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Acoustic Wave

Acoustic Wave patent applications listed include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.

Related Categories:

Active Solid-state Devices (e.g., Transistors, Solid-state Diodes)


Responsive To Non-electrical Signal (e.g., Chemical, Stress, Light, Or Magnetic Field Sensors) > Physical Deformation > Acoustic Wave



Semiconductor device and microphone
12/18/14 - 20140367808 - A bump-joining pad (61) is provided to the upper surface of a substrate (45), and a bump (70) of a circuit element (43) is connected to the bump-joining pad. The bump-joining pad (61) is connected to a substrate-side joining section (69) provided to a surface facing a cover by a...

Viristor in base for mems microphones
12/18/14 - 20140367809 - A micro electro mechanical system (MEMS) apparatus includes a substrate. The substrate includes a first surface and a second surface. The first surface and the second surface are on opposing sides of the substrate. A programming contact pad is disposed on the second surface of the substrate. A MEMS device...

Open cavity substrate in a mems microphone assembly and method of manufacturing the same
12/18/14 - 20140367810 - An acoustic apparatus includes a substrate. A microelectromechanical system (MEMS) device is disposed on the substrate. The MEMS device forms a back volume between the MEMS device and the substrate. An integrated circuit disposed on the substrate. A cover is disposed on the substrate and the cover includes a port....

Capacitance type sensor and method of manufacturing the same
12/18/14 - 20140367811 - A capacitance type sensor has a semiconductor substrate having a vertically opened penetration hole, a movable electrode film arranged above the penetration hole such that a periphery portion opposes to a top surface of the semiconductor substrate with a gap provided, and a fixed electrode film arranged above the movable...

Capacitive sensing structure with embedded acoustic channels
12/11/14 - 20140361388 - A MEMS device includes a dual membrane, an electrode, and an interconnecting structure. The dual membrane has a top membrane and a bottom membrane. The bottom membrane is positioned between the top membrane and the electrode and the interconnecting structure defines a spacing between the top membrane and the bottom...

Mems microphone and electronic equipment having the mems microphone
12/04/14 - 20140353779 - The present invention provides a MEMS microphone and an electronic equipment having the MEMS microphone. The electronic equipment of the present invention at least comprises: a MEMS microphone and a printed circuit board, wherein, the microphone comprises: a microphone chip containing acoustic and electric sensor, a package shell packaging the...

Detection structure for a mems acoustic transducer with improved robustness to deformation
12/04/14 - 20140353780 - A micromechanical structure for a MEMS capacitive acoustic transducer, has: a substrate of semiconductor material; a rigid electrode, at least in part of conductive material, coupled to the substrate; a membrane, at least in part of conductive material, facing the rigid electrode and coupled to the substrate, which undergoes deformation...

Mems microphone with reduced parasitic capacitance
11/27/14 - 20140346620 - A MEMS microphone has reduced parasitic capacitance. The microphone includes a trench electrically separating an acoustically active section of the backplate from an acoustically inactive section of the backplate....

Mems backplate, mems microphone comprising a mems backplate and method for manufacturing a mems microphone
11/27/14 - 20140346621 - A MEMS backplate enables MEMS microphones with reduced parasitic capacitance. A MEMS backplate includes a central area and a perforation in the central area. A suspension area surrounds the central area at least partially. An aperture is disposed in the suspension area....

Forming semiconductor structure with device layers and trl
11/27/14 - 20140346622 - A semiconductor wafer is formed with a first device layer having active devices. A handle wafer having a trap rich layer is bonded to a top surface of the semiconductor wafer. A second device layer having a MEMS device or acoustic filter device is formed on a bottom surface of...

Piezoelectric mems microphone
11/20/14 - 20140339657 - A piezoelectric MEMS microphone comprising a multi-layer sensor that includes at least one piezoelectric layer between two electrode layers, with the sensor being dimensioned such that it provides a near maximized ratio of output energy to sensor area, as determined by an optimization parameter that accounts for input pressure, bandwidth,...

