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Stock Material Or Miscellaneous Articles > Composite (nonstructural Laminate) > Of Epoxy Ether Of Epoxy EtherOf Epoxy Ether patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.05/31/07 - 20070122628 - Expandable sealant for fasteners An expandable sealant is provided for a fastener including a threaded defining surface. The fastener includes the expandable sealant as a coating adhered to at least a portion of the thread-defining surface to lock the fastener in place and to expand to fill space between the thread-defining surface of the ... 05/24/07 - 20070116962 - Liquid epoxy resin composition A liquid epoxy resin composition comprising: (A) a liquid epoxy resin; (B) an amine type curing agent; (C) a sulfur-containing phenol compound in an amount of from 1 to 20 parts by weight per total 100 parts by weight of the components (A) and (B); and (D) an inorganic filler ... 05/24/07 - 20070116961 - Anisotropic conductive adhesive compositions The invention provides anisotropically conductive adhesive compositions, which comprise a mixture of a multifunctional glycidyl ether epoxy resin, a phenoxy resin, a core-shell polymer, optionally a thermoplastic resin, a thermally activated curing agent, and electrically conductive particles. ... 05/24/07 - 20070116960 - Aviation coating compositions and the use thereof The present invention is directed to a coating composition that produces a high quality gloss dried film coating on a substrate that is resistant to aircraft hydraulic fluids. This invention is also directed to a method of producing said coating composition and the use thereof. This invention is further directed ... 05/17/07 - 20070111010 - Flame retardant prepregs and laminates for printed circuit boards The present invention is directed to prepregs, laminates and printed circuit boards comprising fine particle size melamine cyanurate or a mixture of fine particle size melamine cyanurate and fine particle size melamine polyphosphate as a flame retardant. The present prepregs, laminates and printed circuit boards exhibit excellent flame retardancy as ... 05/10/07 - 20070104960 - Liquid epoxy resin composition A liquid epoxy resin composition comprising (A) a liquid epoxy resin (B) an amine curing agent and (C) an inorganic filler in an amount of from 50 to 900 parts by weight per 100 parts by weight of the component (A), wherein the component (B) is contained in such an ... 05/10/07 - 20070104959 - Liquid epoxy resin composition A liquid epoxy resin composition comprising (A) a liquid epoxy resin (B) an amine curing agent (C) a nitrogen compound selected from the group consisting of organic acids salts of tertiary amines, amino acids, imino acids, and monoamine compounds having an alcoholic hydroxyl group in an amount of from 0.1 ... 05/10/07 - 20070104958 - Epoxy based reinforcing patches with encapsulated physical blowing agents Reinforcing sheets for substrates such as steel and other metals have an adhesive layer that contains an epoxy resin, a rubber, a latent curing agent and an encapsulated physical blowing agent. ... 05/10/07 - 20070104957 - Method of forming a radiation curable coating and coated article A plasma polymer having residual functional (reactive) groups is formed on a substrate, a radiation curable coating composition is applied to the plasma polymer-coated substrate, and the radiation curable composition is radiation cured. The radiation curable composition contains a component which forms a polymer with the reactive groups of the ... 05/03/07 - 20070098995 - Adhesive film and process for preparing the same as well as adhesive sheet and semiconductor device An object of the present invention is to provide a die-adhering adhesive film which can be laminated on a back of a wafer at a temperature lower than a softening temperature of a protecting tape for an ultra-thin wafer, or a dicing tape to be laminated, can reduce a thermal ... 04/26/07 - 20070092733 - Concurrently curable hybrid adhesive composition A curable adhesive composition comprises (a) at least one polymer comprising polymerized units derived (or derivable) from at least one (meth)acryloyl-functional monomer or oligomer; (b) at least one (meth)acryloyl-multifunctional monomer or oligomer; (c) at least one multifunctional epoxide; (d) at least one free radical initiator; and (e) at least one ... 04/19/07 - 20070087202 - Composite material Composite materials composed of a structural fibrous reinforcement and a matrix resin composition. The matrix resin composition includes at least one thermoset resin component, at least one curative component and at least one inorganic nano-scale particulate. The cured composite material exhibits a fatigue performance such that it achieves greater than ... 04/19/07 - 20070087201 - Self-bonding coating composition A self-bonding coating composition for the production of electrical steel sheets cores comprising A) 100 parts per weight of at least one epoxy resin based on bisphenol-A-type and/or bisphenol-F-type, 100% of solids, B) 0.1 to 200 parts per weight of nano particles having an average radius ranging from 2 to ... 04/12/07 - 20070082203 - Dual-stage wafer applied underfills A 100% non-volatile, one-part liquid underfill encapsulant is disclosed for application to the active side of a large wafer or integrated circuit chip. Upon coating, the encapsulant is converted to a liquefiable, tack-free solid by exposure to radiation, particularly in the UV, visible and infrared spectrum. The underfill-coated wafer exhibits ... 