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Active Solid-state Devices (e.g., Transistors, Solid-state Diodes) > Housing Or Package > With Contact Or Lead > Having Power Distribution Means (e.g., Bus Structure)

Having Power Distribution Means (e.g., Bus Structure)

Having Power Distribution Means (e.g., Bus Structure) patent applications listed include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.

02/06/14 - 20140035120 - Semiconductor unit
A semiconductor unit includes an insulation layer, a conductive layer bonded to one side of the insulation layer, a semiconductor device mounted on the conductive layer, a cooler thermally coupled to the other side of the insulation layer, a first bus bar having a bonding surface bonded to the semiconductor...

01/09/14 - 20140008781 - Semiconductor unit
A semiconductor unit includes a first conductive layer, a second conductive layer electrically insulated from the first conductive layer, a first semiconductor device mounted on the first conductive layer, a second semiconductor device mounted on the second conductive layer, a first bus bar for electrical connection of the second semiconductor...

05/02/13 - 20130105961 - Low inductance power module
A power module includes a housing, a power semiconductor die enclosed within the housing and a first power terminal embedded in the housing and electrically connected to the power semiconductor die. A portion of the first power terminal protrudes outward from an external surface of the housing. The power module...

03/14/13 - 20130062750 - Semiconductor device including cladded base plate
A semiconductor device includes a semiconductor chip coupled to a substrate and a base plate coupled to the substrate. The base plate includes a first metal layer clad to a second metal layer. The second metal layer is deformed to provide a pin-fin or fin cooling structure....

02/14/13 - 20130037928 - Semiconductor package and system
A semiconductor package includes a package board, a pellet provided over the package board, and a protection member covering the package board and the pellet and including a hole penetrating the protection member....

01/24/13 - 20130020694 - Power module packaging with double sided planar interconnection and heat exchangers
A double sided cooled power module package having a single phase leg topology includes two IGBT and two diode semiconductor dies. Each IGBT die is spaced apart from a diode semiconductor die, forming a switch unit. Two switch units are placed in a planar face-up and face-down configuration. A pair...

07/19/12 - 20120181681 - Stacked half-bridge package with a current carrying layer
According to an exemplary embodiment, a stacked half-bridge package includes a control transistor having a control drain for connection to a high voltage input, a control source coupled to an output terminal, and a control gate for being driven by a driver IC. The stacked half-bridge package also includes a...

06/14/12 - 20120146208 - Semiconductor module and manufacturing method thereof
A semiconductor module according to one embodiment includes a semiconductor chip, an insulating substrate, a case, an electrode, a busbar and a busbar support body. The semiconductor chip is mounted on the insulating substrate. The insulating substrate is housed inside the case. The electrode is disposed in the case and...

03/29/12 - 20120074556 - Semiconductor power module and method of manufacturing the same
A semiconductor power module according to the present invention includes a base member, a semiconductor power device having a surface and a rear surface with the rear surface bonded to the base member, a metal block, having a surface and a rear surface with the rear surface bonded to the...

03/08/12 - 20120056313 - Semiconductor package
A semiconductor package includes a radiator plate including a stress alleviation section, a resin sheet arranged on the radiator plate, a pair of bus bars joined to the radiator plate through the resin sheet at positions at which the stress alleviation section is interposed between the bus bars, and a...

11/03/11 - 20110266665 - Press-pack module with power overlay interconnection
Systems and methods for utilizing power overlay (POL) technology and semiconductor press-pack technology to produce semiconductor packages with higher reliability and power density are provided. A POL structure may interconnect semiconductor devices within a semiconductor package, and certain embodiments may be implemented to reduce the probability of damaging the semiconductor...

08/11/11 - 20110193215 - Semiconductor package
Means for decreasing parasitic inductance by a realistic mounting method is provided. On a surface layer of a semiconductor package, there is provided a ground pad having a plurality of comb-tooth-shaped ground pads which are connecting points for wire bonding and are protruded on the surface layer of the semiconductor...

