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Coating Processes > Immersion Or Partial Immersion > Metal Base > Metal Coating > Chemical Compound Reducing Agent Utilized (i.e., Electroless Deposition) Chemical Compound Reducing Agent Utilized (i.e., Electroless Deposition)Chemical Compound Reducing Agent Utilized (i.e., Electroless Deposition) patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.04/26/07 - 20070092658 - Electroless plating apparatus and electroless plating method An electroless plating apparatus can form a protective film on exposed surfaces of embedded interconnects stably with good selectivity for thereby protecting the interconnects. The electroless plating apparatus includes a magnetic removal portion for magnetically removing small magnetic suspended solids in an electroless plating solution which have not been removed ... 03/29/07 - 20070071904 - Electroless copper plating solution and electroless copper plating method An object is to provide an electroless copper plating solution that realizes uniform plating at lower temperatures, when the electroless copper plating is performed on a semiconductor wafer or other such mirror surface on which a plating reaction hardly occurs. An electroless copper plating solution, wherein, along with a first ... 10/19/06 - 20060233963 - Method for electroless plating and metal-plated article It is an object to provide a method for metal plating with good adhesion to materials that are difficult to plate. The present invention is a metal plating method wherein a material to be plated is surface treated with a silane coupling agent having in a molecule thereof a functional ... 10/12/06 - 20060228489 - Method for manufacturing metallic microstructure The present invention discloses a method for forming a metallic microstructure on a patterned surface of a substrate by a nonisothermal deposition (NTID) in an electroless plating solution. The substrate is immersed in the solution being heated by a heating device mounted on a bottom of an electroless plating reactor ... 10/12/06 - 20060228488 - Method for preparing copper interconnectors of an ulsi A method for depositing a copper layer on a substrate is disclosed. The method is achieved by heating a plating solution located between a heating device and a target substrate. Through the process illustrated above, metal nano-particles come out from the plating solution and deposit on a substrate with high ... 08/24/06 - 20060188659 - Cobalt self-initiated electroless via fill for stacked memory cells A method for electrolessly filling a stacked memory cell interconnect feature comprising electroless deposition from a composition comprising Co ions and a reducing agent by bottom-up filling initiated by reduction to Co metal on an electrically conducting bottom of the feature. An electroless deposition composition for electrolessly depositing Co in ... 02/02/06 - 20060024447 - Electroless plating with nanometer particles The addition of nanometer particles to electroless metal plating baths reduces or eliminates seeding in the electroless plating baths. The reduced seeding results in less inclusions or pitting in the coating. Usually the maintenance and frequent tank-cleaning schedule can be increased beyond the normal 2-3 day. The properties of the ... 07/21/05 - 20050158478 - Substrate processing apparatus and substrate processing method A substrate processing apparatus has a processing tank (10) for plating a substrate (W) in a plating solution (Q) holds therein, a cover (40) for selectively opening and closing an opening (11) of the processing tank (10), a spraying nozzle (60) mounted on an upper surface of the cover (40), ... 07/07/05 - 20050147762 - Method to fabricate amorphous electroless metal layers A metal alloy capping layer containing a group VIII metal and silicon, carbon, or nitrogen may be used to protect copper interconnects of integrated circuits from oxidation and to prevent the electromigration of copper interconnects while at the same time not effecting the performance of integrated circuit. Methods of incorporating ... 06/23/05 - 20050136193 - Selective self-initiating electroless capping of copper with cobalt-containing alloys Embodiments of the invention generally provide compositions of plating solutions, methods to mix plating solutions and methods to deposit capping layers with plating solutions. The plating solutions described herein may be used as electroless deposition solutions to deposit capping layers on conductive features. The plating solutions are rather dilute and ... ### FreshPatents.com Support |