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Active Solid-state Devices (e.g., Transistors, Solid-state Diodes) > Lead Frame > With Heat Sink Means

With Heat Sink Means

With Heat Sink Means patent applications listed include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.

11/13/14 - 20140332941 - System, method and apparatus for leadless surface mounted semiconductor package
A packaged semiconductor device may include a termination surface having terminations configured as leadless interconnects to be surface mounted to a printed circuit board. A first flange has a first surface and a second surface. The first surface provides a first one of the terminations, and the second surface is...

10/23/14 - 20140312480 - Double-side exposed semiconductor device
A double-side exposed semiconductor device includes an electric conductive first lead frame attached on top of a thermal conductive but electrical nonconductive second lead frame and a semiconductor chip flipped and attached on top of the first lead frame. The gate and source electrodes on top of the flipped chip...

10/16/14 - 20140306330 - Low profile leaded semiconductor package
In a semiconductor package a lead having a bottom surface coplanar with the flat bottom surface of the plastic body extends outward at the bottom of the vertical side surface of the plastic body. The result is a package with a minimal footprint that is suitable for the technique known...

10/09/14 - 20140299979 - Semiconductor device and a method for manufacturing a semiconductor device
The reliability of a semiconductor device is improved. A semiconductor device has a first metal plate and a second metal plate electrically isolated from the first metal plate. Over the first metal plate, a first semiconductor chip including a transistor element formed thereover is mounted. Whereas, over the second metal...

10/02/14 - 20140291823 - Chip package and method of manufacturing the same
Embodiments provide provides a chip package. The chip package may include a leadframe having a die pad and a plurality of lead fingers; a first chip attached to the die pad, the first chip being bonded to one or more of the lead fingers via a first set of wire...

09/18/14 - 20140264798 - Packaged device comprising non-integer lead pitches and method of manufacturing the same
Packaged chips comprising non-integer lead pitches, systems and methods for manufacturing packaged chips are disclosed. In one embodiment a packaged device includes a first chip, a package encapsulating the first chip and a plurality of leads protruding from the package, wherein the plurality of leads comprises differing non-integer multiple lead...

09/18/14 - 20140264799 - Power overlay structure and method of making same
A power overlay (POL) structure includes a POL sub-module. The POL sub-module includes a dielectric layer and a semiconductor device having a top surface attached to the dielectric layer. The top surface of the semiconductor device has at least one contact pad formed thereon. The POL sub-module also includes a...

09/18/14 - 20140264800 - Power overlay structure and method of making same
A semiconductor device module includes a dielectric layer, a semiconductor device having a first surface coupled to the dielectric layer, and a conducting shim having a first surface coupled to the dielectric layer. The semiconductor device also includes an electrically conductive heatspreader having a first surface coupled to a second...

09/18/14 - 20140264801 - Semiconductor device
A semiconductor device of the present invention comprises: an outer package; a first lead frame including a first relay lead, a first die pad with a power element mounted thereon, and a first external connection lead which has an end protruding from the outer package; and a second lead frame...

08/28/14 - 20140239470 - Resin package
A resin package includes: a die pad having a main surface on which a semiconductor substrate and a matching circuit substrate is mounted; at least one lead terminal electrically connected to the semiconductor substrate and the matching circuit substrate; a thin plate fixed to at least one of the main...

08/21/14 - 20140231976 - Method for producing a solder joint
The invention relates to a method for producing a solder joint between at least one base part (2) and at least one first component (3), comprising the following steps: providing the base part (2); partially blasting a surface of the base part (2) using a SACO blasting agent, the blasting...

07/24/14 - 20140203420 - Method for producing semiconductor device, and semiconductor device produced using production method
A method for producing a semiconductor device includes laser welding to bond an upper terminal and a lower terminal as internal wiring members of the semiconductor device. When the upper terminal is fixed to the lower terminal by the laser welding, a gap between an upper surface of the lower...

07/03/14 - 20140183712 - Ball grid array package with improved thermal characteristics
An integrated circuit package includes a substrate having first and second surfaces and a plurality of conductive traces therebetween and a semiconductor die mounted on the first surface of the substrate. A plurality of wire bonds connect the semiconductor die to ones of the conductive traces of the substrate and...

