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Active Solid-state Devices (e.g., Transistors, Solid-state Diodes) > Housing Or Package > With Contact Or Lead > Having Power Distribution Means (e.g., Bus Structure) Having Power Distribution Means (e.g., Bus Structure)Having Power Distribution Means (e.g., Bus Structure) patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.01/10/08 - 20080006928 - Composite multi-layer substrate and module using the substrate A composite multi-layer substrate comprising a flat plate-like core member formed of a material having an excellent electric conductivity, an excellent heat conductivity, and a high rigidity, a front resin layer and a rear resin layer covering at least the front and rear surfaces of the core member, and a ... 01/10/08 - 20080006927 - Manufacturing process for single-chip mmc/sd flash memory device with molded asymmetric circuit board An MMC/SD core unit includes a PCBA in which all passive components and unpackaged IC chips are attached to a single side of a PCB opposite to the metal contacts. The IC chips include, for example, a controller chip and a flash memory chip, or a single-chip (combined controller/flash memory) ... 11/15/07 - 20070262438 - System and method of silicon switched power delivery using a package In one particular embodiment, an integrated circuit includes a package and a substrate electrically and physically coupled to the package. The package includes a first pin, a second pin, and metallization coupling the first pin to the second pin. The substrate is coupled to the package via the first pin ... 10/11/07 - 20070235855 - Methods and apparatus for a reduced inductance wirebond array A wirebond array (100) comprising a plurality of signal wires 110 and a plurality of ground wires (120) interdigitated with and substantially parallel to the set of signal wires (110). In one embodiment, each of the plurality of signal wires (110) and ground wires (120) is attached to a first ... 09/27/07 - 20070222059 - Direct power delivery into an electronic package In some embodiments, direct power delivery into an electronic package is presented. In this regard, a substrate is introduced having a conductive substrate core designed to physically connect with a power cable. Other embodiments are also disclosed and claimed. ... 09/20/07 - 20070216014 - Separable network interconnect systems and asemblies Microelectronic assemblies interconnected using a separable network interface and electronic systems using the microelectronic assemblies to physically separate high performance signals and lower performance signals to enhance system performance are disclosed. ... 07/19/07 - 20070164420 - Apparatus and methods for packaging dielectric resonator antennas with integrated circuit chips Apparatus and methods are provided for integrally packaging antenna devices with semiconductor IC (integrated circuit) chips, wherein IC chips are packaged with dielectric resonators antennas that are integrally constructed as part of a package molding (encapsulation) process, for example, to form compact integrated radio/wireless communications systems for millimeter wave applications. ... 07/12/07 - 20070158818 - Integrated capacitors in package-level structures, processes of making same, and systems containing same An article includes a top electrode that is embedded in a solder mask. An article includes a top electrode that is on a core structure. A process of forming the top electrode includes reducing the solder mask thickness and forming the top electrode on the reduced-thickness solder mask. A process ... 07/12/07 - 20070158817 - Semiconductor device A semiconductor device includes, in first and second power source systems, electrostatic discharge (ESD) protective bonding pads connected by bonding wires to first and second power supply terminals and first and second ground terminals, first and second signal ESD protective element sections that are each connected to first and second ... 05/31/07 - 20070120245 - Semiconductor device Mutual inductance from an external output signal system to an external input signal system, in which parallel input/output operation is enabled, is reduced. A semiconductor integrated circuit has a plurality of external connection terminals facing a package substrate, and has an external input terminal and an external output terminal, in ... 05/31/07 - 20070120244 - Semiconductor device having electrostatic breakdown protection element A semiconductor device (1) comprises a semiconductor substrate (2) on which an integrated circuit (3, 4) is formed, a first ground terminal (7) and a second ground terminal (8) for electrically connecting the integrated circuit (3, 4) to an external ground electrode, and an electrostatic breakdown protection element (5) for ... 05/17/07 - 20070108588 - Multilayer wiring board, manufacturing method thereof, semiconductor device, and wireless electronic device A multilayer wiring board exhibiting excellent moldability and having a capacitor where variation of capacitance is suppressed, its producing method, a semiconductor device mounting a semiconductor chip on the multilayer wiring board, and a wireless electronic device mounting the semiconductor device. ... 