06/23/11 - 20110147915 - Combined power mesh transition and signal overpass/underpass
A zipper structure includes a first contiguous full-dense-mesh (FDM) array of a first supply in top metal and a second contiguous FDM array of a second supply in top-1 metal, a third contiguous FDM array of the second supply in top metal and a fourth contiguous FDM array of the...

05/12/11 - 20110108975 - Semiconductor package and system
Even when only one of semiconductor packages mounted by carrying out infrared reflow is defective, it is required to carry out infrared reflow again to dismount this defective semiconductor package from a mounting board. At this time, stress of heat is also applied to the other non-defective semiconductor packages. For...

05/05/11 - 20110101515 - Power module assembly with reduced inductance
A device is provided that includes a first conductive substrate and a second conductive substrate. A first power semiconductor component having a first thickness can be electrically coupled to the first conductive substrate. A second power semiconductor component having a second thickness can be electrically coupled to the second conductive...

03/31/11 - 20110074006 - Rf transistor packages with internal stability network including intra-capacitor resistors and methods of forming rf transistor packages with internal stability networks including intra-capacitor resistors
A packaged RF transistor device includes an RF transistor die including a plurality of RF transistor cells. Each of the plurality of RF transistor cells includes a control terminal and an output terminal. The RF transistor device further includes an RF input lead, and an input matching network coupled between...

09/16/10 - 20100230800 - Double side cooled power module with power overlay
A power module includes one or more semiconductor power devices having a power overlay (POL) bonded thereto. A first heat sink is bonded to the semiconductor power devices on a side opposite the POL. A second heat sink is bonded to the POL opposite the side of the POL bonded...

08/12/10 - 20100200979 - Power transistor package with integrated bus bar
According to one embodiment, a power transistor package includes an electrically conductive flange configured to be connected to a source of a power transistor device. The package further includes a first terminal mechanically fastened to the flange and configured to be electrically connected to a gate of the power transistor...

08/12/10 - 20100200980 - Semiconductor device
This semiconductor device has a frame including a bed portion on which a semiconductor chip is mounted, lead groups arranged in an outer peripheral portion, first bus bars, second bus bars and a rectifying bus bar. The first bus bars and the second bus bars are arranged between the bed...

06/24/10 - 20100155927 - Semiconductor packages with stiffening support for power delivery
Embodiments of the invention relate to semiconductor packages in which electrical power is delivered to die-side components removably installed in sockets formed between a package stiffener and an electrical conductor. To this purpose, the package stiffener and the electrical conductor may be electrically coupled to the power and ground terminals...

05/27/10 - 20100127378 - Semiconductor device and semiconductor package
There is provided a semiconductor device including: plural bit cells each including the same circuit; plural electrodes supplied with power from outside, wherein each of the respective plural electrodes is mounted above the same circuit within the plural bit cells. Further, there is provided a semiconductor package including: the semiconductor...

05/27/10 - 20100127379 - Power semiconductor module with control functionality and integrated transformer
A power semiconductor module comprising: a substrate, a plurality of conductor tracks arranged thereon, the conductor tracks being electrically insulated from one another, and including power semiconductor components arranged thereon; a connecting device, composed of an alternating layer sequence of at least two electrically conductive layers and at least one...

05/13/10 - 20100117214 - Image forming apparatus, chip, and chip package
An image forming apparatus including an engine unit to perform an image forming operation, and a board unit to control the engine unit. The board unit includes at least one chip package that includes a chip. The chip includes first pads to transmit a first type of signal, a second...

05/13/10 - 20100117215 - Planar multi semiconductor chip package
Provided are a planar multi semiconductor chip package in which a processor and a memory device are connected to each other via a through electrode and a method of manufacturing the planar multi semiconductor chip package. The planar multi semiconductor chip package includes: a substrate comprising a plurality of first...

04/08/10 - 20100084760 - Semiconductor device and method for manufacturing same
A semiconductor device includes: a semiconductor chip mounting substrate, a control circuit board, a power terminal holder and a semi-fixing member. The semiconductor chip mounting substrate includes a substrate, a semiconductor chip provided on a first major surface of the substrate, and a first and second semiconductor chip connection electrodes....

