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Stock Material Or Miscellaneous Articles > All Metal Or With Adjacent Metals > Composite; I.e., Plural, Adjacent, Spatially Distinct Metal Components (e.g., Layers, Joint, Etc.) > Transition Metal-base Component > Group Viii Or Ib Metal-base Component > Cu-base Component Cu-base ComponentCu-base Component patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.05/31/07 - 20070122649 - Thin film transistor substrate for display A conductive structure containing copper is capable of being etched to have a reliable profile where the copper layer is free of corrosion or oxidation includes a barrier layer formed on an insulating or semiconductor substrate followed by a copper layer, a blocking layer and a capping layer. The copper ... 03/29/07 - 20070071998 - Preferred copper plated finish and method of making same A copper plated material having at least a surface that is pretreated, copper plated, heat treated, and having a predetermined color blend incorporated into the surface of the material is provided. The present invention also provides a method of making the copper plated material. ... 11/09/06 - 20060251917 - Method for magnetron sputter deposition A method for depositing a nanostructured coating comprising chromium or a copper-chromium mixture on a workpiece. The workpiece may comprise a hollowed structure such as a rocket or jet engine combustion chamber liner. The method comprises providing a magnetron and an external sputter target material comprising chromium or a copper-chromium ... 07/27/06 - 20060166032 - Copper electrolytic solution and electrolytic copper foil produced therewith It is an object of the present invention to provide a copper electrolytic solution used to obtain a low-profile electrolytic copper foil with low surface roughness on the rough side (the opposite side from the glossy side) in the production of an electrolytic copper foil using a cathode drum, and ... 03/16/06 - 20060057420 - Copper foil provided with dielectric layer for forming capacitor layer, copper clad laminate for formation of capacitor layer using such such copper foil with dielectric layer, and method for producing such copper foil with dielectric layer for formation In the case of dielectric-layer-provided copper foils respectively having a dielectric layer on one side of a copper foil, the dielectric layer 6 is an inorganic-oxide sputter film having a thickness of 1.0 μm or less and formed on the one side of the copper foil in accordance with the ... ### FreshPatents.com Support |