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Active Solid-state Devices (e.g., Transistors, Solid-state Diodes) > Lead Frame > On Insulating Carrier Other Than A Printed Circuit Board

On Insulating Carrier Other Than A Printed Circuit Board

On Insulating Carrier Other Than A Printed Circuit Board patent applications listed include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.

09/18/14 - 20140264794 - Low cte interposer without tsv structure
A microelectronic assembly including a dielectric region, a plurality of electrically conductive elements, an encapsulant, and a microelectronic element are provided. The encapsulant may have a coefficient of thermal expansion (CTE) no greater than twice a CTE associated with at least one of the dielectric region or the microelectronic element....

07/10/14 - 20140191378 - Integrated circuit package
An integrated circuit (IC) package including a bottom leadframe, an interposer mounted on the bottom leadframe, a flipchip die mounted on the interposer and a top leadframe electrically connected to the interposer. Also, a method of making an integrated circuit (IC) package including electrically and physically attaching a die to...

06/19/14 - 20140167234 - Single layer coreless substrate
An electronic chip package comprising at least one chip bonded to a routing layer of an interposer comprising a routing layer and a via post layer that is surrounded by a dielectric material comprising glass fibers in a polymer matrix, wherein the electronic chip package further comprises a second layer...

06/12/14 - 20140159213 - Electrical interconnect for an integrated circuit package and method of making same
An interconnect assembly for an embedded chip package includes a dielectric layer, first metal layer comprising upper contact pads, second metal layer comprising lower contact pads, and metalized connections formed through the dielectric layer and in contact with the upper and lower contact pads to form electrical connections therebetween. A...

05/22/14 - 20140138808 - Leadframe area array packaging technology
Embodiments of the present invention are directed to leadframe area array packaging technology for fabricating an area array of I/O contacts. A manufactured package includes a polymer material substrate, an interconnect layer positioned on top of the polymer material substrate, a die coupled to the interconnect layer via wire bonds...

05/22/14 - 20140138809 - Package structure and manufacturing method thereof
A package structure and a manufacturing method thereof are disclosed. The package structure includes an outer lead, a driver chip, a soft material, and a solidified material. There is a distance between the driver chip and the outer lead. The soft material is used to fill the space in the...

05/08/14 - 20140124910 - Semiconductor package and method of forming the same
Semiconductor packages and methods of forming the same may be provided. According to the semiconductor package of the present inventive concepts, a bump attached to and protruded from a bonding pad on a surface of a semiconductor chip is inserted into a through-hole defined in a package substrate. As a...

05/01/14 - 20140117519 - Semiconductor device
The semiconductor device has the CSP structure, and may include a plurality of electrode pads formed on a semiconductor integrated circuit in order to input/output signals from/to exterior; solder bumps for making external lead electrodes; and rewiring. The solder bumps may be arranged in two rows along the periphery of...

04/17/14 - 20140103503 - Semiconductor device and method of forming non-linear interconnect layer with extended length for joint reliability
A semiconductor device has a substrate and first conductive layer formed over the substrate. An insulating layer is formed over the first substrate with an opening over the first conductive layer. A second conductive layer is formed within the opening of the insulating layer. A portion of the second conductive...

04/17/14 - 20140103504 - Semiconductor device
A first chip including electrodes is mounted above an expanded semiconductor chip formed by providing an expanded portion at an outer edge of a second chip including chips. The electrodes of the first chip are electrically connected to the electrodes of the second chip by conductive members. A re-distribution structure...

04/10/14 - 20140097525 - Circuit boards, methods of fabricating the same, and semiconductor packages including the circuit boards
Provided is a circuit board, which may include a base layer, an adhesive film, a conductive circuit, and a through via. The adhesive film and the conductive circuit may be provided in plurality to be alternately stacked on the base layer. The through via may be formed through soldering. Since...

03/27/14 - 20140084430 - Semiconductor chip and film and tab package comprising the chip and film
A semiconductor chip for a TAB package includes a surface including a set of input pads connected to internal circuitry of the chip and for receiving external signals The surface includes output pads. A plurality of input pads are adjacent a first edge and are in a first row substantially...