05/17/07 - 20070108587 - Integrated circuit package system with a heat sink An integrated circuit package system is provided forming a substrate having an integrated circuit die thereon, thermally connecting a heat slug and a resilient thermal structure to the integrated circuit die, and encapsulating the resilient thermal structure. ... 04/26/07 - 20070090511 - Power core devices and methods of making thereof A device comprising a power core wherein said power core comprises: at least one embedded singulated capacitor layer containing at least one embedded singulated capacitor wherein said embedded singulated capacitor comprises at least a first electrode and a second electrode and wherein said embedded singulated capacitor is positioned on the ... 04/19/07 - 20070085191 - Lead pin, circuit, semiconductor device, and method of forming lead pin A lead pin of a circuit includes a pin, an insulator that surrounds the pin, and a conductor that surrounds the insulator, the conductor including non-uniformity. ... 03/15/07 - 20070057359 - Energy conditioning circuit assembly and component carrier The present invention is a component carrier (132) comprising of a plate of insulating material having a plurality of apertures (140) for accepting the leads of a thru-hole differential and common mode filter (130). Another embodiment comprises of a surface mount component carrier (10) comprising a disk (16) of insulating ... 03/01/07 - 20070045810 - Multichip sensor A multichip sensor includes an element chip having a detection element of a sensor; a signal-processing IC chip having a signal-processing IC for processing an output signal of the detection element; and a package adapted to accommodate at least the element chip and the signal-processing IC chip and having a ... 03/01/07 - 20070045809 - Quad flat pack (qfp) package and flexible power distribution method therefor A Quad Flat Pack (QFP) package which includes first and second dies arranged in a side-by-side orientation, and a power supply bus which protrudes between adjacent sides of the first and second dies and which supplies power to the adjacent sides via connections to the adjacent sides. ... 02/08/07 - 20070029662 - Semiconductor device having termination circuit line A semiconductor device may have a plurality of dielectric layers and at least one termination circuit line between the dielectric layers. The termination circuit lines may be formed over the active surface of a semiconductor substrate. ... 02/08/07 - 20070029661 - Power plane design and jumper wire bond for voltage drop minimization According to one embodiment of the invention, a power system for a die comprises a plurality of supply voltage lines, a plurality of ground lines, a plurality of metallized rails, and a via. Each of the plurality of supply voltage lines are in communication with at least one supply voltage ... 01/25/07 - 20070018307 - Integrated circuit chip module An integrated circuit chip module includes a first integrated circuit chip including a first power source pad for a first power voltage and an adjacent second power source pad for a second power voltage, the first power voltage being higher than the second power voltage, a second integrated circuit chip ... 01/11/07 - 20070007642 - Semiconductor integrated circuit device A semiconductor integrated circuit device includes a functional circuit block, a power supply for supplying power to the functional circuit block, a power supply interruption circuit disposed between the functional circuit block and the power supply and including a plurality of switching elements, and a power supply interruption control circuit ... 01/11/07 - 20070007641 - Chip-embedded interposer structure and fabrication method thereof, wafer level stack structure and resultant package structure A method for fabricating a chip-embedded interposer may comprise forming at least one cavity on a silicon substrate, forming a plurality of through vias penetrating the silicon substrate, providing an integrated circuit chip having a plurality of I/O pads, and forming rerouting conductors connected to the I/O pads and the ... 12/28/06 - 20060289983 - System, method and device for reducing electromagnetic emissions and susceptibility from electrical and electronic devices A system, device, and method are provided to analyze and provide recommendations regarding electrical noise in circuitry. A rule and algorithm-based recommendation generator may be used to analyze electrical noise at the schematic design stage. The engineer is provided with detailed recommendations of changes to the schematic diagram of the ... 