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Active Solid-state Devices (e.g., Transistors, Solid-state Diodes) > Housing Or Package > Insulating Material > With Heat Sink With Heat SinkWith Heat Sink patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.12/27/07 - 20070296076 - Semiconductor device and apparatus and method for manufacturing the same The present invention provides a semiconductor device including: a semiconductor chip mounted on a substrate; a heat spreader provided above the semiconductor chip; and a sealing resin interposed between the semiconductor chip and the heat spreader and covering the semiconductor chip. The heat spreader is not in contact with any ... 12/27/07 - 20070296075 - Package using selectively anodized metal and manufacturing method thereof A package using selectively anodized metal and a manufacturing method thereof are provided. The method includes a patterning step, an anodized metal film forming step, a via hole forming step, and a bump forming step. The pattering step is performed by attaching a masking material to a surface of a ... 12/06/07 - 20070278665 - Thermally enhanced three-dimensional package and method for manufacturing the same A thermally enhanced three-dimensional (3D) package is disclosed. The package includes a heat sink having an opening and a stiffener ring inside the opening. The stiffener ring has a first surface and a second surface. A first substrate of a first package is disposed inside the opening and secured to ... 12/06/07 - 20070278664 - Semiconductor package structure having enhanced thermal dissipation characteristics In one embodiment, a packaged semiconductor device having enhanced thermal dissipation characteristics includes a lead frame structure and a semiconductor chip having a major current carrying or heat generating electrode. The semiconductor chip is oriented so that the major current carrying electrode faces the top of the package or away ... 12/06/07 - 20070278663 - Integrated circuit cooling device A pump having: a cavity formed inside an insulating substrate, the upper part of the substrate being situated near the cavity having an edge; a conductive layer covering the inside of the cavity up to the edge and optionally covering the edge itself; a flexible membrane made of a conductive ... 11/15/07 - 20070262443 - Electronic device with integrated heat distributor The present invention relates to an electronic device incorporating a heat distributor. It applies more particularly to devices of the plastic package type, with one or more levels of components. According to the invention, the electronic device, for example of the package type, is provided for its external connection with ... 11/15/07 - 20070262441 - Heat sink structure for embedded chips and method for fabricating the same A heat sink structure for embedding chips and a method for fabricating the same are proposed. An external metal layer is formed on the surface of a chip with pads and a wafer backside heat conductive layer is formed on the inactive surface of the chip. At least one chip ... 10/25/07 - 20070246822 - Hard disk drive preamp heat dissipation methods A heatsink architecture employing a combination of stiffeners and flex substrate to improve the sinking of heat from the integrated circuit. The stiffener may be employed in numerous locations, including above the integrated circuit, or interposed between the integrated circuit and an e-block. The flex substrate may be interposed between ... 10/18/07 - 20070241449 - Apparatus for effecting reliable heat transfer of bare die microelectroinc device and method thereof Apparatus and method include using a bare die microelectronic device; a heat sink assembly; a heat sink mounting assembly for mounting the heat sink assembly independently of the bare die microelectronic device; and, a force applying mechanism that compression loads, under controlled forces, a surface of the bare die into ... 10/11/07 - 20070235860 - Power semiconductor module with flush terminal elements A power semiconductor module includes a housing, terminal elements leading to the outside of the housing, an electrically insulated substrate arranged inside the housing, with the substrate being comprised of an insulating body and having on the first main face facing away from the base plate a plurality of connecting ... 10/11/07 - 20070235859 - Integrated circuit package system with heatspreader An integrated circuit package system includes providing a substrate having an integrated circuit, attaching a heatspreader having a force control protrusion on the substrate, and forming an encapsulant over the heatspreader and the integrated circuit. ... 09/20/07 - 20070216022 - Fin structure for a heat sink A heat sink includes a base adapted for absorbing heat from a heat-generating component, and a plurality of parallel fins having channels defined therebetween. Each of the fins includes a main body standing on the base. A row of protruding portions and openings is alternately arranged on the main body ... 08/23/07 - 20070194440 - Substrate for semiconductor device and semiconductor device A configuration for a substrate for a semiconductor device which makes it possible to achieve further stabilization of the voltage for driving a semiconductor element (5) to be mounted is provided. The substrate for a semiconductor device is provided with a base (1) and an electrically insulating film (3) formed ... 07/19/07 - 20070164423 - Multi-chip semiconductor package A multi-chip semiconductor package that includes two power semiconductor devices arranged in a half-bridge configuration between two opposing circuit boards. ... 07/05/07 - 20070152323 - Integrated heat spreader lid A heat spreader lid includes an outer periphery region having a lip for bonding to an underlying substrate board, a center region, and one or more strain isolation regions. The strain isolation regions are located between the center region and the outer periphery region and may comprise a number of ... 07/05/07 - 20070152322 - Semiconductor device and method of manufacturing the same A heatsink plate is to be fixed to a substrate with sufficient strength, so as to prevent the heatsink plate from being stripped off, to thereby secure reliability on the performance of the semiconductor chip. The heatsink plate has both the upper and lower surfaces of the fixing section sandwiched ... 06/28/07 - 20070145571 - Semiconductor package structure with constraint stiffener for cleaning and underfilling efficiency A semiconductor package structure with a heat dissipating stiffener and method of fabricating the same are provided. In one embodiment, the package structure comprises a substrate having a front side and a back side; a semiconductor chip mounted on the front surface of the substrate; a thermally-conductive stiffener mounted over ... 