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Radiation Imagery Chemistry: Process, Composition, Or Product Thereof > Imaging Affecting Physical Property Of Radiation Sensitive Material, Or Producing Nonplanar Or Printing Surface - Process, Composition, Or Product > Forming Nonplanar Surface Forming Nonplanar SurfaceForming Nonplanar Surface patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.06/07/07 - 20070128558 - Pattern formation method and exposure system After forming a resist film made from a chemically amplified resist material, pattern exposure is carried out by irradiating the resist film with exposing light while supplying, between a projection lens and the resist film, a solution of water (having a refractive index of 1.44) that includes an antifoaming agent ... 05/31/07 - 20070122754 - Manufacturing method of pattern formed body A main object of the present invention is to provide a manufacturing method of a plurality of pattern formed bodies which makes it possible that even if the pattern formed bodies are continuously manufactured, their property varied patterns are each made into a target pattern form with high precision. To ... 05/10/07 - 20070105057 - Method for forming photoresist pattern A method of forming a photoresist pattern, capable of improving an adhesion property of the photoresist pattern formed on a substrate, includes forming a photocatalytic layer on a substrate, forming a negative-type photoresist layer on the photocatalytic layer, exposing the photoresist layer to ultraviolet rays, heat-treating the photoresist layer, and ... 05/03/07 - 20070099128 - Method for manufacturing insulating resin layer, substrate for electro-optical devices, method for manufacturing electro-optical device, and electro-optical device [Solving Means] A method for manufacturing an insulating layer for electro-optical devices according to the present invention includes an exposure step of performing exposure for a protrusion-forming layer 7 containing a photosensitive resin (insulating material) with an illuminance of 80 mW/cm2 or more. The resin is decolorized due to the ... 04/26/07 - 20070092844 - Method to form photo patterns A method for forming photo patterns on a photoresist layer is disclosed. A photoresist layer is formed over a substrate. The photoresist layer has a first photo region and a second photo region. A first exposure is performed to define a through pitch pattern at the first photo region and ... 04/26/07 - 20070092843 - Method to prevent anti-assist feature and side lobe from printing out A method for forming photo patterns on a photoresist layer is disclosed. A photoresist layer is formed over a substrate. The photoresist layer is then treated with a basic compound and is exposed. The photoresist layer can be treated with a basic compound first, and then exposed. The photoresist layer ... 04/05/07 - 20070077526 - Method of patterning a positive tone resist layer overlaying a lithographic substrate A single exposure method and a double exposure method for reducing mask error factor and for enhancing lithographic printing-process resolution is presented. The invention comprises decomposing a desired pattern of dense lines and spaces in two sub patterns of semi-dense spaces that are printed in interlaced position with respect to ... 04/05/07 - 20070077525 - Multi-level layer Various methods and apparatus relating to a multi-level layer are disclosed. ... 03/29/07 - 20070072133 - Substrate, method of exposing a substrate, machine readable medium A double exposure method for enhancing the image resolution in a lithographic system, is presented herein. The invention comprises decomposing a desired pattern to be printed on the substrate into at least two constituent sub-patterns that are capable of being optically resolved by the lithographic system, coating the substrate with ... 02/08/07 - 20070031764 - Exposure process An exposure process is provided. First, a plurality of optical modules is provided. The optical modules are arranged in order and a partially overlap areas is formed at the overlapping region between each two adjacent optical modules. A photo mask with pluralities of first device patterns and pluralities of second ... 12/28/06 - 20060292501 - Lithography process with an enhanced depth-on-focus Provided is a method for lithography processing. The method comprises forming a photoresist layer on a substrate and forming a resolution enhancement material (REM) layer on the photoresist layer. The REM layer comprises an acid component. ... 12/28/06 - 20060292500 - Cure during rinse to prevent resist collapse Numerous embodiments of a method to increase the mechanical strength of a photoresist structure are described. In one embodiment of the present invention, a photoresist material is dispensed over a substrate to form a photoresist layer. The photoresist material is exposed to a first radiation treatment to define a pattern ... 