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Semiconductor package with low profile switch node integrated heat spreader
05/14/15 - 20150130036 - In one implementation, a semiconductor package includes a patterned conductive carrier including partially etched segments. The semiconductor package also includes a control FET having a control drain attached to a first partially etched segment of the patterned conductive carrier. In addition, the semiconductor package includes a sync FET having a...

Semiconductor module for electric power
04/30/15 - 20150115423 - Included are: the third frame which is electrically connected to the first intermediate frame and is arranged above the first frame; the fourth frame which is electrically connected to the second intermediate frame and is arranged above the second frame; the electric source terminal part which is provided on an...

Electronic system comprising stacked electronic devices provided with integrated-circuit chips
04/30/15 - 20150115424 - An electronic system includes a first electronic device (with a first integrated-circuit chip) and a second electronic device (with a second integrated-circuit chip). The second electronic device is stacked above the first electronic device on a same side as the first integrated-circuit chip. Electrical connection elements located around the first...

Semiconductor device with heat spreader
04/23/15 - 20150108625 - A semiconductor device includes a package body, a semiconductor die embedded in the package body and a heat spreader attached to a top surface of the package body and spaced from semiconductor die. The heat spreader may be formed of solder that is melted within a recess in the top...

Semiconductor device, semiconductor device mounting structure and power semiconductor device
04/16/15 - 20150102474 - A semiconductor device includes a plurality of die pad sections, a plurality of semiconductor chips, each of which is arranged in each of the die pad sections, a resin encapsulation portion having a recess portion for exposing at least a portion of the die pad sections, the resin encapsulation portion...

Package structure and manufacturing method thereof
04/16/15 - 20150102475 - The invention discloses a package structure for better heat-dissipation or EMI performance. A first conductive element and a second conductive element are both disposed between the top lead frame and the bottom lead frame. The first terminal of the first conductive element is electrically connected to the bottom lead frame,...

Power semiconductor package
04/02/15 - 20150091146 - Disclosed herein is a power semiconductor package. The power semiconductor package according to a preferred embodiment of the present invention includes: a semiconductor device; a circuit pattern formed on the semiconductor device; a molding member burying the semiconductor device and the circuit pattern and formed so as to expose one...

Semiconductor package and method of fabricating the same
03/26/15 - 20150084170 - Provided is a semiconductor package including a lower package, an interposer on the lower package, and an upper package on the interposer. The lower package may include a lower package substrate, a lower semiconductor chip on the lower package substrate, and a lower heat-transfer layer on the lower semiconductor chip....

Semiconductor device and method of manufacturing the same
03/19/15 - 20150076674 - According to one embodiment, a semiconductor device includes: a semiconductor chip; a resin which covers the semiconductor chip, and includes first and second surfaces opposite to each other, first and second side surfaces opposite to each other, and third and fourth side surfaces opposite to each other; a first conductive...

Package-on-package devices, methods of fabricating the same, and semiconductor packages
03/05/15 - 20150061095 - In a package-on-package (PoP) device according to the inventive concepts, an anisotropic conductive film is disposed between a lower semiconductor package and an upper semiconductor package to remove an air gap between the lower and upper semiconductor packages. Thus, heat generated from a lower semiconductor chip may be rapidly and...

Stacked multi - chip packaging structure and manufacturing method thereof
02/05/15 - 20150035129 - A stacked multi-chip packaging structure comprises a lead frame, a first semiconductor chip mounted on the lead frame, a second semiconductor chip flipped-chip mounted on the lead frame, a metal clip mounted on top of the first and second semiconductor chips and a third semiconductor chip stacked on the meal...

Semiconductor module
01/29/15 - 20150028462 - A semiconductor module includes: a metal block; an insulation layer for heat radiation formed by directly depositing a ceramic material on at least a first surface of the metal block; an insulation layer for a relay electrode formed by directly depositing a ceramic material on a part of a second...

Semiconductor device having three terminal miniature package
01/15/15 - 20150014832 - A semiconductor device (100) comprises a semiconductor chip (310) attached to the pad (302) of a planar leadframe and connected by bonding wires (411) to two leads (403) of the leadframe. The device further includes a plastic body (130) encapsulating chip and wires, the body shaped as a pentahedron with...

Integrated circuit device package with thermal isolation
01/01/15 - 20150001694 - An integrated circuit (IC) package having an IC device; a heat source operably associated with said IC device; an electrical substrate operably electrically connected to the IC device; and a thermal isolation mat positioned between the IC device and the electrical substrate and having a base surface, a ceiling structure...

