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With Structure For Mounting Semiconductor Chip To Lead Frame (e.g., Configuration Of Die Bonding Flag, Absence Of A Die Bonding Flag, Recess For Led)

With Structure For Mounting Semiconductor Chip To Lead Frame (e.g., Configuration Of Die Bonding Flag, Absence Of A Die Bonding Flag, Recess For Led) patent applications listed include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.

Related Categories:

Active Solid-state Devices (e.g., Transistors, Solid-state Diodes)


Lead Frame > With Structure For Mounting Semiconductor Chip To Lead Frame (e.g., Configuration Of Die Bonding Flag, Absence Of A Die Bonding Flag, Recess For Led)



Multilevel leadframe
04/23/15 - 20150108626 - A multilevel leadframe for an integrated circuit package is provided that has a plurality of lead lines formed in a first level and bond pads formed in a second level. A first set of bond pads is arranged in a first row and are separated from an adjacent bond pad...

Quad flat no lead package and production method thereof
04/16/15 - 20150102476 - The present invention discloses a quad flat no lead package and a production method thereof. The quad flat no lead package comprises a lead frame carrier consisting of a carrier pit and three circles of leads arranged around the carrier pit, wherein the three circles of leads respectively consist of...

X-line routing for dense multi-chip-package interconnects
04/16/15 - 20150102477 - X-line routing arrangements for dense multi-chip-package interconnects are described. In an example, an electronic signal routing structure includes a substrate. A plurality of layers of conductive traces is disposed above the substrate. A first pair of ground traces is disposed in a first of the plurality of layers of conductive...

Surface mount semiconductor device with additional bottom face contacts
04/09/15 - 20150097278 - Assembling a surface mount semiconductor device includes providing a lead frame structure with peripheral leads and additional bottom face contacts integral with frame members. Outer portions of the bottom face contact members are interposed between inner portions of adjacent pairs of the peripheral leads. A package body is formed by...

Semiconductor device and method for manufacturing the same
04/09/15 - 20150097279 - A semiconductor device includes: a semiconductor chip including a main surface electrode; a first mounting lead; a second mounting lead; a connection lead which overlaps with the main surface electrode, the first mounting lead and the second mounting lead when viewed in a thickness direction of the semiconductor chip and...

Semiconductor package
04/02/15 - 20150091147 - A semiconductor package includes a die pad, wherein a semiconductor die is mounted on the die pad; a plurality of leads comprising a power lead disposed along a peripheral edge of the die pad; at least one connecting bar connecting with the die pad; and a power bar disposed on...

No-lead semiconductor package and method of manufacturing the same
03/26/15 - 20150084171 - A non-lead (QFN) semiconductor package is disclosed. The package includes a die attach pad and a semiconductor die supported by the die attached pad. The semiconductor die includes a plurality of pads on an active surface thereof. The package further includes a plurality of terminal leads, an encapsulant that encapsulates...

Integrated circuit packaging system with side solderable leads and method of manufacture thereof
03/26/15 - 20150084172 - A system and method of manufacture of an integrated circuit packaging system includes: a leadframe having a side solderable lead with a half-etched lead portion and a lead top side; a mold body directly on the leadframe and the side solderable lead, the lead top side of the side solderable...

Semiconductor device and method of manufacturing the same
03/26/15 - 20150084173 - There is provided a semiconductor device having a converter circuit, a brake circuit and an inverter circuit and manufacturable by a simplified manufacturing process. the semiconductor device has a plurality of die pads, IGBTs, diodes, freewheel diodes, an HVIC and LVICs mounted on the plurality of die pads, a plurality...

Semiconductor device leadframe
03/26/15 - 20150084174 - For so called film assisted moulding (FAM) device processing techniques there is provided lead frame for a semiconductor device, comprising a base portion and a connection lead, said base portion arranged for mounting a semiconductor die, said connection lead comprising a horizontal portion for external connection and an angled portion...

