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Physical Deformation

Physical Deformation patent applications listed include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.

Related Categories:

Active Solid-state Devices (e.g., Transistors, Solid-state Diodes)


Responsive To Non-electrical Signal (e.g., Chemical, Stress, Light, Or Magnetic Field Sensors) > Physical Deformation



Mems device
05/28/15 - 20150145074 - A MEMS device includes a fixed electrode and a movable electrode arranged isolated and spaced from the fixed electrode by a distance. The movable electrode is suspended against the fixed electrode by one or more spacers including an insulating material, wherein the movable electrode is laterally affixed to the one...

Mems devices utilizing a thick metal layer of an interconnect metal film stack
05/28/15 - 20150145075 - A MEMS device, such as an accelerometer or gyroscope, fabricated in interconnect metallization compatible with a CMOS microelectronic device. In embodiments, a proof mass has a first body region utilizing a thick metal layer that is separated from a thin metal layer. The thick metal layer has a film thickness...

Semiconductor package and manufacturing method thereof
05/28/15 - 20150145076 - There is provided a semiconductor package including: an application specific integrated circuit (ASIC) chip including a first bump ball and a second bump ball formed inwardly of the first bump ball; a micro electro mechanical system (MEMS) sensor electrically connected to the second bump ball; a lead frame electrically connected...

Method of stacking a plurality of dies to form a stacked semiconductor device, and stacked semiconductor device
05/28/15 - 20150145077 - A method of stacking a plurality of first dies to a respective plurality of second dies, each one of the first dies having a surface including a surface coupling region which is substantially flat, each one of the second dies having a respective surface including a respective surface coupling region...

Mechanisms for forming micro-electro mechanical system device
05/21/15 - 20150137276 - Embodiments of mechanisms for forming a micro-electro mechanical system (MEMS) device are provided. The MEMS device includes a CMOS substrate, a cap substrate, and a MEMS substrate bonded between the CMOS substrate and the cap substrate. The MEMS substrate includes a first movable element and a second movable element. The...

Semiconductor sensor chips
05/21/15 - 20150137277 - Semiconductor sensor chips are provided. In some embodiments, a semiconductor sensor chip can include at least one wire bond pad on one side thereof, at least one bond pad on another, opposite side thereof, and at least one through-silicon via (TSV) extending therebetween and electrically connected to the bond pads...

Semiconductor package with gel filled cavity
05/21/15 - 20150137278 - A semiconductor device package is assembled using a jig that alters the shape of gel material disposed in a cavity in the package. In one embodiment, a jig having a concave bottom surface is inserted onto uncured gel material disposed within a cavity in a housing of the package to...

Multi-die sensor device
05/21/15 - 20150137279 - A semiconductor device includes a lead frame having a flag and leads that surround the flag. The leads include a dummy lead that has first and second wire bonding areas. A first die is attached on the flag and electrically connected to the first wire bonding area. The first die...

Structures and formation methods of micro-electro mechanical system device
05/21/15 - 20150137280 - A structure and a formation method of a micro-electro mechanical system (MEMS) device are provided. The MEMS device includes a cap substrate and a MEMS substrate bonded with the cap substrate. The MEMS substrate includes a first movable element and a second movable element. The MEMS device also includes a...

Physical quantity measurement sensor
05/21/15 - 20150137281 - A physical quantity measurement sensor includes: a ceramic package including a plate provided with a flow port through which a fluid to be measured flows; an electronic component including a sensing element housed in the package to detect the pressure of the fluid to be measured having flown through the...

Flow sensor, method for manufacturing flow sensor and flow sensor module
05/21/15 - 20150137282 - A flow sensor structure seals the surface of an electric control circuit and part of a semiconductor device via a manufacturing method that prevents occurrence of flash or chip crack when clamping the semiconductor device via a mold. The flow sensor structure includes a semiconductor device having an air flow...

Mems devices, packaged mems devices, and methods of manufacture thereof
05/21/15 - 20150137283 - MEMS devices, packaged MEMS devices, and methods of manufacture thereof are disclosed. In one embodiment, a microelectromechanical system (MEMS) device includes a first MEMS functional structure and a second MEMS functional structure. An interior region of the second MEMS functional structure has a pressure that is different than a pressure...

