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Including Inductive Element

Including Inductive Element patent applications listed include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.

Related Categories:

Active Solid-state Devices (e.g., Transistors, Solid-state Diodes)


Integrated Circuit Structure With Electrically Isolated Components > Passive Components In Ics > Including Inductive Element



Patterned ground shield structures and semiconductor devices
12/11/14 - 20140361401 - A patterned ground shield structure is provided. The patterned ground shield structure includes a substrate having a dielectric layer. The patterned ground shield structure also includes a plurality of conductive rings having a plurality of sub conductive rings in the dielectric layer. Further, the patterned ground shield structure includes an...

Integrated circuit package with printed circuit layer
12/11/14 - 20140361402 - An integrated circuit (IC) package including an IC die and a conductive ink printed circuit layer electrically connected to the IC die....

Vertically oriented semiconductor device and shielding structure thereof
12/04/14 - 20140353798 - The present disclosure involves a semiconductor device. The semiconductor device includes a substrate; a capacitor disposed over the substrate; an inductor disposed over the substrate and having a coil feature surrounding the capacitor; and a shielding structure over the substrate and configured around the coil feature....

On-chip inductors with reduced area and resistance
11/27/14 - 20140346634 - An integrated circuit that includes an on-chip inductor wrapped around an interface pad. On-chip inductors are arranged around an interface pad to reduce the area occupied by the inductor. Furthermore, arranging the on-chip inductors in an upper level metal layer, such us the redistribution layer (RDL), the top metal interconnect...

Semiconductor module and driving device for switching element
11/27/14 - 20140346635 - A semiconductor module includes: a semiconductor element; first and second main current passages for energizing the semiconductor element, the first and second main current passages being opposed to each other in such a manner that a first energization direction of the first main current passage is opposite to a second...

Semiconductor device, electronic apparatus, and method of manufacturing semiconductor device
11/27/14 - 20140346636 - A semiconductor chip is mounted on a first surface of an interconnect substrate, and has a multilayer interconnect layer. A first inductor is formed over the multilayer interconnect layer, and a wiring axis direction thereof is directed in a horizontal direction to the interconnect substrate. A second inductor is formed...

Composite reconstituted wafer structures
11/13/14 - 20140332925 - A reconstituted electronic device comprising at least one die and at least one passive component. A functional material is incorporated in the substrate of the device to modify the electrical behaviour of the passive component. The passive component may be formed in redistribution layers of the device. Composite functional materials...

Semiconductor device and method of forming inductor over insulating material filled trench in substrate
11/06/14 - 20140327107 - A semiconductor device has a trench formed in a substrate. The trench has tapered sidewalls and depth of 10-120 micrometers. A first insulating layer is conformally applied over the substrate and into the trench. An insulating material, such as polymer, is deposited over the first insulating layer in the trench....

Noise cancellation for a magnetically coupled communication link utilizing a lead frame
11/06/14 - 20140327108 - An integrated circuit package includes an encapsulation and a lead frame with a portion of the lead frame disposed within the encapsulation. The lead frame includes a first conductor having a first conductive loop and a third conductive loop disposed within the encapsulation. The third conductive loop is wound in...

High quality factor filter implemented in wafer level packaging (wlp) integrated device
10/30/14 - 20140319652 - Some implementations provide an integrated device that includes a capacitor and an inductor. The inductor is electrically coupled to the capacitor. The inductor and the capacitor are configured to operate as a filter for an electrical signal in the integrated device. The inductor includes a first metal layer of a...

Integrated circuit chip with discontinuous guard ring
10/23/14 - 20140312457 - An electronic apparatus includes a semiconductor substrate, a circuit block disposed in and supported by the semiconductor substrate and comprising an inductor, and a discontinuous noise isolation guard ring surrounding the circuit block. The discontinuous noise isolation guard ring includes a metal ring supported by the semiconductor substrate and a...