Semiconductor device leadframe
03/26/15 - 20150084175 - For so called film assisted moulding (FAM) device processing techniques there is provided lead frame for a semiconductor device, comprising a base portion and a connection lead, said base portion arranged for mounting a semiconductor die, said connection lead comprising a horizontal portion for external connection and an angled portion...

High efficiency module
03/26/15 - 20150084176 - A module (1) includes a first functional device (2) and a second functional device (3). The first functional device (2) includes a base electrode, an emitter electrode and a collector electrode. The second functional device (3) includes at least one electrode. The module (1) further includes a conductive frame (4)....

Lead frame for mounting led elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements
03/26/15 - 20150084177 - A lead frame for mounting LED elements includes a frame body region and a large number of package regions arranged in multiple rows and columns in the frame body region. The package regions each include a die pad on which an LED element is to be mounted and a lead...

Leadframe package with wettable sides and method of manufacturing same
03/19/15 - 20150076675 - Embodiments of the present disclosure are directed to leadframe packages with wettable sides and methods of manufacturing same. In one embodiment, the leads of the leadframe packages have recesses with a curved profile formed therein. The recesses are plated with a solder wettable layer of conductive material that enables solder...

Power semiconductor device package and fabrication method
03/19/15 - 20150076676 - A power semiconductor device package includes a conductive assembly including a connecting structure and a semiconductor die having an aperture formed therethrough, the aperture being sized and configured to spacedly receive the connecting structure. In an alternative embodiment, a power semiconductor device package includes a conductive assembly including a connecting...

Cte matched interposer and method of making
03/19/15 - 20150076677 - The present interposer makes it possible to tailor the coefficient of thermal expansion of the interposer to match components to be attached thereto within very wide ranges. The semiconductor interposer, includes a substrate of a semiconductor material having a first side and an opposite second side. There is at least...

Method for manufacturing a semiconductor device, and semiconductor device
03/12/15 - 20150069591 - According to various embodiments, a method for manufacturing a semiconductor device may include providing a semiconductor workpiece including a device region at a first side of the semiconductor workpiece, wherein a mechanical stability of the semiconductor workpiece is insufficient to resist at least one back end process without damage, and...

Semiconductor device, method of manufacturing same, and application board mounted with same
03/12/15 - 20150069592 - In one embodiment, a semiconductor device includes a lead frame including an island portion and a terminal portion separated from the island portion. The device further includes a semiconductor chip mounted on the island portion and including an electrode. The device further includes an insulating layer disposed on the semiconductor...

Semiconductor device and method of manufacturing same
03/12/15 - 20150069593 - In one embodiment, a semiconductor device includes a lead frame including a chip mounting portion and a lead portion separated from the chip mounting portion and having the same thickness as the chip mounting portion, a level of an upper face of the chip mounting portion being same as a...

Semiconductor device and method of manufacturing the same
03/12/15 - 20150069594 - A semiconductor device is inhibited from being degraded in reliability. The semiconductor device has a tab including a top surface, a bottom surface, and a plurality of side surfaces. Each of the side surfaces of the tab has a first portion continued to the bottom surface of the tab, a...

Apparatus and method for a component package
03/12/15 - 20150069595 - A component package and a method of forming are provided. A first component package may include a first semiconductor device having a pair of interposers attached thereto on opposing sides of the first semiconductor device. Each interposer may include conductive traces formed therein to provide electrical coupling to conductive features...

Semiconductor package with multi-level die block
03/05/15 - 20150061096 - A semiconductor package includes a block having a first side, a second side opposite the first side and a recessed region extending from the second side toward the first side so that the block has a thinner part in the recessed region and a thicker part outside the recessed region....

Edge coupling of semiconductor dies
03/05/15 - 20150061097 - Edge coupling of semiconductor dies. In some embodiments, a semiconductor device may include a first semiconductor die, a second semiconductor die disposed in a face-to-face configuration with respect to the first semiconductor die, and an interposer arranged between the first semiconductor and second semiconductor dies, the interposer having an edge...

