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Semiconductor Device Manufacturing: Process > Making Device Or Circuit Responsive To Nonelectrical Signal > Responsive To Electromagnetic Radiation > Packaging (e.g., With Mounting, Encapsulating, Etc.) Or Treatment Of Packaged Semiconductor Packaging (e.g., With Mounting, Encapsulating, Etc.) Or Treatment Of Packaged SemiconductorPackaging (e.g., With Mounting, Encapsulating, Etc.) Or Treatment Of Packaged Semiconductor patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.02/01/07 - 20070026563 - Method of manufacturing semiconductor photodetector A method of manufacturing a semiconductor photodetector having spectral sensitivity close to relative luminous characteristics at low cost includes steps of sealing a light receiving surface side of a semiconductor light receiving element having high spectral sensitivity in wavelengths from the visible light region to infrared region with a sealing ... 01/11/07 - 20070010041 - Method of manufacturing optical device having transparent cover and method of manufacturing optical device module using the same Example embodiments of the present invention relate to a method of manufacturing an optical device having a transparent cover and a method of manufacturing an optical device module using the optical device. According to an example method of manufacturing the optical device, a semiconductor substrate having a plurality of dies ... 12/28/06 - 20060292732 - Methods of flip-chip image sensor package fabrication The present invention provides flip-chip packaging for optically interactive devices such as image sensors and methods of assembly. In a first embodiment of the invention, conductive traces are formed directly on the second surface of a transparent substrate and an image sensor chip is bonded to the conductive traces. Discrete ... 12/07/06 - 20060275943 - Substrate structure for an image sensor package and method for manufacturing the same A substrate structure for an image sensor package, the substrate structure includes a bottom base and a frame layer. The bottom base has an upper surface formed with a plurality of first electrodes, and a lower surface formed with a plurality of second electrodes, an insulation layer is coated between ... 11/30/06 - 20060270094 - Cmos type image sensor module having transparent polymeric encapsulation material A CMOS type of image sensor module for use in a mobile camera or a PC camera includes an image sensoring semiconductor chip encapsulated in a transparent block of polymeric material on a substrate having a circuit to which the ship is connected. The image sensoring semiconductor chip is disposed ... 11/30/06 - 20060270093 - Semiconductor device and manufacturing method thereof A stacked MCM is manufactured at reduced cost without using expensive apparatus. A first wiring and a second wiring are formed on a surface of a semiconductor chip of a first semiconductor device through an insulation film. A glass substrate having an opening to expose the second wiring is bonded ... 10/05/06 - 20060223216 - Sensor module structure and method for fabricating the same A sensor module structure and a method for fabricating the same are proposed. A chip carrier module plate including a plurality of chip carriers is provided, each chip carrier having a first surface and a second surface. At least one semiconductor chip is mounted on and electrically connected to the ... 07/06/06 - 20060148120 - Deuterium alloy process for image sensors A method of alloying an image sensor is disclosed. The method comprises forming various semiconductor devices in a semiconductor substrate. Then, an insulator layer is formed over the semiconductor devices. Finally, deuterium gas is used to alloy said image sensor after the insulator oxide layer has been formed and prior ... 04/13/06 - 20060079018 - Method for producing an optical or electronic module provided with a plastic package A method for producing an optical or electronic module provided with a plastic package in which at least one optical or electronic component having an operative region is encapsulated with at least one polymer compound to form the plastic package. Portions of the polymer compound are then removed by a ... 03/16/06 - 20060057763 - Method of forming a surface mountable ic and its assembly A flip-chip interconnect structure for a RFID tag is described which permits the use of an isotropic electrically conductive adhesive (ECA) without requirement of critical alignment of the chip terminal pads to antenna terminals on the substrate. The interconnect foot print utilizes design principles of standard discrete SMD terminal footprint, ... 03/16/06 - 20060057762 - Method of building electronic label for electronic device A method for building an electronic label within an electronic device, which packs and incorporates the electronic label into the electronic device, protects the electronic label from separation or damage caused by external force, and thereby facilitates the sale management or manufacture management of various electronic devices. The method includes ... 03/09/06 - 20060051887 - Manufacturing method and joining device for solid-state imaging devices The present invention provides a method of manufacturing solid-state imaging devices comprising the steps of: forming a large number of solid-state image sensing devices over a wafer; forming, in positions matching said solid-state image sensing devices on the under face of a transparent flat plate to be joined to said ... 12/29/05 - 20050287695 - Method for producing a for a tfa image sensor The invention relates to a method for producing a photodiode contact for a TFA image sensor which includes a photodiode, produced by deposition of a multilayer system and a transparent conductive contact layer on an ASIC circuit that has been coated with an intermediate metal dielectric component and that has ... 12/01/05 - 20050266602 - Encapsulated chip and method of fabrication thereof A method of fabricating an integrated circuit having an optically transmissive window therein includes forming an integrated chip preform structure that includes a plurality of bonding wires connecting pads on a die structure to pads on a lead frame structure, at least some of the bonding wires having a selected ... 12/01/05 - 20050266601 - [photoelectric device grinding process and device grinding process] A photoelectric device grinding process comprising the following steps is disclosed. A wafer comprising a plurality of chip units is provided. Each chip unit has at least a photoelectric device disposed on a surface layer. A dielectric substrate is attached to the wafer with glue having a plurality of spacers ... 11/17/05 - 20050255628 - Microelectronic devices and methods for packaging microelectronic devices Microelectronic devices and methods of packaging microelectronic devices are disclosed herein. In one embodiment, a method includes placing a plurality of singulated radiation responsive dies on a support member, electrically connecting circuitry of the radiation responsive dies to contacts of the support member, and forming a barrier on the support ... 11/17/05 - 20050255627 - Semiconductor device, method of manufacturing the same, cover for semiconductor device, and electronic equipment A method of manufacturing a semiconductor device includes (a) fixing a cover onto a semiconductor substrate so as to place a surface of the cover that includes a portion defining a first opening, face to face on a surface of the semiconductor substrate that includes an electrode and (b) applying ... ### FreshPatents.com Support |