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Semiconductor Device Manufacturing: Process > Including Control Responsive To Sensed Condition Including Control Responsive To Sensed ConditionIncluding Control Responsive To Sensed Condition patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.04/19/07 - 20070087455 - Independent control of ion density, ion energy distribution and ion dissociation in a plasma reactor A method of processing a workpiece in a plasma reactor includes coupling RF power from at least three RF power source of three respective frequencies to plasma in the reactor, setting ion energy distribution shape by selecting a ratio between the power levels of a first pair of the at ... 03/01/07 - 20070048882 - Method to reduce plasma-induced charging damage In some implementations, a method is provided for inhibiting charge damage in a plasma processing chamber during a process transition from one process step to another process step, including performing a pre-transition compensation of at least one process parameter so as to inhibit charge damage from occurring during the process ... 03/01/07 - 20070048881 - Memory device transistors Method and device embodiments are described for fabricating MOSFET transistors in a semiconductor also containing non-volatile floating gate transistors. MOSFET transistor gate dielectric smiling, or bird's beaks, are adjustable by re-oxidation processing. An additional re-oxidation process is performed by opening a poly-silicon layer prior to forming an inter-poly oxide dielectric ... 02/22/07 - 20070042508 - Pulsed mass flow delivery system and method A system for delivering a desired mass of gas, including a chamber, a first valve controlling flow into the chamber, a second valve controlling flow out of the chamber, a pressure transducer connected to the chamber, an input device for providing a desired mass to be delivered, and a controller ... 02/01/07 - 20070026540 - Method of forming non-conformal layers In one aspect, non-conformal layers are formed by variations of plasma enhanced atomic layer deposition, where one or more of pulse duration, separation, RF power on-time, reactant concentration, pressure and electrode spacing are varied from true self-saturating reactions to operate in a depletion-effect mode. Deposition thus takes place close to ... 01/25/07 - 20070020776 - Method and apparatus for wall film monitoring A wall film monitoring system includes first and second microwave mirrors in a plasma processing chamber each having a concave surface. The concave surface of the second mirror is oriented opposite the concave surface of the first mirror. A power source is coupled to the first mirror and configured to ... 01/04/07 - 20070004052 - Processing schedule creaitng method, coating and developing apparatus, pattern forming apparatus and processing system A coating and developing apparatus having a plurality of cassettes includes at least a step of acquiring, for each of all wafers retained in the cassettes, wafer attribute information associated with a cassette retaining that wafer and a process recipe, a step of acquiring inside-cassette information associated with the retained ... 01/04/07 - 20070004051 - Processing method and device A processing system has a processing section for continuously processing a member to be processed; an inspection section for inspecting a processed state of the member processed by the processing section; a processed state determination section for determining whether the processed state is defective/nondefective, on the basis of a result ... 12/21/06 - 20060286689 - Semiconductor device and manufacturing method thereof A metal wire for inspection and an electrode for inspection are formed on a region of a semiconductor substrate where a metal wire and an electrode for external connection are not formed. The metal wire for inspection and the electrode for inspection electrically detect an open failure, a short-circuit failure ... 12/14/06 - 20060281196 - Controlled electrochemical polishing method The invention relates to a method of polishing a substrate comprising at least one metal layer by applying an electrochemical potential between the substrate and at least one electrode in contact with a polishing composition comprising a reducing agent or an oxidizing agent. ... 12/07/06 - 20060275931 - Technology of detecting abnormal operation of plasma process A method of detecting abnormal operation of a plasma process, includes: (i) detecting a potential Vpp1 between an upper electrode and a lower electrode disposed parallel to each other in a reaction camber at a time T1 after the plasma process begins in the reaction chamber; (ii) detecting a Vpp2 ... 11/30/06 - 20060270067 - Defect detection method A defect detection method is disclosed, in which the method includes: providing a semiconductor sample, wherein the semiconductor sample comprises at least one defect; utilizing a failure analysis for detecting at least one suspected area on the backside of the semiconductor sample; utilizing a physical energy for forming a plurality ... 10/26/06 - 20060240579 - Method for reducing threshold voltage variations due to gate length differences The invention provides a method of reducing threshold voltage variations due to gate length differences. The method comprises: providing a substrate having a plurality of MOS transistors at different gate lengths, pocket implanting these MOS transistors at different angles, establishing a relationship between the threshold voltages and gate lengths on ... 