Semiconductor device and method for manufacturing the same
03/05/15 - 20150061098 - A semiconductor device includes a conductive portion having semiconductor elements provided on a substrate, a case housing the conductive portion, and a lead terminal integrated into the case to be directly connected to the semiconductor elements or an interconnection of the substrate. The lead terminal has a stress relief shape...

Dense-pitch small-pad copper wire bonded double ic chip stack packaging piece and preparation method therefor
03/05/15 - 20150061099 - A dense-pitch small-pad copper wire bonded double IC chip stack package comprises a plastic package body, in which a lead frame carrier and a frame lead inner pin are arranged; the upper surface of the lead frame carrier is fixedly connected with a first IC chip; a second IC chip...

Semiconductor arrangement, method for producing a number of chip assemblies, method for producing a semiconductor arrangement and method for operating a semiconductor arrangement
03/05/15 - 20150061100 - A semiconductor arrangement includes top and bottom contact plates, a plurality of chip assemblies, a dielectric embedding compound, and a control electrode interconnection structure. Each chip assembly has a semiconductor chip having a semiconductor body. The semiconductor body has a top side and an opposing underside. The top side is...

Semiconductor packages and methods of packaging semiconductor devices
03/05/15 - 20150061101 - A method of forming semiconductor assemblies is disclosed. The method includes providing an interposer with through interposer vias. The interposer includes first and second surfaces. The through interposer vias extend from the first surface to the second surface of the interposer. The interposer with the through interposer vias enable attachment...

Integrated circuit package with die attach paddle having at least one recessed portion
02/26/15 - 20150054145 - An integrated circuit package having a die attach paddle, a power die mounted on the die attach paddle and a controller die mounted on the die attach paddle. The die attach paddle has at least one recessed portion at least partially underlying the controller die....

Semiconductor device
02/26/15 - 20150054146 - A semiconductor device of the present invention includes a semiconductor element having an electrode pad; a substrate over which the semiconductor element is mounted and which has an electrical bonding part; and a bonding wire electrically connecting the electrode pad to the electrical bonding part, wherein a main metal component...

Lead frame having a perimeter recess within periphery of component terminal
02/26/15 - 20150054147 - Embodiments described herein relate to a packaged circuit including a lead frame having at least one recess pattern on an internal surface thereof. The at least one recess pattern includes a perimeter recess that defines a perimeter around one or more raised surfaces. The packaged circuit also includes a component...

Molded semiconductor package with backside die metallization
02/12/15 - 20150041967 - A semiconductor package is manufactured by providing a semiconductor die with a terminal at a first side of the die, providing a material coupled to the die at an opposing second side of the die and embedding the die in a molding compound so that the die is covered by...

Integrated passives package, semiconductor module and method of manufacturing
01/29/15 - 20150028463 - An integrated passives package includes an encapsulation compound and a plurality of electrically conductive pads embedded in the encapsulation compound. Each of the pads has opposing first and second sides. The first side of the pads is uncovered by the encapsulation compound and forms array of external electrical connections at...

Lead frame, electric power converting device, semiconductor apparatus and method of manufacturing semiconductor apparatus
01/29/15 - 20150028464 - According to the disclosure, a lead frame is provided, which includes: a first island and a second island that are arranged side by side; an outer peripheral frame; first leads that extend in a second direction perpendicular to the first direction; second leads that extend in the second direction; a...

Semiconductor device and method of manufacturing the same
01/29/15 - 20150028465 - A semiconductor device includes a semiconductor element that is mounted on a substrate, an electrode pad that contains aluminum as a main component and is provided in the semiconductor element, a copper wire that contains copper as a main component and connects a connection terminal provided on the substrate and...

Semiconductor device and manufacturing method thereof
01/29/15 - 20150028466 - The present invention relates to a semiconductor device and a manufacturing method thereof. The semiconductor device has a plurality of power units placed in parallel in a predetermined direction, wherein each of the power units includes a plurality of semiconductor elements placed on a metal plate having predetermined gaps with...

