REGISTER now for FREE 
|
FREE patent keyword monitoring and additional FREE benefits. REGISTER now for FREE
|
|
|
Radiation Imagery Chemistry: Process, Composition, Or Product Thereof > Imaging Affecting Physical Property Of Radiation Sensitive Material, Or Producing Nonplanar Or Printing Surface - Process, Composition, Or Product > Making Electrical Device > With Formation Of Resist Image, And Etching Of Substrate Or Material Deposition > Material Deposition Only Material Deposition OnlyMaterial Deposition Only patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.05/10/07 - 20070105054 - Pattern forming method and manufacturing method of semiconductor device According to an aspect of the invention, there is provided a pattern forming method including forming a lower layer organic film on a substrate, forming an upper layer resist film containing an inorganic element on the lower layer organic film, exposing a pattern on the upper layer resist film and ... 12/21/06 - 20060286487 - Process for coating thick resist over polymer features An embodiment of a process is disclosed comprising depositing a sealing layer on a first photoresist layer formed on a substrate, the first photoresist layer having a form patterned and etched therein, depositing a second photoresist layer on the sealing layer, and curing the second photoresist layer by changing its ... 11/16/06 - 20060257794 - Method for transferring structures from a photomask into a photoresist layer A method for transferring structures from a photomask into a photoresist layer is disclosed. In one embodiment, the method involves the patterning of a photoresist layer provided on a layer stack having a topology. In order to suppress standing waves in the photoresist layer and the resist swing effect, which ... 11/16/06 - 20060257793 - Printed wiring board manufacturing method This printed wiring board manufacturing method comprises the steps of providing a large number of through holes (for a through-hole) in a substrate made of an insulating material of which both sides are coated with a copper foil; making the inside of the through holes electrically conductive, coating the substrate ... 10/26/06 - 20060240364 - Apparatus and method for making circuitized substrates having photo-imageable dielectric layers in a continuous manner Apparatus and method for making circuitized substrates using a continuous roll format in which a layer of conductor is fed into the apparatus, layers of photo-imageable dielectric are applied to opposite sides of the conductor layer, thru-holes are formed through the composite, and then metal layers are added over the ... 09/28/06 - 20060216653 - Reduced pitch multiple exposure process A lithographic method to enhance image resolution in a lithographic cluster using multiple projections and a lithographic cluster used to project multiple patterns to form images that are combined to form an image having enhanced resolution. ... 05/25/06 - 20060110686 - Method for forming metal pattern by using metal nanocrystals Disclosed herein is a method for forming a metal pattern by using metal nanocrystals. The method comprises the steps of: (i) coating a photosensitive compound having a substituent, which is converted into a free carboxyl group by light exposure, on a substrate to form a photosensitive film; (ii) selectively exposing ... 04/13/06 - 20060078829 - Method of patterning a thick-film paste material layer, method of manufacturing cold- cathode field electron emission device, and method of manufacturing a cold-cathode field electrin emission display In a method of manufacturing a cold cathode field emission device, a cathode electrode 11, an insulating layer 12 and a gate electrode 13 are formed; an opening portion 14 is formed through the gate electrode 13 and the insulating layer 12 to expose the cathode electrode 11; a resist-material ... 03/02/06 - 20060046202 - Integral plated resistor and method for the manufacture of printed circuit boards comprising the same An integral plated resistor having an improved range of resistance is produced by uniformly dispersing an effective amount of various particles in an electroless nickel phosphorus plating composition so that the particles are codeposited with the electroless nickel phosphorus plating composition. Preferred particles include, polytetrafluoroethylene, silicon carbide, tungsten carbide, and ... 10/27/05 - 20050239001 - Elimination of write head plating defects using high activation chemically amplified resist Methods of forming a component of a thin film magnetic head and improving the plating of a component of a thin film magnetic head are provided. The methods include the use of a high activation energy chemically amplified photoresist (CARS) that is contacted with a low pH high saturation magnetic ... 10/20/05 - 20050233260 - Processing method of thin-film and manufacturing method of thin-film magnetic head A processing method of a thin-film includes a step of forming a predetermined pattern film or predetermined elements on a substrate or on a film formed in an upstream process, a step of forming a transparent film over the formed predetermined pattern film or predetermined elements, a step of forming ... 10/13/05 - 20050227184 - Topographically defined thin film cpp read head fabrication A method of constructing a small trackwidth magnetorsesistive sensor by defining a trench between first and second hard bias layers and depositing the sensor into the trench. ... ### FreshPatents.com Support |