06/21/07 - 20070138625 - Semiconductor package with heat dissipating structure and method of manufacturing the same A semiconductor package in which heat is easily dissipated and a semiconductor chip is not damaged during a molding process, and a method of manufacturing the same. The semiconductor package with a heat dissipating structure includes a substrate, a semiconductor chip, which is mounted on the substrate and electrically connected ... 06/21/07 - 20070138623 - Carbon nanotube micro-chimney and thermo siphon die-level cooling A method, apparatus and system with a semiconductor package including a microchimney or thermosiphon using carbon nanotubes to modify the effective thermal conductivity of an integrated circuit die. ... 06/14/07 - 20070132091 - Thermal enhanced upper and dual heat sink exposed molded leadless package A semiconductor package includes a semiconductor device 30 and a molded upper heat sink 10. The heat sink has an interior surface 16 that faces the semiconductor device and an exterior surface 15 that is at least partially exposed to the ambient environment of the packaged device. An annular planar ... 05/17/07 - 20070108597 - Integrated circuit package system with heat dissipation enclosure An integrated circuit package system is provided providing an integrated circuit die, and enclosing the integrated circuit die in a heat dissipation enclosure comprises mounting the integrated circuit die on a die paddle attaching a heat block ring to the die paddle around the integrated circuit die, and attaching a ... 05/17/07 - 20070108596 - Integrated circuit package system using heat slug An integrated circuit package system includes providing a substrate having an integrated circuit die thereon. A support is provided on the substrate. A heat slug having a tie bar is positioned by the tie bar on the support. The substrate and the integrated circuit die are encapsulated with an encapsulant, ... 05/17/07 - 20070108595 - Semiconductor device with integrated heat spreader A semiconductor device includes a die, a substrate, a heat spreader and a plurality of signal interconnects extending from the die. The heat spreader has a base and a plurality of fins. The heat spreader is mounted on the substrate in such a way that the base of the head ... 05/03/07 - 20070096299 - Semiconductor device package with integrated heat spreader A multi chip housing has a lead frame to which plural die are soldered. A heat spreader conductive cap encloses a volume containing the plural die or chips and is fixed to the periphery of the lead frame. The tops of the die are closely spaced from the interior of ... 05/03/07 - 20070096298 - Thermal management device attachment A thermal management device attachment apparatus may be used to thermally couple a thermal management device to a heat generating component on a circuit board. The attachment apparatus may include a support member mounted on the same side of the circuit board as the heat generating component and extending around ... 05/03/07 - 20070096297 - Rf power transistor package An RF power transistor package with a rectangular ceramic base can house one or more dies affixed to an upper surface of the ceramic base. Source leads attached to the ceramic base extend from at least opposite sides of the rectangular base beneath a periphery of a non-conductive cover overlying ... 04/26/07 - 20070090518 - Microelectronic cooling apparatus and associated method An apparatus and associated method to provide localized cooling to a microelectronic device are generally described. In this regard, according to one example embodiment, a cooling apparatus comprising a heat spreader and one or more thermoelectric cooler(s) thermally coupled to the heat spreader provides cooling to one or more hot ... 04/26/07 - 20070090517 - Stacked die package with thermally conductive block embedded in substrate Disclosed are embodiments of a stacked die package including a thermally conductive block disposed in the substrate. The die stack may include a lower die thermally coupled with the conductive block and one or more upper die disposed on the lower die. The upper die may be electrically interconnected to ... 04/12/07 - 20070080447 - Electronic apparatus The invention provides an electronic apparatus having a metal core substrate including a metal plate, an insulating layer formed on the metal plate and a conductive layer formed on the insulating layer, and an electronic part, and to which the conductive layer and a terminal of the electronic part are ... 03/29/07 - 20070069371 - Cavity chip package A package for an IC includes a carrier with a cavity formed on one of the major surfaces. Bumps of a semiconductor die are mated to contact pads located on the bottom of the cavity. The die is attached to the major surface of the carrier. The major surface creates ... 03/29/07 - 20070069370 - Semiconductor device A semiconductor device 1 includes a substrate 10, a semiconductor chip 20 (first semiconductor chip), semiconductor chips 30 (second semiconductor chips) and a heat sink 40. Semiconductor chips 20 and 30 are mounted on the substrate 10. The level of the top surface of the semiconductor chip 20 on the ... 03/29/07 - 20070069369 - Heat dissipation device and method for making the same A heat dissipation device includes a chip unit and a heat dissipation unit thermally attached to the chip unit. The chip unit includes a carrier substrate and a chip in electrical contact with the carrier substrate. The heat dissipation unit includes a heat spreader thermally contacting with the chip and ... 03/29/07 - 20070069368 - Integrated circuit device incorporating metallurigacal bond to enhance thermal conduction to a heat sink An integrated circuit device incorporating a metallurgical bond to enhance thermal conduction to a heat sink. In a semiconductor device, a surface of an integrated circuit die is metallurgically bonded to a surface of a heat sink. In an exemplary method of manufacturing the device, the upper surface of a ... 03/01/07 - 20070045824 - Methods of making a die-up ball grid array package with printed circuit board attachable heat spreader An electrically and thermally enhanced die-up tape substrate ball grid array (BGA) package and die-up plastic substrate BGA package are described. A substrate that has a first surface and a second surface is provided. The stiffener has a first surface and a second surface. The second stiffener surface is attached ... 03/01/07 - 20070045823 - Thermally conductive thermoplastics for die-level packaging of microelectronics A composition and method for die-level packaging of microelectronics is disclosed. The composition includes about 20% to about 80% of a thermoplastic base matrix; about 20% to about 70% of a non-metallic, thermally conductive material such that the composition has a coefficient of thermal expansion of less than 20 ppm/C ... 