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Active Solid-state Devices (e.g., Transistors, Solid-state Diodes) > Integrated Circuit Structure With Electrically Isolated Components > Passive Components In Ics > Including Inductive Element Including Inductive ElementIncluding Inductive Element patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.01/31/08 - 20080023791 - High performance integrated inductor Some embodiments of the present invention include providing high performance integrated inductors. ... 01/17/08 - 20080012091 - Vertical lc tank device An LC tack structure. The structure, including a set of wiring levels on top of a semiconductor substrate, the wiring levels stacked on top of each other from a lowest wiring level nearest the substrate to a highest wiring level furthest from the substrate; an inductor in the highest wiring ... 11/29/07 - 20070273004 - Like integrated circuit devices with different depth The invention forms integrated circuit devices of similar structure and dissimilar depth, such as interconnects and inductors, simultaneously. The invention deposits a conformal polymer over an area on a substrate with vias and an area without vias. Simultaneously, cavities are formed in the areas with and without vias. The depth ... 10/25/07 - 20070246798 - Inductor energy loss reduction techniques An inductive device including an inductor coil located over a substrate, at least one electrically insulating layer interposing the inductor coil and the substrate, and a plurality of current interrupters each extending into the substrate, wherein a first aggregate outer boundary of the plurality of current interrupters substantially encompasses a ... 10/04/07 - 20070228515 - Semiconductor integrated circuit with spiral inductors A spiral inductor, which is formed of a spiral wiring pattern, is formed in an inductor formation region which is assigned within an IC chip. A plurality of dummy wiring lines are formed according to a given design rule on an inside region surrounded by the spiral inductor within the ... 10/04/07 - 20070228514 - Electronic device The electronic device comprises a network of at least one thin-film capacitor and at least one inductor on a first side of a substrate of a semiconductor material. The substrate has a resistivity sufficiently high to limit electrical losses of the inductor and being provided with an electrically insulating surface ... 08/09/07 - 20070181970 - High performance system-on-chip inductor using post passivation process A system and method for forming post passivation inductors, and related structures, is described. High quality electrical components, such as inductors and transformers, are formed on a layer of passivation, or on a thick layer of polymer over a passivation layer. ... 07/12/07 - 20070158782 - Inductor device for multiband radio frequency operation The inductance of a monolithic planar inductor is distributed into smaller inductor portions. The smaller inductor portions are provided in a cascode configuration in a manner that causes inductor to function as a differential inductor device. The node between the immediate inductor portions is a common-mode point of the inductor ... 06/21/07 - 20070138594 - Inductor integrated chip and fabrication method thereof An inductor integrated chip and fabrication method thereof is provided. The inductor integrated chip includes a wafer; an inductor bonded on a surface of the wafer; a circuit element formed on the surface of the wafer and coupled to a first end of the inductor; a packaging wafer connected to ... 05/17/07 - 20070108551 - High performance system-on-chip inductor using post passivation process A system and method for forming post passivation inductors, and related structures, is described. High quality electrical components, such as inductors and transformers, are formed on a layer of passivation, or on a thick layer of polymer over a passivation layer. ... 03/29/07 - 20070069333 - Integrated inductor structure and method of fabrication An inductor structure comprised of a magnetic section and a single turn solenoid The single turn solenoid to contain within a portion of the magnetic section and circumscribed by the magnetic section. ... 03/01/07 - 20070045773 - Integrated electronic device and method of making the same An integrated electronic device includes a substrate, passive components, pads for external connection, and three-dimensional wiring. The passive components includes a multi-stage coil inductor provided on the substrate. The multi-stage coil inductor has a plurality of coils disposed in several layers. Mutually adjacent coil wires are spaced-apart from each other. ... 02/22/07 - 20070040238 - Coil structure, method for manufacturing the same and semiconductor package A chip coil has a chip format including a rectangle substrate of an insulating resin material and a coil portion having a solenoid structure a part of which is embedded within the substrate and in which adjacent coils are insulated from each other by the substrate. The resin material contains ... 02/22/07 - 20070040237 - High current semiconductor device system having low resistance and inductance A high current semiconductor device (for example QFN for 30 to 70 A) with low resistance and low inductance is encapsulated by molding compound (401, height 402 about 0.9 mm) so that the second lead surfaces 110b remain unencapsulated. A copper heat slug (404) may be attached to chip surface ... 