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Active Solid-state Devices (e.g., Transistors, Solid-state Diodes) > Responsive To Non-electrical Signal (e.g., Chemical, Stress, Light, Or Magnetic Field Sensors) > Physical Deformation > Acoustic Wave

Acoustic Wave

Acoustic Wave patent applications listed include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.

09/18/14 - 20140264650 - Low frequency response microphone diaphragm structures and methods for producing the same
A microphone system includes a diaphragm suspended by springs and including a sealing layer that seals passageways which, if left open, would degrade the microphone's frequency response by allowing air to pass from one side of the diaphragm to the other when the diaphragm is responding to an incident acoustic...

09/18/14 - 20140264651 - Semiconductor devices and methods of forming thereof
In accordance with an embodiment of the present invention, a method of forming a semiconductor device includes forming a sacrificial layer over a first surface of a workpiece having the first surface and an opposite second surface. A membrane is formed over the sacrificial layer. A through hole is etched...

09/18/14 - 20140264652 - Acoustic sensor with integrated programmable electronic interface
An integrated MEMS acoustic sensor has a MEMS transducer and a programmable electronic interface. The programmable electronic interface includes non-volatile memory and is coupled to the MEMS transducer. Using programmable electrical functions, the programmable electronic interface is operable to sense variations in the MEMS transducer caused by application of an...

09/18/14 - 20140264653 - Mems pressure sensor and microphone devices having through-vias and methods of forming same
A method embodiment includes providing a MEMS wafer. A portion of the MEMS wafer is patterned to provide a first membrane for a microphone device and a second membrane for a pressure sensor device. A carrier wafer is bonded to the MEMS wafer. The carrier wafer is etched to expose...

09/18/14 - 20140264654 - Microphone package with integrated substrate
MEMS microphone packages are described that include an ASIC integrated in the base substrate of the package housing. Methods of manufacturing the same and methods for separating individual microphone packages from wafer form assembly arrays are also described....

09/18/14 - 20140264655 - Surface roughening to reduce adhesion in an integrated mems device
In an integrated MEMS device, moving silicon parts with smooth surfaces can stick together if they come into contact. By roughening at least one smooth surface, the effective area of contact, and therefore surface adhesion energy, is reduced and hence the sticking force is reduced. The roughening of a surface...

09/18/14 - 20140264656 - Mems acoustic sensor with integrated back cavity
A MEMS device is disclosed. The MEMS device comprises a first plate with a first surface and a second surface; and an anchor attached to a first substrate. The MEMS device further includes a second plate with a third surface and a fourth surface attached to the first plate. A...

09/18/14 - 20140264657 - Monolithically integrated multi-sensor device on a semiconductor substrate and method therefor
An integrated circuit having an indirect sensor and a direct sensor formed on a common semiconductor substrate is disclosed. The direct sensor requires the parameter being measured to be directly applied to the direct sensor. Conversely, the indirect sensor can have the parameter being measured to be indirectly applied to...

09/18/14 - 20140264658 - Cell phone having a monolithically integrated multi-sensor device on a semiconductor substrate and method therefor
A cell phone is provided having multiple sensors configured to detect and measure different parameters of interest. The cell phone includes at least one monolithic integrated multi-sensor (MIMS) device. The MIMS device comprises at least two sensors of different types formed on a common semiconductor substrate. For example, the MIMS...

09/18/14 - 20140264659 - Transportation device having a monolithically integrated multi-sensor device on a semiconductor substrate and method therefor
A transportation device is provided having multiple sensors configured to detect and measure different parameters of interest. The transportation device includes at least one monolithic integrated multi-sensor (MIMS) device. The MIMS device comprises at least two sensors of different types formed on a common semiconductor substrate. For example, the MIMS...

09/18/14 - 20140264660 - Complementary metal oxide semiconductor (cmos) ultrasonic transducers and methods for forming the same
Complementary metal oxide semiconductor (CMOS) ultrasonic transducers (CUTs) and methods for forming CUTs are described. The CUTs may include monolithically integrated ultrasonic transducers and integrated circuits for operating in connection with the transducers. The CUTs may be used in ultrasound devices such as ultrasound imaging devices and/or high intensity focused...

