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Radiation Imagery Chemistry: Process, Composition, Or Product Thereof > Imaging Affecting Physical Property Of Radiation Sensitive Material, Or Producing Nonplanar Or Printing Surface - Process, Composition, Or Product > Making Electrical Device Making Electrical DeviceMaking Electrical Device patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.06/07/07 - 20070128557 - Phototool coating A phototool having a fluorinated phosph(on)ate coating and methods of using the phototool. ... 06/07/07 - 20070128556 - Method of manufacturing semiconductor integrated circuit devices To alleviate the absolute value control accuracy of phases in a mask having a groove shifter structure, transfer regions formed at different planar positions on the same plane of the same mask are subjected to a multiple exposure by scanning exposure. Although. identical mask patterns are formed over the transfer ... 06/07/07 - 20070128555 - Novel ester compound, polymer, resist composition, and patterning process A polymer comprising recurring units (2) obtained through polymerization of an ester compound of formula (1) is used to form a resist composition. R1 is F or C1-C6 fluoroalkyl, R2 is H or C1-C8 alkyl, R3 is O or C1-C6 alkylene, R4 and R5 each are H or C1-C10 alkyl ... 06/07/07 - 20070128554 - Semiconductor device manufacturing method to form resist pattern, and substrate processing apparatus This invention discloses a method to form a resist pattern on a to-be-processed substrate by immersion exposure. A resist film is formed on the central portion of the upper surface of the to-be-processed substrate, on a bevel portion of the upper surface, which is obtained by chamfering the peripheral portion ... 06/07/07 - 20070128553 - Method for forming feature definitions Methods are provided for processing a substrate by depositing a negative mask material on a surface of the substrate, etching the negative mask material to the substrate surface to form negative mask feature definitions, depositing an etch resistant material in the negative mask feature definitions, polish the etch resistant material ... 06/07/07 - 20070128552 - Manufacturing method of pattern formed body and pattern formed body manufacturing apparatus A main object of the invention is to provide a a manufacturing method of a plurality of pattern formed bodies which makes it possible that even if the pattern formed bodies are continuously manufactured, their property varied patterns are each made into a target pattern form with high precision; and ... 06/07/07 - 20070128551 - Manufacturing method of thin film transistor array panel A method of manufacturing a thin film transistor array panel. The method includes forming an amorphous silicon layer, an insulating layer, and a conductive layer on a substrate, forming a first photoresist having a first portion and a second portion with a thickness less than the first portion on the ... 05/31/07 - 20070122751 - Methods of patterning using photomasks including shadowing elements therein and related systems A photomask for patterning an integrated circuit device using a patterning radiation may include a transparent substrate, a pattern of radiation blocking regions, an array of radiation blocking regions, and an array of shadowing elements. The transparent substrate may have first and second opposing surfaces, and the pattern of radiation ... 05/31/07 - 20070122750 - Salt suitable for an acid generator and a chemically amplified resist composition containing the same The present invention also provides a chemically amplified resist composition comprising the salt of the formula (I). ... 05/31/07 - 20070122749 - Method of nanopatterning, a resist film for use therein, and an article including the resist film A method of nanopatterning includes the steps of providing a resist film (12) and forming a pattern in the resist film (12). The resist film (12) includes a copolymer consisting of an organosilicone component and an organic component. An article (10) includes a substrate (14) and the resist film (12) ... 05/24/07 - 20070117050 - Maintenance of photoresist activity on the surface of dielectric arcs for 90 nm feature sizes We have determined that it is necessary to remove hydroxyl groups from the surface of a DARC over which a CAR photoresist is applied, to reduce poisoning of the photoresist during imaging. The poisoning is reduced by treating the surface of the DARC film with a hydrogen or helium-containing plasma ... 05/24/07 - 20070117049 - Anti-reflective coatings using vinyl ether crosslinkers Novel, wet developable anti-reflective coating compositions and methods of using those compositions are provided. The compositions comprise a polymer and/or oligomer having acid functional groups and dissolved in a solvent system along with a crosslinker and a photoacid generator. The preferred acid functional group is a carboxylic acid, while the ... 05/17/07 - 20070111144 - Display device and manufacturing method of the same A plurality of wires and electrodes are formed by forming a first conductive film, selectively forming a resist over the first conductive film, forming a second conductive film over the first conductive film and the resist, removing the second conductive film formed over the resist by removing the resist, forming ... 05/17/07 - 20070111143 - Method of fixing organic molecule and micro/nano article To make it possible to fix various organic molecules in an arbitrary configuration or arrangement on a micro/nano scale as a cheap and simple process by irradiating a photocurable resin containing an organic molecule on a substrate with light, thereby curing the photocurable resin in a given pattern and removing ... 05/10/07 - 20070105051 - Method of forming pattern Formation of a constricted portion in an interconnect pattern is inhibited while moderating design rule for a phase shifting mask. When an interconnect pattern including a plurality of straight lines that are arranged in parallel is formed in a photoresist film on or over a wafer, the process thereof comprises: ... 05/10/07 - 20070105050 - Method and apparatus for producing microchips Method for producing microchips by using immersion lithography, wherein the immersion fluid comprises an additive so that the refractive index of the immersion fluid is increased relative to the fluid not comprising the additive. The exposure light in the method has improved resolution, so that microchips having an increased integration ... 05/03/07 - 20070099125 - Fabrication method for a damascene bit line contact plug A fabrication method for a damascene bit line contact plug. A semiconductor substrate has a first gate conductive structure, a second gate conductive structure and a source/drain region formed therebetween. A first conductive layer is formed in a space between the first gate conductive structure and the second gate conductive ... 05/03/07 - 20070099124 - Composition for removing immersion lithography solution and method for manufacturing semiconductor device including immersion lithography process using the same Disclosed herein is a composition for removing an immersion lithography solution. The composition includes an organic solvent and an acid compound. Also disclosed is a method for manufacturing a semiconductor device including an immersion lithography process. When a photoresist pattern is formed by the immersion lithography process, an exposure process ... 05/03/07 - 20070099123 - Method of forming solder mask and wiring board with solder mask A method of forming solder mask, suitable for forming a solder mask on the surface of a wiring board, is provided. The surface of the wiring board includes a first region and a second region, and the surface of the wiring board has a wiring pattern thereon. The method includes ... 05/03/07 - 20070099122 - Reflective film interface to restore transverse magnetic wave contrast in lithographic processing A method and system for exposing a resist layer with regions of photosensitivity to an image in a lithographic process using a high numerical aperture imaging tool. There is employed a substrate having thereover a layer reflective to the imaging tool radiation and a resist layer having a region of ... 05/03/07 - 20070099121 - Liquid discharge head manufacturing method, and liquid discharge head obtained using this method According to the present invention, a method for manufacturing a liquid discharge head includes the steps of depositing a solid layer for forming a flow path on a substrate on which an energy generating element is arranged to generate energy that is used to discharge liquid, forming, on the substrate ... 04/26/07 - 20070092841 - Exposure method An exposure method includes the step of illuminating a mask having a contact hole pattern that includes a hybrid pattern using an illumination light that forms an effective source that has plural poles, and projecting an image of the mask onto a plate through a projection optics. The hybrid pattern ... 04/26/07 - 20070092840 - System and method for photolithography in semiconductor manufacturing A method for photolithography in semiconductor manufacturing includes providing a substrate for a wafer and providing a mask for exposing the wafer. The wafer is exposed by utilizing a combination of high angle illumination and focus drift exposure methods. ... 04/26/07 - 20070092839 - Polarizing photolithography system A polarizing photolithography reticle system is provided including providing a reticle substrate, forming polarization structures on the reticle substrate, and etching circuit patterns on the reticle substrate on a side opposite the polarization structures. ... 04/19/07 - 20070087291 - Lithography process to reduce interference A method and associated masks for carrying out a lithographic imaging process to reduce or avoid a strong interference effect in off-axis illumination, the method including providing a resist layer on a substrate; illuminating a first group of line patterns through a first mask on the resist layer; illuminating a ... 04/19/07 - 20070087290 - High resolution printing technique A pattern having exceptionally small features is printed on a partially fabricated integrated circuit during integrated circuit fabrication. The pattern is printed using an array of probes, each probe having: 1) a photocatalytic nanodot at its tip; and 2) an individually controlled light source. The surface of the partially fabricated ... 