03/25/10 - 20100072604 - Semiconductor device
In an example of the main technique, two chips are stacked with each other, first to third pads are disposed along corresponding sides of the respective chips, which are arranged close and in parallel to each other, and these pads are commonly connected to each other with first to third...

03/25/10 - 20100072605 - Semiconductor package with a controlled impedance bus and method of forming same
An apparatus includes a first substrate having a set of semiconductor devices formed within it. The apparatus also includes a second substrate. A third substrate has a data conductor coupled between first and second connections to the second substrate. The data conductor is coupled to the set of semiconductor devices...

02/11/10 - 20100032824 - Ic package method capable of decreasing ir drop and associated ic apparatus
An IC package method capable of decreasing IR drop of a chip and associated IC apparatus is provided. The IC package method comprises forming a lead frame including a die paddle and a plurality of fingers; installing a die on the die paddle, and coupling a plurality of signal terminals...

01/28/10 - 20100019373 - Universal substrate for semiconductor packages and the packages
A universal substrate for semiconductor packages and the package are revealed. The universal substrate comprises a substrate core, two peripheral rows of bonding fingers and a central row of redistribution fingers disposed on the substrate core, and a solder mask formed on the substrate core. The redistribution fingers are located...

01/14/10 - 20100007005 - Semiconductor device
A semiconductor device suppresses a magnetic field caused by a current loop formed by a signal wiring and a return path wiring, to reduce transmission loss of a high-speed signal. The semiconductor device includes a signal current path connected from a signal pad to a first external terminal via a...

01/14/10 - 20100007006 - Integrated semiconductor outline package
A transistor outline package is provided for a semiconductor integrated device suitable for use in a control module of an automobile for connection between a printed circuit board and a bus bar of such a module. The package includes a package housing, having a first end suitable for mounting to...

12/10/09 - 20090302451 - Semiconductor device having function circuits selectively connected to bonding wire
A semiconductor device includes a semiconductor chip, a wiring substrate, and wires. The semiconductor chip includes a first circuit, a second circuit having a function differing from that of the first circuit, a plurality of first pads disposed in a row along one side of the semiconductor chip and connected...

11/19/09 - 20090283894 - Semiconductor chip package and printed circuit board having through interconnections
A semiconductor chip package includes a signal interconnection penetrating a semiconductor chip and transmitting a signal to the semiconductor chip and a power interconnection and a ground interconnection penetrating the semiconductor and supplying power and ground to the semiconductor chip. The power interconnection and the ground interconnection are arranged to...

10/01/09 - 20090243079 - Semiconductor device package
Provided is a semiconductor device package including a substrate formed of a silicon (Si)-based material. The semiconductor device package includes a first substrate which comprises first and second principal planes which are opposite each other, and a substrate body layer disposed between the first and second principal planes, the substrate...

09/17/09 - 20090230540 - High performance multi-chip flip chip package
A structure and method of manufacture for an improved multi-chip semiconductor package that reduces package resistance to a negligible level, and offers superior thermal performance. Housing of multiple dies is facilitated by providing electrically isolated lead frames that are separated from a common base carrier by a non-conductive layer of...

09/10/09 - 20090224395 - Substrate strip for semiconductor packages
A substrate strip for semiconductor packages to slow the crack growth, primarily comprises a molding area and two side rails. The molding area includes a plurality of packaging units. The side rails are located outside the molding area and include two opposing longer sides of the substrate strip. A metal...

09/10/09 - 20090224396 - Oversized contacts and vias in semiconductor chip defined by linearly constrained topology
A rectangular-shaped interlevel connection structure is defined to electrically connect a first structure in a first chip level with a second structure in a second chip level. The rectangular-shaped interlevel connection structure is defined by an as-drawn cross-section having at least one dimension larger than a corresponding dimension of either...

08/27/09 - 20090212413 - Ball grid array package layout supporting many voltage splits and flexible split locations
A die package generally including (A) ground paths routing a power ground from a ground power set of contact pads in a first conductive layer to a ground ring in a second conductive layer, (B) core paths routing a core voltage from a core power set of contact pads in...

