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Coating Processes > With Pretreatment Of The Base > Preapplied Reactant Or Reaction Promoter Or Hardener (e.g., Catalyst, Etc.) > Metal Coating (e.g., Electroless Deposition, Etc.) > Nickel, Copper, Cobalt, Or Chromium Coating Nickel, Copper, Cobalt, Or Chromium CoatingNickel, Copper, Cobalt, Or Chromium Coating patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.03/01/07 - 20070048447 - System and method for forming patterned copper lines through electroless copper plating A method for forming copper on a substrate including inputting a copper source solution into a mixer, inputting a reducing solution into the mixer, mixing copper source solution and the reducing solution to form a plating solution having a pH of greater than about 6.5 and applying the plating solution ... 06/08/06 - 20060121200 - Electroless plating of piezoelectric ceramic Methods of electroless plating piezoelectric ceramic with copper metal, include contacting a copper halide salt with an electroless plating solution to form a mixture and contacting the piezoelectric ceramic with the mixture. ... 10/13/05 - 20050227007 - Volatile copper(i) complexes for deposition of copper films by atomic layer deposition The present invention relates to novel 1,3-diimine copper complexes and the use of 1,3-diimine copper complexes for the deposition of copper on substrates or in or on porous solids in an Atomic Layer Deposition process. ... 08/18/05 - 20050181135 - Methods and systems for processing a microelectronic topography Methods and systems are provided which are adapted to process a microelectronic topography, particularly in association with an electroless deposition process. In general, the methods may include loading the topography into a chamber, closing the chamber to form an enclosed area, and supplying fluids to the enclosed area. In some ... 08/18/05 - 20050181134 - Methods and systems for processing a microelectronic topography Methods and systems are provided which are adapted to process a microelectronic topography, particularly in association with an electroless deposition process. In general, the methods may include loading the topography into a chamber, closing the chamber to form an enclosed area, and supplying fluids to the enclosed area. In some ... ### FreshPatents.com Support |