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Active Solid-state Devices (e.g., Transistors, Solid-state Diodes) > Housing Or Package > Insulating Material > Composite Ceramic, Or Single Ceramic With Metal Composite Ceramic, Or Single Ceramic With MetalComposite Ceramic, Or Single Ceramic With Metal patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.01/18/07 - 20070013050 - Structure of an over-current protection device and method for manufacturing the same This invention is novel structure of an over-current protection device and manufacturing method thereof. The over-current protection device is formed with a main body with a lead frame and a ceramic fiber lead wound by a metal wire exteriorly, by coating the exterior of the whole lead with a thermally-insulating ... 07/27/06 - 20060163719 - Semiconductor device and method of manufacturing a semiconductor device There is provided a semiconductor device including, a bed, a brazing filler metal formed on a first surface of the bed, a barrier metal film formed on a first surface of the brazing filler metal, a alloy film formed on a first surface of the barrier metal film, a semiconductor ... 06/08/06 - 20060118945 - Low cost hermetic ceramic microcircuit package Hermeticity of microcircuit packages is achieved in one embodiment by recognition that water can penetrate the ceramic structure and thus the ceramic structure is sealed and the edges of the ceramic package are metallically bonded to the electronic package. In one embodiment, a clear ceramic dielectric compound is sprayed on ... 05/18/06 - 20060103006 - Substrate design to improve chip package reliability A substrate design to improve chip package reliability is provided. The chip package includes a substrate having a ceramic layer formed in a recess. A die is attached to the substrate on the ceramic layer. The substrate may be attached to a printed circuit board. The substrate may be fabricated ... 05/18/06 - 20060103005 - Metal-ceramic substrate for electric circuits or modules, method for producing one such substrate and module comprising one such substrate The invention relates to a metal-ceramic substrate for electric circuits or modules, said substrate comprising a ceramic layer which is provided with at least one metallic layer of a first type applied to a surface of said ceramic layer in a plane manner. An insulating layer consisting of a glass-containing ... 04/20/06 - 20060081977 - Ceramic multilayer substrate A ceramic multilayer substrate has a ceramic laminate including a plurality of ceramic layers laminated, having a first main surface, and including internal circuit elements disposed in the inside, a resin layer having a bonding surface in contact with the first main surface of the ceramic laminate and a mounting ... 01/26/06 - 20060017155 - Flip chip package capable of measuring bond line thickness of thermal interface material A flip chip package includes a substrate, a flip chip, a thermal interface material and a heat sink. The flip chip is mounted on the substrate. The thermal interface material is applied on the back surface of the flip chip. The back surface of the flip chip includes a region ... 12/01/05 - 20050263877 - Laminated radiation member, power semiconductor apparatus, and method for producing the same A laminated radiation member includes a radiation plate, an insulation substrate bonded to the upper surface of the radiation plate and an electrode provided on the upper surface of the insulation substrate. The laminated radiation member is made by a method including the steps of surface treating a bonding surface ... 10/06/05 - 20050218506 - Non-magnetic, hermetically-sealed micro device package A process for preparing an electronic package comprising: (a) providing a ceramic housing defining an internal cavity for receiving a micro device and having one or more interface portions; (b) treating the housing to form a tungsten layer on the interface portions; and (c) overlaying a palladium layer on the ... 07/14/05 - 20050151241 - Multilayer ceramic substrate with single via anchored pad and method of forming A multilayer ceramic substrate in which an outer metal pad is anchored to the substrate by a single metal-filled via in the first ceramic layer adjacent to the metal pad. In turn, this single metal-filled via is anchored to the substrate by a larger, single metal-filled via in the next ... 06/23/05 - 20050133903 - Integrated circuit package substrate having a thin film capacitor structure This invention relates to the manufacture of a substrate, such as a package substrate or an interposer substrate, of an integrated circuit package. A base structure is formed from a green material having a plurality of via openings therein. The green material is then sintered so that the green material ... ### FreshPatents.com Support - Terms & Conditions |