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Active Solid-state Devices (e.g., Transistors, Solid-state Diodes) > Housing Or Package > With Provision For Cooling The Housing Or Its Contents > Heat Dissipating Element Has High Thermal Conductivity Insert (e.g., Copper Slug In Aluminum Heat Sink) Heat Dissipating Element Has High Thermal Conductivity Insert (e.g., Copper Slug In Aluminum Heat Sink)Heat Dissipating Element Has High Thermal Conductivity Insert (e.g., Copper Slug In Aluminum Heat Sink) patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.07/26/07 - 20070170581 - Silicon-diamond composite heat spreader and associated methods Diamond heat spreaders are produced having thermal properties approaching that of pure diamond. Diamond particles of relatively large grain size are tightly packed to maximize diamond-to-diamond contact. Subsequently, smaller diamond particles can optionally be introduced into the interstitial voids to further increase the diamond content per volume. An interstitial material ... 06/07/07 - 20070126116 - Integrated circuit micro-cooler having tubes of a cnt array in essentially the same height over a surface Heat sink structures employing carbon nanotube or nanowire arrays to reduce the thermal interface resistance between an integrated circuit chip and the heat sink, where the nanotubes are cut to essentially the same length over the surface of the structure, are disclosed. Carbon nanotube arrays are combined with a thermally ... 05/24/07 - 20070114658 - Integrated circuit micro-cooler with double-sided tubes of a cnt array Heat sink structures employing carbon nanotube or nanowire arrays exposed from both opposite surfaces of the structure to reduce the thermal interface resistance between an integrated circuit chip and the heat sink are disclosed. In one embodiment, the nanotubes are cut to essentially the same length over the surface of ... 05/24/07 - 20070114657 - Integrated circuit micro-cooler having multi-layers of tubes of a cnt array Heat sink structures employing mutli-layers of carbon nanotube or nanowire arrays to reduce the thermal interface resistance between an integrated circuit chip and the heat sink are disclosed. In one embodiment, the nanotubes are cut to essentially the same length over the surface of the structure. Carbon nanotube arrays are ... 04/19/07 - 20070085199 - Integrated circuit package system using etched leadframe An integrated circuit package system includes a conductive substrate. A heat sink and a plurality of leads are etched in the substrate to define a conductive film connecting the heat sink and the plurality of leads to maintain their spatial relationship. A die is attached to the heat sink and ... 04/05/07 - 20070075420 - Microelectronic package having direct contact heat spreader and method of manufacturing same A method of fabricating a microelectronic package having a direct contact heat spreader, a package formed according to the method, a die-heat spreader combination formed according to the method, and a system incorporating the package. The method comprises metallizing a backside of a microelectronic die to form a heat spreader ... 03/22/07 - 20070063339 - Heat dissipating assembly for heat dissipating substrate and application In a heat dissipating assembly for heat dissipating substrate and application, a heat dissipating substrate is made of a graphite layer and a thermal conductive metal layer covered onto the surface of the graphite layer, so that when the heat dissipating substrate is placed on a heat source, the graphite ... 01/25/07 - 20070018312 - Wiring substrate and semiconductor package implementing the same A wiring substrate may have a first surface including a chip mounting pad, and a second surface opposite to the first surface. A heat radiating layer may be provided on the second surface of the wiring substrate. A plurality of heat conducting elements may connect the chip mounting pad to ... 01/04/07 - 20070001293 - Semiconductor assemblies including redistribution layers and packages and assemblies formed therefrom Methods for creating redistribution layers for only selected dice, such as known good dice, to form relatively thin semiconductor component assemblies and packages, and the assemblies and packages created by the methods, are disclosed. A sacrificial layer is deposited on a support substrate. An etch stop layer having a lower ... 12/28/06 - 20060289989 - Intrinsic thermal enhancement for fbga package A semiconductor device for dissipating heat generated by a die during operation and having a low height profile, a semiconductor die package incorporating the device, and methods of fabricating the device and package are provided. In one embodiment, the semiconductor device comprises a thick thermally conductive plane (e.g., copper plane) ... 