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Active Solid-state Devices (e.g., Transistors, Solid-state Diodes) > Responsive To Non-electrical Signal (e.g., Chemical, Stress, Light, Or Magnetic Field Sensors) > Physical Deformation

Physical Deformation

Physical Deformation patent applications listed include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.

04/17/14 - 20140103460 - Mems device and method of manufacturing a mems device
A method for manufacturing a MEMS device is disclosed. Moreover a MEMS device and a module including a MEMS device are disclosed. An embodiment includes a method for manufacturing MEMS devices includes forming a MEMS stack on a first main surface of a substrate, forming a polymer layer on a...

04/17/14 - 20140103461 - Mems devices and fabrication methods thereof
A method for fabricating a MEMS device includes providing a micro-electro-mechanical system (MEMS) substrate having a sacrificial layer on a first side, providing a carrier including a plurality of cavities, bonding the first side of the MEMS substrate on the carrier, forming a first bonding material layer on a second...

04/17/14 - 20140103462 - Mems devices and methods for forming the same
A method includes forming a Micro-Electro-Mechanical System (MEMS) device on a front surface of a substrate. After the step of forming the MEMS device, a through-opening is formed in the substrate, wherein the through-opening is formed from a backside of the substrate. The through-opening is filled with a dielectric material,...

04/17/14 - 20140103463 - Mems sensor package systems and methods
Embodiments relate to sensor and sensing devices, systems and methods. In an embodiment, a micro-electromechanical system (MEMS) device comprises at least one sensor element; a framing element disposed around the at least one sensor element; at least one port defined by the framing element, the at least one port configured...

04/10/14 - 20140097508 - Accelerometer and its fabrication technique
An accelerometer has E-shaped resilient beams to isolate stress and reduce deformation. A top cap silicon wafer and a bottom cap silicon wafer are both coupled with a measurement mass to form a capacitor. The measurement mass has a mass, range-of-motion stops, and resilient beams located within a support frame....

04/03/14 - 20140091404 - Acceleration sensor
A first sensor section installed in an acceleration sensor employs a first elastic member which is elastically movable according to acceleration in the first and third directions and is stiff against acceleration in second direction so as to restrict elasticity in second direction. Thereby, the first sensor section is provided...

04/03/14 - 20140091405 - Hybrid integrated pressure sensor component
A pressure sensor component includes a MEMS component having at least one pattern element that is able to be deflected perpendicular to the component plane, which is equipped with at least one electrode of a measuring capacitor device, and an ASIC component having integrated circuit elements and at least one...

03/27/14 - 20140084392 - Semiconductor device and method of manufacturing the same
After a TEOS oxide film is formed on the surface of a semiconductor device, a PSG film and an SiN film, which have air permeability, are formed on the surface of the TEOS oxide film. Thereafter, a Poly-Si film is formed thereon. A sacrifice layer is removed by a gaseous...

03/27/14 - 20140084393 - Micro electro mechanical systems device
Disclosed herein is a micro electro mechanical systems (MEMS) device including: a mass body; a first fixed part provided at an outer side of the mass body; and a first flexible part having one end connected to a distal end of the mass body and the other end connected to...

03/20/14 - 20140077316 - Wafer bonding and related methods and apparatus
Techniques for bonding wafers together are described. The wafers may be bonded via a eutectic bond. In some instances, one wafer has an integrated circuit and a second wafer has a microelectromechanical systems (MEMS) feature. The wafer with an integrated circuit may have a metal formed thereon for bonding purposes...

03/13/14 - 20140070335 - Electronic device
According to one embodiment, an electronic device includes a drive circuit on a semiconductor substrate, an insulating region including a first insulating part provided on the semiconductor substrate and formed of interlayer insulating films, and a second insulating part provided on the first insulating part, and covering the drive circuit,...

03/13/14 - 20140070336 - Semiconductor device and method for manufacturing the same
Method for manufacturing a semiconductor device includes the steps of forming a lower electrode pattern on a substrate, forming a first interlayer insulating layer on the lower electrode pattern, forming an upper electrode pattern on the first interlayer insulating layer, forming a second interlayer insulating layer on the upper electrode...

03/13/14 - 20140070337 - Integrated circuit including an environmental sensor
An integrated circuit and a method of making the same. The integrated circuit includes a semiconductor substrate including at least one environmental sensor. The integrated circuit also includes a cap layer located on a major surface of the substrate. The integrated circuit further includes at least one elongate channel for...

