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Active Solid-state Devices (e.g., Transistors, Solid-state Diodes) > Responsive To Non-electrical Signal (e.g., Chemical, Stress, Light, Or Magnetic Field Sensors)

Responsive To Non-electrical Signal (e.g., Chemical, Stress, Light, Or Magnetic Field Sensors)

Responsive To Non-electrical Signal (e.g., Chemical, Stress, Light, Or Magnetic Field Sensors) patent applications listed include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.

10/02/14 - 20140291778 - Integrated device of a capacitive type for detecting humidity, in particular manufactured using a cmos technology
An integrated capacitive-type humidity sensor formed in a semiconductor chip integrating a sensing capacitor and a reference capacitor. Each of the sensing and reference capacitors have at least a first electrode and at least a second electrode, the first and second electrodes of each of the sensing and reference capacitors...

09/18/14 - 20140264642 - Gas sensor
A gas sensor comprises a set of one or more sensor cells (SC) and a substrate (1). Each sensor cell (SC) of the set comprises a sensitive film (42) built from a sensitive material (4) covering an area of the substrate (1). One or more elevated structures (2) are manufactured...

09/11/14 - 20140252505 - Semiconductor analysis microchip and method of manufacturing the same
According to one embodiment, a semiconductor analysis microchip configured to detect a fine particle in a sample liquid, including a semiconductor substrate, a first flow channel provided in the semiconductor substrate, to which the sample liquid is introduced, and a pore provided in the first flow channel and configured to...

08/21/14 - 20140231933 - Gas sensor and manufacturing method thereof
Provided is a gas sensor including a substrate, a sensing electrode extended in a first direction on the substrate, and a plurality of heaters disposed in a second direction crossing the first direction on the substrate. The plurality of heaters is separated at both sides of the sensing electrode. The...

08/14/14 - 20140225202 - Chemical sensor and method for manufacturing such a chemical sensor
The invention relates to a chemical sensor (1) comprising a substrate layer (2) having a front surface (2.1) and a back surface (2.2) and a sensing layer (3) arranged on the front surface (2.1) of the substrate layer (2), the sensing layer (3) comprising a sensing element (4) and the...

07/17/14 - 20140197500 - Capacitive sensor integrated onto semiconductor circuit
There is disclosed a capacitive sensor on a passivation layer of a semiconductor circuit such as an ASIC, and a method for manufacturing such sensor. The system and method may comprise: forming a bottom electrode layer and landing pad on a portion of the passivation layer located over active circuitry...

07/03/14 - 20140183667 - Nanopore sensor device
A pair of electrode plates can be provided by directional deposition and patterning of a conductive material on sidewalls of a template structure on a first dielectric layer. An electrode line straddling the center portion is formed. A dielectric spacer and a conformal conductive layer are subsequently formed. Peripheral electrodes...

07/03/14 - 20140183668 - Nanopore sensor device
A pair of electrode plates can be provided by directional deposition and patterning of a conductive material on sidewalls of a template structure on a first dielectric layer. An electrode line straddling the center portion is formed. A dielectric spacer and a conformal conductive layer are subsequently formed. Peripheral electrodes...

06/26/14 - 20140175570 - Dual-side micro gas sensor and method of fabricating the same
Provided are a dual-side micro gas sensor and a method of fabricating the same. The sensor may include an elastic layer, a heat-generating resistor layer on the elastic layer, an interlayered insulating layer on the heat-generating resistor layer, an upper sensing layer on the interlayered insulating layer, and a lower...

06/12/14 - 20140159173 - Semiconductor device having au-cu electrodes, and method of manufacturing semiconductor device
A method of manufacturing a biosensor semiconductor device in which copper electrodes at a major surface of the device are modified to form Au—Cu alloy electrodes. Such modification is effected by depositing a gold layer over the device, and then thermally treating the device to promote interdiffusion between the gold...

05/01/14 - 20140117468 - Methods and integrated circuit package for sensing fluid properties
An integrated circuit package for sensing fluid properties includes: a substrate made of semiconductor material; a fluid property measurement circuit formed on the substrate; and a sensor circuit coupled to the fluid property measurement circuit within a same integrated circuit package. The sensor circuit is configured to generate a field...

03/27/14 - 20140084390 - Chemical sensor
In a method for manufacturing a chemical sensor with multiple sensor cells, a substrate is provided and an expansion inhibitor is applied to the substrate for preventing a sensitive material to be applied to an area on the substrate for building a sensitive film of a sensor cell to expand...

