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Active Solid-state Devices (e.g., Transistors, Solid-state Diodes) > Responsive To Non-electrical Signal (e.g., Chemical, Stress, Light, Or Magnetic Field Sensors) > Physical Deformation > Acoustic Wave

Acoustic Wave

Acoustic Wave patent applications listed include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.

07/17/14 - 20140197501 - Mems device with polymer layer, system of a mems device with a polymer layer, method of making a mems device with a polymer layer
A MEMS device, a method of making a MEMS device and a system of a MEMS device are shown. In one embodiment, a MEMS device includes a first polymer layer, a MEMS substrate disposed on the first polymer layer and a MEMS structure supported by the MEMS substrate. The MEMS...

07/17/14 - 20140197502 - Comb mems device and method of making a comb mems device
A MEMS device and a method to manufacture a MEMS device are disclosed. An embodiment includes forming trenches in a first main surface of a substrate, forming conductive fingers by forming a conductive material in the trenches and forming an opening from a second main surface of the substrate thereby...

07/17/14 - 20140197503 - Sensor package
A sensor package is disclosed. One embodiment provides a sensor device having a carrier, a semiconductor sensor mounted on the carrier and an active surface. Contact elements are electrically connecting the carrier with the semiconductor sensor. A protective layer made of an inorganic material covers at least the active surface...

07/10/14 - 20140191343 - Sound transducer and microphone using same
Provided is an acoustic transducer including: a semiconductor substrate; a vibrating membrane, provided above the semiconductor substrate, including a vibrating electrode; and a fixed membrane, provided above the semiconductor substrate, including a fixed electrode, the acoustic transducer detecting a sound wave according to changes in capacitances between the vibrating electrode...

07/10/14 - 20140191344 - Mems process and device
A method of fabricating a micro-electrical-mechanical system (MEMS) transducer comprises the steps of forming a membrane on a substrate, and forming a back-volume in the substrate. The step of forming a back-volume in the substrate comprises the steps of forming a first back-volume portion and a second back-volume portion, the...

07/03/14 - 20140183671 - Semiconductor device and microphone
A package is formed by vertically stacking a cover and a substrate. A microphone chip is mounted at the top surface of a concave portion provided to the cover, and a circuit element is mounted on the upper surface of the substrate. The microphone chip is connected to a pad...

05/29/14 - 20140145275 - Ultrasonic transducer and method of manufacturing the same
An ultrasonic transducer and a method of manufacturing the same are disclosed. The ultrasonic transducer includes a conductive substrate, a projection which is disposed on the conductive substrate and which forms a cavity therein, a via hole which penetrates the projection and conductive substrate, a first electrode which includes a...

05/29/14 - 20140145276 - Mems microphone and method for manufacture
An improved method for manufacturing an MEMS microphone with a double fixed electrode is specified which results in a microphone which likewise has improved properties....

05/08/14 - 20140124878 - Mapping density and temperature of a chip, in situ
A method and system to map density and temperature of a chip, in situ, is disclosed. The method includes measuring a propagation time that a mechanical propagation wave travels along at least one predefined path in a substrate. The method further includes calculating an average substrate density and temperature along...

05/08/14 - 20140124879 - Component and method for producing same
A packaging concept for MEMS components having at least one diaphragm structure formed in the front side of the component is provided, according to which the MEMS component is mounted on a support which at least laterally delimits a cavity adjoining the diaphragm structure. In addition, at least one electrical...

05/01/14 - 20140117473 - Packages and methods for packaging
A three-dimensional printing technique can be used to form a microphone package. The microphone package can include a housing having a first side and a second side opposite the first side. A first electrical lead can be formed on an outer surface on the first side of the housing. A...

04/17/14 - 20140103464 - Microphone system with integrated passive device die
A microphone system has a package forming an interior chamber, and a MEMS microphone secured within the interior chamber. The package forms an aperture for permitting acoustic access to the interior of the chamber and thus, the MEMS microphone. The system also has two dies; namely, the system has a...

04/17/14 - 20140103465 - Surface acoustic wave (saw) device package and method for fabricating same
A surface acoustic wave (SAW) device package and method for packaging a SAW device provide a surface excited device having a small footprint, low cost and fabricated according to a unique manufacturing process. A substrate including a SAW active area on a first side is bonded to another similar sized...

