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Semiconductor Device Manufacturing: Process > With Measuring Or Testing > Optical Characteristic Sensed Optical Characteristic SensedOptical Characteristic Sensed patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.03/22/07 - 20070065957 - Method for manufacturing semiconductor device In the case of forming fine wires and the like by a droplet discharging apparatus to manufacture electric circuits, discharging controls including controls of a discharging position, a discharging timing, and the like are required to have very high accuracy. After forming design diagram data of an electric circuit by ... 03/08/07 - 20070054425 - Apparatus for measuring semiconductor physical characteristics A reflectometry method and apparatus for gathering reflectance data indicative of one or more characteristics of a semiconductor substance being grown on a substrate within a reaction chamber. The method includes directing light of known characteristics from a light source into the reaction chamber towards the surface of the semiconductor ... 03/01/07 - 20070048884 - Method and apparatus for localizing production errors in a semiconductor component part The invention relates to a method and to an arrangement for localizing production errors in a semiconductor component part by generating excess charge carriers in the semiconductor component part and by determining the electric potential in said part. In order to be able to localize production errors with simple measures ... 02/22/07 - 20070042513 - Electron beam exposure method, hot spot detecting apparatus, semiconductor device manufacturing method, and computer program product An EB exposure method includes dividing drawing layer pattern to be transferred onto drawing layer by EB exposure and underlying pattern to be transferred onto an underlying layer of the drawing layer by the EB exposure respectively into unit regions, setting representative figure in each of the unit regions of ... 02/15/07 - 20070037303 - Apparatus and method of illuminating the surface of a wafer in a wafer inspection system An apparatus for illuminating the surface of a wafer in a wafer inspection system, comprising a first flash source for emitting a first light beam and a second flash source for emitting a second light beam, a redirecting optics and a control means, wherein the flash sources are arranged for ... 02/15/07 - 20070037302 - Method of preparing electrode Methods of preparing electrodes, as well as related devices, components, systems, and methods, are disclosed. ... 01/25/07 - 20070020785 - Systems and methods for alignment of laser beam(s) for semiconductor link processing A method makes a discrete adjustment to static alignment of a laser beam in a machine for selectively irradiating conductive links on or within a semiconductor substrate using the laser beam. The laser beam propagates along a beam path having an axis extending from a laser to a laser beam ... 01/25/07 - 20070020784 - Method and system for determining optical properties of semiconductor wafers A method and system are disclosed for determining at least one optical characteristic of a substrate, such as a semiconductor wafer. Once the optical characteristic is determined, at least one parameter in a processing chamber may be controlled for improving the process. For example, in one embodiment, the reflectivity of ... 01/04/07 - 20070004061 - Method for detecting an end-point for polishing a material An optical surface analysis system for scanning the surface of a (silicon) wafer and detect if any residual material is still on the wafer surface in order to determine an appropriate end-point in a polishing process. An Optical Surface Analyzer (OSA), of the present invention, is generally used to identify ... 12/28/06 - 20060292714 - Semiconductor manufacturing apparatus and wafer processing method A semiconductor manufacturing apparatus and a wafer processing method are disclosed. The semiconductor manufacturing apparatus, comprises a rotatable device for supporting a wafer. A sensor for irradiating a laser beam onto a surface of the wafer and a detector including a plurality of modules for detecting the laser beam reflected ... 12/14/06 - 20060281201 - Damage evaluation method of compound semiconductor member, production method of compound semiconductor member, gallium nitride compound semiconductor member, and gallium nitride compound semiconductor membrane A method of evaluating damage of a compound semiconductor member, comprising: a step of performing spectroscopic ellipsometry measurement on a surface of the compound semiconductor member; and a step of evaluating damage on the surface of the compound semiconductor member, using a spectrum in a wavelength band containing a wavelength ... 11/16/06 - 20060258026 - Multi-wavelength semiconductor laser device and its manufacturing method A multi-wavelength semiconductor laser device having a high reflectance multi-layered film that can be collectively formed on a facet of a semiconductor laser element is provided. The multi-wavelength semiconductor laser device is made of a plurality of semiconductor laser elements each of which oscillates at a wavelength different from each ... 09/28/06 - 20060216840 - Methods for assessing alignments of substrates within deposition apparatuses; and methods for assessing thicknesses of deposited layers within deposition apparatuses The invention includes deposition apparatuses having reflectors with rugged reflective surfaces configured to disperse light reflected therefrom, and/or having dispersers between lamps and a substrate. The invention also includes optical methods for utilization within a deposition apparatus for assessing the alignment of a substrate within the apparatus and/or for assessing ... 