11/16/06 - 20060257797 - Bank structure, wiring pattern forming method, device, electro-optical device, and electronic apparatus There is provided a bank structure which partitions off a pattern formation region in which a functional liquid is to be disposed. The pattern formation region includes a first pattern formation region, and a second pattern formation region which is connected to the first pattern formation region and which has ... 11/16/06 - 20060257796 - Bank structure, wiring pattern forming method, device, electro-optical device, and electronic apparatus There is provided a bank structure which partitions off a pattern formation region in which a functional liquid is to be disposed and flow. The pattern formation region includes a first pattern formation region, and a second pattern formation region which is continuously connected to the first pattern formation region ... 10/19/06 - 20060234167 - Semiconductor constructions The invention includes a process whereby a solvent is utilized to remove soluble portions of a resist, and subsequently the solvent can be removed with a gas-fortified liquid. In particular aspects, the gas-fortified liquid emits bubbles during the removal of the solvent. Additionally, the gas-fortified liquid can be utilized to ... 10/12/06 - 20060228653 - Development or removal of block copolymer or pmma-b-s-based resist using polar supercritical solvent Methods of developing or removing a select region of block copolymer films using a polar supercritical solvent to dissolve a select portion are disclosed. In one embodiment, the polar supercritical solvent includes chlorodifluoromethane, which may be exposed to the block copolymer film using supercritical carbon dioxide (CO2) as a carrier ... 09/28/06 - 20060216655 - Compositions, systems, and methods for imaging A composition, method, and system for recording an image. The system includes an imaging material in which radiation energy is absorbed by an antenna material. The antenna material may be chosen from the group consisting of phthalocyanines and naphthalocyanines. ... 08/24/06 - 20060188826 - Method for utilizing dry film A method for utilizing a dry film is provided. A dry film is pressed onto a substrate, such as a wafer. The dry film includes a photoresist layer tightly attached to the substrate and an exposed carrier film with light transmission. Before exposure and development, the carrier film of the ... 08/24/06 - 20060188825 - Laser irradiation device and laser induced thermal imaging method A laser irradiation device includes a laser generator for patterning and a laser generator for preheating. A laser induced thermal imaging (LITI) method, includes preparing an acceptor substrate, laminating a donor substrate on the acceptor substrate, and irradiating a laser beam onto a predetermined region of the donor substrate and ... 08/17/06 - 20060183059 - System and method for absorbance modulation lithography A lithography system is disclosed that provides an array of areas of imaging electromagnetic energy that are directed toward a recording medium. The reversible contrast-enhancement material is disposed between the recording medium and the array of areas of imaging electromagnetic energy. ... 08/17/06 - 20060183058 - System and method for contrast enhanced zone plate array lithography A lithography system is disclosed that includes an array of focusing elements for directing focused illumination toward a recording medium, and a reversible contrast-enhancement material disposed between the recording medium and the array of focusing elements. ... 08/17/06 - 20060183057 - Patterning method Formation of a photomask in the conventional art requires significant cost and time. The invention provides a patterning method of forming a desired latent image pattern by irradiating a resist film formed on a substrate with focused light beam. The method comprising adjusting intensity of the focused light beam or ... 08/10/06 - 20060177777 - Pattern forming method and method of manufacturing semiconductor device A pattern forming method includes forming a resist film on a substrate, coating the resist film with a coating solution which forms a cover film on the resist film to form the cover film on the resist film, transferring a pattern onto the resist film by an immersion lithography method ... 08/10/06 - 20060177776 - Immersion exposure method and apparatus, and manufacturing method of a semiconductor device There is disclosed an immersion exposure method of carrying out an exposure process in a state that liquid is at least partly filled between a substrate to be exposed and a projection optical system of an exposure apparatus carrying out the exposure process, comprising carrying out a process of making ... 08/03/06 - 20060172230 - Method and composition for reducing waste in photo-imaging applications Waste reduction, including hazardous waste reduction in photoimaging processes can be accomplished by improving diffusional resolution of cationic curable compositions. The addition of fluorinated polymers including fluorinated surfactants provides improved diffusional resolution in cationic and/or radical based photoimaging formulations allowing for image accuracy improvements, and reduced product and process waste ... 