02/13/14 - 20140042601 - Multi-chip stacking of integrated circuit devices using partial device overlap
One aspect provides an integrated circuit (IC) packaging assembly that comprises a substrate having conductive traces located thereon, wherein the signal traces are located in an IC device region and the power traces are located in a wafer level fan out (WLFO) region located lateral the IC device region. This...

02/13/14 - 20140042602 - Wiring board and method for manufacturing wiring board
A wiring board includes a substrate having a cavity, and an electronic component accommodated in the cavity of the substrate. The substrate has a thickness which is greater than a thickness of the electronic component such that a ratio of the thickness of the substrate to the thickness of the...

01/30/14 - 20140027889 - Reconstituted wafer package with high voltage discrete active dice and integrated field plate for high temperature leakage current stability
A reconstituted wafer level package for a versatile high-voltage capable component is disclosed. The reconstituted wafer package includes a dice substantially encapsulated by a mold material except for a first face. A dielectric layer is disposed on the first face of the dice. The package further includes an array of...

01/02/14 - 20140001612 - Multiple die packaging interposer structure and method
System and method for providing a multiple die interposer structure. An embodiment comprises a plurality of interposer studs in a molded interposer, with a redirection layer on each side of the interposer. Additionally, the interposer studs may be initially attached to a conductive mounting plate by soldering or wirebond welding...

12/26/13 - 20130341775 - Semiconductor module
A semiconductor module includes: an insulating plate; a plurality of metal patterns formed on the insulating plate and spaced apart from each other; a power device chip solder-joined on one the metal pattern; a lead frame solder-joined on the metal pattern to which the power device chip is not solder-joined,...

11/28/13 - 20130313695 - Semiconductor device
In a semiconductor device including a semiconductor element and a wiring substrate on which the semiconductor element is mounted. The wiring substrate includes an insulating substrate and conductive wiring formed in the insulating substrate and electrically connected to the semiconductor element. The conductive wiring includes an underlying layer formed on...

09/05/13 - 20130228905 - Method for manufacturing semiconductor devices having a glass substrate
A method for connecting a semiconductor chip to a metal layer of a carrier substrate is disclosed. A semiconductor chip is provided which has a first side, a second side opposite the first side, a glass substrate bonded to the second side of the semiconductor chip and including at least...

08/29/13 - 20130221503 - Semiconductor package
A semiconductor package including a semiconductor chip; a base member on which the semiconductor chip is mounted; a plurality of leads formed on the base member, the leads including inner ends electrically connected to the semiconductor chip and outer ends; and an index for identifying locations of specific leads....

08/29/13 - 20130221504 - Semiconductor module and method of manufacturing a semiconductor module
An exemplary semiconductor module includes a substrate formed of a ceramic insulator, and at least one metallic layer formed on the substrate. The metallic layer includes a deepening for placing and fixing a contact element. The contact element is at least partially “L”-shaped and includes a first arm for fixing...

06/27/13 - 20130161801 - Module including a discrete device mounted on a dcb substrate
A module includes a DCB substrate and a discrete device mounted on the DCB substrate, wherein the discrete device comprises a leadframe, a semiconductor chip mounted on the leadframe and an encapsulation material covering the semiconductor chip....

06/06/13 - 20130140687 - Semiconductor device
According to one embodiment, provided is a semiconductor device including a lower layer wiring, and an upper layer wiring that is drawn in the same direction as a direction in which the lower layer wiring is drawn. Intermediate wirings include at least a first intermediate wiring and a second intermediate...

05/16/13 - 20130119524 - Chip package, method for forming the same, and package wafer
A chip package includes: a substrate having a first surface and a second surface; a device region disposed in or on the substrate; a conducting pad disposed in the substrate or on the first surface, wherein the conducting pad is electrically connected to the device region; a hole extending from...

03/21/13 - 20130069213 - Power module package
Disclosed herein is a power module package including: a first substrate having one surface and the other surface; a second substrate contacting one surface of the first substrate; a third substrate contacting one side of the other surface of the first substrate; a first lead frame contacting the other side...

