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Active Solid-state Devices (e.g., Transistors, Solid-state Diodes) > Integrated Circuit Structure With Electrically Isolated Components > Passive Components In Ics > Including Inductive Element

Including Inductive Element

Including Inductive Element patent applications listed include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.

10/23/14 - 20140312457 - Integrated circuit chip with discontinuous guard ring
An electronic apparatus includes a semiconductor substrate, a circuit block disposed in and supported by the semiconductor substrate and comprising an inductor, and a discontinuous noise isolation guard ring surrounding the circuit block. The discontinuous noise isolation guard ring includes a metal ring supported by the semiconductor substrate and a...

10/23/14 - 20140312458 - Methods and apparatus related to an improved package including a semiconductor die
In one general aspect, a method can include forming a redistribution layer on a substrate using a first electroplating process, and forming a conductive pillar on the redistribution layer using a second electroplating process. The method can include coupling a semiconductor die to the redistribution layer, and can include forming...

10/23/14 - 20140312459 - Vertical meander inductor for small core voltage regulators
Vertical meander inductors for small core voltage regulators and approaches to fabricating vertical meander inductors for small core voltage regulators are described. For example, a semiconductor die includes a substrate. An integrated circuit is disposed on an active surface of the substrate. An inductor is coupled to the integrated circuit....

10/09/14 - 20140299964 - On-chip inductor using redistribution layer and dual-layer passiviation
A system and method utilize a redistribution layer in a flip-chip or wirebond package, which is also used to route signals to bumps, as a layer for the construction of an on-chip inductor or a layer of a multiple-layer on-chip inductor. In one example, the redistribution layer is surrounded by...

09/25/14 - 20140284761 - Integrated inductor and integrated inductor fabricating method
The present invention provides an integrated inductor and an integrated inductor fabricating method. The integrated inductor comprises: a semiconductor substrate, a plurality of through silicon vias (TSVs), and an inductor. The TSVs are formed in the semiconductor substrate and arranged in a specific pattern, and the TSVs are filled with...

09/25/14 - 20140284762 - Integrated inductor and integrated inductor fabricating method
The present invention provides an integrated inductor and an integrated inductor fabricating method. The integrated inductor comprises: a semiconductor substrate, a plurality of deep trenches, and an inductor. The deep trenches are formed in the semiconductor substrate and arranged in a specific pattern, and the deep trenches are filled with...

09/25/14 - 20140284763 - Integrated inductor and integrated inductor fabricating method
The present invention provides an integrated inductor and an integrated inductor fabricating method. The integrated inductor comprises: a semiconductor substrate, an inductor, and a redistribution layer (RDL). The inductor is formed above the semiconductor substrate. The RDL is formed above the inductor and has a specific pattern to form a...

09/18/14 - 20140264732 - Magnetic core inductor (mci) structures for integrated voltage regulators
Semiconductor packages including magnetic core inductor (MCI) structures for integrated voltage regulators are described. In an example, a semiconductor package includes a package substrate and a semiconductor die coupled to a first surface of the package substrate. The semiconductor die has a first plurality of metal-insulator-metal (MIM) capacitor layers thereon....

09/18/14 - 20140264733 - Device with integrated passive component
Semiconductor devices and methods for forming a semiconductor device are presented. The semiconductor device includes a die which includes a die substrate having first and second major surfaces. The semiconductor device includes a passive component disposed below the second major surface of the die substrate. The passive component is electrically...

09/18/14 - 20140264734 - Inductor with magnetic material
In accordance with an embodiment, a semiconductor device comprises a semiconductor die, an interposer, and conductive bumps bonding the semiconductor die to the interposer. The semiconductor die comprises a first metallization layer, and the first metallization layer comprises a first conductive pattern. The interposer comprises a second metallization layer, and...

09/18/14 - 20140264735 - Inductor system and method
A system and method for providing and manufacturing an inductor is provided. In an embodiment similar masks are reutilized to form differently sized inductors. For example, a two turn inductor and a three turn inductor may share masks for interconnects and coils, while only masks necessary for connections between the...

09/18/14 - 20140264736 - Semiconductor device and method of forming an inductor on polymer matrix composite substrate
A semiconductor device has a first insulating layer formed over a first surface of a polymer matrix composite substrate. A first conductive layer is formed over the first insulating layer. A second insulating layer is formed over the first insulating layer and first conductive layer. A second conductive layer is...