06/12/14 - 20140159215 - Semiconductor device and method of manufacturing the same
A semiconductor device having a substrate including a plurality of external terminals on a rear surface and a plurality of bonding terminals electrically connected to the plurality of external terminals on a front surface, a semiconductor chip mounted on the front surface of the substrate, a surface of the chip...

06/12/14 - 20140159216 - Semiconductor module, semiconductor device having semiconductor module, and method of manufacturing semiconductor module
A semiconductor module is configured such that heat radiation substrates are connected to lead frames and semiconductor chips are directly connected to the lead frames so that the semiconductor chips are not connected to the lead frames through conductive portions of the heat radiation substrates. Therefore, the conductive portion can...

06/05/14 - 20140151864 - Atomic level bonding for electronics packaging
An electronic device assembly that includes a die and a substrate, and optionally a lead frame and a heat spreader. The die is characterized as an electronic device in die form, and has a polished die region. The substrate has a polished substrate region in direct contact with the polished...

05/15/14 - 20140131847 - Thermal performance of logic chip in a package-on-package structure
Embodiments of the invention provides an IC system in which low-power chips can be positioned vertically proximate high-power chips without suffering the effects of overheating. In one embodiment, the IC system includes a first substrate, a high-power chip disposed on a first side of the first substrate, a thermal conductive...

05/01/14 - 20140117521 - Semiconductor device with thermal dissipation lead frame
A lead frame for assembling a semiconductor device has a die pad surrounded by lead fingers. Each of the lead fingers has a proximal end close to but spaced from an edge of the die pad and a distal end farther from the die pad. A semiconductor die is attached...

05/01/14 - 20140117522 - Semiconductor package
There is provided a semiconductor package including: a lead frame having an electronic component mounted on one surface thereof; a heat dissipation substrate disposed downwardly of the lead frame; an insulating member disposed upwardly of the electronic component such that the electronic components are electrically connected to one another; a...

04/24/14 - 20140110828 - Semiconductor packages and methods of formation thereof
In accordance with an embodiment of the present invention, a semiconductor device includes a lead frame having a die paddle and a lead. A chip is disposed over the die paddle of the lead frame. The semiconductor device further includes a clip, which is disposed over the chip. The clip...

04/17/14 - 20140103505 - Die down integrated circuit package with integrated heat spreader and leads
Methods, systems, and apparatuses for integrated circuit packages are provided. An integrated circuit package, such as a quad flat no-lead (QFN) package, includes a plurality of peripherally positioned leads, a heat spreader, an integrated circuit die, and an encapsulating material. The peripherally positioned leads are attached to a first surface...

04/17/14 - 20140103506 - Semiconductor chip device with polymeric filler trench
A method of manufacturing is provided that includes providing a semiconductor chip with an insulating layer. The insulating layer includes a trench. A second semiconductor chip is stacked on the first semiconductor chip to leave a gap. A polymeric filler is placed in the gap wherein a portion of the...

04/03/14 - 20140091445 - Bumpless build-up layer package including an integrated heat spreader
An example includes a die package including a microelectronic die having a lower die surface, an upper die surface parallel to the lower die surface, and a die side, the microelectronic die including an active region and an inactive region. The example optionally includes a heat spreader having a lower...

04/03/14 - 20140091446 - Semiconductor device employing aluminum alloy lead-frame with anodized aluminum
A semiconductor device comprises an aluminum alloy lead-frame with a passivation layer covering an exposed portion of the aluminum alloy lead-frame. Since aluminum alloy is a low-cost material, and its hardness and flexibility are suitable for deformation process, such as punching, bending, molding and the like, aluminum alloy lead frame...

03/27/14 - 20140084431 - Semiconductor package with heat spreader
A semiconductor package that includes a semiconductor die and a heat spreader thermally coupled to the semiconductor and disposed at least partially within the molded housing of the package....