04/12/07 - 20070082297 - Polymer, top coating layer, top coating composition and immersion lithography process using the same A polymer, a top coating layer, a top coating composition and an immersion lithography process using the same are provided. The polymer used as a top coating layer covering (or formed on) a photoresist may include a specific chemical structure. The top coating composition may include a solvent and a ... 04/12/07 - 20070082296 - Method of forming micro-patterns using multiple photolithography process Provided is a method of forming micro-patterns using a multi-photolithography process, including: providing an etch target layer where micro-patterns are to be formed; forming a mask layer on the etch target layer; forming a first mask pattern including engraved portions and embossed portions by etching a predetermined region of the ... 04/12/07 - 20070082295 - Method of manufacturing semiconductor device A method of manufacturing a semiconductor device using immersion exposure in which exposure is carried out with an immersion exposure liquid interposed between a projection lens and a substrate, includes preparing a photomask on which a plurality of patterns are formed, projecting the patterns formed on the photomask, on a ... 04/05/07 - 20070077523 - Method of patterning a positive tone resist layer overlaying a lithographic substrate A single exposure method and a double exposure method for reducing mask error factor and for enhancing lithographic printing-process resolution is presented. The invention comprises decomposing a desired pattern of dense lines and spaces in two sub patterns of semi dense spaces that are printed in interlaced position with respect ... 03/29/07 - 20070072129 - Method for forming flexible printed circuit boards The present invention provides a method for forming flexible printed circuit boards. The method includes the following steps: providing a substrate with a copper film formed on at least one surface of the substrate; and forming a number of copper holes in the copper film through a photolithography process. The ... 03/29/07 - 20070072128 - Method of manufacturing an integrated circuit to obtain uniform exposure in a photolithographic process A method of manufacturing an integrated circuit in which the method comprises exposing a wafer to an energy source defining a focal plane with which a depth of focus is associated and conforming the wafer to substantially correspond with the focal plane. ... 03/22/07 - 20070065757 - Photo-curable resin composition and a method for forming a pattern using the same Provided is a new photo-curable resin composition which can be used in a photo nanoimprinting technology available for a photo nanoimprinting technology by which a substrate is processed with high accuracy. The photo-curable resin composition contains a photo-curable resin material essentially containing a (meth)acrylate, a reactive diluent, and a photo ... 03/15/07 - 20070059648 - Method for forming a capacitor In a method for forming a photoresist pattern, a method for forming a capacitor, and a capacitor manufactured using the same, a light is selectively irradiated onto a selected portion of a photoresist film formed on a substrate. An interfered light generated from the irradiated light is transmitted through other ... 03/15/07 - 20070059647 - Capacitor for a semiconductor device In a method for forming a photoresist pattern, a method for forming a capacitor, and a capacitor manufactured using the same, a light is selectively irradiated onto a selected portion of a photoresist film formed on a substrate. An interfered light generated from the irradiated light is transmitted through other ... 03/15/07 - 20070059646 - Method of forming conductive tracks A patterned electrical conductor having improved conductivity and controllably high resolution track and gap widths is obtained by exposing, to a desired conductive pattern, a pressure-sensitive or photosensitive element comprising a support and a pressure-sensitive or photosensitive material coated thereon being sensitive to the exposure (e.g. the wavelength of exposing ... 03/15/07 - 20070059645 - Methods for fabricating nanoscale electrodes and uses thereof The present invention relates to methods for fabricating nanoscale electrodes separated by a nanogap, wherein the gap size may be controlled with high precision using a self-aligning aluminum oxide mask, such that the gap width depends upon the thickness of the aluminum oxide mask. The invention also provides methods for ... 03/15/07 - 20070059644 - Micropattern formation material and method of micropattern formation The present invention provides a method of forming a fine pattern, comprising the steps of forming a resist pattern 3 made of a chemically amplified photoresist on a substrate 1 with a diameter of 6 inches or more, applying a fine pattern forming material containing a water-soluble resin, a water-soluble ... 03/08/07 - 20070054221 - Method of manufacturing nozzle plate The method manufactures a nozzle plate including a nozzle having a tapered section where a diameter gradually decreases from a liquid supply side toward a liquid ejection side, and a straight section which is substantially cylindrical and is situated nearer a liquid ejection side of the tapered section. The method ... 03/01/07 - 20070048673 - Perfluoropolyether benzotriazole compounds Perfluoropolyether benzotriazole compounds and compositions containing perfluoropolyether benzotriazole compounds are provided. The perfluoropolyether benzotriazole compounds can be attached to a substrate having a metal or metal oxide-containing surface to provide at least one of the following characteristics: anti-soiling, anti-staining, ease of cleaning, repellency, hydrophobicity, or oleophobicity. ... 03/01/07 - 20070048672 - Barrier coating compositions containing silicon and methods of forming photoresist patterns using the same wherein the expressions (1+m+n)=1; 0.1≦(1/(1+m+n))≦0.7; 0.3≦(m/(1+m+n))≦0.9; and 0.0≦(n/(1+m+n))≦0.6 are satisfied; R1, R2 and R3 are C1 to C5 alkyl, C1 to C5 alkoxy and hydroxyl groups; and Z represents an alkene that includes at least one hydrophilic group. Barrier coating compositions will include an organic solvent or solvent system selected ... 03/01/07 - 20070048671 - Barrier coating compositions containing fluorine and methods of forming photoresist patterns using such compositions wherein the expressions 1+m+n=1;0.1≦1/(l+m+n)≦0.7; 0.3≦m/(l+m+n)≦0.9; and 0.0≦n/(1+m+n)≦0.6 are satisfied; Rf is a C1 to C5 fluorine-substituted hydrocarbon group; and Z, if present, includes at least one hydrophilic group. Compositions according to the invention may be used to form barrier layers on photoresist layers to suppress dissolution of photoresist components during ... 03/01/07 - 20070048670 - Coating compositions for use in forming patterns and methods of forming patterns A coating composition for forming etch mask patterns may include a polymer and an organic solvent. The polymer may have an aromatic ring substituted by a vinyl ether functional group. The polymer may be, for example, a Novolak resin partially substituted by a vinyl ether functional group or poly(hydroxystyrene) partially ... 03/01/07 - 20070048669 - Method of forming the photo resist feature The method of forming the photo resist feature comprises forming a photo resist layer on the substrate, providing a photo mask comprises the main feature and the assistant feature, providing the exposure process to form the photo resist main feature and the photo resist assistant feature correspondingly and providing the ... 03/01/07 - 20070048668 - Wafer edge patterning in semiconductor structure fabrication A lithographic process including providing a first wafer including (i) a first substrate, (ii) a first underlying layer on the first substrate, and (iii) a first resist layer on the first underlying layer; exposing a first plurality of full exposure fields of a first top resist layer plane through a ... 02/22/07 - 20070042299 - Method to print photoresist lines with negative sidewalls It is very difficult to produce a negative wall angle from either negative or positive-tone chemically amplified resists, especially by e-beam lithography. This problem has now been overcome by first forming a photoresist pedestal in the conventional way, followed by flood exposing with electrons. Then, a second development treatment is ... 02/22/07 - 20070042298 - Method for manufacturing semiconductor device using immersion lithography process Disclosed is a method for manufacturing a semiconductor device using an immersion lithography process comprising rapidly accelerating the rotation of a wafer after exposing and before developing steps to remove an immersion lithography solution, thereby effectively reducing water mark defects. ... 02/22/07 - 20070042297 - Resist pattern forming method and manufacturing method of semiconductor device According to an aspect of the invention, there is provided a resist pattern forming method of forming a resist pattern by immersion exposure, comprising forming a resist film on a substrate to be treated, a contact angle between the resist film and an immersion liquid being a first angle, forming ... 02/15/07 - 20070037099 - Alkaline solution and manufacturing method, and alkaline solution applied to pattern forming method, resist film removing method, solution application method, substrate treatment method, solution supply method, and semiconductor device manufacturing metho A manufacturing method of an alkaline solution, comprising dissolving a gaseous molecule having oxidizing properties or reducing properties in an aqueous alkaline solution. ... 02/15/07 - 20070037098 - Systems and methods for modifying features in a semi-conductor device Systems and methods for modifying features of a semiconductor device. The systems and methods of the invention modify features of a semiconductor device according to the amount of exposure dose of light to which a common reticle field of a semiconductor device is exposed. A mask, or a thin film ... 02/08/07 - 20070031761 - Polymers, methods of use thereof, and methods of decomposition thereof Polymers, methods of use thereof, and methods of decomposition thereof, are provided. One exemplary polymer, among others, includes, a photodefinable polymer having a sacrificial polymer and a photoinitiator. ... 02/08/07 - 20070031760 - Immersion lithography watermark reduction A method of performing immersion lithography on a semiconductor substrate includes providing a layer of resist onto a surface of the semiconductor substrate and exposing the resist layer using an immersion lithography exposure system. The immersion lithography exposure system utilizes a fluid during exposure and may be capable of removing ... 