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Semiconductor Device Manufacturing: Process > Making Device Or Circuit Emissive Of Nonelectrical Signal > Including Integrally Formed Optical Element (e.g., Reflective Layer, Luminescent Material, Contoured Surface, Etc.) Including Integrally Formed Optical Element (e.g., Reflective Layer, Luminescent Material, Contoured Surface, Etc.)Including Integrally Formed Optical Element (e.g., Reflective Layer, Luminescent Material, Contoured Surface, Etc.) patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.04/05/07 - 20070077671 - In-situ substrate imaging Methods and products, including computer program products, for endpoint determination. An image of a portion of a substrate is captured in-situ, where the image includes optical information that depends on a thickness of a substrate layer. The image is examined to find a location on the substrate, and a process ... 03/29/07 - 20070072322 - Methods for patterning films, fabricating organic electroluminescence display and fabricating thin film transistor array substrate A method for fabricating a thin film transistor array substrate is provided. Wherein, a plurality of contact holes and recesses are formed in a protection layer disposed upon thin film transistors. Each recess comprises an under-cut profile while each contact hole exposes a drain-metal layer of a corresponding thin film ... 03/08/07 - 20070054430 - Method of fabricating organic electroluminescent devices patterning the first sealing film 5 by dry-etching the first sealing film 5 using the second sealing film 6 having the opening pattern as a mask. ... 03/08/07 - 20070054429 - Back panel manufacturing process A method for manufacturing a back panel on a substrate is provided. The substrate has at least a switching device formed therein and a dielectric layer structure formed thereon. An interconnect structure is also formed in the dielectric layer structure. The method of forming the back panel comprises the step ... 03/01/07 - 20070048886 - Electrical connection in oled devices A method of making an OLED device, including providing a substrate having a first electrode and a conductive bus line provided over the substrate and organic EL media provided over the first electrode and over the conductive bus line; forming a radiation absorbing structure associated with the conductive bus line; ... 02/22/07 - 20070042518 - Method of manufacturing an amoled The present invention relates to a method of manufacturing an AMOLED panel. The method comprises providing a substrate, forming a data line and a drain metal on the substrate, forming a buffer insulator layer, forming an active layer, forming a gate insulator layer, forming a gate metal, performing an ion ... 02/01/07 - 20070026554 - Semiconductor device and process for producing same A semiconductor device and process for producing same are provided. The process for producing a semiconductor device includes a first embossing step of pressing a stamp having a relief pattern onto a surface of a substrate to form a depression pattern on the surface of the substrate; a second step ... 01/11/07 - 20070010037 - Superlattice nanocrystal si-sio2 electroluminescence device A superlattice nanocrystal Si—SiO2 electroluminescence (EL) device and fabrication method have been provided. The method comprises: providing a Si substrate; forming an initial SiO2 layer overlying the Si substrate; forming an initial polysilicon layer overlying the initial SiO2 layer; forming SiO2 layer overlying the initial polysilicon layer; repeating the polysilicon ... 01/04/07 - 20070004068 - Image display device and method of manufacturing the same An image display device includes an envelope having a first substrate and a second substrate opposed to the first substrate with a gap, and a plurality of pixels arranged in the envelope. A plurality of spacers are arranged between the first substrate and the second substrate in the envelope to ... 01/04/07 - 20070004067 - Floating body germanium phototransistor with photo absorption threshold bias region A floating body germanium (Ge) phototransistor with a photo absorption threshold bias region, and an associated fabrication process are presented. The method includes: providing a p-doped Silicon (Si) substrate; selectively forming an insulator layer overlying a first surface of the Si substrate; forming an epitaxial Ge layer overlying the insulator ... 01/04/07 - 20070004066 - Method for manufacturing a light emitting device and a light emitting device manufactured therefrom A method for manufacturing a light emitting device includes: preparing a light emitting diode including an epitaxial substrate, an n-type cladding layer, an active layer, a p-type cladding layer, and first and second electrodes; thinning the epitaxial substrate; and forming a reflecting layer and a heat dissipating substrate on the ... 12/28/06 - 20060292725 - Method for manufacturing device having optical semiconductor element The invention provides a method of forming a device having an optical semiconductor element by bonding a cover body, which can cover the optical semiconductor element, to a head portion having the optical semiconductor element. The method comprises the steps of: a short circuit step of shorting terminals of the ... 12/28/06 - 20060292724 - Method of manufacturing organic el display A method of manufacturing a plurality of organic EL displays, by sealing and cutting an organic EL substrate, controlling the adhesion width and cutting the glass substrate without extending the cutting position. An organic EL substrate, and a sealing glass substrate with recesses opposing each laminate of the organic EL ... 