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Active Solid-state Devices (e.g., Transistors, Solid-state Diodes) > Responsive To Non-electrical Signal (e.g., Chemical, Stress, Light, Or Magnetic Field Sensors) > Physical Deformation Physical DeformationPhysical Deformation patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.12/13/07 - 20070284681 - Apparatus and method for protective covering of microelectromechanical system (mems) devices A microelectromechanical system (MEMS) assembly includes a MEMS substrate having a plurality of MEMS devices, a plurality of bond pads, and a wafer cap. The wafer cap includes a unitary structure having a plurality of pockets and a plurality of apertures. The wafer cap is fixed to the MEMS substrate ... 12/13/07 - 20070284680 - Method for manufacturing semiconductor device and semiconductor device using the same A method for manufacturing a semiconductor device, includes: forming a protrusive portion on a surface of a semiconductor substrate, forming a thin film on the surfaces of the semiconductor substrate and the protrusive portion, applying a resist on a surface of the thin film so that at least an apex ... 12/06/07 - 20070278600 - Piezo-diode cantilever mems A piezo thin-film diode (piezo-diode) cantilever microelectromechanical system (MEMS) and associated fabrication processes are provided. The method deposits thin-films overlying a substrate. The substrate can be made of glass, polymer, quartz, metal foil, Si, sapphire, ceramic, or compound semiconductor materials. Amorphous silicon (a-Si), polycrystalline Si (poly-Si), oxides, a-SiGe, poly-SiGe, metals, ... 11/15/07 - 20070262401 - Semiconductor device embedded with pressure sensor and manufacturing method thereof The method for promoting the size reduction, the performance improvement and the reliability improvement of a semiconductor device embedded with pressure sensor is provided. In a semiconductor device embedded with pressure sensor, a part of an uppermost wiring is used as a lower electrode of a pressure detecting unit. A ... 10/11/07 - 20070235826 - Devices having horizontally-disposed nanofabric articles and methods of making the same New devices having horizontally-disposed nanofabric articles and methods of making same are described. A discrete electro-mechanical device includes a structure having an electrically-conductive trace. A defined patch of nanotube fabric is disposed in spaced relation to the trace; and the defined patch of nanotube fabric is electromechanically deflectable between a ... 09/27/07 - 20070222007 - Method of manufacturing an electronic device and electronic device A method for manufacturing a micro-electromechanical systems (MEMS) device, comprising providing a base layer (10) and a mechanical layer (12) on a substrate (14), providing a sacrificial layer (16) between the base layer (10) and the mechanical layer (12), providing an etch stop layer (18) between the sacrificial layer (16) ... 09/20/07 - 20070215965 - Micro-mechanical structure and method for manufacturing the same Provided is a micro-mechanical structure and method for manufacturing the same, including a hydrophilic surface on at least a part of a surface of the micro-mechanical structure, so as to prevent generation of an adhesion phenomenon in the process of removing a sacrificial layer to release the micro-mechanical, wherein the ... 09/13/07 - 20070210393 - Lithographic method products obtained and use of said method A lithographic method, products obtained thereby and use of the method, in particular, in the production of micro- or nano-metric products or objects. The method includes the steps of deposition of a film of an organometallic solution of a substrate, containing at least one metal ion as precursor(s) for marking ... 08/30/07 - 20070200187 - Nanowire device and method of making A method (40) for fabricating a nanoscale device, includes nano-imprinting (44) a one dimensional nanostructure (20) on a material (12), forming (46) a patterning layer (22, 26) over the one dimensional nanostructure (20) and the material (12), patterning (48) the patterning layer (22, 26) to differentiate an area over the ... 08/09/07 - 20070181963 - Micro-electromechanical system (mems) based current and magnetic field sensor using tunneling current sensing A micro-electro-mechanical system (MEMS) current sensor for sensing a magnetic field produced by an electrical current flowing in a conductor includes a first fixed element and a moving element. The moving element is spaced away from the first fixed element and is movable relative to the fixed element responsive to ... 08/02/07 - 20070176249 - Semiconductor physical quantity sensor of electrostatic capacitance type and method for manufacturing the same In a semiconductor physical quantity sensor of electrostatic capacitance type, mutually facing peripheral areas (bonding areas) of a glass substrate and a silicon substrate are contacted for anodic bonding, while at the same time, both substrates have an anodic bonding voltage applied therebetween so as to be integrated. A fixed ... 