02/08/07 - 20070031759 - Radiation curable polymer films having improved laser ablation properties and radiation curable sensitizers therefor Disclosed are coating formulations that include a copolyester and a vinyl ether in which the copolyester is produced by copolymerizing a monomer composition that includes a fused aromatic diacid monomer, an unsaturated diacid monomer, and a polyol. Also disclosed are methods for producing a laser-ablatable film on a surface of ... 02/01/07 - 20070026345 - Use of supercritical fluid to dry wafer and clean lens in immersion lithography Disclosed are immersion lithography methods and systems involving irradiating a photoresist through a lens and an immersion liquid of an immersion lithography tool, the immersion liquid in an immersion space contacting the lens and the photoresist; removing the immersion liquid from the immersion space; charging the immersion space with a ... 01/25/07 - 20070020564 - Method for manufacturing photoresist having nanoparticles An exemplary method for manufacturing photoresist includes the steps of: adding a metal salt into an aqueous solution, whereby the aqueous solution contains metallic ions (211); adding a sulfide containing sulfur ions (231) into the aqueous solution; adding a polymerizable surfactant (220) into the aqueous solution thereby forming metallic ion ... 01/18/07 - 20070015088 - Method for lithographically printing tightly nested and isolated hole features using double exposure A mask pattern including a group of small-pitched contact hole features with pitch being less than a predetermined value and isolated contact hole features with pitch being greater than the predetermined value is provided. The mask pattern is split into two sub-mask patterns, one having about half of the group ... 01/11/07 - 20070009837 - Electronic substrate and its manufacturing method, electro-optical device manufacturing method, and electronic apparatus manufacturing method An electronic substrate manufacturing method includes: forming a wiring pattern on a substrate; providing a mask with an opening for the substrate on which the wiring pattern has been formed; performing a specified treatment in a part area of the wiring pattern through the opening of the mask. The opening ... 01/11/07 - 20070009836 - Method of manufacturing semiconductor device A method of manufacturing a semiconductor device includes: (A) providing a wafer to which a photo-resist is applied; (B) forming a reacted portion in the photo-resist by exposing the wafer to a light through a mask having a translucent section, the reacted portion being a portion reacted with the light; ... 01/11/07 - 20070009835 - Solvent for printing, pattern composition for printing comprising the solvent, and patterning method using the composition Disclosed is a solvent for printing which comprises a first solvent selected from the group consisting of acetone, methyl ethyl ketone, methyl acetate, ethyl acetate, methanol and mixtures thereof, and a second solvent selected from the group consisting of propylene glycol monomethyl ether acetate (PGMEA), propylene glycol monomethyl ether (PGME), ... 01/04/07 - 20070003880 - Negative photosensitive resin composition A negative photosensitive resin composition comprising an alkali-soluble photosensitive resin (A) having acidic groups and having at least three ethylenic double bonds per molecule, an ink repellent (B) made of a polymer having polymerized units (b1) having a C20 or lower alkyl group in which at least one of its ... 01/04/07 - 20070003879 - Immersion lithography edge bead removal A method of performing immersion lithography on a semiconductor wafer is provided. The method includes providing a layer of resist onto a surface of the semiconductor wafer. Next, an edge-bead removal process spins the wafer at a speed greater than 1000 revolutions per minute and dispenses solvent through a nozzle ... 01/04/07 - 20070003878 - Reduced pitch multiple exposure process A lithographic method to enhance image resolution in a lithographic cluster using multiple projections and a lithographic cluster used to project multiple patterns to form images that are combined to form an image having enhanced resolution. ... 01/04/07 - 20070003877 - Inorganic semiconductive films and methods therefor Inorganic semiconductive films are made by depositing a suitable precursor substance upon a substrate, irradiating the precursor substance with electromagnetic radiation to form a nascent film, and heating the nascent film at a predetermined temperature to form an inorganic semiconductive film. ... 01/04/07 - 20070003876 - Microstructure and method for producing microstructures Light-diffracting microstructures are produced by the superimposition of at least two relief structures, wherein the first relief structure is produced mechanically while at least one second relief structure is a photomechanically generated diffraction structure. A process for the production of light-diffracting microstructures which are additive superimpositions comprising a relief structure ... 12/28/06 - 20060292496 - Circuit pattern forming method, circuit pattern forming device and printed circuit board A circuit pattern forming method is provided which can reduce a possibility of undesired short-circuits being produced in the circuit by satellites formed when fabricating a conductive pattern and thereby can form a highly reliable printed circuit board. To that end, this invention overlappingly draws a conductive pattern and an ... 12/21/06 - 20060286484 - Pretreatment compositions (b) at least one organic solvent, and optionally, (c) at least one adhesion promoter; wherein the amount of the compound of Structure VI present in the composition is effective to inhibit residue from forming when the photosensitive composition is coated on a substrate and the coated substrate is processed to ... 12/14/06 - 20060281028 - Processes and devices using polycyclic fluoroalkanes in vacuum and deep ultraviolet applications Processes and apparatuses using polycyclic fluoroalkanes that are highly transparent to UV wavelengths ranging from about 190 nm to 260 nm are provided. The polycylic fluoroalkanes are useful in a wide variety of applications, including optical couplants, optical cements, optical elements, optical inspection media for semiconductor wafers and devices, and ... 12/07/06 - 20060275709 - Lithographic apparatus and device manufacturing method A lithographic apparatus has a plurality of patterning arrays (e.g., 2, 4, etc.), which are spaced apart in an object plane. A combined, overlapped image of the patterning arrays is projected onto the substrate. Because the image is formed from radiation produced from spaced apart patterning arrays, the image arrives ... 12/07/06 - 20060275708 - Lithographic printing with polarized light The present invention provides systems and methods for improved lithographic printing with polarized light. In embodiments of the present invention, polarized light (radially or tangentially polarized) is used to illuminate a phase-shift mask (PSM) and produce an exposure beam. A negative photoresist layer is then exposed by light in the ... 12/07/06 - 20060275707 - Pattern formation method In a pattern formation method, a resist film is formed on a substrate, an alkali-soluble first barrier film is formed on the resist film and an alkali-insoluble second barrier film is formed on the first barrier film. Subsequently, with a liquid provided on the second barrier film, pattern exposure is ... 12/07/06 - 20060275706 - Immersion lithography contamination gettering layer A method of forming an image in a photoresist layer. The method includes, providing a substrate; forming the photoresist layer over the substrate; forming a contamination gettering topcoat layer over the photoresist layer, the contamination gettering topcoat layer including one or more polymers and one or more cation complexing agents; ... 12/07/06 - 20060275705 - Conductive patterning Various embodiments of a method, coating and system for conductive patterning are disclosed. ... 11/30/06 - 20060269875 - Calculation system for inverse masks A system for calculating mask data to create a desired layout pattern on a wafer reads all or a portion of a desired layout pattern. Mask data having pixels with transmission characteristics is defined along with corresponding optimal mask data pixel transmission characteristics. An objective function is defined having one ... 11/23/06 - 20060263729 - Surface treatment of a dry-developed hard mask and surface treatment compositions used therefor A surface treatment process includes rinsing a substrate after a dry development process to remove residual resist material prior to patterning a hard mask layer. An amorphous carbon hard mask is dry developed and thereafter, the surface treatment includes an aqueous ammonium hydroxide and hydrogen peroxide composition. While the composition ... 11/23/06 - 20060263728 - Method of forming fine patterns It is disclosed a method of forming fine patterns comprising repeating plural times the following course of steps: covering a substrate having thereon photoresist patterns with an over-coating agent for forming fine patterns, applying heat treatment to cause thermal shrinkage of the over-coating agent so that the spacing between the ... 11/23/06 - 20060263727 - Semiconductor chip with coil element over passivation layer A method for fabricating a circuitry component includes providing a semiconductor substrate, a first coil over said semiconductor substrate, a passivation layer over said first coil; and depositing a second coil over said passivation layer and over said first coil. Said second coil may be deposited by forming a first ... 11/23/06 - 20060263726 - Pattern forming method and method of manufacturing semiconductor device A pattern forming method includes forming a photo resist film on a film to be processed, forming a protective film for protecting the photo resist film from an immersion liquid on the photo resist film by coating method, performing immersion exposure selectively to a region of part of the photo ... 11/23/06 - 20060263725 - Forming a patterned metal layer using laser induced thermal transfer method A method of forming a pattern of electrical conductors on a receiving substrate (110) comprises forming metal nanoparticles of a conductive material. A donor substrate (45) is formed. A layer of release material (75) is deposited on a first side of the donor substrate. The metal nanoparticles are deposited on ... 