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Coating Processes > Electrical Product Produced > Integrated Circuit, Printed Circuit, Or Circuit Board Integrated Circuit, Printed Circuit, Or Circuit BoardIntegrated Circuit, Printed Circuit, Or Circuit Board patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.08/02/07 - 20070178228 - Method for fabricating a pcb A method for forming a metal layer on a substrate begins by providing a resin film on the substrate. An organic photo conductor layer having charged and uncharged segments is adhered to the resin film. Metal powder is deposited onto the charged segments of the organic photo conductor layer after ... 07/05/07 - 20070154626 - Wiring substrate A substrate is provided on which wires can be formed satisfactorily using a dispersion liquid of metal microparticles without causing disconnection or short circuit. The wiring substrate comprises a substrate, an organic membrane formed on the substrate, and a metal wire formed on the organic membrane. An arithmetic mean deviation ... 05/24/07 - 20070116862 - Semiconductor device having resin anti-bleed feature A device and a method for controlling resin bleed, the device comprising a substrate having a surface, wherein an interior region, a peripheral region, and an exterior region of the surface are generally defined. An adhesive generally resides on the surface of the substrate in the peripheral region thereof, wherein ... 05/17/07 - 20070110893 - Method of forming structures using drop-on-demand printing A method and apparatus are described for forming a structure on a substrate. The structure may be a circuit element. The method uses a digital specification 910 for forming the structure, including specifications for printing and curing. The structure is printed (step 112) using a drop-on-demand printer 400, wherein the ... 05/03/07 - 20070098882 - Electronic substrate, electronic circuit, and method and device for manufacturing of the same This device for manufacture of an electronic circuit forms a desired circuit pattern P by permeating liquid material (10, 40) including a material for circuit pattern formation into a permeable electronic substrate (100). This device for manufacture comprises an ink jet type head (20, 50) which discharges liquid material (10, ... 12/07/06 - 20060275541 - Systems and method for fabricating substrate surfaces for sers and apparatuses utilizing same The present invention is related in general to chemical and biological detection and identification and more particularly to systems and methods for the rapid detection and identification of low concentrations of chemicals and biomaterials using surface enhanced Raman spectroscopy. ... 10/05/06 - 20060222760 - Process for producing a multifunctional dielectric layer on a substrate A multifunctional dielectric layer can be formed on a substrate, especially on an exposed metallic strip conductor system on a substrate. An additional metal layer is formed across the surface of the exposed metal strip conductors. The metal layer is then at least partially converted to a nonconducting metal oxide, ... 09/21/06 - 20060210705 - Method for forming fine copper particle sintered product type of electric conductor having fine shape, method for forming fine copper wiring and thin copper film using said method The present invention provides a process for forming a copper fine particle sintered product type of a fine-shaped electric conductor showing superior electroconductivity, which comprises steps of drawing a fine pattern with the use of a dispersion containing the copper fine particles having a surface oxide film layer, conducting a ... 09/14/06 - 20060204650 - Electrical connector structure of circuit board and method for fabricating the same An electrical connector structure of circuit board and a method for fabricating the same are proposed. A circuit board having a conductive layer is formed with a first resist layer and a second resist layer thereon, so as to form electrical connection pads and metal bumps on the electrical connection ... 08/31/06 - 20060193970 - Rigid flexible printed circuit board and method of fabricating same A rigid flexible printed circuit board (PCB) and a method of fabricating the same. Since a polyimide copper clad laminate is not used during the fabrication of the rigid flexible PCB, an increase in cost resulting from use of the polyimide copper clad laminate and poor reliability of adhesion at ... 06/15/06 - 20060127567 - Wiring pattern formation method, manufacturing method for multi layer wiring substrate, and electronic device A wiring pattern formation method in which a wiring pattern is formed by arranging, in a region which is demarcated by a partition wall, liquid material which includes an electrically conductive material, including: arranging a resin material around the periphery of a region upon which the wiring pattern is to ... 06/01/06 - 20060115582 - Method for manufacturing printed wiring board A method for manufacturing a printed wiring board, including the steps of: forming a thermosetting resin layer so as to fill the spaces between circuit patterns formed on the printed wiring board; heating and curing the resin layer in a reduced pressure chamber in which the pressure is reduced while ... 03/16/06 - 20060057280 - Method for producing a circuit A method for producing a printed circuit, including at least the following steps: feeding different colloid inks to different printing nozzles of at least one print head, the colloid inks each containing a printing carrier and particles of a basic substance; printing individual droplets of the different colloid inks onto ... 03/02/06 - 20060045963 - Method of forming wiring pattern and method of forming gate electrode for tft The invention provides a method of forming a wiring pattern in which a conductive material layer is formed in a pattern formation region having a first region, which is bordered by a bank pattern and has a first width, and a second region, which touches the first region and has ... 03/02/06 - 20060045962 - Method of manufacturing multi-layered wiring board, electronic device, and electronic apparatus There provided a method of manufacturing a multi-layered wiring board having at least two conductor layers, an interlayer insulation layer provided between the conductor layers, and a conductor post that electrically connects the conductor layers, on a substrate. In the method, the conductor post is formed by repeatedly performing: coating ... 02/09/06 - 20060029727 - Systems and methods affecting profiles of solutions dispensed across microelectronic topographies during electroless plating processes A method is provided which includes dispensing a deposition solution at a plurality of locations extending different distances from a center of a microelectronic topography each at different moments in time during an electroless plating process. An electroless plating apparatus used for the method includes a substrate holder, a moveable ... 