03/29/07 - 20070071984 - Substrate for flexible printed wiring board and method for manufacturing the same The present invention provides a substrate for a flexible printed wiring board including an adhesive layer containing an epoxy resin composition, insulating layers respectively stacked on both sides of the adhesive layer and formed with a pair of films containing a nonthermoplastic polyimide resin, and conductor layers respectively disposed on ... 03/15/07 - 20070059531 - Method of manufacturing inkjet printhead and inkjet printhead manufactured using the method A method of manufacturing an inkjet printhead, including forming a nozzle layer by radiating actinic radiation to a cross-linked polymer resist composition including a precursor polymer, a cationic photoinitiator, and a solvent, in which a concentration of the cationic photoinitiator is varied to control a tapered angle of a nozzle ... 03/08/07 - 20070054129 - Solar heat reflective roofing membrane and process for making the same A roofing membrane with high solar heat reflectance includes a bituminous base sheet, a tie-layer with a reinforcement material, and a solar heat-reflective upper layer. ... 03/08/07 - 20070054128 - Multi-component epoxy-amine primer systems comprising a polythioether Multi-component epoxy-amine primer systems are disclosed, which comprise an amine component that comprises a polythioether. Also disclosed are substrates coated with such primer systems as well as methods for coating substrates with such primer systems. ... 02/22/07 - 20070042191 - Tougher cycloaliphatic epoxide resins A method for enhancing the toughness, e.g., resistance to cracking upon flexing, of coatings made from cycloaliphatic epoxy resins wherein the cycloaliphatic epoxy resin is a cycloaliphatic epoxide ester of a hydroxy-functional compound containing at least one cycloaliphatic ring. ... 02/22/07 - 20070042190 - Resin member for valve To provide a light-weight resin member, for a valve, which has high strength and can be used in a high-temperature atmosphere, and is also excellent in chemical resistance and corrosion resistance. A resin member for a valve, which is produced by molding a molding material having a tensile strength of ... 02/15/07 - 20070036981 - Molding compositions containing quaternary organophosphonium salts Molding compositions particularly useful in coating electronic devices such as integrated circuits are disclosed. The molding compositions include an epoxy resin; a hardener for the epoxy resin, and a quaternary organophosphonium salt for catalyzing a reaction between the epoxy resin and the hardener, such as ethyl triphenyl phosphonium acid acetate. ... 02/08/07 - 20070031675 - Epoxy resin composition for packaging a semiconductor device, method of making the same, and semiconductor device using the same An epoxy resin composition, and a method of making the same, includes an epoxy resin and a curing agent, the epoxy resin composition also includes inorganic fillers, curing accelerators, and modified silicone oils. The epoxy resin is a modified epoxy resin prepared by glycidyl etherification of a mixture of a ... 01/04/07 - 20070003767 - Hardeners for coating compositions (iv) The invention relates to hardeners for water-based epoxy resin systems providing a longer resin pot life, incorporating particular compounds (F) and being obtainable by (i) reacting a mixture of (A) at least one epoxidized polyalkylene oxide (A), (B) at least one epoxidized aromatic hydroxy compound (B); (C) at least one ... 01/04/07 - 20070003766 - Hardeners for coating compositions (iii) The invention relates to hardeners for water-based epoxy resin systems providing a longer resin pot life, incorporating particular compounds (F) and being obtainable by (i) reacting a mixture of (A) at least one epoxidized polyalkylene oxide (A), (B) at least one epoxidized aromatic hydroxy compound (B); (C) at least one ... 12/28/06 - 20060292376 - Coating composition yielding abrasion-resistant tintable coatings A coating composition based upon at least partially hydrolyzed epoxy-functional alkoxy silanes and having particular utility in forming tintable, abrasion resistant coatings on lenses. Incorporation in the composition of a non-hydrolyzed epoxy-functional alkoxy silane provides a desired reduction in viscosity. Incorporation in the composition of a polyether surfactant provides a ... 12/28/06 - 20060292375 - Resin compositions with high thermoplatic loading Uncured thermosetting resins are loaded with relatively high amounts of solid thermoplastic resin particles to form a resin precursor. The resin precursor is heat treated so as to produce an uncured resin composition wherein the thermoplastic resin particles become substantially dissolved in the thermosetting resin without causing cure of the ... 12/28/06 - 20060292374 - Powder coating compositions, mid-gloss range coatings, related methods and substrates Disclosed are curable powder coating compositions that include a film-forming resin composition that includes (a) a first film-forming resin, (b) a second film-forming resin that is different from and incompatible with the first film-forming resin, and (c) a compatibilizing agent that includes a first portion that is compatible with the ... 