Methods and apparatus related to an improved package including a semiconductor die
10/23/14 - 20140312458 - In one general aspect, a method can include forming a redistribution layer on a substrate using a first electroplating process, and forming a conductive pillar on the redistribution layer using a second electroplating process. The method can include coupling a semiconductor die to the redistribution layer, and can include forming...

Vertical meander inductor for small core voltage regulators
10/23/14 - 20140312459 - Vertical meander inductors for small core voltage regulators and approaches to fabricating vertical meander inductors for small core voltage regulators are described. For example, a semiconductor die includes a substrate. An integrated circuit is disposed on an active surface of the substrate. An inductor is coupled to the integrated circuit....

On-chip inductor using redistribution layer and dual-layer passiviation
10/09/14 - 20140299964 - A system and method utilize a redistribution layer in a flip-chip or wirebond package, which is also used to route signals to bumps, as a layer for the construction of an on-chip inductor or a layer of a multiple-layer on-chip inductor. In one example, the redistribution layer is surrounded by...

Integrated inductor and integrated inductor fabricating method
09/25/14 - 20140284761 - The present invention provides an integrated inductor and an integrated inductor fabricating method. The integrated inductor comprises: a semiconductor substrate, a plurality of through silicon vias (TSVs), and an inductor. The TSVs are formed in the semiconductor substrate and arranged in a specific pattern, and the TSVs are filled with...

Integrated inductor and integrated inductor fabricating method
09/25/14 - 20140284762 - The present invention provides an integrated inductor and an integrated inductor fabricating method. The integrated inductor comprises: a semiconductor substrate, a plurality of deep trenches, and an inductor. The deep trenches are formed in the semiconductor substrate and arranged in a specific pattern, and the deep trenches are filled with...

Integrated inductor and integrated inductor fabricating method
09/25/14 - 20140284763 - The present invention provides an integrated inductor and an integrated inductor fabricating method. The integrated inductor comprises: a semiconductor substrate, an inductor, and a redistribution layer (RDL). The inductor is formed above the semiconductor substrate. The RDL is formed above the inductor and has a specific pattern to form a...

Magnetic core inductor (mci) structures for integrated voltage regulators
09/18/14 - 20140264732 - Semiconductor packages including magnetic core inductor (MCI) structures for integrated voltage regulators are described. In an example, a semiconductor package includes a package substrate and a semiconductor die coupled to a first surface of the package substrate. The semiconductor die has a first plurality of metal-insulator-metal (MIM) capacitor layers thereon....

Device with integrated passive component
09/18/14 - 20140264733 - Semiconductor devices and methods for forming a semiconductor device are presented. The semiconductor device includes a die which includes a die substrate having first and second major surfaces. The semiconductor device includes a passive component disposed below the second major surface of the die substrate. The passive component is electrically...

Inductor with magnetic material
09/18/14 - 20140264734 - In accordance with an embodiment, a semiconductor device comprises a semiconductor die, an interposer, and conductive bumps bonding the semiconductor die to the interposer. The semiconductor die comprises a first metallization layer, and the first metallization layer comprises a first conductive pattern. The interposer comprises a second metallization layer, and...

Inductor system and method
09/18/14 - 20140264735 - A system and method for providing and manufacturing an inductor is provided. In an embodiment similar masks are reutilized to form differently sized inductors. For example, a two turn inductor and a three turn inductor may share masks for interconnects and coils, while only masks necessary for connections between the...

Semiconductor device and method of forming an inductor on polymer matrix composite substrate
09/18/14 - 20140264736 - A semiconductor device has a first insulating layer formed over a first surface of a polymer matrix composite substrate. A first conductive layer is formed over the first insulating layer. A second insulating layer is formed over the first insulating layer and first conductive layer. A second conductive layer is...

Component-embedded substrate
09/18/14 - 20140264737 - A component-embedded substrate having a multilayer substrate formed by laminating a plurality of thermoplastic sheets in a predetermined direction, an internal component provided in the multilayer substrate, and a surface-mount component mounted on a surface of the multilayer substrate using bumps. The surface-mount component, when viewed in a plan view...