12/28/06 - 20060292723 - Plasma display device A plasma display device includes a plasma display 1, a chassis 2 having conductivity that supports the plasma display 1, a tuner circuit 11, a scan driver 12, a sustaining driver 13 and so forth used to display a video on the plasma display 1, a back cover 4 that ... 12/21/06 - 20060286698 - Electro-optical device, method of manufacturing the same, and electronic apparatus An electro-optical device includes: a substrate; a plurality of data lines which are formed on the substrate; a plurality of scanning lines which are arranged on the substrate so as to intersect the plurality of data lines; a plurality of pixel electrodes which are provided on the substrate so as ... 12/14/06 - 20060281209 - Light emitting device and method of manufacturing the same Provided is a light emitting device and a method of manufacturing the same. The light emitting device comprises a transparent substrate, an n-type compound semiconductor layer formed on the transparent substrate, an active layer, a p-type compound semiconductor layer, and a p-type electrode sequentially formed on a first region of ... 12/14/06 - 20060281208 - Laser process for reliable and low-resistance electrical contacts Disclosed is a method for manufacturing an organic optoelectronic device. The method comprises providing a substrate, disposing a first electrode on the substrate, disposing a metal pad on the substrate, electrically separated from the first electrode, disposing a first material over the first electrode and at least partially over the ... 11/30/06 - 20060270083 - Electro-optical device and electronic apparatus having the same An electro-optical device includes a holding capacitor with a first electrode electrically connected to a transistor and a pixel electrode, a second electrode disposed opposite to the first electrode, and a multilayer dielectric film structure disposed between the first electrode and the second electrode. The multilayer dielectric film structure includes ... 11/30/06 - 20060270082 - Method of forming film pattern, active matrix substrate, electro-optic device, and electronic apparatus A method of forming a film pattern includes the steps of forming a bank for partitioning a pattern forming area including a first pattern forming area and a second pattern forming area having an intersection with the first pattern forming area and divided in the intersection into sub-areas, disposing a ... 11/30/06 - 20060270081 - Light emitting device having a layer of photonic crystals and a region of diffusing material and method for fabricating the device A light emitting device and method for fabricating the device utilizes a layer of photonic crystals and a region of diffusing material to enhance the light output of the device. The layer of photonic crystals is positioned over a light source, such as a light emitting diode die, and the ... 11/30/06 - 20060270080 - Apparatus and method for forming reflective layer of optical disc Improved techniques for forming a reflective layer of an optical disc are provided. One improvement includes forming the reflective layer over an information layer of the disc by utilizing a metallizer and a masking device having an angled lip configured to align to an outer edge of the information layer. ... 11/23/06 - 20060263919 - Electroluminescent element The main object of the present invention is to provide a method for producing an EL element for realizing the high luminous efficiency, the high light takeout efficiency, the simplicity of the production process, and the formation of highly fine patterns. In order to achieve the above-mentioned object, the present ... 11/16/06 - 20060258031 - Wafer-level electro-optical semiconductor manufacture fabrication method A wafer-level electro-optical semiconductor manufacture fabrication method improves upon traditional electro-optical semiconductor grain packaging methods. The present invention electrically connects semiconductor grains to the grains on a top surface of a wafer. This is done by either screen-printing or steel board-printing solder or silver paste onto the wafer. After that, ... 11/16/06 - 20060258030 - Mask holding structure, film forming method, electro-optic device manufacturing method, and electronic apparatus A mask includes a base plate having aperture parts, and chips having aperture patterns and positioned in the aperture parts of the base plate. The mask is arranged on a bottom surface of a bed plate with a substrate on which a film is to be formed sandwiched therebetween. Magnets ... 11/09/06 - 20060252169 - Transparent member, optical device using transparent member and method of manufacturing optical device In a method of manufacturing an optical device, a whole substrate is first prepared which has a plurality of regions corresponding to substrates constituting a plurality of optical devices, respectively. A plurality of chips are then mounted to the plurality of regions, respectively. A whole sealing member having a plurality ... 10/05/06 - 20060223209 - Surface-emission semiconductor laser device A method for fabricating a surface-emission semiconductor laser on a p-type substrate includes the step of interposing an Au film between an AuGeNi film or AuGe film of an n-side electrode and a compound semiconductor layer of an n-type DBR, followed by annealing to form an Au alloy in the ... 