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Active Solid-state Devices (e.g., Transistors, Solid-state Diodes) > Encapsulated > With Specified Encapsulant With Specified EncapsulantWith Specified Encapsulant patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.12/20/07 - 20070290377 - Three dimensional six surface conformal die coating Semiconductor die are typically manufactured as a large group of integrated circuit die imaged through photolithographic means on a semiconductor wafer or slice made of silicon. After manufacture, the silicon wafer is thinned, usually by mechanical means, and the wafer is cut, usually with a diamond saw, to singulate the ... 11/29/07 - 20070273050 - Semiconductor device and method of manufacturing thereof A method of manufacturing a semiconductor device sealed in a cured silicone body by placing an unsealed semiconductor device into a mold and subjecting a curable liquid silicone composition that fills the spaces between the mold and the unsealed semiconductor device to compression molding under a predetermined molding temperature, wherein ... 05/17/07 - 20070108637 - Semiconductor device and method for producing it, and use of an electrospinning method A semiconductor device and a method for producing it, and the use of the electrospinning method is disclosed. In one embodiment, delamination of the plastic housing composition from the circuit carrier can occur under loading, which can lead to the failure of the semiconductor device. For better adhesion, an adhesion-promoting ... 01/04/07 - 20070001321 - Semiconductor devices at least partially covered by a composite coating including particles dispersed through photopolymer material Devices include at least one semiconductor die including at least one surface that is at least partially covered by a photopolymer material. The photopolymer material includes a plurality of discrete particles dispersed through a polymerized matrix. In some embodiments, the photopolymer material may cover at least a portion of each ... 11/30/06 - 20060267223 - Materials for integrated circuit packaging Integrated circuit packages and their manufacture are described, wherein the packages comprise dendrimers or hyperbranched polymers. In some implementations, the dendrimers or hyperbranched polymers include repeat units having one or more ring structures and having surface groups to react with one or more components of a plastic. In some implementations, ... 11/16/06 - 20060255480 - Materials and method to seal vias in silicon substrates Sealing a via using a soventless, low viscosity, high temperature stable polymer or a high solids content polymer solution of low viscosity, where the polymeric material is impregnated within the via at an elevated temperature. A supply chamber is introduced to administer the polymeric material at an elevated temperature, typically ... 09/07/06 - 20060197236 - Curable composition having low coefficient of thermal expansion, method of making an integrated circuit, and an integrated circuit made there from wherein X is an aromatic ring or a six membered cycloaliphatic ring, m is from about 0 to about 2, n is from about 1 to about 3, Z is an epoxy group of empirical formula: C2H3O, p is a number from about 2 to about 3, and (ii) a ... 06/08/06 - 20060118973 - Sheet for optical-semiconductor-element encapsulation and process for producing optical semiconductor device with the sheet The present invention provides a sheet for optical-semiconductor-element encapsulation, which comprises: an outermost resin layer A that is to be brought into contact with one or more optical semiconductor elements; a light-diffusing layer formed on the layer A and containing light-diffusing particles; and a resin layer B formed on the ... 03/09/06 - 20060049532 - Chip module A chip module having a chip which is mounted by means of chip adhesive on a mount and is electrically connected via bonding wires to contact pads, and an encapsulation compound which surrounds the chip and the bonding wires and is bounded by a subarea of the mount. The encapsulation ... 03/02/06 - 20060043614 - Underfill and mold compounds including siloxane-based aromatic diamines An apparatus including a first substrate comprising a first set of contact points; a second substrate including a second set of contact points coupled to the first substrate through interconnections between a portion of the first set of contact points a portion of the second set of contact points; and ... 12/08/05 - 20050269719 - Integrated circuit device An integrated circuit device having a semiconductor device and an encapsulating material on at least a portion of the semiconductor device and a method for encapsulating an integrated circuit device is disclosed. The encapsulating material includes a plurality of nanoparticles. ... 10/06/05 - 20050218531 - Optoelectronic component and method for producing it An optoelectronic component having a basic housing or frame (12) and at least one semiconductor chip (20), specifically a radiation-emitting or -receiving semiconductor chip, in a cavity (18) of the basic housing. In order to increase the efficiency of the optoelectronic component (10), reflectors are provided in the cavity in ... 07/14/05 - 20050151273 - Semiconductor chip package A semiconductor chip package includes an integrated circuit chip and a substrate. A chip contact pad is formed on a first side of the chip. A stud is formed on the chip contact pad from wire using a wire bonding machine. The stud has a partially squashed ball portion bonded ... 07/07/05 - 20050146057 - Micro lead frame package having transparent encapsulant The present invention discloses an MLP having an optically transparent encapsulant. The MLP comprises a lead frame having a die-pad, a plurality of lead fingers and an interlock undercut. A die is placed onto the die-pad. A conductive wire is provided for connecting the die to the plurality of lead ... 06/23/05 - 20050133938 - Chip packaging compositions, packages and systems made therewith, and methods of making same A system for chip packaging includes an adamantoid packaging composition. The adamantoid composition ameliorates the CTE mismatch that typically exists between a packaged die and a resin-impregnated fiberglass mounting substrate. In an embodiment, the system includes a packaging composition that alone exhibits a CTE that is characteristic of an inorganic-filled ... 06/09/05 - 20050121808 - Semiconductor device where E represents the Young's modulus (GPa) of the sealing resin at room temperature; α represents the coefficient of linear expansion (ppm) of the sealing resin at room temperature; αs represents the coefficient of linear expansion (3.5 ppm) of the silicon substrate; and h represents the thickness (m) of the ... ### FreshPatents.com Support - Terms & Conditions |