02/01/07 - 20070023862 - Semiconductor device and oscillator A semiconductor device includes a semiconductor substrate including an active element or an integrated circuit and a plurality of connection electrodes to be electrically connected to the integrated circuit; a first resin layer formed on a surface of the semiconductor substrate on which the connection electrodes are formed in such ... 01/25/07 - 20070018282 - Semiconductor device and fabrication method thereof A semiconductor device includes a semiconductor substrate having a plurality of conductive layers. The device further includes buried contacts and buried vias, which connect the interconnect layers respectively. At least one of the contacts and vias is dummy. ... 01/25/07 - 20070018281 - Packaging chip having inductor therein A packaging chip having inductors therein. The packaging chip includes a substrate for mounting a circuit element therein, at least one port formed on a surface of the substrate, a sealing portion electrically connected on the substrate to the circuit element and the at least one port, respectively, and a ... 01/11/07 - 20070007623 - Method to fabricate horizontal air columns underneath metal inductor A new method is provided for creating an inductor on the surface of a silicon substrate. The invention provides overlying layers of oxide fins beneath a metal inductor. The oxide fins provide the stability support for the overlying metal inductor while also allowing horizontal air columns to simultaneously exist underneath ... 01/11/07 - 20070007622 - Method of manufacturing a passive integrated matching network for power amplifiers An impedance matching network is integrated on a first die and coupled to a second die, with the first and second dies mounted on a conductive back plate. The impedance matching network comprises a first inductor bridging between the first and second dies, a second inductor coupled to the first ... 11/30/06 - 20060267138 - Semiconductor device An object is to provide a semiconductor device having an antenna structure which is advantageous for miniaturization, without changing the number of steps and communication distance. One feature to achieve the above object is a semiconductor device including a substrate, a tag portion including a thin film element formed over ... 11/23/06 - 20060261438 - Capacitive techniques to reduce noise in high speed interconnections Structures, in various embodiments, are provided using capacitive techniques to reduce noise in high speed interconnections, such as in CMOS integrated circuits. In an embodiment, a transmission line is disposed on a first layer of insulating material, where the first layer of insulating has a thickness equal to or less ... 11/09/06 - 20060249810 - Inductor with plural coil layers An inductor with plural coil layers includes a base wafer; a plurality of insulating layers sequentially laminated on one surface of the base wafer; and a plurality of coil layers built in the plurality of insulating layers, respectively, and having different magnetic flux passage areas. ... 10/19/06 - 20060231923 - Inductor for semiconductor integrated circuit and method of fabricating the same Disclosed are an inductor for a semiconductor integrated circuit, which provides a wider cross-sectional area, significantly reduces the resistance to improve the Q value and has a highly uniform film thickness, and a method of fabricating the inductor. A spiral inductor is formed on a topmost interconnection layer of a ... 10/12/06 - 20060226511 - Miniature inductor suitable for integrated circuits A miniature inductor suitable for integrated circuits comprises a semiconductor substrate having a coplanar strip line and a plurality of metal-insulator-metal (MIM) capacitors, wherein the plurality of MIM capacitors are connected between the transmission lines of the coplanar strip line in parallel, and the coplanar strip line connected with the ... 10/12/06 - 20060226510 - Integrated circuit transformer devices for on-chip millimeter-wave applications Methods are provided for building integrated circuit transformer devices having compact and optimized architectures for use in MMW (millimeter-wave) applications. The integrated circuit transformer devices have universal and scalable architectures that can be used as templates or building blocks for constructing various types of on-chip devices for millimeter-wave applications. ... 09/07/06 - 20060197182 - High frequency integrated circuits The specification describes a silicon-on-silicon interconnection arrangement to implement high performance RF impedance matching using off-chip passive components. The RF sections of the system are dis-integrated into separate RF functional chips, and the functional chips are flip-chip mounted on a high resistivity silicon intermediate interconnect substrate (SIIS). The passive devices ... 08/31/06 - 20060192267 - Inductor fabricated with dry film resist and cavity and method of fabricating the inductor An inductor fabricated with a dry film resist and a cavity and a method of fabricating the inductor. The cavity can be formed in a substrate to minimize a parasitic capacitance generated by structures of upper electrodes, an insulating layer, and a lower electrode and minimize energy loss caused by ... 08/10/06 - 20060175680 - Balun A balun in which the phase shift may be reduced significantly is disclosed. The balun has three lines, i.e. a first line b, a second line a and a third line c, arranged in parallel with the ground surface. The second line a and the third line c are arranged ... 