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Physical Deformation

Physical Deformation patent applications listed include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.

Related Categories:

Active Solid-state Devices (e.g., Transistors, Solid-state Diodes)


Responsive To Non-electrical Signal (e.g., Chemical, Stress, Light, Or Magnetic Field Sensors) > Physical Deformation



Integrated circuit having varying substrate depth and method of forming same
03/26/15 - 20150084138 - A semiconductor device is formed such that a semiconductor substrate of the device has a non-uniform thickness. A cavity is etched at a selected side of the semiconductor substrate, and the selected side is then fusion bonded to another substrate, such as a carrier substrate. After fusion bonding, the side...

Electronic device
03/19/15 - 20150076626 - According to one embodiment, an electronic device includes a substrate, a first electrode provided stationary above the substrate and used for a variable capacitor, a second electrode provided movable above or below the first electrode and used for the variable capacitor, a first protective insulation film provided on a first...

Package-on-package semiconductor sensor device
03/12/15 - 20150069537 - A semiconductor sensor device has a MCU die and an acceleration-sensing die mounted on a die paddle of a lead frame. The MCU die is connected to leads of the lead frame with first bond wires and the acceleration-sensing die is connected to the MCU die with second bond wires....

Micro-electro-mechanical system device having differential capacitors of corresponding sizes
03/12/15 - 20150069538 - The invention provides a micro-electro-mechanical device having differential capacitor of corresponding sizes, which includes a substrate; a top fixed electrode; a bottom fixed electrode; a mass, having a top electrode and a bottom electrode, wherein the top electrodes form a top capacitor with the top fixed electrode and the bottom...

Sequential wafer bonding
03/05/15 - 20150061044 - Embodiments of methods of fabricating a sensor device includes attaching a first wafer to a sensor wafer with a first bond material, and attaching a second wafer to the sensor wafer with a second bond material, the second bond material having a lower bonding temperature than the first bond material....

Mems device
03/05/15 - 20150061045 - A MEMS device includes a first chip and a MEMS chip. The first chip has a mounting surface and includes at least an integrated circuit. The MEMS chip has a main surface on which a first set of contact pads for contacting the MEMS device and a second set of...

Wafer level method of sealing different pressure levels for mems sensors
03/05/15 - 20150061046 - The present disclosure relates to a method of forming a plurality of MEMs device having a plurality of chambers with different pressures on a substrate, and an associated apparatus. In some embodiments, the method is performed by providing a device wafer having a plurality of microelectromechanical system (MEMs) devices. A...

Capacitive pressure sensors and fabrication methods thereof
03/05/15 - 20150061047 - A capacitive pressure sensor is provided. The capacitive pressure sensor includes a substrate; and a first electrode formed in one surface of the substrate and vertical to the surface of the substrate. The capacitive pressure sensor also includes a second electrode with a portion facing the first sub-electrode, a portion...

Capacitive micro-machined ultrasonic transducer and method of singulating the same
02/26/15 - 20150054095 - A capacitive micro-machined ultrasonic transducer (CMUT) and a method of singulating the same. Singulating CMUTs may include forming first trenches in regions of a device wafer defining a plurality of ultrasonic transducer structures, the device wafer including a plurality of the ultrasonic transducer structures, forming an ultrasonic transducer wafer having...

Reducing mems stiction by introduction of a carbon barrier
02/26/15 - 20150054096 - A mechanism for reducing stiction in a MEMS device by decreasing an amount of carbon from TEOS-based silicon oxide films that can accumulate on polysilicon surfaces during fabrication is provided. A carbon barrier material film is deposited between one or more polysilicon layer in a MEMS device and the TEOS-based...

Device with a micro- or nanoscale structure
02/19/15 - 20150048461 - The component (1) is arranged at least partly in the recess (23). An electrically conducting structure (3) is provided for bridging a gap (6) between the component (1) and the support (2)....

Sensor package and method of forming same
02/19/15 - 20150048462 - A method (70) of forming sensor packages (20) entails providing a sensor wafer (74) having sensors (30) formed on a side (26) positioned within areas (34) delineated by bonding perimeters (36), and providing a controller wafer (82) having control circuitry (42) at one side (38) and bonding perimeters (46) on...