03/01/07 - 20070045822 - Heat sink packaging assembly for electronic components A packaging assembly (100) includes a plurality of dissimilar die (102, 104, 106) bonded to a base board (110) and ground coupled to a heat sink (108) through an opening (132). A mating board (112) is coupled to the base board (110) to provide separate surface mountable contacts (148-158, 166) ... 02/22/07 - 20070040267 - Method and system for secure heat sink attachment on semiconductor devices with macroscopic uneven surface features Methods, systems, and apparatuses for attaching heat sinks to integrated circuit packages using thermally conductive adhesive materials are described. The adhesive materials can be shaped to conform to surfaces of the integrated circuit package and/or heat sink, prior to hardening, such as by curing the adhesive material. ... 02/22/07 - 20070040266 - Heat-conducting packaging of electronic circuit units The invention relates to a heat-conducting coating of electronic circuit assemblies (102), comprising a coating agent (100), which encloses the electronic circuit assembly (102) and which is electrically insulating, with dispersed particles in the coating agent (100) which have a high thermal conductivity, whereby the particles dispersed in the coating ... 02/15/07 - 20070035012 - Integrated solder and heat spreader fabrication A system may include an integrated heat spreader that includes a portion of solder material and a thermal conductor, wherein a voidless interface exists between the solder material and a first side of the thermal conductor. ... 02/15/07 - 20070035011 - Integrated circuit apparatus with heat speader An integrated circuit apparatus with heat removal has an electrical interconnection network. The electrical interconnection network has a plurality of electrically and thermally conductive vias in electrical communication with terminals of at least one semiconductor device. An electrically insulating heat spreader is chemically bonded to each of the vias at ... 02/08/07 - 20070029664 - Integrated circuit package and method of assembling the same Flexible, adhesive materials are used to secure integrated circuit package components together. The die is secured to the heat sink, the ringframe to the heat sink and the leadframe to the ringframe, using epoxy materials that flex over the operational temperature range of the circuit package. The flexibility of the ... 02/01/07 - 20070023891 - Substrate based ic-package A semiconductor component comprises a substrate that includes wiring on a first surface. A chip is mounted on a second surface of the substrate by a die attach, the second surface opposite the first surface. A bond channel in the center of the substrate allows for electrical connection of contact ... 01/25/07 - 20070018310 - Semiconductor device and manufacturing method thereof In a semiconductor device, a semiconductor element is mounted on a package substrate, and a heat dissipating member is laid above the semiconductor element and the package thereby sealing the semiconductor element. Resin is filled into the space defined by the semiconductor element, the package substrate, and the heat dissipating ... 01/18/07 - 20070013054 - Thermally conductive materials, solder preform constructions, assemblies and semiconductor packages A thermally conductive material that includes an alloy which includes indium, zinc, magnesium or a combination thereof is described herein. Also, a semiconductor package comprising a thermal interface material which includes solder and particles dispersed throughout the solder, the particles being of thermal conductivity greater than or equal to about ... 01/18/07 - 20070013053 - Semiconductor device and method for manufacturing a semiconductor device A semiconductor device mountable to a substrate includes: a semiconductor die; an electrically conductive attachment region having a first attachment surface and a second attachment surface, the first attachment surface arranged for electrical communication with the semiconductor die; an interface material having a first interface surface and a second interface ... 01/04/07 - 20070001290 - Semiconductor packaging structure A semiconductor packaging structure includes a baseboard, a semiconductor chip set, a thermal conductor, a package and a heat sink. The thermal conductor is located on the baseboard. The semiconductor chip set is directly mounted onto the thermal conductor. The heat sink is coupled on the thermal conductor. Hence heat ... 12/14/06 - 20060278974 - Method for forming wafer-level heat spreader structure and package structure thereof A method for forming wafer-level heat sink in a chip of the packaging structure is provided. Before the sawing process, a plurality of via holes are formed and covered with a heat conductive layer such as a metal layer for forming a heat spreader structure in the backside of a ... 12/07/06 - 20060273453 - Heat sink and display panel including heat sink A heat sink that absorbs heat generated from at least one semiconductor device and dissipates the heat absorbed includes: a first surface adapted to match and contact at least one semiconductor device; a second surface having a fin structure adapted to dissipate heat from the heat sink into the air, ... 12/07/06 - 20060273452 - Semiconductor package and fabrication method thereof A semiconductor package and a fabrication method thereof are provided. During a molding process, a substrate mounted with a chip is placed in a mold having a molding cavity, wherein the molding cavity is sized larger than the predetermined size of the semiconductor package, and a portion of the mold ... 12/07/06 - 20060273451 - Semiconductor ic and its manufacturing method, and module with embedded semiconductor ic and its manufacturing method A semiconductor IC includes a semiconductor IC main body having a predetermined circuit formed on a main surface, a metal layer selectively provided on substantially the whole back surface of the semiconductor IC main body excluding the periphery. According to the present invention, the metal layer provided on the semiconductor ... 12/07/06 - 20060273450 - Solid-diffusion, die-to-heat spreader bonding methods, articles achieved thereby, and apparatus used therefor A die and heat spreader are bonded with an intermetallic thermal interface material (TIM). The bonding process is carried out in a tool that can control conditions such that fluxing is not required. An article including an intermetallic TIM between a die and a heat spreader is provided in a ... 11/30/06 - 20060267182 - Package and method for attaching an integrated heat spreader In some embodiments, an integrated circuit package includes a substrate and a heat spreader coupled to the substrate by fasteners. Thermal interface material thermally couples the die to the heat spreader. The heat spreader is provided over the die and is attached to the substrate with fasteners rather than a ... 