Microelectromechanical device and a method of manufacturing
11/13/14 - 20140332910 - A microelectromechanical device that comprises a wafer plate, a group of one or more wafer connector elements, and an electrical distribution layer between them. For reduced device thickness, the wafer plate comprises at least two dies and bonding material that bonds the at least two dies alongside each other to...

Capacitive micro-machined transducer and method of manufacturing the same
11/13/14 - 20140332911 - The present invention relates to a method of manufacturing a capacitive micro- machined transducer (100), in particular a CMUT, the method comprising depositing a first electrode layer (10) on a substrate (1), depositing a first dielectric film (20) on the first electrode layer (10), depositing a sacrificial layer (30) on...

Chip package and a method of manufacturing the same
11/13/14 - 20140332912 - In various embodiments, a method for manufacturing a chip package is provided. The method includes arranging a chip over a substrate, the chip including a microphone structure and an opening to the microphone structure; and encapsulating the chip with encapsulation material such that the opening is kept at least partially...

Component having a micromechanical microphone pattern
10/30/14 - 20140319629 - Measures are provided for increasing the resistance to compression of a component having a micromechanical microphone pattern. In particular, the robustness of the microphone pattern to highly dynamic pressure fluctuations is to be increased, without the microphone sensitivity, i.e. the microphone performance, being impaired. The microphone pattern of such a...

Wafer level assembly of a mems sensor device and related mems sensor device
10/30/14 - 20140319630 - An assembly of a MEMS sensor device envisages: a first die, integrating a micromechanical detection structure and having an external main face; a second die, integrating an electronic circuit operatively coupled to the micromechanical detection structure, electrically and mechanically coupled to the first die and having a respective external main...

Microphone module and method of manufacturing thereof
10/23/14 - 20140312439 - A microphone module includes a package including a semiconductor chip and having a recess on an upper surface and a micro-electro-mechanical microphone being electrically connected to the package. Further, the micro-electro-mechanical microphone is arranged on the upper surface of the package. The recess forms an acoustic back volume of the...

Microphone
10/16/14 - 20140306299 - A microphone has a base substrate comprising a main surface, an acoustic sensor mounted on the main surface, and a circuit element stacked on the acoustic sensor. A hollow space is formed between the acoustic sensor and the circuit element. The acoustic sensor has a sensor substrate having a first...

Silicon based mems microphone, a system and a package with the same
10/09/14 - 20140299948 - The present invention relates to a silicon based MEMS microphone, comprising a silicon substrate and an acoustic sensing part supported on the silicon substrate, wherein a mesh-structured back hole is formed in the substrate and aligned with the acoustic sensing part, the mesh-structured back hole includes a plurality of mesh...

Assembly of a capacitive acoustic transducer of the microelectromechanical type and package thereof
10/09/14 - 20140299949 - A microelectromechanical-acoustic-transducer assembly has: a first die integrating a MEMS sensing structure having a membrane, which has a first surface in fluid communication with a front chamber and a second surface, opposite to the first surface, in fluid communication with a back chamber of the microelectromechanical acoustic transducer, is able...

Methods and devices for packaging integrated circuits
10/02/14 - 20140291782 - Methods and devices for packaging integrated circuits. A packaged device may include an integrated circuit, a first packaging component including a patterned surface, and a second packaging component. The patterned surface of the first packaging component may be adhesively coupled to a surface of the second packaging component or a...

Cover for a mems microphone
10/02/14 - 20140291783 - A microphone assembly includes a base, a cover, and a microelectromechanical system (MEMS) die. The cover extends at least partially over and is coupled to the base. The cover and the base form a cavity. The MEMS die is coupled to the base and disposed within the cavity. At least...

Mems apparatus with increased back volume
10/02/14 - 20140291784 - A microelectromechanical system (MEMS) microphone assembly includes a base and a cover. The cover is coupled to the base and together with the base defines a cavity. The base forms a recess and the recess has dimensions and a shape so as to hold a MEMS die. The MEMS die...