Semiconductor device and method for manufacturing the same
01/29/15 - 20150028467 - A semiconductor device can reduce the number of bonding wires. The semiconductor device includes two or more semiconductor elements each of which has electrodes on a first main surface and a second main surface, an electrode plate that has one surface which is bonded to electrodes on the first main...

Semiconductor device with plated pillars and leads
01/22/15 - 20150021751 - A semiconductor device with plated pillars and leads is disclosed and may include a semiconductor die comprising a conductive pillar, a conductive lead electrically coupled to the conductive pillar, a metal plating layer covering the conductive lead and conductive pillar, and an encapsulant material encapsulating the semiconductor die and at...

Semiconductor device
01/22/15 - 20150021752 - There is provided a semiconductor device having excellent moisture resistance and high temperature storage properties. The semiconductor device includes a lead frame that has a die pad and an inner lead, as a substrate, a semiconductor element that is mounted on the die pad, an electrode pad that is provided...

Packaging structure of a semiconductor device
01/22/15 - 20150021753 - A method of making a semiconductor packaged device comprises mounting onto a lead frame a bottom of a molded semiconductor chip having a first plastic package body covering a top face of a semiconductor chip, encapsulating the lead frame and the semiconductor chip with a second plastic package body with...

Quad flat semiconductor device with additional contacts
01/15/15 - 20150014833 - A Quad Flat Package (QFP) semiconductor device has a multi-stepped lead frame for forming rows of external contacts. A semiconductor die is attached to a die pad of the lead frame and electrically connected to lead with bond wires. The die and bond wires are encapsulated with a mold compound...

Hybrid lead frame and ball grid array package
01/15/15 - 20150014834 - A semiconductor device includes a first substrate having opposing first and second main surfaces, a first die disposed on the first main surface of the first substrate, a first bond wire coupled to the first die, a first packaging material encapsulating the first die and the first bond wire, and...

Solder flow impeding feature on a lead frame
01/15/15 - 20150014835 - One embodiment is directed towards a packaged chip including a lead frame. At least one chip is mounted on the lead frame. At least one edge the lead frame has a solder flow impeding feature located thereon. The solder flow impeding feature includes an integral portion of the lead frame...

Using an integrated circuit die configuration for package height reduction
01/08/15 - 20150008567 - A semiconductor device includes a semiconductor die having a first major surface and a second major surface opposite the first major surface, a first minor surface and a second minor surface opposite the first minor surface, a plurality of contact pads on the first major surface, and a notch which...

Semiconductor device
01/08/15 - 20150008568 - Provided is a semiconductor device including a package having a hollow portion, which can meet the need of reduction in size and thickness. The semiconductor device includes: a resin molded member (1) including a hollow portion (10) having an inner bottom surface on which a semiconductor chip (6) is mounted,...

Manufacturing method of semiconductor device and semiconductor device
01/08/15 - 20150008569 - A semiconductor device includes a die pad, which includes an upper surface and a lower surface, the upper surface forming a rectangular shape in plan view; a plurality of support pins that support the die pad; a plurality of inner leads arranged around the die pad; a plurality of outer...

Semiconductor die carrier structure and method of manufacturing the same
01/01/15 - 20150001696 - Various embodiments provide a method of manufacturing a semiconductor die carrier structure. The method may include providing a die pad configured to carry a semiconductor die thereon; and bending at least one portion of the die pad, wherein the at least one bent portion extends across the die pad....

Selective treatment of leadframe with anti-wetting agent
01/01/15 - 20150001697 - Embodiments of the present disclosure are directed to a leadframe packages that include a leadframe having a surface that is selectively treated with chemicals that reduce the wettability of the surface and thereby reduce adhesive flow on the surface and methods of forming a packing comprising same. In one embodiment...