12/21/06 - 20060284302 - Semiconductor integrated circuit including a power supply, semiconductor system including a semiconductor integrated circuit, and method of forming a semiconductor integrated circuit Provided are a semiconductor integrated circuit including a power supply, a semiconductor system including the semiconductor integrated circuit, and a method of forming the semiconductor integrated circuit. The semiconductor integrated circuit includes: a semiconductor substrate on a surface of which a plurality of electrical circuits and a plurality of power ... 11/30/06 - 20060267177 - Semiconductor bga package having a segmented voltage plane A semiconductor device assembly and method of making the device are disclosed. The assembly comprises a semiconductor die attached to an electrically conductive layer, which is, in turn, connected to a dielectric layer carrying conductive traces of the electrical connection layer. The conductive traces provide connection between an array of ... 11/30/06 - 20060267176 - Method of assembling electronic components of an electronic system, and system thus obtained An electronic system comprising: an electronic system support substrate for the attachment of components of the electronic system, the electronic system support substrate including electric signal propagation paths for the propagation of electric signals between the system components; at least a first and a second electronic components wherein at least ... 11/02/06 - 20060244122 - Electronic circuit device An electronic circuit device has a high-density mount board (2), on which are disposed a microcomputer (3) and random access memory (7) which are connected to each other through an exclusive memory bus (12) for high-speed data transfer, a programmable device (8) which is a variable logic circuit represented by ... 10/26/06 - 20060237835 - Electronic circuit device An electronic circuit device has a high-density mount board (2), on which are disposed a microcomputer (3) and random access memory (7) which are connected to each other through an exclusive memory bus (12) for high-speed data transfer, a programmable device (8) which is a variable logic circuit represented by ... 10/26/06 - 20060237834 - Method for forming an electric device comprising power switches around a logic circuit and related apparatus A method for forming an electric device having power switches around a logic circuit including: forming a logic circuit on a substrate; forming a plurality of power switches around the logic circuit; and coupling first ends of the power switches to a voltage end, and coupling second ends of the ... 10/12/06 - 20060226531 - Power semiconductor module A semiconductor power module has a support (1), whereon are formed conductor strips (5, 6, 7, 8) by applying a structure on an electrically conductive layer (3) applied on one side (2) of the support. A semiconductor power module can be manufactured easily and economically enabling several mounting technologies by ... 10/12/06 - 20060226530 - Advanced standard cell power connection A method for establishing standard cell power connections is disclosed. The method generally includes the steps of (A) calculating a power consumption of a plurality of logic cells receiving power directly from a power rail, (B) removing at least one excess via from a plurality of vias directly connecting the ... 10/05/06 - 20060220216 - Circuit device and manufacturing method thereof A circuit device includes a ceramic substrate, an Al wiring layer provided on the ceramic substrate, and a semiconductor device and a bus bar which are electrically connected to the wiring layer. On part of the wiring layer, a Ni layer is plated. Thus a coated region in which the ... 10/05/06 - 20060220215 - Semiconductor chips having redistributed power/ground lines directly connected to power/ground lines of internal circuits and methods of fabricating the same Provided are embodiments of semiconductor chips having a redistributed metal interconnection directly connected to power/ground lines of an internal circuit are provided. Embodiments of the semiconductor chips include an internal circuit formed on a semiconductor substrate. A chip pad is disposed on the semiconductor substrate. The chip pad is electrically ... 09/14/06 - 20060202321 - Impedance matching external component connections with uncompensated leads In one aspect, an electronic assembly includes an interconnection substrate, a component, and a discontinuity compensator. The interconnection substrate includes a signal conductor and a ground conductor. The component includes a device having a signal line and a ground conductor, a package, and a signal lead. The signal lead is ... 08/24/06 - 20060186530 - Memory device power distribution in memory assemblies A memory assembly has a memory package with a plurality of interconnect pins having a plurality of first power input pins located on a first side of the memory package, the first power input pins independent of each other. A lead-over-chip leadframe has a plurality of leads coupled to the ... 