08/27/09 - 20090212414 - Semiconductor chips having redistributed power/ground lines directly connected to power/ground lines of internal circuits and methods of fabricating the same
Provided are embodiments of semiconductor chips having a redistributed metal interconnection directly connected to power/ground lines of an internal circuit are provided. Embodiments of the semiconductor chips include an internal circuit formed on a semiconductor substrate. A chip pad is disposed on the semiconductor substrate. The chip pad is electrically...

08/13/09 - 20090200657 - 3d smart power module
A 3D smart power module for power control, such as a three phase power control module, includes a two sided printed circuit (PC) board with power semiconductor devices attached to one side and control semiconductor devices attached to the other side. The power semiconductor devices are die bonded to a...

08/06/09 - 20090194864 - Integrated module for data processing system
An apparatus for an integrated module. A silicon carrier with through-silicon vias has a plurality of die connected to a top side of the silicon carrier. In addition, a substrate is connected to a bottom side of the silicon carrier. The substrate is coupled to the plurality of die via...

07/23/09 - 20090184411 - Semiconductor packages and methods of manufacturing the same
Provided are semiconductor packages and methods of manufacturing the semiconductor package. The semiconductor packages may include a substrate including a chip pad, a redistributed line which is electrically connected to the chip pad and includes an opening. The semiconductor packages may also include an external terminal connection portion, and an...

05/21/09 - 20090127691 - Semiconductor power module packages with simplified structure and methods of fabricating the same
Provided are semiconductor power module packages, which are structurally simplified by bonding electrodes onto substrates, and methods of fabricating the same. An exemplary package includes a substrate and semiconductor chips disposed on a top surface of the substrate. Electrodes are bonded to the top surface of the substrate and electrically...

04/30/09 - 20090108435 - Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly
An assembly includes a chip including an integrated circuit, a casing including an integrated circuit and having an upper portion formed on a side of the chip and lower portion formed on another side of the chip, plural through-wafer vias (TWVs) for electrically connecting the integrated circuit of the chip...

04/09/09 - 20090091017 - Partitioned integrated circuit package with central clock driver
Disclosed are IC partitioned packaging and interconnection constructions that provide for improved distribution of power, ground, cross chip interconnections and clocks....

03/26/09 - 20090079057 - Integrated circuit device
An integrated circuit device includes a carrier defining a surface with a semiconductor chip including an integrated circuit attached to the carrier. An insulation layer is disposed over the carrier, extending above the surface of the carrier a first distance at a first location and a second distance at a...

03/26/09 - 20090079058 - Semiconductor substrate elastomeric stack
A reconfigurable high performance computer occupies less than 360 cubic inches and has an approximate compute power of 0.7 teraflops per second while consuming less than 1000 watts. The computer includes a novel stack of semiconductor substrate assemblies. Some semiconductor substrate assemblies involve field programmable gate array (FPGA) dice that...

03/26/09 - 20090079059 - Integrated semiconductor substrate structure using incompatible processes
A plurality of FPGA dice is disposed upon a semiconductor substrate. In order both to connect thousands of signal interconnect lines between the plurality of FPGA dice and to supply the immense power required, it is desired that the substrate construction include two different portions, each manufactured using incompatible processes....

03/05/09 - 20090057869 - Co-packaged high-side and low-side nmosfets for efficient dc-dc power conversion
A circuit package assembly is disclosed. The assembly includes a conductive substrate; a high-side n-channel metal oxide semiconductor field effect transistor (NMOSFET) having a source on a side facing a surface of the conductive substrate and in electrical contact therewith and a low-side standard n-channel metal oxide semiconductor field effect...

03/05/09 - 20090057870 - Stacked semiconductor package with a reduced volume
The stacked semiconductor package includes a substrate having a plurality of connection pads; a first semiconductor chip disposed over the substrate, a plurality of first bonding pads disposed at an first of the first semiconductor chip, redistributions extending from the first bonding pads to the middle of the upper face;...

02/19/09 - 20090045499 - Semiconductor package having a plurality input/output members
A semiconductor package has a first substrate having a plurality of electrically conductive patterns formed thereon. A first semiconductor die is coupled to the plurality of conductive patterns. A second semiconductor die is coupled to the first semiconductor die by a die attach material. A third semiconductor die is coupled...