REGISTER now for FREE 
|
FREE patent keyword monitoring and additional FREE benefits. REGISTER now for FREE
|
 
|
|
Radiation Imagery Chemistry: Process, Composition, Or Product Thereof > Imaging Affecting Physical Property Of Radiation Sensitive Material, Or Producing Nonplanar Or Printing Surface - Process, Composition, Or Product > Making Electrical Device > With Formation Of Resist Image, And Etching Of Substrate Or Material Deposition With Formation Of Resist Image, And Etching Of Substrate Or Material DepositionWith Formation Of Resist Image, And Etching Of Substrate Or Material Deposition patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.05/31/07 - 20070122752 - Semiconductor device manufacturing method and substrate processing system A semiconductor device manufacturing method includes: forming an etching mask having a predetermined circuit pattern on a surface of an etching target film disposed on a semiconductor substrate; etching the etching target film through the etching mask to form a groove or hole in the etching target film; removing the ... 05/10/07 - 20070105053 - Method of manufacturing semiconductor device Aiming at improving productivity of the semiconductor devices and at improving the product yield, a method of the present invention fabricates a semiconductor device by using, as a photomask, a first photomask 106 having a first rectangular pattern 104a obtained by dividing a mask pattern, and a second photomask 108 ... 05/10/07 - 20070105052 - Method of making thin film transistor liquid crystal display A thin film transistor liquid array substrate includes forming a plurality of amorphous silicon thin film transistors and storage capacities on a transparent substrate, wherein the amorphous silicon thin film transistors and the storage capacities are arranged in an array pattern. The storage capacitor has a top electrode and a ... 05/03/07 - 20070099127 - Compact integrated capacitor An interdigitized, single layer capacitor with a narrow interplate channel and a method for forming the same is disclosed. The narrow interplate channel is formed using a method which provides for a narrower interplate channel than can be produced using standard photolithographic techniques. ... 05/03/07 - 20070099126 - Methods of fabricating integrated circuit transistors by simultaneously removing a photoresist layer and a carbon-containing layer on different active areas Integrated circuit transistors may be fabricated by simultaneously removing a photoresist layer on a first active area of an integrated circuit substrate and a carbon-containing layer on a second active area of the integrated circuit substrate, to expose a nitride stress-generating layer on the second active area. A single mask ... 04/12/07 - 20070082298 - Method of manufacturing semiconductor device from semiconductor wafer In a method of manufacturing a semiconductor device, a semiconductor wafer is provided. The wafer has semiconductor chip regions, a scribing line region and a predetermined region. A passivation layer is formed on the wafer. A photoresist film is formed on the passivation layer. A first pattern in a reticle ... 03/29/07 - 20070072131 - Method of manufacturing semiconductor device There are provided a semiconductor device manufacturing method including: forming a film to be processed above a substrate; forming a resist layer above the film to be processed; transferring a transfer pattern to the resist layer using a reticle including the transfer pattern having a space having a width that ... 03/29/07 - 20070072130 - Process for fabricating micro-display A process for fabricating a micro-display is provided. First, a wafer having a driving circuit thereon is provided. Then, a metallic reflective layer is formed on the wafer. Thereafter, an anti-reflection layer and a patterned photoresist layer are sequentially formed on the metallic reflective layer. Using the patterned photoresist layer ... 03/01/07 - 20070048674 - Methods for forming arrays of small, closely spaced features Methods of forming arrays of small, densely spaced holes or pillars for use in integrated circuits are disclosed. Various pattern transfer and etching steps can be used, in combination with pitch-reduction techniques, to create densely-packed features. Conventional photolithography steps can be used in combination with pitch-reduction techniques to form superimposed ... 02/15/07 - 20070037101 - Manufacture method for micro structure A micro structure manufacture method includes the steps of: (a) preparing an etching object having an etching target film, provided with a lower hard mask layer and an upper hard mask layer stacked on the etching target film; (b) forming a resist pattern above the etching object; (c) etching the ... 02/15/07 - 20070037100 - High aspect ratio mask open without hardmask A method of etching a stack of dielectric mask layers by reactive ion etch steps in order to open an aperture for etching into a semiconductor substrate improves the selectivity of the reactive ion etch relative to photoresist to the extent that an etch of an equivalent of 2000 nm ... 