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Stock Material Or Miscellaneous Articles > Structurally Defined Web Or Sheet (e.g., Overall Dimension, Etc.) > Discontinuous Or Differential Coating, Impregnation Or Bond (e.g., Artwork, Printing, Retouched Photograph, Etc.) > Including Metal Layer Including Metal LayerIncluding Metal Layer patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.06/07/07 - 20070128417 - Wired circuit board A wired circuit board is provided which can reduce transmission loss with a simple layer structure and also features excellent long-term reliability by preventing the occurrence of an ion migration phenomenon between a metal foil and an insulating layer to improve the adhesion between the metal foil and the insulating ... 05/31/07 - 20070122597 - Bond pad for low k dielectric materials and method for manufacture for semiconductor devices A semiconductor device, which has an improved contact structure. The device has a semiconductor substrate, e.g., silicon wafer. The device has a plurality of gate structures (e.g., MOS gate structures) formed on a portion of the semiconductor substrate. The device also has a gate dielectric layer and isolation structures, e.g., ... 05/24/07 - 20070116937 - Security element for documents in general and particularly for banknotes, security cards and the like A security element for documents in general and particularly for banknotes, security cards and the like, comprising a flexible support layer that has a layer of metallic material on at least one face, said metallic layer having a substantially uniform thickness with a tolerance of less than +/−4%, and on ... 05/17/07 - 20070110969 - Laminated circuit board A through-hole type laminated circuit board is given with high reliability of electrical connection using copper foil and conductive paste containing low melting point metal without generating harmful void and crack at boundary between the copper foil and conductive paste metal. The laminated circuit board is made by laminating a ... 05/17/07 - 20070110968 - Silver alloy, sputtering target material thereof, and thin film thereof It is an object of the present invention to provide a Ag—Pd—Cu—Ge type silver alloy which can form a reflective electrode film having such two characteristics that it is very reduced in the lowering of reflectance caused by thermal deterioration and has resistant to yellowing caused by sulfurization even after ... 05/10/07 - 20070104929 - Method for plating printed circuit board and printed circuit board manufactured therefrom Disclosed herein are a method for plating a printed circuit board and the printed circuit board manufactured therefrom. In the method, a bare soldering or wire bonding portion of a copper (Cu)- or copper alloy layer, is plated with palladium (Pd) or a palladium alloy, and then gold (Au) or ... 05/03/07 - 20070098967 - Resin product, production method for the same, and deposition method for a metallic coating The present invention provides a metallic coating having a sheen and discontinuous structure and a resin product having the metallic coating by using a physical vapor deposition method at high productivity and low cost. ... 05/03/07 - 20070098966 - Patterned transfer of metallic elements using photo-degradable polymer templates The present invention is drawn to a method of printing metallic elements, comprising steps of forming a photo-degradable polymer template comprising a photo-degradable polymer, depositing a metal layer on the template, and adhering at least a portion of the metal layer to a substrate. Additional steps include exposing the template ... 04/19/07 - 20070087175 - Wired circuit board A wired circuit board is provided that includes an insulating base layer, a conductor layer formed on the insulating base layer, and an insulating cover layer formed on the conductor layer and having an opening through which the conductor layer is exposed, an electrode is formed on the surface of ... 04/19/07 - 20070087174 - Reducing thermal expansion effects in semiconductor packages Reducing effects of thermal expansion in electronic components. An electronic device can include a support, such as a leadframe. An electronic component can be supported by the support. A first flexible layer can cover the electronic component. A second more rigid layer can cover the first layer. The first layer ... 04/12/07 - 20070082183 - Circuit board A circuit board, having improved adhesion between its via conductor and insulating layer, is provided. The circuit board includes a first wiring layer, a second wiring layer, the insulating layer, a filler, and the via conductor. The first wiring layer and the second wiring layer are electrically insulated from each ... 03/15/07 - 20070059503 - Insulated conductive particles and anisotropic conductive adhesive film containing the particles An insulated conductive particle for an anisotropic conductive film is disclosed. One embodiment of the particle includes a conductive particle and insulating fixative particles discontinuously fixed on the surface of the conductive particle. The insulating particles provides insulation with other adjacent insulated conductive particles, while the insulated conductive particle is ... 03/15/07 - 20070059502 - Integrated process for sputter deposition of a conductive barrier layer, especially an alloy of ruthenium and tantalum, underlying copper or copper alloy seed layer A fabrication method and a product for the deposition of a conductive barrier or other liner layer in a vertical electrical interconnect structure. One embodiment includes within a a hole through a dielectric layer a barrier layer of RuTaN, an adhesion layer of RuTa, and a copper seed layer forming ... 03/15/07 - 20070059501 - Tantalum carbide, method for producing tantalum carbide, tantalum carbide wiring and tantalum carbide electrode The tantalum carbide is formed on the surface of tantalum or a tantalum alloy by placing the tantalum or tantalum alloy in a vacuum heat treatment furnace, heat-treating the tantalum or tantalum alloy under a condition where a native oxide layer of Ta2O5 formed on the surface of tantalum or ... 03/01/07 - 20070048507 - Laminated circuit board To provide a laminated circuit board, in which a conductive paste including low melting point metal is used, without generating a void and crack at a boundary portion between a copper foil and the conductive paste containing low melting point metal, and having high reliability for connection. The laminated circuit ... 02/22/07 - 20070042167 - Novel polymide film and use thereof A polyimide film in which the dimensional change is reduced when it has undergone a step of laminating a metal on the polyimide film or a step of etching the metal layer to form wiring, and the rate of dimensional change can be stabilized across the entire width is provided. ... 02/22/07 - 20070042166 - Tape substrate having reinforcement layer for tape packages The following invention is directed to a tape substrate having a reinforcement layer for tape packages and a method of fabricating the same. In an example embodiment, a tape substrate for tape packages may include a base film, a circuit pattern formed on the base film, and at least one ... 02/15/07 - 20070036955 - Laminate, a substrate with wiring, an organic el display element, a connection terminal for an organic el display element and a method for producing each A laminate for forming a substrate with wires, comprising a conductive layer containing Al or an Al alloy as the major component, formed on a substrate and a capping layer containing a Ni—Mo alloy as the major component, formed on the conductive layer, a substrate with wires produced by etching ... 02/15/07 - 20070036954 - Wiring circuit board A wiring circuit board at least contains an electric insulator layer and an electric conductor formed on the electric insulator layer so as to form a predetermined circuit pattern, which further comprises an adhesive layer formed by thermal hardening of the thermosetting adhesive and pressure-sensitive adhesive composition as described in ... 