03/27/14 - 20140084391 - Composite reconstituted wafer structures
A reconstituted electronic device comprising at least one die and at least one passive component. A functional material is incorporated in the substrate of the device to modify the electrical behaviour of the passive component. The passive component may be formed in redistribution layers of the device. Composite functional materials...

03/20/14 - 20140077314 - Integrated circuit comprising a capacitive gas sensor
An integrated circuit and a method of making the same. The integrated circuit includes a capacitive gas sensor on a semiconductor substrate. The gas sensor includes first and second capacitor electrodes on the substrate. The gas sensor also includes a gas sensitive material having a dielectric constant that is sensitive...

03/20/14 - 20140077315 - Electronic sensor apparatus for detecting chemical or biological species, microfluidic apparatus comprising such a sensor apparatus, and method for producing the sensor apparatus and method for producing the microfluidic apparatus
An electronic sensor apparatus for detecting chemical or biological species includes a semiconductor chip, a sensor device, and a substrate. The chip is produced from a semiconductor substrate and is configured for one or more functions such as: amplifying and/or evaluating an electrical voltage, amplifying and/or evaluating an electric current,...

03/06/14 - 20140061823 - Membrane structure for electrochemical sensor
A micro-electrochemical sensor contains magnetic compounds inserted within a substrate that exert a magnetic force of attraction on paramagnetic beads held in contact with an electrode. The magnetic compounds can be contained within a fluid that is introduced into a void in the substrate. The electrode can be spaced apart...

01/30/14 - 20140027866 - Noise shielding techniques for ultra low current measurements in biochemical applications
A device having an integrated noise shield is disclosed. The device includes a plurality of vertical shielding structures substantially surrounding a semiconductor device. The device further includes an opening above the semiconductor device substantially filled with a conductive fluid, wherein the plurality of vertical shielding structures and the conductive fluid...

12/26/13 - 20130341734 - Integrated circuit with sensors and manufacturing method
Disclosed is an integrated circuit comprising a substrate (10) carrying plurality of circuit elements (20); a plurality of sensing electrodes (34) over said substrate, each sensing electrode being electrically connected to at least one of said circuit elements; and a plurality of wells (50) for receiving a sample, each sensing...

12/19/13 - 20130334619 - Integrated circuit with ion sensitive sensor and manufacturing method
Disclosed is an integrated circuit comprising a substrate (10) carrying plurality of circuit elements (20); a metallization stack (30) over said substrate for providing interconnections to at least some of said circuit elements, the metallization stack comprising a plurality of patterned metal layers (31) spatially separated from each other by...

11/21/13 - 20130307093 - Backside stimulated sensor with background current manipulation
A CMOS (Complementary Metal Oxide Semiconductor) pixel for sensing at least one selected from a biological, chemical, ionic, electrical, mechanical and magnetic stimulus. The CMOS pixel includes a substrate including a backside, a source coupled with the substrate to generate a background current, and a detection element electrically coupled to...

10/10/13 - 20130264660 - Micromechanical substrate for a diaphragm with a diffusion barrier layer
At least two separate single-crystal silicon layers are formed in a micromechanical substrate which has a diaphragm in a partial region. The diaphragm has a thickness of less than 20 μm and includes part of a first of the single-crystal silicon layers. The substrate construction also includes a heating element...

10/03/13 - 20130256813 - Semiconductor device and method of manufacturing the same
The semiconductor device has a sensor unit including a sensing part, and a semiconductor substrate. The semiconductor substrate is bonded to the sensor unit through an insulation film such that the sensing part is disposed in an air-tightly sealed chamber provided between a recessed portion of the semiconductor substrate and...

09/26/13 - 20130249022 - Double-sided diaphragm micro gas-preconcentrator
A double-sided diaphragm micro gas-preconcentrator has a micro-gas chamber which is formed by bonding an upper silicon substrate with a lower silicon substrate. One or more suspended membranes are provided on every silicon substrate. The silicon where the suspended membrane is provided is completely removed for forming a cavity. A...

09/05/13 - 20130228880 - Integrated sensor structure
Embodiments of the present invention provide a method for manufacturing an integrated sensor structure. In one step, a semiconductor substrate having integrated readout electronics and a metallization structure is provided, the metallization structure including tungsten and being exposed on a surface of the semiconductor substrate. In another step, a sensor...