Folded conical inductor
09/18/14 - 20140264738 - A semiconductor inductor structure may include a first spiral structure, located on a first metal layer, having a first outer-spiral electrically conductive track and a first inner-spiral electrically conductive track separated from the first outer-spiral electrically conductive track by a first dielectric material. A second spiral structure, located on a...

Semiconductor device and method of manufacturing thereof
09/11/14 - 20140252540 - A semiconductor device includes a semiconductor substrate having a first main surface in which a recess is formed. Further, the semiconductor device includes an electrical interconnect structure which is arranged at a bottom of the recess. A semiconductor chip is located in the recess. The semiconductor chip includes a plurality...

Systems and methods for power train assemblies
09/11/14 - 20140252541 - A power train assembly is provided. The power train assembly includes a component package including a first transistor having a first gate, a first drain, and a first source, a second transistor having a second gate, a second drain, and a second source, and a thermal pad configured to dissipate...

Structure and method for an inductor with metal dummy features
09/11/14 - 20140252542 - The present disclosure provides a semiconductor device. The semiconductor device includes an inductor formed on a substrate and configured to be operable with a current of a frequency; and dummy metal features configured between the inductor and the substrate, the dummy metal features having a first width less than 2...

High quality factor inductor implemented in wafer level packaging (wlp)
09/04/14 - 20140246753 - Some novel features pertain to a first example provides a semiconductor device that includes a printed circuit board (PCB), asset of solder balls and a die. The PCB includes a first metal layer. The set of solder balls is coupled to the PCB. The die is coupled to the PCB...

Electroless plated material formed directly on metal
08/28/14 - 20140239442 - A method for forming magnetic conductors includes forming a metal structure on a substrate. Plating surfaces are prepared on the metal structure for electroless plating by at least one of: masking surfaces of the metal structure to prevent electroless plating on masked surfaces and/or activating a surface of the metal...

Electroless plated material formed directly on metal
08/28/14 - 20140239443 - A method for forming magnetic conductors includes forming a metal structure on a substrate. Plating surfaces are prepared on the metal structure for electroless plating by at least one of: masking surfaces of the metal structure to prevent electroless plating on masked surfaces and/or activating a surface of the metal...

Process of ultra thick trench etch with multi-slope profile
08/21/14 - 20140231955 - The present disclosure relates to an integrated chip (IC) having an ultra-thick metal layer formed in a metal layer trench having a rounded shape that reduces stress between an inter-level dielectric (ILD) layer and an adjacent metal layer, and a related method of formation. In some embodiments, the IC has...

Integrated circuit inductor
08/21/14 - 20140231956 - An inductive device is formed in a circuit structure that includes alternating conductive and insulating layers. The device includes, in a plurality of the conductive layers, traces forming a respective pair of interleaved loops and at least one interconnect segment in each of the plurality of the conductive layers. In...

Semiconductor device, method of manufacturing the same, and signal transmitting/receiving method using the semiconductor device
08/14/14 - 20140225221 - A semiconductor device includes a semiconductor chip including a main surface, an internal circuit including a plurality of transistors, formed on the main surface, a bonding pad electrically connected to the internal circuit, formed on the main surface, an inductor for communicating an external device in a non-contact manner, formed...

Helical spiral inductor between stacking die
08/07/14 - 20140217546 - The present disclosure relates to a multi-level integrated inductor that provides for a good inductance and Q-factor. In some embodiments, the integrated inductor has a first inductive structure with a first metal layer disposed in a first spiral pattern onto a first IC die and a second inductive structure with...

Semiconductor package with air core inductor (aci) and magnetic core inductor (mci)
08/07/14 - 20140217547 - Semiconductor die packaged with air core inductors (ACIs) and magnetic core inductors (MCIs), or with multiple MCIs, are described. In a first example, a semiconductor package includes a semiconductor die, one or more air core inductors (ACIs) coupled to the semiconductor die, and one or more magnetic core inductors (MCIs)...