12/13/12 - 20120313228 - Impedence controlled packages with metal sheet or 2-layer rdl
A microelectronic assembly includes an interconnection element, a conductive plane, a microelectronic device, a plurality of traces, and first and second bond elements. The interconnection element includes a dielectric element, a plurality of element contacts, and at least one reference contact thereon. The microelectronic device includes a front surface with...

11/29/12 - 20120299167 - Uniformity control for ic passivation structure
The present disclosure involves a semiconductor device. The semiconductor device includes a wafer containing an interconnect structure. The interconnect structure includes a plurality of vias and interconnect lines. The semiconductor device includes a first conductive pad disposed over the interconnect structure. The first conductive pad is electrically coupled to the...

11/29/12 - 20120299168 - Integrated circuit packaging system with vertical interconnects and method of manufacture thereof
A method of manufacture of an integrated circuit packaging system includes: providing a base carrier having a base carrier hole from a base carrier interconnection side to a base carrier device side; mounting a base integrated circuit over the base carrier; forming an encapsulation over the base carrier covering the...

11/29/12 - 20120299169 - Stacked wafer level package having a reduced size
A stacked wafer level package includes a first semiconductor chip having a first bonding pad and a second semiconductor chip having a second bonding pad. Both bonding pads of the semiconductor chips face the same direction. The second semiconductor chip is disposed in parallel to the first semiconductor chip. A...

11/01/12 - 20120273928 - Chip on film type semiconductor package
A chip on film (COF) type semiconductor package is provided. The chip on film (COF) type semiconductor package includes a film, a plurality of leads formed on a surface of the film, a chip adhered to ends of the leads, an underfill layer filled within a space between the chip...

09/27/12 - 20120241928 - Integrated circuit packaging system with flipchip leadframe and method of manufacture thereof
An integrated circuit packaging system and method of manufacture thereof includes: leads and a paddle; a first encapsulant molded between the leads and the paddle, the first encapsulant thinner than the leads; a non-conductive layer over the paddle; and conductive traces directly on the leads, the first encapsulant, and the...

08/23/12 - 20120211877 - Semiconductor device and method for manufacturing same
A semiconductor device includes (i) a tape base material, (ii) a wiring pattern, (iii) a semiconductor element which is electrically connected with the wiring pattern, (iv) a top-side insulating protective film which covers a top surface of the tape base material and has an top-side opening section provided in a...

08/09/12 - 20120199960 - Wire bonding for interconnection between interposer and flip chip die
An integrated circuit (IC) device includes an interposer having a dielectric substrate having a first side, a second side, and an inner aperture, wherein a plurality of electrically conductive traces are on the first side. An IC die includes a topside semiconductor surface having active circuitry and a bottomside surface,...

07/12/12 - 20120175754 - Wiring board
A wiring board including a core substrate made of an insulative material and having a penetrating portion, a first interlayer insulation layer formed on the surface of the core substrate, a first conductive circuit formed on the surface of the first interlayer insulation layer, a first via conductor formed in...

07/05/12 - 20120168918 - Semiconductor packages
Provided is a semiconductor package including: a semiconductor chip mounted on a die pad; at least one lead connected electrically to the semiconductor chip; and a flexible film substrate including a metal wiring, which electrically connects the semiconductor chip and the at least one lead, wherein the semiconductor chip is...

06/21/12 - 20120153445 - Hybrid substrates, semiconductor packages including the same and methods for fabricating semiconductor packages
Provided are a hybrid substrate, a semiconductor package including the same, and a method for fabricating the semiconductor package. The hybrid substrate may include an insulation layer, and an organic layer. The insulation layer may include a top, a bottom opposite to the top, and a conductive pattern having different...

05/31/12 - 20120133035 - Tcp-type semiconductor device and method of testing thereof
A semiconductor device includes a base film, a semiconductor chip mounted on the base film, and a plurality of leads formed on the base film, each of the leads including one end coupled to the semiconductor chip and another end being opposite to the one end. The another end of...

05/10/12 - 20120112330 - Semiconductor device
A semiconductor device, such as a semiconductor device of chip on film package, is provided. The semiconductor device includes at least an integrated circuit formed on a film base, each integrated circuit includes a chip and a plurality of leads formed interior to a boundary of a predetermined range, each...