09/11/14 - 20140252512 - Methods and apparatus for mems structure release
Methods and apparatus for MEMS release are disclosed. A method is described including providing a substrate including at least one MEMS device supported by a sacrificial layer; performing an etch in solution to remove the sacrificial layer from at least one MEMS device; immersing the substrate including the at least...

09/04/14 - 20140246738 - Top port mems cavity package and method of manufacture thereof
A method for the manufacture of a package encasing a Micro-Electro-Mechanical Systems (MEMS) device provides a cover having a lid and sidewalls with a port extending through the lid. A first base component is bonded to the sidewalls defining an internal cavity. This first base component further includes an aperture...

09/04/14 - 20140246739 - Top port mems cavity package and method of manufacture thereof
A method for the manufacture of a package encasing a Micro-Electro-Mechanical Systems (MEMS) device provides a cover having a lid and sidewalls with a port extending through the lid. A first base component is bonded to the sidewalls defining an internal cavity. This first base component further includes an aperture...

08/14/14 - 20140225203 - Packages and methods for packaging mems microphone devices
Microelectromechanical systems (MEMS) microphone devices and methods for packaging the same include a package housing, an interior lid, and an integrated MEMS microphone die. The package housing includes a sound port therethrough for communicating sound from outside the package housing to an interior of the package housing. The interior lid...

08/14/14 - 20140225204 - Acoustic sensor and method for manufacturing same
A cavity is provided in a substrate so as to penetrate from a front surface to a back surface of the substrate. A thin-film diaphragm for sensing acoustic vibrations above the substrate is provided over the cavity. At least one wall surface of the cavity is configured of a first...

08/14/14 - 20140225205 - Mems component
An MEMS component includes at least one metal-ceramic multilayer stack as a mechanical functional layer in the layered structure of the MEMS component. The metal-ceramic multilayer stack functions as a mechanical functional layer in which at least one component of the micromechanical structure of the MEMS component is configured....

08/07/14 - 20140217522 - Microphone structure
A microphone structure is disclosed. The microphone structure comprises a substrate penetrated with at least one opening chamber and having an insulation surface. A conduction layer is arranged on the insulation surface and arranged over the opening chamber. An insulation layer is arranged on the conduction layer and having a...

07/31/14 - 20140210020 - Mems device and method of manufacturing a mems device
MEMS devices with a rigid backplate and a method of making a MEMS device with a rigid backplate are disclosed. In one embodiment, a device includes a substrate and a backplate supported by the substrate. The backplate includes elongated protrusions....

07/24/14 - 20140203380 - Chip package comprising a microphone structure and a method of manufacturing the same
In various embodiments, a method for manufacturing a chip package is provided. The method includes arranging a chip over a substrate, the chip including a microphone structure and an opening to the microphone structure; and encapsulating the chip with encapsulation material such that the opening is kept at least partially...

07/17/14 - 20140197501 - Mems device with polymer layer, system of a mems device with a polymer layer, method of making a mems device with a polymer layer
A MEMS device, a method of making a MEMS device and a system of a MEMS device are shown. In one embodiment, a MEMS device includes a first polymer layer, a MEMS substrate disposed on the first polymer layer and a MEMS structure supported by the MEMS substrate. The MEMS...

07/17/14 - 20140197502 - Comb mems device and method of making a comb mems device
A MEMS device and a method to manufacture a MEMS device are disclosed. An embodiment includes forming trenches in a first main surface of a substrate, forming conductive fingers by forming a conductive material in the trenches and forming an opening from a second main surface of the substrate thereby...

07/17/14 - 20140197503 - Sensor package
A sensor package is disclosed. One embodiment provides a sensor device having a carrier, a semiconductor sensor mounted on the carrier and an active surface. Contact elements are electrically connecting the carrier with the semiconductor sensor. A protective layer made of an inorganic material covers at least the active surface...

07/10/14 - 20140191343 - Sound transducer and microphone using same
Provided is an acoustic transducer including: a semiconductor substrate; a vibrating membrane, provided above the semiconductor substrate, including a vibrating electrode; and a fixed membrane, provided above the semiconductor substrate, including a fixed electrode, the acoustic transducer detecting a sound wave according to changes in capacitances between the vibrating electrode...