11/23/06 - 20060263724 - Method for forming material layer between liquid and photoresist layer The invention is directed towards a method for forming a material layer between the liquid and the photoresist layer in immersion lithography. After forming a photoresist layer over the wafer, a material layer is formed between the photoresist layer and the liquid and covering the photoresist layer. The material layer, ... 11/16/06 - 20060257790 - A semiconductor device structure and methods of manufacturing thereof Described is a semiconductor device structure with improved iso-dense bias and methods of producing thereof. Non-functional patterns may be added to an integrated circuit layout design. These patterns may be located next to an isolated transistor or an array of densely-packed transistors in order to mitigate the iso-dense bias effects. ... 11/09/06 - 20060251994 - Apparatus and method for characterizing an image system in lithography projection tool A system and method for characterizing an imaging system causes a diffraction image indicative of a test structure having a generalized line-grating to be formed and then extracts from a measurement of the diffraction image a lens transmittance function, a photoresist property or a defocus distance. ... 11/02/06 - 20060246380 - Micropattern forming material and method for forming micropattern A micropattern forming material is formed on a resist pattern containing an acidic group. The micropattern forming material comprises a compound that penetrates the resist pattern. The penetration of the compound causes the resist pattern to form a crosslinked layer and thereby swell resulting in formation of a film insoluble ... 11/02/06 - 20060246379 - Generic patterned conductor for customizable electronic devices A method of making a multilayered product having a repeating conductive pattern that includes determining a repeating pattern configuration such as a grid of conductive traces for use in a range of active element configurations, and forming a continuous web of multilayered product having at least one layer of conductive ... 11/02/06 - 20060246378 - Photolithographic process, stamper, use of said stamper and optical data storage medium A photolithographic process is described. It comprises the steps of: applying a photoresist layer (2) on a substrate (1), locally exposing the photoresist layer (2) to a radiation source with a suitable wavelength, providing a suitable liquid developer composition on the substrate (1), dissolving an exposed or unexposed region of ... 11/02/06 - 20060246377 - Halogenated oxime derivatives and the use thereof as latent acids Compounds of the formula (I) or (II) wherein R1 is C1-C10haloalkylsulfonyl, halobenzenesulfonyl, C2-C10haloalkanoyl, halobenzoyl; R2 is halogen or C1-C10 haloalkyl; Ar1 is phenyl, biphenylyl, fluorenyl, naphthyl, anthracyl, phenanthryl, or heteroaryl, all of which are optionally substituted; Ar′1 is for example phenylene, naphthylene, diphonylene, heteroarylene, oxydiphenylene, phenyleneD-D1-D-phenylene or —Ar′1-A1-Y1-A1-Ar′1—; wherein these ... 10/26/06 - 20060240358 - Pretreatment compositions wherein, V is selected from CH and N, Y is selected from O and NR3 wherein R3 is selected from H, CH3 and C2H5, R1 and R2 are each independently selected from H, a C1-C4 alkyl group, a C1-C4 alkoxy group, cyclopentyl and cyclohexyl, or alternatively, R1 and R2 can ... 10/19/06 - 20060234164 - Norbornene-type polymers, compositions thereof and lithographic process using such compositions Embodiments of the present invention relate generally to non-self imageable and imageable norbornene-type polymers useful for immersion lithographic processes, methods of making such polymers, compositions employing such polymers and the immersion lithographic processes that make use of such compositions. More specifically the embodiments of the present invention are related to ... 10/19/06 - 20060234163 - Laser-assisted deposition A method is provided for depositing a patterning material onto an optically transparent substrate by the use of a laser beam. A solid layer of a patterning material is placed adjacent to a receiving surface of the substrate. A laser beam is directed at an incident angle between 0 and ... 10/12/06 - 20060228650 - Manufacturing method of laser processed parts and protective sheet for laser processing Providing a method of manufacturing a laser processed part by using a protective sheet for laser processing capable of effectively suppressing contamination of surface of workpiece by decomposition product, and processing at high precision, when processing the workpiece by optical absorption ablation of laser beam. It is also an object ... 10/05/06 - 20060223010 - Positive type radiation-sensitive resin composition A positive type radiation-sensitive resin composition suitable as a chemically-amplified resist sensitive to active radiation particularly to deep ultraviolet rays represented by a KrF excimer laser, an ArF excimer laser, or an F2 excimer laser, excelling particularly in a process margin for the KrF excimer laser is provided. The positive ... 10/05/06 - 20060223009 - Imaging methods An imaging method is disclosed. An imaging composition is coated on a work piece followed by applying a sufficient amount of energy from a 3-D imaging system to form an image on the coated work piece. The image may be a logo or marker for alignment of parts. ... 10/05/06 - 20060223008 - Composition for forming antireflection film, laminate, and method for forming resist pattern wherein R1 and R2 represent a hydrogen atom, a fluorine atom, or a monovalent organic group, m is an integer of 1-20, and A represents a divalent coupling means. ... 10/05/06 - 20060223007 - Method and apparatus for lithographic imaging using asymmetric illumination According to one aspect of the present invention, a method and apparatus for processing a substrate may be provided. A reticle may be positioned relative to a substrate. The reticle may have a plurality of features with dimensions extending in a first and a second direction and being asymmetric in ... 09/28/06 - 20060216652 - Composition for forming anti-reflective coating for use in lithography and can be contained in a main chain or a side chain, or both main chain and side chain of a resin. The anti-reflective coating for lithography obtained from the composition has a high reflection reducing effect and does not cause intermixing with a resist layer to give an excellent ... 09/28/06 - 20060216651 - Method and system for drying a substrate A method and system is described for drying a thin film on a substrate following liquid immersion lithography. Drying the thin film to remove immersion fluid from the thin film is performed prior to baking the thin film, thereby reducing the likely hood for interaction of immersion fluid with the ... 09/28/06 - 20060216650 - Exposure apparatus and method, and device manufacturing method An exposure apparatus which includes a projection optical system configured to project a pattern of a reticle onto a substrate and exposes the substrate to light via the reticle and the projection optical system with a gap between the projection optical system and the substrate filled with liquid, comprises a ... 09/28/06 - 20060216649 - Reduced pitch multiple exposure process A lithographic method to enhance image resolution in a lithographic cluster using multiple projections and a lithographic cluster used to project multiple patterns to form images that are combined to form a patterned image having enhanced resolution. ... 09/21/06 - 20060210929 - Photosensitive composition and forming process of structured material using the composition The invention provides a photosensitive composition for forming a highly heat-resistant pattern of a micro phase separation structure. The photosensitive composition comprises: (A) a block copolymer containing a segment composed of an alkoxysilyl-group-containing monomer as a repeating unit, and (B) a photosensitive decomposition agent. The polydispersity index (Mw/Mn) of the ... 09/14/06 - 20060204897 - Negative resist composition comprising base polymer having epoxy ring and si-containing crosslinker and patterning method for semiconductor device using the same A negative resist composition and a patterning method for semiconductor devices using the composition are provided. In one aspect, a negative resist composition comprises an alkali-soluble base polymer having an epoxy ring substituent, a silicon-containing crosslinker having multiple hydroxy groups, and a photoacid generator. In another aspect, a patterning method ... 09/14/06 - 20060204896 - Composition for stripping photoresist and method for manufacturing thin transistor array panel using the same The present invention provides a photoresist stripper comprising about 5 wt % to about 20 wt % alcohol amine, about 40 wt % to about 70 wt % glycol ether, about 20 wt % to about 40 wt % N-methyl pyrrolidone, and about 0.2 wt % to about 6 wt ... 09/07/06 - 20060199108 - Polymer for forming anti-reflective coating layer wherein, R is a substituted or non-substituted alky group of C1 to C5. ... 09/07/06 - 20060199107 - Polymer for forming anti-reflective coating layer wherein, R1 is a substituted or non-substituted alky group of C1 to C5. ... 09/07/06 - 20060199106 - Polymer for forming anti-reflective coating layer wherein, R is a substituted or non-substituted alky group of C1 to C5. ... 08/24/06 - 20060188822 - Off-axis projection optics and extreme ultraviolet lithography apparatus employing the same . ... // - 2 - ... // - 2 - ... // - 2 - ... // - 2 - ... // - 1 - ... // - 1 - ... // - 1 - ... // - 1 - ... 08/24/06 - 20060188821 - Photosensitive resin, photoresist composition having the photosensitive resin and method of forming a photoresist pattern using the photoresist composition In a photosensitive resin, a photoresist composition including the photosensitive resin and a method of forming a photoresist pattern using the photoresist composition, the photosensitive resin includes a hydrophobic terminal group having at least five carbon atoms and a blocking group. The photosensitive resin has a weight average molecular weight ... 