10/19/06 - 20060234398 - Single ic-chip design on wafer with an embedded sensor utilizing rf capabilities to enable real-time data transmission An apparatus and method for real-time monitoring process conditions of a semiconductor wafer processing operation. A semiconductor wafer subject to processing in a wafer processing tool is embedded with one or more sensor devices. In response to receipt of wireless electromagnetic signals, the embedded sensor devices are activated for generating ... 10/12/06 - 20060228815 - Inductively coupled plasma chamber attachable to a processing chamber for analysis of process gases Disclosed herein are exemplary embodiments of an improved Inductively Coupled Plasma (ICP) chamber which is externally coupleable to a processing chamber to monitor processes gases therefrom. The disclosed ICP chamber design is beneficial because it allows for the porting of reference gases for the purpose of performing actinometry, and/or allows ... 08/31/06 - 20060194350 - Control system A scientific experiment control system includes a main controller for high-level control, an experimental manager for lower-level control of scientific experiments, and a roll-up engine for automatically propagating modifications (or “changes”) within the system to ensure consistency across the system and instruments which are linked to it in an automatic ... 08/31/06 - 20060194349 - Method of reworking a semiconductor structure The present invention allows correcting malfunctions occurring in the formation of a cap layer on an electrical element in a semiconductor substrate. It is detected whether a malfunction occurred in the formation of the cap layer. If a malfunction in the formation of the cap layer was detected, a rework ... 08/24/06 - 20060189005 - Methods for fabricating semiconductor devices so as to stabilize the same when contact-bearing surfaces thereof face over test substrates One or more of stabilizers are formed or disposed on the surface of a semiconductor device or test substrate prior to orienting the semiconductor device so that a contact-bearing surface thereof faces the test substrate. Upon assembly of the semiconductor device and test substrate, the stabilizers prevent the semiconductor device ... 08/03/06 - 20060172441 - Resist application method and device The resist application method comprises the steps of: thermal processing for evaporating water from the surface of a wafer 10; making the surface of the wafer 10 hydrophobic with a hydrophobic processing material; and applying a resist onto the wafer 10, and the step of thermal processing to the step ... 07/20/06 - 20060160253 - Method and apparatus for wafer temperature regulation A method and apparatus for regulating the temperature a wafer is provided. The apparatus may include a temperature controlling unit provided within the chamber and regulating the temperature of the wafer; a wafer support pin for adjusting the position of the wafer with respect to the temperature controlling unit; and/or ... 07/13/06 - 20060154383 - Processing apparatus and processing method In a processing apparatus, a process gas including a source gas (TiCl4, NH3) and an inert gas (N2) is supplied into a process chamber (2). A pressure meter (6) detects a pressure in the process chamber (2) so as to control an amount of flow of the process gas supplied ... 06/29/06 - 20060141642 - Method for making mask in process of fabricating semiconductor device A method for making a mask in a process of fabricating a semiconductor device is disclosed, in which one database is classified into an SRAM block and a random logic block so that OPC is separately performed for the SRAM block and the random logic block, thereby improving performance of ... 06/22/06 - 20060134811 - Semiconductor processing apparatus and method A semiconductor processing apparatus includes a process chamber to accommodate a target substrate, a gas supply system to supply a process gas into the process chamber, an exhaust unit to exhaust the process chamber, and an exhaust line connecting the process chamber to the exhaust unit. An opening variable valve ... 06/22/06 - 20060134810 - Apparatus and method for voltage contrast analysis of a wafer using a titled pre-charging beam A method for electrically testing a wafer that includes: receiving a wafer having a first layer that is at least partly conductive and a second layer formed over the first layer, following production of openings in the second layer; directing towards the wafer a first set of beams of charged ... 05/25/06 - 20060110836 - Eliminating systematic process yield loss via precision wafer placement alignment A method for a semiconductor process includes correlating yield loss for the performance of a processing step in a semiconductor manufacturing process with the mechanical placement of the semiconductor substrate and, based on the correlation, placing semiconductor substrates in a position with sufficient placement precision to reduce yield loss below ... 