02/08/07 - 20070031763 - Method of fabricating semiconductor device A method of fabricating a semiconductor device is provided. The method includes forming at least one etch target film on a substrate, forming a first reflowable etch mask on the at least one etch target film, patterning the etch target film using the first reflowable etch mask. The method further ... 02/08/07 - 20070031762 - Methods of patterning substrates; and templates comprising one or both of cds and cdse The invention includes a template comprising one or both of CdS and CdSe adhered to a base in a desired pattern. The base can be any transparent or translucent material, and the desired pattern can include two or more separated segments. The template can be utilized for patterning a plurality ... 01/25/07 - 20070020565 - Methods of fabricating a semiconductor device Methods of fabricating a semiconductor device are provided. Methods of forming a finer pattern of a semiconductor device using a buffer layer for retarding, or preventing, bridge formation between patterns in the formation of a finer pattern below resolution limits of a photolithography process by double patterning are also provided. ... 01/18/07 - 20070015089 - Method of making a semiconductor device using a dual-tone phase shift mask A method for making a semiconductor device is provided which comprises (a) providing a source of actinic radiation (601), (b) providing a reticle comprising (i) a substrate having a plurality of structures defined therein, said substrate being essentially transparent to the actinic radiation, and (ii) a layer of attenuating material ... 01/11/07 - 20070009840 - Method of fabricating a semiconductor device A method of fabricating a semiconductor device comprising a method of forming an etching mask used for etching a semiconductor base material is disclosed. The method of fabricating a semiconductor device comprises forming hard mask patterns on a semiconductor base material; forming material layers covering the lateral and top surfaces ... 01/11/07 - 20070009839 - Pattern forming method, film forming apparatus and pattern forming apparatus A pattern forming method for forming a predetermined pattern on a substrate includes the steps of supplying a developer to a photosensitive film coating the substrate and having a latent image of the pattern formed thereon, to form a pattern of the photosensitive film, replacing the developer with a rinsing ... 01/11/07 - 20070009838 - Method of manufacturing a pattern structure and method of forming a trench using the same A method of manufacturing a pattern structure and a method of forming a trench using the same are provided. A mask pattern structure having mask patterns spaced apart from one another may be formed on a layer. The mask pattern structure may be divided into a first region having a ... 01/04/07 - 20070003881 - Method of manufacturing semiconductor device A method of manufacturing a semiconductor device includes forming a plurality of dummy line patterns arranged at a first pitch on an underlying region, forming first mask patterns having predetermined mask portions formed on long sides of the dummy line patterns, each of the first mask patterns having a closed-loop ... 12/28/06 - 20060292497 - Method of forming minute pattern of semiconductor device An embodiment of the invention provides a method of forming minute patterns of a semiconductor device. In one embodiment, after a first oxide film, a lower anti-reflection film, and a first photoresist film patterns are sequentially formed on a semiconductor substrate, the lower anti-reflection film and the first oxide film ... 12/21/06 - 20060286486 - Method of fabricating a semiconductor device A method of fabricating a semiconductor device. A first organic layer, a silicon-containing sacrificial layer, and a second organic layer are sequentially formed on a substrate. A photolithography process is performed for forming a predetermined pattern in the second organic layer. Thereafter, the second organic layer is utilized as an ... 12/21/06 - 20060286485 - Substrate structure and the fabrication method thereof The present invention provides a substrate structure and the fabrication method thereof. First, a laminate is provided, wherein there are arranged a conductive layer, or an adhesive layer and a conductive layer on the surface of the laminate from bottom to top. A patterned through hole is formed to penetrate ... 12/14/06 - 20060281030 - Method for forming an anti-etching shielding layer of resist patterns in semiconductor fabrication A method is disclosed for forming a photoresist pattern with enhanced etch resistance on a semiconductor substrate. A photoresist pattern is first formed on the substrate. A silicon-containing polymer layer is deposited over the photoresist pattern on the substrate. A thermal treatment is performed to form a cross-linked anti-etch shielding ... 12/07/06 - 20060275710 - Semiconductor device and manufacturing method thereof To provide a semiconductor device having a circuit with high operating performance and high reliability, and improve the reliability of the semiconductor device, thereby improving the reliability of an electronic device having the same. The aforementioned object is achieved by combining a step of crystallizing a semiconductor layer by irradiation ... 