07/20/06 - 20060160032 - Pattern formation method and exposure system After forming a resist film made from a chemically amplified resist material, pattern exposure is carried out by irradiating the resist film with exposing light while supplying, between a projection lens and the resist film, a solution of water (having a refractive index of 1.44) that includes an antifoaming agent ... 07/20/06 - 20060160031 - Euv lithography filter Filters for EUV lithography, methods of manufacture thereof, and methods of filtering in an EUV lithography system are disclosed. The filter comprises a nanotube material layer sandwiched by two thin material layers that are highly transmissive and provide structural support for the nanotube material layer. The filter is supported on ... 07/13/06 - 20060154183 - Exposure apparatus and method for producing device An exposure apparatus which performs an exposure while filling a space between a projection optical system and a substrate with liquid, and in which deterioration of a device caused by adherent liquid on the substrate is suppressed is provided. A device manufacturing system (SYS) includes a main body of an ... 07/13/06 - 20060154182 - Method for post lithographic critical dimension shrinking using post overcoat planarization A method for post lithographic critical dimension shrinking of a patterned semiconductor feature includes forming an overcoat layer over a patterned photoresist layer, and removing portions of the overcoat layer initially formed over top surfaces of the patterned photoresist layer. The remaining portions of the overcoat layer on sidewalls of ... 07/13/06 - 20060154181 - Method of forming resist pattern, positive resist composition, and layered product There are provided a method of forming a resist pattern that enables the resist pattern to be formed with good control of the pattern size, as well as a positive resist composition used in the method, and a layered product formed using the positive resist composition. In the above method ... 07/06/06 - 20060147846 - Method of forming photoresist pattern and semiconductor device employing the same A method of forming a photoresist pattern includes forming a material layer on a substrate, coating a photoresist on the material layer, and forming photoresist patterns by performing at least two times a process of exposing and developing the coated photoresist. A semiconductor device includes a material layer formed on ... 07/06/06 - 20060147845 - Electrically reconfigurable photolithography mask for semiconductor and micromechanical substrates A mask useful for photolithography that can be electronically reconfigured is described. In one embodiment, a photolithography system has an illumination system, a reticle scanning stage, a wafer scanning stage, and a reticle mounted to the reticle scanning stage, the reticle having an electronically reconfigurable mask. ... 06/29/06 - 20060141399 - Supercritical developing for a lithographic process A method of creating a resist image on a semiconductor substrate includes exposing a layer of photoresist on the semiconductor substrate and developing the exposed layer of photoresist using a first fluid including supercritical carbon dioxide and a base such as Tetra-Methyl Ammonium Hydroxide (TMAH). Additionally, the developed photoresist can ... 06/22/06 - 20060134563 - Method for manufacturing semiconductor device The present invention provides a method for manufacturing a semiconductor device, which includes a resist deposition step for forming a resist film on the surface of a semiconductor substrate provided with a plurality of chips disposed in matrix form, an exposure step for sequentially exposing chip patterns with respect to ... 06/22/06 - 20060134562 - Method of forming micro-pattern A method of forming a micro pattern. The method comprises the following steps: providing a substrate; forming a first micro-fluid layer of photo resistant material on the substrate; providing a first photo mask; and exposing the first micro-fluid layer to light via the first photo mask to form a micro ... 06/15/06 - 20060127821 - Method of forming a photoresist pattern A method is provided that, when forming color filters of color photoresist for a solid-state imaging device, pigments are prevented from sublimating out of the photoresist during exposing light thereto to attach to the inside of a photolithography machine. Color photoresist is first applied onto a semiconductor substrate formed with ... 06/15/06 - 20060127820 - Method for forming photoresist pattern and method for triming photoresist pattern A method for forming a photoresist pattern is described. A photoresist layer is first formed over a substrate, and then an exposure process and a development process are performed to pattern the photoresist layer so as to form a patterned photoresist layer. Next, a multiple-trimming process is performed to trim ... 05/25/06 - 20060110687 - Pattern forming method and a semiconductor device manufacturing method A pattern forming method is disclosed, which comprises forming a photo resist film on a substrate, irradiating the photo resist film with an energy ray to form a desired latent image pattern, placing the substrate on a spacer provided on a hot plate, heating the photo resist film by using ... 