Semiconductor package
01/01/15 - 20150001695 - Provided are a semiconductor die and a semiconductor package. The semiconductor package includes: a monolithic die; a driving circuit, a low-side output power device, and a high-side output power device disposed in the monolithic die; and an upper electrode and a lower electrode disposed above and below the monolithic die....

Semiconductor device with heat spreader and thermal sheet
12/25/14 - 20140374891 - A semiconductor device includes a die pad and a semiconductor die having a mounting surface attached to the die pad and an opposite, active surface with die external terminals. The device has package external connectors, each having a bond region selectively electrically coupled to the die external terminals with a...

System, method and apparatus for leadless surface mounted semiconductor package
11/13/14 - 20140332941 - A packaged semiconductor device may include a termination surface having terminations configured as leadless interconnects to be surface mounted to a printed circuit board. A first flange has a first surface and a second surface. The first surface provides a first one of the terminations, and the second surface is...

Double-side exposed semiconductor device
10/23/14 - 20140312480 - A double-side exposed semiconductor device includes an electric conductive first lead frame attached on top of a thermal conductive but electrical nonconductive second lead frame and a semiconductor chip flipped and attached on top of the first lead frame. The gate and source electrodes on top of the flipped chip...

Low profile leaded semiconductor package
10/16/14 - 20140306330 - In a semiconductor package a lead having a bottom surface coplanar with the flat bottom surface of the plastic body extends outward at the bottom of the vertical side surface of the plastic body. The result is a package with a minimal footprint that is suitable for the technique known...

Semiconductor device and a method for manufacturing a semiconductor device
10/09/14 - 20140299979 - The reliability of a semiconductor device is improved. A semiconductor device has a first metal plate and a second metal plate electrically isolated from the first metal plate. Over the first metal plate, a first semiconductor chip including a transistor element formed thereover is mounted. Whereas, over the second metal...

Chip package and method of manufacturing the same
10/02/14 - 20140291823 - Embodiments provide provides a chip package. The chip package may include a leadframe having a die pad and a plurality of lead fingers; a first chip attached to the die pad, the first chip being bonded to one or more of the lead fingers via a first set of wire...

Packaged device comprising non-integer lead pitches and method of manufacturing the same
09/18/14 - 20140264798 - Packaged chips comprising non-integer lead pitches, systems and methods for manufacturing packaged chips are disclosed. In one embodiment a packaged device includes a first chip, a package encapsulating the first chip and a plurality of leads protruding from the package, wherein the plurality of leads comprises differing non-integer multiple lead...

Power overlay structure and method of making same
09/18/14 - 20140264799 - A power overlay (POL) structure includes a POL sub-module. The POL sub-module includes a dielectric layer and a semiconductor device having a top surface attached to the dielectric layer. The top surface of the semiconductor device has at least one contact pad formed thereon. The POL sub-module also includes a...

Power overlay structure and method of making same
09/18/14 - 20140264800 - A semiconductor device module includes a dielectric layer, a semiconductor device having a first surface coupled to the dielectric layer, and a conducting shim having a first surface coupled to the dielectric layer. The semiconductor device also includes an electrically conductive heatspreader having a first surface coupled to a second...

Semiconductor device
09/18/14 - 20140264801 - A semiconductor device of the present invention comprises: an outer package; a first lead frame including a first relay lead, a first die pad with a power element mounted thereon, and a first external connection lead which has an end protruding from the outer package; and a second lead frame...

Resin package
08/28/14 - 20140239470 - A resin package includes: a die pad having a main surface on which a semiconductor substrate and a matching circuit substrate is mounted; at least one lead terminal electrically connected to the semiconductor substrate and the matching circuit substrate; a thin plate fixed to at least one of the main...

Method for producing a solder joint
08/21/14 - 20140231976 - The invention relates to a method for producing a solder joint between at least one base part (2) and at least one first component (3), comprising the following steps: providing the base part (2); partially blasting a surface of the base part (2) using a SACO blasting agent, the blasting...

Method for producing semiconductor device, and semiconductor device produced using production method
07/24/14 - 20140203420 - A method for producing a semiconductor device includes laser welding to bond an upper terminal and a lower terminal as internal wiring members of the semiconductor device. When the upper terminal is fixed to the lower terminal by the laser welding, a gap between an upper surface of the lower...

Ball grid array package with improved thermal characteristics
07/03/14 - 20140183712 - An integrated circuit package includes a substrate having first and second surfaces and a plurality of conductive traces therebetween and a semiconductor die mounted on the first surface of the substrate. A plurality of wire bonds connect the semiconductor die to ones of the conductive traces of the substrate and...