07/10/14 - 20140191344 - Mems process and device
A method of fabricating a micro-electrical-mechanical system (MEMS) transducer comprises the steps of forming a membrane on a substrate, and forming a back-volume in the substrate. The step of forming a back-volume in the substrate comprises the steps of forming a first back-volume portion and a second back-volume portion, the...

07/03/14 - 20140183671 - Semiconductor device and microphone
A package is formed by vertically stacking a cover and a substrate. A microphone chip is mounted at the top surface of a concave portion provided to the cover, and a circuit element is mounted on the upper surface of the substrate. The microphone chip is connected to a pad...

05/29/14 - 20140145275 - Ultrasonic transducer and method of manufacturing the same
An ultrasonic transducer and a method of manufacturing the same are disclosed. The ultrasonic transducer includes a conductive substrate, a projection which is disposed on the conductive substrate and which forms a cavity therein, a via hole which penetrates the projection and conductive substrate, a first electrode which includes a...

05/29/14 - 20140145276 - Mems microphone and method for manufacture
An improved method for manufacturing an MEMS microphone with a double fixed electrode is specified which results in a microphone which likewise has improved properties....

05/08/14 - 20140124878 - Mapping density and temperature of a chip, in situ
A method and system to map density and temperature of a chip, in situ, is disclosed. The method includes measuring a propagation time that a mechanical propagation wave travels along at least one predefined path in a substrate. The method further includes calculating an average substrate density and temperature along...

05/08/14 - 20140124879 - Component and method for producing same
A packaging concept for MEMS components having at least one diaphragm structure formed in the front side of the component is provided, according to which the MEMS component is mounted on a support which at least laterally delimits a cavity adjoining the diaphragm structure. In addition, at least one electrical...

05/01/14 - 20140117473 - Packages and methods for packaging
A three-dimensional printing technique can be used to form a microphone package. The microphone package can include a housing having a first side and a second side opposite the first side. A first electrical lead can be formed on an outer surface on the first side of the housing. A...

04/17/14 - 20140103464 - Microphone system with integrated passive device die
A microphone system has a package forming an interior chamber, and a MEMS microphone secured within the interior chamber. The package forms an aperture for permitting acoustic access to the interior of the chamber and thus, the MEMS microphone. The system also has two dies; namely, the system has a...

04/17/14 - 20140103465 - Surface acoustic wave (saw) device package and method for fabricating same
A surface acoustic wave (SAW) device package and method for packaging a SAW device provide a surface excited device having a small footprint, low cost and fabricated according to a unique manufacturing process. A substrate including a SAW active area on a first side is bonded to another similar sized...

04/03/14 - 20140091406 - Mems microphone system for harsh environments
A MEMS microphone system suited for harsh environments. The system uses an integrated circuit package. A first, solid metal lid covers one face of a ceramic package base that includes a cavity, forming an acoustic chamber. The base includes an aperture through the opposing face of the base for receiving...

04/03/14 - 20140091407 - Integrated semiconductor devices with amorphous silicon beam, methods of manufacture and design structure
Bulk acoustic wave filters and/or bulk acoustic resonators integrated with CMOS processes, methods of manufacture and design structures are disclosed. The method includes forming at least one beam comprising amorphous silicon material and providing an insulator material over and adjacent to the amorphous silicon beam. The method further includes forming...

04/03/14 - 20140091408 - Sensor module and semiconductor chip
A sensor module and semiconductor chip. One embodiment provides a carrier. A semiconductor chip includes a first recess and a second recess and a main surface of the semiconductor chip. The semiconductor chip is mounted to the carrier such that the first recess forms a first cavity with the carrier...

03/27/14 - 20140084394 - Micro electro mechanical system (mems) microphone and fabrication method thereof
Provided is a structure for improving performance of a micro electro mechanical system (MEMS) microphone by preventing deformation from occurring due to a residual stress and a package stress of a membrane and by decreasing membrane rigidity. A MEMS microphone according to the present disclosure includes a backplate formed on...

03/27/14 - 20140084395 - Mems microphone
Mechanical resonating structures, as well as related devices and methods of manufacture. The mechanical resonating structures can be microphones, each including a diaphragm and a piezoelectric stack. The diaphragm can have one or more openings formed therethrough to enable the determination of an acoustic pressure being applied to the diaphragm...