11/09/06 - 20060249836 - Chip-scale package A semiconductor package including a conductive clip preferably in the shape of a can, a semiconductor die, and a conductive stack interposed between the die and the interior of the can which includes a conductive platform and a conductive adhesive body. ... 11/09/06 - 20060249835 - Package for receiving electronic parts, and electronic device and mounting structure thereof A package for receiving electronic part has a heat radiating plate having a mounting area where the electronic part is mounted at a center portion of one main surface, a frame body adhered to the one main surface to surround the mounting area, and a wiring conductor derived from the ... 11/02/06 - 20060244127 - Integrated stacked microchannel heat exchanger and heat spreader Integrated stacked microchannrel heat exchanger and heat spreaders for cooling integrated circuit (IC) dies and packages and cooling systems employing the same are disclosed. In one embodiment, a stacked microchannel heat exchanger is operatively and thermally coupled to an IC die or package using an interstitial solder or a solderable ... 11/02/06 - 20060244126 - Memory module In a memory module, a plurality of semiconductor memory packages are arranged and mounted on a module board, and a control semiconductor package is disposed in a central region of the arrangement of the semiconductor memory packages, and mounted on the module board. A control semiconductor radiator thermally connected to ... 11/02/06 - 20060244125 - Heat sink member and method of manufacturing the same A heat sink member capable of suppressing development of cracks and chaps in manufacturing, suppressing enlargement of a thermal expansion coefficient and suppressing lowering of thermal conductivity is obtained. This heat sink member comprises a ply member (1) mainly composed of Cu, a substrate (2) mainly composed of Mo and ... 10/19/06 - 20060231944 - Thermally enhanced semiconductor package and fabrication method thereof A thermally enhanced semiconductor package and a fabrication method thereof are provided. A semiconductor chip is mounted and electrically connected to a chip carrier. A receiving plate having an opening is provided on the chip carrier and the semiconductor chip is received in the opening. A heat sink formed with ... 10/05/06 - 20060220224 - Thermally enhanced three-dimensional package and method for manufacturing the same A thermally enhanced three-dimensional (3D) package is disclosed. The package includes a heat sink having an opening and a stiffener ring inside the opening. The stiffener ring has a first surface and a second surface. A first substrate of a first package is disposed inside the opening and secured to ... 09/21/06 - 20060208353 - Semiconductor cooling system and process for manufacturing the same A cooling device for an element such as a microprocessor in a computer, and a process for manufacturing the cooling device. The cooling device provides an effective structure of cooling a microprocessor by providing a metallic filler layer and a metal plate layer spreading out heat generated from the microprocessor, ... 09/14/06 - 20060202324 - Semiconductor power module A semiconductor power module has insulative substrate which is configured with a metal wiring pattern formed on an upper first surface thereof, a metal conductor formed on a rear face, opposite the first surface and an insulative layer between the metal wiring pattern and the metal conductor. A semiconductor chip ... 09/14/06 - 20060202323 - Semiconductor module One of the aspects of the present invention is to provide a semiconductor module, which includes at least one semiconductor device including a semiconductor element molded with a resin package having a main surface and a side surface, and a plurality of terminals extending from the side surface and being ... 09/07/06 - 20060197219 - Heat sink and package structure A heat sink for conducting a coolant is provided. The heat sink includes a casing and a porous material layer. The porous material layer is disposed inside the casing, and the coolant is conducted into the porous material layer. Moreover, a package structure that dissipates heat by use of a ... 09/07/06 - 20060197218 - Hip package structure A chip package structure is provided, including a package substrate, a chip, a heat spreader, and a molding compound. The chip is disposed on a surface of the package substrate, and electrically connected thereof. The heat spreader is disposed on the surface of the package substrate, and the heat spreader ... 08/24/06 - 20060186533 - Chip scale package with heat spreader A dense semiconductor flip-chip device assembly is provided with a heat sink/spreading/dissipating member that is formed as a paddle of a metallic paddle frame in a strip of paddle frames. Semiconductor dice are bonded to the paddles by, e.g., conventional die attach methods, enabling bump attachment and testing to be ... 08/17/06 - 20060180923 - Heat sink A heat sink includes a plurality of plate members combined together. Each plate member has a flat rectangular body provided with mounting holes, two sidewalls extending from a first side and a second side of the flat rectangular body, and a plurality of mounting lugs respectively provided at bottom side ... 08/10/06 - 20060175700 - Semiconductor device and method of manufacturing the same A semiconductor chip is sealed by resin without covering an outer terminal of a semiconductor device having a power transistor. A semiconductor chip having a power transistor is housed within a recess of a metal cap while a drain electrode on a first surface of the semiconductor chip is bonded ... 08/03/06 - 20060170094 - Semiconductor package integral heat spreader An integral heat spreader is disclosed wherein its physical characteristics are modified in regions between adjacent semiconductor devices. The modification improves the reliability of the semiconductor devices by reducing stiffness of the integral heat spreader. ... 07/13/06 - 20060151872 - Connection between a semiconductor housing and a base plate comprising a passage opening for fastening to a heat sink A semiconductor module has a housing (2) and a metal base plate (3). A reliable yet easily producible force-transmitting connection between a semiconductor module and an external heat sink is provided by a mechanical pressure-proof counterpart (4) which is incorporated into the housing (2) and forms a firm connection (14) ... 07/06/06 - 20060145334 - Semiconductor device A semiconductor device includes an intermediate layer provided between a semiconductor element and a heat sink. The intermediate layer moderates thermal stress resulting from a difference between thermal expansion of the semiconductor element and thermal expansion of the heat sink arising due to heat produced by the semiconductor element. This ... 