12/21/06 - 20060286385 - Method for producing and treating epoxide resin moulding materials A method for the preparation and processing of epoxy resin molding compositions comprised of epoxy resins, hardeners, fillers and additives, by mixing the epoxy resins with the other components of the composition in a high-speed mixer and granulating the same and homogenizing the resultant free-flowing granules shortly prior to shaping ... 12/07/06 - 20060275608 - B-stageable film, electronic device, and associated process A B-stageable film that includes a thermal interface material is provided. The film may secure a heat-generating device to a heat-dissipating component, may further cross-link, and may conduct thermal energy from the heat-generating device to the heat-dissipating component. A method of making and using the film is provided, as well ... 11/30/06 - 20060269756 - Actinic radiation curable coating compositions A cured coating or molded article prepared from a composition comprising an actinic-radiation curing polymer, wherein the composition is cured with actinic radiation at a temperature of at most 150° C. to form the cured coating or molded article; wherein the cured coating or molded article has a thickness of ... 11/09/06 - 20060251901 - Curable composition and substrates possessing protective layer obtained therefrom A curable composition which comprises: a) silane-functionalized colloidal silica; b) at least one curable monomer selected from the group consisting of aliphatic cyclic acrylate, urethane diacrylate and epoxy resin; and, c) at least one curing agent for curable monomer (b). The composition when cured exhibits scratch and abrasion resistant properties ... 10/26/06 - 20060240262 - Hybrid composite of silicone and organic resins A fiber reinforced composite including layers of fibers, each layer being impregnated with a resin. The layers include in combination a layer of an addition cured silicone resin and a layer of an organic resin. The layers form a hybrid composite having a higher modulus retention at elevated temperatures than ... 10/12/06 - 20060228562 - Semiconductor device, resin composition for buffer coating, resin composition for die bonding, and resin composition for encapsulating This invention can provide a semiconductor device exhibiting excellent anti-solder reflow resistance and higher reliability in surface mounting using a lead-free solder. In accordance with the present invention, there is provided a semiconductor device formed by placing a semiconductor chip whose surface is coated with a cured resin composition for ... 10/12/06 - 20060228561 - Epoxy resin composition for semiconductor encapsulating use, and semiconductor device There is provided an epoxy resin composition for semiconductor encapsulating use comprising: an epoxy resin (A); a phenol resin (B); a curing accelerator (C); and an inorganic filler (D), wherein the inorganic filler (D) contains a spherical fused silica (d1) which contains: metal or semimetal other than silicon; and/or an ... 10/05/06 - 20060222859 - Transparent conductor In formula (1) to (3), n, m and p each represents a positive integer. ... 10/05/06 - 20060222858 - Flexible dry erase/ instructional magnets A dry erase magnet made of a transparent dry erase film top layer for allowing dry erase marker markings to be wiped off. Prior to application of the dry erase layer, the opaque vinyl layer of the magnet substrate may be printed on directly with a layout or design for ... 10/05/06 - 20060222857 - Individual flexible dry erase pads A dry erase pad made of a transparent dry erase film top layer for allowing dry erase marker markings to be wiped off. Prior to application of the dry erase layer, the opaque vinyl layer of the flexible substrate may be printed on directly with a layout or design for ... 10/05/06 - 20060222856 - Prepreg for printed wiring board and copper-clad laminated board A prepreg for a printed wiring board characterized with use of a brominated epoxy resin, possessing a peak intensity of infrared absorption spectrum at 2100 to 2300 cm−1, which is 5% or lower than that of a benzene ring carbon-carbon double bond at 1600 cm−1 as measured with an infrared ... 09/28/06 - 20060216521 - Process for making pressure sensitive adhesive tapes from cationic cure adhesives A process for the preparation of pressure sensitive adhesive tapes where cationic cure is conducted against liners and substrates with low moisture content and in an environment where moisture ingress during cure is prevented. ... 09/28/06 - 20060216520 - Semiconductor encapsulating epoxy resin composition and semiconductor device Epoxy resin compositions comprising (A) an epoxy resin, (C) an inorganic filler, (D) a cure accelerator in the form of an addition product of tertiary phosphine and benzoquinone, (E) a maleimide compound, and (F) an alkenyl phenol are effectively moldable and cures into products having a high Tg and a ... 09/28/06 - 20060216519 - Semiconductor encapsulating epoxy resin composition and semiconductor device An epoxy resin composition comprising (A) at least one epoxy resin comprising (a) a naphthalene ring-containing epoxy resin having at least one substituted or unsubstituted naphthalene ring in a molecule and having an epoxy equivalent of 175 to 210, (B) a phenolic resin having at least one substituted or unsubstituted ... 