03/20/14 - 20140077317 - Microelectromechanical system (mems) device and fabrication method thereof
A MEMS device includes a silicon substrate and a structural dielectric layer. The silicon substrate has a cavity. The structural dielectric layer is disposed on the silicon substrate. The structural dielectric layer has a space above the cavity of the silicon substrate and holds a plurality of structure elements within...

03/06/14 - 20140061825 - Micro electro mechanical system(mems) acoustic sensor and fabrication method thereof
Provided are a micro electro mechanical system (MEMS) acoustic sensor for removing a nonlinear component that occurs due to a vertical motion of a lower electrode when external sound pressure is received by fixing the lower electrode to a substrate using a fixing pin, and a fabrication method thereof. The...

03/06/14 - 20140061826 - Ultrasonic transducer and method of manufacturing the same
An ultrasonic transducer and a method of manufacturing the same are disclosed. The ultrasonic transducer includes a first electrode layer which is disposed to cover a conductive substrate and an inner wall and a top of a via hole penetrating a membrane and has a top surface at a same...

02/13/14 - 20140042565 - Apparatus comprising and a method for manufacturing an embedded mems device
A system and a method for forming a packaged MEMS device are disclosed. In one embodiment a packaged MEMS device includes a MEMS device having a first main surface with a first area along a first direction and a second direction, a membrane disposed on the first main surface of...

01/30/14 - 20140027867 - Packages and methods for 3d integration
Packages and methods for 3D integration are disclosed. In various embodiments, a first integrated device die having a hole is attached to a package substrate. A second integrated device die can be stacked on top of the first integrated device die. At least a portion of the second integrated device...

01/16/14 - 20140015070 - Component having a micromechanical microphone pattern
A microphone component has a micromechanical microphone pattern which is implemented in a layer construction on a semiconductor substrate and includes (i) an acoustically active diaphragm which at least partially spans a sound opening on the backside of the substrate, (ii) at least one movable electrode of a microphone capacitor...

01/16/14 - 20140015071 - Encapsulated micro-electro-mechanical device, in particular a mems acoustic transducer
An encapsulated micro-electro-mechanical device, wherein a MEMS chip is encapsulated by a package formed by a first, a second, and a third substrates that are bonded together. The first substrate has a main surface bearing the MEMS chip, the second substrate is bonded to the first substrate and defines a...

01/09/14 - 20140008740 - Mems microphone and method for packaging the same
The present invention relates to a MEMS microphone and a method of manufacturing the same, the MEMS microphone comprising: a monolithic silicon chip incorporating an acoustic sensing element and one or more conditioning CMOS integrated circuits; a silicon-based carrier chip having an acoustic cavity; a substrate for surface mounting the...

01/02/14 - 20140001580 - Transducer with enlarged back volume
A packaged integrated device includes a package substrate having a first surface and a second surface opposite the first surface, and the package substrate has a hole therethrough. The integrated device package also includes a first lid mounted on the first surface of the package substrate to define a first...

01/02/14 - 20140001581 - Mems microphone and forming method therefor
A micro-electro-mechanical system (MEMS) microphone may include a sensitive diaphragm and a fixed electrode corresponding to the sensitive diaphragm; at least one sensitive diaphragm support located on the surface of the sensitive diaphragm corresponding to the fixed electrode; and a sensitive diaphragm support arm coupled to the sensitive diaphragm support....

12/19/13 - 20130334625 - Method for fabricating patterned polyimide film and applications thereof
A method for fabricating a patterned polyimide film, wherein the method comprises steps as follows: Firstly, a polyimide film is provided on a substrate. A wet planarization process is then performed to remove a portion of the polyimide film. Subsequently the planarized polyimide film is patterned....

12/19/13 - 20130334626 - Hybrid integrated component and method for the manufacture thereof
A hybrid integrated component includes: at least one ASIC element having integrated circuit elements and a back-end stack; an MEMS element having a micromechanical structure, which extends over the entire thickness of the MEMS substrate; and a cap wafer. The hybrid integrated component is provided with an additional micromechanical function....

12/19/13 - 20130334627 - Semiconductor integrated device assembly and related manufacturing process
Described herein is a semiconductor integrated device assembly, which envisages: a package defining an internal space; a first die including semiconductor material; and a second die, distinct from the first die, also including semiconductor material; the first die and the second die are coupled to an inner surface of the...