Microphone
10/02/14 - 20140291785 - A microphone has a base substrate having a main surface, an acoustic sensor mounted on the main surface, and a circuit element that processes a signal output from the acoustic sensor. The acoustic sensor has a sensor substrate having a first surface opposed to the base substrate, a second surface...

Component having a micromechanical microphone structure
10/02/14 - 20140291786 - Substrate-side overload protection for the diaphragm structure of a microphone component having a micromechanical microphone structure which impairs the damping properties of the microphone structure as little as possible, in which the microphone structure includes a diaphragm structure having at least one acoustically active diaphragm which is formed in a...

Structure of mems electroacoustic transducer
10/02/14 - 20140291787 - A structure of micro-electro-mechanical systems (MEMS) electroacoustic transducer is disclosed. The MEMS electroacoustic transducer includes a substrate having a MEMS device region, a diaphragm having openings and disposed in the MEMS device region, a silicon material layer disposed on the diaphragm and sealing the diaphragm, and a conductive pattern disposed...

Low frequency response microphone diaphragm structures and methods for producing the same
09/18/14 - 20140264650 - A microphone system includes a diaphragm suspended by springs and including a sealing layer that seals passageways which, if left open, would degrade the microphone's frequency response by allowing air to pass from one side of the diaphragm to the other when the diaphragm is responding to an incident acoustic...

Semiconductor devices and methods of forming thereof
09/18/14 - 20140264651 - In accordance with an embodiment of the present invention, a method of forming a semiconductor device includes forming a sacrificial layer over a first surface of a workpiece having the first surface and an opposite second surface. A membrane is formed over the sacrificial layer. A through hole is etched...

Acoustic sensor with integrated programmable electronic interface
09/18/14 - 20140264652 - An integrated MEMS acoustic sensor has a MEMS transducer and a programmable electronic interface. The programmable electronic interface includes non-volatile memory and is coupled to the MEMS transducer. Using programmable electrical functions, the programmable electronic interface is operable to sense variations in the MEMS transducer caused by application of an...

Mems pressure sensor and microphone devices having through-vias and methods of forming same
09/18/14 - 20140264653 - A method embodiment includes providing a MEMS wafer. A portion of the MEMS wafer is patterned to provide a first membrane for a microphone device and a second membrane for a pressure sensor device. A carrier wafer is bonded to the MEMS wafer. The carrier wafer is etched to expose...

Microphone package with integrated substrate
09/18/14 - 20140264654 - MEMS microphone packages are described that include an ASIC integrated in the base substrate of the package housing. Methods of manufacturing the same and methods for separating individual microphone packages from wafer form assembly arrays are also described....

Surface roughening to reduce adhesion in an integrated mems device
09/18/14 - 20140264655 - In an integrated MEMS device, moving silicon parts with smooth surfaces can stick together if they come into contact. By roughening at least one smooth surface, the effective area of contact, and therefore surface adhesion energy, is reduced and hence the sticking force is reduced. The roughening of a surface...

Mems acoustic sensor with integrated back cavity
09/18/14 - 20140264656 - A MEMS device is disclosed. The MEMS device comprises a first plate with a first surface and a second surface; and an anchor attached to a first substrate. The MEMS device further includes a second plate with a third surface and a fourth surface attached to the first plate. A...

Monolithically integrated multi-sensor device on a semiconductor substrate and method therefor
09/18/14 - 20140264657 - An integrated circuit having an indirect sensor and a direct sensor formed on a common semiconductor substrate is disclosed. The direct sensor requires the parameter being measured to be directly applied to the direct sensor. Conversely, the indirect sensor can have the parameter being measured to be indirectly applied to...

Cell phone having a monolithically integrated multi-sensor device on a semiconductor substrate and method therefor
09/18/14 - 20140264658 - A cell phone is provided having multiple sensors configured to detect and measure different parameters of interest. The cell phone includes at least one monolithic integrated multi-sensor (MIMS) device. The MIMS device comprises at least two sensors of different types formed on a common semiconductor substrate. For example, the MIMS...