Cmos-mems integrated device including multiple cavities at different controlled pressures and methods of manufacture
05/14/15 - 20150129991 - An integrated MEMS device comprises two substrates where the first and second substrates are coupled together and have two enclosures there between. One of the first and second substrates includes an outgassing source layer and an outgassing barrier layer to adjust pressure within the two enclosures. The method includes depositing...

Micromechanical sensor unit and method for manufacturing micromechanical sensor units
05/07/15 - 20150123217 - A method for manufacturing a micromechanical sensor unit, the micromechanical sensor unit including a substrate and a sealing cap, in the first method step the substrate and the sealing cap being configured and joined in such a way that, as a result of bonding the sealing cap and the substrate,...

Electrode system for a micromechanical component
05/07/15 - 20150123219 - An electrode system for a micromechanical component, including: at least one first functional layer including electrodes formed therein, at least one second functional layer, and at least one third functional layer, the third functional layer being usable as an electrical printed conductor, the third functional layer being at least sectionally...

Low-profile stacked-die mems resonator system
05/07/15 - 20150123220 - A low-profile packaging structure for a microelectromechanical-system (MEMS) resonator system includes an electrical lead having internal and external electrical contact surfaces at respective first and second heights within a cross-sectional profile of the packaging structure and a die-mounting surface at an intermediate height between the first and second heights. A...

Mems device with outgassing shield
04/30/15 - 20150115376 - A capped micromachined device has a movable micromachined structure in a first hermetic chamber and one or more interconnections in a second hermetic chamber that is hermetically isolated from the first hermetic chamber, and a barrier layer on its cap where the cap faces the first hermetic chamber, such that...

Mems device with integrated temperature stabilization
04/30/15 - 20150115377 - An apparatus for providing localized heating as well as protection for a vibrating MEMS device. A cap over a MEMS gyroscope includes an embedded temperature sensor and a heater. The temperature sensor is a trace made of a material with a known temperature/resistance coefficient, which loops back along itself to...

Method for manufacturing a die assembly having a small thickness and die assembly relating thereto
04/30/15 - 20150115378 - A method for manufacturing a die assembly, including the steps of: bonding a first wafer of semiconductor material to a second wafer, the second wafer including a respective semiconductor body having a respective initial thickness and forming an integrated electronic circuit; and subsequently reducing the initial thickness of the semiconductor...

Vibrator, manufacturing method of vibrator, electronic device, electronic apparatus, and moving object
04/23/15 - 20150108591 - A vibrator includes a base, a lid, and a functional element that is stored in a cavity formed by the base and the lid, in which the lid is provided with a sealing hole that penetrates through the lid and a sealing member that air-tightly seals the sealing hole, and...

Method of improving getter efficiency by increasing superficial area
04/16/15 - 20150102432 - The present disclosure relates to a method of gettering that provides for a high efficiency gettering process by depositing a gettering material on a roughened substrate surface, and an associated apparatus. In some embodiments, the method is performed by providing a substrate into a processing chamber having residual gases. One...

Package structure having mems element
04/16/15 - 20150102433 - A package structure having at least an MEMS element is provided, including a chip having electrical connecting pads and the MEMS element; a lid disposed on the chip to cover the MEMS element and having a metal layer provided thereon; first sub-bonding wires electrically connecting to the electrical connecting pads;...

Microelectromechanical device with protection for bonding and process for manufacturing a microelectromechanical device
04/16/15 - 20150102434 - A microelectromechanical device includes: a substrate; a semiconductor die, bonded to the substrate and incorporating a microstructure; an adhesive film layer between the die and the substrate; and a protective layer between the die and the adhesive film layer. The protective layer has apertures, and the adhesive film layer adheres...

Sealed mems devices with multiple chamber pressures
04/09/15 - 20150097253 - A MEMS apparatus has a substrate, a cap forming first and second chambers with the base, and movable microstructure within the first and second chambers. To control pressures, the MEMS apparatus also has a first outgas structure within the first chamber. The first outgas structure produces a first pressure within...