02/15/07 - 20070036953 - Thermosetting adhesive and pressure-sensitive adhesive composition, thermosetting adhesive and pressure-sensitive adhesive tape or sheet, and wiring circuit board wherein R1 represents —CH2— or —CH2—O—CH2—, n is a positive integer, and m is an integer of 1 to 4. ... 02/15/07 - 20070036952 - Method and device for enhancing solderability A method and a device for enhancing the solderability of a lead-free component are provided. The provided method is compatible with the conventional soldering process and is capable of improving the wetting ability of the solder so as to enhance the solderability and the ability of anti-oxidation thereof. Besides, it ... 02/15/07 - 20070036951 - Microfabrication using replicated patterned topography and self-assembled monolayers A method of selectively and electrolessly depositing a metal onto a substrate having a metallic patterned-nanostructure surface is disclosed. The method includes providing a tool having a patterned-nanostructure surface, the patterned-nanostructure surface having surface regions having a nanostructured surface, replicating the tool patterned-nanostructure surface onto a substrate to form a ... 01/18/07 - 20070014975 - Method of manufacturing wiring substrate, and wiring substrate The method of manufacturing a wiring substrate comprises the steps of: performing a pattern exposure of a resin layer containing photocatalyst particles, in a shape of a desired wiring pattern so that the photocatalyst particles are exposed at a surface of the resin layer; performing irradiation of radiation to the ... 01/18/07 - 20070014974 - Method and system for creating fine lines using ink jet technology In a method and system for producing a geometry (24, 35) of desired dimension on a substrate, successive droplets (43) of a material are dropped on to the substrate so as to form a pattern (22, 32) that is of sufficient dimension to accommodate the geometry within a boundary thereof; ... 01/11/07 - 20070009718 - Layered board and electronic apparatus having the layered board A layered board is disclosed which can avoid the occurrence of cracks in a core layer due to shearing stress caused by a difference in coefficient of thermal expansion between the core layer and a buildup layer. The layered board includes a core layer which serves as a printed board, ... 01/11/07 - 20070009717 - Electron-beam treated cdo films A method of forming an integrated circuit including forming a dielectric film is described. The forming of the dielectric film includes: providing a substrate, providing a carbon doped oxide film on the substrate, and treating the carbon doped oxide film with an electron beam. The carbon doped oxide film can ... 01/04/07 - 20070003744 - Wiring board In order to prevent stress caused by bending a flexible wiring board from being applied to the connection section between the flexible wiring board and a driving IC, solder is deposited as a reinforcement member, on both sides of the driving IC connected onto the flexible wiring board. ... 12/28/06 - 20060292354 - Wiring substrate In a wiring substrate having a metal wiring pattern that is formed on a substrate and includes a contact portion for providing connection to an external element, an organic thin film containing silane is formed to cover the metal wiring pattern and the contact portion is electrically connected to the ... 12/21/06 - 20060286358 - Heat spreader for use with light emitting diode A substrate for an integrated circuit device includes a low coefficient of thermal expansion material having opposing first and second surfaces with an array of through holes extending from the first surface to the second surface. A high thermal conductivity substrate is adjacent to the second surface of the low ... 12/14/06 - 20060280919 - Wiring substrate A wiring substrate comprised of a substrate main body made of glass-ceramic, a pad formed on a surface of the substrate main body and a conductor pin provided in an upright position on the pad. The pad is comprised of a ceramic that is the same as the ceramic constituting ... 12/14/06 - 20060280918 - Wiring substrate In the wiring substrate, a first high melting point metal portion 18 having a melting point higher than Au and Ag is provided between an Au wiring portion 15 and an Ag wiring portion 17. The higher the melting point of the first high melting point metal portion 18, the ... 11/30/06 - 20060269730 - Wired circuit board and production method thereof A wired circuit board that can remove static electricity not only from an insulating base layer and an insulating cover layer but also from a terminal portion, to effectively prevent an electronic component mounted from being damaged by static electricity and also prevent stripping of a semi-conductive layer. In a ... 11/30/06 - 20060269729 - Copper conducting wire structure and fabricating method thereof A copper conducting wire structure is for use in the thin-film-transistor liquid crystal display (LCD) device. The copper conducting wire structure includes at least a buffer layer and a copper layer. A fabricating method of the copper conducting wire structure includes the following steps. At first, a glass substrate is ... 11/30/06 - 20060269728 - Peelable circuit board foil In one embodiment, a peelable circuit board foil (200) has a metal support layer (205) and a conductive metal foil layer (210) bonded by an inorganic high temperature release structure (215) that comprises a co-deposited layer (250) and a metal oxide layer (260). The co-deposited layer comprises an admixture of ... 11/23/06 - 20060263580 - Materials and methods for immobilization of catalysts on surfaces and for selective electroless metallization A method of immobilizing a catalyst on a substrate surface involves providing novel ligating copolymers comprising functional groups capable of binding to a substrate surface and functional groups capable of ligating to catalysts such as metal ions, metal complexes, nanoparticles, or colloids; applying the ligating copolymer to a substrate surface ... 11/09/06 - 20060251873 - A method of manufacturing a film printed circuit board A method of manufacturing a film printed circuit board is provided. A film substrate consisting of a polyimide substrate, an alloy layer and a first copper layer is provided. A first lithographic and etching process is performed to pattern the copper layer and the alloy layer and a plurality of ... 11/09/06 - 20060251872 - Conductive barrier layer, especially an alloy of ruthenium and tantalum and sputter deposition thereof A fabrication method, a product structure, a fabrication method, and a sputtering target for the deposition of a conductive barrier or other liner layer in an interconnect structure. The barrier layer comprises a conductive metal of a refractory noble metal alloy, such as a ruthenium/tantalum alloy, which may be amorphous ... 11/09/06 - 20060251871 - Anisotropic electrically conductive film and method of producing the same The present invention is directed to an anisotropic conductive film and manufacturing methods thereof, in which an electrically insulative porous film made of synthetic resin is used as a base film and in which conductive parts capable of being provided with conductiveness in the film thickness direction are formed independently ... 11/02/06 - 20060246270 - Optical recording medium where 20≦−2.75α+0.708β+1.18γ−7.56≦43, and α/(α+β)≦0.12. ... 11/02/06 - 20060246269 - Memory device and semiconductor device The present invention provides an involatile memory device that is capable of data writing and erasing at a time other than during manufacturing, and a semiconductor device having the memory device. Also, the present invention provides a compact-sized and inexpensive involatile memory device and a semiconductor device having the memory ... 