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Semiconductor Device Manufacturing: Process > With Measuring Or Testing > Packaging (e.g., With Mounting, Encapsulating, Etc.) Or Treatment Of Packaged Semiconductor Packaging (e.g., With Mounting, Encapsulating, Etc.) Or Treatment Of Packaged SemiconductorPackaging (e.g., With Mounting, Encapsulating, Etc.) Or Treatment Of Packaged Semiconductor patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.03/08/07 - 20070054424 - Semiconductor heating heater holder and semiconductor manufacturing apparatus A semiconductor heater holder for setting a heater for heating a semiconductor, having an opening, wherein the heat capacity of the semiconductor heater holder is not more than 1.5 times the heat capacity of the heater, and a semiconductor manufacturing apparatus comprising this semiconductor heater holder. ... 01/04/07 - 20070004060 - System and method for matching chip and package terminals A system and method for matching chip and package terminals and for packaging integrated circuits. Various aspects of the present invention may comprise receiving as input a first list of chip terminal identifiers and a second list of package terminal identifiers. The first and second lists may be analyzed with ... 10/19/06 - 20060234405 - Semiconductor device with self-aligning contactless interface Contactless interconnects between an integrated circuit die and an electrical structure are aligned by charging alignment pads on the integrated circuit die to a first voltage, and charging counterpart alignment pads on the electrical structure to a second voltage. The integrated circuit die is disposed in an initial position relative ... 07/27/06 - 20060166383 - Semiconductor substrate having reference semiconductor chip and method of assembling semiconductor chip using the same A semiconductor substrate having a reference semiconductor chip and a method of assembling semiconductor chips using the same are provided. According to the method, a semiconductor substrate having a plurality of semiconductor chips is provided. An identification mark is made on a reference semiconductor chip among the semiconductor chips. The ... 07/13/06 - 20060154386 - Apparatus and method for aligning devices on carriers An apparatus and method are provided for aligning a plurality of semiconductor devices placed on a carrier. Alignment guides are located adjacent to each device in use, and arranged such that they correspond to a desired alignment of each semiconductor device. For alignment, the semiconductor devices are held by a ... 06/15/06 - 20060128040 - Bond positioning method for wire-bonding process and substrate for the bond positioning method A bond positioning method for a wire-bonding process and a substrate for the bond positioning method are provided. At least one solder mask mark is formed in a solder mask layer on the substrate, such that during the wire-bonding process, the solder mask mark serves as a reference point for ... 06/08/06 - 20060121633 - Semiconductor laser device manufacturing method and semiconductor laser device A semiconductor laser device manufacturing method includes, sequentially, a first aging step S1, a first inspection step S2, a mounting step S3, a second aging step S4 and a second inspection step S5. Since the first aging step S1 on a semiconductor laser chip with a high-temperature direct current conduction ... 05/18/06 - 20060105477 - Device and method for manufacturing wafer-level package In an embodiment of the invention, a device for manufacturing a wafer-level package includes a wafer sawing unit, a sorting unit, a pickup unit, and a placing unit. The wafer sawing unit cuts a wafer into wafer-level packages. The sorting unit performs a sorting process on the wafer-level packages to ... 04/20/06 - 20060084190 - Process for the surface treatment of a component, and apparatus for the surface treatment of a component Components which are subject to operating loads can often be passed for refurbishment by means of an acid treatment. The time for which the components remain in the acid has hitherto been determined empirically, which means that individual loads are not taken into account. The process according to the invention ... 03/23/06 - 20060063284 - Dc bias voltage measurement circuit and plasma cvd apparatus comprising the same A circuit for measuring DC bias voltage occurring in an ungrounded electrode of a plasma processing apparatus, includes: a first terminal connected between the ungrounded electrode and the RF power source; a second terminal for determining a value of the DC bias voltage; a first resistance connected between the first ... 03/16/06 - 20060057747 - Reloading of die carriers without removal of die carriers from sockets on test boards A method of testing microelectronic dies is described. A respective set of dies is inserted into die carrier bodies releasably held within a set of sockets secured to a burn-in board. A set of die carrier covers is closed, each die carrier cover being secured to a respective die carrier ... 02/02/06 - 20060024851 - Method for producing an optical or electronic module provided with a plastic package A method for producing an optical or electronic module provided with a plastic package including: providing at least one optical or electronic component, the component having an operative region, via which it is in operative connection with the surroundings in the finished module, encapsulating the component with at least one ... 01/26/06 - 20060019419 - Method of detecting a defect in a simiconductor device A method of detecting a defect in a semiconductor device may involve immersing a substrate into a chemical solution. The substrate may support a metal wiring and an insulation layer may cover the metal wiring. The chemical solution may permeate through the defect such as a pinhole and/or a crack ... 01/26/06 - 20060019418 - Method for evaluating and modifying solder attach design for integrated circuit packaging assembly A method of reducing a likelihood that a die pad will be delaminated from a die in an integrated circuit die package for a structure design during an attachment of a heat sink member to the die pad using solder, is provided. A sample structure of the structure design is ... 01/19/06 - 20060014308 - Procedure for arranging chips of a first substrate on a second substrate The invention relates to a method for arranging chips of a first substrate on a second substrate, in which the chips are grouped at least into first chips and into second chips, the first chips of the first substrate are singulated and the singulated first chips are arranged on the ... 12/08/05 - 20050272172 - Method of temporarily securing a die to a burn-in carrier A method of using adhesive tape to temporarily retain a die being temporarily held in a fixture during testing and burn-in. The method of the present invention uses a die cut piece of adhesively coated tape to hold a die in a test and burn-in fixture. Upon subsequent heating of ... 11/17/05 - 20050255612 - Method of attaching a leadframe to singulated semiconductor dice The present invention is directed to a method of attaching a leadframe to a singulated good die using a wet film adhesive applied in a predetermined pattern on the active surface of the good die, the lead finger of a leadframe, or both. By applying the adhesive only to identified ... 10/20/05 - 20050233482 - Method of making contact pin card system A compliant contact pin contactor card method for making is provided. A compliant contact pin assembly includes a contact pin formed from a portion of a substrate with the contact pin compliantly held suspended within the substrate by a compliant coupling structure. The suspension within the substrate results in a ... 10/13/05 - 20050227385 - Method of and system for manufacturing organic el devices It is an object of the present invention to eliminate a color deviation possibly caused by a film formation failure in an organic layer of organic EL devices, thereby improving product yield. A method of manufacturing organic EL devices according to the invention comprises: a pre-treating step for forming lower ... 10/13/05 - 20050227384 - Method for manufacturing semiconductor device In a production of a semiconductor device, after a step in which a thermosetting resin is thermally cured to seal a semiconductor chip with the resin and before a step in which a characteristic of the semiconductor chip is inspected, the thermosetting resin is baked at a temperature higher than ... 07/21/05 - 20050158888 - System and method for product yield prediction A system and method for predicting yield of integrated circuits includes at least one type of characterization vehicle which incorporates at least one feature which is representative of at least one type of feature to be incorporated in the final integrated circuit product. The characterization vehicle is subjected to at ... 06/23/05 - 20050136563 - Backside failure analysis of integrated circuits Backside failure analysis of integrated circuits. In one embodiment, a method of preparing a device under test (DUT) for an image based diagnostic testing is disclosed. The method comprises removing a portion of the backside package of the DUT to allow for the implementation of an image based diagnostic test ... ### FreshPatents.com Support |