09/28/06 - 20060216518 - Vulcanized rubber laminate The invention provides a vulcanized rubber laminate obtained by firmly bonding an unvulcanized epichlorohydrin rubber layer and an organic peroxide-containing fluororubber layer. The laminate is obtained by thermal adhesion a layer of an unvulcanized epichlorohydrin rubber composition to a layer of an unvulcanized fluororubber composition. The epichlorohydrin rubber composition comprises ... 09/21/06 - 20060210805 - Epoxy resin composition and semiconductor device An epoxy resin composition for sealing semiconductors which comprises as essential components (A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator, (D) an inorganic filler and (E) a component comprising (e1) a butadiene-acrylonitrile copolymer having carboxyl group and/or (e2) a reaction product of (e1) a butadiene-acrylonitrile copolymer ... 09/14/06 - 20060204762 - Liquid epoxy resin composition and semiconductor device A liquid epoxy resin composition comprising a liquid epoxy resin, a curing agent, and an inorganic filler is useful for semiconductor encapsulation when the curing agent contains 5-100% by weight of a specific aromatic amine compound of at least 99% pure, the epoxy resin and the curing agent are present ... 09/14/06 - 20060204761 - Cured product of epoxy resin composition and method for producing the same, and photosemiconductor device using the same An epoxy resin composition for photosemiconductor element encapsulation having small internal stress and excellent light transmissibility is provided. A cured product formed from an epoxy resin composition for photosemiconductor element encapsulation containing the following components (A) to (D). In the above-described cured product, particles of the component (C) silicone resin ... 09/14/06 - 20060204760 - Epoxy resin composition for photosemiconductor element encapsulation and photosemiconductor device using the same An epoxy resin composition for photosemiconductor element encapsulation, which is excellent in both light transmissibility and low stress property, as well as light resistance against short wavelength light (for example, 350 to 500 nm), is provided. The epoxy resin composition for photosemiconductor element encapsulation, which comprises the following components (A) ... 09/14/06 - 20060204759 - Low temperature curing coating powder A low temperature curable coating powder comprising an epoxy functional resin is cured with styrene maleimide imide, alone or in combination with at least one other curing agent. Another embodiment involves using a non-epoxy functional resin in combination with an epoxy functional compound, rather than using an epoxy functional resin. ... 08/31/06 - 20060194063 - Alicyclic epoxy resins, their preparation process, their compositions, epoxy resin cured product, and uses of alicyclic epoxy resin compositions Alicyclic epoxy resins having high transparency, suited for application to optical materials, coating materials, etc., and solid at normal temperature are provided. These alicyclic epoxy resins meet the following requirements (a) to (d): (a) epoxy equivalent is 500 to 10,000; (b) nuclear hydrogenation rate is not lower than 96%; (c) ... 08/31/06 - 20060194062 - Epoxy resin composition A fibre composite impregnated with an epoxy resin matrix and comprising a benzylidenamine compound has advantageous properties. ... 08/24/06 - 20060188727 - Thermally conductive resin sheet and power module using the same A thermally conductive resin sheet includes a thermosetting resin, and a thermally conductive and electrically insulating inorganic filler. The inorganic filler is a mixture of a flat inorganic filler and a granular inorganic filler. The ratio of the volume content, VL, of the flat inorganic filler to volume content, VR, ... 08/24/06 - 20060188726 - Heat curable, thermally expandable composition with high degree of expansion Compositions containing at least one liquid epoxy resin, at least one solid epoxy resin, at least one propellant, at least one curing agent and at least one mica-containing filler produce expandable, thermally curable binder systems which may be used without the addition of hollow glass beads for the production of ... 08/17/06 - 20060182973 - Resin composition and ceramic/polymer composite for embedded capacitors having excellent tcc property Disclosed herein is a resin composition and ceramic/polymer composite for dielectric layers of embedded capacitors having a high dielectric constant, a dielectric layer of a capacitor manufactured therefrom, and a printed circuit board including the dielectric layer. In addition, a method of increasing temperature stability and a dielectric constant of ... 07/27/06 - 20060166004 - Polyvinylidene fluoride coating for metal substrates The invention relates to a one-step fluoropolymer, especially polyvinylidene fluoride (PVDF), coating for use on metals, especially use on metal fuel line and brake tubes, etc, to provide a protective barrier with superior chemical resistance, impact resistance and heat resistance as well as good flexibility. The coating composition contains, on ... 07/27/06 - 20060166003 - Fabrication of carbon nanotube reinforced epoxy polymer composites using functionalized carbon nanotubes The present invention is directed to methods of integrating carbon nanotubes into epoxy polymer composites via chemical functionalization of carbon nanotubes, and to the carbon nanotube-epoxy polymer composites produced by such methods. Integration is enhanced through improved dispersion and/or covalent bonding with the epoxy matrix during the curing process. In ... 