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Lead Frame

Lead Frame patent applications listed include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.

Related Categories:

Active Solid-state Devices (e.g., Transistors, Solid-state Diodes)


Lead Frame



Elimination of die-top delamination
11/20/14 - 20140339690 - An integrated-circuit module includes an integrated-circuit device having a first surface and a plurality of bond pads disposed on the first surface. The module further includes metallic bond wires or metallic ribbons, which are attached between respective ones of a first subset of the bond pads and a package substrate...

Microelectronic devices and methods for manufacturing microelectronic devices
11/13/14 - 20140332938 - Microelectronic devices and methods for manufacturing microelectronic devices are disclosed herein. One such method includes forming a plurality of apertures in a substrate with the apertures arranged in an array, and, after forming the apertures, attaching the substrate to a lead frame having a plurality of pads with the apertures...

Semiconductor device and method for manufacturing same
11/06/14 - 20140327121 - Solder containing easily volatized metals (Zn, Mg, Sb) is used for a solder material 106, and after a semiconductor element 104 is connected to a lead frame 102 and wire bonding is carried out, vacuum heat treatment is applied, the easily volatized metals in the solder are volatized to adhere...

Semiconductor package with wire bonding
10/23/14 - 20140312474 - A semiconductor package having a die having a plurality of electrically continuous die wire bonding sites includes a first die wire bonding site and a second die wire bonding site. The package includes a substrate having a plurality of electrically continuous substrate wire bonding sites including a first substrate wire...

Die reuse in electrical circuits
10/23/14 - 20140312475 - A die having multiple sets of contact pads, with each such set having two or more contact pads distributed over the die and electrically interconnected using a respective electrical intra-die path to enable die reuse in a manner that causes electrical inter-die buses to be relatively short in length. Each...

No-exposed-pad ball grid array (bga) packaging structures and method for manufacturing the same
10/23/14 - 20140312476 - A no-exposed-pad ball grid array (BGA) packaging structure includes a metal substrate, a first die coupled to a top surface of the metal substrate, and a plurality of outer leads formed on the metal substrate and extending to the proximity of the die. A metal layer that contains a plurality...

Lead and lead frame for power package
10/23/14 - 20140312477 - A power device includes a semiconductor chip provided over a substrate, and a patterned lead. The patterned lead includes a raised portion located between a main portion and an end portion. At least part of the raised portion is positioned over the semiconductor chip at a larger height than both...

Semiconductor device and method of manufacturing thereof
10/16/14 - 20140306327 - A semiconductor device includes a device carrier and a semiconductor chip attached to the device carrier. Further, the semiconductor device includes a lid having a recess. The lid includes a semiconductor material and is attached to the device carrier such that the semiconductor chip is accommodated in the recess....

Semiconductor device
10/16/14 - 20140306328 - The semiconductor device includes a semiconductor element, a main lead and a resin package. The semiconductor element includes an obverse surface and a reverse surface spaced apart from each other in a thickness direction. The main lead supports the semiconductor element via the reverse surface of the semiconductor element. The...

Semiconductor device
10/09/14 - 20140299977 - A semiconductor device includes: a lead frame; an IC element mounted on a main face of the lead frame; an inductor mounted on a back face of the lead frame; and a resin body configured to seal the lead frame, the IC element and the inductor, wherein the inductor and...

Integrated circuit package
10/02/14 - 20140291822 - An integrated circuit (“IC”) package including an IC assembly mounted on a leadframe and an encapsulant block covering the IC assembly and portions of the leadframe. The encapsulant block has a molded chamfered outer surface portion and the leadframe has a saw cut outer periphery....

Multi-chip semiconductor power device
09/25/14 - 20140284777 - A semiconductor device includes a first semiconductor power chip mounted over a first carrier and a second semiconductor power chip mounted over a second carrier. The semiconductor device further includes a contact clip mounted over the first semiconductor power chip and on the second semiconductor power chip. A semiconductor logic...

Methods and systems for selectively forming metal layers on lead frames after die attachment
09/25/14 - 20140284778 - Methods and systems are disclosed for selectively forming metal layers on lead frames after die attachment to improve electrical connections for areas of interest on lead frames, such as for example, lead fingers and down-bond areas. By selectively forming metal layers on areas of interest after die attachment, the disclosed...

Semiconductor packages and methods of packaging semiconductor devices
09/18/14 - 20140264789 - Semiconductor packages and methods for forming a semiconductor package are disclosed. The method includes providing a package substrate having first and second major surfaces. The package substrate includes a base substrate having a mold material and a plurality of interconnect structures including via contacts extending through the first to the...