11/02/06 - 20060246268 - Printed circuit board A ground pattern includes a plurality of integrally formed first to third ground lines. A plurality of first ground lines are arranged parallel to one another at equal intervals. A plurality of second ground lines are arranged parallel to one another at equal intervals between adjacent ones of the first ... 10/26/06 - 20060240231 - Method for improving the thermal cycled adhesion of thick-film conductors on dielectric An improved electrical printed circuit exhibiting a combination of enhanced solderability and outstanding adhesion with a dielectric substrate includes a stack of two different types of conductive films. The stack includes a first conductive film that is printed onto the substrate with an ink that has been specially formulated to ... 10/19/06 - 20060234020 - Ceramic multilayer component, method for the production thereof and retaining device The invention relates to a method for producing a ceramic multi-layer component, wherein a base body (1) containing unsintered ceramic (2) and at least one metal-containing internal electrode (3) is sintered in a sintering atmosphere, where a metal is provided in the sintering atmosphere as a sintering aid, whose redox ... 10/05/06 - 20060222833 - Imprinting mold for printed circuit board having excellent durability and method of manufacturing printed circuit board using the same The present invention relates to an imprinting mold for a printed circuit board, having excellent durability, and a method of manufacturing a printed circuit board using the same. Specifically, this invention provides an imprinting mold for a printed circuit board, having excellent durability, in which the mold having a surface ... 09/28/06 - 20060216484 - Wiring board and circuit apparatus A wiring board in which a line can be made narrower and/or a transmission loss can be reduced is developed. The wiring board includes a first conductor and a second conductor maintained at the same potential, a dielectric material layer provided between the first and second conductors, and a third ... 09/21/06 - 20060210780 - Circuit board and production method therefor A method of manufacturing a circuit board comprising: an inner layer board laminating step for laminating inner layer board material and one or more metal sheet(s) for inner layer; an inner layer circuit forming step for forming circuits of the metal sheet to make an inner layer circuit board; a ... 09/21/06 - 20060210779 - Electrical-energy-storage unit (eesu) utilizing ceramic and integrated-circuit technologies for replacement of electrochemical batteries An electrical-energy-storage unit (EESU) has as a basis material a high-permittivity composition-modified barium titanate ceramic powder. This powder is double coated with the first coating being aluminum oxide and the second coating calcium magnesium aluminosilicate glass. The components of the EESU are manufactured with the use of classical ceramic fabrication ... 09/14/06 - 20060204734 - Laminate A laminate having a metal foil layer, and a polyimide resin layer provided on the metal foil layer, wherein the polyimide resin layer is obtained by curing a coating of a polyimide resin precursor solution directly applied onto a surface of the metal foil layer, wherein the polyimide resin layer ... 09/14/06 - 20060204733 - Circuit device The present invention provides a circuit device capable of controlling deformation of a circuit device while preventing an insulating layer from peeling from a substrate. The circuit device includes a substrate, an insulating layer formed on the substrate, a filler filled into the insulating layer, a conductive layer formed on ... 09/07/06 - 20060198994 - Ceramic circuit substrate and manufacturing method thereof A ceramic circuit substrate and a manufacturing method thereof are provided, which has excellent thermal shock tolerance by forming a gap between a circuit pattern section and a ceramic substrate, and has a capability to prevent etchant residue from remaining therein. The ceramic circuit substrate according to the present invention ... 08/31/06 - 20060194031 - Wiring substrate and manufacturing method thereof A first plating foundation layer is formed by printing on a front face of a sheet-shaped insulating substrate. By inserting a punch into the sheet-shaped insulating substrate having the first plating foundation layer, a through hole is formed while leaving a piece having the plating foundation layer in the portion ... 08/24/06 - 20060188702 - Electronic apparatus including printed circuit board A copper foil pattern is formed such that mountain portions and valley portions thereof are continuous to be substantially orthogonal to a forward direction of a printed circuit board at the time of solder immersion, and a non-copper foil pattern portion free of a copper foil is provided to be ... 08/24/06 - 20060188701 - Multilayered construction for resistor and capacitor formation The invention concerns multilayered constructions useful for forming resistors and capacitors, for the manufacture of printed circuit boards or other microelectronic devices. The multilayered constructions comprise sequentially attached layers comprising: a first electrically conductive layer, a first thermosetting polymer layer, a heat resistant film layer, a second thermosetting polymer layer, ... 08/03/06 - 20060172127 - Laminate for forming a substrate with wires, substrate with wires and methods for producing them A laminate for forming a substrate with wires in which a silver type material is used for a conductor layer and the layer is covered with a conductive protection layer for protection, the laminate for forming a substrate with wires exhibiting an extremely low contact resistance between the conductive protection ... 08/03/06 - 20060172126 - Magnetically directed self-assembly of molecular electronic junctions A device having a substrate, a pair of ferromagnetic leads on a surface of the substrate, laterally separated by a gap, and one or more ferromagnetic microparticles comprising a conductive coating at least partially within the gap. The conductive coating forms at least part of an electrical connection between the ... 07/20/06 - 20060159899 - Optimized multi-layer printing of electronics and displays An apparatus and method for making a printed circuit board comprising a substrate and an electrical circuit is provided. The circuit is formed by deposition of a plurality of electronic inks onto the substrate and curing of each of the electronic inks. The deposition may be performed using an ink-jet ... 07/20/06 - 20060159898 - Semi-conducting resin composition, and wired circuit board To provide a semi-conducting resin composition capable of forming a semi-conducting layer which exhibits a less variable surface resistivity even when subjected to ultrasonic cleaning and effectively discharges static electricity and also provide a wired circuit board comprising the semi-conducting layer composed of the semi-conducting resin composition, an imide resin ... 07/20/06 - 20060159897 - Data carrier with a module with a reinforcement strip In a lead-frame configuration (60), a module (70) and a data carrier (72), two connecting plates (12, 13) of the module (70), which are each intended for connection to a connecting contact or bump (47,48) of a chip (41), are connected to a reinforcement film (66, 71) formed from a ... 07/13/06 - 20060154035 - Identification code drawing method, substrate, display module, and electronic apparatus An identification code drawing method of drawing an identification code on a substrate includes: cleaning the substrate by using a cleaning unit; performing lyophobization for the substrate; discharging liquid droplets of functional liquid, into which particles of metal or metal oxide are dispersed, from nozzles of a first liquid droplet ... 07/13/06 - 20060154034 - Functional device A functional device having very good operation durability characteristics, high reliability and satisfactory performance is provided. The functional device provided is a functional device having: at least one functional layer deposited over a substrate wherein an organic material is included; and a plurality of electrodes for bringing the functional layer ... 