03/15/12 - 20120061810 - Led lead frame having different mounting surfaces
An LED lead frame comprises an insulative housing including a top surface, a bottom surface, and four side surfaces connected the top surface and the bottom surface, and a cavity recessed from the top surface. A pair of conductive leads each has a portion embedded into the insulative housing and...

01/26/12 - 20120018861 - Tape carrier substrate
A tape carrier substrate includes: a tape carrier base 1; a first terminal section 2A including a plurality of first terminals 2a arranged with one another in a first direction W; a second terminal section 2B including a plurality of second terminals 2b; and first and second conductive wires 3a...

12/29/11 - 20110316131 - Semiconductor device with heat spreader
A BGA type semiconductor device includes: a substrate having wirings and electrodes; a semiconductor element disposed on the substrate, having a rectangular plan shape, and a plurality of electrodes disposed along each side of the semiconductor element; a plurality of wires connecting the electrodes on the semiconductor element with the...

09/29/11 - 20110233741 - Semiconductor memory device and manufacturing the same
According to one embodiment, a semiconductor memory device including an organic substrate with an external connection terminal and a semiconductor memory chip. The semiconductor memory device further includes a lead frame having a bonded portion and an installation portion. It further includes a resin mold for sealing the semiconductor memory...

09/29/11 - 20110233742 - Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus
A semiconductor device is provided comprising: a semiconductor element including a plurality of electrodes; first wirings coupled to the electrodes and directed toward a center of the semiconductor element from a portion coupled to the electrodes; second wirings coupled between the first wirings and external terminals, the second wirings being...

08/18/11 - 20110198740 - Semiconductor storage device and manufacturing method thereof
According to one embodiment, a semiconductor storage device includes an organic board provided with external connection terminals on one surface and formed as an individual piece into a plane shape substantially identical to that of an area where the external connection terminals are provided, a lead frame having a mounting...

07/14/11 - 20110169147 - Chip package structure and package substrate
A chip package structure for being disposed on a carrier includes a package substrate and a chip. The package substrate includes a laminated layer, a patterned conductive layer, a solder-mask layer, at least one outer pad and a padding pattern. The patterned conductive layer is disposed on a first surface...

07/14/11 - 20110169148 - Tape wiring substrate and tape package using the same
A tape wiring substrate may have dispersion wiring patterns. The dispersion wiring patterns may be provided between input/output wiring pattern groups to compensate for the intervals therebetween. Connecting wiring patterns may be configured to connect the dispersion wiring patterns to a first end of the adjacent input/output wiring pattern....

07/07/11 - 20110163426 - Dice rearrangement package structure using layout process to form a compliant configuration
A dice rearrangement package structure is provided, which a dice having an active surface and a bottom surface, and a plurality of pads is disposed on the active surface; a package body is provided to cover the dices and the plurality of pads being exposed; one ends of plurality of...

06/23/11 - 20110147903 - Leadframe circuit and method therefor
An integrated circuit leadframe device supports various chip arrangements. As consistent with various embodiments, a leadframe includes a plurality of banks of conductive integrated circuit chip connectors. Each bank has a plurality of conductive strips respectively having an end portion, the end portions of each of the strips in the...

06/02/11 - 20110127657 - Wiring circuit structure and manufacturing method for semiconductor device using the structure
A conductor layer 2 is formed as a circuit pattern on a base insulating layer 1, a terminal 3 is formed thereon, and a supporting column 4 is formed in the vicinity of the terminal on the upper face of the base insulating layer 1. Here, supposing the protrusion height...

05/05/11 - 20110101510 - Board on chip package substrate and manufacturing method thereof
A single-layer board on chip package substrate and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, the substrate includes an insulator, a first pad and a second pad, which are provided on an upper surface of the insulator, a through-hole, which is formed...

03/03/11 - 20110049688 - Tcp-type semiconductor device
A TCP type semiconductor device, which is connected to a plurality of substrate-side electrodes parallel to each other and each having a linear shape, has: a base film; a semiconductor chip mounted on the base film; and a plurality of leads formed on the base film and electrically connecting between...