Chip package and method for manufacturing the same
09/18/14 - 20140264790 - Various embodiments provide a chip package. The chip package may include a metallic chip carrier; at least one chip carried by the metallic chip carrier; encapsulation material encapsulating the at least one chip and the metallic chip carrier; and a plurality of redistribution layers disposed over the at least one...

Direct external interconnect for embedded interconnect bridge package
09/18/14 - 20140264791 - An external direct connection usable for an embedded interconnect bridge package is described. In one example, a package has a substrate, a first semiconductor die having a first bridge interconnect region, and a second semiconductor die having a second bridge interconnect region. The package has a bridge embedded in the...

Semiconductor packages and methods of packaging semiconductor devices
09/18/14 - 20140264792 - Semiconductor packages and methods for forming a semiconductor package are presented. The method includes providing a package substrate having first and second major surfaces. The package substrate includes at least one substrate layer having at least one cavity. Interconnect structure is formed. At least one conductive stud is formed within...

Wafer-level package mitigated undercut
09/11/14 - 20140252571 - A wafer-level package device and techniques are described that include utilizing a dry-etch process for mitigating metal seed layer undercut. In an implementation, a process for fabricating the wafer-level package device that employs the techniques of the present disclosure includes processing a substrate, depositing a metal seed layer on the...

Structure and method for 3d ic package
09/11/14 - 20140252572 - Provided is a chip package structure and a method for forming the chip package. The method includes bonding a plurality of first dies on a carrier, encapsulating in a first molding compound the first dies on the carrier, coupling a plurality of second dies on the first dies using conductive...

Semiconductor device and method of forming embedded conductive layer for power/ground planes in fo-ewlb
09/11/14 - 20140252573 - A semiconductor device has a first conductive layer and a semiconductor die disposed adjacent to the first conductive layer. An encapsulant is deposited over the first conductive layer and semiconductor die. An insulating layer is formed over the encapsulant, semiconductor die, and first conductive layer. A second conductive layer is...

Lead frame and semiconductor device
09/11/14 - 20140252574 - A lead frame of high quality which can endure direct bonding to the electrodes of a semiconductor element and a metal member, and a semiconductor device of high reliability which utilizing the lead frame. The lead frame includes a pair of lead frame portions which are arranged spaced apart from...

Electronic device
08/28/14 - 20140239466 - An electronic device includes a first transistor device with first contact elements, a second transistor device with second contact elements, and an electrical connection member with a first main face and a second main face opposite to the first main face. The first transistor device is disposed on the first...

Semiconductor device
08/28/14 - 20140239467 - A semiconductor device includes a lead frame, a semiconductor chip soldered to the lead frame, and a metal bar. The metal bar is arranged inside a solder layer so as to extend along one side of the semiconductor chip. When viewed in a stacking direction of the lead frame and...

Semiconductor device
08/28/14 - 20140239468 - An object is to provide a semiconductor device having a plate electrode adapted to a plurality of chips, capable of being produced at low cost, and having high heat cycle property. A semiconductor device according to the present invention includes a plurality of semiconductor chips formed on a substrate, and...

Semiconductor device
08/21/14 - 20140231975 - A semiconductor device includes an insulating circuit substrate mounted with at least one semiconductor element; a resin case having a bottom surface portion attached with the insulating circuit substrate and a side surface portion enclosing a periphery of the bottom surface portion; a lead molded integrally with the resin case...

Semiconductor device
08/14/14 - 20140225238 - A semiconductor device includes a metal substrate, semiconductor elements, wires, a control terminal, a main electrode terminal, a control substrate, a cover, a sealing resin, a case, and an insulator. The metal substrate includes a metal plate, an insulating layer formed on the top surface of the metal plate, and...

Resin-encapsulated semiconductor device and method of manufacturing the same
08/14/14 - 20140225239 - A resin-encapsulated semiconductor device includes a semiconductor element mounted on a die pad portion, a plurality of lead portions arranged so that leading end portions thereof are opposed to the die pad portion, and thin metal wires for connecting together electrodes of the semiconductor element and the lead portions. Those...

Electrical connectivity of die to a host substrate
08/07/14 - 20140217565 - According to example configurations herein, an apparatus comprises a die and a host substrate. The die can include a first transistor and a second transistor. A surface of the die includes multiple conductive elements disposed thereon. The multiple conductive elements on the surface are electrically coupled to respective nodes of...