04/03/14 - 20140091406 - Mems microphone system for harsh environments
A MEMS microphone system suited for harsh environments. The system uses an integrated circuit package. A first, solid metal lid covers one face of a ceramic package base that includes a cavity, forming an acoustic chamber. The base includes an aperture through the opposing face of the base for receiving...

04/03/14 - 20140091407 - Integrated semiconductor devices with amorphous silicon beam, methods of manufacture and design structure
Bulk acoustic wave filters and/or bulk acoustic resonators integrated with CMOS processes, methods of manufacture and design structures are disclosed. The method includes forming at least one beam comprising amorphous silicon material and providing an insulator material over and adjacent to the amorphous silicon beam. The method further includes forming...

04/03/14 - 20140091408 - Sensor module and semiconductor chip
A sensor module and semiconductor chip. One embodiment provides a carrier. A semiconductor chip includes a first recess and a second recess and a main surface of the semiconductor chip. The semiconductor chip is mounted to the carrier such that the first recess forms a first cavity with the carrier...

03/27/14 - 20140084394 - Micro electro mechanical system (mems) microphone and fabrication method thereof
Provided is a structure for improving performance of a micro electro mechanical system (MEMS) microphone by preventing deformation from occurring due to a residual stress and a package stress of a membrane and by decreasing membrane rigidity. A MEMS microphone according to the present disclosure includes a backplate formed on...

03/27/14 - 20140084395 - Mems microphone
Mechanical resonating structures, as well as related devices and methods of manufacture. The mechanical resonating structures can be microphones, each including a diaphragm and a piezoelectric stack. The diaphragm can have one or more openings formed therethrough to enable the determination of an acoustic pressure being applied to the diaphragm...

03/20/14 - 20140077317 - Microelectromechanical system (mems) device and fabrication method thereof
A MEMS device includes a silicon substrate and a structural dielectric layer. The silicon substrate has a cavity. The structural dielectric layer is disposed on the silicon substrate. The structural dielectric layer has a space above the cavity of the silicon substrate and holds a plurality of structure elements within...

03/06/14 - 20140061825 - Micro electro mechanical system(mems) acoustic sensor and fabrication method thereof
Provided are a micro electro mechanical system (MEMS) acoustic sensor for removing a nonlinear component that occurs due to a vertical motion of a lower electrode when external sound pressure is received by fixing the lower electrode to a substrate using a fixing pin, and a fabrication method thereof. The...

03/06/14 - 20140061826 - Ultrasonic transducer and method of manufacturing the same
An ultrasonic transducer and a method of manufacturing the same are disclosed. The ultrasonic transducer includes a first electrode layer which is disposed to cover a conductive substrate and an inner wall and a top of a via hole penetrating a membrane and has a top surface at a same...

02/13/14 - 20140042565 - Apparatus comprising and a method for manufacturing an embedded mems device
A system and a method for forming a packaged MEMS device are disclosed. In one embodiment a packaged MEMS device includes a MEMS device having a first main surface with a first area along a first direction and a second direction, a membrane disposed on the first main surface of...

01/30/14 - 20140027867 - Packages and methods for 3d integration
Packages and methods for 3D integration are disclosed. In various embodiments, a first integrated device die having a hole is attached to a package substrate. A second integrated device die can be stacked on top of the first integrated device die. At least a portion of the second integrated device...

01/16/14 - 20140015070 - Component having a micromechanical microphone pattern
A microphone component has a micromechanical microphone pattern which is implemented in a layer construction on a semiconductor substrate and includes (i) an acoustically active diaphragm which at least partially spans a sound opening on the backside of the substrate, (ii) at least one movable electrode of a microphone capacitor...

01/16/14 - 20140015071 - Encapsulated micro-electro-mechanical device, in particular a mems acoustic transducer
An encapsulated micro-electro-mechanical device, wherein a MEMS chip is encapsulated by a package formed by a first, a second, and a third substrates that are bonded together. The first substrate has a main surface bearing the MEMS chip, the second substrate is bonded to the first substrate and defines a...

01/09/14 - 20140008740 - Mems microphone and method for packaging the same
The present invention relates to a MEMS microphone and a method of manufacturing the same, the MEMS microphone comprising: a monolithic silicon chip incorporating an acoustic sensing element and one or more conditioning CMOS integrated circuits; a silicon-based carrier chip having an acoustic cavity; a substrate for surface mounting the...

01/02/14 - 20140001580 - Transducer with enlarged back volume
A packaged integrated device includes a package substrate having a first surface and a second surface opposite the first surface, and the package substrate has a hole therethrough. The integrated device package also includes a first lid mounted on the first surface of the package substrate to define a first...

