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Semiconductor Device Manufacturing: Process > Making Device Or Circuit Responsive To Nonelectrical Signal > Responsive To Electromagnetic Radiation > Packaging (e.g., With Mounting, Encapsulating, Etc.) Or Treatment Of Packaged Semiconductor > Having Additional Optical Element (e.g., Optical Fiber, Etc.) Having Additional Optical Element (e.g., Optical Fiber, Etc.)Having Additional Optical Element (e.g., Optical Fiber, Etc.) patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.08/17/06 - 20060183265 - Image sensor having improved sensitivity and method for making same An image sensor having improved sensitivity and method for making same include a substrate having an active pixel region with a peripheral circuit region surrounding the active pixel region; a plurality of photo conversion elements disposed in the active pixel region, each photodiode is configured for receiving light through a ... 08/10/06 - 20060177957 - Micromirror array device with a small pitch size A spatial light modulator is disclosed, along with a method for making such a modulator that comprises an array of micromirror devices. The center-to-center distance and the gap between adjacent micromirror devices are determined corresponding to the light source being used so as to optimize optical efficiency and performance quality. ... 06/15/06 - 20060128051 - Method of fabricating cmos image sensor A method of fabricating a CMOS image sensor is disclosed that enhances device robustness. The method includes the steps of forming a metal pad on a pad area of a substrate, forming a planarizing layer on the substrate including the metal pad, removing a portion of the planarizing layer to ... 02/02/06 - 20060024857 - Image sensor package structure and method for fabricating the same A method for fabricating an image sensor package is disclosed, comprising: providing a wafer having a plurality of image sensor integrated circuits, each of which has a photosensitive active region and at least one first bonding pad; joining a transparent protecting material to the wafer wherein the photosensitive active region ... 01/12/06 - 20060008939 - Image sensor package An image sensor package includes a substrate, a frame layer, a photosensitive chip, wires, and transparent layer. The substrate has an upper surface on which first electrodes are formed, and a lower surface on which second electrodes are formed, wherein the each first electrode is curved. The frame layer is ... 01/05/06 - 20060003483 - Optoelectronic packaging with embedded window A method and apparatus for encapsulating optoelectronic components. An optical semiconductor die is attached to a lead frame or a substrate. A solid window transparent to light and no larger than the die area, excluding wire bond pads, is cut, scored, or otherwise singulated from glass or plastic. A transparent ... 07/21/05 - 20050158907 - Image sensor device and method of fabricating the same A method of fabricating an image sensor device is disclosed. In the method, a substrate having a plurality of trenches therein is provided. A first anti-reflective layer is formed on the surfaces of the trenches. An insulating layer is filled in the trenches for forming a plurality of shallow trench ... ### FreshPatents.com Support |