Semiconductor device
07/31/14 - 20140210060 - Provided is a method of manufacturing a semiconductor device which includes a semiconductor chip, an insulating board mounted with the semiconductor chip and having a wiring pattern, and a leadframe connected to the wiring pattern, the semiconductor chip, the wiring pattern and the leadframe being partially sealed with a sealing...

Lead frame and a method of manufacturing thereof
07/24/14 - 20140203418 - A method of manufacturing a lead frame, comprising the steps of: providing an electrically-conductive base material having first and second planar sides; forming a patterned conductive layer on the first planar side of the base material; etching the second planar side of the base material at portions with respect to...

Half-bridge package with a conductive clip
07/24/14 - 20140203419 - According to an exemplary embodiment, a stacked half-bridge package includes a control transistor having a control drain for connection to a high voltage input, a control source coupled to a common conductive clip, and a control gate for being driven by a driver IC. The stacked half-bridge package also includes...

Chip arrangement and a method for forming a chip arrangement
07/17/14 - 20140197523 - A chip arrangement is provided, the chip arrangement, including: a carrier; at least one chip including at least one contact pad disposed over the carrier; an encapsulation material at least partially surrounding the at least one chip and the carrier; and at least one low temperature co-fired ceramic sheet disposed...

Die package structure
07/17/14 - 20140197524 - A die packaged structure includes a pad on the central region of the die. A packaged substrate with an opening disposed in the central region, and a connecting terminal is passed through the packaged substrate and disposed around the opening. An external connecting terminal is disposed on the four sides...

Power module
07/17/14 - 20140197525 - A power module configured to arrange a first electrode on a surface of which a first switching device is bonded, a second electrode on a surface of which a second switching device is bonded, and a third electrode by stacking the first electrode, the first switching device, the second electrode,...

Semiconductor device and method of making a semiconductor device
07/03/14 - 20140183711 - In accordance with an embodiment of the present invention, a semiconductor device has a substrate having a first surface and a second surface opposite the first surface. Also, the substrate has a first hole. A plurality of leads is disposed over the first surface of the substrate and a die...

Method for manufacturing a chip arrangement, and chip arrangement
06/26/14 - 20140175624 - A method for manufacturing a chip arrangement in accordance with various embodiments may include: placing a chip on a carrier within an opening of a metal structure disposed over the carrier; fixing the chip to the metal structure; removing the carrier to thereby expose at least one contact of the...

Semiconductor device including at least one element
06/26/14 - 20140175625 - A semiconductor device includes a chip, at least one element electrically coupled to the chip, an adhesive at least partially covering the at least one element, and a mold material at least partially covering the chip and the adhesive....

Integrated circuit package and method of manufacture
06/26/14 - 20140175626 - An integrated circuit package has a leadframe having an open space extending therethrough. An integrated circuit device is attached to a portion of the upper surface of the leadframe. A shunt is located within the open space such that it is not in contact with any portion of the leadframe....

Semiconductor light-emitting device
06/19/14 - 20140167233 - A semiconductor light-emitting device includes a lead frame, a semiconductor light-emitting element mounted on the top surface of the bonding region, and a case covering part of the lead frame. The bottom surface of the bonding region is exposed to the outside of the case. The lead frame includes a...

Stacked type power device module
06/12/14 - 20140159212 - The disclosure relates to a stacked type power device module. May use the vertical conductive layer for coupling the stacked devices, the electrical transmission path may be shortened. Hence, current crowding or contact damages by employing the conductive vias or wire bonding may be alleviated....

Embedded integrated circuit package and method for manufacturing an embedded integrated circuit package
06/05/14 - 20140151862 - A embedded integrated circuit package is provided, the embedded integrated circuit package including: at least one chip arranged over a chip carrier, the at least one chip including a plurality of chip contact pads; encapsulation material formed over the chip carrier and at least partially surrounding the at least one...

System for no-lead integrated circuit packages without tape frame
05/22/14 - 20140138805 - A system has a leadframe strip and a plurality of integrated circuit dies are each encapsulated in an encapsulant. The encapsulant has a plurality of first cuts and a plurality of second cuts therein. A fixture holds the package in said plurality of first cuts while said plurality of second...

Power overlay structure with leadframe connections
05/22/14 - 20140138806 - A power overlay (POL) packaging structure that incorporates a leadframe connection is disclosed. The a POL structure includes a POL sub-module having a dielectric layer, at least one semiconductor device attached to the dielectric layer and that includes a substrate composed of a semiconductor material and a plurality of connection...

Power overlay structure with leadframe connections
05/22/14 - 20140138807 - A power overlay (POL) packaging structure that incorporates a leadframe connection is disclosed. The a POL structure includes a POL sub-module having a dielectric layer, at least one semiconductor device attached to the dielectric layer and that includes a substrate composed of a semiconductor material and a plurality of connection...