07/27/06 - 20060166002 - Decorative composite material and functional elements constructed therefrom Decorative composite materials in the form of tiles, trays, light boxes, furniture, surfaces, partition walls, dividing screen doors, and the like include a combination of elements embedded and/or encapsulated in a highly durable epoxy resin mixture that allows the embedded and or encapsulated elements to appear as if they are ... 07/27/06 - 20060166001 - Powder coating compositions The present invention relates to powdered thermosetting coating compositions comprising a co-reactable mixture of a glycidyl group containing acrylic copolymer, a carboxylic acid group containing acrylic copolymer, a carboxylic acid group containing polyester, all 3 compounds having a high Tg, along with a low Tg counter part 1 to 3 ... 07/20/06 - 20060159929 - Epoxy compound and cured epoxy resin product The present invention provides a novel epoxy compound, which can be converted into a cured epoxy resin product having liquid crystal properties by curing with a curing agent. Since the cured epoxy resin product of the present invention exhibits good heat conductivity, it is also useful as an insulating material ... 07/20/06 - 20060159928 - Resin composition for printed wiring board, prepreg, and laminate obtained with the same An epoxy resin composition for use in producing a prepreg for printed wiring boards excellent in appearance, flame retardancy, etc., which comprises an epoxy resin, a phenolic novolak, and a curing accelerator. It is characterized in that the epoxy resin comprises an epoxy (a) and an epoxy (b), wherein the ... 07/20/06 - 20060159927 - Paste composition and dielectric composition using the same A paste composition contains an inorganic filler, a resin and a solvent, wherein the paste composition is characterized in that it contains one or more solvents of which the boiling point is 160° C. or higher and an inorganic filler of which the mean particle diameter is 5 μm or ... 07/13/06 - 20060154080 - Anhydride polymers for use as curing agents in epoxy resin-based underfill material An underfill material is presented that may be used between an electrical component and a substrate. The underfill material may be a cured epoxy resin composition comprising a liquid or semisolid epoxy resin and a polyfunctional anhydride polymer and/or oligomer curing agent. The use of anhydride polymers and/or oligomers decrease ... 07/13/06 - 20060154079 - Epoxy resin composition and semiconductor device The object of the present invention is to provide an epoxy resin composition for semiconductor encapsulation which is excellent in flowability, adhesion to substrates, flame retardancy and solder crack resistance without using bromine-containing organic compounds and antimony compounds. According to the present invention, there is provided an epoxy resin composition ... 07/13/06 - 20060154078 - Curing resin composition, adhesive epoxy resin paste, adhesive epoxy resin sheet, conductive connection paste, conductive connection sheet, and electronic component joined body It is an object of the invention to provide a curable resin composition excellent in mechanical strength, heat resistance, moisture resistance, flexibility, resistance to thermal cycles, resistance to solder reflow, dimensional stability, and the like after curing and providing high adhesion reliability and conduction reliability and an adhesive epoxy resin ... 07/06/06 - 20060147719 - Curable composition, underfill, and method A curable composition is provided, and a method associated therewith. The curable composition may include a curable resin and a finely divided refractory solid. The solid may have a surface area that is greater than about 5 square meters per gram, and a determined density of active surface termination sites ... 07/06/06 - 20060147718 - Optoelectronic molding compound that transmits visible light and blocks infrared light A molding compound for use in encapsulating electronic packages which include an optoelectronic component, such as an LED or optical sensor. The molding compound includes a partially-cured epoxy composition, a linear polyol, a dye that absorbs in the region of above 700 nm to about 1200 nm and substantially transmits ... 06/29/06 - 20060141262 - Varnish for laminate or prepreg, laminate or prepreg prepared using this varnish, and printed wiring board prepared using this laminate or prepreg Disclosed are a varnish for laminate or prepreg, comprising a heat treatment product which is obtained by mixing together (a) an epoxy resin, (b) dicyandiamide, and (c) a compound having an imidazole ring so that the component (c) is present in an amount of 0.001 to 0.03% by weight, based ... 06/29/06 - 20060141261 - Coatings having low volatile organic compound content The present invention provides a method of making an aqueous coating composition comprising an aqueous dispersion of an epoxy acrylate resin and a polymerized reactive diluent. The aqueous coating composition preferably has a volatile organic compound content of no greater than 0.4 kilogram per liter of solids. ... 