08/24/06 - 20060188820 - Photosensitive resin composition and method of forming a pattern using the composition (in the formura (1), X1 and X2 indicate a hydrogen atom, a halogen atom, a hydrocarbon group which may contain an oxygen atom or a halogen atom, or an alkoxy group to which a substituent may bond, and they may be identical to or different from one another. Y indicates ... 08/10/06 - 20060177774 - Process of imaging a photoresist with multiple antireflective coatings A process for imaging a photoresist comprising the steps of, a) forming a stack of multiple layers of organic antireflective coatings on a substrate; b) forming a coating of a photoresist over the upper layer of the stack of multiple layers of organic antireflective coatings; c) imagewise exposing the photoresist ... 08/10/06 - 20060177773 - Method for producing semiconductor patterns on a wafer A method is used to produce semiconductor patterns (10′, 13′) on a wafer (15′). For this purpose, a mask (25) and a dipole aperture (2) with two aperture openings (2b) arranged behind one another in a dipole axis (y) are used. The mask (25) is imaged on the wafer (15′) ... 08/10/06 - 20060177772 - Process of imaging a photoresist with multiple antireflective coatings A process for imaging a photoresist comprising the steps of, a) forming a stack of multiple layers of organic antireflective coatings on a substrate; b) forming a coating of a photoresist over the upper layer of the stack of multiple layers of organic antireflective coatings; c) imagewise exposing the photoresist ... 08/03/06 - 20060172229 - Alignment system used in nano-imprint lithography and nano imprint lithography method using the alignment system An alignment system used in nano-imprint lithography and a nano-imprint lithography method using the alignment system are provided. The alignment system includes: a plurality of electron emission devices, which are provided in the mold and emit electrons; and a plurality of electrodes, which are provided to face the electron emission ... 08/03/06 - 20060172228 - Photosensitive composition, compound for use in the photosensitive composition and pattern forming method using the photosensitive composition The invention provides a photosensitive composition for use in the production process of a semiconductor such as IC, in the production of a circuit substrate of liquid crystal, thermal head and the like or in other photofabrication processes, a pattern forming method using the photosensitive composition, and a specific organic ... 08/03/06 - 20060172227 - Method for making fluid emitter orifice A method of forming a tapered bore an orifice layer of a photo-resist comprises forming a lens in a surface of a first unexposed portion of the layer and exposing the first unexposed portion through a bore-hole mask to define an exposed portion and a second unexposed portion, wherein the ... 07/27/06 - 20060166142 - Illuminant distribution evaluation method, optical member manufacturing method, illumination optical device, exposure apparatus, and exposure method There is disclosed an evaluation method for evaluating a one-dimensional illumination distribution using polynomials, the method comprising steps of: setting up, as the polynomials, one-dimensional power polynomials which are orthogonal in a closed interval; and approximating the one-dimensional illumination distribution with the power polynomials to obtain the coefficients of respective ... 07/20/06 - 20060160026 - Device and method of forming film A film forming device includes a mask member that is made of silicon and has first openings of predetermined patterns; a magnetic member that is made of a magnetic material and has a second opening, and that is aligned with the mask member so that the first openings are arranged ... 07/13/06 - 20060154180 - Imaging element for use as a recording element and process of using the imaging element The invention relates to an imaging element and a method of using the imaging element to form a recording element. The imaging element includes a composition sensitive to actinic radiation at a first wavelength and a photoluminescent tag that is responsive to radiation at a second wavelength different from the ... 07/13/06 - 20060154179 - Imprint lithography An imprinting method is disclosed which involves irradiating a photo-curable imprintable medium in a flowable state on a substrate with radiation to initiate curing of the medium, after the irradiating, contacting the medium with a template to form an imprint in the medium, allowing the medium to substantially cure such ... 07/13/06 - 20060154178 - Method for the production of photoresist structures The optical element (3) is a polyhedron with planar or curved surfaces which largely prevents refraction of the light beams on the surface of the volume of photosensitive material (5) when the beams are fed-in and/or fed-out of the volume of photosensitive material (5), so that the angle of refraction ... 07/06/06 - 20060147842 - Laser-markable compositions A laser-markable composition comprises a binder and an oxyanion of a multivalent metal. ... 07/06/06 - 20060147841 - Pattern plotting device and pattern plotting method In a pattern writing method for writing a pattern on a substrate by the use of projection patterns output from a mirror device including two-dimensionally arranged micromirrors, exposure is implemented by ON/OFF controlling each micromirror and partly overlapping the projection patterns from the mirror device at least in a one-dimensional ... 06/29/06 - 20060141397 - Resist exposure system and method of forming a pattern on a resist A resist exposure system and a method of forming a pattern on a resist are provided and include an exposure source, a photoresist composition, and a mask positioned therebetween. The resist composition comprises a first photoresist X and a second photoresist Y. The first photoresist X absorbs at a higher ... 06/22/06 - 20060134558 - Polymer for forming anti-reflective coating layer wherein, R1 is hydrogen or methyl group, and R2 is a substituted or non-substituted alky group of C1 to C5. The composition for forming the organic anti-reflective coating layer includes the polymer having the repeating unit represented by above Formulas; a light absorber; and a solvent. ... 06/22/06 - 20060134557 - Method and apparatus for thermal development having a textured support The invention is a method and apparatus for forming a relief structure by thermally developing a photosensitive element containing a composition layer capable of being partially liquefied. During thermal development, the photosensitive element is supported on a base member having an exterior surface that is textured. The textures for the ... 06/22/06 - 20060134556 - Methods and compositions for forming aperiodic patterned copolymer films The present invention provides improved and compositions methods for replicating substrate patterns including patterns containing irregular features. The methods of the invention involve depositing block copolymer materials on a patterned substrate and ordering components in the material to replicate the pattern. In some embodiments, ordering is facilitated through the use ... 06/22/06 - 20060134555 - Monolithic inkjet printhead and method of manufacturing the same A method of manufacturing an inkjet printhead includes forming a first photoresist layer on a substrate having ink ejection devices disposed thereon by coating the substrate with a first negative photoresist, exposing the first photoresist layer through a first photomask formed that defines a pattern of ink chambers, forming a ... 06/15/06 - 20060127814 - Mandrel with controlled release layer for multi-layer electroformed ink-jet orifice plates A system and method are provided for fabricating an orifice plate for use in an ink jet printing system. Initially, a substrate base is provided, and a controlled-release layer is applied to a surface of the substrate base. A conductive metal layer is adherently coated on the controlled-release layer. At ... 06/15/06 - 20060127813 - Pattern forming method and method of manufacturing ink jet recording head The present invention has as its object to provide a pattern forming method which, even if a pattern is formed by photolithography, can keep the edge of the opening portion of the pattern in a sharp state and yet, can make the wall surface of the recess of the pattern ... 06/15/06 - 20060127812 - Barrier film material and pattern formation method using the same A resist film is first formed on a substrate. Subsequently, a barrier film including a basic compound of, for example, dicyclohexylamine is formed on the resist film. Thereafter, with an immersion liquid including cesium sulfate provided on the barrier film, pattern exposure is carried out by selectively irradiating the resist ... 06/08/06 - 20060121393 - Green sheet and method of manufacturing the same, and a method of manufacturing a plasma display panel The present invention relates to a green sheet and method of manufacturing the same, and a method of manufacturing a plasma display panel. According to the present invention, a black matrix layer and an electrode layer are formed on a substrate at the same time by once laminating a film ... 06/01/06 - 20060115772 - Polymeric tetrahedral carbon films, methods of forming the same and methods of forming fine patterns using the same The present invention provides polymeric films including polymers having an sp3 carbon main frame including a tetrahedral center atom. Methods of forming the same, hard marks including the same and methods of forming fine patterns using the same are also provided. ... 06/01/06 - 20060115771 - Method for the removal of deposition on an optical element, method for the protection of an optical element, device manufacturing method, apparatus including an optical element, and lithographic apparatus A method for the removal of a deposition on an optical element of an apparatus including the optical element includes providing an H2 containing gas in at least part of the apparatus includes producing hydrogen radicals from H2 from the H2 containing gas; and bringing the optical element with deposition ... 06/01/06 - 20060115770 - Printed circuit board including embedded capacitor and method of fabricating same Disclosed is a PCB including an embedded capacitor, in which a dielectric layer and an upper electrode layer are formed after a lower electrode layer of the embedded capacitor is formed, thereby providing a microcircuit pattern on a circuit layer having a lower electrode layer formed thereon, and a method ... 