Axial semiconductor package
05/15/14 - 20140131842 - An axially-mountable device includes a semiconductor chip comprising lower and upper electrical contacts. A lower die pad is electrically and mechanically connected to the lower electrical contact of the chip. An upper die pad is electrically and mechanically connected to the upper electrical contact of the chip. A first axially...

Magnetically coupled galvanically isolated communication using lead frame
05/15/14 - 20140131843 - An integrated circuit package includes an encapsulation and a lead frame. A portion of the lead frame is disposed within encapsulation. The lead frame includes a first conductor having a first conductive loop disposed substantially within the encapsulation. The lead frame also includes a second conductor that is galvanically isolated...

System and method for an electronic package with a fail-open mechanism
05/15/14 - 20140131844 - A semiconductor package including a fail open mechanism is disclosed. An embodiment includes a semiconductor package having a chip carrier, a chip disposed on the chip carrier and an encapsulant encapsulating the chip and the chip carrier. The semiconductor package further including a pin protruding from the encapsulant and a...

Semiconductor device
05/15/14 - 20140131845 - A semiconductor device includes a semiconductor element, a capacitor, a first resin, lead frames and a second resin. The first resin forms a resin molding which covers the semiconductor element and the capacitor. The lead frames are attached to two surfaces of the resin molding and are connected to the...

Semiconductor device
05/08/14 - 20140124909 - According to one embodiment, a semiconductor device includes a first electrical conductor, a second electrical conductor, first and second semiconductors between the first and second electrical conductors, a first power terminal, a second power terminal, a signal terminal, and an insulator which covers the components. The insulator includes a flat...

Multiple die in a face down package
05/01/14 - 20140117516 - A microelectronic package includes a subassembly including a first substrate and first and second microelectronic elements having contact-bearing faces facing towards oppositely-facing first and second surfaces of the first substrate and each having contacts electrically connected with the first substrate. The contact-bearing faces of the first and second microelectronic elements...

Power quad flat no-lead (pqfn) package having control and driver circuits
05/01/14 - 20140117517 - According to an exemplary implementation, a power quad flat no-lead (PQFN) package includes a multi-phase power inverter, a control circuit, and a driver circuit. The driver circuit is configured to drive the multi-phase power inverter responsive to a control signal from the control circuit. The multi-phase power inverter, the control...

Control and driver circuits on a power quad flat no-lead (pqfn) leadframe
05/01/14 - 20140117518 - According to an exemplary implementation, a power quad flat no-lead (PQFN) leadframe includes U-phase and W-phase power switches situated on the PQFN leadframe and respectively connected to a U-phase output strip and a W-phase output pad of the PQFN leadframe. The PQFN leadframe further includes a common integrated circuit (IC)...

Circuit board with twinned cu circuit layer and method for manufacturing the same
04/17/14 - 20140103501 - A circuit board with twinned Cu circuit layer and a method for manufacturing the same are disclosed, wherein the method comprises the following steps: (A) providing a substrate with a first circuit layer formed thereon, wherein the first circuit layer comprises a conductive pad; (B) forming a first dielectric layer...

Semiconductor device
04/17/14 - 20140103502 - A semiconductor device includes: a first semiconductor chip held on a substrate and including an expanded portion expanding outward from a side surface of a body of the first semiconductor chip; a first wire connecting the expanded portion of the first semiconductor chip to the substrate; and a second wire...

High density second level interconnection for bumpless build up layer (bbul) packaging technology
04/03/14 - 20140091442 - An apparatus including a die including a device side; and a build-up carrier including a body including a plurality of alternating layers of conductive material and dielectric material disposed on the device side of the die, an ultimate conductive layer patterned into a plurality of pads or lands; and a...

Extremely thin package
03/27/14 - 20140084429 - Techniques for achieving extremely thin package structures are disclosed. In some embodiments, a device comprises an integrated circuit connected to a leadframe or substrate via connections and EMC (Epoxy Molding Compound) surrounding the integrated circuit except at a backside of the integrated circuit and connecting areas via which the integrated...

Method and system for pre-migration of metal ions in a semiconductor package
03/20/14 - 20140077346 - Pre-migration of metal ions is achieved in a controlled manner to form a migrated metalover which an inhibitor is applied to prevent further migration. In a semiconductor circuit, pre-migration of metal ions is achieved by exposing a joined metal system to water, oxygen and an electrical field in a controlled...