06/15/06 - 20060127678 - Corrosion and alkali-resistant compositions and methods for using the same A corrosion resistant, alkali resistant coating composition is disclosed. The composition comprises a binder comprising a reaction product of an epoxy-containing material and a phosphorus-containing material together with a curing agent. Aminoplasts, especially melamine-based aminoplasts, are particularly suitable curing agents. A source of silicon can optionally be included. The compositions ... 05/25/06 - 20060110599 - Layered product, electromagnetic-shielding molded object, and processes for producing these A layered product which is a molded object comprising a thermoset resin layer, a thermoplastic resin layer, and reinforcing fibers comprising many continuous filaments, wherein the thremoset resin layer has been united with the thermoplastic resin layer at the interface between these layers, the resin of the thermoset resin layer ... 05/11/06 - 20060099425 - Conductive epoxy resin composition and method for producing the same The present invention provides a conductive epoxy resin composition comprising an epoxy resin, a curing agent, a curing accelerator comprising a salt of a diazabicyclo compound and an organic acid, and a carbon material containing expanded graphite. Also disclosed are a production method of the composition, and a molded article ... 05/04/06 - 20060093829 - Metal coated with a radiation curable outdoor durable coating This invention describes a metallic article coated with a radiation curable coating that exhibits resistance to weathering and UV exposure. The radiation curable coating is comprised of greater than about 95% solids by weight and is either clear or pigmented. ... 04/27/06 - 20060088715 - Method for gluing fpcb's A method for gluing plastic parts, especially Flexible Printed Circuit Boards (FPCB's), with a thermally-activated adhesive comprising at least one thermoplastic polymer or a modified rubber and at least one resin. ... 04/20/06 - 20060083928 - Resin composition Resin compositions containing (A) a resin having a polybutadiene structure in a molecule, (B) a thermosetting resin, and (C) a compound having 2 or more mercapto groups in a molecule and/or a compound having a disulfide bond in a molecule are useful for protecting flexible printed circuit boards. ... 04/06/06 - 20060073343 - Curable compositions and rapid prototyping process using the same The present invention provides curable compositions and rapid prototyping processes using the same. In one embodiment, the present compositions include one or more aromatic epoxies and one or more aliphatic epoxies, and, after full cure, exhibit a heat deflection temperature of at least 105° C. and an elongation at break ... 04/06/06 - 20060073342 - Hydraulic transfer film and process for producing hydraulic transfer product therewith An object of the present invention is to provide a hydraulic transfer film which has a transfer layer capable of forming a cured resin layer having excellent surface properties on a hydraulic transfer body and is less likely to cause blocking, a method for producing a hydraulic transfer film, capable ... 04/06/06 - 20060073341 - Printed circuit board tact switch The present invention relates to a PCB-type tactile switch, which improves clicking operation and prevents operational errors, thus improving functionality and reliability of products including the tactile switch. The tactile switch of the present invention comprises an insulating member (100), an interval maintaining member (200), a lower pattern (300), a ... 03/30/06 - 20060068207 - Curable high refractive index resins for optoelectronic applications Novel compositions and methods of using those compositions to form high refractive index coatings are provided. The compositions preferably comprise both a reactive solvent and a high refractive index compound. Preferred reactive solvents include aromatic resins that are functionalized with one or more reactive groups (e.g., epoxides, vinyl ethers, oxetane), ... 03/09/06 - 20060051588 - Electrical devices having an oxygen barrier coating An electrical device includes two electrodes and a conductive polymer layer, containing a mixture of a polymer and a conductive filler, separating the electrodes. A oxygen barrier material containing a thermosetting polymer component is present on the exposed surface of the conductive polymer layer that is not in contact with ... 03/09/06 - 20060051587 - Thermosetting resin composition and adhesive film wherein R represents a hydrocarbon group of a carbon number of 2-18 having a double bond, wherein at least one of hydrogen atoms of the hydrocarbon group may be substituted with a halogen atom, a hydroxyl group or a carboxyl group, and X represents a single bond or a carbonyl ... 02/23/06 - 20060040108 - Uv-absorbing coatings and methods of making the same Methods of forming UV-absorbent transparent coatings and transparent substrates coated with the same allow for a relatively lower temperature cross-linkage reaction between a UV-absorbent compound and an epoxy-alkoxysilane. More specifically, UV-absorbent coatings on transparent substrates are formed by prepolymerizing a mixture consisting essentially of a benzophenone, an epoxy alkoxysilane and ... 02/16/06 - 20060035088 - Epoxy resin for prepreg, prepreg, fiber-reinforced composite material, and processes for producing these An epoxy resin composition suitably used for a prepreg which can complete curing in a short time even at a low temperature and secure a sufficient usable period under preservation at room temperature, in comparison with conventional epoxy resin compositions. An epoxy resin composition comprising at least one of an ... 