07/26/07 - 20070170528 - Wafer encapsulated microelectromechanical structure and method of manufacturing same There are many inventions described and illustrated herein. In one aspect, the present inventions relate to devices, systems and/or methods of encapsulating and fabricating electromechanical structures or elements, for example, accelerometer, gyroscope or other transducer (for example, pressure sensor, strain sensor, tactile sensor, magnetic sensor and/or temperature sensor), filter or ... 07/12/07 - 20070158769 - Integrated cmos-mems technology for wired implantable sensors Disclosed are wired implantable integrated CMOS-MEMS sensors and fabrication methods. A first ceramic substrate comprising a biocompatible material such as fused silica is provided. A polysilicon layer is formed on the first substrate. An integrated circuit is fabricated adjacent to the surface of the first substrate. A passivation layer is ... 07/12/07 - 20070158768 - Electrical contacts formed of carbon nanotubes An apparatus and method for a micromachined mechanical switch device having first and second cooperating electrical switch contacts formed by respective first and second patterns of robust carbon nanotube thin film structures for forming intermittent electrical contact between the first and second conductors in response to the applied force urging ... 07/12/07 - 20070158767 - Out-of-plane electrostatic actuator A micro-electromechanical device includes a semiconductor substrate and an arm coupled to the substrate. The arm is pivotable out-of-plane relative to the substrate and at least a portion of the arm is deformable. The deformable portion of the arm deforms as the arm pivots relative to the substrate. ... 06/28/07 - 20070145501 - Semiconductor device having a suspended micro-system A method is provided for fabricating a semiconductor device that includes a suspended micro-system. According to the method, a silicon porous layer is formed above a silicon substrate, and the silicon porous layer is oxidized. An oxide layer is deposited, and a first polysilicon layer is deposited above the oxide ... 06/14/07 - 20070132047 - Method for manufacturing a microelectromechanical component, and a microelectromechanical component The invention relates to microelectromechanical components, like microelectromechanical gauges used in measuring e.g. acceleration, angular acceleration, angular velocity, or other physical quantities. The microelectromechanical component, according to the invention, comprises, suitably bonded to each other, a microelectromechanical chip part sealed by a cover part, and at least one electronic circuit ... 06/14/07 - 20070132046 - Nanotube based nonvolatile memory device and a method of fabricating and operating the same Provided are a nonvolatile memory device and methods of fabricating and operating the same. The memory device may include a substrate, at least a first and a second electrode on the substrate to be spaced a distance from each other, a conductive nanotube between the first and second electrodes and ... 06/07/07 - 20070126071 - Process for manufacturing thick suspended structures of semiconductor material A process for manufacturing a suspended structure of semiconductor material envisages the steps of: providing a monolithic body of semiconductor material having a front face; forming a buried cavity within the monolithic body, extending at a distance from the front face and delimiting, with the front face, a surface region ... 05/31/07 - 20070120207 - Torsion spring for mems structure A torsion spring for a micro-electro-mechanical system (MEMS) structure is provided. The torsion spring is connected between a pivoting member and a fixed member and supports the pivoting member so that the pivoting member can pivot about the torsion spring. The torsion spring includes: a horizontal beam; at least one ... 05/24/07 - 20070114623 - Method for manufacturing a microelectromechanical component, and a microelectromechanical component The invention relates to microelectromechanical components, like microelectromechanical gauges used in measuring e.g. acceleration, angular acceleration, angular velocity, or other physical quantities. The microelectromechanical component, according to the invention, comprises a microelectromechanical chip part, sealed by means of a cover part, and an electronic circuit part, suitably bonded to each ... 05/17/07 - 20070108541 - Integrated electronic microphone and a method of manufacturing The present invention provides an integrated electronic microphone formed as part of a semiconductor device, and a manufacturing method therefor. The microphone is formed with a sensing electrode as part of a sensing membrane, and the sensing electrode is connected to the gate of a sensing transistor to provide an ... 04/26/07 - 20070090475 - Mems performance improvement using high gravity force conditioning A system for conditioning a sensor die. The sensor die may have a sensor wafer and a substrate wafer anodically bonded together. The sensor die may have an inertial device such as an accelerometer or a gyroscope. The device has a scale factor that may change with a bowing of ... 04/05/07 - 20070075387 - Bi-directional released-beam sensor An acceleration sensor includes a semiconductor substrate, a first layer formed on the substrate, a first aperture within the first layer, and a beam coupled at a first end to the substrate and suspended above the first layer for a portion of the length thereof. The beam includes a first ... 