09/18/14 - 20140264737 - Component-embedded substrate
A component-embedded substrate having a multilayer substrate formed by laminating a plurality of thermoplastic sheets in a predetermined direction, an internal component provided in the multilayer substrate, and a surface-mount component mounted on a surface of the multilayer substrate using bumps. The surface-mount component, when viewed in a plan view...

09/18/14 - 20140264738 - Folded conical inductor
A semiconductor inductor structure may include a first spiral structure, located on a first metal layer, having a first outer-spiral electrically conductive track and a first inner-spiral electrically conductive track separated from the first outer-spiral electrically conductive track by a first dielectric material. A second spiral structure, located on a...

09/11/14 - 20140252540 - Semiconductor device and method of manufacturing thereof
A semiconductor device includes a semiconductor substrate having a first main surface in which a recess is formed. Further, the semiconductor device includes an electrical interconnect structure which is arranged at a bottom of the recess. A semiconductor chip is located in the recess. The semiconductor chip includes a plurality...

09/11/14 - 20140252541 - Systems and methods for power train assemblies
A power train assembly is provided. The power train assembly includes a component package including a first transistor having a first gate, a first drain, and a first source, a second transistor having a second gate, a second drain, and a second source, and a thermal pad configured to dissipate...

09/11/14 - 20140252542 - Structure and method for an inductor with metal dummy features
The present disclosure provides a semiconductor device. The semiconductor device includes an inductor formed on a substrate and configured to be operable with a current of a frequency; and dummy metal features configured between the inductor and the substrate, the dummy metal features having a first width less than 2...

09/04/14 - 20140246753 - High quality factor inductor implemented in wafer level packaging (wlp)
Some novel features pertain to a first example provides a semiconductor device that includes a printed circuit board (PCB), asset of solder balls and a die. The PCB includes a first metal layer. The set of solder balls is coupled to the PCB. The die is coupled to the PCB...

08/28/14 - 20140239442 - Electroless plated material formed directly on metal
A method for forming magnetic conductors includes forming a metal structure on a substrate. Plating surfaces are prepared on the metal structure for electroless plating by at least one of: masking surfaces of the metal structure to prevent electroless plating on masked surfaces and/or activating a surface of the metal...

08/28/14 - 20140239443 - Electroless plated material formed directly on metal
A method for forming magnetic conductors includes forming a metal structure on a substrate. Plating surfaces are prepared on the metal structure for electroless plating by at least one of: masking surfaces of the metal structure to prevent electroless plating on masked surfaces and/or activating a surface of the metal...

08/21/14 - 20140231955 - Process of ultra thick trench etch with multi-slope profile
The present disclosure relates to an integrated chip (IC) having an ultra-thick metal layer formed in a metal layer trench having a rounded shape that reduces stress between an inter-level dielectric (ILD) layer and an adjacent metal layer, and a related method of formation. In some embodiments, the IC has...

08/21/14 - 20140231956 - Integrated circuit inductor
An inductive device is formed in a circuit structure that includes alternating conductive and insulating layers. The device includes, in a plurality of the conductive layers, traces forming a respective pair of interleaved loops and at least one interconnect segment in each of the plurality of the conductive layers. In...

08/14/14 - 20140225221 - Semiconductor device, method of manufacturing the same, and signal transmitting/receiving method using the semiconductor device
A semiconductor device includes a semiconductor chip including a main surface, an internal circuit including a plurality of transistors, formed on the main surface, a bonding pad electrically connected to the internal circuit, formed on the main surface, an inductor for communicating an external device in a non-contact manner, formed...

08/07/14 - 20140217546 - Helical spiral inductor between stacking die
The present disclosure relates to a multi-level integrated inductor that provides for a good inductance and Q-factor. In some embodiments, the integrated inductor has a first inductive structure with a first metal layer disposed in a first spiral pattern onto a first IC die and a second inductive structure with...

08/07/14 - 20140217547 - Semiconductor package with air core inductor (aci) and magnetic core inductor (mci)
Semiconductor die packaged with air core inductors (ACIs) and magnetic core inductors (MCIs), or with multiple MCIs, are described. In a first example, a semiconductor package includes a semiconductor die, one or more air core inductors (ACIs) coupled to the semiconductor die, and one or more magnetic core inductors (MCIs)...

07/31/14 - 20140210044 - Semiconductor device having inductor
A semiconductor device including a first insulating layer and a second insulating layer sequentially disposed on a substrate is disclosed. A first conductive line and a second conductive line are disposed in the first insulating layer, and each of the first and second conductive lines has a first end and...