02/09/06 - 20060029811 - Resin composition, method of its composition, and cured formulation It is an object of the present invention to provide a resin composition which can form cured formulations having various excellent properties such as an insulating property, thermal shock resistance, moldability/formability and strength, and exhibit an excellent appearance in which transparency is enhanced, a resin composition whose cured thin film ... 02/09/06 - 20060029810 - One part, heat cured pressure sensitive adhesives Novel one part, heat cured pressure-sensitive adhesives capable of bonding metallic and non-metallic materials at ambient temperatures and curing at elevated temperatures to form a bond with very high adhesive bond strengths at temperatures up to at least 160° C. The invention is particularly well suited for use with insulated ... 01/05/06 - 20060003166 - Aqueous primer surfacer compositions The invention relates to aqueous coating compositions for producing primer and/or filler layers in a multi-layer coating, in particular in vehicle coating, comprising the following components: A) at least one water-dilutable epoxy resin, B) at least one polyamine curing agent, C) optionally, at least one water-dilutable polyurethane resin, D) water ... 01/05/06 - 20060003165 - Flame-retardant epoxy resin composition and cured product obtained therefrom wherein, -ph(R1)n-, -ph(R2)n- and -ph(R3)n- represent respectively R1-substituted, R2-substituted and R3-substituted phenylene groups, or an unsubstituted phenylene group; n is an integer of 0 to 3; R1, R2 and R3 each independently represent a C1 to C3 alkyl group or a C1 to C3 alkoxy group; and X represents O, ... 12/08/05 - 20050271880 - Method of applying ablative insulation coatings and articles obtained therefrom A method of forming ablative insulation coatings on aerospace structures and articles produced thereby. The method includes forming a mold having a cavity configured to complementarily receive at least a portion of the structure and directly molding the ablative coating to a surface of the structure by introducing a prepared ... 11/17/05 - 20050255322 - Maleimide terminated rubber and curable composition produced by using the maleimide terminated rubber An object of the present invention is to provide a curable composition which exhibits excellent toughness after the curing and excellent long term stability, as well as a rubber used in such curable composition. Such object is realized by a maleimide terminated rubber having maleimide structure on both ends of ... 11/03/05 - 20050244649 - Epoxy-silicone mixed resin composition and light-emitting semiconductor device An epoxy-silicone mixed resin composition to give a transparent cured product which comprises [I] 100 parts by weight of a curable resin composition containing an organosilicon compound and an epoxy resin as essential components, and [II] 0.1 to 50 parts by weight of a silicone elastomer having a refractive index ... 11/03/05 - 20050244648 - Toner fuser member with release layer formed from silsesquioxane-epoxy resin composition A toner fuser member contains a substrate on which is disposed a toner release surface layer formed from a composition that includes a silsesquioxane and a curable epoxy resin. On curing, the composition forms an interpenetrating polymer network of the silsesquioxane and cured epoxy resin. ... 10/27/05 - 20050238881 - Semiconductor assembly using dual-cure die attach adhesive A semiconductor assembly comprising a semiconductor chip on a substrate is adhered to the substrate using a dual cure B-stageable adhesive comprising two chemical compositions, (i) a first composition comprising a curable monomeric or polymeric compound or resin and a curing initiator or curing agent for that compound or resin, ... 10/13/05 - 20050227084 - Resin-impregnated flexible graphite articles Composites are prepared from resin-impregnated flexible graphite materials. Impregnated materials are compressed and cured at elevated temperature and pressure to form structures suitable for uses such as electronic thermal management (ETM) devices, supercapacitors and secondary batteries. ... 10/13/05 - 20050227083 - High tg coatings Articles are coated by applying a coating composition of a high Tg phenoxy-type material having a Tg of at least about 75° C. to at least a portion of a surface of an article, and forming a dried/cured coating of the high Tg phenoxy-type material on the article surface, where ... 10/13/05 - 20050227082 - Adhesive for sealing organic electroluminescent element and use thereof It is an object of the present invention to provide an adhesive for sealing an organic electroluminescence device, an adhesive tape for sealing an organic electroluminescence device, a double-faced adhesive tape for sealing an organic electroluminescence device, a method of sealing an organic electroluminescence device and an organic electroluminescence device, ... 09/22/05 - 20050208307 - Epoxy resin composition and semiconductor device An objective of this invention is to provide an epoxy resin composition for encapsulating a semiconductor free from a harmful substance out of regard for the environment, which exhibits excellent soldering heat resistance and a higher productivity, as well as a semiconductor device manufactured by encapsulating therewith. This invention relates ... 