03/22/07 - 20070063297 - Displacement detection device In a displacement detection device having an IC chip for a regulation plate, silicon broken pieces might drop from loose chippings during assembling or using the device and affect properties of the displacement detection device. By setting an angle of grinding traces on an IC chip wafer of chip with ... 03/08/07 - 20070052046 - Pressure sensors and methods of making the same A pressure sensor includes a base substrate silicon fusion bonded to a cap substrate with a chamber disposed between the base substrate and the cap substrate. Each of the base substrate and the cap substrate include silicon. The base substrate includes walls defining a cavity and a diaphragm portion positioned ... 02/22/07 - 20070040231 - Partially etched leadframe packages having different top and bottom topologies A package for a micro-electromechanical (MEMS) device is described. A premolded leadframe base has opposing top and bottom surfaces. Each surface is defined by a topology having at least one electrically conductive portion and at least one electrically non-conductive portion, and the topology of the top surface differs from the ... 02/15/07 - 20070034976 - Micromechanical capacitive transducer and method for manufacturing the same A micromechanical capacitive converter and a method for manufacturing a micromechanical converter comprise a movable membrane and an electrically conductive face element in a carrier layer. The electrically conductive face element is arranged opposite the membrane above a cavity. The electrically conductive face element and the carrier layer are perforated ... 02/15/07 - 20070034975 - Nanotube semiconductor structures with varying electrical properties There is disclosed a nanotube sensor which essentially employs a straight or twisted nanotube deposited on a supporting surface, such as silicon, silicon dioxide and some other semiconductor or metal material. The nanotube is basically a graphite device which is now subjected to stress causing the electrical characteristics of the ... 01/04/07 - 20070001250 - Micromachine and method of fabricating the same A micromachine successfully reduced in parasitic capacity between input and output electrodes, and having an oscillator configured as ensuring a high S/N ratio under operation at higher frequencies is disclosed. The micromachine comprises an insulating layer formed on a substrate; a first electrode for signal input formed on the insulating ... 12/28/06 - 20060289955 - Semiconductor composite device and method of manufacturing the same The present invention provides a semiconductor composite device including a semiconductor device formed on or in a substrate, an insulating film formed on the substrate so as to cover the semiconductor device, a micro electro mechanical portion formed on the insulating film, and a wiring layer connected to the semiconductor ... 12/28/06 - 20060289954 - Method for processing a mems/cmos cantilever based memory storage device A method is disclosed. The method includes fabricating microelectromechanical (MEMS) structures of a Seek and Scan Probe (SSP) memory device on a first wafer, and fabricating CMOS and memory medium components of the SSP memory device on a second wafer. ... 12/14/06 - 20060278942 - Antistiction mems substrate and method of manufacture A composite wafer for fabricating MEMS devices is provided with a plurality of antistiction bumps, buried under a device layer of the composite wafer. The antistiction bumps are prepared lithographically, by patterning an antistiction material prior to the assembly of the composite wafer. ... 12/07/06 - 20060273417 - Authentication system having a flexible imaging pressure sensor A sensor for a textured surface (e.g., a fingerprint) is provided. The sensor includes a flexible substrate and a flexible membrane supported above the substrate by one or more spacers. The sensor also includes multiple pressure sensor elements responsive to a separation between parts of the membrane and corresponding parts ... 11/09/06 - 20060249801 - Semiconductor device A semiconductor device has a first substrate and a second substrate. The first substrate has first electrodes on at least one surface. The second substrate has concave portions on a surface, and second electrodes provided on bottom surfaces of the concave portions. The semiconductor device further has metallic members located ... 10/26/06 - 20060237806 - Micromachined microphone and multisensor and method for producing same A micromachined microphone is formed from a silicon or silicon-on-insulator (SOI) wafer. A fixed sensing electrode for the microphone is formed from a top silicon layer of the wafer. Various polysilicon microphone structures are formed above a front side of the top silicon layer by depositing at least one oxide ... 10/12/06 - 20060226502 - Microelectromechanical systems (mems) device including a superlattice A microelectromechanical system (MEMS) device may include a substrate and at least one movable member supported by the substrate. The at least one movable member may include a superlattice including a plurality of stacked groups of layers with each group of layers of the superlattice comprising a plurality of stacked ... 