Semiconductor device having inductor
07/31/14 - 20140210044 - A semiconductor device including a first insulating layer and a second insulating layer sequentially disposed on a substrate is disclosed. A first conductive line and a second conductive line are disposed in the first insulating layer, and each of the first and second conductive lines has a first end and...

Inductor device and semiconductor device
07/31/14 - 20140210045 - An inductor device includes an insulation layer, an inductor, fixed electrodes, and a movable electrode. The inductor is formed on the insulation layer. The fixed electrodes are provided in positions which do not overlap with the inductor in a planar view. The movable electrode overlaps with the inductor and the...

Semiconductor device having high frequency wiring and dummy metal layer at multilayer wiring structure
07/31/14 - 20140210046 - A semiconductor device includes a semiconductor substrate, and a multilayer wiring layer provided over the semiconductor substrate. The multilayer wiring layer includes an inductor wiring formed in one wiring layer, a plurality of first dummy metals formed in the same layer as the inductor and provided inside the inductor, a...

Semiconductor device
07/31/14 - 20140210047 - A semiconductor device including: first and second semiconductor chips mounted on a base substrate; a third semiconductor chip, which is mounted on the base substrate, and outputs control signals controlling operations of the first and second semiconductor chips; a first transmission transformer, which is mounted on the base substrate, and...

Methods and apparatus for inductors and transformers in packages
07/24/14 - 20140203397 - Methods and apparatus for forming a semiconductor device package with inductors and transformers using a micro-bump layer are disclosed. The micro-bump layer may comprise micro-bumps and micro-bump lines, formed between a top die and a bottom die, or between a die and an interposer. An inductor can be formed by...

Integrated magnetic core inductors with interleaved windings
07/24/14 - 20140203398 - A coupled inductor topology for a thin-film magnetic core power inductor that enables efficient integrated power conversion. Coupled magnetic core inductors with interleaved windings inductors comprise magnetic films and partially or fully interleaved conductors. Methods described herein are suitable for integration into monolithic, chip stacking fabrication or other traditional semiconductor...

Integrated circuits with magnetic core inductors and methods of fabrications thereof
07/24/14 - 20140203399 - In one embodiment, a method of forming a semiconductor device includes forming a first inductor coil within and/or over a substrate. The first inductor coil is formed adjacent a top side of the substrate. First trenches are formed within the substrate adjacent the first inductor coil. The first trenches are...

Electroless plating of cobalt alloys for on chip inductors
07/10/14 - 20140191361 - A method for forming an on-chip magnetic structure includes forming a seed layer over a substrate of a semiconductor chip. The seed layer is patterned to provide a plating location. A cobalt based alloy is electrolessly plated at the plating location to form an inductive structure on the semiconductor chip....

Electroless plating of cobalt alloys for on chip inductors
07/10/14 - 20140191362 - A method for forming an on-chip magnetic structure includes forming a seed layer over a substrate of a semiconductor chip. The seed layer is patterned to provide a plating location. A cobalt based alloy is electrolessly plated at the plating location to form an inductive structure on the semiconductor chip....

External storage device and method of manufacturing external storage device
07/10/14 - 20140191363 - An external storage device including an interconnect substrate having a contact type external terminal, at least one semiconductor chip disposed over a first surface of the interconnect substrate, and a sealing resin layer which seals the at least one semiconductor chip and does not cover the external terminal. The at...

Guard ring design for maintaining signal integrity
07/03/14 - 20140183690 - A structure includes a metal feature, and a passivation layer having a portion overlapping the metal feature. The passivation layer includes a non-low-k dielectric material. A polymer layer is over the passivation layer. A Post-Passivation Interconnect (PPI) extends into the polymer layer to electrically couple to the metal feature. A...

Resonant clocking for three-dimensional stacked devices
07/03/14 - 20140183691 - Resonant clocking for three-dimensional stacked devices. An embodiment of an apparatus includes a stack including integrated circuit dies; and through silicon vias through at least one of the dies, wherein at least a first through silicon via of the through silicon vias includes a capacitive structure or an inductive structure,...