11/16/06 - 20060257792 - A method of structuring of a substrate The invention relates to a method of structuring of a substrate by providing a polymerization starter layer on the substrate, applying a radiation field on the polymerization starter layer for selectively reducing a density of polymerization starters of the polymerization starter layer, applying monomers and then polymerizing of the monomers, ... 11/16/06 - 20060257791 - Method for forming conductive line of semiconductor device A method for forming a conductive line of a semiconductor device is disclosed. The method includes forming a photoresist film pattern defining a conductive line region on a stacked structure of a conductive layer and a hard mask layer disposed on a semiconductor substrate, etching the hard mask layer using ... 10/26/06 - 20060240362 - Method to align mask patterns Alignment tolerances between narrow mask lines, for forming interconnects in the array region of an integrated circuit, and wider mask lines, for forming interconnects in the periphery of the integrated circuit, are increased. The narrow mask lines are formed by pitch multiplication and the wider mask lines are formed by ... 10/26/06 - 20060240361 - Method of forming small pitch pattern using double spacers A method of forming a small pitch pattern using double spacers is provided. A material layer and first hard masks are used and characterized by a line pattern having a smaller line width than a separation distance between adjacent mask elements. A first spacer layer covering sidewall portions of the ... 10/26/06 - 20060240360 - Method of manufacturing printed circuit board using imprinting process The present invention relates to a method of manufacturing a printed circuit board using an imprinting process, in which a pattern having a large area can be uniformly formed using a plurality of molds, and the plurality of molds is sequentially removed, thereby solving problems occurring in release of the ... 10/26/06 - 20060240359 - Patterning process and contact structure A patterning process is described. A substrate formed with a material layer and a photoresist layer thereon is provided, and then a photomask is provided having a main opaque pattern and a partial-exposure pattern at the periphery of the main opaque pattern thereon. The photoresist layer is exposed through the ... 10/19/06 - 20060234166 - Method of forming pattern using fine pitch hard mask A method of forming a fine pattern of a semiconductor device using a fine pitch hard mask is provided. A first hard mask pattern including first line patterns formed on an etch target layer of a substrate with a first pitch is formed. A first layer including a top surface ... 10/19/06 - 20060234165 - Method of manufacturing a semiconductor device A method of manufacturing a semiconductor device, comprises forming a first mask pattern on an under-layer region, forming a plurality of dummy-line patterns on the under-layer region, the dummy-line patterns being arranged at a first pitch, forming second mask patterns having mask parts provided on long sides of the dummy-line ... 10/12/06 - 20060228652 - Method of fabricating flash memory device A method of fabricating a memory device includes forming first and second gate stacks, each gate stack having a floating gate and a control gate. A contact plug comprising metal is formed to contact a doped region provided between the first and second gate stacks. A first insulation layer is ... 09/14/06 - 20060204899 - Fine pattern forming method A fine pattern forming method includes the first step of depositing a plasma reaction products on a sidewall of a patterned mask layer to increase a pattern width thereof, the second step of etching a first etching target layer by using as a mask the mask layer, the pattern width ... 09/14/06 - 20060204898 - Process for producing sublithographic structures A layer structure and process for providing sublithographic structures are provided. A first auxiliary layer is formed over a surface of a carrier layer. A lithographically patterned second auxiliary layer structure is formed on a surface of the first auxiliary layer. The first auxiliary layer is anisotropically etched using the ... 09/07/06 - 20060199109 - Phase shift photomask and method for improving printability of a structure on a wafer A phase shift photomask and method for improving printability of a structure on a wafer are disclosed. The method includes providing a photomask including a zero degree PSW formed on a top surface of a substrate and a 180 degree PSW formed in a first region of the substrate. An ... 08/24/06 - 20060188824 - Method for improving design window A method of forming photo masks having rectangular patterns and a method for forming a semiconductor structure using the photo masks is provided. The method for forming the photo masks includes determining a minimum spacing and identifying vertical conductive feature patterns having a spacing less than the minimum spacing value. ... 