05/25/06 - 20060110684 - Photomask for forming small contact hole array and methods of fabricating and using the same Photomasks that are used to form a fine contact hole array, a method of fabricating the photomask, and use of the photomask. The photomask includes a transparent substrate; a plurality of line-type opaque patterns being formed on the transparent substrate, for defining floodlighting portions for forming patterns; and phase-shifting regions ... 05/25/06 - 20060110683 - Process of improved grayscale lithography Methods for minimizing the errors associated with substrate etching are presented. The methods use intentional defocusing of the pattern image on the photoresist to minimize errors in the etching process particularly grayscale etching and/or multiple exposure contributions from neighboring patterns. ... 05/18/06 - 20060105272 - Compositions and processes for immersion lithography The present invention relates to barrier layer compositions that are applied above a photoresist composition for immersion lithography processing. In a further aspect, new methods are provided for immersion lithography processing. ... 05/04/06 - 20060093964 - Manufacturing method of microstructure, manufacturing method and manufacturing device of electronic device The present invention provides a manufacturing method capable of obtaining minute structures. In order to achieve this, as shown in FIG. 1, a process target material (108) is exposed and the shape thereof is changed by relatively shifting a laser beam or electronic beam (101) against such process target material ... 05/04/06 - 20060093963 - Manufacturing method of semiconductor device After forming a resist film on a Si substrate, a circuit pattern for a semiconductor integrated circuit, a first L-shaped length measuring pattern and a cross-shaped monitor pattern for alignment are formed on the resist film. Next, based on these patterns, the Si substrate is patterned. Thereafter, a polysilicon film ... 04/27/06 - 20060088789 - Maskless photolithography for using photoreactive agents The present invention relates to maskless photolithography using a patterned light generator for creating 2-D and 3-D patterns on objects using photoreactive chemicals. In an embodiment, the patterned light generator uses a micromirror array to direct pattern light on a target object. In an alternate embodiment, the patterned light generator ... 04/27/06 - 20060088788 - Composition for coating over a photoresist pattern The present invention relates to an aqueous coating composition for coating a photoresist pattern comprising a polymer containing amino group. The present invention also relates to a process for manufacturing a microelectronic device comprising providing a substrate with a photoresist pattern, coating the photoresist pattern with the novel coating material ... 04/20/06 - 20060084010 - Lithographic process In a lithographic process for producing microstructures by means of a direct write system, predefined areas are exposed by means of a focussed beam, particularly a laser beam, in order to produce microstructures. This process is to be further developed such that structures can be produced which are smaller than ... 04/20/06 - 20060084009 - Method for forming self-synthesizing conductive or conjugated polymer film and application The present invention discloses a method by utilizing chemical reaction or specific attractive forces (complexation or hydrogen bonding) for forming self-synthesizing conductive or conjugated polymer film and its application. First of all, at least one photoresist layer with a first functional group and a specific pattern is formed, so that ... 04/13/06 - 20060078827 - Method to restore hydrophobicity in dielectric films and materials Silica dielectric films, whether nanoporous foamed silica dielectrics or nonporous silica dielectrics are readily damaged by fabrication methods and reagents that reduce or remove hydrophobic properties from the dielectric surface. The invention provides for methods of imparting hydrophobic properties to such damaged silica dielectric films present on a substrate. The ... 04/06/06 - 20060073420 - Resist pattern thickening material, resist pattern and process for forming the same, and semiconductor device and process for manufacturing the same The present invention provides a resist pattern thickening material and the like which can thicken a resist pattern and form a fine space pattern. The resist pattern thickening material contains: a resin; a crosslinking agent; and at least one type selected from cationic surfactants, amphoteric surfactants, and non-ionic surfactants selected ... 04/06/06 - 20060073419 - Resist pattern thickening material and process for forming resist pattern, and semiconductor device and process for producing the same The object of the present invention is to provide a process for forming a resist pattern that is capable to utilize excimer laser beam, the thickening level of the resist pattern is controllable uniformly, constantly and precisely, without being affected substantially by environmental changes such as temperatures and humidity, and ... 03/30/06 - 20060068331 - Exposure method An exposure method includes the steps of providing a mask that arranges a contact-hole pattern and a pattern smaller than the contact-hole pattern, and illuminating the mask using plural kinds of light so as to resolve the contact-hole pattern and restrain the smaller pattern from resolving on an object to ... 03/30/06 - 20060068330 - Method for forming photosensitive polyimide pattern and electronic devices having the pattern (E) a step of forming a polyimide pattern 38 by curing the developed precursor layers 33 and 34. ... 03/30/06 - 20060068329 - Antistatic layer for electrically modulated display The present invention relates to a display comprising at least one substrate having at least one electrically modulated imaging layer thereon, at least one patterned electrically conductive layer, and at least one antistatic layer. ... 03/16/06 - 20060057501 - Antireflective compositions for photoresists The present invention relates to a coating solution comprising a polymer obtained by reacting a glycoluril compound with a reactive compound containing hydroxy groups and/or acid groups, and further where the polymer is soluble in an organic solvent. The invention also relates to a process for imaging a photoresist coated ... 02/09/06 - 20060029888 - Method of application of a dielectric sheet and photosensitive dielectric composition(s) and tape(s) used therein A castable photosensitive dielectric composition, a conformable photosensitive green dielectric tape suitable for hot roll lamination, methods of application of the unique compositions and tapes, method of forming an electronic circuit, and multilayered electronic circuit and structures utilizing and/or formed from said compositions and tapes. ... 02/09/06 - 20060029887 - Semiconductor devices having a support structure for an active layer pattern and methods of forming the same Semiconductor devices include a semiconductor substrate with a stack structure protruding from the semiconductor substrate and surrounded by an isolation structure. The stack structure includes an active layer pattern and a gap-filling insulation layer between the semiconductor substrate and the active layer pattern. A gate electrode extends from the isolation ... 02/02/06 - 20060024617 - Products with data-encoding pattern A method of applying content and a data encoding pattern 18 to a product 10 comprises: applying the content 14 to a substrate 12; modifying the reflectivity of the content 14 at a predetermined wavelength; and applying the pattern 18 to the product, wherein the method is such that the ... 02/02/06 - 20060024616 - Basic quencher/developer solutions for photoresists A basic developer/quencher solution formulated to include at least one supercritical fluid or liquid solvent and a base may be used to quench a photo-generated acid within a photoresist as well as develop the photoresist. The supercritical fluid or liquid solvent may be carbon dioxide and the base may be ... 01/26/06 - 20060019201 - Post-dry etching cleaning liquid composition and process for fabricating semiconductor device A post-dry etching cleaning liquid composition for cleaning a substrate after dry etching is provided, the cleaning liquid composition containing at least one type of fluorine compound, glyoxylic acid, at least one type of organic acid salt, and water. With regard to the fluorine compound, ammonium fluoride may be used. ... 01/19/06 - 20060014106 - Photoresist undercoat-forming material and patterning process An undercoat-forming material comprising a copolymer derived from an indene and a compound having a hydroxyl or epoxy group and a double bond, an organic solvent, an acid generator, and a crosslinker, optionally combined with an intermediate layer having an antireflective effect, has an absorptivity coefficient sufficient to provide an ... 01/19/06 - 20060014105 - Immersion exposure liquid and pattern formation method An immersion exposure liquid to be provided between a resist film formed on a substrate and a projection lens for increasing the value of a numerical aperture is obtained by adding, to a solvent, a carbonyl group, a sulfonyl group or the like including a polar molecule having higher polarity ... 01/12/06 - 20060008741 - Transparent amorphous carbon structure in semiconductor devices A transparent amorphous carbon layer is formed. The transparent amorphous carbon layer has a low absorption coefficient such that the amorphous carbon is transparent in visible light. The transparent amorphous carbon layer may be used in semiconductor devices for different purposes. The transparent amorphous carbon layer may be included in ... 01/05/06 - 20060003263 - Phase-change memory device and method of manufacturing the same Disclosed are a phase-change memory device and its manufacturing method, which can reduce a contact area between a bottom electrode and a phase-change layer, thereby reducing the quantity of current necessary for phase change. The phase-change memory device comprises: a bottom electrode formed on a contact plug; a phase-change layer ... 01/05/06 - 20060003262 - Forming electrical conductors on a substrate A method of forming a pattern of electrical conductors on a substrate (18) consists of forming metal nanoparticles on a conductive material. A light absorbing dye is mixed with the metal nanoparticles. The mixture is then coated on the substrate. The pattern is formed on the coated substrate with laser ... 