02/09/06 - 20060029726 - Method of fabricating pcb in parallel manner Disclosed is a method of fabricating a multilayer PCB (MLB). More particularly, the present invention relates to a method of fabricating a multilayer PCB, in which plural circuit layers having insulating layers attached thereto and another circuit layer having no insulating layer are formed in a parallel manner according to ... 02/02/06 - 20060024428 - Method and apparatus for manufacturing laminate for flexible printed circuit board having metal plated layer using vacuum deposition Disclosed herein is a method of manufacturing a laminate for a flexible printed circuit board, including surface treating a base film, forming a tie layer on the base film, forming a metal conductive layer on the tie layer, and depositing a metal on the metal conductive layer by radiating electronic ... 01/05/06 - 20060003090 - Parylene-based flexible multi-electrode arrays for neuronal stimulation and recording and methods for manufacturing the same Method for manufacturing a parylene-based electrode array that includes an underlying parylene layer, one or more patterned electrode layers comprising a conductive material such as a metal, and one or more overlying parylene layers. The overlying parylene is etched away or otherwise processed to expose the electrodes where stimulation or ... 12/15/05 - 20050276911 - Printing of organometallic compounds to form conductive traces A method of forming a desired conductive trace layout on a substrate, comprising the steps of: printing an organometallic compound onto the substrate in the desired conductive trace layout using a printer, the organometallic compound substantially transparent to electromagnetic radiation which is at least in part absorbed by the substrate; ... 12/01/05 - 20050266154 - Apparatus for forming a circuit Methods and apparatuses for forming components or circuits by ejecting a fluid including materials in a single ligament are disclosed. ... 11/24/05 - 20050260338 - Method of manufacturing circuit layout on touch panel by utilizing metal plating technology The present invention is to provide a method of manufacturing a circuit layout on a touch panel by utilizing metal plating technology, comprising uniformly coating a conductive metal or conductive oxidized metal on predetermined areas proximate edges of a transparent conductive layer on a transparent glass substrate for forming a ... 11/17/05 - 20050255233 - High aspect ratio c-mems architecture C-MEMS architecture having high aspect ratio carbon structures and improved systems and methods for producing high aspect ratio C-MEMS structures are provided. Specifically, high aspect ratio carbon structures are microfabricated by pyrolyzing a patterned carbon precursor polymer. Pyrolysing the polymer preferably comprises a multi-step process in an atmosphere of inert ... 11/17/05 - 20050255232 - Method, system, and apparatus for protective coating a flexible circuit A process for applying a protective coating to a flex circuit comprises providing a flex circuit having conductive traces on one surface and applying a protective coating in substantially a liquid state to the one surface from a first roller including the protective coating in a pattern thereon. The pattern ... 09/08/05 - 20050196529 - Resin coating method and apparatus A resin coating method for applying resin to a predetermined region of a wiring board includes the steps of imaging an external appearance of the resin extruded from a resin application device; and automatically adjusting an amount of the resin extruded from the resin application device based on the external ... 08/25/05 - 20050186332 - Production method of suspension board with circuit In order to provide a new production method of a suspension board with circuit capable of preventing deterioration of the outward appearance and defects in products caused by a metal supporting layer, and further capable of forming an electroless nickel plating layer having an even thickness in a reliable manner, ... 08/04/05 - 20050170077 - Adhesion method A primer composed of a polymer solution is applied to a roughened metal surface, and a polymer material such as a pre-preg is applied to the treated metal surface to form a bond between the metal and the polymer material. ... 07/28/05 - 20050163919 - Fast production method for printed board A high-speed production method of a printed circuit board comprising the steps of, melting and jet-spraying a solid ink on an insulating substrate to be patterned, leaving portions corresponding to an image part unsprayed, coating a side of the insulating substrate patterned with a conductive layer, and removing solid ink ... 07/21/05 - 20050158456 - Method and apparatus for making devices A method and an apparatus for manufacturing a device are provided. The method and the apparatus can form micro wiring without undesired wetting and spreading using an inexpensive functional-liquid supplying method. A method for forming a device, such as a radiofrequency identification tag, includes: making patterns at a plurality of ... 07/21/05 - 20050158455 - Method of producing multilayer interconnection board A method of producing a multilayer interconnection board is disclosed that includes the steps of processing a resin member on an interconnection layer by imprinting press, and removing residue of the resin member at the bottom of a via hole after forming the via hole. In the method of producing ... 07/14/05 - 20050153060 - Structure and method of embedding components in multi-layer substrates A method for producing a circuit board having an integrated electronic component comprising providing a circuit board substrate having a first substrate surface and a second substrate surface, securing an integrated electronic component to the first substrate surface, and disposing a first dielectric layer on the first substrate surface and ... 07/14/05 - 20050153059 - Partial plating method, partially-plated resin base, method for manufacturing multilayered circuit board Disclosed is a partial plating process for forming a patterned plating layer on a surface of a resin substrate. The partial plating process of the present invention comprises the following steps: subjecting the surface of the resin substrate to oxidation treatment, causing a compound, which has a structure capable of ... 07/07/05 - 20050147740 - Method of applying a cover layer to a structured base layer A method for applying a cover layer (1) to a base layer (2) which is provided with structuring (3) determined, for example, by printed conductors. The base layer (2) is moved continuously at a feed rate (v) in continuous operation. A guide (4) constructed as a rotatable body, brings the ... 06/09/05 - 20050123677 - System, method and apparatus for optimizing power delivery and signal routing in printed circuit board design A system, method and apparatus for providing a printed circuit board having optimized power delivery planes and signal routing regions are disclosed. In one aspect, the present disclosure teaches a printed circuit board having two or more cores coupled together using a prepreg sheet having selected regions of increased permittivity. ... ### FreshPatents.com Support |