12/28/06 - 20060289988 - Integrated circuit with heat conducting structures for localized thermal control An integrated circuit die includes a substrate having an upper surface, at least one active device formed in a first area of the upper surface of the substrate, and a plurality of layers formed on the upper surface of the substrate above the at least one active device. A first ... 12/14/06 - 20060278975 - Ball grid array package with thermally-enhanced heat spreader A ball grid array (BGA) package having a thermally enhanced dummy chip is provided. In one embodiment, the package comprises a substrate. A chip is attached to the substrate. A heat spreader is disposed over the chip, and a dummy chip is disposed between the heat spreader and the chip. ... 11/16/06 - 20060255453 - Tightly engaged heat dissipating apparatus and method for manufacturing the same A method for manufacturing a tightly engaged heat dissipating apparatus includes the steps of providing a thermal-conductive base, forming a plurality of grooves on one surface of the base and forming a plurality of walls adjacent to the grooves, placing a plurality of fn plates of a heat dissipating unit ... 11/02/06 - 20060244129 - Electronic device with heat dissipation module An electronic device. The electronic device includes a circuit board, a heat dissipation module, and a light-emitting diode. The circuit board includes a heating element thereon. The heat dissipation module is disposed on the circuit board and the heating element. The light-emitting diode is disposed on the heat dissipation module. ... 10/05/06 - 20060220226 - Integrated heat spreader with intermetallic layer and method for making Integrated heat spreader and die coupled with solder in a manner forming an intermetallic compound having a higher liquidus temperature than the liquidus temperature of the solder used to create the intermetallic compound are described herein. ... 09/28/06 - 20060214286 - Integrated circuit thermal management method and apparatus An apparatus, method, and system for providing thermal management for an integrated circuit includes a first metallic layer directly placed on a back surface of the integrated circuit. An integrated heat spreader with a substantially cap-like shape is placed over the integrated circuit, with an aperture of a ceiling wall ... 09/28/06 - 20060214285 - Integrated circuit package An IC package includes a package body of non-conductive material. A conductive heat-sink pad includes an interior pad portion located within an interior of the package body. An exterior pad portion is located external to the package body. The exterior pad portion includes at least two pad pieces that are ... 08/24/06 - 20060186536 - Substrate assembly with direct electrical connection as a semiconductor package A substrate assembly with direct electrical connection as a semiconductor package is disclosed, which includes a carrier structure formed with at least a cavity; at least a semiconductor chip received in the cavity of the carrier structure having a plurality of electrically connecting pads formed thereon; at least a build-up ... 08/24/06 - 20060186535 - Semi-conductor die mount assembly A die mount assembly including a semiconductor die and die mount is provided. The semiconductor die may be a light emitting diode die that is attached to the die mount forming an electrical and thermal connection. The die mount includes a first set of pads and a second set of ... 06/22/06 - 20060131739 - Semiconductor device and method of arranging pad thereof A semiconductor device and method of forming a pad thereof are provided. The device includes: a substrate; at least one first active region disposed in a first region of the substrate; at least one second active region disposed in a second region adjacent to the first region of the substrate; ... 06/22/06 - 20060131738 - Method and apparatus for chip cooling using a liquid metal thermal interface In one embodiment, the present invention is a method and apparatus for chip cooling using a liquid metal thermal interface. One embodiment of an inventive thermal interface for facilitating thermal contact between opposing surfaces of an integrated circuit chip and a heat sink the thermal interface includes a liquid metal ... 05/25/06 - 20060108681 - Semiconductor component package A semiconductor component package and method of fabrication are disclosed. The package employs a heat dissipating element embedded within the protective material over the component. The heat dissipating element is preferably made by stamping, and is formed from an essentially uniform thickness heat conducting sheet. The element is formed so ... 05/18/06 - 20060103016 - Heat sinking structure High performance integrated circuits generally have high heat generating capabilities. During powering up of these integrated circuits under typical operating conditions, heat generation is unavoidably accelerated. When the accumulated heat is not adequately dissipated, the high temperature of the integrated circuits will lead to overheating which in turn, causes irreversible ... 