10/05/06 - 20060223208 - Optical device The disclosure relates to a method of forming an optical device including the steps of (i) providing a substrate carrying a first electrode capable of injecting or accepting charge carriers of a first type; (ii) depositing a polyfluorene over the first electrode; and (iii) forming over the polyfluorene a second ... 08/17/06 - 20060183258 - Imaging system and method for producing semiconductor structures on a wafer by imaging a mask on the wafer with a dipole diaphragm An imaging system having a dipole diaphragm (2) having two diaphragm openings (2b) arranged one behind the other in a dipole axis (y), and a mask having mask structures (20, 23) is used for producing semiconductor structures (10′, 13′) on a wafer (15′) by imaging the mask (25) onto the ... 08/10/06 - 20060177953 - Method of fabricating semiconductor device A method of fabricating a semiconductor device includes the steps of forming a step region having a mesa shape in a direction of <011> or <0-11> on a (100) plane of an InP-based compound semiconductor crystal, and burying the step region with InP-based buried layers grown by vapor-phase growth by ... 08/10/06 - 20060177952 - Process to make nano-structurated components In a process to make a nano-structured component, such as a photonic crystal or an emitter (10) which can be led to incandescence through the passage of electric current, at least one layer made of anodized porous alumina (1) is used as sacrificial element for the structuring of at least ... 08/03/06 - 20060172448 - Screen printable electrode for light emitting polymer device A screen printed light emitting polymer device is fabricated by depositing an electroluminescent polymer layer between a transparent electrode and an air stable screen printed top electrode. This invention describes advantageous methods and materials for printed top electrodes for polymer light emitting devices including composite electrode inks containing conducting particles, ... 07/06/06 - 20060148114 - Method of forming mask and mask A method of forming a mask, in which a film pattern is formed on a substrate by using a mask, includes sequentially arranging the mask, the substrate and a first member having a flat surface contacting with the substrate in this order from a supply source of film forming material; ... 06/29/06 - 20060141648 - Light emitting device methods Light-emitting device methods are disclosed. ... 06/22/06 - 20060134814 - Self-alignment manufacturing method of the microlens and the aperture using in optical devices The present invention discloses a self-alignment manufacturing method of a microlens and an aperture using in an optical device. The method manufactures the aperture and the circular opening in the opaque film on a transparent substrate, and utilizes the self-alignment backside exposure technology to precisely integrate the aperture and the ... 06/01/06 - 20060115916 - Method of manufacturing silicon optoelectronic device, silicon optoelectronic device manufacture by the method, and image input and/or output apparatus using the silicon optoelectronic device A method of manufacturing a silicon optoelectronic device, a silicon optoelectronic device manufactured by the method, and an image input and/or output apparatus including the silicon optoelectronic device are provided. The method includes preparing an n- or p-type silicon-based substrate, forming a microdefect pattern along a surface of the substrate ... 05/04/06 - 20060094143 - Micro-displays and their manufacture A method of forming a micro-display includes forming a device that includes forming a partially reflecting layer on a first substrate and forming a plate overlying the partially reflecting layer, and adhering the device to a second substrate. ... 04/06/06 - 20060073625 - Method for manufacturing semiconductor light emitting device A method for manufacturing a semiconductor light emitting device can result in a device that includes a housing having a cavity, a light emitting element on a bottom face of the cavity, and a wavelength conversion layer provided within the cavity. The wavelength conversion layer can include particles of a ... 03/02/06 - 20060046334 - Light emitting device In an active matrix type light emitting device, a top surface exit type light emitting device in which an anode formed at an upper portion of an organic compound layer becomes a light exit electrode is provided. In a light emitting element made of a cathode, an organic compound layer ... 03/02/06 - 20060046333 - Laser induced thermal imaging method and a method of fabricating organic light emitting display A laser inducted thermal imaging method includes preparing a donor element and a substrate; facing a transfer layer of the donor element to the substrate and then patterning the transfer layer onto the substrate; and annealing the patterned substrate. ... 02/16/06 - 20060035397 - Flat panel display device and method of manufacturing the same A flat panel display includes a pixel electrode having an opening portion formed on an insulating substrate, a semiconductor layer formed over a surface of the insulating substrate, spaced apart from the pixel electrode, having source and drain regions formed to both end portions thereof, a first insulating layer formed ... 01/19/06 - 20060014311 - Method of manufacturing semiconductor laser element A method of manufacturing a semiconductor laser element having an enhanced yield ratio is provided. The semiconductor laser element having a cladding layer, an intermediate layer, and a capping layer is manufactured as follows. At the laminating step, a plurality of lamination layers are laminated in a laminating direction. Subsequently, ... 