12/22/05 - 20050282088 - Production method of suspension board with circuit A production method of a suspension board with circuit that can provide reduced number of man-hour and complicated processes for forming the ground terminal, to provide production cost reduction. An insulating base layer 4 having a base opening portion 3 is formed on a metal board 2 at a ground ... 12/22/05 - 20050282087 - Method and device for producing exposed structures In order to improve a method for producing exposed structures on a plurality of components by means of an exposure unit, with which substrate member and the exposure unit are moved relative to one another, wherein identical structures are produced on at least some of the components, in such a ... 12/15/05 - 20050277063 - Optical films and methods of making the same Films for optical use, articles containing such films, methods for making such films, and systems that utilize such films, are disclosed. ... 12/15/05 - 20050277062 - Method of making a photopolymer sleeve blank having an integral uv transparent cushion layer for flexographic printing A method of making a photopolymer sleeve blank for use in flexographic printing is provided which includes providing a base sleeve, applying a cushion layer over the base sleeve which is substantially transparent to curing radiation, applying an optional barrier layer over the cushion layer, and applying a photopolymer layer ... 12/01/05 - 20050266353 - Method for applying a resist layer, uses of adhesive materials, and adhesive materials and resist layer A method in which a resist layer is applied to a base layer is disclosed. The resist layer includes an adhesive material, and the adhesive force of the adhesive material decreases or increases during an irradiation process. Residues of the resist layer may be stripped using the disclosed method. ... 12/01/05 - 20050266352 - Metallic pattern forming method and conductive pattern material R3, R4, R5 and R5 independently represents a bivalent organic group. ... 12/01/05 - 20050266351 - Chemically amplified positive resist composition, (meth)acrylate derivative and a process for producing the same The present invention further provides a novel monomers useful for the resist composition, and process for the monomers and the compositions. ... 11/24/05 - 20050260527 - Methods of patterning photoresist Methods of patterning photoresist are disclosed. One example method includes forming photoresist on a substrate having a lower layer; performing a first exposure process to the photoresist in state of positioning a mask on the photoresist; performing a first development process to the photoresist; performing a second entire-surface exposure process ... 11/17/05 - 20050255410 - Anti-reflective coatings using vinyl ether crosslinkers Novel, wet developable anti-reflective coating compositions and methods of using those compositions are provided. The compositions comprise a polymer and/or oligomer having acid functional groups and dissolved in a solvent system along with a crosslinker and a photoacid generator. The preferred acid functional group is a carboxylic acid, while the ... 11/17/05 - 20050255409 - Photo-curable resin composition, method of patterning the same, and ink jet head and method of fabricating the same A photo-curable resin composition, a method of patterning the same, an ink jet head, and a method of fabricating the same. The photo-curable resin composition includes an epoxy compound, a photo-catalyst provided as a photo-initiator, and a non-photo reactive solvent. The photo-catalyst may be a semiconductor material to generate electron-hall ... 11/17/05 - 20050255408 - Method to build robust mechanical structures on substrate surfaces A robust mechanical structure is provided to prevent small foundation structures formed on a substrate from detaching from the substrate surface. The strengthened structure is formed by plating a foundation metal layer on a seed layer and then embedding the plated foundation structure in an adhesive polymer material, such as ... 11/10/05 - 20050250049 - Bi-wavelength optical intensity modulators using materials with saturable absorptions Device and method for exposing photoresists on semiconductor wafers without using physical masks while improving significantly the time- and cost-efficiencies for the manufacturing of integrated-circuit chips. Two electromagnetic sources of different wavelengths are used as the light sources, with the one having longer wavelength functioning as the control light beam ... 11/03/05 - 20050244755 - Method of photolithographic production of polymer arrays In one embodiment of the invention, methods for synthesizing polymers on a substrate are provided. The method includes the steps of coupling a monomer into exposed areas of a substrate in positive-tone application of a photoresist, or coupling a monomer into unexposed areas of a substrate in negative-tone application of ... 10/20/05 - 20050233257 - Photolithography scheme using a silicon containing resist A method for forming a patterned amorphous carbon layer in a semiconductor stack, including forming an amorphous carbon layer on a substrate and forming a silicon containing photoresist layer on top of the amorphous carbon layer. Thereafter, the method includes developing a pattern transferred into the resist layer with a ... 10/20/05 - 20050233256 - Compositions and methods involving direct write optical lithography An improved optical photolithography system and method provides predetermined light patterns generated by a direct write system without the use of photomasks. The Direct Write System provides predetermined light patterns projected on the surface of a substrate (e.g., a wafer) by using a computer controlled means for dynamically generating the ... 10/20/05 - 20050233255 - Method for forming pattern A method of forming a pattern, which comprises forming a masking material layer on a surface of a working film by coating the surface with a solution of a mixture comprising an inorganic compound having a bond between an inorganic element and oxygen atom, and a volatile unit, volatilizing the ... 10/20/05 - 20050233254 - Patterning process and resist overcoat material In an immersion lithography process, a pattern is formed by forming a photoresist layer on a wafer, forming a protective coating on the photoresist layer from a resist overcoat material, exposing the layer structure to light in water, and developing. A water-insoluble, alkali-soluble material is used as the resist overcoat ... 10/20/05 - 20050233253 - Heterocycle-bearing onium salts (wherein M3 is a phosphorus atom, an arsenic atom or an antimony atom), an organic acid or a compound shown by the general formula [4]]”. ... 10/13/05 - 20050227183 - Compositions and methods for image development of conventional chemically amplified photoresists Methods for carrying out lithography with a carbon dioxide development system are described. This invention involves methods for preferential removal of the darkfield region of conventional chemically amplified positive tone resists. The carbon dioxide development systems include a quaternary ammonium salt, preferably a quaternary ammonium halide, borate, sulfonate, tosylate or ... 10/13/05 - 20050227182 - Method of producing a relief image for printing The present invention involves a method for making a relief image. A film that includes a carrier sheet and an imageable material is used to form a mask image that is opaque to a curing radiation. In one embodiment, the mask image is formed on the carrier sheet while in ... 10/13/05 - 20050227181 - Metallisation This invention relates to photosensitive organometallic compounds which are used in the production of metal deposits. In particular, this invention relates to photosensitive organometallic compounds such as bis-(perfluoropropyl)-1,5-cyclooctadiene platinum (II) (i.e. (C3F7)2PtC8H12) which on exposure to UV radiation and then a reduction process forms a platinum metal deposit such as ... 10/06/05 - 20050221231 - Method for photolithography using multiple illuminations and a single fine feature mask A method forms a feature pattern on a substrate by exposing the substrate, using a mask having a pattern of features thereon, with illumination having a first set of settings. The substrate is exposed a second time, using the same mask having the pattern of features thereon, with illumination having ... 09/29/05 - 20050214689 - Fabrication of nanoelectronic circuits A silicon substrate is coated with one or more layers of resist. First and second circuit patterns are exposed in sequence, where the second pattern crosses the first pattern. The patterned resist layers are developed to open holes which extend down to the substrate only where the patterns cross over ... 09/29/05 - 20050214688 - Method for forming film pattern, method for manufacturing semiconductor device, liquid crystal television, and el television An object of the invention is to provide a method for manufacturing a semiconductor device having a semiconductor element with a minute structure, which can reduce a cost and improve throughput due to a small number of steps and reduction in a material. One feature of the invention is to ... 09/22/05 - 20050208429 - Low ph development solutions for chemically amplified photoresists A method for carrying out positive tone lithography with a carbon dioxide development system is carried out by: (a) providing a substrate, the substrate having a polymer resist layer formed thereon, (b) exposing at least one portion of the polymer resist layer to radiant energy causing a chemical shift to ... 09/22/05 - 20050208428 - Surface graft material, conductive pattern material, and production method thereof A surface graft material including a substrate and a surface graft polymer chain, wherein the surface graft polymer chain includes a photocleavable moiety at one of its terminals, and the surface graft polymer chain is directly bonded to a surface of the substrate by a covalent bond between the photocleavable ... 09/22/05 - 20050208427 - Semiconductor device manufacturing method A semiconductor device manufacturing method which shortens the turnaround time for semiconductor devices. In this method, shading material of resist film lies over a main surface of mask blanks and light-transmitting patterns are made as openings in the shading material. A planarizing film is formed so as to cover the ... 