08/29/13 - 20130221452 - Semiconductor device and method of forming semiconductor die with active region responsive to external stimulus
A semiconductor device has a semiconductor die and an encapsulant deposited over the semiconductor die. A conductive layer can be formed over the encapsulant and the semiconductor die. A transmissive layer can be formed over the semiconductor die. An interconnect structure can be formed through the encapsulant and electrically connected...

08/15/13 - 20130207204 - Biosensor chip and a method of manufacturing the same
A method of forming a biosensor chip enables a bond pad and detector electrode to be formed of different materials (one is formed of a connection layer such as copper and the other is formed of a diffusion barrier layer such as tantalum or tantalum nitride). A single planarizing operation...

08/15/13 - 20130207205 - Noise shielding techniques for ultra low current measurements in biochemical applications
A device having an integrated noise shield is disclosed. The device includes a plurality of vertical shielding structures substantially surrounding a semiconductor device. The device further includes an opening above the semiconductor device substantially filled with a conductive fluid, wherein the plurality of vertical shielding structures and the conductive fluid...

08/15/13 - 20130207206 - Semiconductor device having au-cu electrodes, and method of manufacturing semiconductor device
A method of manufacturing a biosensor semiconductor device in which copper electrodes at a major surface of the device are modified to form Au—Cu alloy electrodes. Such modification is effected by depositing a gold layer over the device, and then thermally treating the device to promote interdiffusion between the gold...

08/01/13 - 20130193527 - Micro-electro mechanical system (mems) structures with through substrate vias and methods of forming the same
The present disclosure includes micro-electro mechanical system (MEMS) structures and methods of forming the same. Substrates of the MEMS structures are bonded together by fusion bonding at high processing temperatures, which enables more complete removal of chemical species from the dielectric materials in the substrates prior to sealing cavities of...

07/04/13 - 20130168781 - Two-wafer mems ionization device
A microelectromechanical system (MEMS) assembly includes at least one emission source; a top wafer having a plurality of side walls and a generally horizontal portion, the horizontal portion having a thickness between a first side and a directly opposed second side, at least one window in the horizontal portion extending...

06/06/13 - 20130140649 - Transient devices designed to undergo programmable transformations
The invention provides transient devices, including active and passive devices that electrically and/or physically transform upon application of at least one internal and/or external stimulus. Materials, modeling tools, manufacturing approaches, device designs and system level examples of transient electronics are provided....

05/23/13 - 20130126987 - Physical quantity sensor and method of making the same
A first sealing layer having a frame-like shape and a first contact layer are formed on a back surface of a frame portion of a sensor substrate. The first contact layer is separated from the first sealing layer, extends through a functional member and an insulation layer, and is electrically...

05/16/13 - 20130119488 - Thinned finger sensor and associated methods
An electronic device may include a housing with a connector member opening therein, electronic circuitry within the housing, and a finger sensor assembly carried by the housing. The finger assembly may include a thinned finger sensing integrated circuit (IC) secured to the housing that has a thickness less than 200...

05/09/13 - 20130113054 - Semiconductor sensor device and method of packaging same
A packaged semiconductor device with a cavity formed by a cover or lid mounted to a substrate. The lid covers one or more semiconductor sensor dies mounted on the substrate. The dies are coated with a gel or spray on coating, and the lid is encapsulated with a mold compound....

04/25/13 - 20130099331 - Structure and process for microelectromechanical system-based sensor
A structure and a process for a microelectromechanical system (MEMS)-based sensor are provided. The structure for a MEMS-based sensor includes a substrate chip. A first insulating layer covers a top surface of the substrate chip. A device layer is disposed on a top surface of the first insulating layer. The...

03/21/13 - 20130069176 - Integrated circuit with sensor and method of manufacturing such an integrated circuit
An integrated circuit package for an integrated circuit having one or more sensor elements in a sensor element area of the circuit. An encapsulation covers bond wires but leaves an opening over the sensor element area. A protection layer is provided over the integrated circuit over which the encapsulation extends,...

03/07/13 - 20130056838 - Sensor chip and method for manufacturing a sensor chip
The present sensor chip comprises a substrate. A plurality of electrode elements is arranged at a first level on the substrate with at least one gap between neighbouring electrode elements. A metal structure is arranged at a second level on the substrate, wherein the second level is different from the...

03/07/13 - 20130056839 - Ultrasensitive biosensors
The present invention is a biosensor apparatus that includes a substrate, a source on one side of the substrate, a drain spaced from the source, a conducting channel between the source and the drain, an insulator region, and receptors on a gate region for receiving target material. The receptors are...