08/17/06 - 20060180918 - Semiconductor device and method of manufacturing the same To prevent an electrostatic noise from entering a non-connected power supply pad from a round power supply wiring, there is provided a semiconductor device, including: a round power supply wiring; a plurality of power supply pads that are connected to the same potential through internal power supply wirings; a signal ... 08/17/06 - 20060180917 - Circuit board for reducing crosstalk of signals A circuit board includes a first group of layers located close to a top side of the circuit board, and a second group of layers located close to an underside of the circuit board. Signals which are fed to input and output contact terminals on the top side of the ... 08/17/06 - 20060180916 - Ground arch for wirebond ball grid arrays A structure provides for the control of bond wire impedance. In an example embodiment, there is an integrated circuit device (100) comprising an integrated circuit (130) having a plurality (115) of grounding pads, signal pads, and power pads and a package (110) for mounting the integrated circuit and includes a ... 08/10/06 - 20060175698 - Semiconductor device A semiconductor device includes a pad composed of plural wiring layers and a power supply ring to provide a power supply provided through the pad for the power supply to an internal circuit, and the pad for the power supply and the power supply ring are connected by vias provided ... 08/03/06 - 20060170093 - Flip chip interconnection pad layout A flip chip interconnect pad layout has the die signal pads are arranged on the die surface near the perimeter of the die, and the die power and ground pads arranged on the die surface inboard from the signal pads; and has the signal pads on the corresponding package substrate ... 07/27/06 - 20060163715 - Flip chip interconnection pad layout A flip chip interconnect pad layout has the die signal pads are arranged on the die surface near the perimeter of the die, and the die power and ground pads arranged on the die surface inboard from the signal pads; and has the signal pads on the corresponding package substrate ... 07/20/06 - 20060157845 - Semiconductor device When an integrated circuit is formed in a semiconductor wafer, the integrated circuit is formed only in the central part of each chip region. In a case where packaging other than a chip size package is made, only the central part in which the integrated circuit is formed is cut ... 06/29/06 - 20060138636 - Device for electrical connection of an integrated circuit chip A device is provided for electrically connecting an integrated circuit chip. The device includes a main board, an intermediate board, and electrical connection balls in a space separating the boards. In the space, a peripheral zone comprises a peripheral matrix of balls, a central zone comprises a central matrix of ... 06/22/06 - 20060131727 - Semiconductor device Radiation noise is reduced, and any operation error is prevented by suppressing noise propagation between an input/output circuit and an internal circuit while preventing or minimizing an increase in the number of steps of semiconductor element design. A semiconductor device having an input/output circuit region and an internal circuit region ... 06/22/06 - 20060131726 - Arrangement of input/output pads on an integrated circuit Input/output pads are arranged on an integrated circuit. Input/output pads are placed around a perimeter of core circuitry. Each input/output pad has an input/output pad bond opening with a height in a direction perpendicular to the perimeter of the core circuitry and with a width in a direction parallel to ... 06/22/06 - 20060131725 - System for implementing a configurable integrated circuit The present invention provides a system for implementing a configurable integrated circuit (IC). Aspects of the invention include an IC die; a plurality of input/outputs (I/Os) coupled to the IC die; and a plurality power planes coupled to the IC die for providing power to the plurality of I/Os at ... 06/15/06 - 20060125078 - Semiconductor device A semiconductor device is provided which includes a semiconductor element having power pads for supplying a power potential, ground pads for supplying a ground potential, and signal pads for inputting and outputting a signal, all of which are formed on one main surface thereof. Power bumps for outside connection are ... 06/01/06 - 20060113657 - Designated mosfet and driver design to achieve lowest parasitics in discrete circuits Apparatus are described for a pair of MOSFET power transistors, a MOSFET driver, and an idealized circuit layout utilized in a power stage such as that of a power conversion system. The power stage comprises a pair of MOSFET transistors having substantially identical electrical characteristics and complementary package configurations for ... 04/27/06 - 20060087024 - Method and system for an improved power distribution network for use with a semiconductor device Systems and methods for a structure for a power distribution network intended to distribute power from a PCB to a semiconductor device on a package. These improved power distribution networks may reduce current crowding in the BGA balls of a package and may serve to more equitably distribute current through ... 