07/06/06 - 20060145333 - Semiconductor device with a cooling element A semiconductor device comprising a semiconductor component (12), particularly a power laser diode bar, disposed on a cooling element (20), wherein the cooling element (20) contains in its interior a cooling channel (26) for conducting a coolant. The coolant channel (26) comprises in at least one region (32) microstructures for ... 06/29/06 - 20060138644 - Thermal interface structure with integrated liquid cooling and methods A method and device for thermal conduction is provided. A thermal interface device and method of formation is described that includes advantages such as improved interfacial strength, and improved interfacial contact. Embodiments of thermal conduction structures are shown that provide composite thermal conduction and circulated liquid cooling. Embodiments are further ... 06/29/06 - 20060138643 - One step capillary underfill integration for semiconductor packages The present invention relates to a semiconductor package containing a package substrate, integrated heat spreader, and semiconductor die. An underfill material is embedded in the semiconductor package serving both as underfill and sealant. ... 06/22/06 - 20060131735 - Hyper thermally enhanced semiconductor package system A semiconductor package system is provided including mounting a semiconductor chip to a substrate having a substrate opening. A first heat slug is attached to a first surface of the semiconductor chip at least partially encapsulating the semiconductor chip. A second heat slug is attached to the second surface of ... 06/22/06 - 20060131734 - Multi lead frame power package According to an embodiment of the invention, a system, operable to facilitate dissipation of thermal energy, includes a mold compound, a die, a first lead frame, and a second lead frame. The die is disposed within the mold compound, and in operation generates thermal energy. The first lead frame is ... 06/22/06 - 20060131733 - Integrated circuit coolant microchannel with movable portion According to some embodiments, a microchannel is provided to transport a coolant. The microchannel may be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant. Moreover, a movable portion may be provided to adjust a volume of a space associated with the microchannel (e.g., ... 06/22/06 - 20060131732 - Discrete electronic component arrangement including anchoring, thermally conductive pad An electronic component arrangement includes a discrete electronic component having first and second terminals and a centre-exposed pad. A substrate has a first electrical conductor electrically connected to the first terminal, a second electrical conductor electrically connected to the second terminal, and a third electrical conductor. A thermally conductive element ... 06/15/06 - 20060125087 - Apparatus for effecting reliable heat transfer of bare die microelectronic device and method thereof Apparatus and method include using a bare die microelectronic device; a heat sink assembly; a heat sink mounting assembly for mounting the heat sink assembly independently of the bare die microelectronic device; and, a force applying mechanism that compression loads, under controlled forces, a surface of the bare die into ... 06/15/06 - 20060125086 - Modular heat sink decoupling capacitor array forming heat sink fins and power distribution interposer module A modular heat sink decoupling capacitor array includes a plurality of modules, each defining parallel distributed decoupling plates, and each module forming a heat sink fin. Each module includes multiple spaced apart contacts for providing low inductance connections with an associated device. A power distribution interposer module is attached to ... 06/08/06 - 20060118947 - Thermal expansion compensating flip chip ball grid array package structure A flip chip ball grid array package is provided. In one embodiment, a flip chip ball grid array package comprises an inorganic substrate, a die disposed on the substrate, the die having a coefficient of thermal expansion approximately equal to the coefficient of thermal expansion of the substrate, a heat ... 06/01/06 - 20060113661 - Cooling system of power semiconductor module A cooling system of a power semiconductor module of the invention includes a temperature detection sensor provided in a semiconductor element as a heat source provided in a power semiconductor module, and a controller which estimates a change of a heat transfer coefficient from the power semiconductor module to cooling ... 05/18/06 - 20060103010 - Semiconductor package system with substrate heat sink A semiconductor package system is provided including: providing a substrate having substrate wiring and a cavity provided therein with a heat sink foil closing off the cavity; attaching a semiconductor die in the cavity to the heat sink foil; and bonding the semiconductor die to the substrate wiring. ... 05/18/06 - 20060103009 - Integrated circuit package system with heat slug An integrated circuit package system is provided including providing a substrate having a die attached and electrically bonded thereto. The system includes forming heat slug pillars on the substrate, positioning a heat slug on the heat slug pillars, and encapsulating the substrate, the die, the heat slug pillars, and the ... 05/18/06 - 20060103008 - Hyper thermally enhanced semiconductor package system A semiconductor package system is provided including mounting a semiconductor chip to a substrate having a substrate opening. A first heat slug is attached to a first surface of the semiconductor chip at least partially encapsulating the semiconductor chip. A second heat slug is attached to the second surface of ... 05/18/06 - 20060103007 - Heater for annealing trapped charge in a semiconductor device A structure and associated method for annealing a trapped charge from a semiconductor device. The semiconductor structure comprises a substrate and a first heating element. The substrate comprises a bulk layer, an insulator layer and a device layer. The first heating element is formed within the bulk layer. A first ... 05/11/06 - 20060097382 - High frequency module A high frequency module includes an insulating substrate, an upper layer plated pattern (a signal line) formed on a main surface of the insulating substrate and electrically connected to a high frequency circuit to transmit a high frequency signal, a mounted part (an electronic component) mounted on the main surface ... 05/11/06 - 20060097381 - Chip package with grease heat sink The present invention relates to enhanced protection of the active surface and the bond wires or ball array of a microelectronic device, and to thermal management of the microelectronic device as it is packaged with a printed circuit board (PCB) or other substrate. The enhanced protection and thermal management are ... 