03/13/14 - 20140070338 - Taxel-addressable matrix of vertical nanowire piezotronic transistors
A tactile sensing matrix includes a substrate, a first plurality of elongated electrode structures, a plurality of vertically aligned piezoelectric members, an insulating layer infused into the piezoelectric members and a second plurality of elongated electrode structures. The first plurality of elongated electrode structures is disposed on the substrate along...

03/13/14 - 20140070339 - Through silicon via including multi-material fill
An apparatus includes a substrate having at least one via disposed in the substrate, wherein the substrate includes a trench having a substantially trapezoidal cross-section, the trench extending through the substrate between a lower surface of the substrate and an upper surface of the substrate, wherein the top of the...

03/13/14 - 20140070340 - Normally closed microelectromechanical switches (mems), methods of manufacture and design structures
Normally closed (shut) micro-electro-mechanical switches (MEMS), methods of manufacture and design structures are provided. A structure includes a beam structure that includes a first end hinged on a first electrode and in electrical contact with a second electrode, in its natural state when not actuated....

03/06/14 - 20140061824 - Mems packaging scheme using dielectric fence
A packaging scheme for MEMS device is provided. A method of packaging MEMS device in a semiconductor structure includes forming an insulation fence that surrounds the MEMS device on the semiconductor structure. The method further includes attaching a wafer of dielectric material to the insulation fence. The lid wafer, the...

02/27/14 - 20140054728 - Semiconductor structures provided within a cavity and related design structures
Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are disclosed. The method includes forming at least one Micro-Electro-Mechanical System (MEMS) cavity. The method for forming the cavity further includes forming at least one first vent hole of a first dimension which is sized to avoid or minimize material...

02/27/14 - 20140054729 - Mems device, electronic apparatus, and manufacturing method of mems device
A MEMS device includes a first oxide film that is laminated on a main surface of a wafer substrate, a lower-layer wire portion that is provided on the first oxide film, a nitride film that is laminated so as to cover the first oxide film and the lower-layer wire portion,...

02/27/14 - 20140054730 - System and method for forming a buried lower electrode in conjunction with an encapsulated mems device
A system and method for forming a sensor device with a buried first electrode includes providing a first silicon portion with an electrode layer and a second silicon portion with a device layer. The first silicon portion and the second silicon portion are adjoined along a common oxide layer formed...

02/27/14 - 20140054731 - Mems pressure sensor with multiple membrane electrodes
In one embodiment, a MEMS sensor includes a first fixed electrode in a first layer, a cavity defined above the first fixed electrode, a membrane extending over the cavity, a first movable electrode defined in the membrane and located substantially directly above the first fixed electrode, and a second movable...

02/13/14 - 20140042562 - Mems devices and methods for forming the same
A device includes a Micro-Electro-Mechanical System (MEMS) wafer having a MEMS device therein. The MEMS device includes a movable element, and first openings in the MEMS wafer. The movable element is disposed in the first openings. A carrier wafer is bonded to the MEMS wafer. The carrier wafer includes a...

02/13/14 - 20140042563 - Integrated circuit with mems element and manufacturing method thereof
An integrated circuit comprising a MEMS (microelectromechanical system) element in a plane of the integrated circuit, the MEMS element being suspended in a cavity over a substrate, said cavity including a first cavity region in said plane spatially separating an edge of the MEMS element from a wall section, said...

02/13/14 - 20140042564 - Integrated-circuit switch
A switch and the manufacturing method thereof are provided. The switch comprises a chip structure providing a one-piece bonding surface. An actuating member of a mechanical switch could receive an external force to contact the one-piece bonding surface so as to actuate the chip structure....

02/06/14 - 20140035071 - Substrate with multiple encapsulated devices
A device with multiple encapsulated functional layers, includes a substrate, a first functional layer positioned above a top surface of the substrate, the functional layer including a first device portion, a first encapsulating layer encapsulating the first functional layer, a second functional layer positioned above the first encapsulating layer, the...

01/23/14 - 20140021561 - Microfabrication of high quality three dimensional structures using wafer-level glassblowing of fused quartz and ultra low expansion glasses
A high temperature micro-glassblowing process and a novel inverted-wineglass architecture that provides self-aligned stem structures. The fabrication process involves the etching of a fused quartz substrate wafer. A TSG or fused quartz device layer is then bonded onto the fused quartz substrate, creating a trapped air pocket or cavity between...