Mems device with differential vertical sense electrodes
02/12/15 - 20150041927 - A MEMS device includes a first sense electrode and a first portion of a sense mass formed in a first structural layer, where the first sense electrode is fixedly coupled with the substrate and the first portion of the sense mass is suspended over the substrate. The MEMS device further...

Wafer encapsulated microelectromechanical structure
02/12/15 - 20150041928 - A cavity is formed within a first substrate together with trenches that separate first and second portions of the first substrate from each other and from the remainder of the first substrate. The first portion of the first substrate is disposed within the cavity and constitutes a microelectromechanical structure, while...

Mems device and method of forming the same
02/05/15 - 20150035089 - A method for forming a MEMS device is provided. The method includes the following steps of providing a substrate having a first portion and a second portion; fabricating a membrane type sensor on the first portion of the substrate; and fabricating a bulk silicon sensor on the second portion of...

Stacked die package for mems resonator system
02/05/15 - 20150035090 - In a packaging structure for a microelectromechanical-system (MEMS) resonator system, a resonator-control chip is mounted on a lead frame having a plurality of electrical leads, including electrically coupling a first contact on a first surface of the resonator-control chip to a mounting surface of a first electrical lead of the...

Process for manufacturing a packaged device, in particular a packaged micro-electro-mechanical sensor, having an accessible structure, such as a mems microphone and packaged device obtained thereby
02/05/15 - 20150035091 - In order to manufacture a packaged device, a die having a sensitive region is bonded to a support, and a packaging mass of moldable material is molded on the support so as to surround the die. During molding of the packaging mass, a chamber is formed, which faces the sensitive...

Sensors and method of operating sensor
02/05/15 - 20150035092 - Sensors and methods of operating sensors are described herein. One sensor includes a number of III-nitride strain sensitive devices and a number of passive electrical components that connects each of them to one of the III-nitride strain sensitive devices....

Inertial and pressure sensors on single chip
02/05/15 - 20150035093 - In one embodiment, the process flow for a capacitive pressures sensor is combined with the process flow for an inertial sensor. In this way, an inertial sensor is realized within the membrane layer of the pressure sensor. The device layer is simultaneously used as z-axis electrode for out-of-plane sensing in...

Assembly and packaging of mems device
01/29/15 - 20150028432 - A Micro Electro Mechanical systems (MEMS) device includes a solder bump on a substrate, a CMOS-MEMS die comprising a CMOS die and a MEMS die, and stud bumps on the CMOS die. The MEMS die is disposed between the CMOS die and the substrate. The stud bumps and the solder...

Encapsulation structure including a mechanically reinforced cap and with a getter effect
01/29/15 - 20150028433 - and in which the Young's modulus of a second material of the mechanical reinforcement portions is higher than that of the first material....

Resonant transducer, manufacturing method therefor, and multi-layer structure for resonant transducer
01/29/15 - 20150028434 - A resonant transducer includes a silicon single crystal substrate, a silicon single crystal resonator disposed over the silicon single crystal substrate, a shell made of silicon, surrounding the resonator with a gap, and forming a chamber together with the silicon single crystal substrate, an exciting module configured to excite the...

Reducing microelectromechanical systems stiction by formation of a silicon carbide layer
01/22/15 - 20150021717 - A mechanism is provided for reducing stiction in a MEMS device by forming a near-uniform silicon carbide layer on silicon surfaces using carbon from TEOS-based silicon oxide sacrificial films used during fabrication. By using the TEOS as a source of carbon to form an antistiction coating, all silicon surfaces can...

Apparatus and method for reduced strain on mems devices
01/22/15 - 20150021718 - A method and apparatus for coupling a MEMS device to a substrate is disclosed. The method includes providing a substrate with a conductor disposed over the substrate, adhering the MEMS device to the substrate, wherein a first elastomer adheres the MEMS device to the substrate. The MEMS device is electrically...

Functional device, electronic apparatus, and moving object
01/22/15 - 20150021719 - A functional device includes a movable body displaceable along a first axis, a fixed section configured to support the movable body in a coupling section, a movable electrode section extending from the movable body, a fixed electrode section arranged to be opposed to the movable electrode section, and an extending...