05/11/06 - 20060099536 - Patterned structures of high refractive index materials A process for forming a polymer template includes exposing a photoresist having polymer molecules to a light pattern and baking the photoresist to chemically react polymer molecules in portions of the photoresist that were exposed to light of the light pattern. The reacted polymer molecules have a different solubility in ... 05/11/06 - 20060099535 - Pattern forming method and pattern forming apparatus A pattern forming apparatus (1) comprises an ejection part (41) for ejecting a patterning material to a main surface of a substrate (9) from a plurality of outlets. The ejection part (41) moves relative to the substrate (9) in a direction along the main surface of the substrate (9) by ... 05/11/06 - 20060099534 - Method for fabricating optical devices in photonic crystal structures A method for manufacturing optical components in a three-dimensional photonic crystal lattice. A first resist (9) is coated on a substrate (10) and exposed to an e-beam (11), to produce an imaged area (12). Another resist coating is applied to thicken the resist (13) and an interference exposure (15) is ... 04/06/06 - 20060073425 - Pattern designing method, photomask manufacturing method, resist pattern forming method and semiconductor device manufacturing method There is disclosed a method of designing a pattern comprising: preparing a first design pattern containing a first hole pattern, obtaining a distance between the first hole pattern and a pattern adjacent to the first hole pattern, obtaining an enlarged amount of the first hole pattern based on the distance ... 04/06/06 - 20060073424 - Optical coatings Systems and techniques involving optical coatings for semiconductor devices. An implementation includes a substantially isotropic, heterogeneous anti-reflective coating having a substantially equal thickness normal to any portion of a substrate independent of the orientation of the portion. ... 03/30/06 - 20060068334 - Phase-shifting optical maskless lithography enabling asics at the 65 and 45 nm nodes Phase stepped and paired piston SLM configurations are described, with attention to rasterization and image stability. In contrast to attenuated phase-shift reticle performance of simple titling mirror SLMs, these configuration have phase shifting capabilities emulating a hard phase shift reticle and beyond. To use a straight-forward rasterization architecture where individual ... 03/23/06 - 20060063112 - Pattern reversal employing thick residual layers The present invention features a method of patterning a substrate that includes forming, on the substrate, a first layer having a first pattern and selectively shifting in tone, as well as along a first direction, a subsequent pattern formed into the same layer that corresponds to the first pattern. To ... 03/23/06 - 20060063111 - Method of forming a structured surface using ablatable radiation sensitive material A structured surface is formed with the method of the present invention. The method of making this structured surface includes the steps of applying an ablatable radiation sensitive coating on the major surface of the substrate, and exposing the ablatable radiation sensitive coating to radiation such that exposed portions of ... 03/16/06 - 20060057506 - Controlling resist profiles through substrate modification Photoresists may be formed over a structure that has been modified so as to poison a lower layer of the photoresist. Then, when the photoresist is patterned, it is only patterned down to the poisoned layer. The poisoned layer may be removed subsequently. However, because of the use of the ... 02/23/06 - 20060040215 - Pattern formation method After forming a resist film made from a chemically amplified resist material, pattern exposure is carried out by selectively irradiating the resist film with exposing light while supplying, onto the resist film, water that includes triphenylsulfonium nonaflate, that is, an acid generator, and is circulated and temporarily stored in a ... 02/02/06 - 20060024621 - Method of producing a structure on the surface of a substrate The present invention relates to a method for producing a structure serving as an etching mask on the surface of a substrate. In this case, a first method involves forming a first partial structure on the surface of the substrate, which has structure elements that are arranged regularly and are ... 01/19/06 - 20060014108 - Resist pattern forming method based on near-field exposure, and substrate processing method and device manufacturing method using the resist pattern forming method Disclosed is a resist pattern forming method wherein an exposure mask with a light blocking film having a fine opening not greater than a wavelength of exposure light is placed close to a resist layer provided on a substrate and wherein exposure light is projected to the resist layer through ... 