10/12/06 - 20060226501 - Collapsing zipper varactor with inter-digit actuation electrodes for tunable filters According to one embodiment a microelectromechanical (MEMS) switch is disclosed. The MEMS switch includes a substrate, a plurality of actuation electrodes mounted on the substrate, a plurality of bottom electrodes mounted on the substrate, a capacitor having subcomponents mounted on the two or more bottom electrodes and a top bendable ... 10/05/06 - 20060220160 - Structure of a structure release and a method for manufacturing the same A structure of a structure release and a manufacturing method are provided. The structure and manufacturing method are adapted for an interference display cell. The structure of the interference display cell includes a first electrode, a second electrode and at least one supporter. The second electrode has at least one ... 09/28/06 - 20060214246 - Methods and apparatuses for microelectronic assembly having a material with a variable viscosity around a mems device Various methods and apparatuses are described in which a micro-electro-mechanical systems (MEMS) device is encapsulated with a material having a variable viscosity with a viscosity value high enough to retard foreign material from contacting the MEMS device during an electronic package assembly process. The material having the variable viscosity may ... 09/21/06 - 20060208329 - Semiconductor device including semiconductor memory element and method for producing same A wafer, in which a plurality of rectangular regions are defined on the face of the wafer by streets arranged in a lattice pattern, and a semiconductor memory element is disposed in each of the rectangular regions, is divided along the streets to separate the rectangular regions individually, thereby forming ... 09/21/06 - 20060208328 - Electrostatic micro switch, production method thereof, and apparatus provided with electrostatic micro switch An electrostatic micro switch includes a fixed electrode disposed on a fixed substrate; a movable substrate elastically supported by the fixed substrate, the movable substrate including a movable electrode facing the fixed electrode. The movable substrate includes a semiconductor including a plurality of regions having different values of resistivity and ... 09/14/06 - 20060202289 - Electrochemical device An electrochemical transistor device is provided, which comprises a flexible substrate; a layer of organic material, which comprises a source portion, a drain portion and a transistor channel portion; a gate electrode arranged on said substrate separated from said layer of organic material; and a layer of solidified electrolyte arranged ... 08/31/06 - 20060192260 - Process for packaging micro-components using a matrix A process for packaging a number of micro-components on the same substrate wafer, in which each micro-component is enclosed in a cavity. This process includes making a covering plate comprising a re-useable matrix, a polymer layer, and a metal layer; covering the wafer with the covering plate; applying a contact ... 08/24/06 - 20060186494 - Semiconductor relay A semiconductor relay includes an essentially parallelepiped-shaped housing that has a fastening side and four lateral surfaces, which are perpendicular thereto, and has a front side, which is opposite the fastening side. These lateral surfaces and front side serve as connecting sides. At least one electrical connecting element and at ... 08/17/06 - 20060180883 - Micro-oscillating element and method of making the same A micro-oscillating element includes a frame, a movable functional portion, and a torsional joint for joining the frame and the functional portion. The micro-oscillating element also includes first and second comb-tooth electrodes for generation of the driving force for the oscillating motion of the movable functional portion about the torsional ... 07/20/06 - 20060157808 - Electronic component having micro-electrical mechanical system An electronic component includes a semiconductor substrate having a first surface and a second surface opposite to the first surface, a cavity that penetrates from the first surface to the second surface of the semiconductor substrate, and an electrical mechanical element that has a movable portion formed above the first ... 07/20/06 - 20060157807 - Three dimensional high aspect ratio micromachining Multi-level structures are formed in a semiconductor substrate by first forming a pattern of lines or structures of different widths. Width information on the pattern is decoded by processing steps into level information to form a MEMS structure. The pattern is etched to form structures having a first floor. The ... 06/29/06 - 20060138573 - Bi-directional released-beam sensor An acceleration sensor includes a semiconductor substrate, a first layer formed on the substrate, a first aperture within the first layer, and a beam coupled at a first end to the substrate and suspended above the first layer for a portion of the length thereof. The beam includes a first ... 06/22/06 - 20060131679 - Systems and methods for electrical contacts to arrays of vertically aligned nanorods Systems and methods may provide electrical contacts to an array of substantially vertically aligned nanorods. The nanorod array may be fabricated on top of a conducting layer that serves as a bottom contact to the nanorods. A top metal contact may be applied to a plurality of nanorods of the ... 