04/13/06 - 20060076668 - Multi-layer printed circuit board A multi-layer PCB includes a first signal layer, a ground layer, a second signal layer, a third signal layer, an electric power layer, and a fourth signal layer, including a first insulating layer arranged between the first signal layer and the ground layer; a second insulating layer arranged between the ... 04/06/06 - 20060071320 - Semiconductor device Fine-pitch first and second bonding pads are formed on a chip along its perimeter. The first bonding pads are formed at the peripheral parts on the chip, while the second bonding pads are formed inside the peripheral parts. An ESD protection circuit is connected to the first bonding pad, and ... 04/06/06 - 20060071319 - Semiconductor integrated circuit In a semiconductor integrated circuit including a plurality of cells, a supplementary power-supply wire is disposed between a lattice-shaped upper power-supply wire and a lower cell power-supply wire for cases in which power is supplied from the upper power-supply wire to the lower cell power-supply wire. The supplementary power-supply wire ... 03/16/06 - 20060055022 - Routing power and ground vias in a substrate A method for routing vias in a multilayer substrate is disclosed. One embodiment of a method may comprise providing a multilayer substrate with an internal bond surface having a plurality of internal bond pads and an external bond surface with a plurality of external bond pads. A plurality of power ... 02/23/06 - 20060038277 - Semiconductor device and electronic apparatus using the same A semiconductor device contains a semiconductor chip, and includes first and second circuits, a control signal line and a terminal. The first circuit is arranged in a center of the semiconductor chip and is configured to operate in a first voltage. The second circuit is arranged in an input/output circuit ... 02/16/06 - 20060033197 - Power gridding scheme An electrical device includes electrical contact pads, a supply voltage bus and an interconnection circuit. The electrical contact pads receive a supply voltage, and the bus is electrically connected to the electrical contact pads. For each electrical contact pad, the interconnection circuit forms a redundant connection between the bus and ... 12/22/05 - 20050280137 - Method and apparatus for providing wafer-level capacitive decoupling One embodiment of the present invention provides capacitive decoupling on the surface of a semiconductor die, instead of providing the decoupling on a package or printed circuit board to which the semiconductor die is attached. In this embodiment, a surface of a semiconductor die includes exposed power and ground conductors, ... 12/15/05 - 20050275082 - Vertical conduction power electronic device package and corresponding assembling method A vertical conduction power electronic device package and corresponding assembly method comprising at least a metal frame suitable to house at least a plate or first semiconductor die having at least a first and a second conduction terminal on respective opposed sides of the first die. The first conduction terminal ... 12/08/05 - 20050269684 - Semiconductor package including redistribution pattern and method of manufacturing the same A semiconductor device package includes a substrate, first and second chip pads spaced apart over a surface of the substrate, and an insulating layer located over the surface of the substrate. The insulating layer includes a stepped upper surface defined by at least a lower reference potential line support surface ... 11/10/05 - 20050248025 - Rf seal ring structure Described is a method where a seal ring is formed by stacking interconnected conductive layers along the perimeter of an integrated circuit (IC). The seal ring is formed continuously around the IC perimeter using a conductive chain with two distinct widths. Each section of distinct width forms a transmission having ... 11/10/05 - 20050248024 - Power delivery system for integrated circuits A system for delivering power to an integrated circuit (IC) component mounted on a circuit board includes a circuit board having a first side and an opposite second side. An IC component is mounted on the first side of the circuit board, and the IC component has a plurality of ... 11/10/05 - 20050248023 - Circuit board with high density power semiconductors A circuit board is provided with a plurality of MOSFETs (metal oxide semiconductor field effect transistors) each of which include a field effect transistor and an associated control circuit. The control circuits are mounted in a control section of the board remote from a power section mounting the MOSFETs. The ... 