Device comprising a fluid channel fitted with at least one microelectronic or nanoelectronic system, and method for manufacturing such a device
01/22/15 - 20150021720 - A device comprising a substrate comprising at least one microelectronic and/or nanoelectronic structure comprising at least one sensitive portion and one fluid channel (2) defined between said substrate and a cap (6), where said fluid channel (2) comprises at least two apertures to provide a flow in said channel, where...

Pressure sensor having down-set flag
01/15/15 - 20150014793 - A semiconductor sensor device has a lead frame having an outer frame with wire bond pads and a die pad to which a pressure sensor die is mounted. The die pad is vertically offset from the outer frame and wire bond pads by tie bars that have down set structures....

Integrated circuit provided with a device for detecting its spatial orientation and/or a modification of this orientation
01/15/15 - 20150014794 - An integrated circuit includes a mechanical device for detection of spatial orientation and/or of change in orientation of the integrated circuit. The device is formed in the BEOL and includes an accommodation whose sides include metal portions formed within various metallization levels. A mobile metal component is accommodated within the...

Mems-cmos integrated devices, and methods of integration at wafer level
01/08/15 - 20150008540 - A method for forming an integrated semiconductor device includes providing a first wafer, providing a second wafer, and bonding the first wafer over the second wafer. The first wafer includes a first substrate having a microelectromechanical system (MEMS) device layer. The second wafer includes a second substrate having at least...

Mems pressure sensors and fabrication method thereof
01/08/15 - 20150008541 - A MEMS capacitive pressure sensor is provided. The pressure sensor includes a substrate having a first region and a second region, and a first dielectric layer formed on the substrate. The pressure sensor also includes a first electrode layer formed on the first dielectric layer, and a second dielectric layer...

Mems device incorporating a fluidic path, and manufacturing process thereof
01/01/15 - 20150001645 - A MEMS device wherein a die of semiconductor material has a first face and a second face. A membrane is formed in or on the die and faces the first surface. A cap is fixed to the first face of the first die and is spaced apart from the membrane...

Integrated soi pressure sensor having silicon stress isolation member
12/25/14 - 20140374846 - In one embodiment a pressure sensor is provided. The pressure sensor includes a housing having an input port configured to allow a media to enter the housing. A support is mounted within the housing, the support defining a first aperture extending therethrough. A stress isolation member is mounted within the...

Packaging method for mems devices
12/25/14 - 20140374847 - In a method of packaging micro-electro-mechanical systems (MEMS) devices, an interposer board is provided having a first surface and an opposing second surface, with the interposer board including a plurality of electrical contacts on the second surface. A plurality of shim layers are bonded to the first surface of the...

Semiconductor sensor device with metal lid
12/25/14 - 20140374848 - A semiconductor sensor device is packaged using a lid in which one or more dies are mounted to a substrate within the lid housing and one or more other dies are mounted to the substrate outside of the lid housing. The dies located outside of the lid housing may be...

Angular rate sensor with quadrature error compensation
12/25/14 - 20140374849 - An angular rate sensor includes a substrate, a drive mass flexibly coupled to the substrate, and a sense mass suspended above the substrate and flexibly coupled to the drive mass via flexible support elements. An electrode structure is mechanically coupled to, but electrically isolated from, the drive mass and is...

Apparatus and method for shielding and biasing in mems devices encapsulated by active circuitry
12/25/14 - 20140374850 - One or more conductive shielding plates are formed in a standard ASIC wafer top metal layer, e.g., for blocking cross-talk from MEMS device structure(s) on the MEMS wafer to circuitry on the ASIC wafer when the MEMS device is capped directly by the ASIC wafer in a wafer-level chip scale...

Mems device and method for fabricating mems devices
12/25/14 - 20140374851 - A method (60) entails providing a substrate (34) with a structural layer (30) having a thickness (40). A partial etch process is performed at locations (82) on the structural layer (30) so that a portion (92) of the structural layer (30) remains at the locations (82). An oxidation process is...

Electrical shielding in a mems leadframe package
12/25/14 - 20140374852 - A lead frame packaged electronic chip. The packaged electronic chip includes a MEMS device, an integrated circuit and a wire bond electrically coupling the MEMS device and the integrated circuit. The packaged electronic chip is encased in a molding material. The packaged electronic chip further includes a mechanism that shields...