Die bond design for medium pressure sensor
04/02/15 - 20150091107 - A micro-electromechanical pressure transducer formed from a silicon die centers itself on a pedestal, formed from either a metal or a dielectric, by applying a predetermined amount of liquid epoxy adhesive to the square, top surface of the pedestal and allowing the liquid adhesive to distribute itself over the top...

Integrated circuit having varying substrate depth and method of forming same
03/26/15 - 20150084138 - A semiconductor device is formed such that a semiconductor substrate of the device has a non-uniform thickness. A cavity is etched at a selected side of the semiconductor substrate, and the selected side is then fusion bonded to another substrate, such as a carrier substrate. After fusion bonding, the side...

Electronic device
03/19/15 - 20150076626 - According to one embodiment, an electronic device includes a substrate, a first electrode provided stationary above the substrate and used for a variable capacitor, a second electrode provided movable above or below the first electrode and used for the variable capacitor, a first protective insulation film provided on a first...

Package-on-package semiconductor sensor device
03/12/15 - 20150069537 - A semiconductor sensor device has a MCU die and an acceleration-sensing die mounted on a die paddle of a lead frame. The MCU die is connected to leads of the lead frame with first bond wires and the acceleration-sensing die is connected to the MCU die with second bond wires....

Micro-electro-mechanical system device having differential capacitors of corresponding sizes
03/12/15 - 20150069538 - The invention provides a micro-electro-mechanical device having differential capacitor of corresponding sizes, which includes a substrate; a top fixed electrode; a bottom fixed electrode; a mass, having a top electrode and a bottom electrode, wherein the top electrodes form a top capacitor with the top fixed electrode and the bottom...

Sequential wafer bonding
03/05/15 - 20150061044 - Embodiments of methods of fabricating a sensor device includes attaching a first wafer to a sensor wafer with a first bond material, and attaching a second wafer to the sensor wafer with a second bond material, the second bond material having a lower bonding temperature than the first bond material....

Mems device
03/05/15 - 20150061045 - A MEMS device includes a first chip and a MEMS chip. The first chip has a mounting surface and includes at least an integrated circuit. The MEMS chip has a main surface on which a first set of contact pads for contacting the MEMS device and a second set of...

Wafer level method of sealing different pressure levels for mems sensors
03/05/15 - 20150061046 - The present disclosure relates to a method of forming a plurality of MEMs device having a plurality of chambers with different pressures on a substrate, and an associated apparatus. In some embodiments, the method is performed by providing a device wafer having a plurality of microelectromechanical system (MEMs) devices. A...

Capacitive pressure sensors and fabrication methods thereof
03/05/15 - 20150061047 - A capacitive pressure sensor is provided. The capacitive pressure sensor includes a substrate; and a first electrode formed in one surface of the substrate and vertical to the surface of the substrate. The capacitive pressure sensor also includes a second electrode with a portion facing the first sub-electrode, a portion...

Capacitive micro-machined ultrasonic transducer and method of singulating the same
02/26/15 - 20150054095 - A capacitive micro-machined ultrasonic transducer (CMUT) and a method of singulating the same. Singulating CMUTs may include forming first trenches in regions of a device wafer defining a plurality of ultrasonic transducer structures, the device wafer including a plurality of the ultrasonic transducer structures, forming an ultrasonic transducer wafer having...

Reducing mems stiction by introduction of a carbon barrier
02/26/15 - 20150054096 - A mechanism for reducing stiction in a MEMS device by decreasing an amount of carbon from TEOS-based silicon oxide films that can accumulate on polysilicon surfaces during fabrication is provided. A carbon barrier material film is deposited between one or more polysilicon layer in a MEMS device and the TEOS-based...

Device with a micro- or nanoscale structure
02/19/15 - 20150048461 - The component (1) is arranged at least partly in the recess (23). An electrically conducting structure (3) is provided for bridging a gap (6) between the component (1) and the support (2)....

Sensor package and method of forming same
02/19/15 - 20150048462 - A method (70) of forming sensor packages (20) entails providing a sensor wafer (74) having sensors (30) formed on a side (26) positioned within areas (34) delineated by bonding perimeters (36), and providing a controller wafer (82) having control circuitry (42) at one side (38) and bonding perimeters (46) on...

