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Semiconductor Device Manufacturing: Process > Making Device Or Circuit Emissive Of Nonelectrical Signal > Packaging (e.g., With Mounting, Encapsulating, Etc.) Or Treatment Of Packaged Semiconductor Packaging (e.g., With Mounting, Encapsulating, Etc.) Or Treatment Of Packaged SemiconductorPackaging (e.g., With Mounting, Encapsulating, Etc.) Or Treatment Of Packaged Semiconductor patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.03/29/07 - 20070072321 - Device package and methods for the fabrication and testing thereof Provided are methods of forming sealed via structures. One method involves: (a) providing a semiconductor substrate having a first surface and a second surface opposite the first surface; (b) forming a layer on the first surface of the substrate; (c) etching a via hole through the substrate from the second ... 03/22/07 - 20070065958 - Method for attaching an optical filter to an encapsulated package A method for attaching an optical device to an encapsulated electronic package. The method may include aligning and attaching an optical device to a non-singulated encapsulated electronic package using an adhesive, and curing the entire package. The method may further include singulating the non-singulated encapsulated electronic package with the optical ... 01/18/07 - 20070015300 - Method for fabricating a light-emitting device The present invention discloses a method for fabricating a light-emitting device, wherein a thermosonic bonding process is utilized to join the contacts on a substrate with bond pads on the light-emitting element. Thereby, the deterioration of the substrate can be reduced, and the yield can also be promoted. Further, in ... 01/04/07 - 20070004065 - Phosphor tape article A phosphor tape article includes a phosphor layer having a phosphor and a polymeric binder material, a pressure sensitive adhesive layer disposed adjacent the phosphor layer such that light transmitted through the pressure sensitive adhesive layer is received by the phosphor layer, and a release liner disposed on the pressure ... 12/28/06 - 20060292720 - Semiconductor laser device When a laser irradiation direction is assumed as a forward direction, a front end surface of a die pad (104), a front end surface of a resin mold member (106), and a front end surface of a semiconductor laser element (101) are sequentially disposed in this order from the front ... 11/30/06 - 20060270078 - Method of fabricating light emitting diode package The invention relates to an LED package and proposes a method of fabricating an LED package including steps of providing a package substrate having a mounting area of an LED and a metal pattern to be connected with the LED, and plasma-treating the package substrate to reform at least a ... 11/02/06 - 20060246617 - Fabrication method of light emitting diode package The invention provides a fabrication method of an LED package for easily fabricating LED packages of excellent heat radiation characteristics. In the method, a metallic package substrate having a recess and a reflecting surface formed in the recess is prepared, and the package substrate is selectively anodized and divided into ... 11/02/06 - 20060246616 - Structure of laser diode and method of manufacturing the same A laser diode and a manufacture method thereof are disclosed. The method of manufacturing the laser diode comprises the steps of: 1. coupling a photo diode chip with one of a plurality of pins on a frame; 2. coupling and overlapping a laser diode chip with the photo diode chip; ... 11/02/06 - 20060246615 - Method of manufacturing vertical cavity surface emitting laser A method of manufacturing a vertical cavity surface emitting laser is disclosed. The method comprises the steps of: 1. punching one pin of each of a plurality of pin groups mounted on a frame for forming a large-area expanded surface on the pin; 2. coupling a plurality of vertical cavity ... 10/26/06 - 20060240586 - Image pickup device and method of manufacturing the same The present invention relates to an image pickup device, etc., having a structure such that electrostatic discharge is unlikely to occur when an FOP and a CCD reading part are joined. This image pickup device comprises a semiconductor substrate, provided with the CCD reading part on a front surface that ... 10/19/06 - 20060234409 - Light emitting device, display apparatus with an array of light emitting devices, and display apparatus method of manufacture A light emitting device and display apparatus using a plurality of light emitting devices can drastically reduce contrast loss due to light from an external source. The light emitting device has a light emitting chip(s) and a first layer covering the light emitting chip(s). A second layer including a light ... 08/24/06 - 20060189013 - Method of making led encapsulant with undulating surface An LED package includes an LED die and a light-transmissive material encapsulating the die. The encapsulant is formed by dispensing a curable material onto a substrate, such as a carrier on which is mounted the LED die, to form a liquid mass thereon, the liquid mass having an unconstrained smooth ... 07/20/06 - 20060160259 - Sealant region pattern for liquid crystal display and method for fabricating the same A sealant region pattern for a liquid crystal display apparatus and a method for fabricating the same. The method comprises providing a first substrate and a second substrate opposite thereto, forming a predetermined material layer on the first substrate, forming an organic material pattern layer having openings of a saw ... 07/13/06 - 20060154394 - Plasma display panel and manufacturing method of the same The manufacturing method includes the step of forming a dielectric layer on a substrate where electrodes are formed so as to coat the electrodes in accordance with a vapor phase growth method, the step of carrying out a process for planarization on the dielectric layer, and the step of forming ... 07/13/06 - 20060154393 - Systems and methods for removing operating heat from a light emitting diode Systems and methods for fabricating a light emitting diode include forming a multilayer epitaxial structure above a carrier substrate; depositing at least one metal layer above the multilayer epitaxial structure and forming heat removal fins thereon; removing the carrier substrate. ... 06/22/06 - 20060134813 - Organic light-emitting panel, package process for organic light-emitting panel and coating apparatus thereof An organic light-emitting panel, a process for packaging an organic light-emitting panel and a coating apparatus applied thereto are described. A patterned desiccant with large surface area is formed on a cover plate by an ink-jet printing process. The process for packaging an organic light-emitting panel and the coating process ... 