Transportation device having a monolithically integrated multi-sensor device on a semiconductor substrate and method therefor
09/18/14 - 20140264659 - A transportation device is provided having multiple sensors configured to detect and measure different parameters of interest. The transportation device includes at least one monolithic integrated multi-sensor (MIMS) device. The MIMS device comprises at least two sensors of different types formed on a common semiconductor substrate. For example, the MIMS...

Complementary metal oxide semiconductor (cmos) ultrasonic transducers and methods for forming the same
09/18/14 - 20140264660 - Complementary metal oxide semiconductor (CMOS) ultrasonic transducers (CUTs) and methods for forming CUTs are described. The CUTs may include monolithically integrated ultrasonic transducers and integrated circuits for operating in connection with the transducers. The CUTs may be used in ultrasound devices such as ultrasound imaging devices and/or high intensity focused...

Methods and apparatus for mems structure release
09/11/14 - 20140252512 - Methods and apparatus for MEMS release are disclosed. A method is described including providing a substrate including at least one MEMS device supported by a sacrificial layer; performing an etch in solution to remove the sacrificial layer from at least one MEMS device; immersing the substrate including the at least...

Top port mems cavity package and method of manufacture thereof
09/04/14 - 20140246738 - A method for the manufacture of a package encasing a Micro-Electro-Mechanical Systems (MEMS) device provides a cover having a lid and sidewalls with a port extending through the lid. A first base component is bonded to the sidewalls defining an internal cavity. This first base component further includes an aperture...

Top port mems cavity package and method of manufacture thereof
09/04/14 - 20140246739 - A method for the manufacture of a package encasing a Micro-Electro-Mechanical Systems (MEMS) device provides a cover having a lid and sidewalls with a port extending through the lid. A first base component is bonded to the sidewalls defining an internal cavity. This first base component further includes an aperture...

Packages and methods for packaging mems microphone devices
08/14/14 - 20140225203 - Microelectromechanical systems (MEMS) microphone devices and methods for packaging the same include a package housing, an interior lid, and an integrated MEMS microphone die. The package housing includes a sound port therethrough for communicating sound from outside the package housing to an interior of the package housing. The interior lid...

Acoustic sensor and method for manufacturing same
08/14/14 - 20140225204 - A cavity is provided in a substrate so as to penetrate from a front surface to a back surface of the substrate. A thin-film diaphragm for sensing acoustic vibrations above the substrate is provided over the cavity. At least one wall surface of the cavity is configured of a first...

Mems component
08/14/14 - 20140225205 - An MEMS component includes at least one metal-ceramic multilayer stack as a mechanical functional layer in the layered structure of the MEMS component. The metal-ceramic multilayer stack functions as a mechanical functional layer in which at least one component of the micromechanical structure of the MEMS component is configured....

Microphone structure
08/07/14 - 20140217522 - A microphone structure is disclosed. The microphone structure comprises a substrate penetrated with at least one opening chamber and having an insulation surface. A conduction layer is arranged on the insulation surface and arranged over the opening chamber. An insulation layer is arranged on the conduction layer and having a...

Mems device and method of manufacturing a mems device
07/31/14 - 20140210020 - MEMS devices with a rigid backplate and a method of making a MEMS device with a rigid backplate are disclosed. In one embodiment, a device includes a substrate and a backplate supported by the substrate. The backplate includes elongated protrusions....

Chip package comprising a microphone structure and a method of manufacturing the same
07/24/14 - 20140203380 - In various embodiments, a method for manufacturing a chip package is provided. The method includes arranging a chip over a substrate, the chip including a microphone structure and an opening to the microphone structure; and encapsulating the chip with encapsulation material such that the opening is kept at least partially...

