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Stock Material Or Miscellaneous Articles > All Metal Or With Adjacent Metals > Composite; I.e., Plural, Adjacent, Spatially Distinct Metal Components (e.g., Layers, Joint, Etc.) > Transition Metal-base Component > Group Viii Or Ib Metal-base Component > Cu-base Component > Next To Co-, Cu-, Or Ni-base Component Next To Co-, Cu-, Or Ni-base ComponentNext To Co-, Cu-, Or Ni-base Component patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.03/29/07 - 20070071999 - Nickel plating solution and its preparation method, nickel plating method and printed wiring board copper foil A nickel plating solution preparation method has the steps of: dissolving in water 100 g/L or more and less than 200 g/L of nickel sulfate, and 10 g/L or more and less than 30 g/L of sodium citrate or 8 g/L or more and less than 25 g/L of citric ... 02/08/07 - 20070031697 - Copper-metallized integrated circuits having electroless thick copper bond pads A metal structure (100) for a contact pad of a semiconductor device, which has interconnecting traces of a first copper layer (102). The substrate is protected by an insulating overcoat (104). In the structure, the first copper layer of first thickness and first crystallite size is selectively exposed by a ... 11/02/06 - 20060246314 - Method of producing a heat dissipation substrate of molybdenum powder impregnated with copper with rolling in primary and secondary directions A material for a semiconductor-mounting heat dissipation substrate comprises a copper-molybdenum rolled composite obtained by impregnating melted copper into a void between powder particles of a molybdenum powder compact to obtain a molybdenum-copper composite and then rolling the composite. In a final rolling direction of a plate material, the coefficient ... 12/29/05 - 20050287389 - Method for preventing elution of lead and/or nickel from copper alloy piping material such as valve or pipe joint and copper alloy piping material, and fluid for use in cleaning piping material A technique is provided to precludes elution of the nickel by infallibly removing the nickel adhering to the inner surface of plumbing hardware, realize a treatment for efficient (treating temperature, treating duration, etc.) preclusion of both or either of lead and nickel and perform a neutralizing treatment on the varying ... ### FreshPatents.com Support |