01/12/06 - 20060008747 - Device manufacturing method A device manufacturing method is disclosed, which includes forming a resist film on a substrate, preparing an exposure tool which comprises a projection optical system, preparing a photo mask on which a mask pattern is formed, mounting the substrate and the photo mask on the exposure tool, the substrate having ... 01/12/06 - 20060008746 - Method for manufacturing semiconductor device The present application provides a method for manufacturing a semiconductor device, the method including forming a resist film on a substrate, forming a protective film on the resist film, exposing the resist film with a first liquid interposed between the protective film and a lens for exposure, removing the protective ... 01/12/06 - 20060008745 - Translucent electromagnetic shield film, producing method therefor and emulsifier A producing method for a translucent electromagnetic shield film comprising exposing a photosensitive material having an emulsion layer containing a silver salt and a dye on a substrate, then executing a development process to form a metallic silver portion and a light transmitting portion respectively in an exposed area and ... 01/05/06 - 20060003267 - Nano-structure and method of fabricating nano-structures In one embodiment, a method for fabricating a nano-structure includes forming a feature on a substrate, depositing multiple layers of material over the substrate and feature to form a multi-layer stack, depositing a film over the multi-layer stack, removing a portion of the film and the multi-layer stack to expose ... 12/22/05 - 20050282090 - Composition for forming antireflection coating A composition for forming an antireflection coating, characterized in that it comprises an organic solvent and, dissolved therein, (A) a ladder silicone copolymer containing (a1) 10 to 90 mole % of a (hydroxyphenylalkyl)silses-quioxane unit, (a2) 0 to 50 mole % of a (alkoxyphenylalkyl)silsesquioxane unit and (a3) 10 to 90 mole ... 12/15/05 - 20050277068 - Semiconductor manufacturing apparatus and pattern formation method In a pattern formation method employing immersion lithography, after a resist film is formed on a wafer, pattern exposure is performed by selectively irradiating the resist film with exposing light with a liquid including an unsaturated aliphatic acid, such as sunflower oil or olive oil including oleic acid, provided on ... 12/01/05 - 20050266354 - Top coat material and use thereof in lithography processes wherein: M is a polymerizable backbone moiety; Z is a linking moiety selected from the group consisting of —C(O)O—, —C(O)—, —OC(O)—, and —O—C(O)—C(O)—O—; R1 is selected from the group consisting of an alkylene, an arylene, a semi- or perfluorinated alkylene, and a semi- or perfluorinated arylene; p and q are ... 11/24/05 - 20050260528 - Liquid composition for immersion lithography and lithography method using the same wherein R is a linear or branched, substituted C1-C40 alkyl, and n is an integer ranging from 10 to 10,000. The surface tension of the liquid composition is reduced by the nonionic surfactant, thereby solving the problem that the liquid composition is not completely filled or is partially concentrated on ... 11/17/05 - 20050255413 - Semiconductor manufacturing apparatus and pattern formation method A semiconductor manufacturing apparatus includes a liquid supplying section for supplying a liquid to be provided on a stage where a substrate having a resist film is placed; an exposing section for irradiating the resist film with exposing light through a mask with the liquid provided on the resist film ... 11/17/05 - 20050255412 - Method and structure for fabricating mechanical mirror structures using backside alignment techniques A method for fabricating mechanical structures from bonding substrates. The method includes providing a bonded substrate structure, which includes a first substrate having a first thickness of silicon material and a first face. The bonded substrate also includes a second substrate having a second thickness and a second face. At ... 11/10/05 - 20050250052 - Maskless lithography using uv absorbing nano particle Systems and methods are disclosed for a maskless lithography process by over coating a photo resist layer with water soluble thermoplastics; and imaging ultraviolet (UV) absorbing nano particles onto the photo resist layer. ... 11/10/05 - 20050250051 - Organometallic composition for forming a metal alloy pattern and a method of forming such a pattern using the composition An organometallic composition containing an organometallic compound (I) containing Ag, an organometallic compound (II) containing Au, Pd, or Ru, and an organometallic compound (III) containing Ti, Ta, Cr, Mo, Ru, Ni, Pd, Cu, Au, or Al, wherein the metal components of organometallic compounds (II) and (III), respectively, are present in ... 11/03/05 - 20050244757 - Dynamic mask module A dynamic mask module is disclosed, which comprises a microcomputer system, a mask pattern generator and a light source. The mask pattern generator is disposed over a substrate and electrically connected to the microcomputer system. The microcomputer system transmits an image signal to the mask pattern generator. The light source ... 