04/06/06 - 20060073618 - Method of fabricating thin film calibration features for electron/ion beam image based metrology A method of making and using thin film calibration features is described. To fabricate a calibration standard according to the invention raised features are first formed from an electrically conductive material with a selected atomic number. A conformal thin film layer is deposited over the exposed sidewalls of the raised ... 04/06/06 - 20060073617 - Surface coordinate system A method for creating a reference for a first position on a substrate edge. A first reference point is selected relative to a circumference of the substrate edge, and a second reference point is selected relative to a bevel of the substrate edge. A first distance along the circumference of ... 03/23/06 - 20060063280 - Lamp heating apparatus and method for producing semiconductor device A lamp heating apparatus has: a chamber having a transparent window and housing a substrate; a heating lamp for heating the substrate by radiant heat of a heating lamp through the transparent window; a radiation thermometer that optically detects the temperature of the substrate and has a sensing portion provided ... 03/09/06 - 20060051883 - Apparatus and system for suspending a chip-scale device and related methods A suspension of a chip-scale device is accomplished using a suspension frame and at least one first tether. The chip-scale suspension frame defines a first plane and an opening through the suspension frame. At least one first tether crosses the opening at a first angle relative to the first plane ... 01/26/06 - 20060019413 - Method for producing a local coating and combinatory substrate having such coating A method for producing at least one local coating on a substrate is provided, as well as a combinatory substrate having such a local coating, a mask that is removable in a non-destructive manner being arranged on the substrate in a first step; the mask having at least one perforation, ... 12/01/05 - 20050266587 - Substrate support method The present invention includes a method for supporting a substrate that features a chuck body having a body surface with a pin extending therefrom having a contact surface lying in a plane, with the pin being movably coupled to the chuck body to move with respect to the plane. To ... 11/17/05 - 20050255609 - Delivery position aligning method for use in a transfer system and a processing system employing the method A transfer system has a position aligning device, a mounting device, and a transfer mechanism having two pick. In a delivery position aligning method for use in a transfer system, a set of delivery position coordinates that defines an access point of each pick of the transfer mechanism is temporarily ... 11/03/05 - 20050244989 - Ion implantation apparatus and method An ion implantation apparatus includes an ion emission unit configured to emit ions to a plurality of regions of at least one substrate under different conditions. A substrate holding unit is configured to hold the substrate and change a position of the at least one substrate relative to the ions ... 10/20/05 - 20050233477 - Substrate processing apparatus, substrate processing method, and program for implementing the method A substrate processing apparatus which is capable of enhancing productivity in manufacturing product substrates. In process chambers 106 and 107 of an etching apparatus 100, etching is carried out on a substrate as an object to be processed, and dummy processing is carried out on at least one non-product substrate ... 09/29/05 - 20050214955 - Method to control a management system to control semiconductor manufacturing equipment In the control method in a management system of semiconductor manufacturing equipment to enhance a product yield through a control of etching process, information of a corresponding lot for the etching process is recognized. It is checked whether the information of corresponding lot is for an etching process after a ... 06/23/05 - 20050136558 - Stacked semiconductor device assembly and method for forming One embodiment relates to using a robust metal layer of a semiconductor device to form landing pads. In one embodiment, a sputterable, nonwettable refractory metal is used as a solder mask for the landing pads. A second device may then be coupled to the robust metal layer landing pads of ... 06/16/05 - 20050130330 - Method for etch processing with end point detection thereof A method for performing process end point detection in a semiconductor substrate processing system by monitoring for an increase in a flow of backside gas above a predetermined limit. ... 06/16/05 - 20050130329 - Method for the prediction of the source of semiconductor part deviations A method for predicting a source of semiconductor part deviation is disclosed. The method includes the steps of selecting at least one chart including part parameters and associating with each of the part parameters at least one fabrication process, which are stored in recipes, scanning the selected charts for deviations ... 06/02/05 - 20050118735 - Method for determining or inspecting a property of a patterned layer One embodiment of the invention provides a method for determining or inspecting a lateral dimension or a volume of a recess in a layer at a surface of a substrate or a property of a material arranged in the recess. The layer having the recess is irradiated with an electromagnetic ... ### FreshPatents.com Support |