07/13/06 - 20060154033 - Process and ink for making electronic devices A process for making an electronic device comprising a dielectric substrate laminated with an electrically conductive metal or alloy which comprises applying a non-aqueous etch-resistant ink by ink jet printing to selected areas of the metal or alloy, exposing the etch-resistant ink to actinic radiation and/or particle beam radiation to ... 07/06/06 - 20060147684 - Layered board and manufacturing method of the same, electronic apparatus having the layered board A manufacturing method of a layered board that includes a core layer that serves as a printed board, and a buildup layer that is electrically connected to said core layer, said buildup layer including an insulation-part and a wiring part includes the step of setting a coefficient of thermal expansion, ... 07/06/06 - 20060147683 - Flux for soldering and circuit board A flux contains resin having film forming ability, activator, solvent, and at least one complex selected from silver complex and copper complex. The flux is used when soldering is performed onto a circuit having electroless nickel plating or further having gold plating on the electroless nickel plating. Allowing a barrier ... 06/29/06 - 20060141226 - Printed circuit board and camera module A printed circuit board has a flexible portion where a covering layer is exposed, and a rigid portion provided by forming a resistant layer on a part of the covering layer. To produce a camera module, a lens unit and a CCD are affixed to the printed circuit board through ... 06/29/06 - 20060141225 - Oxygen doped firing of barium titanate on copper foil The present invention relates to a method of making an embedded capacitor and a printed wiring board includes providing a metallic foil; forming a first dielectric layer over the metallic foil; forming a conductive layer over at least a portion of the first dielectric layer; controlling an oxygen content of ... 06/15/06 - 20060127653 - Chemical etching of polycarbonate films and related applications Disclosed herein is a composition for etching a polycarbonate film comprising an alkali metal salt and an amine solubilizer. Also disclosed is a method for etching polycarbonate films with the etchant and an article containing the etched film. The article is useful for, e.g., flexible circuits and carrier tapes. ... 06/15/06 - 20060127652 - Multi-layered circuit board and manufacturing method of multi-layered circuit board There is provided a multi-layered circuit board and a manufacturing method of the multi-layered circuit board that allows electronic parts to be mounted adequately and that will not hamper performance of the electronic parts. A power terminal (pin) of an electronic part to be mounted on a surface of the ... 06/08/06 - 20060121257 - Method for producing a rewiring printed circuit board The invention relates to a method for producing a rewiring printed circuit board with a substrate wafer having passage connections between a first and a second surface. One embodiment of the method comprises applying and patterning masking layers on the first and the second surfaces, thereby uncovering a first contact ... 06/08/06 - 20060121256 - Method of fabricating printed circuit board having thin core layer Disclosed is a printed circuit board (PCB) having a thin core layer and a method of fabricating the same. In the method, a substrate, where a copper foil is formed on a release film and a prepreg, is employed as a base substrate and a core insulating layer is removed ... 06/08/06 - 20060121255 - Parallel multilayer printed circuit board having interlayer conductivity due to via ports and method of fabricating same Disclosed is a parallel multilayer printed circuit board (MLB), in which conductivity is provided to a through hole, formed through an interlayer connection layer, using a pair of via posts formed on circuit layers, and a method of fabricating the same. The parallel MLB comprises insulating layers through which a ... 06/01/06 - 20060115636 - Electromagnetic wave shield material and process for producing the same The present invention is to provide an electromagnetic wave shielding material which comprises a transparent substrate and a fine line pattern formed thereon, wherein the fine line pattern comprises a metal plating film using a physically developed metal silver as a catalytic nucleus and a process for preparing an electromagnetic ... 05/18/06 - 20060105153 - Printed circuit board and method of manufacturing the same Provided is a method of manufacturing a printed circuit board. In an embodiment, the method includes forming a prepreg layer via a reel method, forming a conductive film for forming a circuit pattern on at least one surface of the prepreg layer; and forming a predetermined circuit pattern on the ... 05/18/06 - 20060105152 - Flexible sheet for resistive touch screen A resistive touch screen, comprising: a) a substrate; b) a first conductive layer located on the substrate; c) a flexible cover sheet comprising a substantially planar surface and integral compressible spacer dots formed thereon, each integral compressible spacer dot having a base closest to the planar surface and a peak ... 05/11/06 - 20060099391 - Thermosetting resin composition, and prepreg, metal-clad laminated board and printed wiring board using the same The present invention relates to: (1) a resin thermosetting resin composition comprising: (A) a phenol-modified cyanate ester oligomer obtained by reacting a cyanate compound (a) containing two or more cyanato groups in a single molecule, and (b) a phenol compound represented by the formula (I) and/or formula (II), such that ... 05/11/06 - 20060099390 - Electronic component module The present invention is to provide a small-sized electronic component module in which RF units of a mobile phone for multi-band and multi-system are integrated at low cost. In the RF module, an RF transceiver LSI, a SAW chip, and chip components are mounted on a module board. The SAW ... 05/04/06 - 20060093799 - Wired circuit board (m represents a degree of polymerization) ... 04/27/06 - 20060088705 - Plating substrate, electroless plating method, and circuit forming method using the same An electroless copper plating method is provided having a first catalyst step of forming a first catalyst layer on a ceramic base material containing a glass component using a tin chloride solution and a palladium chloride solution; a pre-copper-plating heat treatment step of heating the ceramic base material in an ... 04/27/06 - 20060088704 - Opaque chrome coating having increased resistance to pinhole formation A substrate with a patterned opaque coating formable into an opaque aperture in one process is provided. The opaque coating includes at least a bottom layer and a top layer. The bottom and top layers each include a material selected from the group consisting of chrome and chrome oxide. The ... 04/20/06 - 20060083906 - Thick film dielectric compositions for use on aluminum nitride substrates The present invention relates to a Cd-free and Pb-free glass composition comprising, based in mol %, 1-10% MO where M is selected from Ba, Sr, Ca and mixtures thereof, 5-30% MgO, 0.3-5% CuO, 0-2.5% P2O5, 0-2.5% ZrO2, 24-45% ZnO, 2-10% Al2O3, 35-50% SiO2 and 0.1-3% A2O where A is selected ... 04/20/06 - 20060083905 - Counterfeit-proof metallic foil A counterfeit-proof metal foil is textured in at least a given partial area of its surface, this partial area having a radiation refraction value which is different compared to the remaining surface area. The metal foil is suitable as a packaging material, among others for medications. The manufacturer or the ... 