10/20/05 - 20050233262 - Lithography mask and optical lithography method using surface plasmon A periodic structure for producing surface plasmon resonance as a result of coupling surface plasmon with light is formed on a side to which the light is to be input, while a fine structure having a periodically or aperiodically arbitrary shape is formed opposite to the periodic structure in order ... 10/20/05 - 20050233261 - Method and apparatus for monitoring saturation levels of solvents used during rapid prototyping processes A monitoring device and method is disclosed for monitoring the saturation level of resin in solvent baths, such as those used to remove resin from objects form by stereolithography. The monitoring device operates by monitoring an electrical characteristic, such as impedance, of the solvent bath as the resin-to-solvent ratio of ... 10/06/05 - 20050221234 - Resist pattern forming method, semiconductor apparatus using said method, and exposure apparatus thereof In immersion exposure, a resist pattern forming method suppressing resist pattern defects comprises mounting a substrate formed a resist film thereon and a reticle formed a pattern thereon onto an exposure apparatus, supplying a first chemical solution onto the resist film to selectively form a first liquid film in a ... 09/29/05 - 20050214693 - Pattern forming method, graft pattern material, conductive pattern forming method and conductive pattern material The present invention provides a pattern forming method characterized in that energy is applied to a surface of a base material including a polyimide having a polymerization initiating moiety in a skeleton thereof to thereby generate an active site on the surface of the base material, and a polymer directly ... 09/29/05 - 20050214692 - Method for producing microhole structures The invention relates to a novel method for producing microhole structures. According to said method, the material used to produce said microhole structures is applied to a substrate surface provided with a relief structure, by means of an angular coating process. In order to achieve the desired pattern of holes, ... 09/22/05 - 20050208433 - Pattern forming method, circuit substrate and electronic apparatus A pattern forming method includes the step of forming a partition wall, at least a portion of a boundary betweeen a pattern formation area and other areas, by coating droplets usng a droplet discharge method. ... 09/15/05 - 20050202351 - Process of imaging a deep ultraviolet photoresist with a top coating and materials thereof The present invention relates to a process for imaging deep ultraviolet (uv) photoresists with a topcoat using deep uv immersion lithography. The invention further relates to a topcoat composition comprising a polymer with at least one ionizable group having a pKa ranging from about −9 to about 11. ... 09/08/05 - 20050196710 - Method for forming pattern, thin film transistor, display device and method for manufacturing the same, and television apparatus It is an object of the present invention to provide a display device in which a material usability is enhanced and which can be manufactured by simplifying the manufacturing process, and a manufacturing technique thereof. It is also an object of the invention to provide a technique in which a ... 08/25/05 - 20050186516 - Barrier film material and pattern formation method using the same A resist film made of a chemically amplified resist is formed on a substrate. Subsequently, a barrier film for preventing a component of the resist film from eluting into an immersion liquid or preventing the immersion liquid from permeating into the resist film is formed on the resist film. Thereafter, ... 08/25/05 - 20050186515 - Structured materials and methods In general, in one aspect, the invention features methods for forming structured materials that include providing a layer including a first material; patterning the layer while a surface of the layer is exposed without the need for a processing layer, such as a resist; permeating the patterned layer with a ... 08/25/05 - 20050186514 - Use of perfluoro-n-alkanes in vacuum ultraviolet applications This invention concerns liquid perfluoro-n-alkanes for use in applications demanding high transparency at UV wavelengths ranging from about 150 to 165 nm, especially 157 nm. Uses include optical couplants, optical cements, optical elements, optical inspection media for semiconductor wafers and devices, and most especially immersion photolithography at 157 nm exposure ... 08/18/05 - 20050181312 - Image enhancement for multiple exposure beams An aspect of the present invention includes a method for patterning a workpiece covered at least partly with a layer sensitive to electromagnetic radiation by using a plurality of exposure beams having a predetermined separation in at least a first direction for exposing a pattern onto said workpiece, where said ... 08/11/05 - 20050175940 - Device manufacturing method and a substrate A method of reducing the effect of bubbles on the imaging quality of an immersion lithography apparatus, in which a top coating is applied to a substrate to keep bubbles away from a radiation sensitive layer of the substrate. ... 