03/13/14 - 20140070387 - Coupling assembly of power semiconductor device and pcb and method for manufacturing the same
Provided is a coupling assembly of a power semiconductor device and a printed circuit board (PCB). The coupling assembly of the power semiconductor device and the printed circuit board (PCB) includes a PCB, a power semiconductor device comprising a plurality of legs electrically connected to a circuit pattern disposed on...

02/20/14 - 20140048918 - Semiconductor device and method of manufacturing the same
A semiconductor device has a connection structure in which a power semiconductor chip is mounted on an insulating substrate having conductor patterns bonded to front and rear surfaces thereof, and the insulating substrate is connected to a heat-dissipating base member to dissipate heat generated from the power semiconductor chip to...

01/30/14 - 20140027891 - Semiconductor device and method for manufacturing semiconductor device
A method includes the steps of: preparing a lead frame including a plurality of die pads, and preparing a plurality of semiconductor chips; disposing each of the semiconductor chips on a respective one of the die pads; forming a sealing resin to cover the die pads and the semiconductor chips;...

01/09/14 - 20140008776 - Chip package and method of manufacturing the same
Embodiments provide provides a chip package. The chip package may include a leadframe having a die pad and a plurality of lead fingers; a first chip attached to the die pad, the first chip being bonded to one or more of the lead fingers via a first set of wire...

01/02/14 - 20140001613 - Semiconductor package
There is provided semiconductor package including: an internal lead having at least one electronic component mounted on a surface thereof; a heat sink disposed below the internal lead; a molded portion sealing the at least one electronic component, the internal lead and the heat sink; an external lead extended from...

01/02/14 - 20140001614 - Thermally enhanced semiconductor package
One exemplary disclosed embodiment comprises a semiconductor package including an inside pad, a transistor, and a conductive clip coupled to the inside pad and a terminal of the transistor. A top surface of the conductive clip is substantially exposed at the top of the package, and a side surface of...

12/26/13 - 20130341776 - Semiconductor device apparatus and assembly with opposite die orientations
An electronic apparatus includes a base substrate, the base substrate including an interconnect. The electronic apparatus further includes a first die including a first semiconductor device, the first semiconductor device being coupled to the interconnect, and further includes a second die including a second semiconductor device, the second semiconductor device...

12/26/13 - 20130341777 - Electro-thermal cooling devices and methods of fabrication thereof
In one embodiment, a semiconductor module includes a leadframe having a first side and an opposite second side. A semiconductor chip is disposed over the first side of the leadframe. A switching element is disposed under the second side of the leadframe. In another embodiment, a method of forming a...

12/19/13 - 20130334673 - Flexible power module semiconductor packages
Power module semiconductor packages that contain a flexible circuit board and methods for making such packages are described. The semiconductor package contain a flexible circuit board, a conductive film on a first portion of the upper surface of the flexible circuit board, a land pad on a second portion of...

12/12/13 - 20130328180 - Packaged semiconductor device with an exposed metal top surface
In a manufacturing technique for packaged semiconductor devices, a pre-form of a packaged semiconductor device is formed by a molding process which encapsulates the semiconductor device and its associated heat transfer component in a passivating material presenting a surface. The surface is then processed to at least remove excess passivating...

12/05/13 - 20130320514 - Package-in-package for high heat dissipation having leadframes and wire bonds
A semiconductor system (100) comprises a first component including a first semiconductor chip (110) attached to the pad (120) of a leadframe made of a first metal sheet of high thermal conductivity, and a second component including a second semiconductor chip (140) attached to the pad (150) of a leadframe...

11/28/13 - 20130313696 - Power semiconductor package and method of manufacturing the same
A power semiconductor package and a method of method of manufacturing the same are disclosed, where the power semiconductor package includes a lead frame, a first die, a second die and a single connecting strip. The lead frame includes a voltage plate, a grounding plate, an output plate, a first...

11/14/13 - 20130299955 - Film based ic packaging method and a packaged ic device
Film-on-wire (FOW) based IC devices and FOW based methods for IC packaging are described. In an embodiment, a method for packaging an IC dies involves applying a film layer to IC dies and bond wires that are attached to a substrate or a leadframe to form a film-on-wire layer, where...