04/20/06 - 20060083904 - Wiring apparatus, protecting cap for device package using the same, and a method for manufacturing them A wiring apparatus including a substrate, a via-hole penetrating the substrate, a buffer layer formed on an inner surface of the via-hole, and a plating layer filling filing the via hole inside of the buffer layer. When the wiring apparatus is applied to a protecting cap for device package, a ... 04/13/06 - 20060078715 - Bonding structure of device packaging A bonding structure of device packaging includes a first substrate and a second substrate. The surfaces of the first substrate have metal pads and a first bonding layer connected to the second substrate whose surfaces have a second bonding layer and electrodes. The first bonding layer is combined with the ... 04/06/06 - 20060073316 - Hdd suspension and its manufacture This invention relates to an HDD suspension and a process for its manufacture with high productivity and reliability. The HDD suspension of this invention is manufactured from a laminate composed of a stainless steel substrate, an insulating resin layer and a metal foil by wet-etching the laminate by the use ... 04/06/06 - 20060073315 - Metallized polyamideimide film for substrate and production method thereof Metallized polyamideimide films for use as a substrate, in which a conductive layer is adhered to a polyamideimide film at high peel strength, may be prepared in a relatively small number of steps without using a special material by treating an inorganic filler-containing polyamideimide film with an alkaline permanganate solution, ... 04/06/06 - 20060073314 - Metallized polyimide film for substrate and production method thereof Metallized polyimide films for use as a substrate, in which a conductive layer is adhered to a polyimide film at high peel strength, may be prepared in a relatively small number of steps without using a special material by treating an inorganic filler-containing polyimide film with an alkaline permanganate solution, ... 03/30/06 - 20060068181 - Deep via seed repair using electroless plating chemistry Methods of forming a continuous seed layer in a high aspect via and its associated structures are described. Those methods comprise forming a recess in a substrate, forming a non-continuous metal layer within the recess, activating the non-continuous metal layer and a plurality of non-deposited regions within the recess, electrolessly ... 03/30/06 - 20060068180 - Printed board and manufacturing method thereof In a printed board having a land as an electrode, a colored thermoplastic resin film is arranged on a land forming surface of a thermoplastic resin member so as to set a difference in light reflectivity between the land and the colored thermoplastic resin film, to be greater than that ... 03/30/06 - 20060068179 - Fuse applications of reactive composite structures In accordance with the invention, a fuse comprises a reactive composite structure to interrupt the flow of current in a circuit. The term fuse, as used herein, is intended to cover current interrupters generically and thus encompasses fuses, circuit breakers and other devices for interrupting the flow of current through ... 03/23/06 - 20060062979 - Circuit board and a power module employing the same A circuit board containing a metal-insulator composite member including an insulator substrate and a metal layer having a pattern, the composite member having an area where the spacing between a lower part of adjacent elements of the pattern on the metal layer which is in contact with the insulator is ... 03/23/06 - 20060062978 - Film forming method, electronic device and electronic apparatus A film forming method for forming a thin film pattern on a substrate, comprising a) forming the pattern of a metal base layer on the substrate by vapor-phase deposition with a mask; and b) forming a second metal film on the pattern of the metal base layer by plating the ... 03/23/06 - 20060062977 - Bonded lightweight structural sheet Laminated composites such as noise damping sheet metal sandwiches with viscoelastic adhesive cores are strengthened against delamination during forming and made more conductive for welding. Electrically conductive, metal-element containing particles, wires, wire meshes, or the like conductive bonding elements are included in the core material and fused to facing surfaces ... 03/23/06 - 20060062976 - Printed circuit board material for embedded passive devices A printed circuit board material for embedded passive devices, which has excellent electromagnetic properties and reliability is provided. The invention provides a printed circuit board material comprises: a conductive copper foil layer; a resin bonding layer formed on the conductive layer and including above 70-100 vol % of resin and ... 03/23/06 - 20060062975 - Transparent polymeric coated conductor The present invention provides a member comprising a substrate and a transparent conductive layer comprising an electronically conductive polymer of a polythiophene present in a cationic form with a polyanion-, wherein said conductive layer-has an FOM less than or equal to 50 wherein FOM is defined as the slope of ... 03/16/06 - 20060057341 - Multilayer substrate and manufacturing method thereof A multilayer substrate according to the present invention includes a plurality of laminated insulating layers and conductive patterns formed between the respective insulating layers. The conductive patterns include a first conductive pattern having a predetermined thickness and a second conductive pattern thicker than the first conductive pattern. The first and ... 03/16/06 - 20060057340 - Conductive paste multilayered board including the conductive paste and process for producing the same A conductive paste is provided, which has good conductivity and good adhesiveness to substrates and has good long-lasting stability of these properties, and which, when applied to a through-hole of a multi-layered substrate, ensures improved reliability of bonding to the end faces of conductive layers in the through-hole. Therefore, the ... 03/02/06 - 20060046035 - Method of producing base plate circuit board, base plate for circuit board, and circuit board using the base plate First, a melt of Al or a melt of an Al alloy containing Si is injected in a die filled with SiC powder and cast to form a plate member made of an Al/SiC composite. Next, an Al foil member made of an Al—Mg-based alloy is joined with the surface ... 02/23/06 - 20060040095 - Identifiable flexible printed circuit board and method of fabricating the same The invention discloses an identifiable flexible printed circuit board (PCB) and a method of fabricating the same. The identifiable flexible PCB includes a flexible substrate, a conductive layer, and a printing ink layer. First, the conductive layer is formed over a surface of the flexible substrate. Second, the printing ink ... 02/23/06 - 20060040094 - Electronic parts board and method of producing the same An electronic component substrate 1-1 includes an insulating base 10 and a flexible circuit board 20 mounted on the insulating base 10. The flexible circuit board 20 is a synthetic resin film provided thereon with terminal patterns 29 and a conductor pattern 25 whose surface is slidingly contacted with a ... 02/16/06 - 20060035067 - Film multilayer body and flexible circuity board A film laminate permitting the formation of a fine pattern and being excellent in electrical reliability is provided. The film laminate is characterized in that a plasma CVD layer of an organic metal compound and an electrically conductive layer are successively formed on at least one side of a heat-resistant ... 02/09/06 - 20060029781 - Circuitized substrate and method of making same A method of making a circuitized substrate such as a laminate chip carrier in which a polymer, e.g., Teflon, is used as a dielectric layer and a promotion adhesion layer of a polymer is used to securely adhere a conductive layer thereto which is deposited by plating. The resulting product ... 