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Radiation Imagery Chemistry: Process, Composition, Or Product Thereof > Diazo Reproduction, Process, Composition, Or Product Diazo Reproduction, Process, Composition, Or ProductDiazo Reproduction, Process, Composition, Or Product patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.05/31/07 - 20070122733 - Positive photosensitive resin composition, method for forming pattern, and electronic part Provided is a positive photosensitive resin composition which is advantageous not only in excellent sensitivity, resolution and adhesion, but also in excellent heat resistance even when the composition is cured by a low-temperature process at equal to or lower than 280° C., as well as low water absorption and capability ... 03/01/07 - 20070048656 - Photosensitive resin composition and method for manufacturing semiconductor device using the same A photosensitive resin composition comprising: a quinone diazide sulfonic acid ester of a phenol compound represented by formula (I) as defined in the specification; and a polybenzoxazole precursor, and a method for manufacturing a semiconductor device using the same. ... 01/11/07 - 20070009825 - Bisstyryl compound and high density recording media utilizing the same wherein Z1 and Z2 are benzene, naphthalene, or heterocyclic ring, R1 is H, C1-5 alkyl, hydroxyl, halogen atoms, or alkoxy, R2 is H, halogen atoms, C1-5 alkyl, nitro, ester, carboxyl, sulfo, sulfonamide, sulfuric ester, amide, C1-3 alkoxy, amino, alkylamino, cyano, C1-6 alkylsulfonyl, or C2-7 alkoxy carbonyl, R3, R4, R5, and ... 10/05/06 - 20060222997 - Adhesion improver for photosensitive resin composition and photosensitive resin composition containing same An adhesion-improving agent comprising a sulfonyl group substituted nitrogen compound represented by the below described general formulae (1) to (5) or a thiadiazole compound represented by the below described general formulae (6) to (8) and a photosensitive resin composition containing an alkali-soluble resin and a photosensitizer, comprising said adhesion-improving agent. ... 08/17/06 - 20060183048 - Positive photoresist composition and resist pattern formation A means for increasing development velocity of a positive photoresist composition is provided which contains a photosensitive novolak resin formed by replacing some hydrogen atoms within those of all phenolic hydroxyl groups of alkali soluble novolak resin by 1,2-naphthoquinonediazide sulfonyl group. This means is positive photoresist composition and a formation ... 07/13/06 - 20060154169 - Radiation-sensitive compositions comprising a 1,4-dihydropyridine sensitizer and imageable elements based thereon which does not contain any nitro groups bonded to an aromatic ring. ... 04/13/06 - 20060078818 - Near-field exposure photoresist and fine pattern forming method using the same A near-field photoresist for formation of a fine pattern with by near-field exposure includes an alkali-soluble novalac resin, a diazyde-type photosensitizer which is photoreactive by near-field exposure, a photoacid generator which generates acid by the near-field exposure, and a solvent. ... 03/30/06 - 20060068315 - Color forming compositions and associated methods Compositions and methods for production of color images which are developable at desired wavelengths are disclosed and described. The color forming composition can include a color former which is a spiro dye. The color forming composition can include a radiation antenna admixed with or in thermal contact with the color ... 03/23/06 - 20060063095 - Novel photosensitive resin compositions A positive-working photosensitive composition comprising one or more polybenzoxazole precursor polymers, a diazonaphthoquinone photoactive compound which is the condensation product of a compound containing from 2 to about 9 aromatic hydroxyl groups with a 5-naphthoquinone diazide sulfonyl compound and a 4-naphthoquinone diazide sulfonyl compound, and at least one solvent, and ... 02/09/06 - 20060029879 - Silicon based optically degraded arc for lithographic patterning An optically tuned SLAM (Sacrificial Light-Absorbing Material) may be used in a via-first dual damascene patterning process to facilitate removal of the SLAM. The monomers used to produce the optically tuned SLAM may be modified to place an optically sensitive structure in the backbone of the SLAM polymer. The wafer ... 01/12/06 - 20060008728 - Photoresist composition The present invention provides a photoresist composition and more particularly, a photoresist composition comprising a) a novolak resin, b) a diazide compound, and c) a solvent containing propylene glycol methyl ether acetate (PGMEA) and 2,2,4-triemthyl-1,3-penthanediolmonoisobutylate (TMPMB). The photoresist composition according to the invention has excellent coating uniformity and stain inhibitory ... 12/29/05 - 20050287466 - Negative-working photosensitive composition and negative-working photosensitive planographic printing plate A negative-working photosensitive composition comprises (a) an alkali-soluble resin, (b) a compound which causes a crosslinking reaction by an acid, (c) a compound which generates an acid by heating, and (d) a photothermal converting agent, wherein the compound (c) which generates an acid by heating described above is an onium ... 12/01/05 - 20050266334 - Positive-working photosensitive resin composition, method for producing pattern-formed resin film, semicoductor device, display device, and method for producing the semiconductor device and the display device A positive-working photosensitive resin composition containing an alkali soluble resin (A), a diazoquinone compound (B) and a compound (C) which contains a —CH20H group but not a phenolic hydroxyl group, a method for producing a pattern-formed resin film using the composition, a semiconductor device and a display device using the ... 08/18/05 - 20050181297 - Novel photosensitive resin compositions A positive-working photosensitive composition comprising one or more polybenzoxazole precursor polymers, a diazonaphthoquinone photoactive compound which is the condensation product of a compound containing from 2 to about 9 aromatic hydroxyl groups with a 5-naphthoquinone diazide sulfonyl compound and a 4-naphthoquinone diazide sulfonyl compound, and at least one solvent, and ... 07/21/05 - 20050158651 - Adhesive compound and method for forming photoresist pattern using the same wherein R represents a photoacid generator is disclosed. ... 07/21/05 - 20050158650 - One component euv photoresist In one embodiment, a photoactive compound may be attached to a polymer backbone. This embodiment may be more resistant to the generation of reactive outgassing components and may exhibit better contrast. ... ### FreshPatents.com Support |