08/03/06 - 20060170072 - Circuit board and semiconductor device A semiconductor device, includes: a semiconductor substrate; a multilayered interconnect structure formed on the semiconductor substrate; a terminal for flip-chip packaging arranged on the surface of the multilayered interconnect structure; and a spiral inductor formed to enclose the terminal for flip-chip packaging, in a plan view, which is not electrically ... 08/03/06 - 20060170071 - Circuit substrate structure and circuit apparatus A first wiring layer in a circuit substrate structure is provided with a first inductor and a second inductor. A dielectric layer is provided with a first via and a second via electrically connected to the first inductor and the second inductor, respectively. A second wiring layer is provided with: ... 07/27/06 - 20060163695 - Inductors for integrated circuits An inductor for an integrated circuit or integrated circuit package comprises a three-dimensional structure. In one embodiment the inductor is arranged on an integrated circuit substrate in at least two rows, each row comprising upper segments and lower segments, with the upper segments being longer than the lower segments. The ... 07/27/06 - 20060163694 - Semiconductor device having spiral-shaped inductor An element isolation region is formed in a surface region of a semiconductor substrate. A spiral-shaped inductor is formed above the element isolation region. A conductive region to which a constant potential is applied is formed inside the inner circumference of the inductor. ... 07/27/06 - 20060163693 - Chip-type noise filter, manufacturing method thereof, and semiconductor package In a chip-type noise filter having a signal line of a conductor and a magnetic body disposed so as to adhere to the signal line, the magnetic body is a sintered body containing mainly Fe2O3 and containing NiO in the rest. This enables to effectively absorb and damp noise of ... 07/27/06 - 20060163692 - Inductive and capacitvie elements for semiconductor techinologies with minimum pattern density requirements The present invention provides a semiconductor device comprising a plurality of layers, the semiconductor device comprising:—a substrate having a first major surface,—an inductive element fabricated on the first major surface of the substrate, the inductive element comprising at least one conductive line, and—a plurality of tilling structures in at least ... 07/13/06 - 20060151851 - On-pad broadband matching network A chip is provided in which an on-chip matching network has a first terminal conductively connected to a bond pad of the chip and a second terminal conductively connected to a common node on the chip. A wiring trace connects the on-chip matching network to a circuit of the chip. ... 06/15/06 - 20060125047 - Interposer including at least one passive element at least partially defined by a recess formed therein, system including same, and wafer-scale interposer An interposer for assembly with a semiconductor die and methods of manufacture are disclosed. The interposer may include at least one passive element at least partially defined by at least one recess formed in at least one dielectric layer of the interposer. The at least one recess may have dimensions ... 06/15/06 - 20060125046 - Integrated inductor and method of fabricating the same Provided are an integrated inductor and a method of manufacturing the same. The integrated inductor includes: a silicon on insulator (SOI) wafer on which a substrate, an oxide layer, and an active layer are stacked; a first metal interconnection formed in a predetermined region on the SOI wafer; a second ... 06/08/06 - 20060118906 - High power radio frequency integrated circuit capable of impeding parasitic current loss A high power RF IC capable of impeding parasitic current loss and method of manufacturing the same. First a step of semiconductor front-side processing for the high power RF components that includes inductive components is performed. Afterwards, the backside of semiconductor base is polished to a certain thickness, and then ... 06/08/06 - 20060118905 - Electronic part and manufacturing method thereof An electronic component includes conductive pattern (2) on insulating substrate (1), a metal film formed by a plating method on a surface of conductive pattern (2), and metal oxide layer (3) formed by oxidizing the metal film on the surface of conductive pattern (2). This structure allows forming a thin ... 05/25/06 - 20060108663 - Surface mount inductor with integrated componentry Disclosed are inductor systems with reduced volume for use in larger electronic circuits. Embodiments of the invention are disclosed for a surface mount inductor system that includes an inductor having a niche for receiving an IC component interposed between the inductor and PCB. Preferably, the assembly is encapsulated to form ... 05/11/06 - 20060097346 - Structure for high quality factor inductor operation A structure for high quality factor inductor operation formed on a semiconductor chip is disclosed. The structure comprises a plurality of pillars displaced from the semiconductor chip for forming an inductor. The plurality of pillar is arranged in an electrically inductive formation and at least one of the plurality of ... 04/06/06 - 20060071296 - Rf passive circuit and rf amplifier with via-holes An input matching parallel inductor 114 which utilizes a spiral inductor, and an input matching parallel capacitor 115 which utilizes an MIM capacitor, both being constituting elements of an input matching circuit portion 125, form an input matching parallel capacitor 115 inside an input matching circuit via-hole 121 being formed ... 