Techniques for fast resonance convergence
07/03/14 - 20140183692 - Some methods provide an electronic design file, which includes an integrated circuit (IC) component that is operably coupled to a package component. The IC component and package component collectively form a resistor inductor capacitor (RLC) resonant circuit. The method also provides a damping component in the electronic design file. This...

Semiconductor device and method of manufacturing the same
06/26/14 - 20140175602 - Characteristics of a semiconductor device are improved. A semiconductor device has a laminated insulating film formed above a lower-layer inductor. This laminated insulating film includes a first polyimide film, and a second polyimide film formed on the first polyimide film and having a second step between the first polyimide film...

Low-profile chip package with modified heat spreader
06/19/14 - 20140167216 - An integrated circuit system includes a heat spreader that is thermally coupled to a semiconductor chip and has a cavity or opening formed in the heat spreader. The cavity or opening is positioned so that capacitors and/or other passive components mounted to the same packaging substrate as the semiconductor chip...

Package with dielectric or anisotropic conductive (acf) buildup layer
06/19/14 - 20140167217 - Embodiments of the present disclosure are directed to techniques and configurations for an integrated circuit (IC) package having one or more dies connected to an integrated circuit substrate by an interface layer. In one embodiment, the interface layer may include an anisotropic portion configured to conduct electrical signals in the...

Circuit configuration and manufacturing processes for vertical transient voltage suppressor (tvs) and emi filter
06/19/14 - 20140167218 - A vertical TVS (VTVS) circuit includes a semiconductor substrate for supporting the VTVS device thereon having a heavily doped layer extending to the bottom of substrate. Deep trenches are provided for isolation between multi-channel VTVS. Trench gates are also provided for increasing the capacitance of VTVS with integrated EMI filter....

Thick on-chip high-performance wiring structures
06/19/14 - 20140167219 - Methods for fabricating a back-end-of-line (BEOL) wiring structure, BEOL wiring structures, and design structures for a BEOL wiring structure. The BEOL wiring may be fabricated by forming a first wire in a dielectric layer and annealing the first wire in an oxygen-free atmosphere. After the first wire is annealed, a...

Through substrate features in semiconductor substrates
06/12/14 - 20140159196 - Through substrate features in semiconductor substrates are described. In one embodiment, the semiconductor device includes a through substrate via disposed in a first region of a semiconductor substrate. A through substrate conductor coil is disposed in a second region of the semiconductor substrate....

Shielding silicon from external rf interference
06/05/14 - 20140151846 - Consistent with an example embodiment, there is an integrated circuit device (IC) built on a substrate of a thickness. The IC comprises an active device region of a shape, the active device region having a topside and an underside. Through silicon vias (TSVs) surround the active device region, the TSVs...

Hybrid transformer structure on semiconductor devices
05/22/14 - 20140138792 - Several novel features pertain to a hybrid transformer formed within a semiconductor die having multiple layers. The hybrid transformer includes a first set of windings positioned on a first layer of the die. The first layer is positioned above a substrate of the die. The first set of windings includes...

Inductor structure with pre-defined current return
05/01/14 - 20140117494 - An inductor structure implemented within a semiconductor integrated circuit includes a coil of conductive material including at least one turn and a current return encompassing the coil. The current return is formed of a plurality of interconnected metal layers of the semiconductor integrated circuit....

Switch circuit package module
05/01/14 - 20140117495 - A switch circuit package module includes a semiconductor switch unit and a capacitor unit. The semiconductor switch unit includes sub micro-switch elements. The capacitor unit is arranged at a periphery of the semiconductor switch unit or stacked on a surface of the semiconductor switch unit, such that impedances of commutation...

Semiconductor device having ground shield structure and fabrication method thereof
05/01/14 - 20140117496 - Semiconductor devices having a ground shield structure and methods for their formation are provided herein. An exemplary semiconductor device can include a substrate, a ground ring, a ground shield, an electronic device, and/or an insulation layer. The ground ring can be disposed over the substrate. The ground shield can be...