07/31/14 - 20140210045 - Inductor device and semiconductor device
An inductor device includes an insulation layer, an inductor, fixed electrodes, and a movable electrode. The inductor is formed on the insulation layer. The fixed electrodes are provided in positions which do not overlap with the inductor in a planar view. The movable electrode overlaps with the inductor and the...

07/31/14 - 20140210046 - Semiconductor device having high frequency wiring and dummy metal layer at multilayer wiring structure
A semiconductor device includes a semiconductor substrate, and a multilayer wiring layer provided over the semiconductor substrate. The multilayer wiring layer includes an inductor wiring formed in one wiring layer, a plurality of first dummy metals formed in the same layer as the inductor and provided inside the inductor, a...

07/31/14 - 20140210047 - Semiconductor device
A semiconductor device including: first and second semiconductor chips mounted on a base substrate; a third semiconductor chip, which is mounted on the base substrate, and outputs control signals controlling operations of the first and second semiconductor chips; a first transmission transformer, which is mounted on the base substrate, and...

07/24/14 - 20140203397 - Methods and apparatus for inductors and transformers in packages
Methods and apparatus for forming a semiconductor device package with inductors and transformers using a micro-bump layer are disclosed. The micro-bump layer may comprise micro-bumps and micro-bump lines, formed between a top die and a bottom die, or between a die and an interposer. An inductor can be formed by...

07/24/14 - 20140203398 - Integrated magnetic core inductors with interleaved windings
A coupled inductor topology for a thin-film magnetic core power inductor that enables efficient integrated power conversion. Coupled magnetic core inductors with interleaved windings inductors comprise magnetic films and partially or fully interleaved conductors. Methods described herein are suitable for integration into monolithic, chip stacking fabrication or other traditional semiconductor...

07/24/14 - 20140203399 - Integrated circuits with magnetic core inductors and methods of fabrications thereof
In one embodiment, a method of forming a semiconductor device includes forming a first inductor coil within and/or over a substrate. The first inductor coil is formed adjacent a top side of the substrate. First trenches are formed within the substrate adjacent the first inductor coil. The first trenches are...

07/10/14 - 20140191361 - Electroless plating of cobalt alloys for on chip inductors
A method for forming an on-chip magnetic structure includes forming a seed layer over a substrate of a semiconductor chip. The seed layer is patterned to provide a plating location. A cobalt based alloy is electrolessly plated at the plating location to form an inductive structure on the semiconductor chip....

07/10/14 - 20140191362 - Electroless plating of cobalt alloys for on chip inductors
A method for forming an on-chip magnetic structure includes forming a seed layer over a substrate of a semiconductor chip. The seed layer is patterned to provide a plating location. A cobalt based alloy is electrolessly plated at the plating location to form an inductive structure on the semiconductor chip....

07/10/14 - 20140191363 - External storage device and method of manufacturing external storage device
An external storage device including an interconnect substrate having a contact type external terminal, at least one semiconductor chip disposed over a first surface of the interconnect substrate, and a sealing resin layer which seals the at least one semiconductor chip and does not cover the external terminal. The at...

07/03/14 - 20140183690 - Guard ring design for maintaining signal integrity
A structure includes a metal feature, and a passivation layer having a portion overlapping the metal feature. The passivation layer includes a non-low-k dielectric material. A polymer layer is over the passivation layer. A Post-Passivation Interconnect (PPI) extends into the polymer layer to electrically couple to the metal feature. A...

07/03/14 - 20140183691 - Resonant clocking for three-dimensional stacked devices
Resonant clocking for three-dimensional stacked devices. An embodiment of an apparatus includes a stack including integrated circuit dies; and through silicon vias through at least one of the dies, wherein at least a first through silicon via of the through silicon vias includes a capacitive structure or an inductive structure,...

07/03/14 - 20140183692 - Techniques for fast resonance convergence
Some methods provide an electronic design file, which includes an integrated circuit (IC) component that is operably coupled to a package component. The IC component and package component collectively form a resistor inductor capacitor (RLC) resonant circuit. The method also provides a damping component in the electronic design file. This...

06/26/14 - 20140175602 - Semiconductor device and method of manufacturing the same
Characteristics of a semiconductor device are improved. A semiconductor device has a laminated insulating film formed above a lower-layer inductor. This laminated insulating film includes a first polyimide film, and a second polyimide film formed on the first polyimide film and having a second step between the first polyimide film...