01/02/14 - 20140001581 - Mems microphone and forming method therefor
A micro-electro-mechanical system (MEMS) microphone may include a sensitive diaphragm and a fixed electrode corresponding to the sensitive diaphragm; at least one sensitive diaphragm support located on the surface of the sensitive diaphragm corresponding to the fixed electrode; and a sensitive diaphragm support arm coupled to the sensitive diaphragm support....

12/19/13 - 20130334625 - Method for fabricating patterned polyimide film and applications thereof
A method for fabricating a patterned polyimide film, wherein the method comprises steps as follows: Firstly, a polyimide film is provided on a substrate. A wet planarization process is then performed to remove a portion of the polyimide film. Subsequently the planarized polyimide film is patterned....

12/19/13 - 20130334626 - Hybrid integrated component and method for the manufacture thereof
A hybrid integrated component includes: at least one ASIC element having integrated circuit elements and a back-end stack; an MEMS element having a micromechanical structure, which extends over the entire thickness of the MEMS substrate; and a cap wafer. The hybrid integrated component is provided with an additional micromechanical function....

12/19/13 - 20130334627 - Semiconductor integrated device assembly and related manufacturing process
Described herein is a semiconductor integrated device assembly, which envisages: a package defining an internal space; a first die including semiconductor material; and a second die, distinct from the first die, also including semiconductor material; the first die and the second die are coupled to an inner surface of the...

12/05/13 - 20130320465 - Thin mems microphone module
A MEMS microphone module includes a first circuit board and a second circuit board attached to the first circuit board. A MEMS chip and an ASIC chip are respectively received in one of two concavities of the first circuit board. A first ground layer of the first circuit board and...

11/28/13 - 20130313661 - Method for processing a wafer at unmasked areas and previously masked areas to reduce a wafer thickness
A method for processing a wafer having microelectromechanical system structures at the first main surface includes applying a masking material at the second main surface and structuring the masking material to obtain a plurality of masked areas and a plurality of unmasked areas at the second main surface. The method...

11/28/13 - 20130313662 - Mems microphone device and method for making same
The present invention discloses a MEMS microphone device and its manufacturing method. The MEMS microphone device includes: a substrate including a first cavity; a MEMS device region above the substrate, wherein the MEMS device region includes a metal layer, a via layer, an insulating material region and a second cavity;...

11/28/13 - 20130313663 - Capacitive electromechanical transducer
Provided is a capacitive electromechanical transducer manufactured by fusion bonding, which is capable of enhancing the performance by reducing fluctuations in initial deformation among diaphragms caused at positions having difference boundary conditions such as the bonding area. The capacitive electromechanical transducer includes a device, the device including at least one...

10/31/13 - 20130285173 - Acoustic transducers with perforated membranes
A MEMS device, such as a microphone, uses a perforated plate. The plate comprises an array of holes across the plate area. The plate has an area formed as a grid of polygonal cells, wherein each cell comprises a line of material following a path around the polygon thereby defining...

10/31/13 - 20130285174 - Ultrasound probe
Disclosed is an ultrasonic probe comprising: CMUT cells (13) that mutually convert ultrasonic waves and electrical signals; a semiconductor substrate (15) that has a plurality of the CMUT cells (13) formed on the surface thereof; an acoustic lens (3) that is provided on the front face side of the CMUT...

10/24/13 - 20130277776 - Packaged mems device and method of calibrating a packaged mems device
A packaged MEMS device and a method of calibrating a packaged MEMS device are disclosed. In one embodiment a packaged MEMS device comprises a carrier, a MEMS device disposed on the substrate, a signal processing device disposed on the carrier, a validation circuit disposed on the carrier; and an encapsulation...

10/10/13 - 20130264663 - Mems device and method of making a mems device
A MEMS device and a method of making a MEMS device are disclosed. In one embodiment a semiconductor device comprises a substrate, a moveable electrode and a counter electrode, wherein the moveable electrode and the counter electrode are mechanically connected to the substrate. The movable electrode is configured to stiffen...

10/03/13 - 20130256815 - Cavity package design
A semiconductor device. The device including a substrate having electrical traces, at least one of a MEMS die and a semiconductor chip mounted on the substrate, and a spacer. The spacer has a first end connected to the substrate and includes electrical interconnects coupled to the electrical traces. The at...

