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Optical Waveguides > With Disengagable Mechanical Connector > Optical Fiber To A Nonfiber Optical Device Connector > With Housing > Sealed From Environment Sealed From EnvironmentSealed From Environment patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.03/08/07 - 20070053639 - Optical module An optical module includes an optical connector on one end of a package for storing a carrier including an optical element, and a laminated ceramic feedthrough disposed on the other end of the package. The feedthrough includes on an outer surface an electrical terminal perpendicular to the optical axis of ... 02/15/07 - 20070036496 - Bonding methods and optical assemblies Provided are methods of chemically bonding a first object to a second object with a bonding agent that includes magnesium. Also provided are methods of bonding a component in an optical assembly, as well as optical assemblies. The invention finds particular applicability in the optoelectronics industry in forming micro-optical assemblies. ... 11/09/06 - 20060251363 - Lens cap A lens cap having a lens formed in the window at its top portion, used for a semiconductor laser, etc., using an aspherical lens instead of a spherical lens with large aberration. This invention proposes a lens cap having an aperture formed at its top portion, comprising a lens formed ... 02/16/06 - 20060034571 - Laser module with sealed packages having reduced total volume In a laser module in which laser beams emitted from semiconductor laser elements are collimated by collimator lenses, and condensed by an optical condensing system so that the laser beams converge at a light-entrance end face of an optical fiber. The semiconductor laser elements and the collimator lenses are contained ... 02/09/06 - 20060029338 - Package sealing means and photonic device packages so formed The present invention is directed to hermetically sealed photonic device packages and the polymeric sealing means employed therefore for connecting one or more optical fibers to a photonic device. ... 02/09/06 - 20060029337 - Opto-electronic housing and optical assembly An opto-electronic housing and an opto-electronic assembly. The housing includes an enclosure defining a cavity. An opening through a wall of the enclosure is adapted to receive a substrate. A mount projects into the cavity opposite the opening. The mount is adapted to support an opto-electronic device. Adjacent the mount ... 02/02/06 - 20060024006 - Container assembly for laser diode module In a container assembly for a laser diode module in which a temperature control device is not incorporated in advance, a heat-insulative casing is adapted to accommodate the laser diode module. A temperature detector is accommodated in the casing. A thermal coupling member is accommodated in the casing so as ... 10/27/05 - 20050238297 - Optical fiber connector cord and optical coupling set including the optical fiber connector cord A optical fiber connector cord capable of being detachably attached to a receptacle fixed to an optical apparatus includes an optical fiber having at least one hole which extends along an optical axis, a plug having a fiber hole through which the optical fiber extends and which is capable of ... 09/22/05 - 20050207711 - Optical termination pedestal An optical termination pedestal defines an interior cavity for interconnecting an optical fiber of a distribution cable and an optical fiber of a drop cable. The pedestal includes a base, a housing positioned over the base, and a plate secured to the housing or the base. The plate separates the ... 09/15/05 - 20050201695 - Hermetically-sealed lasers and methods of manufacturing A hermetically-sealed laser can be constructed without the need for packaging in larger form factors, such as transistor outline cans. In one implementation, a substrate, such as a silicon substrate, has a tub formed therein. The tub can be formed using a wet-etch, photolithographic, or any otherwise suitable etching process. ... 07/21/05 - 20050157990 - Optical sub-assembly packaging techniques that incorporate optical lenses Techniques for manufacturing an optical transmission device in a manner so that the photonic device is protected from damage that can be caused by exposure to the environment and physical handling are described. The invention involves placing a lens or a lens array over a photonic device, either with or ... 07/07/05 - 20050147361 - Telecommunications connector protective device A fiber optic connector assembly with a fiber optic connector mounted to a fiber optic cable and including a ferrule with an end face terminating the fiber. A plug is configured to fit about and engage the ferrule of the fiber optic connector to seal the end face from contaminants. ... 06/30/05 - 20050141830 - Methods of metallizing non-conductive substrates and metallized non-conductive substrates formed thereby Disclosed are methods of metallizing non-conductive substrates. The methods involve: (a) providing a non-conductive substrate having an exposed non-conductive surface; (b) forming a first nickel layer over the exposed non-conductive surface by electroless plating; and (c) forming a second nickel layer over the first nickel layer by electrolytic plating with ... 06/16/05 - 20050129374 - Modular optoelectronic package Each functional piece for a particular optoelectronic product (e.g., laser, tap, modulator, Variable Optical Amplifier (VOA), etc.) may be packaged individually. Each package may be equipped with one or more optical windows through which collimated beams are allowed to pass. The individual packages or modules may be mated and aligned ... 06/16/05 - 20050129373 - Method and apparatus for manufacturing a transistor-outline (to) can having a ceramic header An optoelectronic package includes an insulating base and an optoelectronic device mounted on the upper surface of the insulating base. A metal layer is attached to the upper surface of the insulating base, and a metal cap is attached to the metal layer to hermetically seal the metal cap to ... 06/16/05 - 20050129372 - Method and apparatus for manufacturing a transistor-outline (to) can having a ceramic header A method of manufacturing a hermetically-sealed optoelectronic package having an insulating base, a metal cap, and a metal layer sandwiched between the metal cap and the insulating base includes supplying a force to push the metal cap against the metal layer and to push the metal layer against the insulating ... ### FreshPatents.com Support |