Mems device with polymer layer, system of a mems device with a polymer layer, method of making a mems device with a polymer layer
07/17/14 - 20140197501 - A MEMS device, a method of making a MEMS device and a system of a MEMS device are shown. In one embodiment, a MEMS device includes a first polymer layer, a MEMS substrate disposed on the first polymer layer and a MEMS structure supported by the MEMS substrate. The MEMS...

Comb mems device and method of making a comb mems device
07/17/14 - 20140197502 - A MEMS device and a method to manufacture a MEMS device are disclosed. An embodiment includes forming trenches in a first main surface of a substrate, forming conductive fingers by forming a conductive material in the trenches and forming an opening from a second main surface of the substrate thereby...

Sensor package
07/17/14 - 20140197503 - A sensor package is disclosed. One embodiment provides a sensor device having a carrier, a semiconductor sensor mounted on the carrier and an active surface. Contact elements are electrically connecting the carrier with the semiconductor sensor. A protective layer made of an inorganic material covers at least the active surface...

Sound transducer and microphone using same
07/10/14 - 20140191343 - Provided is an acoustic transducer including: a semiconductor substrate; a vibrating membrane, provided above the semiconductor substrate, including a vibrating electrode; and a fixed membrane, provided above the semiconductor substrate, including a fixed electrode, the acoustic transducer detecting a sound wave according to changes in capacitances between the vibrating electrode...

Mems process and device
07/10/14 - 20140191344 - A method of fabricating a micro-electrical-mechanical system (MEMS) transducer comprises the steps of forming a membrane on a substrate, and forming a back-volume in the substrate. The step of forming a back-volume in the substrate comprises the steps of forming a first back-volume portion and a second back-volume portion, the...

Semiconductor device and microphone
07/03/14 - 20140183671 - A package is formed by vertically stacking a cover and a substrate. A microphone chip is mounted at the top surface of a concave portion provided to the cover, and a circuit element is mounted on the upper surface of the substrate. The microphone chip is connected to a pad...

Ultrasonic transducer and method of manufacturing the same
05/29/14 - 20140145275 - An ultrasonic transducer and a method of manufacturing the same are disclosed. The ultrasonic transducer includes a conductive substrate, a projection which is disposed on the conductive substrate and which forms a cavity therein, a via hole which penetrates the projection and conductive substrate, a first electrode which includes a...

Mems microphone and method for manufacture
05/29/14 - 20140145276 - An improved method for manufacturing an MEMS microphone with a double fixed electrode is specified which results in a microphone which likewise has improved properties....

Mapping density and temperature of a chip, in situ
05/08/14 - 20140124878 - A method and system to map density and temperature of a chip, in situ, is disclosed. The method includes measuring a propagation time that a mechanical propagation wave travels along at least one predefined path in a substrate. The method further includes calculating an average substrate density and temperature along...

Component and method for producing same
05/08/14 - 20140124879 - A packaging concept for MEMS components having at least one diaphragm structure formed in the front side of the component is provided, according to which the MEMS component is mounted on a support which at least laterally delimits a cavity adjoining the diaphragm structure. In addition, at least one electrical...

Packages and methods for packaging
05/01/14 - 20140117473 - A three-dimensional printing technique can be used to form a microphone package. The microphone package can include a housing having a first side and a second side opposite the first side. A first electrical lead can be formed on an outer surface on the first side of the housing. A...

Microphone system with integrated passive device die
04/17/14 - 20140103464 - A microphone system has a package forming an interior chamber, and a MEMS microphone secured within the interior chamber. The package forms an aperture for permitting acoustic access to the interior of the chamber and thus, the MEMS microphone. The system also has two dies; namely, the system has a...

Surface acoustic wave (saw) device package and method for fabricating same
04/17/14 - 20140103465 - A surface acoustic wave (SAW) device package and method for packaging a SAW device provide a surface excited device having a small footprint, low cost and fabricated according to a unique manufacturing process. A substrate including a SAW active area on a first side is bonded to another similar sized...