01/05/06 - 20060003478 - Method of manufacturing display device Arrangements (e.g., methods) for manufacturing a display device, including irradiating an amorphous semiconductor film formed on a substrate with an excimer laser beam to convert the amorphous semiconductor film into a polycrystalline semiconductor film; and irradiating predetermined areas of the polycrystalline semiconductor film intermittently with a continuous wave laser beam ... 01/05/06 - 20060003477 - Method for producing a light source provided with electroluminescent diodes and comprising a luminescence conversion element The invention describes a method for producing a light-emitting-diode (LED) light source, particularly comprising mixed-color LEDs, wherein at least a portion of primary radiation emitted by a chip is transformed by luminescence conversion. Said chip comprises a front-side (i.e., the side facing in the direction of radiation) electrical contact to ... 12/29/05 - 20050287691 - Method for doping quantum dots A doping method for forming quantum dots is disclosed, which includes following steps: providing a first precursor solution for a group II element and a second precursor solution for a group VI element; heating and mixing the first precursor solution and the second precursor solution for forming a plurality of ... 12/29/05 - 20050287690 - Optical microsystem and method for making same The invention relates to the fabrication of optical microsystems for miniature cameras or miniature matrix displays. It is proposed that N dot matrix arrays and associated circuits should be collectively fabricated, on the front of a semiconductor wafer, to produce N identical chips, with on the side of each array, ... 12/22/05 - 20050282304 - Light-emission device, method of manufacturing same, electro-optical device and electronic device An organic EL display unit is manufactured in an efficient manner. A light emission device (1000) is manufactured by bonding together a driving circuit substrate (100) formed with driving circuit constituted by thin film transistors 11, and a light emission substrate (300) comprising a successively laminated transparent electrode layer 31, ... 12/15/05 - 20050277217 - Method for manufacturing micro-structural unit A method for manufacturing a micro-structural unit is provided. By the method, micro-machining is performed on a material substrate including first through third conductive layers and two insulating layers, one of which is interposed between the first and the second conductive layers, and the other between the second and the ... 12/08/05 - 20050272176 - Method for forming led by a substrate removal process The present invention relates to a method for forming LED. In the present invention, LED dies are defined by photolithography and etching processes to replace a cutting step, and a metal substrate of the LED is formed by chemical or physical method. ... 11/10/05 - 20050250230 - Control tft for oled display The present invention discloses a control TFT structure (i.e. a driving TFT) for reducing leakage in an OLED display. A semiconductor layer, such as a polysilicon layer, is deposited on a transparent substrate as a channel region. A lightly doped region and a drain region are disposed on one side ... 10/27/05 - 20050239228 - Method for producing micromechanical and micro-optic components consisting of glass-type materials What is proposed here is a method of structuring surfaces of glass-type materials and variants of this method, comprising the following steps of operation: providing a semiconductor substrate, structuring, with the formation of recesses, of at least one surface of the semiconductor substrate, providing a substrate of glass-type material, joining ... 10/20/05 - 20050233487 - Method of fabricating quantum features A method of fabricating quantum features on a substrate from a layer of material selected from materials identified in the III-V periodic groups (e.g., silicon (Si), InP, Si—Ge, and the like) uses sequentially two patterned masks, each mask includes an elongated mask pattern disposed substantially orthogonal to the elongated pattern ... 10/06/05 - 20050221522 - Optical channels for multi-level metal optical imagers and method for manufacturing same The manufacture of multi-level optical imagers and the resulting imagers are described. Multiple levels of metallization are prepared, each level having a via. The vias are aligned and a material having a higher refractive index than its surrounds is positioned within the vias to form an optical channel. The higher ... 10/06/05 - 20050221521 - Nitride semiconductor light emitting device and method of manufacturing the same Disclosed herein is a nitride semiconductor light emitting device having patterns formed on the upper and lower surfaces of a substrate from which light is emitted in a flip chip bonding structure wherein the patterns are capable of changing light inclination at the upper and lower surfaces of the substrate ... 10/06/05 - 20050221520 - Ternary nitride-based buffer layer of a nitride-based light-emitting device and a method for manufacturing the same Ternary nitride-based buffer layer of a nitride-based light-emitting device and related manufacturing method. The device includes a substrate and a plurality of layers formed over the substrate in the following sequence: a ternary nitride-based buffer layer, a first conductivity type nitride-based semiconductor layer, a light-emitting layer, and a second conductivity ... 09/29/05 - 20050214963 - Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices A method of making a light active sheet. A bottom substrate having an electrically conductive surface is provided. A hotmelt adhesive sheet is provided. Light active semiconductor elements, such as LED die, are embedded in the hotmelt adhesive sheet. The LED die each have a top electrode and a bottom ... 