06/15/06 - 20060128044 - Solid state imaging device and producing method thereof A semiconductor substrate of a solid state imaging device is connected to a cover glass, and then a backgrind is performed so as to make the thickness smaller. On a first face of the semiconductor substrate is formed plural units which is constructed of image sensors and plural contact terminals. ... 06/15/06 - 20060128043 - Method of mounting light emitting element The present invention provides a method of mounting a light emitting element, in which a light emission point can be positioned at high accuracy with respect to the mounting member. A semiconductor laser element is placed on a matching stage. Next, a position and an azimuth of a laser stripe ... 06/15/06 - 20060128042 - Method for encapsulating at least one organic light-emitting (oled) device and oled device A method for encapsulating at least one organic light-emitting (OLED) device (22) comprising the step of forming a concave region (24) on a plate (6) by applying a negative pressure to a predetermined area of the plate. The plate is attached to a substrate (1) comprising at least one active ... 05/18/06 - 20060105483 - Encapsulated light emitting diodes and methods of making Methods for making encapsulated light emitting diodes, and light emitting articles prepared thereby are disclosed. The methods include activating a light emitting diode to emit light to at least partially polymerize a photopolymerizable encapsulant. ... 05/11/06 - 20060099728 - Method of manufacturing a substrate structure for increasing cutting precision and strength thereof A method of manufacturing a substrate structure includes the steps of: (1) providing a metal substrate having a metal portion; (2) chemically etching a plurality of trenches in the metal substrate; (3) applying a polymer composite material into the trenches to form a substrate having a polymer composite portion abutted ... 05/04/06 - 20060094142 - Fabricating method of semiconductor optical device for flip-chip bonding Disclosed is a method for manufacturing a semiconductor optical device for flip-chip bonding. The method includes the steps of: etching an active layer and clad which are sequentially stacked on a semiconductor substrate into first and second alignment keys and an optical area, which has a mesa structure; growing at ... 04/13/06 - 20060079015 - Manufacturing method of pickup device In a manufacturing method of a pickup device, a hologram element is positioned on a package by turning the hologram element around the Z axis and then by moving the element in the Y-axis direction so as to maximize the light reception intensity of reflected light from the hologram element ... 04/06/06 - 20060073624 - Die-attach films for chip-scale packaging, packages made therewith, and methods of assembling same A die-attach composition includes a resin such as a thermosetting resin, a hardener, and a low molecular weight oligomer diluent. A die-attach composition includes a polyimide in a major amount and a resin such as a thermosetting resin in a minor amount. The die-attach composition also includes a reactive polymer ... 03/30/06 - 20060068516 - Method for producing nitride semiconductor laser light source and apparatus for producing nitride semiconductor laser light source A method for producing a nitride semiconductor laser light source is provided. The nitride semiconductor laser light source has a nitride semiconductor laser chip, a stem for mounting the laser chip thereon, and a cap for covering the laser chip. The laser chip is encapsulated in a sealed container composed ... 03/23/06 - 20060063289 - Methods of coating semiconductor light emitting elements by evaporating solvent from a suspension Semiconductor light emitting devices are fabricated by placing a suspension including phosphor particles suspended in solvent on at least a portion of a light emitting surface of a semiconductor light emitting element, and evaporating at least some of the solvent to cause the phosphor particles to deposit on at least ... 03/16/06 - 20060057752 - Light emitting diode and method of making the same A light emitting diode (LED) and a method of making the same are disclosed. The present invention uses a metal layer of high conductivity and high reflectivity to prevent the substrate from absorbing the light emitted. This invention also uses the bonding technology of dielectric material thin film to replace ... 11/17/05 - 20050255618 - Display device producing method and display device producing device Provided are a manufacturing method which can efficiently manufacture a display device with higher image quality, and a manufacturing apparatus which can be applied to the manufacturing method. Position adjustment is carried out so that a seal pattern (4) formed on at least one of a bottom substrate (2) and ... 10/27/05 - 20050239227 - Light emitting diode component A light emitting package (8, 8′, 8″, 208, 408) includes a printed circuit board (10, 10′, 10″, 210, 410) supporting at least one light emitting die (12, 12″, 14, 16, 212, 412). A light transmissive cover (60, 60′, 60″, 260, 460) is disposed over the at least one light emitting ... 09/22/05 - 20050208690 - Method of manufacturing optical semiconductor device, package molding jig, method of manufacturing package molding jig and manufacturing apparatus for package molding jig A method of manufacturing an optical semiconductor device includes preparing an optical semiconductor provided on a distal end of a first lead portion of a lead frame and connected electrically with a distal end of a second lead portion of the lead frame, forming thermoplastic resin for preparing a package ... 08/11/05 - 20050176160 - Wafer packaging process of packaging light emitting diode A wafer packaging process of packaging light-emitting diode is described. A first photoresist layer is coated on an uncut wafer having a plurality of pads. The first photoresist layer is etched to form a plurality of first openings until a portion of the pad within the first openings are exposed. ... 07/21/05 - 20050158896 - Device transferring method A method of selectively transferring devices arrayed on a first substrate to a second substrate on which an adhesive resin layer is previously formed is provided. The method includes steps of selectively heating the adhesive resin layer on the second substrate by laser irradiation from the back surface side of ... 06/16/05 - 20050130336 - Method of packaging a semiconductor light emitting device A semiconductor light emitting device is packaged by forming a sealed compartment enclosing the device, at least one of the walls of the sealed compartment being formed of an elastomeric material. The elastomeric material is then penetrated with a needle and a quantity of softer material is injected through the ... ### FreshPatents.com Support |