08/25/05 - 20050186430 - Bifunctional phenylene ether oligomer, its derivatives, its use and process for the production thereof R2, R3, R4, R8, R9, R10 and R11 in the formula (2′) and the formula (3′) being required not to be a hydrogen atom, and its use. ... 08/18/05 - 20050181214 - Curable epoxy compositions, methods and articles made therefrom A curable epoxy formulation comprises an epoxy monomer, an epoxy oligomer, or a combination thereof; an organofunctionalized colloidal silica; a cure catalyst; and optional reagents. Further embodiments of the present invention include a method for making the curable epoxy formulation and a semiconductor package comprising the curable epoxy formulation. Embodiments ... 08/18/05 - 20050181213 - Thermoconductive curable liquid polymer composition and semiconductor device produced with the use of this composition A thermoconductive curable liquid polymer composition including (A) a curable liquid polymer, (B) a filler made from a thermally-elongatable shape-memory alloy, and (C) a thermoconductive filler other than (B). A semiconductor device having a semiconductor element glued or coated with the thermoconductive curable liquid polymer composition. ... 08/04/05 - 20050170188 - Resin compositions and methods of use thereof A composition comprises a first curable resin composition that includes at least one aromatic epoxy resin in combination with a solvent, a functionalized colloidal silica dispersion, and at least one other component selected from the group consisting of cycloaliphatic epoxy monomers, aliphatic epoxy monomers, hydroxy aromatic compounds, combinations thereof, and ... 08/04/05 - 20050170187 - Solventless, non-polluting radiation curable coatings Solventless siloxane epoxy-based coating compositions for use on metals, plastics, wood, and glass are disclosed. The compositions are cationically curable in air by U.V. or by electron beam radiation. The siloxane epoxy coating compositions exhibit excellent film properties after curing, such as good adhesion, flexibility, and appearance. The coating compositions ... 07/21/05 - 20050158557 - Resin composition for encapsulating semiconductor A resin composition usable for encapsulating a semiconductor, wherein the resin composition has a viscosity of 5000 Pa.s or less as determined at 80° C., and wherein the resin composition comprises (A) an epoxy resin having two or more epoxy groups in one molecule; (B) a curing agent; and (C) ... 07/21/05 - 20050158556 - Nanoporous laminates A process of making a nanoporous substrate, such as the matrix in an electrical laminate, by grafting onto an organic resin backbone a thermolabile functionality by reacting hydrogen active groups of the organic resin with a compound containing thermolabile groups; then thermally degrading the thermolabile groups grafted on the organic ... 06/23/05 - 20050136262 - Cathodic electrocoating composition containing a morpholine dione crosslinking agent An improved aqueous cathodic electrocoating composition having a binder of an epoxy-amine adduct and a crosslinking agent; wherein the improvement is the use of a crosslinking agent having at least one, preferably a plurality of morpholine dione groups per molecule. Electrodeposited finishes are formed that have reduced volatile emissions and ... 06/16/05 - 20050129957 - Epoxy/silicone mixed resin composition and light-emitting semiconductor device An epoxy/silicone mixed resin composition comprising (A′) an organosilicon compound containing at least one aliphatic unsaturated monovalent hydrocarbon group and at least one silicon atom-bonded hydroxyl group, (B) an epoxy resin containing at least one epoxy group, (C) an organohydrogenpolysiloxane, (D) a platinum group metal-based catalyst, and (E) an aluminum-based ... 06/16/05 - 20050129956 - Novel underfill material having enhanced adhesion An underfill composition with enhanced adhesion and improved resistance to cracking comprising an epoxy resin in combination with a difunctional siloxane anhydride epoxy hardener and optional reagents. In some embodiments, the epoxy resin includes a functionalized colloidal silica filler having a particle size ranging from about 1 nm to about ... 06/16/05 - 20050129955 - Binding agent component for surface coating agents with improved adhesive properties The invention relates to a binding agent composition, in particular an adhesive, containing at least one epoxy compound or at least one amino compound comprising at least two amino groups, or at least one hydroxy compound comprising at least two OH groups, or at least one mercapto compound comprising at ... 06/09/05 - 20050123768 - Hardeners A process for the preparation of dual-cure hardeners, coating systems which contain these hardeners, and the use of these coating systems, as well as substrates coated with these coating agents. The dual-cure hardeners are prepared by reacting at least one diisocyanate or polyisocyanate A with the product B of the ... 06/02/05 - 20050118430 - Resin composition and optical element There are provided a resin composition, which has optical properties such as a high refractive index, has excellent restorability and scratch resistance, and has good adhesion to a substrate, and, when utilized as an optical member (lens) used, for example, in screens for projection televisions or the like, can satisfy ... ### FreshPatents.com Support |