Component including means for reducing assembly-related mechanical stresses and methods for manufacturing same
12/25/14 - 20140374853 - Measures are provided for stress decoupling between a semiconductor component and its mounting support, these measures being implementable very easily, inexpensively and in a space-saving manner, regardless of the substrate thickness of the component, and not being limited to soldered connections but instead also being usable in conjunction with other...

Vertical mount package and wafer level packaging therefor
12/25/14 - 20140374854 - Vertical mount packages and methods for making the same are disclosed. A method for manufacturing a vertical mount package includes providing a device substrate with a plurality of device regions on a front surface, and a plurality of through-wafer vias. MEMS devices or integrated circuits are formed or mounted onto...

Mems structure and method of forming the same
12/18/14 - 20140367805 - A method of forming a MEMS structure, in which an etch stop layer is formed to be buried within the inter-dielectric layer and, during an etch of the substrate and the inter-dielectric layer from backside to form a chamber, the etch stop layer protect the remaining inter-dielectric layer. The chamber...

Functional element, electronic apparatus, and moving object
12/18/14 - 20140367806 - A functional element includes a first electrode section, a second electrode section, a first wiring line connected to the first electrode section, and a second wiring line connected to the second electrode section, the first wiring line is provided with at least one first intersecting section intersecting with a wiring...

Electric device and method of manufacturing the same
12/18/14 - 20140367807 - There is provided an electric device including a base member, a beam elastically deformable to bend upward and having an outline partially defined by a slit formed in the base member, a conductive pattern provided on a top surface of the beam, a contact electrode provided above the conductive pattern,...

Chip arrangement and method for manufacturing a chip arrangement
12/11/14 - 20140361387 - A chip arrangement may include: a mold compound; and a microelectromechanical systems device at least partially embedded in the mold compound....

Microelectronic packages including patterned die attach material and methods for the fabrication thereof
12/04/14 - 20140353772 - Embodiments of microelectronic packages and methods for fabricating microelectronic packages are provided. In one embodiment, the fabrication method includes printing a patterned die attach material onto the backside of a wafer including an array of non-singulated microelectronic die each having an interior keep-out area, such as a central keep-out area....

Method for forming a suspended membrane
12/04/14 - 20140353773 - The present disclosure is directed to a device that includes a substrate and a sensor formed on the substrate. The sensor includes a chamber formed from a plurality of integrated cavities, a membrane above the substrate, the membrane having a plurality of openings, each opening positioned above one of the...

Methods for stiction reduction in mems sensors
12/04/14 - 20140353774 - A method of the invention includes reducing stiction of a MEMS device by providing a conductive path for electric charge collected on a bump stop formed on a substrate. The bump stop is formed by depositing and patterning a dielectric material on the substrate, and the conductive path is provided...

Wafer-level packaging of integrated devices, and manufacturing method thereof
12/04/14 - 20140353775 - A wafer-level packaging, comprising: a first semiconductor body integrating a MEMS structure; a second semiconductor body, including a surface electrical-contact region and an ASIC coupled to the MEMS structure and to said electrical-contact region; a first coating layer, made of resin, which englobes and protects the first body, the second...

Mems structure with adaptable inter-substrate bond
12/04/14 - 20140353776 - A MEMS structure incorporating multiple joined substrates and a method for forming the MEMS structure are disclosed. An exemplary MEMS structure includes a first substrate having a bottom surface and a second substrate having a top surface substantially parallel to the bottom surface of the first substrate. The bottom surface...

Electrical device including a functional element in a cavity
12/04/14 - 20140353777 - A substrate includes a functional element. An insulating first film forms a cavity which stores the functional element, together with the substrate, and includes a plurality of through-holes. An insulating second film covers the plurality of through-holes, is formed on the first film, and has a gas permeability which is...

Capacitive pressure sensing semiconductor device
12/04/14 - 20140353778 - A capacitive pressure sensing semiconductor device is provided, which has pressure resistance against pressure applied by a pressing member and can detect the pressure surely and efficiently. The pressure sensing semiconductor device includes a pressure detecting part, which detects pressure as a change in capacitance, and a package that receives...