Leadless packages and method of manufacturing same
01/01/15 - 20150001698 - Embodiments of the present disclosure are directed to leadframe strips and methods of forming packages that include first separating adjacent leads of a leadframe strip and subsequently singulating components into individual packages. In one embodiment, the adjacent leads are separated by etching through the leads, thereby providing electrical isolation of...

Semiconductor device
01/01/15 - 20150001699 - A semiconductor device includes a first chip mounting portion, a first semiconductor chip arranged over the first chip mounting portion, a first pad formed in a surface of the first semiconductor chip, a first lead which serves as an external coupling terminal, a first conductive member which electrically couples the...

Lead frame and semiconductor device using same
12/25/14 - 20140374892 - A lead frame for a semiconductor device has a die pad for supporting a semiconductor die and intermediate lead fingers extending from a periphery of the package towards the die pad, and each having a bonding end near the die pad. Outer lead fingers are located adjacent respective tie bars...

Semiconductor package
12/25/14 - 20140374893 - A semiconductor package, comprising: a package substrate including chip regions, a separation region between the chip regions, and an edge region around the chip and separation regions; semiconductor chips disposed on the chip regions of the package substrate; and signal patterns. The package substrate comprises an upper layer substantially adjacent...

Leadframe with lead of varying thickness
12/18/14 - 20140367838 - A leadframe that includes a die attachment pad and a lead having a bondwire attach portion with a thickness less than 50% of the thickness of an adjacent portion of the lead. Also a method of forming a leadframe includes forming a lead having a bond wire attach portion with...

A semiconductor package of a flipped mosfet
12/11/14 - 20140361418 - The invention relates to a semiconductor package of a flip chip and a method for making the semiconductor package. The semiconductor chip comprises a metal-oxide-semiconductor field effect transistor. On a die paddle including a first base, a second base and a third base, half-etching or punching is performed on the...

Power control device and preparation method thereof
12/11/14 - 20140361419 - A power semiconductor device comprises a lead frame unit, a control die, a first MOSFET die and a second MOSFET die, wherein the lead frame unit comprises at least a die paddle for mounting the first and second MOSFET dies, a first pin and a second pin for connecting to...

Hybrid packaging multi-chip semiconductor device and preparation method thereof
12/11/14 - 20140361420 - A hybrid packaging multi-chip semiconductor device comprises a lead frame unit, a first semiconductor chip, a second semiconductor chip, a first interconnecting structure and a second interconnecting structure, wherein the first semiconductor chip is attached on a first die paddle and the second semiconductor chip is flipped and attached on...

Lead frame based semiconductor die package
12/11/14 - 20140361421 - A lead frame based semiconductor die package includes a lead frame having a die pad that supports a semiconductor die and lead fingers that surround the die and die pad. The die is electrically connected to the lead fingers with bond wires. The die and bond wires are covered with...

Semiconductor device
12/11/14 - 20140361422 - In a QFN that includes a die pad, a semiconductor chip mounted on the die pad, a plurality of leads arranged around the semiconductor chip, a plurality of wires that electrically connect the plurality of electrode pads of the semiconductor chip with the plurality of leads, respectively, and a sealing...

Semiconductor device and method of using leadframe bodies to form openings through encapsulant for vertical interconnect of semiconductor die
12/11/14 - 20140361423 - A semiconductor device has a leadframe with a plurality of bodies extending from the base plate. A first semiconductor die is mounted to the base plate of the leadframe between the bodies. An encapsulant is deposited over the first semiconductor die and base plate and around the bodies of the...

Packaged semiconductor device
12/04/14 - 20140353808 - Disclosed is a packaged device, comprising a carrier comprising a first carrier contact, a first electrical component having a first top surface and a first bottom surface, the first electrical component comprising a first component contact disposed on the first top surface, the first bottom surface being connected to the...

Semiconductor device and manufacturing method of semiconductor device
12/04/14 - 20140353809 - A technique capable of enhancing a reliability of a semiconductor device is provided. A semiconductor device has a die pad on which a semiconductor chip is mounted. The die pad is sealed with resin so that a lower surface located on an opposite side of an upper surface on which...