05/04/06 - 20060091532 - Carbonaceous composite heat spreader and associated methods A heat spreader including a plurality of carbonaceous particles present in an amount of at least about 50% by volume of the heat spreader. A non-carbonaceous material is also present in an amount of at least about 5% by volume of the heat spreader, the non-carbonaceous material including an element ... 04/06/06 - 20060071328 - Semiconductor substrate structure A semiconductor substrate structure with a highly heat-conductive advantage increases packaging good rate and quality. Using semiconductor chip packaging, an electronic chip is easily made highly heat-conductive, and compared with the prior art, the present invention has superior good rate for substrate structure. The improved heat-conductive structure avoids the semiconductor ... 04/06/06 - 20060071327 - Construction to improve thermal performance and reduce die backside warpage A semiconductor package construction aimed at improving thermal performance. A heatspreader is provided having a metal alloy preform attached to it already. Then, a few dots of conductive epoxy are dispensed around the die. The heatspreader with the preformed metal alloy is pressed on the adhesive and then the part ... 03/30/06 - 20060065974 - Reactive gettering in phase change solders to inhibit oxidation at contact surfaces A method for forming a high thermal conductivity heat sink to IC package interface is disclosed. The method uses reactive getter materials added to a two phase solder system having a phase change temperature that is about the normal operating temperature range of the IC, to bind absorbed and dissolved ... 03/02/06 - 20060043583 - Semiconductor device A semiconductor device is disclosed that includes a semiconductor element, a circuit board electrically connected to the semiconductor element, a heat dissipation member fixed to the first surface of the circuit board and thermally coupled to the semiconductor element, and an interposer provided to the second surface of the circuit ... 03/02/06 - 20060043582 - Method for heat dissipation on semiconductor device A device and method wherein a thermo electric generator device is disposed between stacks of a multiple level device, or is provided on or under a die of a package and is conductively connected to the package. The thermo electric generator device is configured to generate a voltage by converting ... 01/12/06 - 20060006526 - Thermal interposer for cooled electrical packages The specification describes electrical assemblies comprising actively cooled components wherein a thermal interposer is used to limit heat transfer between the ambient and the cooled components. The thermal interposer is effective for transmitting signals for both power/ground and RF. Structurally, the thermal interposer comprises thin conductors in various configurations that ... 10/20/05 - 20050230820 - Power semiconductor arrangement A power semiconductor arrangement has an electrically insulating and thermally conductive substrate, which is provided with structured metallization on at least one side, a cooling device which is in thermal contact with the other side of the substrate, at least one semiconductor component which is arranged on the substrate and ... 10/06/05 - 20050218508 - Electronic packaging apparatus and method An electronic assembly includes a substrate, a device attached to the substrate, and a thermally conductive heat spreader covering the device and at least a portion of the substrate. A metal substantially fills the space between the device and the thermally conductive heat spreader. A method includes attaching at least ... 09/01/05 - 20050189647 - Carbonaceous composite heat spreader and associated methods A carbonaceous composite heat spreader includes a plurality of diamond grits present in an amount greater than about 50% by volume of the heat spreader and a metal matrix holding the diamond grits in a consolidated mass. The metal matrix contains at least about 50% aluminum by volume. The heat ... 06/16/05 - 20050127502 - Thermal dispensing enhancement for high performance flip chip bga (hpfcbga) A microelectronic package comprising a device substrate having first and second opposing surfaces and comprising a plurality of microelectronic devices. The microelectronic package also includes a plurality of electrically conductive members coupled to corresponding ones of the plurality of microelectronics device and extending away from the first surface. A thermally ... 06/02/05 - 20050116336 - Nano-composite materials for thermal management applications Nano-composite materials with enhanced thermal performance that can be used for thermal management in a wide range of applications, including heat sinks, device packaging, semiconductor device layers, printed circuit boards and other components of electronic, optical and/or mechanical systems. One type of nano-composite material has a base material and nanostructures ... ### FreshPatents.com Support - Terms & Conditions |