08/24/06 - 20060188823 - Method for forming an electronic device Provided is a low cost system and method for forming electronic devices, especially large surface area devices. The process of imprint lithography is combined with alternate manufacturing techniques to fabricate the devices. Initially, a template imprints a three-dimensional pattern into a resist layer deposited on a flexible substrate. The resist ... 08/10/06 - 20060177775 - Method for manufacturing plate having electrode with gaps A method for manufacturing a plate (21) having an electrode (214) with a plurality of gaps (217) is provided. The method includes the steps of: providing a substrate (200) comprising a glass layer (210); coating a plurality of photo-resist protrusions (215) on the substrate; coating a transparent conductive layer (218) ... 07/27/06 - 20060166143 - Resist collapse prevention using immersed hardening A method, tool, and machine for hardening a photoresist image while the photoresist image is immersed in a liquid. ... 06/22/06 - 20060134560 - Method for fabricating semiconductor device A method for fabricating a semiconductor device is provided. The method includes: preparing a substrate defined as active regions and inactive regions and provided with a plurality of conductive patterns; forming a buffer layer over the plurality of conductive patterns; forming an organic material having fluidity better than that of ... 05/25/06 - 20060110685 - Apparatus and method to improve resist line roughness in semiconductor wafer processing A process for prohibiting amino group transport from the top surface of a layered semiconductor wafer to a photoresist layer introduces a thin film oxynitride over the silicon nitride layer using a high temperature step of nitrous oxide (N2O) plus oxygen (O2) at approximately 300° C. for about 50 to ... 05/18/06 - 20060105274 - Method for forming a lithography mask A method for forming a lithography mask on a surface region of a wafer is presented. In one embodiment of the method according to the invention time periods from the end of an exposure operation until the beginning of a thermal aftertreatment for the sections of the semiconductor material region ... 05/18/06 - 20060105273 - Method for producing electronic device There is a problem in that when the demand accuracy with respect to a semiconductor pattern dimension comes close to a resist molecule size with miniaturization, the device performance is deteriorated due to edge roughness of a resist pattern to exert a bad influence on the system performance. The present ... 05/04/06 - 20060093965 - Variable mask field exposure A method of fabricating a plurality of integrated circuits on a substrate according to a first integrated circuit design. Each of the integrated circuits is formed with a plurality of layer patterns. At least one first layer pattern of the layer patterns is common with a second integrated circuit design, ... 04/20/06 - 20060084011 - Printed wiring board manufacturing method According to this manufacturing method, a copper foil is attached to both sides of an insulating material to form a substrate. First, a large number of through-holes is made in the substrate and the inside of the through-holes is made electrically conductive. Then, after one side of the substrate is ... 04/13/06 - 20060078828 - System and method for exposure of partial edge die According to one embodiment of the present invention, a method of forming a semiconductor device includes forming a photoresist layer on a surface of a wafer. The wafer includes an array of die that includes a plurality of complete die and at least one partial edge die. The wafer has ... 03/16/06 - 20060057502 - Method of forming a conductive wiring pattern by laser irradiation and a conductive wiring pattern Fine wirings are made by a method having the steps of painting a board with metal dispersion colloid including metal nanoparticles of 0.5 nm-200 nm diameters, drying the metal dispersion colloid into a metal-suspension film, irradiating the metal-suspension film with a laser beam of 300 nm-550 nm wavelengths, depicting arbitrary ... 03/02/06 - 20060046200 - Mask material conversion The dimensions of mask patterns, such as pitch-multiplied spacers, are controlled by controlled growth of features in the patterns after they are formed. To form a pattern of pitch-multiplied spacers, a pattern of mandrels is first formed overlying a semiconductor substrate. Spacers are then formed on sidewalls of the mandrels ... 01/26/06 - 20060019202 - Method and system for contiguous proximity correction for semiconductor masks According to one embodiment, a method for patterning a set of features for a semiconductor device includes providing a mask including a substrate and at least one pair of first and second main features disposed on a substrate. The method also includes positioning the mask over a layer of light-sensitive ... 11/10/05 - 20050250050 - Method of forming a top gate thin film transistor A method of forming a top gate thin film transistor (TFT). By performing photolithography using a first reticle, a photoresist layer having a thick photoresist layer portion and a thin photoresist layer portion is formed on a silicon layer in an active area. Thus, a channel layer and source/drain regions ... 