Bridge interconnect with air gap in package assembly
03/13/14 - 20140070380 - Embodiments of the present disclosure are directed towards techniques and configurations for a bridge interconnect assembly that can be embedded in a package assembly. In one embodiment, a package assembly includes a package substrate configured to route electrical signals between a first die and a second die and a bridge...

Semiconductor memory card
03/13/14 - 20140070381 - A semiconductor memory card includes a lead frame having external connection terminals, a controller chip mounted on the lead frame and a memory chip mounted on the lead frame. The lead frame, the controller chip, and the memory chip are sealed with a sealing resin layer that has a surface...

Pre-molded mems device package
03/13/14 - 20140070382 - A MEMS lead frame package body encloses a MEMS device enclosed in an internal cavity formed by the mold body and cover. To accommodate a MEMS microphone, an acoustic aperture extends through the mold body. In some embodiments, a conductive column extends through the pre-molded body to allow electrical connection...

Pre-molded mems device package with conductive shell
03/13/14 - 20140070383 - A MEMS lead frame package body encloses a MEMS device enclosed in an internal cavity formed by the mold body and cover. A conductive internal shell with a connection window sits in the cavity. The MEMS device is mounted in the shell and electrically coupled to the lead frame through...

Stacked semiconductor device and printed circuit board
03/13/14 - 20140070384 - An interposer of a first semiconductor package includes a power supply wiring for a second semiconductor element, the power supply wiring including a land provided in one surface layer, and a power supply pattern provided in an inner layer and electrically connected to the land, the power supply wiring further...

Flip-chip package structure and method for an integrated switching power supply
03/13/14 - 20140070385 - Disclosed are flip-chip package structures and methods for an integrated switching power supply. In one embodiment, a flip-chip package structure can include: (i) a die with an integrated switching power supply, where a first surface of the die includes first bumps with different polarities; (ii) a redistribution layer including redistribution...

Integrated circuits and a method for manufacturing an integrated circuit
03/06/14 - 20140061878 - An integrated circuit is provided. The integrated circuit includes: a chip and encapsulation material covering at least three sides of the chip, the encapsulation material being formed from adhesive material. The integrated circuit includes a carrier adhered to the chip by means of the encapsulation material....

Multilayer packaged semiconductor device and method of packaging
03/06/14 - 20140061879 - One embodiment is a packaged device having multiple layers. Another embodiment is a method of forming a packaged device having multiple layers. Conductive layers and insulating layers can be formed with openings exposing semiconductor devices. The semiconductor devices can be wire-bonded to the conductive layers. In some embodiments, parasitic effects...

Wafer level chip scale package
03/06/14 - 20140061880 - The present disclosure provides a semiconductor device including a semiconductor element having a first surface and a second surface, which is opposite to the first surface, and a conductive via disposed on the semiconductor element. The semiconductor element includes a die; a first redistribution layer positioned on the first surface,...

Integrated circuit
03/06/14 - 20140061881 - An integrated circuit (IC) includes a packaging body, multiple interface connectors, a functional chip, and an electrostatic discharge (ESD) protection chip. The interface connectors are located on an outer surface of the packaging body. The functional chip has an electronic functional circuit, and the ESD protection chip has an ESD...

Electronic system modules and method of fabrication
03/06/14 - 20140061882 - A circuit assembly includes a plurality of integrated circuits having stud bumps at each input/output pad, an interconnection circuit having wells filled with solder, said wells corresponding in a one-to-one relationship with said stud bumps of said integrated circuits, and electrical and mechanical bonding at each of said input/output pads,...

Semiconductor device, and method of manufacturing semiconductor device
02/27/14 - 20140054757 - A semiconductor device includes a semiconductor element, a solder layer which is arranged on at least one surface of the semiconductor element and a lead frame which is arranged on the solder layer so that a porous nickel plating part is sandwiched between the lead frame and the solder layer....

Multi-chip module power clip
02/13/14 - 20140042599 - The multi-chip leadless module 200 has integrated circuit (IC) 150, dual re-channel mosfet 110, IC leads 210, 211, 212, gate leads 213, 213, and source leads 217-220 encapsulated in resin 250. The IC 150 and the dual n-channel mosfet 110 are mounted face down on the leads. IC leads 210,...

Semiconductor package and manufacturing method thereof
02/13/14 - 20140042600 - A semiconductor package and manufacturing method thereof are disclosed and may include a first semiconductor device comprising a first bond pad on a first surface of the first semiconductor device, a first encapsulant material surrounding side edges of the first semiconductor device, and a redistribution layer (RDL) formed on the...