03/30/06 - 20060065948 - Inductor energy loss reduction techniques An inductive device including an inductor coil located over a substrate, at least one electrically insulating layer interposing the inductor coil and the substrate, and a plurality of current interrupters each extending into the substrate, wherein a first aggregate outer boundary of the plurality of current interrupters substantially encompasses a ... 03/30/06 - 20060065947 - Reverse-biased p/n wells isolating a cmos inductor from the substrate A double well structure beneath an inductor to isolate it from the substrate. Contacts are provided for the deeper well and the substrate, to reverse bias the junction between the substrate and the deep well. In one embodiment, for a P-substrate, the deep well is an N-well, and the other ... 03/23/06 - 20060060939 - Semiconductor apparatus having a built-in electric coil and a method of making the semiconductor apparatus A semiconductor apparatus includes lower conductive film strips, an inter-layer insulating layer, implanted conductive members, and upper conductive film strips. The lower conductive film strips are formed in a pattern closely adjacent in a line width orientation, electrically separated from each other. The inter-layer insulating layer is formed the lower ... 03/09/06 - 20060049483 - Post passivation interconnection process and structures A system and method for forming post passivation metal structures is described. Metal interconnections and high quality electrical components, such as inductors, transformers, capacitors, or resistors are formed on a layer of passivation, or on a thick layer of polymer over a passivation layer. ... 03/09/06 - 20060049482 - System and method for providing a low frequency filter pole Systems are provided for producing a low frequency filter pole. A first bond pad is coupled to a power source. A second bond pad is inductively connected to the first bond pad by a first bond wire. A capacitor is connected to the second bond pad. A third bond pad ... 03/09/06 - 20060049481 - Planar inductive component and an integrated circuit comprising a planar inductive component The invention relates to a planar inductive component arranged over a substrate (103). The substrate in a first plane, a patterned ground shield (102), for shielding the winding (101) from the substrate (103). The winding (101) is at least substantially symmetrical plane. The patterned ground shield (102) comprises a plurality ... 02/23/06 - 20060038257 - Semiconductor device which includes an inductor therein and a manufacturing method thereof A semiconductor device includes a semiconductor substrate having a principal surface in which a semiconductor integrated circuit is included and a spiral inductor disposed over the principal surface of the semiconductor substrate so as to be coupled to the semiconductor integrated circuit. A region occupied by the spiral inductor is ... 01/19/06 - 20060012007 - Open pattern inductor The invention includes a stacked open pattern inductor fabricated above a semiconductor substrate. The stacked open pattern inductor includes a plurality of parallel open conducting patterns embedded in a magnetic oxide or in an insulator and a magnetic material. Embedding the stacked open pattern inductor in a magnetic oxide or ... 01/05/06 - 20060001124 - Low-loss substrate for high quality components Methods and apparatus providing high quality factor (Q) components on low loss substrates. A substrate is fabricated having a plurality of substrate support elements. A bridging layer is formed on the substrate that is supported by the support elements. A component is formed on the bridging layer. CMOS-compatible processing of ... 12/29/05 - 20050285224 - Semiconductor device and manufacturing method thereof A fuse element has a first region, a second region and a third region. The first region is a portion for isolating circuitry. The second region and the third region are respectively connected to both ends of the first region and have a wider pattern width than that of the ... 12/15/05 - 20050275061 - Semiconductor device having inductor A semiconductor device includes a first chip having an inductor, a second chip stacked on the first chip and having a conductive layer, and a first magnetic shielding layer formed between the first and second chips. ... 12/01/05 - 20050263847 - Semiconductor device and method for fabricating the same In a semiconductor device having a WCSP type construction package, to increase inductance without increasing further an area conventionally occupied by a coil. A pseudo-post part 27 comprising a magnetic body is extended in a direction perpendicular to a main surface 12a of a semiconductor chip 12, on a second ... 12/01/05 - 20050263846 - Circuit device In a manufacturing method of a hybrid integrated circuit device 10 according to the present invention, a first dummy pattern D1 is provided on a first wiring layer 18A. Furthermore, a second dummy pattern D2 is provided on a second wiring layer 18B. The first dummy pattern D1 and the ... 11/24/05 - 20050258509 - Substrate, semiconductor device, and substrate fabricating method A substrate is disclosed that includes an inductor that is realized by first wiring, and resin including high magnetic permeability filler material that covers the first wiring. ... 11/24/05 - 20050258508 - Semiconductor device with inductors A semiconductor device includes a semiconductor substrate, and a multi-layered wiring arrangement formed on the semiconductor substrate and having insulating interlayers stacked in order thereon. A first inductor is formed on one of the insulating layers of the multi-layered wiring arrangement. A second inductor has a smaller size than the ... 