Mems microphone system for harsh environments
04/03/14 - 20140091406 - A MEMS microphone system suited for harsh environments. The system uses an integrated circuit package. A first, solid metal lid covers one face of a ceramic package base that includes a cavity, forming an acoustic chamber. The base includes an aperture through the opposing face of the base for receiving...

Integrated semiconductor devices with amorphous silicon beam, methods of manufacture and design structure
04/03/14 - 20140091407 - Bulk acoustic wave filters and/or bulk acoustic resonators integrated with CMOS processes, methods of manufacture and design structures are disclosed. The method includes forming at least one beam comprising amorphous silicon material and providing an insulator material over and adjacent to the amorphous silicon beam. The method further includes forming...

Sensor module and semiconductor chip
04/03/14 - 20140091408 - A sensor module and semiconductor chip. One embodiment provides a carrier. A semiconductor chip includes a first recess and a second recess and a main surface of the semiconductor chip. The semiconductor chip is mounted to the carrier such that the first recess forms a first cavity with the carrier...

Micro electro mechanical system (mems) microphone and fabrication method thereof
03/27/14 - 20140084394 - Provided is a structure for improving performance of a micro electro mechanical system (MEMS) microphone by preventing deformation from occurring due to a residual stress and a package stress of a membrane and by decreasing membrane rigidity. A MEMS microphone according to the present disclosure includes a backplate formed on...

Mems microphone
03/27/14 - 20140084395 - Mechanical resonating structures, as well as related devices and methods of manufacture. The mechanical resonating structures can be microphones, each including a diaphragm and a piezoelectric stack. The diaphragm can have one or more openings formed therethrough to enable the determination of an acoustic pressure being applied to the diaphragm...

Microelectromechanical system (mems) device and fabrication method thereof
03/20/14 - 20140077317 - A MEMS device includes a silicon substrate and a structural dielectric layer. The silicon substrate has a cavity. The structural dielectric layer is disposed on the silicon substrate. The structural dielectric layer has a space above the cavity of the silicon substrate and holds a plurality of structure elements within...

Micro electro mechanical system(mems) acoustic sensor and fabrication method thereof
03/06/14 - 20140061825 - Provided are a micro electro mechanical system (MEMS) acoustic sensor for removing a nonlinear component that occurs due to a vertical motion of a lower electrode when external sound pressure is received by fixing the lower electrode to a substrate using a fixing pin, and a fabrication method thereof. The...

Ultrasonic transducer and method of manufacturing the same
03/06/14 - 20140061826 - An ultrasonic transducer and a method of manufacturing the same are disclosed. The ultrasonic transducer includes a first electrode layer which is disposed to cover a conductive substrate and an inner wall and a top of a via hole penetrating a membrane and has a top surface at a same...

Apparatus comprising and a method for manufacturing an embedded mems device
02/13/14 - 20140042565 - A system and a method for forming a packaged MEMS device are disclosed. In one embodiment a packaged MEMS device includes a MEMS device having a first main surface with a first area along a first direction and a second direction, a membrane disposed on the first main surface of...

Packages and methods for 3d integration
01/30/14 - 20140027867 - Packages and methods for 3D integration are disclosed. In various embodiments, a first integrated device die having a hole is attached to a package substrate. A second integrated device die can be stacked on top of the first integrated device die. At least a portion of the second integrated device...

Component having a micromechanical microphone pattern
01/16/14 - 20140015070 - A microphone component has a micromechanical microphone pattern which is implemented in a layer construction on a semiconductor substrate and includes (i) an acoustically active diaphragm which at least partially spans a sound opening on the backside of the substrate, (ii) at least one movable electrode of a microphone capacitor...

Encapsulated micro-electro-mechanical device, in particular a mems acoustic transducer
01/16/14 - 20140015071 - An encapsulated micro-electro-mechanical device, wherein a MEMS chip is encapsulated by a package formed by a first, a second, and a third substrates that are bonded together. The first substrate has a main surface bearing the MEMS chip, the second substrate is bonded to the first substrate and defines a...