06/15/06 - 20060125033 - Sensor platform using a non-horizontally oriented nanotube element Sensor platforms and methods of making them are described. A platform having a non-horizontally oriented sensor element comprising one or more nanostructures such as nanotubes is described. Under certain embodiments, a sensor element has or is made to have an affinity for an analyte. Under certain embodiments, such a sensor ... 06/08/06 - 20060118895 - Electrostatic/electrostrictive actuation of elastomer structures using compliant electrodes A valve structure comprises an elastomeric block formed with first and second microfabricated recesses separated by a membrane portion of the elastomeric block. The valve is actuated by positioning a compliant electrode on a first side of the first recess proximate to and in physical communication with the membrane. Where ... 06/01/06 - 20060113618 - Microelectronic device with anti-stiction coating One embodiment of a microelectronic device includes a movable plate including a lower surface, a bump positioned on the lower surface, and an anti-stiction coating positioned only on the bump. ... 05/04/06 - 20060091485 - Piezoelectric device and manufacturing method thereof A surface acoustic wave device includes a SAW element having an IDT provided on a piezoelectric substrate and electroconductive pads connected to the IDT, and a bonding substrate having electroconductive pad through holes bonded by an adhesive layer so as to face the IDT. A protective space is provided by ... 05/04/06 - 20060091484 - Micro electromechanical systems thermal switch A Micro Electro-Mechanical Systems (MEMS) thermal switch. The switch includes a FET having a source and drain in a substrate and a beam isolated from the substrate, wherein the beam is a monolithic beam. The beam is positioned over the source and the drain and spaced by a predefined gap. ... 04/27/06 - 20060086995 - Temperature-compensated micro-electromechanical device, and method of temperature compensation in a micro-electromechanical device A micro-electromechanical device includes a semiconductor body, in which at least one first microstructure and one second microstructure of reference are integrated. The first microstructure and the second microstructure are arranged in the body so as to undergo equal strains as a result of thermal expansions of the body. Furthermore, ... 04/27/06 - 20060086994 - Nanoelectromechanical components A nanotube device is disclosed which includes a nanotube with a longitudinal and a lateral extension, a structure for supporting at least a first part of the nanotube, and a first device for exerting a force upon the nanotube in a first direction defined by its lateral extension. At least ... 04/13/06 - 20060076634 - Method and system for packaging mems devices with incorporated getter Methods and systems for packaging MEMS devices such as interferometric modulator arrays are disclosed. One embodiment of a MEMS device package structure includes a seal with a chemically reactant getter. Another embodiment of a MEMS device package comprises a primary seal with a getter, and a secondary seal proximate an ... 03/30/06 - 20060065942 - Mechanism to prevent actuation charging in microelectromechanical actuators According to one embodiment a microelectromechanical (MEMS) switch is disclosed. The MEMS switch includes a top movable electrode, and an actutaion electrode with an undoped polysilicon stopper region to contact the top movable electrode when an actuation current is applied. The undoped polysilicon stopper region prevents actuation charging that accumulates ... 03/16/06 - 20060054984 - Mos transistor with a deformable gate A MOS transistor with a deformable gate formed in a semiconductor substrate, including source and drain areas separated by a channel area extending in a first direction from the source to the drain and in a second direction perpendicular to the first one, a conductive gate beam placed at least ... 03/16/06 - 20060054983 - Post-release capacitance enhancement in micromachined devices and a method of performing the same A MEMS device which utilizes a capacitive sensor or actuator is enhancement by initially fabricating the capacitive assembly which comprises the sensor or actuator as two sets of interdigitated fingers in a noninterdigitated configuration. One of the two sets of fingers is coupled to a movable stage. The stage is ... 03/09/06 - 20060049471 - Encapsulated microstructure and method of producing one such microstructure A microstructure including in a first layer insulated from a substrate by an insulator layer at least one sensitive element connected to at least one contact pad by an electrical connection and protected by a package cap. The sensitive element, the electrical connection, and the contact pad form an assembly ... 01/26/06 - 20060017125 - Vibration type mems switch and fabricating method thereof A vibration type MEMS switch and a method of fabricating the vibration type MEMS switch. The vibration type MEMS switch includes a vibrating body supplied with an alternating current voltage of a predetermined frequency to vibrate in a predetermined direction; and a stationary contact point spaced apart from the vibrating ... 