REGISTER now for FREE 
|
FREE patent keyword monitoring and additional FREE benefits. REGISTER now for FREE
|
|
|
Coating Processes > Electrical Product Produced > Integrated Circuit, Printed Circuit, Or Circuit Board > Immersion Metal Plating From Solution (e.g., Electroless Plating, Etc.) Immersion Metal Plating From Solution (e.g., Electroless Plating, Etc.)Immersion Metal Plating From Solution (e.g., Electroless Plating, Etc.) patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.06/14/07 - 20070134406 - Method of using ultrasonics to plate silver A method of reducing solder mask interface attack in a process of fabricating printed circuit boards. The method comprises the steps of providing a printed circuit board with a solder mask applied thereon and treating the printed circuit board with an immersion plating solution, wherein the immersion plating solution is ... 05/24/07 - 20070116864 - Metal layer formation method for diode chips/wafers An electroless plated metal layer formation method for forming a metal layer on a diode chip/wafer for wire bonding is disclosed to include the step of forming a metal base material on a diode chip/wafer adapted for inducing a reduction system to cause a catalytic reaction at location(s) where the ... 12/28/06 - 20060292294 - Electroless plating bath composition and method of use An electroless plating composition comprising succinic acid, potassium carbonate, a source of cobalt metal ions, a reducing agent, and water is provided. An optional buffering agent may also be included in the composition. The composition may be used to deposit cobalt metal in or on semiconductor substrate surfaces including vias, ... 12/14/06 - 20060280860 - Cobalt electroless plating in microelectronic devices An electroless plating method and composition for depositing Co or Co alloys onto a metal-based substrate in manufacture of microelectronic devices, involving a source of Co ions, a reducing agent for reducing the depositions ions to metal onto the substrate, and an oxime-based compound stabilizer. ... 11/09/06 - 20060251801 - In-situ silicidation metallization process Embodiments of the invention provide a simplified method of filling contact level features formed in a semiconductor device. In general the method includes a novel method of forming a contact level feature that contains a silicide interface and a tungsten CVD deposited layer. The processes discussed below are less complex ... 11/09/06 - 20060251800 - Contact metallization scheme using a barrier layer over a silicide layer Embodiments of the invention generally provide methods of filling contact level features formed in a semiconductor device by depositing a barrier layer over the contact feature and then filing the layer using an PVD, CVD, ALD, electrochemical plating process (ECP) and/or electroless deposition processes. In one embodiment, the barrier layer ... 11/02/06 - 20060246217 - Electroless deposition process on a silicide contact Embodiments as described herein provide methods for depositing a material on a substrate during electroless deposition processes, as well as compositions of the electroless deposition solutions. In one embodiment, the substrate contains a contact aperture having an exposed silicon contact surface. In another embodiment, the substrate contains a contact aperture ... 01/19/06 - 20060013947 - Method for manufacturing wiring board A method for manufacturing a wiring board includes electroless plating wiring patterns provided on a base substrate and cleaning the base substrate. The step of cleaning the base substrate includes at least either using an alkaline solvent or using an acid solvent. ... 07/14/05 - 20050153061 - Interconnect circuitry, multichip module, and methods for making them Methods of electroless plating metal on a dielectric material includes dipping the dielectric in a solution containing attractive catalytic metal particles and a metal salt solution. A thicker metallic layer can be deposited on top of the resulting layer by electroplating. Electrical circuits and multichip modules including such circuits can ... ### FreshPatents.com Support |