Mems device with differential vertical sense electrodes
02/12/15 - 20150041927 - A MEMS device includes a first sense electrode and a first portion of a sense mass formed in a first structural layer, where the first sense electrode is fixedly coupled with the substrate and the first portion of the sense mass is suspended over the substrate. The MEMS device further...

Wafer encapsulated microelectromechanical structure
02/12/15 - 20150041928 - A cavity is formed within a first substrate together with trenches that separate first and second portions of the first substrate from each other and from the remainder of the first substrate. The first portion of the first substrate is disposed within the cavity and constitutes a microelectromechanical structure, while...

Mems device and method of forming the same
02/05/15 - 20150035089 - A method for forming a MEMS device is provided. The method includes the following steps of providing a substrate having a first portion and a second portion; fabricating a membrane type sensor on the first portion of the substrate; and fabricating a bulk silicon sensor on the second portion of...

Stacked die package for mems resonator system
02/05/15 - 20150035090 - In a packaging structure for a microelectromechanical-system (MEMS) resonator system, a resonator-control chip is mounted on a lead frame having a plurality of electrical leads, including electrically coupling a first contact on a first surface of the resonator-control chip to a mounting surface of a first electrical lead of the...

Process for manufacturing a packaged device, in particular a packaged micro-electro-mechanical sensor, having an accessible structure, such as a mems microphone and packaged device obtained thereby
02/05/15 - 20150035091 - In order to manufacture a packaged device, a die having a sensitive region is bonded to a support, and a packaging mass of moldable material is molded on the support so as to surround the die. During molding of the packaging mass, a chamber is formed, which faces the sensitive...

Sensors and method of operating sensor
02/05/15 - 20150035092 - Sensors and methods of operating sensors are described herein. One sensor includes a number of III-nitride strain sensitive devices and a number of passive electrical components that connects each of them to one of the III-nitride strain sensitive devices....

Inertial and pressure sensors on single chip
02/05/15 - 20150035093 - In one embodiment, the process flow for a capacitive pressures sensor is combined with the process flow for an inertial sensor. In this way, an inertial sensor is realized within the membrane layer of the pressure sensor. The device layer is simultaneously used as z-axis electrode for out-of-plane sensing in...

Assembly and packaging of mems device
01/29/15 - 20150028432 - A Micro Electro Mechanical systems (MEMS) device includes a solder bump on a substrate, a CMOS-MEMS die comprising a CMOS die and a MEMS die, and stud bumps on the CMOS die. The MEMS die is disposed between the CMOS die and the substrate. The stud bumps and the solder...

Encapsulation structure including a mechanically reinforced cap and with a getter effect
01/29/15 - 20150028433 - and in which the Young's modulus of a second material of the mechanical reinforcement portions is higher than that of the first material....

Resonant transducer, manufacturing method therefor, and multi-layer structure for resonant transducer
01/29/15 - 20150028434 - A resonant transducer includes a silicon single crystal substrate, a silicon single crystal resonator disposed over the silicon single crystal substrate, a shell made of silicon, surrounding the resonator with a gap, and forming a chamber together with the silicon single crystal substrate, an exciting module configured to excite the...

Reducing microelectromechanical systems stiction by formation of a silicon carbide layer
01/22/15 - 20150021717 - A mechanism is provided for reducing stiction in a MEMS device by forming a near-uniform silicon carbide layer on silicon surfaces using carbon from TEOS-based silicon oxide sacrificial films used during fabrication. By using the TEOS as a source of carbon to form an antistiction coating, all silicon surfaces can...

Apparatus and method for reduced strain on mems devices
01/22/15 - 20150021718 - A method and apparatus for coupling a MEMS device to a substrate is disclosed. The method includes providing a substrate with a conductor disposed over the substrate, adhering the MEMS device to the substrate, wherein a first elastomer adheres the MEMS device to the substrate. The MEMS device is electrically...

Functional device, electronic apparatus, and moving object
01/22/15 - 20150021719 - A functional device includes a movable body displaceable along a first axis, a fixed section configured to support the movable body in a coupling section, a movable electrode section extending from the movable body, a fixed electrode section arranged to be opposed to the movable electrode section, and an extending...