05/11/06 - 20060097380 - Semiconductor module A semiconductor module includes a parts-mounting or packaging substrate, a plurality of power metal insulator semiconductor (MIS) chips which have top surfaces and back surfaces and are mounted by flip chip bonding on or above the package substrate while letting the top surfaces face the package substrate, a drive-use integrated ... 05/04/06 - 20060091529 - High capacity thin module system and method Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. The circuit-populated flexible circuitry is disposed about an edge of a rigid substrate thus placing the integrated circuitry on ... 05/04/06 - 20060091528 - High heat dissipation flip chip package structure A high heat dissipation flip chip package structure including a substrate, a chip, a supporting structure, and a heat spreader is provided. The substrate has a substrate surface. The chip has an active surface with several bumps formed thereon. The bumps are connected to the substrate surface. The supporting structure ... 05/04/06 - 20060091527 - Semiconductor package with heat sink and method for fabricating same A semiconductor package with a heat sink and a method for fabricating the same are proposed. The heat sink is provided with a rigid and thermally resistant detach member on a top surface thereof, and is attached via its bottom surface to a chip mounted on a chip carrier. The ... 04/27/06 - 20060087026 - Audio amplifier assembly An audio amplifier assembly that includes a semiconductor package having a semiconductor power die tuned for class D amplifier applications and a conductive clip used for low inductance integration into the amplifier circuit. ... 04/20/06 - 20060081978 - Heat dissipating package structure and method for fabricating the same A heat dissipating package structure includes a chip carrier; a semiconductor chip mounted and electrically connected to the chip carrier; a heat spreader having a first surface, an opposed second surface and a hollow structure, the second surface of the heat spreader being mounted on the chip, wherein the chip ... 04/13/06 - 20060076672 - Magnetic attachment method for led light engines A light engine (16) includes at least one LED (12) for generating light of one of a plurality of wavelengths. The LED (12) is disposed on the magnetic core printed circuit board (14). A heatsink (26) is disposed in thermal communication with a base (24) and the LED (12) for ... 03/23/06 - 20060060963 - Heat dissipation for chip-on-chip ic packages Disclosed herein are IC package devices and related methods of manufacturing. In one embodiment, an package device includes first and second package substrates, and a first IC chip having at least one coupling structure formed on its active region for electrically coupling the first chip to the first substrate. The ... 03/16/06 - 20060055028 - Semiconductor device According to an aspect of the present invention, a semiconductor device, including: a semiconductor chip having a first metal heat conductive medium in the inside thereof; a substrate having a second metal heat conductive medium thermally connected to the first metal heat conductive medium; and a temperature control device of ... 03/16/06 - 20060055027 - Semiconductor device A semiconductor apparatus includes a semiconductor chip 61 including a power semiconductor device using a wide band gap semiconductor, base materials 62 and 63, first and second intermediate members 65 and 68a, a heat conducting member 66, a radiation fin 67, and an encapsulating material 68 for encapsulating the semiconductor ... 03/02/06 - 20060043578 - Semiconductor device having heat sink A semiconductor device, which may include a heat sink using a thermal induced adhesive is provided. The adhesive strength of the thermal induced adhesive at room temperature may be reduced when heated. The thermal induced adhesive may attach the heat sink to the semiconductor device, and may result in a ... 03/02/06 - 20060043577 - Structure and process of semiconductor package with an exposed heatsink A structure and a process of semiconductor package with an exposed heatsink not only reduces the mold-clamping force acted on the chip but also improves the heat-dissipation by the heatsink directly adhered on the chip. Furthermore, the reliability of the semiconductor package is also improved. The structure of semiconductor package ... 03/02/06 - 20060043576 - Structures and methods for heat dissipation of semiconductor integrated circuits Structures and methods for semiconductor integrated circuits with respect to heat dissipation are provided. The structure comprises a die having a first surface and a second surface. The first surface has an opening in it, and the second surface has a contact pad formed on it. The first surface is ... 02/23/06 - 20060038283 - Integrated circuit with increased heat transfer A technique for improving the thermal power dissipation of an integrated circuit includes reducing the thermal resistivity of the integrated circuit by increasing heat transfer in vertical and/or lateral directions. These results are achieved by increasing the surface area of the backside and/or the surface area of the lateral sides ... 02/23/06 - 20060038282 - Heatsink apparatus and thermally-conductive intermediate material for dissipating heat in semiconductor packages A semiconductor package comprising a die adjacent a lead frame die pad, said lead frame die pad adapted to dissipate heat from the die. The package further comprises a thermally-conductive material abutting the die and a heatsink abutting the thermally-conductive material, said heatsink facing a direction opposite from the lead ... 02/23/06 - 20060038281 - Multiple power density chip structure A multiple power density packaging structure with two or more semiconductor chips on a common wiring substrate having a common thermal spreader with a planar surface in thermal contact with the non-active surfaces of the chips. The semiconductor chips have different cooling requirements and some of the chips are thinned ... 02/16/06 - 20060033203 - Integrated circuit package and method for manufacturing same An integrated circuit package includes a die mounted on a substrate, an integrated heat spreader set above the die, and an array of carbon nanotubes mounted between the die and the integrated heat spreader. The integrated heat spreader is fixed on the substrate, and includes an inner face. The array ... 02/16/06 - 20060033202 - Semiconductor package, printed board mounted with the same, and electronic apparatus having the printed board A holding fixture that holds a component and mounts the component on an electronic circuit board includes a holding member that holds the component at a side of a first surface of the electronic circuit board, a first fixing member that includes a first base that is engageable with the ... 