Multilevel leadframe
11/27/14 - 20140346656 - A multilevel leadframe for an integrated circuit package is provided that has a plurality of lead lines formed in a first level and bond pads formed in a second level. A first set of bond pads is arranged in a first row and are separated from an adjacent bond pad...

Method of manufacturing semiconductor device and semiconductor device
11/13/14 - 20140332942 - Reliability of a semiconductor device is improved. A method of manufacturing a semiconductor device includes a step of arranging a plurality of semiconductor chips next to each other over a chip mounting surface of a die pad. Further, the method of manufacturing a semiconductor device includes a step of electrically...

Barrel-plating quad flat no-lead (qfn) packaging structures and method for manufacturing the same
11/13/14 - 20140332943 - A barrel-plating quad flat no-lead (QFN) package structure and a method for manufacturing the same. The method includes: providing a metal substrate for a plurality of QFN components; forming a first photoresist film on a top surface of the substrate; forming a plating pattern in the first photoresist film; forming...

Resin-encapsulated semiconductor device and its manufacturing method
11/13/14 - 20140332944 - A resin-encapsulated semiconductor device having a semiconductor chip which is prevented from being damaged. The resin-encapsulated semiconductor device (100) comprises a semiconductor chip (1) including a silicon substrate, a die pad (10) to which the semiconductor chip (1) is secured through a first solder layer (2), a resin-encapsulating layer (30)...

Packaged ic having printed dielectric adhesive on die pad
11/06/14 - 20140327123 - A packaged integrated circuit (IC) includes a leadframe having metal terminals positioned outside the die pad. An IC die having a top side including a plurality of bond pads is placed with its bottom side onto attached by a dielectric polymer material to the die pad. Bond wires are between...

Power transistor with heat dissipation and method therefore
11/06/14 - 20140327124 - A device comprising a substrate, an integrated circuit (IC) die attached to the substrate on one side, a plurality of contact pads on an active side of the IC die, a plurality of thermally and electrically conductive legs, each of the legs attached to a respective one of the contact...

Quad flat no-lead (qfn) packaging structure and method for manufacturing the same
10/30/14 - 20140319664 - A quad flat no-lead (QFN) packaging structure. The QFN packaging structure includes a metal substrate, a first outer die pad formed on the metal substrate, and a first die coupled to a top surface of the first outer die pad. The QFN packaging structure also includes a plurality of I/O...

Power semiconductor package
10/30/14 - 20140319665 - A semiconductor package that includes a substrate having a metallic back plate, an insulation body and a plurality of conductive pads on the insulation body, and a semiconductor die coupled to said conductive pads, the conductive pads including regions readied for direct connection to pads external to the package using...

Lead frame and semiconductor package manufactured by using the same
10/30/14 - 20140319666 - The present invention provides a lead frame having excellent solder wettability and solderability, that is well-bonded to a copper wire, and manufactured with low cost, and a semiconductor package manufactured by using the same. The lead frame includes: a base material; a first metal layer formed on at least one...

Chip and chip arrangement
10/16/14 - 20140306331 - Various embodiments provide a chip. The chip may include a body having two main surfaces and a plurality of side surfaces; a first power electrode extending over at least one main surface and at least one side surface of the body; and a second power electrode extending over at least...

Integrating multi-output power converters having vertically stacked semiconductor chips
10/16/14 - 20140306332 - A packaged multi-output converter (200) comprising a leadframe with a chip pad (201) as ground terminal and a plurality of leads (202) including the electrical input terminal (203); a first FET chip (sync chip, 220) with its source terminal affixed to the leadframe and on its opposite surface a first...

Cavity package with die attach pad
10/16/14 - 20140306333 - A cavity package is provided. The package can include a metal leadframe and a substrate attached to an interposer formed as part of the leadframe. The substrate typically has a coefficient of thermal expansion matched to the coefficient of thermal expansion of a semiconductor device to be affixed to the...