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Coating Processes > Electrical Product Produced > Integrated Circuit, Printed Circuit, Or Circuit Board > Vapor Or Gas Deposition Vapor Or Gas DepositionVapor Or Gas Deposition patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.03/01/07 - 20070048438 - Thermochromic coatings The present invention provides the use of atmospheric pressure chemical vapour deposition (APCVD) for producing a film of thermochmmic transition metal-doped vanadium (iN) oxide on a substrate. Specifically, the invention prevides a method of producing a film of thermochromic transition metal-doped vanadium (IV) oxide on a substrate by atmospheric pressure ... 12/28/06 - 20060292293 - Method and apparatus for forming multi-layered circuit pattern In the process of forming, on a substrate, a multi-layered circuit pattern with layers each having a portion made of the same material throughout the different layers in the direction in which the different layers are stacked, the position of nozzles with respect to the substrate when at least one ... 08/17/06 - 20060182878 - Method of producing electronic device To provide a method of producing an electronic device which can improve the durability of the device without reducing the initial performance of the device. The method of the present invention is a method of producing an electronic device including: a first organic layer formation step of forming a first ... 07/13/06 - 20060153973 - Ruthenium layer formation for copper film deposition In one embodiment, a method for forming a material on a substrate is provided which includes positioning a substrate containing a dielectric material having vias formed therein within a process chamber, forming a barrier layer within the vias and on the dielectric material during a barrier deposition process, forming a ... 01/26/06 - 20060019027 - Method for forming microelectronic spring structures on a substrate A method for fabricating microelectronic spring structures is disclosed. In an initial step of the method, a layer of sacrificial material is formed over a substrate. Then, a contoured surface is developed in the sacrificial material, such as by molding the sacrificial material using a mold or stamp. The contoured ... ### FreshPatents.com Support |