02/09/06 - 20060027915 - Device packages with low stress assembly process A microelectromechanical device package and a low-stress inducing method for packaging a microelectromechanical device are disclosed in this invention. The microelectromechanical device is accommodated within a cavity comprised by a first package substrate and a second substrate, wherein a third substrate is disposed between and bonded to both the microelectromechanical ... 01/19/06 - 20060012032 - Electronic device with semiconductor chip including a radiofrequency power module An electronic device, including a radiofrequency power module, includes a cavity housing including a housing frame with plastic walls and with a metal frame including a top side and a rear side, a metallic housing bottom including at least one chip island, and at least one semiconductor chip. Each semiconductor ... 01/19/06 - 20060012031 - Heat dissipation device for integrated circuits An integrated circuit (27, 67) is packaged by mounting it onto a substrate (11, 55) with a heat conductive plate (1, 41) interposed between the integrated circuit (27, 67) and the substrate (11, 55). The plate (1, 41) has portions (5, 7, 9) extending laterally out from under the integrated ... 01/12/06 - 20060006524 - Light emitting diode having an adhesive layer formed with heat paths The present invention is related to a light emitting diode having an adhesive layer provided with heat paths. In the present invention, an adhesive layer is formed to bond the substrate and the LED stack. There are a plurality of metal protrusions or semiconductor protrusions passing through the adhesive layer ... 12/29/05 - 20050285259 - Semiconductor device with magnetically permeable heat sink A semiconductor device is attached to a heat sink by glue that is both thermally conductive and magnetically permeable. The glue fills different features in the surface of the semiconductor device so that there is good coupling between the semiconductor device and the heat sink. The glue is filled with ... 12/29/05 - 20050285258 - Semiconductor package with exposed heat sink and the heat sink thereof A semiconductor package with an exposed heat sink and the heat sink thereof are proposed. A carrier having a first surface and a second surface is provided. At least one chip is mounted on the first surface of the carrier and electrically connected to the carrier. A heat sink includes ... 12/29/05 - 20050285257 - Encapsulated device with heat isolating structure The present invention provides an encapsulated device with heat isolating structure and a reflow soldering method thereof. The encapsulated device has a micro heat spreader with vapor chamber formed on the surface, and a cover covers the encapsulated device and wraps the micro heat spreader. A hermetical space is formed ... 12/22/05 - 20050280140 - Packaging for enhanced thermal and structural performance of electronic chip modules In an integrated circuit packaging structure, such as in a SCM, DCM, or MCM, a method and apparatus for increasing heat spreader size and thus thermal performance is disclosed. The packaging structure includes a first substrate; an electronic device operably coupled to a top surface defining the first substrate; a ... 12/15/05 - 20050275086 - Semiconductor package and process utilizing pre-formed mold cap and heatspreader assembly A semiconductor integrated circuit package incorporating a preformed one-piece mold cap and heatspreader assembly is disclosed. One implementation includes a substrate with a die attached to the substrate. The die is electrically connected with electrical connections formed on the substrate using bonding wires. A preformed one-piece integrated mold cap and ... 12/08/05 - 20050269689 - Conductor device and method of manufacturing thereof A semiconductor device has a package substrate, and a heat spreader having a first surface attached to the package substrate. The heat spreader has a lattice-shaped slit opening on at least the first surface. ... 12/01/05 - 20050263879 - Patterned structure for a thermal interface The present invention provides a thermal interface with a first and a second face that are in contact to each other by a thermal conducting material. A first face includes grooves that are at least partly filled with the thermal conducting material, wherein at least two types of grooves are ... 11/17/05 - 20050253251 - Heat sink and method for processing surfaces thereof A heat sink and a method for processing the surfaces of the heat sink are disclosed. The heat sink and a method for processing the surfaces of the heat sink can improve performance of heat dissipation of the heat sink per volume as a plurality of fine wires based on ... 11/10/05 - 20050248026 - Semiconductor device with pins and method of assembling the semiconductor device A semiconductor device includes a substrate having a semiconductor element mounted thereon, and a heat sink. A plurality of pins are inserted in holes in the heat sink and holes in the substrate to secure the heat sink to the substrate. The pin has an enlarged portion at one end ... 10/20/05 - 20050230817 - Chip bonding heater with differential heat transfer The invention provides a heater for flip chip bonding. The heater transfers more heat to the periphery of a die than to the center. This results in a more even temperature profile along the die and helps prevent epoxy voiding problems. ... 10/20/05 - 20050230816 - Semiconductor module mounting structure, a cardlike semiconductor module, and heat receiving members bonded to the cardlike semiconductor module A semiconductor module has metallic radiator plates provided at central regions of principal surfaces of a sealing resin so as to expose from these principal surfaces. The metallic radiator plates and the principal surfaces of the sealing resin are bonded via grease gaps to heat receiving members. The grease gaps ... 10/13/05 - 20050224957 - Semiconductor package with heat dissipating structure and method of manufacturing the same A semiconductor package in which heat is easily dissipated and a semiconductor chip is not damaged during a molding process, and a method of manufacturing the same. The semiconductor package with a heat dissipating structure includes a substrate, a semiconductor chip, which is mounted on the substrate and electrically connected ... 10/13/05 - 20050224956 - Chip package structure and chip packaging process A chip packaging process is provided. First, a cavity is formed on a heat sink. A first encapsulant is formed on the bottom of the cavity. A circuit substrate is disposed over the heat sink. The circuit substrate has an opening that corresponds in position to the cavity. Thereafter, a ... 10/13/05 - 20050224955 - Method and apparatus for establishing improved thermal communication between a die and a heatspreader in a semiconductor package A semiconductor package comprising a packaging substrate, a semiconductor die mounted with the substrate, a heatspreader, and a multi-layer heat transfer element arranged between the semiconductor die and the heat spreader to enable thermal communication between the die and the heat spreader is disclosed. The multi-layer heat transfer element includes ... 