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Semiconductor Device Manufacturing: Process > Making Device Or Circuit Responsive To Nonelectrical Signal > Thermally Responsive > Packaging (e.g., With Mounting, Encapsulating, Etc.) Or Treatment Of Packaged Semiconductor Packaging (e.g., With Mounting, Encapsulating, Etc.) Or Treatment Of Packaged SemiconductorPackaging (e.g., With Mounting, Encapsulating, Etc.) Or Treatment Of Packaged Semiconductor patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.10/19/06 - 20060234414 - Calorimetric flow meter An encapsulated calorimetric flow meter according to the present invention comprises an integrated circuit (104) mounted on a lead frame (102). The integrated circuit has a channel (105) provided in its lower face, the channel being aligned with two holes (103) provided in the lead frame, the holes coinciding with ... 01/26/06 - 20060019422 - Magnetic shield for integrated circuit packaging Structures and methods for providing magnetic shielding for integrated circuits are disclosed. The shielding comprises a foil or sheet of magnetically permeable material applied to an outer surface of a molded (e.g., epoxy) integrated circuit package. The foil can be held in place by adhesive or by mechanical means. The ... ### FreshPatents.com Support |