Semiconductor device and method of manufacturing the same
06/12/14 - 20140159215 - A semiconductor device having a substrate including a plurality of external terminals on a rear surface and a plurality of bonding terminals electrically connected to the plurality of external terminals on a front surface, a semiconductor chip mounted on the front surface of the substrate, a surface of the chip...

Semiconductor module, semiconductor device having semiconductor module, and method of manufacturing semiconductor module
06/12/14 - 20140159216 - A semiconductor module is configured such that heat radiation substrates are connected to lead frames and semiconductor chips are directly connected to the lead frames so that the semiconductor chips are not connected to the lead frames through conductive portions of the heat radiation substrates. Therefore, the conductive portion can...

Atomic level bonding for electronics packaging
06/05/14 - 20140151864 - An electronic device assembly that includes a die and a substrate, and optionally a lead frame and a heat spreader. The die is characterized as an electronic device in die form, and has a polished die region. The substrate has a polished substrate region in direct contact with the polished...

Thermal performance of logic chip in a package-on-package structure
05/15/14 - 20140131847 - Embodiments of the invention provides an IC system in which low-power chips can be positioned vertically proximate high-power chips without suffering the effects of overheating. In one embodiment, the IC system includes a first substrate, a high-power chip disposed on a first side of the first substrate, a thermal conductive...

Semiconductor device with thermal dissipation lead frame
05/01/14 - 20140117521 - A lead frame for assembling a semiconductor device has a die pad surrounded by lead fingers. Each of the lead fingers has a proximal end close to but spaced from an edge of the die pad and a distal end farther from the die pad. A semiconductor die is attached...

Semiconductor package
05/01/14 - 20140117522 - There is provided a semiconductor package including: a lead frame having an electronic component mounted on one surface thereof; a heat dissipation substrate disposed downwardly of the lead frame; an insulating member disposed upwardly of the electronic component such that the electronic components are electrically connected to one another; a...

Semiconductor packages and methods of formation thereof
04/24/14 - 20140110828 - In accordance with an embodiment of the present invention, a semiconductor device includes a lead frame having a die paddle and a lead. A chip is disposed over the die paddle of the lead frame. The semiconductor device further includes a clip, which is disposed over the chip. The clip...

Die down integrated circuit package with integrated heat spreader and leads
04/17/14 - 20140103505 - Methods, systems, and apparatuses for integrated circuit packages are provided. An integrated circuit package, such as a quad flat no-lead (QFN) package, includes a plurality of peripherally positioned leads, a heat spreader, an integrated circuit die, and an encapsulating material. The peripherally positioned leads are attached to a first surface...

Semiconductor chip device with polymeric filler trench
04/17/14 - 20140103506 - A method of manufacturing is provided that includes providing a semiconductor chip with an insulating layer. The insulating layer includes a trench. A second semiconductor chip is stacked on the first semiconductor chip to leave a gap. A polymeric filler is placed in the gap wherein a portion of the...

Bumpless build-up layer package including an integrated heat spreader
04/03/14 - 20140091445 - An example includes a die package including a microelectronic die having a lower die surface, an upper die surface parallel to the lower die surface, and a die side, the microelectronic die including an active region and an inactive region. The example optionally includes a heat spreader having a lower...

Semiconductor device employing aluminum alloy lead-frame with anodized aluminum
04/03/14 - 20140091446 - A semiconductor device comprises an aluminum alloy lead-frame with a passivation layer covering an exposed portion of the aluminum alloy lead-frame. Since aluminum alloy is a low-cost material, and its hardness and flexibility are suitable for deformation process, such as punching, bending, molding and the like, aluminum alloy lead frame...

Semiconductor package with heat spreader
03/27/14 - 20140084431 - A semiconductor package that includes a semiconductor die and a heat spreader thermally coupled to the semiconductor and disposed at least partially within the molded housing of the package....

Coupling assembly of power semiconductor device and pcb and method for manufacturing the same
03/13/14 - 20140070387 - Provided is a coupling assembly of a power semiconductor device and a printed circuit board (PCB). The coupling assembly of the power semiconductor device and the printed circuit board (PCB) includes a PCB, a power semiconductor device comprising a plurality of legs electrically connected to a circuit pattern disposed on...