02/02/06 - 20060024481 - Jet printing of patterned metal An article comprising a substrate and a patterned electrically conductive metal phase, wherein the electrically conductive metal phase is selectively deposited on the substrate via sequential or simultaneous ink jetting of combinations of a reducible soluble metal salt, a reduction catalyst and a reducing agent. On substrates having layered structures, ... 01/26/06 - 20060019077 - Process A process for making a printed circuit board having a solder mask and area(s) of exposed metal circuitry which comprises the steps: a) applying a non-aqueous ink which is substantially free from organic solvent to a printed circuit board; b) curing the ink by exposure to actinic radiation; and c) ... 01/26/06 - 20060019076 - Method for forming highly conductive metal pattern on flexible substrate and emi filter using metal pattern formed by the method Disclosed herein is a method for forming a highly conductive metal pattern which comprises forming a metal pattern on a substrate by the use of a photocatalyst and a selective electroless or electroplating process, and transferring the metal pattern to a flexible plastic substrate. According to the method, a highly ... 01/26/06 - 20060019075 - Rigid-flexible pcb having coverlay made of liquid crystalline polymer and fabrication method thereof Disclosed are a rigid-flexible PCB and a method for fabricating the rigid-flexible PCB. Characterized by using a liquid crystalline polymer for the formation of coverlay over flexible regions, the all-layer processing method has the advantage of preventing interlayer delamination, thereby providing a highly reliable rigid-flexible PCB which thus meets the ... 01/19/06 - 20060014005 - Method for realizing a sensor device able to detect chemical substances and sensor device so obtained A method realizes a sensor device suitable for detecting the presence of chemical substances and comprises, as detection element, an active film of metallic nanoparticles able to interact with the chemical substances to determine a variation of the global electric conductivity of the film. The method includes preparing an ink ... 01/12/06 - 20060008628 - Multilayer circuit board and method for manufacturing the same It is an object of the present invention to provide a multilayer circuit board, and a method for manufacturing the same, in which a plurality of circuit boards are layered, wherein as regards at least one circuit board positioned on an outer side, a conductive substance is filled into holes ... 01/12/06 - 20060008627 - Laser enhanced plating A method of plating a substrate including coating a substrate surface, laser-treating a region of the coated surface, and plating the region. ... 01/12/06 - 20060008626 - Adhesive film exhibiting anisotropic electrical conductivity An anisotropic conductive film includes a release layer, an insulating adhesive matrix on the release layer, and conductive particles distributed in the matrix in a substantially uniform pattern. The film may also include a patterned adhesive layer on the release layer, so that the particles are positioned in a pattern ... 01/05/06 - 20060003151 - Multilayer ceramic device, method for manufacturing the same, and ceramic device There is provided a multilayer ceramic device enabling achievement of secure electric connection via electroconductive members in through holes and reduction in the thickness of internal electrodes during manufacturing. In multilayer piezoelectric device 1, a melting point of a material of the electroconductive members in the through holes is higher ... 12/22/05 - 20050281996 - Novel catalysts Nanostructured surface materials having patterned indents are and there use for catalytic, therapeutic, herbicidal, pesticidal, antibacterial and antifungal applications is disclosed. ... 12/22/05 - 20050281995 - Sheet material and wiring board In a sheet material (1), a bonding layer (2) is provided, and then a high-strength layer (3) is laminated on the bonding layer (2). The bonding layer (2) is made of an epoxy resin being a thermosetting material. The high-strength layer (3) is made of polyimide, which is not softened ... 12/22/05 - 20050281994 - Metallic material for electric or electronic parts A metallic material for electric or electronic parts containing a resin film on or over at least a part of a metallic substrate; and an electric or electronic part using the metallic material. ... 12/15/05 - 20050276958 - Electrical insulating resin composition, and laminate for circuit board Provided is an electrical insulating resin composition capable of forming an electrical insulating layer which has excellent flexibility and board adhesiveness, together with high thermal resistance and high humidity resistance, tolerates a high temperature treatment at soldering and can be stably used for a long time under a harsh environment ... 12/01/05 - 20050266214 - Wiring substrate and method of fabricating the same A wiring substrate is provided with an insulating resin film; and first and second conductive films provided on the back side and top side of the insulating resin film, respectively. The wiring substrate includes a via formed to fill a recess provided in the insulating resin film and electrically connecting ... 12/01/05 - 20050266213 - Layered board and manufacturing method of the same, electronic apparatus having the layered board A layered board includes a core layer that serves as a printed board, a buildup layer that is electrically connected to the core layer, the buildup layer including an insulation part and a wiring part, and a junction layer that electrically connects and bonds the core layer with the buildup ... 12/01/05 - 20050266212 - Layered board and manufacturing method of the same, electronic apparatus having the layered board A manufacturing method of a layered board that includes a core layer that serves as a printed board, and a buildup layer that is electrically connected to said core layer, said buildup layer including an insulation part and a wiring part includes the step of setting a coefficient of thermal ... 11/24/05 - 20050260391 - Wired circuit board A wired circuit board on which a highly reliable conductor pattern is formed, to allow an electronic component to be mounted on it with improved accuracy. An insulating layer 3 is formed on a metal supporting layer 2 having a degree of surface brilliancy of 150-500% in such a manner ... 11/17/05 - 20050255304 - Aligned nanostructure thermal interface material The invention relates to a thermal interface material comprising aligned nanostructures to increase the thermal conductivity of an electronic assembly. Aligned carbon nanotubes are a particularly suitable nanostructure possessing very high thermal conductivity. The novel use of nanostructures in the invention is particularly applicable to solving the issues of thermal ... 11/17/05 - 20050255303 - Multilayer substrate including components therein Components having different heights are installed in a multilayer substrate using a metal core layer formed by bonding a plurality of metal layers. The metal core layer includes through-holes and a spot-faced portion. Passive components and an active component are disposed in the through-holes and the spot-faced portion, respectively. These ... 11/17/05 - 20050255302 - Printed circuit board A printed circuit board. The printed circuit board includes a patterned bottom layer, at least one core layer and one insulating layer laminated on the bottom layer. A correspondingly patterned conductive layer is on the patterned bottom layer, with the core layer and the insulating layer therebetween. The patterned conductive ... 11/10/05 - 20050249927 - Copper foil for high-density ultra-fine printed wiring board The present invention is to provide an ultra-thin copper foil with a carrier which comprises a release layer, a diffusion preventive layer and a copper electroplating layer laminated in this order, or a diffusion preventive layer, a release layer and a copper electroplating layer laminated in this order on the ... 