10/31/13 - 20130285220 - Vertically packaged integrated circuit
A device comprises a semiconductor package including a first integrated circuit (IC) die including a plurality of through silicon vias (TSVs). The TSVs are formed of conductive material that extend through the first IC die from an outer surface on a first side of the die to an outer surface...

10/31/13 - 20130285221 - Semiconductor device and method of manufacturing same
A semiconductor device has a heat dissipating base; a patterned insulating substrate attached to the heat dissipating base with a solder therebetween; a semiconductor chip attached to a conductive pattern of the patterned insulating substrate with a solder therebetween; a first conductor attached to the semiconductor chip with a solder...

10/17/13 - 20130270684 - Power module and lead frame for power module
The present invention aims at providing a power module and a lead frame for the power module which can enhance adhesion between a heat sink and an insulating resin sheet while maintaining heat radiation properties. The power module includes: the lead frame including a conductor plate formed from Cu or...

10/03/13 - 20130256854 - Lead frame, semiconductor device, and method for manufacturing lead frame
A lead frame includes a plurality of leads defined by an opening extending in a thickness direction. An insulating resin layer fills the opening to entirely cover side surfaces of each lead and to support the leads. A first surface of each lead is exposed from a first surface of...

08/15/13 - 20130207249 - Assembly having stacked die mounted on substrate
Metal rerouting interconnects at one or more sides of a die or multiple die segments can form edge bonding pads for electrical connection. Insulation can be applied to surfaces of the die or multiple die segments after optional thinning and singulation, and openings can be made in the insulation to...

07/11/13 - 20130175678 - Power semiconductor module and manufacturing method thereof
A power semiconductor module includes a power semiconductor element formed with a plurality of control electrodes on one main surface, a first conductor plate bonded by way of a first solder material to one of the main surfaces of the power semiconductor element, and a second conductor plate bonded by...

06/27/13 - 20130161803 - Semiconductor package with conductive heat spreader
A semiconductor package that includes a semiconductor die and a heat spreader thermally coupled to the semiconductor and disposed at least partially within the molded housing of the package....

06/20/13 - 20130154068 - Packaged leadless semiconductor device
A packaged leadless semiconductor device (20) includes a heat sink flange (24) to which semiconductor dies (26) are coupled using a high temperature die attach process. The semiconductor device (20) further includes a frame structure (28) pre-formed with bent terminal pads (44). The frame structure (28) is combined with the...

06/20/13 - 20130154069 - Semiconductor package
Disclosed herein is a semiconductor package, including: a first heat dissipation substrate; a first lead frame that is formed on the first heat dissipation substrate by patterning; a first semiconductor device formed on the first lead frame; a second semiconductor device that is stacked on the first semiconductor device; a...

06/20/13 - 20130154070 - Semiconductor package
Disclosed herein is a semiconductor package. The semiconductor package includes: semiconductor elements, a first heat dissipation substrate formed under the semiconductor elements, a first lead frame electrically connecting the lower portions of the semiconductor elements to an upper portion of the first heat dissipation substrate, a second heat dissipation substrate...

05/23/13 - 20130127029 - Two level leadframe with upset ball bonding surface and device package
A leadframe, device package, and mode of construction configured to attain a thin profile and improved thermal performance. Leadframes of this invention include a raised die attachment pad arrange above distal ends of leadframe leads. A package will further include a die electrically coupled with an underside surface of the...

05/16/13 - 20130119525 - Power semiconductor unit, power module, power semiconductor unit manufacturing method, and power module manufacturing method
Heat radiation surfaces 7b and 8b of electrode lead frames 7 and 8 make thermal contact with heat radiation members 301 via insulation sheets 10 to dissipate heat from a power semiconductor element 5 to the heat radiation members (thick portions 301). Each of exposed areas of the heat radiation...

05/02/13 - 20130105954 - Semiconductor package
Disclosed herein is a semiconductor package, including: a substrate having a first surface and a second surface; at least one semiconductor device formed on the first surface of the substrate; first lead frames respectively formed at both sides of the first surface of the substrate; and second lead frames respectively...