Passive component as thermal capacitance and heat sink
04/24/14 - 20140110820 - Representative implementations of devices and techniques provide improved thermal performance of a chip die disposed within a layered printed circuit board (PCB). Passive components may be strategically located on one or more surfaces of the PCB. The passive components may be arranged to conduct heat generated by the chip die...

Folded conical inductor
04/24/14 - 20140110821 - A semiconductor inductor structure may include a first spiral structure, located on a first metal layer, having a first outer-spiral electrically conductive track and a first inner-spiral electrically conductive track separated from the first outer-spiral electrically conductive track by a first dielectric material. A second spiral structure, located on a...

Semiconductor device including magnetically coupled monolithic integrated coils
04/24/14 - 20140110822 - A semiconductor device includes a first coil that is monolithically integrated in a first portion of a semiconductor body and that includes a first winding wrapping around a first core structure. A second coil is monolithically integrated in a second portion of the semiconductor body and includes a second winding...

Rolled-up inductor structure for a radiofrequency integrated circuit (rfic)
04/17/14 - 20140103486 - A rolled-up inductor structure for a radiofrequency integrated circuit (RFIC) comprises a multilayer sheet in a rolled configuration comprising multiple turns about a longitudinal axis. The multilayer sheet comprises a conductive pattern layer on a strain-relieved layer, and the conductive pattern layer comprises at least one conductive strip having a...

Semiconductor device
04/17/14 - 20140103487 - A semiconductor device, includes a first substrate having a main surface and a rear surface opposing to the main surface, a first circuit including a plurality of transistors formed over the main surface, a first insulating film formed over the main surface to cover the first circuit, a first inductor...

Semiconductor package and method for fabricating the same
04/10/14 - 20140097514 - A semiconductor package includes a semiconductor chip, an inductor applied to the semiconductor chip. The inductor includes at least one winding. A space within the at least one winding is filled with a magnetic material....

Compound semiconductor integrated circuit with three-dimensionally formed components
04/10/14 - 20140097515 - A compound semiconductor integrated circuit with three-dimensionally formed components, such as three-dimensionally formed bond pads or inductors, positioned above an electronic device. The dielectric layer inserted between the electronic device and the bond pads or inductors thereon has a thickness between 10 to 30 microns, so that it can effectively...

Vertical meander inductor for small core voltage regulators
03/27/14 - 20140084414 - Vertical meander inductors for small core voltage regulators and approaches to fabricating vertical meander inductors for small core voltage regulators are described. For example, a semiconductor die includes a substrate. An integrated circuit is disposed on an active surface of the substrate. An inductor is coupled to the integrated circuit....

Semiconductor device and method of forming integrated passive device over semiconductor die with conductive bridge and fan-out redistribution layer
03/27/14 - 20140084415 - A semiconductor device has a first semiconductor die. A first inductor is formed over the first semiconductor die. A second inductor is formed over the first inductor and aligned with the first inductor. An insulating layer is formed over the first semiconductor die and the first and second inductors. A...

Semiconductor devices with impedance matching-circuits, and methods of manufacture thereof
03/13/14 - 20140070365 - Embodiments of semiconductor devices (e.g., RF devices) include a substrate, an isolation structure, an active device, a lead, and a circuit. The isolation structure is coupled to the substrate, and includes an opening. An active device area is defined by a portion of the substrate surface that is exposed through...

Plated lamination structures for integrated magnetic devices
03/06/14 - 20140061853 - Semiconductor integrated magnetic devices such as inductors, transformers, etc., having laminated magnetic-insulator stack structures are provided, wherein the laminated magnetic-insulator stack structures are formed using electroplating techniques. For example, an integrated laminated magnetic device includes a multilayer stack structure having alternating magnetic and insulating layers formed on a substrate, wherein...

Small size and fully integrated power converter with magnetics on chip
03/06/14 - 20140061854 - An integrated circuit has a semiconductor die provided in a first IC layer and an inductor fabricated on a second IC layer. The inductor may have a winding and a magnetic core, which are oriented to conduct magnetic flux in a direction parallel to a surface of a semiconductor die....