Semiconductor device and method of manufacturing the same
02/20/14 - 20140048918 - A semiconductor device has a connection structure in which a power semiconductor chip is mounted on an insulating substrate having conductor patterns bonded to front and rear surfaces thereof, and the insulating substrate is connected to a heat-dissipating base member to dissipate heat generated from the power semiconductor chip to...

Semiconductor device and method for manufacturing semiconductor device
01/30/14 - 20140027891 - A method includes the steps of: preparing a lead frame including a plurality of die pads, and preparing a plurality of semiconductor chips; disposing each of the semiconductor chips on a respective one of the die pads; forming a sealing resin to cover the die pads and the semiconductor chips;...

Chip package and method of manufacturing the same
01/09/14 - 20140008776 - Embodiments provide provides a chip package. The chip package may include a leadframe having a die pad and a plurality of lead fingers; a first chip attached to the die pad, the first chip being bonded to one or more of the lead fingers via a first set of wire...

Semiconductor package
01/02/14 - 20140001613 - There is provided semiconductor package including: an internal lead having at least one electronic component mounted on a surface thereof; a heat sink disposed below the internal lead; a molded portion sealing the at least one electronic component, the internal lead and the heat sink; an external lead extended from...

Thermally enhanced semiconductor package
01/02/14 - 20140001614 - One exemplary disclosed embodiment comprises a semiconductor package including an inside pad, a transistor, and a conductive clip coupled to the inside pad and a terminal of the transistor. A top surface of the conductive clip is substantially exposed at the top of the package, and a side surface of...

Semiconductor device apparatus and assembly with opposite die orientations
12/26/13 - 20130341776 - An electronic apparatus includes a base substrate, the base substrate including an interconnect. The electronic apparatus further includes a first die including a first semiconductor device, the first semiconductor device being coupled to the interconnect, and further includes a second die including a second semiconductor device, the second semiconductor device...

Electro-thermal cooling devices and methods of fabrication thereof
12/26/13 - 20130341777 - In one embodiment, a semiconductor module includes a leadframe having a first side and an opposite second side. A semiconductor chip is disposed over the first side of the leadframe. A switching element is disposed under the second side of the leadframe. In another embodiment, a method of forming a...

Flexible power module semiconductor packages
12/19/13 - 20130334673 - Power module semiconductor packages that contain a flexible circuit board and methods for making such packages are described. The semiconductor package contain a flexible circuit board, a conductive film on a first portion of the upper surface of the flexible circuit board, a land pad on a second portion of...

Packaged semiconductor device with an exposed metal top surface
12/12/13 - 20130328180 - In a manufacturing technique for packaged semiconductor devices, a pre-form of a packaged semiconductor device is formed by a molding process which encapsulates the semiconductor device and its associated heat transfer component in a passivating material presenting a surface. The surface is then processed to at least remove excess passivating...

Package-in-package for high heat dissipation having leadframes and wire bonds
12/05/13 - 20130320514 - A semiconductor system (100) comprises a first component including a first semiconductor chip (110) attached to the pad (120) of a leadframe made of a first metal sheet of high thermal conductivity, and a second component including a second semiconductor chip (140) attached to the pad (150) of a leadframe...

Power semiconductor package and method of manufacturing the same
11/28/13 - 20130313696 - A power semiconductor package and a method of method of manufacturing the same are disclosed, where the power semiconductor package includes a lead frame, a first die, a second die and a single connecting strip. The lead frame includes a voltage plate, a grounding plate, an output plate, a first...

Film based ic packaging method and a packaged ic device
11/14/13 - 20130299955 - Film-on-wire (FOW) based IC devices and FOW based methods for IC packaging are described. In an embodiment, a method for packaging an IC dies involves applying a film layer to IC dies and bond wires that are attached to a substrate or a leadframe to form a film-on-wire layer, where...

Vertically packaged integrated circuit
10/31/13 - 20130285220 - A device comprises a semiconductor package including a first integrated circuit (IC) die including a plurality of through silicon vias (TSVs). The TSVs are formed of conductive material that extend through the first IC die from an outer surface on a first side of the die to an outer surface...

Semiconductor device and method of manufacturing same
10/31/13 - 20130285221 - A semiconductor device has a heat dissipating base; a patterned insulating substrate attached to the heat dissipating base with a solder therebetween; a semiconductor chip attached to a conductive pattern of the patterned insulating substrate with a solder therebetween; a first conductor attached to the semiconductor chip with a solder...

Power module and lead frame for power module
10/17/13 - 20130270684 - The present invention aims at providing a power module and a lead frame for the power module which can enhance adhesion between a heat sink and an insulating resin sheet while maintaining heat radiation properties. The power module includes: the lead frame including a conductor plate formed from Cu or...