09/15/05 - 20050202348 - Substrate, conductive substrate, fine structure substrate, organic field effect transistor and manufacturing method thereof A substrate is provided which comprises an organic resin layer on a base material, wherein the base material has an average surface roughness of not less than 1.2 nm but no more than 5 nm and a maximum height of a surface unevenness of not less than 0.1 μm but ... 09/15/05 - 20050202347 - Process of imaging a deep ultraviolet photoresist with a top coating and materials thereof The present invention relates to a process for imaging deep ultraviolet (uv) photoresists with a topcoat using deep uv immersion lithography. The invention further relates to a topcoat composition comprising a polymer with at least one ionizable group having a pKa ranging from about −9 to about 11. The invention ... 09/08/05 - 20050196705 - Exposure apparatus and method A production method of a semiconductor device which includes the steps of exposing a resist coated on a substrate of a semiconductor device by projecting a light pattern on the substrate of the semiconductor device, developing the resist exposed by the light pattern to form a wafer pattern with the ... 09/08/05 - 20050196704 - Resin coating method and apparatus A resin coating method for applying resin to a predetermined region of a wiring board includes the steps of imaging an external appearance of the resin extruded from a resin application device; and automatically adjusting an amount of the resin extruded from the resin application device based on the external ... 09/08/05 - 20050196703 - Resin coating method and apparatus A resin coating method for applying resin to a predetermined region of a wiring board includes the steps of imaging an external appearance of the resin extruded from a resin application device; and automatically adjusting an amount of the resin extruded from the resin application device based on the external ... 09/08/05 - 20050196702 - Methods for photopatterning hydrogels In one aspect, the invention provides methods for forming a photopatterned hydrogel. In some embodiments, the methods comprise the step of exposing a solution comprising a monomer, a crosslinking agent, and a photoinitiator to a pattern of light comprising a first and a second light intensity for a period of ... 09/01/05 - 20050191583 - Exposure apparatus and method A production method of a semiconductor device which includes the steps of exposing a resist coated on a substrate of a semiconductor device by projecting a light pattern on the substrate of the semiconductor device through an object lens, developing the resist exposed by the light pattern to form a ... 09/01/05 - 20050191582 - System, method, and apparatus for mechanically releasable slider processing including lapping, air bearing patterning, and debonding A mechanically releasable slider process utilizes silicone rubber or PDMS to take the function of a planarization material for individual sliders or slider rows. Mechanical debonding takes advantage of the rubber-elastic property of PDMS. A gripper is used in a virtually solvent-free, air bearing patterning UV-molding process and resist-based processes. ... 08/25/05 - 20050186511 - Laser coding A method for marking an object, wherein the object comprises a material including a functional group and a metal compound or acid that causes an elimination reaction on irradiation with a laser, to form a reaction product of contrasting colour, comprises directing a laser beam on to the areas of ... 08/18/05 - 20050181309 - Method for manufacturing microstructure, method for manufacturing liquid discharge head, and liquid discharge head A method for manufacturing a microstructure comprises the steps of forming positive type resist layer (PMMA) on a base plate having heater formed thereon; forming positive type resist layer (PMIPK) on the aforesaid positive type resist layer; exposing the positive type resist layer on the upper layer to ionizing radiation ... 08/04/05 - 20050170288 - Alternating aperture phase shift photomask having light absorption layer The present invention generally relates to optical lithography and more particularly relates to the fabrication of transparent or semitransparent phase shifting masks used in the manufacture of semiconductor devices. In particular, the present invention utilizes a light absorbing film in a conventional aaPSMs to balance the intensity of light through ... 07/28/05 - 20050164129 - Photomask and manufacturing method of semiconductor device A double exposure process is performed using a halftone phase shift mask (11) including gate patterns (1), assist patterns (2a) and (2b) with different resoluble line widths, and an assist pattern (2c) with a line width equal to or smaller than a resolution limit which are respectively inserted into portions ... 07/28/05 - 20050164128 - Mask for manufacturing semiconductor device and method of manufacture thereof The present invention relates to a microminiaturization technique to achieve the miniaturization and higher integration of IC chip and to the improvement of a mask used in its manufacturing process. In other words, the phases of lights transmitted through the mask is controlled within one mask pattern. Specifically, a transparent ... 07/28/05 - 20050164127 - Method for removing a sacrificial material with a compressed fluid A method comprises depositing an organic material on a substrate; depositing additional material different from the organic material after depositing the organic material; and removing the organic material with a compressed fluid. Also disclosed is a method comprising: providing an organic layer on a substrate; after providing the organic layer, ... 07/28/05 - 20050164126 - Silazane compound and methods for using the same A method for forming a photoresist pattern using the adhesive compound is also disclosed. ... 07/28/05 - 20050164125 - Photoimageable composition The use of photoacid generators including an alkoxyphenylphenyliodonium salt and/or bis(t-butylphenyl)iodonium salt in a photoimageable composition helps improve resolution. Suitable photoimageable compositions includes: (a) a multifunctional polymeric epoxy resin that is dissolved in an organic solvent wherein the epoxy resin comprises oligomers of bisphenol A that is quantitatively protected by ... 07/07/05 - 20050147920 - Method and system for immersion lithography A system (100) and method for immersion lithography is disclosed in which an immersion medium (112) interfaces with a proximal lens (110) that focuses a patterned light beam on a light sensitive material (116), wherein the light sensitive material (116) is covered by a protective film (300) that interfaces with ... 07/07/05 - 20050147919 - Process for the production of strongly adherent coatings The invention relates to a process and to the corresponding apparatus for the production of strongly adherent coatings on an inorganic or organic substrate, wherein in a first step: a) a low-temperature plasma, a corona discharge or a flame is caused to act on the inorganic or organic substrate, in ... 06/30/05 - 20050142497 - Method of forming a pattern in a semiconductor device and method of forming a gate using the same A method of forming a pattern in a semiconductor device is described. A substrate divided into cell and peripheral regions is provided, and an object layer is formed on a substrate. A buffer pattern is formed on the object layer in the cell region along a first direction. A spacer ... 06/30/05 - 20050142496 - Method of fabricating bottom gate type organic thin film transistor A method of fabricating a bottom gate type organic thin film transistor is provided. The method includes the acts of: forming a gate conductive layer pattern on a substrate; forming a gate insulating layer on an exposed portion of the surface of the substrate and the gate conductive layer pattern; ... 06/30/05 - 20050142495 - Methods of controlling multilayer foil ignition Embodiments of the invention include a method of simulating an ignition of a reactive multilayer foil. Other embodiments include various methods of igniting a reactive multilayer foil by transferring energy from an energy source to a reactive multilayer foil. ... 06/23/05 - 20050136358 - Patterning using wax printing and lift off A method for performing a liftoff operation involves printing a liftoff pattern using low-resolution patterning techniques to form fine feature patterns. The resulting feature size is defined by the spacing between printed patterns rather than the printed pattern size. By controlling the cross-sectional profile of the printed liftoff pattern, mask ... 06/16/05 - 20050130067 - Pattern formation method In a pattern formation method, pattern exposure is performed by selectively irradiating, with exposing light, a resist film formed on a substrate and made of a resist including a carboxylic acid derivative. A first resist pattern is formed by developing the resist film after the pattern exposure, and subsequently, the ... 06/16/05 - 20050130066 - Method of forming single sided conductor and semiconductor device having the same A method of forming a single sided conductor and a semiconductor device having the same is provided. The method includes providing a substrate having an opening. The opening exposes a sidewall and an opening base surface. A tilted mask layer is formed in the opening. The tilted mask layer exposes ... 06/09/05 - 20050123857 - Electrically conductive patterns, antennas and methods of manufacture The invention teaches improved, novel methods and materials for the production of antennas. The invention contemplates the use of Directly Electroplateable Resins for the production of these antennas. The unique suitability of Directly Electroplateable Resins to allow facile manufacture of the antennas desired using a broad range of processing and ... 06/02/05 - 20050118532 - Back to front alignment with latent imaging The invention relates to a method for lateral alignment of a substrate for photolithography, wherein the substrate's back side has a reference mark and the substrate front side is coated with a photoresist. The method includes the steps of: retrieving the reference mark on the substrate's back side, applying an ... 06/02/05 - 20050118531 - Method for controlling critical dimension by utilizing resist sidewall protection A method for controlling line width critical dimension is disclosed. A semiconductor layer is deposited on a substrate. A cap layer is formed on the semiconductor layer. A patterned photoresist is formed on the cap layer. The patterned photoresist has a top surface and vertical sidewalls. 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