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Semiconductor Device Manufacturing: Process > Including Control Responsive To Sensed Condition > Optical Characteristic Sensed Optical Characteristic SensedOptical Characteristic Sensed patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.04/19/07 - 20070087457 - Method for inspecting and mending defect of photo-resist and manufacturing process of printed circuit board A method for inspecting and mending defects of photo-resist is provided. It includes the following steps. First, a substrate having at least one film is provided. Then, a patterned photo-resist layer is formed on the film. Next, an optical inspection procedure is performed to inspect whether the patterned photo-resist layer ... 03/15/07 - 20070059847 - Method and system for optimizing a barc stack In the present invention, a BARC stack comprising at least a first BARC layer and at least a second BARC layer is optimized for reducing substrate reflectivity in lithographic processing applications. The first BARC layer is positioned adjacent the resist layer, while the second BARC layer is positioned adjacent the ... 02/01/07 - 20070026541 - Method and system for manufacturing semiconductor device having less variation in electrical characteristics A method of manufacturing a semiconductor device, which has a gate electrode and a pair of diffusion layers formed in a semiconductor substrate on sides of the gate electrode, includes forming an insulating film and a gate electrode on a semiconductor substrate, obtaining a thickness of an affected layer formed ... 01/04/07 - 20070004053 - Tunable alignment geometry An alignment targets with geometry designs provides a desired alignment offset for processes (both symmetric and asymmetric) on a wafer substrate. The alignment target includes one or more sub-targets, where each sub-target is defined as having a left portion and a right portion having a different geometric pattern, and where ... 11/30/06 - 20060270068 - Method for fabricating right-angle holes in a substrate A method is disclosed for forming right-angle contact/via holes for semiconductor devices, comprising a two step etching process. A front end device is provided on a substrate and covered with a first dielectric layer. A second dielectric layer having an etch rate different from that of the first layer is ... 11/02/06 - 20060246608 - Fabrication alignment technique for light guide screen Provided is a fabrication alignment technique for a light guide screen. A plurality of light guide layers are provided. Each light guide layer includes a plurality of aligned light guides, each light guide having an input end, a midsection and an output end. The light guide layers are physically stacked. ... 10/12/06 - 20060228816 - System and method for overlay measurement in semiconductor manufacturing A method for semiconductor manufacturing includes forming an overlay target having a pattern formed by a first mask layer and an adjacent layer. The overlay target is exposed to radiation. As a result, reflective beams can be detected from the pattern and the adjacent layer and the location of the ... 10/05/06 - 20060223200 - Semiconductor manufacture method A semiconductor device manufacture method has the steps of: (a) forming a semiconductor device structure in a chip and alignment marks, respectively in a semiconductor wafer; (b) forming a workpiece layer above the semiconductor wafer; (c) exposing the alignment marks; (d) coating an electron beam resist film on the workpiece ... 07/13/06 - 20060154384 - Optical device A method of forming an optical device comprising the steps of: providing a substrate comprising a first electrode capable of injecting or accepting charge carriers of a first type; forming over the first electrode a first layer that is at least partially insoluble in a solvent by depositing a first ... 04/13/06 - 20060079007 - System, method, and medium for an endpoint detection scheme for copper low-dielectric damascene structures for improved dielectric and copper loss A system, method and medium of detecting a transition interface between a first dielectric material and an adjacent second dielectric material in a semiconductor wafer during a chemical-mechanical polishing process includes impinging an incident light of a predetermined wavelength on the semiconductor wafer at a first time, detecting at least ... 02/16/06 - 20060035391 - Manufacturing method of array substrate and manufacturing method of liquid crystal display device using the same The invention relates to a manufacturing method of an array substrate used for a reflective or transflective liquid crystal display device and a manufacturing method of a liquid crystal display device using the same, and has an object to provide the manufacturing method of the array substrate in which the ... 02/09/06 - 20060030059 - Apparatus and method for testing defects A defect inspection method includes radiating an illumination slit-shaped beam having lights substantially parallel to a longitudinal direction to a substrate having circuit patterns in a direction inclined at a predetermined gradient relative to the direction of a line normal to the substrate and inclined at a predetermined gradient on ... 11/10/05 - 20050250225 - Method and apparatus for forming patterned photoresist layer A method for forming a patterned photoresist layer aligned with a predetermined layer is described. A photoresist layer is formed on a substrate and then exposed. The overlay offset between the exposed portions of the photoresist layer and the predetermined layer is measured for determining whether the exposed portions of ... 11/10/05 - 20050250224 - Method of inspecting pattern and inspecting instrument Electron beam is irradiated to a wafer in the midst of steps at predetermined intervals by a plurality of times under a condition in which a junction becomes rearward bias and a difference in characteristic of a time period of alleviating charge in the rearward bias is monitored. As a ... 09/15/05 - 20050202575 - Semiconductor fabricating apparatus and method and apparatus for determining state of semiconductor fabricating process In a semiconductor device fabrication apparatus for performing an etching process for a semiconductor wafer having a plurality of films formed on a surface thereof and disposed in a chamber, by using plasma generated in the chamber, a change in light of multi-wavelength from the surface of the semiconductor wafer ... 09/01/05 - 20050191768 - Apparatus and method for measuring substrates A substrate measuring apparatus includes a reference value storage unit, an electron irradiator, a current measuring device, and a property value calculating device. The reference value storage unit stores data on the relationship between current flow in a sample substrate with a contact hole of known characteristics that is irradiated ... ### FreshPatents.com Support |