11/03/05 - 20050244622 - Method for processing by laser, apparatus for processing by laser, and three-dimensional structure A laser processing method where laser beam for processing is irradiated on a processing object and the laser beam for processing directly removes a part of the processing object. The processing object is made of a glass substrate, metal thin film having high absorption to laser beam for processing is ... 11/03/05 - 20050244621 - Printed circuit board and method for processing printed circuit board The invention is to provide a printed circuit board in which advance of packaging density of the printed circuit board and reduction in production cost can be attained while processing quality can be made uniform, a method for processing the printed circuit board and a method for producing the printed ... 11/03/05 - 20050244620 - Wired circuit board and production method thereof A wired circuit board which is formed so that even when a wired circuit pattern is formed at a fine pitch and then a tin plating layer is formed on the wired circuit pattern by the electroless tin plating, a wiring of the wired circuit pattern can be prevented from ... 10/27/05 - 20050238859 - Metal member-buried ceramics article and method of producing the same A metal member-buried ceramics article which can uniformalize adsorption force or adsorption force and distribution of temperature in plane, decrease pollution of a semiconductor wafer, and suppress warping of the whole body is provided. This article has a three layer structure comprising, between an upper layer 2 and a lower ... 10/27/05 - 20050238858 - Printed circuit board A PCB that can transmit a high frequency signal of a GHz band with a low loss includes an insulator and magnetic nanoparticles dispersed in the insulator. ... 10/27/05 - 20050238857 - Laminated glazing panel A laminated glazing panel is disclosed comprising two glass plies and a plastic ply having one or more light emitting diodes mounted on a circuit board laminated between the glass plies, forming an LED device. The circuit board is ordinarily a flexible circuit board comprising a substrate (of, for example, ... 10/20/05 - 20050233122 - Manufacturing method of laminated substrate, and manufacturing apparatus of semiconductor device for module and laminated substrate for use therein The invention presents a manufacturing method of laminated substrate capable of realizing small size of portable electronic appliances. Prepreg 141 is a thermosetting resin which holds a plate form in first temperature range, has a thermal fluidity in second temperature range, and is cured in third temperature range, and integrating ... 10/13/05 - 20050227052 - Semi-suspended coplanar waveguide on a printed circuit board A printed circuit board includes two differential signal traces, a layer of core material, a layer of filler material, and a ground plane. The filler material is replaced by an air core under the differential signal traces. ... 10/06/05 - 20050221068 - Multilayer ceramic substrate and method for manufacture thereof A multilayer ceramic substrate which is obtained by firing multilayers of ceramic green sheets each having a dielectric layer, made of a glass-ceramic material comprising a mixture of alumina and a glass containing at least Si and Ca, and an electrode layer made of Ag and formed on the dielectric ... 10/06/05 - 20050221067 - High-efficiency thermal conductive base board A high-efficiency thermal conductive base board for electrical connection with an electronic component includes a metal oxide layer formed on the metal substrate, and a plurality of conductive contacts formed on the metal oxide layer for electrical connection with the electronic component. ... 10/06/05 - 20050221066 - Carrier substrate with a thermochromatic coating Numerous embodiments of a carrier substrate having thermochromatic materials are described. In one embodiment of the present invention, a carrier substrate has a visible surface, and a thermochromatic material is disposed near the carrier substrate. The thermochromatic material produces a visual change of the visible surface when an activation temperature ... 09/29/05 - 20050214517 - Multilayer electronic component and manufacturing method thereof A multilayer electronic component is composed of a ceramic body obtained by laminating a plurality of ceramic layers via a conductor layer. The conductor layer is a plated film and extracted to one end face of the ceramic body, thereby contributing to the formation of capacity. A peripheral edge portion ... 09/29/05 - 20050214516 - Multi-layer ceramic substrate and manufacturing method thereof A multi-layer ceramic substrate is formed of a plurality of glass-ceramic layers. The glass-ceramic layers (partly not shown) contain amorphous glass and alumina (Al2O3), and interconnection patterns of silver are formed in the surfaces of the glass-ceramic layers. The amorphous glass is anorthite (CaAl2Si2O8), for example. With the multi-layer ceramic ... 09/22/05 - 20050208280 - Microelectronic device interconnects A microelectronic assembly including a plurality of conductive columns extending from a bond pad of a microelectronic device and a conductive adhesive on a land pad of a carrier substrate electrically attached to the conductive columns. ... 09/22/05 - 20050208279 - Items made of wear resistant materials An item made of wear resistant material, the item, in certain aspects, made by a method including forming a mass of wear resistant material, the wear resistant material comprising at least one element from the group consisting of arsenic, antimony, cerium and bismuth, wherein the at least one element is ... 09/22/05 - 20050208278 - Method for improving bonding of circuit substrates to metal and articles formed thereby A method of forming a circuit material comprises disposing an adhesion promoting elastomer composition between a conductive copper foil and a thermosetting composition; and laminating the copper foil, adhesion promoting composition, and thermosetting composition to form the circuit material. The adhesion promoting layer may be uncured or partially cured before ... 09/15/05 - 20050202222 - High dielectric constant composition and method of making same Dielectric material compositions comprising HfO2 and a second compound are disclosed. The compositions are characterized by at least a part of the compositions being in a cubic crystallographic phase. Further, semiconductor based devices comprising such dielectric material compound and method for forming such compounds are disclosed. ... 09/15/05 - 20050202221 - Semiconductor chip capable of implementing wire bonding over active circuits A reinforced bonding pad structure includes a bondable metal layer defined on a stress-buffering dielectric layer, and an intermediate metal layer damascened in a first inter-metal dielectric (IMD) layer disposed under the stress-buffering dielectric layer. The intermediate metal layer is situated directly under the bondable metal layer and is electrically ... 09/08/05 - 20050196596 - Solid-state electric device A solid state electric device includes a templated charge-carrier-transporting channel layer interposed between a pair of conductive substrates. The templated charge-carrier-transporting channel layer is made of a layer of a first charge-carrier-transporting material having one or more regions defined using templating techniques, in which regions a second charge-carrier-transporting material is ... 09/08/05 - 20050196595 - Methods for coating surfaces with metal and products made thereby According to the process for coating metal substrates, a light-sensitive (or photo-sensitive) bonding material, such as an emulsion or a photopolymer film, is used to adhere metal directly to a substrate to provide various forms of metal coatings on the substrate. The light-sensitive bonding material is generally applied directly between ... 09/01/05 - 20050191473 - Wired circuit board In order to provide a wired circuit board capable of enhancing the connection reliability and reducing the cost, in a wired circuit board including an insulating base layer, a conductor layer formed on the insulating base layer, and an insulating cover layer formed on the conductor layer and having an ... 