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Semiconductor Device Manufacturing: Process > Making Device Or Circuit Emissive Of Nonelectrical Signal > Packaging (e.g., With Mounting, Encapsulating, Etc.) Or Treatment Of Packaged Semiconductor > Having Additional Optical Element (e.g., Optical Fiber, Etc.) Having Additional Optical Element (e.g., Optical Fiber, Etc.)Having Additional Optical Element (e.g., Optical Fiber, Etc.) patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.04/19/07 - 20070087461 - Light emitting diode and method for manufacturing the same A light emitting diode is disclosed. The light emitting diode comprises: a transparent substrate; a reflective layer located on a surface of the transparent substrate; a solder layer located on the other surface of the transparent substrate; a semiconductor epitaxial structure located on the solder layer, wherein the semiconductor epitaxial ... 04/05/07 - 20070077670 - Super bright light emitting diode of nanorod array structure having ingan quantum well and method for manufacturing the same An GaN light emitting diode (LED) having a nanorod (or, nanowire) structure is disclosed. The GaN LED employs GaN nanorods in which a n-type GaN nanorod, an InGaN quantum well and a p-type GaN nanorod are subsequently formed in a longitudinal direction by inserting the InGaN quantum well into a ... 12/21/06 - 20060286697 - Method for manufacturing light emitting diodes A method for manufacturing the LEDs is disclosed, whereby the light extraction efficiency of the device can be enhanced by forming patterns on a top surface of a substrate, a light emitting structure is formed on the top surface of the substrate formed with the patterns, the substrate is removed ... 12/21/06 - 20060286696 - Passive electrical article A passive electrical article includes a first electrically conductive substrate having a major surface and a second electrically conductive substrate having a major surface. The major surface of the second substrate faces the major surface of the first substrate. An electrically resistive layer is on at least one of the ... 12/14/06 - 20060281207 - Optical device, method of manufacturing the same, optical module, optical transmission system In a conventional optical device which mounts a semiconductor light emitting element, the processing is difficult and a manufacturing process cost is expensive because of the necessity of forming via holes in a substrate. An optical device comprises a laser diode which needs heat radiation, a glass substrate which is ... 11/30/06 - 20060270079 - Method and circuit structure employing a photo-imaged solder mask In one embodiment, a photo-imageable material is deposited on a circuit structure. The photo-imageable material is then exposed to a pattern of radiation, thereby polymerizing portions of the photo-imageable. Un-polymerized portions of the photo-imageable material are then removed to define a solder mask having solder deposition areas. Solder is then ... 11/23/06 - 20060263918 - Soldering method for semiconductor optical device, and semiconductor optical device A method for soldering a semiconductor optical device including a resin-made optical lens to an object by a reflow soldering process using a lead-free solder, and a semiconductor optical device for use in the method. A semiconductor optical device including a silicone resin-made optical lens as the resin-made optical lens ... 11/09/06 - 20060252167 - Silicon optical package with 45 degree turning mirror An optical package includes a sub-mount, an edge-emitting laser mounted on the sub-mount, a collimating ball lens mounted on the sub-mount adjacent to the edge-emitting laser, a mirror mounted on the sub-mount adjacent to the collimating ball lens. The sub-mount is made of a bottom wafer. A lid is bonded ... 08/03/06 - 20060172447 - Multi-layer registration and dimensional test mark for scatterometrical measurement A layered test pattern for measuring registration and critical dimension (CD) for multi-layer semiconductor integrated circuits is disclosed. A first layer includes a first pattern having vertical and horizontal portions. A second layer is formed over the first layer and includes a second pattern having vertical and horizontal portions having ... 06/29/06 - 20060141647 - Method for fabricating cmos image sensor A method for fabricating a CMOS image sensor forms silicon nitride (SiN) layer on a pad. Microlenses, having a minimum height and footprint according to a desired packing density of the lenses, are fabricated of an oxide film and a nitride film deposited on the silicon nitride. Since the lenses ... 06/01/06 - 20060115915 - Method of manufacturing electrooptical device and image forming device A method of manufacturing an electrooptical device includes a step of forming a luminous element on a luminous element forming face of a transparent substrate, a step of forming an attach face by grinding a face of the transparent substrate that opposes the luminous element forming face toward the luminous ... 05/18/06 - 20060105485 - Overmolded lens over led die One or more LED dice are mounted on a support structure. The support structure may be a submount with the LED dice already electrically connected to leads on the submount. A mold has indentations in it corresponding to the positions of the LED dice on the support structure. The indentations ... 05/18/06 - 20060105484 - Molded lens over led die One or more LED dice are mounted on a support structure. The support structure may be a submount with the LED dice already electrically connected to leads on the submount. A mold has indentations in it corresponding to the positions of the LED dice on the support structure. The indentations ... 03/30/06 - 20060068517 - Optical device and method for making the same A method for making an optical device includes the steps of: rubbing an orienting film so as to stretch the molecular structure thereof and so as to permit the molecular units of the molecular structure to be aligned along a first axis and to permit the orienting space between each ... 12/01/05 - 20050266592 - Method of fabricating an encapsulated chip and chip produced thereby A method of fabricating an integrated circuit having a window therein for transmitting optical energy to and/or from an optically active area of the underlying die includes depositing a quantity of an uncured optically transmissive material on the die portion of a integrated circuit preform, placing the window on the ... 10/20/05 - 20050233486 - Vertical cavity surface emitting laser having a gain guide aperture interior to an oxide confinement layer A VCSEL with current confinement achieved by an oxide insulating region and by an ion implant region. An annular shaped oxide layer is formed, and a gain guide ion implant is formed. The ion implant gain guide includes a central region having high conductivity. The VCSEL further includes first and ... 10/06/05 - 20050221519 - Semiconductor light emitting devices including a luminescent conversion element and methods for packaging the same Methods of packaging a semiconductor light emitting device include dispensing a first quantity of encapsulant material into a cavity including the light emitting device. The first quantity of encapsulant material in the cavity is treated to form a hardened upper surface thereof having a selected shape. A luminescent conversion element ... 10/06/05 - 20050221518 - Reflector packages and methods for packaging of a semiconductor light emitting device Methods of packaging a semiconductor light emitting device in a reflector having a moat positioned between a lower and an upper sidewall thereof, the upper and lower sidewall defining a reflective cavity, include dispensing encapsulant material into the reflective cavity including the light emitting device therein to cover the light ... ### FreshPatents.com Support |