10/20/05 - 20050233259 - Resist material and pattern formation method using the same After forming a resist film including titanium oxide on a substrate, pattern exposure is performed by selectively irradiating the resist film with light of a wavelength of 400 nm or less or an electron beam. After the pattern exposure, the resist film is developed, so as to form a resist ... 10/06/05 - 20050221233 - System and method for fabricating contact holes A method of forming a plurality of contact holes of varying pitch and density in a contact layer of an integrated circuit device is provided. The plurality of contact holes can include a plurality of regularly spaced contact holes having a first pitch along a first direction and a plurality ... 09/29/05 - 20050214690 - Method for creating a pattern in a material and semiconductor structure processed therewith A method of manufacturing a semiconductor device with precision patterning is disclosed. A structure of a small dimension is created in a material, such as a semiconductor material, using a first and a second pattern, the patterns being identical but displaced over a distance with respect to each other. Two ... 09/22/05 - 20050208430 - Method of producing self-aligned mask in conjuction with blocking mask, articles produced by same and composition for same A method of forming a self aligned pattern on an existing pattern on a substrate including applying a coating of a solution containing a masking material in a carrier, the masking material being either photo or thermally sensitive; performing a blanket exposure of the substrate; and allowing at least a ... 09/08/05 - 20050196706 - Semiconductor device manufacturing method and semiconductor device manufacturing system In a semiconductor device manufacturing method, the step of calculating an exposure time of a photoresist includes (a) a step of deciding whether or not a variation of a line width of a device pattern 104 or a resist pattern 102a in a reference chip in a plurality of semiconductor ... 07/21/05 - 20050158665 - Substrate having film pattern and manufacturing method of the same, manufacturing method of semiconductor device, liquid crystal television, and el television The invention provides a manufacturing method of a substrate having a film pattern including an insulating film, a semiconductor film, a conductive film and the like by simple steps, and also a manufacturing method of a semiconductor device which is low in cost with high throughput and yield. According to ... 07/21/05 - 20050158664 - Method of integrating post-etching cleaning process with deposition for semiconductor device A method of integrating a post-etching cleaning process with deposition for a semiconductor device. A substrate having a damascene structure formed by etching a dielectric layer formed thereon using an overlying photoresist mask as an etching mask is provided. A cleaning process is performed by a supercritical fluid to remove ... 07/14/05 - 20050153247 - Method of making multilevel mems structures Multi-levels are etched into silicon. The levels are etched through a combination of crosslinking photoresist, multiple photoresist patterning and development, wet etching and/or dry-etching. RIE, DRIE, and other etch techniques can be used during different steps. The multilevel structure may thereby be produced at commercially acceptable production rates allowing the ... 07/14/05 - 20050153246 - Process and apparatus for generating a strong phase shift optical pattern for use in an optical direct write lithography process The present invention provides methods and apparatus for accomplishing a strong phase shift direct write lithography process using reconfigurable optical mirrors. A maskless lithography system is provided. The maskless direct-write lithography system provided uses an array of mirrors configured to operate in a tilting mode, a piston-displacement mode, or both ... 07/14/05 - 20050153245 - Method for forming a pattern and method of manufacturing semiconductor device Disclosed is a method of forming a pattern comprising coating a solution containing a compound having a silicon-nitrogen linkage in the main chain thereof over a surface of a working film to form a mask, replacing the nitrogen in the mask by oxygen, forming a resist film on a surface ... 07/07/05 - 20050147922 - Method for exposing a photosensitive resist layer with near-field light In a method for exposing a photosensitive resist layer with near-field light, a liquid film layer is provided between the photosensitive resist layer and a photomask. The photomask has a light-shielding film containing an opening portion whose width is smaller than the wavelength of light emitted from a light source. ... 06/09/05 - 20050123859 - Photosensitive composition, compound for use in the photosensitive composition, and pattern forming method using the photosensitive composition A photosensitive composition comprising a compound capable of generating a specific sulfonic acid upon irradiation with actinic rays or a radiation; a compound capable of generating a specific sulfonic acid upon irradiation with an actinic ray or a radiation; and a pattern forming method using a photosensitive composition comprising a ... ### FreshPatents.com Support - Terms & Conditions |