09/07/06 - 20060199288 - Data processing apparatus for semiconductor processing apparatus A semiconductor processing method in which a sample wafer is disposed inside of a chamber for processing and process data is detected by using a generated plasma generated which includes data concerning emission light generated. Information data corresponding to the processing data is selectively sent to one of first and ... 09/07/06 - 20060199287 - Method and system for defect detection A method for inspecting objects such as semiconductor wafers. A staging platform and an optical platform are arranged so that the object may be staged and its surface scanned by optical equipment situated on the optical platform. During the scanning process, the surface is illuminated with light of a plurality ... 08/31/06 - 20060194354 - Laser irradiation method and apparatus for forming a polycrystalline silicon film A method for changing an amorphous silicon film to a poly-crystalline silicon film includes the steps of irradiating an elongate pulse laser beam onto the silicon film while scanning in the direction normal to the major axis of the elongate pulse laser beam, to form a plurality of irradiated areas, ... 07/13/06 - 20060154387 - Method for calibration of a photodiode, semiconductor chip and operating method The present invention relates to a method for setting a wavelength-dependent output signal of a light-sensitive integrated circuit (1) in which the output signals of the integrated circuit are measured at different measured wavelengths (λ1, λ2, λ3), the measured values (31, 32, 33) are compared to setpoint values (21, 22), ... 05/04/06 - 20060094136 - Evaluation of openings in a dielectric layer A patterned dielectric layer is evaluated by measuring reflectance of a region which has openings. A heating beam may be chosen for having reflectance from an underlying conductive layer that is several times greater than absorptance, to provide a heightened sensitivity to presence of residue and/or changes in dimension of ... 04/06/06 - 20060073620 - Methods and structures for critical dimension and profile measurement Methods and structures for critical dimension or profile measurement are disclosed. The method provides a substrate having periodic openings therein. Material layers are formed in the openings, substantially planarizing a surface of the substrate. A scattering method is applied to the substrate with the material layers for critical dimension (CD) ... 02/16/06 - 20060035396 - Semiconductor device manufacturing apparatus and a method of controlling a semiconductor device manufacturing process A particle monitor in the process chamber of a semiconductor device manufacturing apparatus provides a measure of a flux of contaminant particles in the chamber. The flux is measured whilst process conditions are produced in the process chamber and a process parameter is adjusted in response to the measured flux ... 12/01/05 - 20050266588 - Optoelectronic component and method of fabricating same The invention concerns an optoelectronic component comprising a layer stack that includes at least two active zones and a carrier that is applied to the layer stack. The invention further concerns a method of fabricating such an optoelectronic component. ... 11/10/05 - 20050250227 - Method to detect photoresist residue on a semiconductor device A method for detecting photoresist residue during semiconductor device manufacture includes developing photoresist on a surface of a semiconductor device to expose portions of the surface A plurality of etch paths are then partially etched into the surface and inspected to determine their depths. ... 10/27/05 - 20050239224 - Method and apparatus for measuring relative dielectric constant A relative-dielectric-constant measuring apparatus according to the present invention includes an ellipsometer and a capacitance measuring part. The ellipsometer allows non-contact measurements of the film thickness and optical constants of an insulation film formed on the upper surface of a wafer. The capacitance measuring part, on the other hand, allows ... 09/29/05 - 20050214959 - Semiconductor thin film manufacturing method A method of forming a semiconductor thin film. includes a highly sensitive inspection method for detecting lateral crystals and a crystallizing method. In the crystallizing method, the time-based pulse width of a laser SXL is modulated and an approximate band-like crystal silicon film SPSI is formed in a desired region ... 09/08/05 - 20050196882 - Real-time in-line testing of semiconductor wafers A method and apparatus for measuring damage of an ion implanted semiconductor wafer during semiconductor processing. The method includes the steps of conveying the wafer such that a surface of the wafer is substantially parallel to a surface photovoltage electrode of a head assembly during the semiconductor processing and exposing ... 08/25/05 - 20050186692 - Method and device for correcting slm stamp image imperfections The invention relates to production and precision patterning of work pieces, including manufacture of photomask for photolithography and direct writing on other substrates, such as semiconductor substrates. In particular, it relates to applying corrections to pattern data, such as corrections for distortions in the field of an SLM exposure stamp. ... 07/21/05 - 20050158889 - Wafer thickness control during backside grind A method and apparatus for controlling the thickness of a semiconductor wafer during a backside grinding process are disclosed. The present invention uses optical measurement of the wafer thickness during a backside grinding process to determine the endpoint of the grinding process. Preferred methods entail measuring light transmitted through or ... 06/16/05 - 20050130333 - Die sorting apparatus and method A die sorting apparatus for a wafer is provided that associates logical positions of each die from a map file for storing records of testing information based upon testing performed on individual dice comprised in the wafer with its physical position as illustrated by an image acquired by an image ... ### FreshPatents.com Support |