08/25/05 - 20050186406 - Multi-layer printed circuit board and method for manufacturing the same A multi-layer printed circuit board includes an insulation substrate; a surface conductive pattern disposed on a surface of the insulation substrate; and an inner conductive pattern embedded in the insulation substrate. The surface conductive pattern has a surface roughness on an insulation substrate side, the surface roughness of the surface ... 08/25/05 - 20050186405 - Microcontact printing method using imprinted nanostructure and nanostructure thereof A microcontact printing method using an imprinted nanostructure is provided, wherein the microcontact printing is introduced to a nanoimprint lithography process to pattern a self-assembled monolayer (SAM) The method includes forming a nanostructure on a substrate by using the nanoimprint lithography process; and patterning the nanostructure with the microcontact printing ... 08/25/05 - 20050186404 - Etched polycarbonate films Disclosed herein is a composition for etching a polycarbonate film comprising an alkali metal salt and an amine solubilizer. Also disclosed is a method for etching polycarbonate films with the etchant and an article containing the etched film. The article is useful for, e.g., flexible circuits and carrier tapes. ... 08/18/05 - 20050181191 - Semiconductor copper bond pad surface protection Electronic packages with uninsulated portions of copper circuits protected with coating layers having thicknesses that are suitable for soldering without fluxing and are sufficiently frangible when being joined to another metal surface to obtain metal-to-metal contact between the surfaces. ... 08/18/05 - 20050181190 - Sheet made of high molecular material and method for making same A method for making a macromolecular laminate is disclosed. Firstly, polyurethane resin with solid content higher than 50% is mixed with additives in order to form polyurethane resin compound that is liquid at the normal temperature. Then, the polyurethane resin compound is coated on releasing paper and dried. Then, the ... 08/11/05 - 20050175826 - Treated copper foil and circuit board An object of the present invention is to provide a treated copper foil laminated with a mesomorphic polymer film having low hygroscopicity and superior high thermal resistance to make a circuit board composite materials having large peel strength and compatibility with fine pattern processes, which a copper foil being deposited ... 08/11/05 - 20050175825 - Fibre reinforced heat element Further, a method is provided for manufacturing of a fibre reinforced laminated resistance element. In the method, at least one resistance element (1) is arranged together with at least one layer of a mat of reinforcement fibres (25) and thermoplastic fibres (26) in a mould, and the resistance elemetn (1) ... 08/11/05 - 20050175824 - Method for forming multilayer circuit structure and base having multilayer circuit structure The invention relates to a method for forming a multilayer circuit structure and to a substrate having a multilayer circuit structure. Its object is to increase the adhesion of the conductor circuit layer while the surface of the electrical insulating layer is kept smooth. A curable composition film containing an ... 07/28/05 - 20050163982 - Circuit substrate for packaging semiconductor device, method for producing the same, and method for producing semiconductor device package structure using the same The invention is intended for providing a semiconductor package structure which prevents degradation in characteristics of a semiconductor device, and breakage of interconnections, when the semiconductor device is packaged on a circuit substrate. In the package structure having the semiconductor device mounted on the circuit substrate, bump electrodes of the ... 07/28/05 - 20050163981 - Method for bonding ceramic to copper, without creating a bow in the copper An electronic device and method of forming said device are presented, in which the device comprises a base having a pair of elongate flanges and a channel portion defined therebetween, wherein the channel portion has a substantially planar first surface, and wherein the pair of flanges extend generally perpendicularly from ... 07/21/05 - 20050158529 - Tin-silver coatings The present invention relates to improved coatings for electrical or electronic connectors such as contacts or terminals used in automotive applications. Coatings in accordance with the present invention preferably comprise binary tin-silver coatings consisting of more than 1.0 wt % to about 20 wt %, preferably from 2.0 wt % ... 07/21/05 - 20050158528 - Wiring substrate A substrate is provided on which wires can be formed satisfactorily using a dispersion liquid of metal microparticles without causing disconnection or short circuit. The wiring substrate comprises a substrate, an organic membrane formed on the substrate, and a metal wire formed on the organic membrane. An arithmetic mean deviation ... 07/21/05 - 20050158527 - Metal-containing resin particle, resin particle, electronic circuit substrate, and method of producing electronic circuit According to one mode of the present invention, metal-containing resin particles comprising a resin containing a thermosetting resin at 50 wt % or more and having a rate of moisture absorption from 500 to 14500 ppm, and fine metal particles contained in the resin, is provided. ... 07/14/05 - 20050153116 - Method for fabricating semiconductor device A method of fabricating a semiconductor device is provided, by which oxide on a Cu surface after via-etch can be removed using Hf (hafnium) as a barrier material. The method includes the steps of forming a Cu line in at least one protective insulating layer on a substrate, forming a ... 07/07/05 - 20050147801 - Use of gold surface finish on a copper wire-bond substrate, method of making same, and method of testing same A wire-bonding substrate is described. The wire-bonding substrate includes a copper metallization and a gold surface finish disposed above and on the copper metallization. The gold surface finish completes a structure that includes at least one of a bond finger for wire bonding of a first side of the substrate, ... 06/23/05 - 20050136231 - Printed circuits on shrink film Methods of creating fine featured circuits by printing a circuit trace onto polymer shrink films or other biaxially-oriented polymer films are disclosed. The shrink films are heated and shrunk after printing, annealing the circuit trace to form conductive features. Compositions suitable for printing onto the films and articles made using ... 06/16/05 - 20050129917 - Apparatus and method for manufacture of multilayer metal products Apparatus for manufacturing multi-layer metal feedstock material for stamping shaped parts eliminates the need for rolls of metal at the stamping site. Multilayer metal feedstock material is assembled from multiple rolls of metal stock, then folded in a zig zag fashion, or “Z-fold” configuration, whereby the multilayer metal assembly is ... 06/02/05 - 20050118403 - Electrical member, electrical device, and method of manufacturing the electrical member and electrical device To provide: an electrical member which can effectively apply characteristics of a carbon nanotube such as an electrode; and an electrical device such as an electrical switch. To provide: an electrical member provided with an electrical contact formed on a base body, in which the electrical contact has a carbon ... 06/02/05 - 20050118402 - Camouflage covering A covering for application on surfaces of a structure, includes at least one sheet including a plurality of components, each component being capable of protecting the structure against detection by at least one sensing method. The sheet can have an adhesive exterior surface whereby it can be adhered to the ... ### FreshPatents.com Support |