08/11/05 - 20050175939 - Percolated metal structure with electrochromic and photochromic properties Bidimensional or three-dimensional, single-layer or multilayer nanostructure, whose electric conductivity B in the total structure has a highly non-linear behavior due to local tunnel effect between adjacent clusters, and it can be varied at will by varying the voltage applied to the electrodes. ... 07/28/05 - 20050164133 - Inverse resist coating process The invention provides systems and processes that form the inverse (photographic negative) of a patterned first coating. The patterned first coating is usually provided by a resist. After the first coating is patterned, a coating of a second material is provided thereover. The uppermost layer of the second coating is ... 07/28/05 - 20050164132 - Nanostructures and methods of making the same Nanostructures and methods of making the same are described. In one aspect, a film including a vector polymer comprising a payload moiety is formed on a substrate. The film is patterned. Organic components of the patterned film are removed to form a payload-comprising nanoparticle. ... 07/21/05 - 20050158668 - Method of forming a mask pattern on a substrate (b) selectively ablating a portion (3B) of the material using a laser to refine the coarse pattern to form the desired mask pattern. ... 07/21/05 - 20050158667 - Solvent free photoresist strip and residue removal processing for post etching of low-k films A photoresist or a residue of the photoresist may by removed by the hydrogen and water plasma mixture. The process may be performed at a temperature range between about 150° C. and about 450° C., preferably about 250° C., and a power range between about 500 W and about 3000 ... 07/14/05 - 20050153248 - Method for fabricating a molding core A method for fabricating a molding core includes: (a) providing a metal substrate; (b) coating a photo-resist layer on the metal substrate; and (c) exposing and developing the photo-resist layer using a photo-mask having a predetermined pattern to form a photo-resist pattern. The substrate and the photo-resist pattern constitute the ... 07/07/05 - 20050147927 - Patterning semiconductor layers using phase shifting and assist features A photomask and method of patterning a photosensitive layer using a photomask, the photomask including a substrate and a film coupled to substrate. The film is etched with a phase shifted assist feature, a low aspect ratio assist feature or phase shifted low aspect primary features. ... 07/07/05 - 20050147926 - Method for processing photoresist Disclosed is a method for processing photoresist. The method of the present invention performs Ar plasma process to the photoresist after or before the photoreisist is formed into a pattern to make the photoresist dense. ... 06/23/05 - 20050136361 - Exposure system and pattern formation method using the same An exposure system includes a liquid supply section for supplying an immersion liquid onto a resist film formed on a substrate; and an exposure section for irradiating the resist film with exposing light through a mask with the immersion liquid provided on the resist film. The liquid supply section includes ... 06/16/05 - 20050130077 - Method for positioning and transferring at least two different patterns from a supply strip A method wherein a supply strip (bm) is entrained at a constant speed, which speed is the same as that of the substrate in strip form (c), during transfer between strips of each pattern and according to a speed profile which is determined between two transfers of the patterns. There ... 06/16/05 - 20050130076 - Method for producing a hard mask in a capacitor device and a hard mask for use in a capacitor device A method for producing a hard mask and a hard mask for use in a capacitor device comprises the steps of applying a photosensitive sol-gel layer to the capacitor device, applying a pattern to the sol-gel layer to form a patterned layer and applying a thermal decomposition treatment to the ... 06/16/05 - 20050130075 - Method for making fluid emitter orifice A method of forming a depression in a surface of a layer of photo-resist comprises exposing a first portion of a layer of photo-resist with a first dose of radiant energy. A second portion of the layer is exposed with a second dose of radiant energy. The second dose is ... 06/16/05 - 20050130074 - Method for the manufacture of micro structures Method for the Manufacture of Micro Structures A method for the manufacture of micro structures in substrates is provided. The method uses a combination of photolithographic mask technology and micro contact printing. ... 06/09/05 - 20050123863 - Immersion lithography process and mask layer structure applied in the same An immersion lithography process is described as follows. A photoresist layer and a protective layer are sequentially formed on a material layer, and then an immersion exposure step is performed to define an exposed portion and an unexposed portion in the photoresist layer. A solubilization step is conducted to solubilize ... ### FreshPatents.com Support |