10/03/13 - 20130256816 - Mems process and device
A method of fabricating a micro-electrical-mechanical system (MEMS) transducer comprises the steps of forming a membrane on a substrate, and forming a back-volume in the substrate. The step of forming a back-volume in the substrate comprises the steps of forming a first back-volume portion and a second back-volume portion, the...

10/03/13 - 20130256817 - Element array, electromechanical conversion device, and process for producing the same
An element array comprises a plurality of elements having a first electrode and a second electrode with a gap therebetween; the first electrode is separated for each of the elements by grooves, an insulating connection substrate is bonded to the first electrode, and wirings are provided from the respective first...

09/26/13 - 20130249023 - High frequency cmut
A high-frequency capacitive micromachined ultrasonic transducer (CMUT) has a silicon membrane and an overlying metal silicide layer that together form a conductive structure which can vibrate over a cavity. The CMUT also has a metal structure that touches a group of conductive structures. The metal structure has an opening that...

08/29/13 - 20130221455 - Methods for embedding controlled-cavity mems package in integration board
An embedded micro-electro-mechanical system (MEMS) (100) comprising a semiconductor chip (101) embedded in an insulating board (120), the chip having a cavity (102) including a radiation sensor MEMS (105), the opening (104) of the cavity at the chip surface covered by a plate (110) transmissive to the radiation (150) sensed...

08/29/13 - 20130221456 - Capacitance type micro-silicon microphone and method for making the same
A capacitance type micro-silicon microphone includes a base, a backplate and a diaphragm positioned above the backplate in a suspended manner. The base includes a top face, a bottom face and a number of sound bores recessing inwardly from the top face. Bottom sides of the sound bores are in...

08/29/13 - 20130221457 - Assembly of a capacitive acoustic transducer of the microelectromechanical type and package thereof
A microelectromechanical-acoustic-transducer assembly has: a first die integrating a MEMS sensing structure having a membrane, which has a first surface in fluid communication with a front chamber and a second surface, opposite to the first surface, in fluid communication with a back chamber of the microelectromechanical acoustic transducer, is able...

08/08/13 - 20130200474 - Low frequency cmut with vent holes
A capacitive micromachined ultrasonic transducer (CMUT), which has a conductive structure that can vibrate over a cavity, has a number of vent holes that are formed in the bottom surface of the cavity. The vent holes eliminate the deflection of the CMUT membrane due to atmospheric pressure which, in turn,...

08/01/13 - 20130193533 - Embedded circuit in a mems device
A Microelectromechanical System (MEMS) microphone includes a printed circuit board, a MEMS die, and an integrated circuit. The MEMS die is disposed on a top surface of the printed circuit board. The integrated circuit is disposed at least partially within the printed circuit board and produces at least one output...

07/25/13 - 20130187246 - Backside integration of rf filters for rf front end modules and design structure
A design structure for an integrated radio frequency (RF) filter on a backside of a semiconductor substrate includes: a device on a first side of a substrate; a radio frequency (RF) filter on a backside of the substrate; and at least one substrate conductor extending from the front side of...

06/13/13 - 20130146995 - Three-dimensional, ultrasonic transducer arrays, methods of making ultrasonic transducer arrays, and devices including ultrasonic transducer arrays
Systems, apparatus, and associated methods of forming the systems and/or apparatus may include imaging devices that may comprise multiple arrays of ultrasonic transducer elements for use in a variety of applications. These multiple arrays of ultrasonic transducer elements can be arranged to form a three-dimensional imaging device. Non-coplanar arrays of...

06/06/13 - 20130140654 - Low frequency cmut with vent holes
A capacitive micromachined ultrasonic transducer (CMUT), which has a conductive structure that can vibrate over a cavity, has a number of vent holes that are formed in the bottom surface of the cavity. The vent holes eliminate the deflection of the CMUT membrane due to atmospheric pressure which, in turn,...

06/06/13 - 20130140655 - Mems acoustic transducer and method for fabricating the same
A MEMS acoustic transducer is provided, which includes a substrate, a MEMS chip, and a housing. The substrate has a first opening area and a lower electrode layer disposed over a surface of the substrate, wherein the first opening area includes at least one hole allowing acoustic pressure to enter...

06/06/13 - 20130140656 - Mems microphone and method for producing the mems microphone
The invention relates to a method for producing a microphone, in which a transducer element (WE) is mounted on a carrier (TR); a cover is arranged over the transducer element (WE) and the carrier (TR) such that the transducer element (WE) is enclosed between the cover and the carrier (TR);...