06/19/14 - 20140167216 - Low-profile chip package with modified heat spreader
An integrated circuit system includes a heat spreader that is thermally coupled to a semiconductor chip and has a cavity or opening formed in the heat spreader. The cavity or opening is positioned so that capacitors and/or other passive components mounted to the same packaging substrate as the semiconductor chip...

06/19/14 - 20140167217 - Package with dielectric or anisotropic conductive (acf) buildup layer
Embodiments of the present disclosure are directed to techniques and configurations for an integrated circuit (IC) package having one or more dies connected to an integrated circuit substrate by an interface layer. In one embodiment, the interface layer may include an anisotropic portion configured to conduct electrical signals in the...

06/19/14 - 20140167218 - Circuit configuration and manufacturing processes for vertical transient voltage suppressor (tvs) and emi filter
A vertical TVS (VTVS) circuit includes a semiconductor substrate for supporting the VTVS device thereon having a heavily doped layer extending to the bottom of substrate. Deep trenches are provided for isolation between multi-channel VTVS. Trench gates are also provided for increasing the capacitance of VTVS with integrated EMI filter....

06/19/14 - 20140167219 - Thick on-chip high-performance wiring structures
Methods for fabricating a back-end-of-line (BEOL) wiring structure, BEOL wiring structures, and design structures for a BEOL wiring structure. The BEOL wiring may be fabricated by forming a first wire in a dielectric layer and annealing the first wire in an oxygen-free atmosphere. After the first wire is annealed, a...

06/12/14 - 20140159196 - Through substrate features in semiconductor substrates
Through substrate features in semiconductor substrates are described. In one embodiment, the semiconductor device includes a through substrate via disposed in a first region of a semiconductor substrate. A through substrate conductor coil is disposed in a second region of the semiconductor substrate....

06/05/14 - 20140151846 - Shielding silicon from external rf interference
Consistent with an example embodiment, there is an integrated circuit device (IC) built on a substrate of a thickness. The IC comprises an active device region of a shape, the active device region having a topside and an underside. Through silicon vias (TSVs) surround the active device region, the TSVs...

05/22/14 - 20140138792 - Hybrid transformer structure on semiconductor devices
Several novel features pertain to a hybrid transformer formed within a semiconductor die having multiple layers. The hybrid transformer includes a first set of windings positioned on a first layer of the die. The first layer is positioned above a substrate of the die. The first set of windings includes...

05/01/14 - 20140117494 - Inductor structure with pre-defined current return
An inductor structure implemented within a semiconductor integrated circuit includes a coil of conductive material including at least one turn and a current return encompassing the coil. The current return is formed of a plurality of interconnected metal layers of the semiconductor integrated circuit....

05/01/14 - 20140117495 - Switch circuit package module
A switch circuit package module includes a semiconductor switch unit and a capacitor unit. The semiconductor switch unit includes sub micro-switch elements. The capacitor unit is arranged at a periphery of the semiconductor switch unit or stacked on a surface of the semiconductor switch unit, such that impedances of commutation...

05/01/14 - 20140117496 - Semiconductor device having ground shield structure and fabrication method thereof
Semiconductor devices having a ground shield structure and methods for their formation are provided herein. An exemplary semiconductor device can include a substrate, a ground ring, a ground shield, an electronic device, and/or an insulation layer. The ground ring can be disposed over the substrate. The ground shield can be...

04/24/14 - 20140110820 - Passive component as thermal capacitance and heat sink
Representative implementations of devices and techniques provide improved thermal performance of a chip die disposed within a layered printed circuit board (PCB). Passive components may be strategically located on one or more surfaces of the PCB. The passive components may be arranged to conduct heat generated by the chip die...

04/24/14 - 20140110821 - Folded conical inductor
A semiconductor inductor structure may include a first spiral structure, located on a first metal layer, having a first outer-spiral electrically conductive track and a first inner-spiral electrically conductive track separated from the first outer-spiral electrically conductive track by a first dielectric material. A second spiral structure, located on a...

04/24/14 - 20140110822 - Semiconductor device including magnetically coupled monolithic integrated coils
A semiconductor device includes a first coil that is monolithically integrated in a first portion of a semiconductor body and that includes a first winding wrapping around a first core structure. A second coil is monolithically integrated in a second portion of the semiconductor body and includes a second winding...