01/23/14 - 20140021562 - Mems device, electronic module, electronic apparatus, and mobile unit
A MEMS device includes: a base substrate; a first wiring disposed on the base substrate using a first structure; a second wiring disposed on the base substrate using the first structure and a second structure connected to the first structure; and a MEMS element connected with the first wiring and...

01/23/14 - 20140021563 - Pressure resistently encapsulated, pressure difference sensor
A pressure difference sensor includes a capsule, which has a ceramic capsule body. The capsule has a transducer seat in its interior, wherein there is arranged in the transducer seat a semiconductor pressure measuring transducer core, which has a measuring membrane body and at least one support body. The measuring...

01/23/14 - 20140021564 - Microelectromechanical gyroscope with enhanced rejection of acceleration noises
An integrated microelectromechanical structure is provided with a driving mass, anchored to a substrate via elastic anchorage elements and designed to be actuated in a plane with a driving movement; and a first sensing mass and a second sensing mass, suspended within, and coupled to, the driving mass via respective...

01/16/14 - 20140015069 - Mems devices, packaged mems devices, and methods of manufacture thereof
MEMS devices, packaged MEMS devices, and methods of manufacture thereof are disclosed. In one embodiment, a microelectromechanical system (MEMS) device includes a first MEMS functional structure and a second MEMS functional structure. An interior region of the second MEMS functional structure has a pressure that is different than a pressure...

01/09/14 - 20140008737 - Cantilever packages for sensor mems (micro-electro-mechanical system)
A packaged sensor MEMS (100) has a semiconductor chip (101) with a protected cavity (102) including a sensor (105), the cavity surrounded by solder bumps (130) attached to the chip terminals; further a leadframe with elongated and radially positioned leads (131), the central lead ends (131a) attached to the bumps....

01/09/14 - 20140008738 - Mems die and methods with multiple-pressure sealing
The present subject matter relates to systems and methods for sealing one or more MEMS devices within an encapsulated cavity. A first material layer can be positioned on a substrate, the first material layer comprising a first cavity and a second cavity that each have one or more openings out...

01/09/14 - 20140008739 - Semiconductor device and method of fabricating same
A wafer structure (88) includes a device wafer (20) and a cap wafer (60). Semiconductor dies (22) on the device wafer (20) each include a microelectronic device (26) and terminal elements (28, 30). Barriers (36, 52) are positioned in inactive regions (32, 50) of the device wafer (20). The cap...

01/02/14 - 20140001577 - Mems device with improved charge elimination and methods of producing same
A method for producing a MEMS device having improved charge elimination characteristics includes providing a substrate having one or more layers, and applying a first charge elimination layer onto at least one portion of one given layer of the substrate. The method may then (1) apply a sacrificial layer onto...

01/02/14 - 20140001578 - Gas pressure measurement cell arrangement
A gas pressure measuring cell configuration has a thermal conduction vacuum cell according to Pirani (Pi), with a measuring chamber housing enclosing a measuring chamber and with a measuring connection which channels the gas pressure P to be measured into the measuring chamber. The measuring chamber has a heatable measuring...

01/02/14 - 20140001579 - Mems pressure sensor and manufacturing method therefor
A Micro Electromechanical System (MEMS) pressure sensor may include a first substrate provided with a sensitive diaphragm of a capacitive pressure sensing unit, an electrical connecting layer and a first bonding layer on a surface of the first substrate; and a second substrate provided with an inter-conductor dielectric layer, a...

12/26/13 - 20130341735 - Anodically bonded strain isolator
A stress isolator that allows a sensor to be attached to materials of the same coefficient of thermal expansion and still provide the required elastic isolation between the sensor and the system to which it is mounted. The isolator is made of two materials, borosilicate glass and silicon. The glass...

12/26/13 - 20130341736 - Packaging compatible wafer level capping of mems devices
This invention discloses and claims a cost-effective, wafer-level package process for microelectromechanical devices (MEMS). Specifically, the movable part of MEMS device is encapsulated and protected while in wafer form so that commodity, lead-frame packaging can be used. An overcoat polymer, such as, epoxycyclohexyl polyhedral oligomeric silsesquioxanes (EPOSS) has been used...