10/13/05 - 20050224954 - Thermal dissipation in integrated circuit systems Integrated circuit systems with thermal dissipation enhancement features are described. In one aspect, an integrated circuit system includes a die incorporating an integrated circuit. The die has a top side and a bottom side. The top side supports an electrical signal communication metallization and a top side thermal dissipation metallization. ... 09/15/05 - 20050199999 - Semiconductor device One of the aspects of the present invention is to provide a semiconductor device including a semiconductor element or chip, which has a peripheral edge and a central portion and is mounted on an insulating substrate via a conductive bonding layer. At least one peripheral thermal sensor is arranged adjacent ... 09/15/05 - 20050199998 - Semiconductor package with heat sink and method for fabricating the same and stiffener A semiconductor package with a heat sink, a method for fabricating the same and a stiffener for the semiconductor package are proposed. At least one chip and the stiffener surrounding the chip are mounted on a substrate, and the heat sink is respectively attached to a non-active surface of the ... 08/25/05 - 20050184386 - Heat dissipation structure for electronic device A heat dissipation structure for an electronic device comprises a plurality of covering members made of a compressed wooden material, and a metal heat dissipation frame held between the covering members, and a portion of the heat dissipation frame is exposed outside of the electronic device. ... 08/25/05 - 20050184385 - Semiconductor device with improved thermal characteristics A semiconductor device includes a substrate and an active region formed in the substrate proximate an upper surface of the substrate. The active region includes at least one circuit element formed therein. At least one channel is formed in a back surface of the substrate opposite the upper surface of ... 08/18/05 - 20050179126 - Diamond-silicon hybrid integrated heat spreader An electronic device includes a die further having a first major surface, and a second major surface. The electronic device also includes a plurality of connectors associated with the first major surface of the die, and an integrated heat spreader in thermally conductive relation with the second major surface of ... 08/18/05 - 20050179125 - Thermally enhanced metal capped bga package A thermally enhanced wirebond BGA package having a laminate substrate, an IC device mounted on the substrate, and a metal cap defining a cavity inside the package between the IC device and the metal cap. A substantial portion of the cavity is filled with a thermally enhanced epoxy encapsulant establishing ... 07/14/05 - 20050151242 - Semiconductor device A semiconductor chip is mounted on an upper surface of the heat sink plate that is provided with a plurality of heat releasing terminals on a lower surface of the heat releasing. A plurality of electric signal terminals are regularly disposed in a lattice-like manner around the heat sink plate. ... 06/30/05 - 20050139995 - Cte-matched heat pipe Heat sinks having a mounting surface with a coefficient of thermal expansion matching that of silicon are disclosed. Heat pipes having layered composite or integral composite low coefficient of expansion heat sinks are disclosed that can be mounted directly to silicon semiconductor devices. ... 06/30/05 - 20050139994 - Semiconductor package A semiconductor package includes a die attached to a substrate. Multitudes of conductive structures are conductively connected the die and the substrate. One molding compound encapsulates the die, and thermal interface material is on the molding compound. Next, a heat sink is on the thermal interface material. The mold compound ... 06/30/05 - 20050139993 - Plastic microfabricated structure for biochip, microfabricated thermal device, microfabricated reactor, microfabricated reactor array, and micro array using the same Provided are a plastic microfabricated structure, and a microfabricated thermal device, a microfabricated reactor, a microfabricated reactor array and a micro array using the same, which may be applied to a bio chip, and the present invention may fabricate the plastic microfabricated structure for providing a heating region by means ... 06/30/05 - 20050139992 - Integrated stacked microchannel heat exchanger and heat spreader Integrated stacked microchannel heat exchanger and heat spreaders for cooling integrated circuit (IC) dies and packages and cooling systems employing the same are disclosed. In one embodiment, a stacked microchannel heat exchanger is operatively and thermally coupled to an IC die or package using an interstitial solder or a solderable ... 06/30/05 - 20050139991 - Thermal intermediate apparatus, systems, and methods Apparatus and system, as well as fabrication methods therefor, may include a thermal intermediate structure comprised of a plurality of carbon nanotubes some of which have organic moieties attached thereto to tether the nanotubes to at least one of a die and a heat sink. The organic moieties include thiol ... 06/23/05 - 20050133905 - Method of assembling a ball grid array package with patterned stiffener layer Electrically, mechanically, and thermally enhanced ball grid array (BGA) packages are described. An IC die is mounted in a centrally located cavity of a substantially planar first surface of a stiffener. The first surface of a substrate is attached to a substantially planar second surface of the stiffener. The second ... 06/16/05 - 20050127501 - Ball grid array package substrates with a modified central opening and method for making the same An electrically and mechanically enhanced die-down tape substrate ball grid array (BGA) package substrate is described. An IC package includes a substrate that has a first surface. The first surface has a central opening. A stiffener/heat spreader has a first surface. The first surface of the stiffener has a central ... 06/16/05 - 20050127500 - Local reduction of compliant thermally conductive material layer thickness on chips In an integrated circuit packaging structure, such as in an MCM or in a SCM, a compliant thermally conductive material is applied between a heat-generating integrated circuit chip and a substrate attached thereto. Raised regions are defined on the back side of the chip aligned to areas of a higher ... 06/09/05 - 20050121774 - Electrical circuit apparatus and methods for assembling same An electrical circuit apparatus (300) that includes: a substrate (330) having a ground layer (336), at least one thermal aperture (332), and at least one solder aperture (334); a heat sink (310); and an adhesive layer (320) for mechanically coupling the heat sink to the ground layer of the substrate ... ### FreshPatents.com Support |