11/24/05 - 20050258507 - Q-factor with electrically controllable resistivity of silicon substrate layer A microelectronic device including, in one embodiment, a plurality of active devices located at least partially in a substrate, at least one dielectric layer located over the plurality of active devices, and an inductor located over the dielectric layer. At least one of the plurality of active devices is located ... 11/10/05 - 20050247999 - Semiconductor device A semiconductor device includes: an inductor (1) provided with a conductor interconnection formed spirally on a semiconductor substrate (10); and a shield (6a) that is provided with a continuous conductor interconnection provided along the outer periphery of the spiral pattern of the inductor (1) while opening a portion of the ... 11/10/05 - 20050247998 - Three-dimensional structural body composed of silicon fine wire, its manufacturing method, and device using same A three-dimensional structure composed of highly-reliable silicon ultrafine wires, a method for producing the three-dimensional structure, and a device including the same are provided. The three-dimensional structure composed of silicon fine wires includes wires (2) on the order of nanometers to micrometers formed by wet etching utilizing the crystallinity of ... 10/27/05 - 20050236689 - High-frequency amplification device A high-frequency amplification device includes a high-frequency amplifier including input and output sections, a first capacitor including first and second electrodes, and a first insulation film interposed therebetween. The first electrode is connected to the output section via a first inductor, and the second electrode is grounded. The amplification device ... 10/20/05 - 20050230783 - High performance system-on-chip discrete components using post passivation process A system and method for forming post passivation discrete components, is described. High quality discrete components are formed on a layer of passivation, or on a thick layer of polymer over a passivation layer. ... 10/13/05 - 20050224911 - Semiconductor integrated circuit The invention provides a semiconductor integrated circuit of which malfunction caused by noise from outside is reduced. The semiconductor integrated circuit has a power supply terminal, a ground terminal, internal circuits supplied with a power supply potential and a ground potential from the power supply terminal and the ground terminal, ... 10/06/05 - 20050218477 - Semiconductor device and method for manufacturing the same There is provided a semiconductor device excellent in reliability. The semiconductor device is comprised of a semiconductor substrate, an insulating portion having a multilayer insulating film composed of an etch stopper film, an insulating film, an etch stopper film, an insulating film, an etch stopper film and an insulating film ... 08/25/05 - 20050184358 - High performance system-on-chip using post passivation process The present invention extends the above referenced continuation-in-part application by in addition creating high quality electrical components, such as inductors, capacitors or resistors, on a layer of passivation or on the surface of a thick layer of polymer. In addition, the process of the invention provides a method for mounting ... 08/25/05 - 20050184357 - Semiconductor element, manufacturing method thereof, and high frequency integrated circuit using the semiconductor element A semiconductor element comprises a capacitance variable section and an inductor section. In the capacitance variable section, a variable capacitance diode equipped with first and second control electrodes is provided on an insulative substrate. The inductor section is formed on the capacitance variable section formed with the variable capacitance diode. ... 08/04/05 - 20050167780 - High q factor integrated circuit inductor An inductor and a method of forming and the inductor, the method including: (a) providing a semiconductor substrate; (b) forming a dielectric layer on a top surface of the substrate; (c) forming a lower trench in the dielectric layer; (d) forming a resist layer on a top surface of the ... 06/30/05 - 20050139955 - Radio frequency integrated circuit, and method for manufacturing the same The present invention discloses a radio frequency integrated circuit and a method for manufacturing the same. The radio frequency integrated circuit is manufactured by forming an inductor and a passivation layer on an insulator substrate of a first substrate, forming an element layer having a multi-layer wiring structure on a ... 06/30/05 - 20050139954 - Radio frequency semiconductor device and method of manufacturing the same The present invention discloses a high frequency device including a first wafer providing an inductor having via contact plugs passing through the first wafer and a second wafer bonded to the first wafer, wherein the second wafer provides logic devices and inductor connection lines on an upper side thereof. ... 06/02/05 - 20050116317 - Inductor for a system-on-a-chip and method for manufacturing the same An inductor for a system-on-a-chip and a method for manufacturing the inductor are disclosed. The inductor comprises a conductive line formed by connecting a plurality of conductive patterns grown from a seed layer formed on a lower wiring. The method comprises using an electrolytic plating process or an electroless plating ... ### FreshPatents.com Support |