Device comprising a fluid channel fitted with at least one microelectronic or nanoelectronic system, and method for manufacturing such a device
01/22/15 - 20150021720 - A device comprising a substrate comprising at least one microelectronic and/or nanoelectronic structure comprising at least one sensitive portion and one fluid channel (2) defined between said substrate and a cap (6), where said fluid channel (2) comprises at least two apertures to provide a flow in said channel, where...

Pressure sensor having down-set flag
01/15/15 - 20150014793 - A semiconductor sensor device has a lead frame having an outer frame with wire bond pads and a die pad to which a pressure sensor die is mounted. The die pad is vertically offset from the outer frame and wire bond pads by tie bars that have down set structures....

Integrated circuit provided with a device for detecting its spatial orientation and/or a modification of this orientation
01/15/15 - 20150014794 - An integrated circuit includes a mechanical device for detection of spatial orientation and/or of change in orientation of the integrated circuit. The device is formed in the BEOL and includes an accommodation whose sides include metal portions formed within various metallization levels. A mobile metal component is accommodated within the...

Mems-cmos integrated devices, and methods of integration at wafer level
01/08/15 - 20150008540 - A method for forming an integrated semiconductor device includes providing a first wafer, providing a second wafer, and bonding the first wafer over the second wafer. The first wafer includes a first substrate having a microelectromechanical system (MEMS) device layer. The second wafer includes a second substrate having at least...

Mems pressure sensors and fabrication method thereof
01/08/15 - 20150008541 - A MEMS capacitive pressure sensor is provided. The pressure sensor includes a substrate having a first region and a second region, and a first dielectric layer formed on the substrate. The pressure sensor also includes a first electrode layer formed on the first dielectric layer, and a second dielectric layer...

Mems device incorporating a fluidic path, and manufacturing process thereof
01/01/15 - 20150001645 - A MEMS device wherein a die of semiconductor material has a first face and a second face. A membrane is formed in or on the die and faces the first surface. A cap is fixed to the first face of the first die and is spaced apart from the membrane...

Integrated soi pressure sensor having silicon stress isolation member
12/25/14 - 20140374846 - In one embodiment a pressure sensor is provided. The pressure sensor includes a housing having an input port configured to allow a media to enter the housing. A support is mounted within the housing, the support defining a first aperture extending therethrough. A stress isolation member is mounted within the...

Packaging method for mems devices
12/25/14 - 20140374847 - In a method of packaging micro-electro-mechanical systems (MEMS) devices, an interposer board is provided having a first surface and an opposing second surface, with the interposer board including a plurality of electrical contacts on the second surface. A plurality of shim layers are bonded to the first surface of the...

Semiconductor sensor device with metal lid
12/25/14 - 20140374848 - A semiconductor sensor device is packaged using a lid in which one or more dies are mounted to a substrate within the lid housing and one or more other dies are mounted to the substrate outside of the lid housing. The dies located outside of the lid housing may be...

Angular rate sensor with quadrature error compensation
12/25/14 - 20140374849 - An angular rate sensor includes a substrate, a drive mass flexibly coupled to the substrate, and a sense mass suspended above the substrate and flexibly coupled to the drive mass via flexible support elements. An electrode structure is mechanically coupled to, but electrically isolated from, the drive mass and is...

Apparatus and method for shielding and biasing in mems devices encapsulated by active circuitry
12/25/14 - 20140374850 - One or more conductive shielding plates are formed in a standard ASIC wafer top metal layer, e.g., for blocking cross-talk from MEMS device structure(s) on the MEMS wafer to circuitry on the ASIC wafer when the MEMS device is capped directly by the ASIC wafer in a wafer-level chip scale...

Mems device and method for fabricating mems devices
12/25/14 - 20140374851 - A method (60) entails providing a substrate (34) with a structural layer (30) having a thickness (40). A partial etch process is performed at locations (82) on the structural layer (30) so that a portion (92) of the structural layer (30) remains at the locations (82). An oxidation process is...

Electrical shielding in a mems leadframe package
12/25/14 - 20140374852 - A lead frame packaged electronic chip. The packaged electronic chip includes a MEMS device, an integrated circuit and a wire bond electrically coupling the MEMS device and the integrated circuit. The packaged electronic chip is encased in a molding material. The packaged electronic chip further includes a mechanism that shields...