12/26/13 - 20130341737 - Packaging to reduce stress on microelectromechanical systems
One example includes an integrated circuit including at least one electrical interconnects disposed on an elongate are extending away from a main portion of the integrated circuit and a microelectromechanical layer including an oscillating portion, the microelectromechanical layer coupled to the main portion of the integrated circuit....

12/26/13 - 20130341738 - Method for manufacturing a component having an electrical through-connection
A method for manufacturing a component having an electrical through-connection includes: providing a semiconductor substrate having a front side and a back side opposite from the front side; producing, on the front side of the semiconductor substrate, an insulating trench which annularly surrounds a contact area; introducing an insulating material...

12/19/13 - 20130334620 - Mems devices and fabrication methods thereof
A method for fabricating a MEMS device includes providing a micro-electro-mechanical system (MEMS) substrate having a sacrificial layer on a first side, providing a carrier including a plurality of cavities, bonding the first side of the MEMS substrate on the carrier, forming a first bonding material layer on a second...

12/19/13 - 20130334621 - Hybrid integrated component and method for the manufacture thereof
An expansion of the functional scope of a hybrid integrated component including an MEMS element, a cap for the micromechanical structure of the MEMS element, and an ASIC element having circuit components is provided. In this component, the circuit components of the ASIC element interact with the micromechanical structure of...

12/19/13 - 20130334622 - Micromechanical device and method for manufacturing a micromechanical device
A micromechanical device, in particular a sensor device, and a method for manufacturing a micromechanical device are provided. The micromechanical device has a housing, the housing including a first cavity, and the housing including a second cavity that is separate from the first cavity. The micromechanical device is configured in...

12/19/13 - 20130334623 - Mems sensing device and method for the same
The present invention discloses a MEMS sensing device which comprises a substrate, a MEMS device region, a film, an adhesive layer, a cover, at least one opening, and a plurality of leads. The substrate has a first surface and a second surface opposite the first surface. The MEMS device region...

12/19/13 - 20130334624 - Method of providing a semiconductor structure with forming a sacrificial structure
A method for providing a semiconductor structure includes forming a sacrificial structure by etching a plurality of trenches from a first main surface of a substrate. The method further includes covering the plurality of trenches at the first main surface with a cover material to define cavities within the substrate,...

12/12/13 - 20130328139 - Micromachined monolithic 3-axis gyroscope with single drive
This document discusses, among other things, a cap wafer and a via wafer configured to encapsulate a single proof-mass 3-axis gyroscope formed in an x-y plane of a device layer. The single proof-mass 3-axis gyroscope can include a main proof-mass section suspended about a single, central anchor, the main proof-mass...

12/12/13 - 20130328140 - Vibration isolated mems structures and methods of manufacture
A microstructure device has a microstructure (e.g., a circuit card assembly, a printed circuit board, etc.) defining a sensitive axis and one or more isolators configured and adapted to be compliant along the sensitive axis and to be rigid along one or more other axes....

12/12/13 - 20130328141 - Hermetic plastic molded mems device package and method of fabrication
A hermetically packaged microelectromechanical system (MEMS) device has a substrate with an assembly pad (101) and a plurality of terminals (102); a chip (110) with a MEMS mechanical element (111) of a first height (111a) assembled on the pad and connected to the terminals by wires (120) with an insulating...

12/12/13 - 20130328142 - Integrated circuit with pressure sensor and manufacturing method
Disclosed is an integrated circuit (100), comprising a semiconductor substrate (110) carrying a plurality of circuit elements; and a pressure sensor including a cavity (140) on said semiconductor substrate, said cavity comprising a pair of electrodes (120, 122) laterally separated from each other; and a flexible membrane (130) over and...

12/05/13 - 20130320463 - Package structure having mems element and fabrication method thereof
A package structure includes: a substrate having a plurality of first conductive pads and a plurality of second conductive pads; an MEMS element disposed on the substrate; a cover member disposed on the MEMS element and having a metal layer formed thereon; a plurality of bonding wires electrically connected to...

12/05/13 - 20130320464 - Integrally molded die and bezel structure for fingerprint sensors and the like
A biometric sensor device, such as a fingerprint sensor, comprises a substrate to which is mounted a die on which is formed a sensor array and at least one conductive bezel. The die and the bezel are encased in a unitary encapsulation structure to protect those elements from mechanical, electrical,...