09/22/05 - 20050208692 - Image sensor and method for fabricating the same The present invention relates to an image sensor with a microlens and a method for fabricating the same with use of a bump formation process. A method for fabricating an image sensor includes the steps of: forming a passivation layer on a substrate structure provided with a photodiode and other ... 09/22/05 - 20050208691 - Method for manufacturing light-emitting diode A method for manufacturing a light-emitting diode (LED) is described. The method comprises: providing a temporary substrate; forming an illuminant epitaxial structure on the temporary substrate; forming a first transparent conductive layer on the illuminant epitaxial structure; forming a metal substrate on the first transparent conductive layer; forming an adhesion ... 09/15/05 - 20050202580 - Process for creating metal-insulator-metal devices A process is described for fabricating an active addressing component such as a metal-insulator-metal (MIM) device by creating surface relief levels to form trenches, and depositing a metal in the trenches. The metal is anodized to create a non-linear dielectric. A second metal is deposited in the trenches to create ... 08/04/05 - 20050170540 - Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates A method for forming a MEMS device is disclosed, where a final release step is performed just prior to a wafer bonding step to protect the MEMS device from contamination, physical contact, or other deleterious external events. Without additional changes to the MEMS structure between release and wafer bonding and ... 07/21/05 - 20050158899 - Miniaturized imaging device with integrated circuit connector system A miniaturized imaging device and method of viewing small luminal cavities are described. The imaging device can be used as part of a catheter, and can include a lens, an SSID including an imaging array optically coupled to the lens; an umbilical including a conductive line; and an adaptor configured ... 07/21/05 - 20050158898 - Methods of forming nanocavity laser structures Optical switches and logic devices comprising microstructure-doped nanocavity lasers are described. These switches and logic devices have gain and thus can be cascaded and integrated in a network or system such as for example on a chip. Exemplary switching elements switch the intensity, wavelength, or direction of the output. Exemplary ... 07/21/05 - 20050158897 - Image sensor device and method of fabricating the same A method of fabricating an image sensor device is disclosed. In the method, a substrate having a plurality of trenches therein is provided. A first anti-reflective layer is formed on the surfaces of the trenches. An insulating layer is filled in the trenches for forming a plurality of shallow trench ... 07/14/05 - 20050153472 - Thin film formation method, thin film formation equipment, method of manufacturing organic electroluminescence device, organic electroluminescence device, and electronic apparatus A thin film formation method is provided which can carry out various kinds of patterning deposition correctly and with high precision, and a thin film formation equipment. The thin film formation method arranges a mask between a substrate and a material source and forms the material of the material source ... 07/14/05 - 20050153471 - Method of manufacturing group-iii nitride crystal There is provided a method of manufacturing a group-III nitride crystal in which a nitrogen plasma is brought into contact with a melt containing a group-III element and an alkali metal to grow the group-III nitride crystal. Furthermore, there is also provided a method of manufacturing a group-III nitride crystal ... 07/14/05 - 20050153470 - Method to obtain contamination free laser mirrors and passivation of these A method to obtain contamination free surfaces of a material chosen from the group comprising GaAs, GaAlAs, InGaAs, InGaAsP and InGaAs at crystal mirror facets for GaAs based laser cavities. The crystal mirrors facets are cleaved out exposed to an ambient atmosphere containing a material from the group comprising air, ... 06/23/05 - 20050136564 - Method of laterally growing gan with indium doping Disclosed herein is a method of laterally growing GaN with In doping, which enables formation of a GaN layer in a shorter period of time by increasing a lateral growth rate of GaN with the In doping when laterally growing GaN with the LEO method. The method comprises the steps ... 06/09/05 - 20050124087 - Method for manufacturing electro-optical device, electro-optical device, and electronic equipment Exemplary embodiments of the present invention make it possible to ensure an actual aperture ratio with respect to an electro-optical device provided with an active element, and to manufacture with ease. A method for manufacturing an electro-optical device of exemplary embodiments of the present invention includes forming an active element ... 06/09/05 - 20050124086 - Method for manufacturing a semiconductor device, and method for manufacturing a wafer There is provided a semiconductor device manufacturing method including a step of adhering a first conductive-type GaP wafer to a first conductive-type semiconductor layer and capable of manufacturing semiconductor devices having a stable device characteristic with an improved yield. Also, there is provided a method of manufacturing a GaP wafer ... ### FreshPatents.com Support |