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Semiconductor Device Manufacturing: Process > Repair Or Restoration Repair Or RestorationRepair Or Restoration patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.02/01/07 - 20070026539 - Method of selecting and analyzing scrap silicon Non-destructive testing is performed on individual pieces of silicon using an energy dispersive x-ray fluorescent analyzer to determine from the obtained spectral data whether a prescribed impurity element is contained therein. The electrical resistivity of each piece of scrap silicon can be measured, and the concentration of the impurity element ... 01/11/07 - 20070010032 - Defect identification system and method for repairing killer defects in semiconductor devices A method for improving semiconductor yield by in-line repair of defects during manufacturing comprises inspecting dies on a wafer after a selected layer is formed on the dies, identifying defects in each of the dies, classifying the identified defects as killer or non-critical, for each killer defect determining an action ... 01/04/07 - 20070004050 - Method of regenerating substrate For the purpose of readily and thoroughly removing organic material components, in particular such as alignment film and alignment-control projection component, formed on an inorganic material film while minimizing the number of process steps, and reducing damage possibly exerted on the individual layers under the organic material components as possible, ... 12/28/06 - 20060292707 - Healing detrimental bonds in deposited materials A method for healing detrimental bonds in deposited materials, for example porous, low-k dielectric materials, including oxydatively processing a deposited material, processing the deposited material with a trialkyl group III compound, and processing in the presence of an alcohol. Also included in embodiments of the invention are materials with bonds ... 11/30/06 - 20060270066 - Organic transistor, manufacturing method of semiconductor device and organic transistor It is an object to form a high quality gate insulating film which is dense and has a strong insulation resistance property, and to propose a high reliable organic transistor in which a tunnel leakage current is little. One mode of the organic transistor of the present invention has a ... 10/26/06 - 20060240578 - Device mounting substrate and method of repairing defective device A method of repairing a defective one of devices mounted on substrate is provided. Devices are arrayed on a substrate and electrically connected to wiring lines connected to a drive circuit, to be thus mounted on the substrate. The devices mounted on the substrate are then subjected to an emission ... 08/17/06 - 20060183254 - Method of fabricating and/or repairing a light emitting device A method of repairing a light emitting device which makes high quality image display possible even if a pin hole is formed during formation of an EL layer is provided. The method of repairing a light emitting device is characterized in that a reverse bias voltage is applied to an ... 08/17/06 - 20060183253 - Repairing method of a thin film transistor array A repairing method of thin film transistor array is provided. The repairing method of thin film transistor array can remove a residue between pixel electrodes so as to prevent the residue from electrically connecting pixel electrodes adjacent to each other. The repairing method of thin film transistor array can also ... 08/03/06 - 20060172440 - Transistor-level signal cutting method and structure A modifiable circuit structure and its method of formation are disclosed. The modifiable circuit structure electrically couples one portion of an interconnect with another portion of the interconnect through vias disposed in a dielectric layer. The combination of the modifiable circuit structure, the interconnect portions, and the vias provide a ... 07/06/06 - 20060148109 - Novel wafer repair method using direct-writing A method of wafer repairing comprises identifying locations and patterns of defective regions in a semiconductor wafer; communicating the locations and patterns of defective regions to a direct-writing tool; forming a photoresist layer on the semiconductor wafer; locally exposing the photoresist layer within the defective regions using an energy beam; ... 06/29/06 - 20060141641 - Repair and restoration of damaged dielectric materials and films Methods of repairing voids in a material are described herein that include: a) providing a material having a plurality of reactive silanol groups; b) providing at least one reactive surface modification agent; and c) chemically capping at least some of the plurality of reactive silanol groups with the at least ... 06/15/06 - 20060128038 - Method and system for providing a highly textured magnetoresistance element and magnetic memory A method and system for providing a magnetic element are disclosed. The method and system include providing a pinned layer, a free layer, and a spacer layer between the pinned layer and the free layer. The spacer layer is insulating and has an ordered crystal structure. The spacer layer is ... 01/26/06 - 20060019412 - Method to selectively correct critical dimension errors in the semiconductor industry A method to correct critical dimension errors during a semiconductor manufacturing process. The method includes providing a first semiconductor device. The first semiconductor device is analyzed to determine at least one critical dimension error within the first semiconductor device. A dose of electron beam exposure to correct the at least ... 12/01/05 - 20050266586 - Stylus system for modifying small structures An improved method for rapidly and accurately modifying small structures, including structures on a micron or nanometer scale, suitable for the repair of defects in lithographic photo-masks and semiconductors on a nano-scopic level. Features or samples repaired may be conductive or non-conductive. A single instrument can be employed to both ... 11/24/05 - 20050260775 - Physical nano-machining with a scanning probe system for integrated circuit modification Nano-machining for circuit edits through the front side or backside of an integrated circuit may be performed using a scanning probe system. The system may create access holes with smaller dimensions and facilitate nano-machining endpoint detection in some embodiments. ... 10/13/05 - 20050227379 - Laser patterning of light emitting devices and patterned light emitting devices Light extraction features are provided for a light emitting device having a substrate and a semiconductor light emitting element on the substrate by shaping a surface of a layer of semiconductor material utilizing a laser to define three dimensional patterns in the layer of semiconductor material. The layer of semiconductor ... 09/01/05 - 20050191767 - Focused ion beam circuit repair using a hardmask and wet chemistry An embodiment of the invention is a method of integrated circuit repair that includes removing the top dielectric layer 160 in at least one location using a FIB and etching exposed areas of a top metal layer 171 using a wet chemistry process. This method also includes etching selected portions ... 07/21/05 - 20050158884 - Multilayered structure film and method of making the same Method and apparatus for using a silylating agent after exposure to an oxidizing environment for repairing damage to low-k dielectric films are described. Plasma photoresist removal, or ashing, may damage bonds in the low-k materials, which may lead to a significant increase in the dielectric constant of the materials. The ... 06/30/05 - 20050142669 - Method for patching up thin-film transistor circuits on a display panel by local thin-film deposition A method for patching up thin-film transistor (TFT) circuit patterns on a display panel comprises the following steps. Firstly, a mask having an opening is placed above the display panel and the opening corresponds to the location of the cracks of the circuits on the display panel. Subsequently, a plasma ... ### FreshPatents.com Support |