Lead frame, semiconductor device, and method for manufacturing lead frame
10/03/13 - 20130256854 - A lead frame includes a plurality of leads defined by an opening extending in a thickness direction. An insulating resin layer fills the opening to entirely cover side surfaces of each lead and to support the leads. A first surface of each lead is exposed from a first surface of...

Assembly having stacked die mounted on substrate
08/15/13 - 20130207249 - Metal rerouting interconnects at one or more sides of a die or multiple die segments can form edge bonding pads for electrical connection. Insulation can be applied to surfaces of the die or multiple die segments after optional thinning and singulation, and openings can be made in the insulation to...

Power semiconductor module and manufacturing method thereof
07/11/13 - 20130175678 - A power semiconductor module includes a power semiconductor element formed with a plurality of control electrodes on one main surface, a first conductor plate bonded by way of a first solder material to one of the main surfaces of the power semiconductor element, and a second conductor plate bonded by...

Semiconductor package with conductive heat spreader
06/27/13 - 20130161803 - A semiconductor package that includes a semiconductor die and a heat spreader thermally coupled to the semiconductor and disposed at least partially within the molded housing of the package....

Packaged leadless semiconductor device
06/20/13 - 20130154068 - A packaged leadless semiconductor device (20) includes a heat sink flange (24) to which semiconductor dies (26) are coupled using a high temperature die attach process. The semiconductor device (20) further includes a frame structure (28) pre-formed with bent terminal pads (44). The frame structure (28) is combined with the...

Semiconductor package
06/20/13 - 20130154069 - Disclosed herein is a semiconductor package, including: a first heat dissipation substrate; a first lead frame that is formed on the first heat dissipation substrate by patterning; a first semiconductor device formed on the first lead frame; a second semiconductor device that is stacked on the first semiconductor device; a...

Semiconductor package
06/20/13 - 20130154070 - Disclosed herein is a semiconductor package. The semiconductor package includes: semiconductor elements, a first heat dissipation substrate formed under the semiconductor elements, a first lead frame electrically connecting the lower portions of the semiconductor elements to an upper portion of the first heat dissipation substrate, a second heat dissipation substrate...

Two level leadframe with upset ball bonding surface and device package
05/23/13 - 20130127029 - A leadframe, device package, and mode of construction configured to attain a thin profile and improved thermal performance. Leadframes of this invention include a raised die attachment pad arrange above distal ends of leadframe leads. A package will further include a die electrically coupled with an underside surface of the...

Power semiconductor unit, power module, power semiconductor unit manufacturing method, and power module manufacturing method
05/16/13 - 20130119525 - Heat radiation surfaces 7b and 8b of electrode lead frames 7 and 8 make thermal contact with heat radiation members 301 via insulation sheets 10 to dissipate heat from a power semiconductor element 5 to the heat radiation members (thick portions 301). Each of exposed areas of the heat radiation...

Semiconductor package
05/02/13 - 20130105954 - Disclosed herein is a semiconductor package, including: a substrate having a first surface and a second surface; at least one semiconductor device formed on the first surface of the substrate; first lead frames respectively formed at both sides of the first surface of the substrate; and second lead frames respectively...

Top-side cooled semiconductor package with stacked interconnection plates and method
04/25/13 - 20130099364 - A top-side cooled semiconductor package with stacked interconnection plate is disclosed. The semiconductor package includes a circuit substrate with terminal leads, a semiconductor die atop the circuit substrate, a low thermal resistance intimate interconnection plate for bonding and interconnecting a top contact area of the semiconductor die with the circuit...

Diode cell modules
04/11/13 - 20130087899 - Diode cell modules for use within photovoltaic systems, including lead frames including first leads extending from the first outlet terminal, second leads spaced from the first leads, second outlet terminals extending from the second leads, and diodes. In some examples, first leads define base portions connected to the first outlet...

Thermally enhanced low parasitic power semiconductor package
04/11/13 - 20130087900 - A semiconductor device includes a source region, a gate region and a drain region. A first leadframe subassembly is coupled to the drain region. on a second side of the die are attached to a second leadframe subassembly. A second leadframe subassembly has a first portion electrically coupled with the...

Package structure
03/28/13 - 20130075882 - A package structure including a first leadframe, a second leadframe, a power pin, a ground pin, a first pin, several first wires, several second wires, and a package body is disclosed. The first leadframe is used for electrically coupling to the drains of a first power transistor and the second...