01/12/06 - 20060006484 - Functional material for micro-mechanical systems A MEMS device includes a first material structure. A second material structure includes TiN. The second material structure is moveable relative to the first material structure. ... 01/12/06 - 20060006483 - Silicon microphone A solid-state transducer is disclosed. The transducer comprises a semi-conductor substrate forming a support structure and having an opening. A thin-film structure forming a diaphragm responsive to fluid-transmitted acoustic pressure is disposed over the opening. The transducer further includes a plurality of semi-conductor supports and tangential arms extending from the ... 01/05/06 - 20060001114 - Apparatus and method of wafer level package An apparatus of wafer level package for the micro elements and methods of fabricating the same is disclosed. The apparatus is utilized to provide a lid substrate for bonding the lid substrate to a substrate having several micro elements and therefore form a cavity capable of being operated for the ... 12/15/05 - 20050275047 - Stress wave sensor Method and device for sensing stress waves. One embodiment is a method that includes providing a bendable support with one or more mounts each located at an end of the support; attaching a semiconductor element containing a plurality of piezoresistors, each having impedance, to the support; connecting the support to ... 12/08/05 - 20050269655 - Mems scanning mirror with trenched surface and tapered comb teeth for reducing inertia and deformation A micro-electro-mechanical system (MEMS) device includes a mirror having a top surface with trenches, a beam connected to the mirror, rotational comb teeth connected to the beam, and one or more springs connecting the beam to a bonding pad. The mirror can have a bottom surface for reflecting light. Stationary ... 12/08/05 - 20050269654 - Pressure sensor A pressure sensor chip includes a diaphragm and pads. A flexible printed circuit board (FPC) includes a resin sheet having a through-hole and wiring patterns that are formed within the resin sheet and sealed. The resin sheet is press-fitted to the pressure sensor chip such that the diaphragm is bared ... 12/08/05 - 20050269653 - Data recording device comprising a diaphragm-type support The invention concerns a data recording device comprising a two-dimensional array of microtips (3), whereof the apex is generally of nanometric dimensions arranged opposite a storage medium consisting of a flexible diaphragm (2) borne by a frame (1) forming a plurality of cells. At least one microtip (3) is associated ... 12/01/05 - 20050263837 - Bump style mems switch A microelectromechanical system switch may be formed with a protrusion defined on the substrate which makes contact with a deflectable member arranged over the substrate. The deflectable member may, for example, be a cantilevered arm or a deflectable beam. The protrusion may be formed in the substrate in one embodiment ... 12/01/05 - 20050263836 - Fingerprint sensor package A fingerprint sensor package includes an LSI chip for reading a fingerprint, a substrate having an external connection terminal and to which the LSI chip is fixed, and a chip fixing mechanism for fixing the LSI chip in a state where the LSI chip is deformed so as to form ... 11/17/05 - 20050253209 - Anchors for microelectromechanical systems having an soi substrate, and method of fabricating same There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device having mechanical structures and anchors to secure the mechanical structures to the substrate. The anchors of the present invention are comprised ... 11/17/05 - 20050253208 - Semiconductor micro device A semiconductor micro device is provided with a rectangular silicon micro structure chip; a lead frame having a die pad for securing the silicon structure chip comprising a contact portion with the chip; and a resin encapsulating material for encapsulating the silicon structure chip and part of the lead frame; ... 11/17/05 - 20050253207 - Microelectronic assembly having a perimeter around a mems device A microelectronic assembly is provided having a MEMS substrate, a MEMS device on the MEMS substrate, the MEMS device having a MEMS component which is movable relative to the MEMS substrate, a cover piece having a side over a side of the MEMS substrate on which the MEMS device is ... 10/27/05 - 20050236682 - Method of manufacturing mems device The present invention provides a method of manufacturing MEMS devices, comprising the steps of forming MEMS device bodies in a first substrate, defining concave portions around the MEMS device bodies over the first substrate, forming convex portions coincident with the concave portions in a second substrate, fitting the convex portions ... 10/20/05 - 20050230768 - Pressure sensor device and method Embodiments of the present invention provide a diaphragm pressure gauge with an interface printed circuit board (“PCB”) contained in a reference pressure chamber of the diaphragm pressure gauge for receiving signals from one or more sensing elements in the reference pressure chamber. The sensing elements can comprise, for example, piezoelectric ... 