Detecting sudden changes in acceleration in semiconductor device or semiconductor packaging containing semiconductor device
11/27/14 - 20140346619 - An approach for detecting sudden changes in acceleration in a semiconductor device or semiconductor package containing the semiconductor device is disclosed. In one embodiment, a piezoelectric sensor is embedded in a semiconductor die. The piezoelectric sensor is configured to sense a mechanical force applied to the semiconductor die. An excessive...

Sensor chip having a micro inductor structure
11/20/14 - 20140339653 - A sensor chip has a supporting structure layer and a micro-inductor layer formed on the supporting structure layer and having an inductance. The micro-inductor layer comprises an insulating layer, at least one magnetic layer, and a micro-coil layer. When an external physical quantity is applied on sensor chip, the micro-inductor...

Micropatterned component and method for manufacturing a micropatterned component
11/20/14 - 20140339654 - A micropatterned component, for measuring accelerations and/or yaw rates, including a substrate having a principal plane of extension of the substrate, an electrode, and a further electrode; the electrode having a principal plane of extension of the electrode, and the further electrode having a principal plane of extension of the...

Mems package structure
11/20/14 - 20140339655 - A MEMS package structure, including a substrate, an interconnecting structure, an upper metallic layer, a deposition element and a packaging element is provided. The interconnecting structure is disposed on the substrate. The MEMS structure is disposed on the substrate and within a first cavity. The upper metallic layer is disposed...

Mems pressure transducer assembly
11/20/14 - 20140339656 - An assembly (20) includes a MEMS die (22) having a pressure transducer device (40) formed on a substrate (44) and a cap layer (38). A packaging process (74) entails forming the device (40) on the substrate, creating an aperture (70) through a back side (58) of the substrate underlying a...

Integrated chip with micro-electro-mechanical system and integrated circuit mounted therein and method for manufacturing the same
11/13/14 - 20140332909 - The invention relates to an integrated chip with an MEMS and an integrated circuit mounted therein and a method for manufacturing the same. The method includes the steps of: S1: providing a first chip, wherein the first chip comprises a first substrate, an MEMS component layer formed on the first...

Chip package and a method of manufacturing the same
10/30/14 - 20140319627 - In various embodiments, a chip package is provided. The chip package may include at least one chip having a plurality of pressure sensor regions and encapsulation material encapsulating the chip....

Physical quantity detection device and physical quantity detector
10/30/14 - 20140319628 - A physical quantity detection device includes a glass substrate, a substrate including a physical quantity detection part and bonded to a first surface of the glass substrate with a hermetically sealed space being formed inside the substrate, and a function membrane formed on a second surface of the glass substrate...

Mems device with stress isolation and method of fabrication
10/23/14 - 20140312435 - A MEMS device (20) includes a proof mass structure (26) and beams (28, 30) residing in a central opening (32) of the proof mass structure (26), where the structure and the beams are suspended over a substrate (22). The beams (28, 30) are oriented such that lengthwise edges (34, 36)...

Method of fabricating mems device having release etch stop layer
10/23/14 - 20140312436 - A method of fabricating a microelectromechanical (MEMS) device includes bonding a transducer wafer to a substrate wafer along a bond interface. An unpatterned transducer layer included within the transducer wafer is patterned. A release etch process is then performed during which a sacrificial layer is exposed to a selected release...

Electronic device, integrated circuit, electronic apparatus, and moving object
10/23/14 - 20140312437 - An electronic device includes a vibrating element that detects a predetermined physical quantity, an integrated circuit that is electrically connected to the vibrating element, and a ceramic package. The ceramic package is provided with a first external terminal and a second external terminal to which a constant potential is supplied....

Physical quantity sensor, electronic apparatus, and moving object
10/23/14 - 20140312438 - A physical quantity sensor includes a sensor element, an integrated circuit that is electrically connected to the sensor element, and a ceramic package (base body) on which the integrated circuit is mounted. A first conductor pattern (interconnection pattern) for electrical connection with the outside is provided on one surface of...

Inertial angular sensor of balanced mems type and method for balancing such a sensor
10/09/14 - 20140299947 - An inertial angular sensor of MEMS type has a support of at least two masses which are mounted movably with respect to the support, at least one electrostatic actuator and at least one electrostatic detector. The masses are suspended in a frame itself connected by suspension means to the support....