Component including means for reducing assembly-related mechanical stresses and methods for manufacturing same
12/25/14 - 20140374853 - Measures are provided for stress decoupling between a semiconductor component and its mounting support, these measures being implementable very easily, inexpensively and in a space-saving manner, regardless of the substrate thickness of the component, and not being limited to soldered connections but instead also being usable in conjunction with other...

Vertical mount package and wafer level packaging therefor
12/25/14 - 20140374854 - Vertical mount packages and methods for making the same are disclosed. A method for manufacturing a vertical mount package includes providing a device substrate with a plurality of device regions on a front surface, and a plurality of through-wafer vias. MEMS devices or integrated circuits are formed or mounted onto...

Mems structure and method of forming the same
12/18/14 - 20140367805 - A method of forming a MEMS structure, in which an etch stop layer is formed to be buried within the inter-dielectric layer and, during an etch of the substrate and the inter-dielectric layer from backside to form a chamber, the etch stop layer protect the remaining inter-dielectric layer. The chamber...

Functional element, electronic apparatus, and moving object
12/18/14 - 20140367806 - A functional element includes a first electrode section, a second electrode section, a first wiring line connected to the first electrode section, and a second wiring line connected to the second electrode section, the first wiring line is provided with at least one first intersecting section intersecting with a wiring...

Electric device and method of manufacturing the same
12/18/14 - 20140367807 - There is provided an electric device including a base member, a beam elastically deformable to bend upward and having an outline partially defined by a slit formed in the base member, a conductive pattern provided on a top surface of the beam, a contact electrode provided above the conductive pattern,...

Chip arrangement and method for manufacturing a chip arrangement
12/11/14 - 20140361387 - A chip arrangement may include: a mold compound; and a microelectromechanical systems device at least partially embedded in the mold compound....

Microelectronic packages including patterned die attach material and methods for the fabrication thereof
12/04/14 - 20140353772 - Embodiments of microelectronic packages and methods for fabricating microelectronic packages are provided. In one embodiment, the fabrication method includes printing a patterned die attach material onto the backside of a wafer including an array of non-singulated microelectronic die each having an interior keep-out area, such as a central keep-out area....

Method for forming a suspended membrane
12/04/14 - 20140353773 - The present disclosure is directed to a device that includes a substrate and a sensor formed on the substrate. The sensor includes a chamber formed from a plurality of integrated cavities, a membrane above the substrate, the membrane having a plurality of openings, each opening positioned above one of the...

Methods for stiction reduction in mems sensors
12/04/14 - 20140353774 - A method of the invention includes reducing stiction of a MEMS device by providing a conductive path for electric charge collected on a bump stop formed on a substrate. The bump stop is formed by depositing and patterning a dielectric material on the substrate, and the conductive path is provided...

Wafer-level packaging of integrated devices, and manufacturing method thereof
12/04/14 - 20140353775 - A wafer-level packaging, comprising: a first semiconductor body integrating a MEMS structure; a second semiconductor body, including a surface electrical-contact region and an ASIC coupled to the MEMS structure and to said electrical-contact region; a first coating layer, made of resin, which englobes and protects the first body, the second...

Mems structure with adaptable inter-substrate bond
12/04/14 - 20140353776 - A MEMS structure incorporating multiple joined substrates and a method for forming the MEMS structure are disclosed. An exemplary MEMS structure includes a first substrate having a bottom surface and a second substrate having a top surface substantially parallel to the bottom surface of the first substrate. The bottom surface...

Electrical device including a functional element in a cavity
12/04/14 - 20140353777 - A substrate includes a functional element. An insulating first film forms a cavity which stores the functional element, together with the substrate, and includes a plurality of through-holes. An insulating second film covers the plurality of through-holes, is formed on the first film, and has a gas permeability which is...

Capacitive pressure sensing semiconductor device
12/04/14 - 20140353778 - A capacitive pressure sensing semiconductor device is provided, which has pressure resistance against pressure applied by a pressing member and can detect the pressure surely and efficiently. The pressure sensing semiconductor device includes a pressure detecting part, which detects pressure as a change in capacitance, and a package that receives...

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