10/20/05 - 20050230806 - Conductive elements with adjacent, mutually adhered regions and semiconductor device assemblies including such conductive elements Conductive elements that include a plurality of adjacent, mutually adhered regions are disclosed. All of the regions may include the same type of material. At least a portion of such a conductive element may be configured to extend laterally. In a semiconductor device assembly, such a conductive element is in ... 09/22/05 - 20050205987 - Package design and method of manufacture for chip grid array A chip level package utilizing a CGA is described. A semiconductor chip with pillars is molded in an encapsulant. Solder balls are added and connected to the chip pillars. The final package does not require a first level substrate or interposer and is able to be assembled to the next ... 09/08/05 - 20050194675 - Capacitor-related systems for addressing package/motherboard resonance According to some embodiments, a device includes a first conductive plane electrically coupled to a first terminal associated with a first polarity and a second terminal associated with the first polarity, a second conductive plane electrically coupled to a third terminal associated with a second polarity, and a dielectric disposed ... 07/28/05 - 20050161801 - Apparatus and methods for measuring parasitic capacitance and inductance of i/o leads on an electrical component using a network analyzer Apparatus and methods are provided for measuring the potential for mutual coupling in an integrated circuit package of any type or configuration using a network analyzer in conjunction with a coaxial test probe. Simple, low-cost test fixturing and methods of testing may be used to measure the parasitic capacitance and ... 07/21/05 - 20050156307 - Multilayer printed circuit board A multilayer printed circuit board (PCB) includes a substrate; a ground layer having edges which define a gap portion, the ground layer being provided on a bottom face of the substrate; and at least two signal traces and provided on a top face of the substrate so as to straddle ... 07/21/05 - 20050156306 - Circuit board device for information apparatus, multilayered module board and navigation system A multilayered module board with mounted high-frequency electronic components such as a CPU and a graphic circuit is mounted on one face of a base board with mounted low-frequency electronic components. The multilayered module board is a squared multilayered board smaller than the base board. The electronic components are wired ... 07/14/05 - 20050151237 - Multi-chip assembly and method for driving the same Disclosed are a multi-chip assembly and a method for driving the same. The multi-chip assembly includes a first chip designed with a first device driven by a first power source and a second chip designed with a second device driven by a second power source. A power applying section applies ... 07/07/05 - 20050146014 - Seal ring for integrated circuits The present invention is directed to a seal structure and a method for forming a seal structure for a semiconductor die. An elongate region which is electrically isolated from the remainder of the substrate, such as a well region of a conductivity type opposite that of the substrate, extends around ... 07/07/05 - 20050146013 - Wafer-level testing apparatus A semiconductor component configured for wafer-level testing includes a semiconductor die having at least one die contact electrically exposed for coupling with a redistribution circuit that electrically couples at least one die contact to an extended contact such as a bumped contact. A wafer-level redistribution circuit interconnects a plurality of ... 06/23/05 - 20050133902 - Dual semiconductor die package with reverse lead form A semiconductor package that includes two semiconductor die each disposed on a respective die pad and a large tracking distance interposed between at least two leads of the package for better creepage characteristics. ... 06/23/05 - 20050133901 - System and method for delivering power to a semiconductor device A system for delivering power to a semiconductor device includes a package substrate comprising a substrate top surface and a substrate bottom surface. The system includes a connector formed on the substrate top surface and a cable coupled to the connector. The cable is operable to deliver power and ground ... 06/16/05 - 20050127492 - Semiconductor packages for enhanced number of terminals, speed and power performance An integrated circuit device package with a first part (101) having a cavity (104) to mount the chip (105), further I/O terminals (102) on the top surface and terminals (103) on the bottom surface. The chip has contact pads (107a and 107b). The second part (110) of the package has ... 06/09/05 - 20050121766 - Integrated circuit and method of manufacturing an integrated circuit and package A packaged IC includes an IC die with signal and signal complement traces positioned relative to each other to maximize broadside coupling for a matching impedance. The signal and signal complement traces are electrically connected to transmission or receive channels of the IC die. Use of a broadside coupled trace ... ### FreshPatents.com Support - Terms & Conditions |