Semiconductor devices and methods for manufacturing semiconductor devices
10/02/14 - 20140291779 - A method includes a step of performing a time multiplexed etching process, wherein the last etching step of the time multiplexed etching process is of a first time duration. After performing the time multiplexed etching process, an etching step having a second time duration is performed, wherein the second time...

Mems device and method of manufacturing the same
10/02/14 - 20140291780 - According to one embodiment, a MEMS device including a first electrode provided on a support substrate, a second electrode opposed to the first electrode, having at least one end part overlapping the first electrode, and able to move in a direction it is opposed to the first electrode, and beam...

Method of packaging a mems transducer device and packaged mems transducer device
10/02/14 - 20140291781 - A packaged MEMS transducer device comprising: a die, including: a semiconductor body having a front side and a back side, opposite to one another in a first direction, at least one cavity extending through the semiconductor body between the front side and the back side, and at least one membrane...

Electrical component and method of manufacturing the same
09/25/14 - 20140284729 - According to one embodiment, an electrical component comprises a substrate, a functional element formed on the substrate, a first layer which includes through holes, and forms a cavity that stores the functional element on the substrate, and a second layer which is formed on the first layer, and closes the...

Mems device and method of manufacturing the same
09/25/14 - 20140284730 - According to one embodiment, a MEMS device comprises a first electrode provided on a support substrate, a burying insulating film formed at the sides of the first electrode, and a second electrode opposed to the first electrode, having ends extending outside the ends of the first electrode and able to...

Semiconductor device
09/25/14 - 20140284731 - A semiconductor device includes a substrate that is made of a semiconductor material and has a main surface formed with a recess. The semiconductor device also includes a wiring layer formed on the substrate, an electronic element housed in the recess, and a sealing resin covering at least a part...

Methods of forming buried electromechanical structures coupled with device substrates and structures formed thereby
09/18/14 - 20140264643 - Methods of forming integrated MEMS structures are described. Those methods and structures may include forming at least one MEMS structure on a first substrate, forming a first bonding layer on a top surface of the first substrate, and then coupling the first bonding layer disposed on the first substrate to...

Mems method and structure
09/18/14 - 20140264644 - MEMS structures and methods utilizing a locker film are provided. In an embodiment a locker film is utilized to hold and support a moveable mass region during the release of the moveable mass region from a surrounding substrate. By providing additional support during the release of the moveable mass, the...

Integrated structure with bidirectional vertical actuation
09/18/14 - 20140264645 - A Micro-Electro-Mechanical Systems (MEMS) device includes a first substrate with a first surface and a second surface, the first substrate including a base layer, a moveable beam disposed on the base layer, at least one metal layer, and one or more standoffs disposed on the base layer such that one...

Microelectromechanical system and method
09/18/14 - 20140264646 - A microelectromechanical system, including a first element and a second element, the first element having a first conductive surface facing a second conductive surface of the second element; wherein at least one of the first element and the second element is operable to constrainedly move nearer and farther from the...

Method of forming monolithic cmos-mems hybrid integrated, packaged structures
09/18/14 - 20140264647 - A method of forming a monolithic CMOS-MEMS hybrid integrated, packaged device comprising the steps of: providing a semiconductor substrate; forming MEMS or NEMS materials on the substrate having conductive, structural, or dielectric layers; forming at least one opening(s) on the semiconductor substrate; positioning on the substrate at least one prefabricated...

Mems integrated pressure sensor devices and methods of forming same
09/18/14 - 20140264648 - A method embodiment includes providing a micro-electromechanical (MEMS) wafer including a polysilicon layer having a first and a second portion. A carrier wafer is bonded to a first surface of the MEMS wafer. Bonding the carrier wafer creates a first cavity. A first surface of the first portion of the...

Micromechanical structure and corresponding production process
09/18/14 - 20140264649 - A micromechanical structure includes a substrate, a micromechanical functional structure, and a conductor track arrangement. The substrate has a top side, and the micromechanical functional structure is formed in the substrate on the top side. The conductor track arrangement is formed above the top side of the substrate, and the...