10/13/05 - 20050224900 - Electro-mechanical device and method of producing the same Briefly, embodiments of the present invention provide an electro-mechanical device, for example, a Micro-Electro-Mechanical Systems (MEMS) device, for example, a low-loss Film Bulk Acoustic Resonators (FBAR) filter, and a process to produce the same. ... 10/06/05 - 20050218466 - Thin-film lamination, and actuator device, filter device, ferroelectric memory, and optical deflection device employing the thin -film lamination A thin-film lamination includes: a monocrystal substrate; an intermediate layer having zirconia as a main constituent produced in an epitaxial growth manner on the monocrystal substrate; a C-rare earth structure film comprising oxide having a C-rare earth crystal structure produced on the intermediate layer in an epitaxial growth manner; and ... 09/29/05 - 20050212067 - Microelectromechanical devices with lubricants and getters formed thereon The present invention provides a packaged microelectromechanical device having a plurality of deflectable elements formed on a substrate that has a getter and/or a lubricant disposed thereon. The substrate can be a glass substrate or a semiconductor wafer. The lubricant and/or getter can be disposed on the substrate or held ... 09/29/05 - 20050212066 - Microfabricated hot wire vacuum sensor A microfabricated vacuum sensor may be formed using semiconductor integrated circuit processes. The sensor may be formed inside an enclosure with a microfabricated component. The sensor may then be used to measure the pressure within the enclosure. ... 09/22/05 - 20050205950 - Compact pressure sensor with high corrosion resistance and high accuracy A pressure sensor includes a sensor chip and a circuit chip. The sensor chip, which is configured to generate an electrical signal representative of a pressure being sensed, has a surface including a sensing area and a plurality of electrical contact pads disposed on the surface. The circuit chip includes ... 09/22/05 - 20050205949 - Semiconductor device having moving part A semiconductor device includes a semiconductor layer supported by a support substrate etched to form a moving part released from the support substrate. The moving part has a plurality of portions extending in directions different from each other. A plurality of through-holes is formed as slender holes elongated along a ... 09/15/05 - 20050199972 - Bulk wave resonator and bulk wave filter A bulk wave resonator comprising: a substrate (1); a layer (3) of piezoelectric material deposited on the substrate; a first electrode (2) and a second electrode (4) which are arranged on opposite surfaces of the layer (3) of piezoelectric material, the overlapping area of the first electrode (2) and second ... 09/08/05 - 20050194651 - Physical quantity sensor A physical quantity sensor is constituted using a plurality of piezoelectric sensors each having first and second semiconductor layers realizing resistances and terminals, and a conductive weight portion in relation to an opening of an insulating film that partially exposes the main surface of a substrate. Both the semiconductor layers ... 08/25/05 - 20050184351 - Mems scanning mirror with trenched surface and tapered comb teeth for reducing inertia and deformation A micro-electro-mechanical system (MEMS) device includes a mirror having a top surface with trenches, a beam connected to the mirror, rotational comb teeth connected to the beam, and one or more springs connecting the beam to a bonding pad. The mirror can have a bottom surface for reflecting light. Stationary ... 08/18/05 - 20050179100 - Micromechanical capacitive transducer and method for producing the same A micromechanical capacitive converter and a method for manufacturing a micromechanical converter comprise a movable membrane and an electrically conductive face element in a carrier layer. The electrically conductive face element is arranged opposite the membrane above a cavity. The electrically conductive face element and the carrier layer are perforated ... 06/30/05 - 20050139942 - Capacitive pick-off and electrostatic rebalance accelerometer having equalized gas damping A Micro Electro-Mechanical System (MEMS) acceleration sensing device, formed of a an elongated sensing element of substantially uniform thickness suspended for motion relative to a rotational axis offset between first and second ends thereof such that a first portion of the sensing element between the rotational axis and the first ... 06/30/05 - 20050139941 - Wide band cross point switch using mems technology The input to each MEMS is electrically separated from the output and from the control by a third conductor (534,550,532,530) connected to the first (grounded) conductor (502). The third conductor traverses one or more of the insulating layers thereby acting as a shield and precluding the high frequency signals presented ... // - 64 MEMS structures (e.g. 540,708,716,718, 720) are mounted on the top surface. Each MEMS has an input, an output, and a control. The input connected to the second conductor. The output is connected to a coplanar waveguide (508) placed on the top surface (500). The control is connected to the bottom surface. - ... ### FreshPatents.com Support |