02/07/13 - 20130032902 - Integrated circuit with sensor and method of manufacturing such an integrated circuit
Disclosed is an integrated circuit comprising a substrate (10) carrying a plurality of circuit elements; a metallization stack (12, 14, 16) interconnecting said circuit elements, said metallization stack comprising a patterned upper metallization layer comprising a first metal portion (20) and a second metal portion (21); a passivation stack (24,...

02/07/13 - 20130032903 - Integrated circuit with sensor and method of manufacturing such an integrated circuit
Disclosed is an integrated circuit comprising a substrate (10) carrying a plurality of circuit elements; a metallization stack (12, 14, 16) interconnecting said circuit elements, said metallization stack comprising a patterned upper metallization layer comprising a first metal portion (20) and a second metal portion (21); a passivation stack (24,...

12/27/12 - 20120326247 - Self-sealed fluidic channels for a nanopore array
A method of forming a nanopore array includes patterning a front layer of a substrate to form front trenches, the substrate including a buried layer disposed between the front layer and a back layer; depositing a membrane layer over the patterned front layer and in the front trenches; patterning the...

12/06/12 - 20120306030 - Balancing a microelectromechanical system
A method of balancing a microelectromechanical system comprises determining if a microelectromechanical system is balanced in a plurality of orthogonal dimensions, and if the microelectromechanical system is not balanced, selectively depositing a first volume of jettable material on a portion of the microelectromechanical system to balance the microelectromechanical system in...

11/29/12 - 20120299126 - Integrated circuit with sensor and method of manufacturing such an integrated circuit
Disclosed is an integrated circuit (IC) comprising a substrate (10) carrying a plurality of circuit elements; a metallization stack (12, 14, 16) interconnecting said circuit elements, said metallization stack comprising a patterned upper metallization layer comprising at least one sensor electrode portion (20) and a bond pad portion (22), at...

10/25/12 - 20120267729 - Self-sealed fluidic channels for nanopore array
A method of forming a nanopore array includes patterning a front layer of a substrate to form front trenches, the substrate including a buried layer disposed between the front layer and a back layer; depositing a membrane layer over the patterned front layer and in the front trenches; patterning the...

10/11/12 - 20120256280 - Packaging for fingerprint sensors and methods of manufacture
A fingerprint sensor package, including a sensing side for sensing fingerprint information and a separate connection side for electrically connecting the fingerprint sensor package to a host device, is disclosed. The fingerprint sensor package can also include a sensor integrated circuit facing the sensing side and substantially surrounded by a...

10/11/12 - 20120256281 - Semiconductor devices having nanochannels confined by nanometer-spaced electrodes
Semiconductor devices having integrated nanochannels confined by nanometer spaced electrodes, and VLSI (very large scale integration) planar fabrication methods for making the devices. A semiconductor device includes a bulk substrate and a first metal layer formed on the bulk substrate, wherein the first metal layer comprises a first electrode. A...

08/23/12 - 20120211845 - Integrated circuit with sensor and method of manufacturing such an integrated circuit
Disclosed is an integrated circuit comprising a substrate (10) carrying a plurality of circuit elements; a metallization stack (12, 14, 16) interconnecting said circuit elements, said metallization stack comprising a patterned upper metallization layer comprising a first metal portion (20); a passivation stack (24, 26, 28) covering the metallization stack;...

08/02/12 - 20120193730 - Gas sensor element and manufacturing method of the same
Provided herein are a gas sensor element in which deformation of a sensitive portion due to stress may be reduced and a method of manufacturing the gas sensor element. A base insulating layer 9 including a heater wiring pattern 19 is formed on a front surface 3A of a support...

07/05/12 - 20120168882 - Integrated chemical sensor
A integrated circuit die includes a chemical sensor, a thermal sensor, and a humidity sensor formed therein. The chemical sensor, thermal sensor, and humidity sensor include electrodes formed in a passivation layer of the integrated circuit die. The integrated circuit die further includes transistors formed in a monocrystalline semiconductor layer....

06/28/12 - 20120161253 - Gas sensor and manufacturing method thereof
A gas sensor manufacturing method including the following steps: providing a SOI substrate, including an oxide layer, a device layer, and a carrier, wherein the oxide layer is disposed between the device layer and the carrier; etching the device layer to form an integrated circuit region, an outer region, a...

06/21/12 - 20120153407 - Light-assisted biochemical sensor
A light-assisted biochemical sensor based on a light addressable potentiometric sensor is disclosed. The light-assisted biochemical sensor comprises a semiconductor substrate and a sensing layer, which are used to detect the specific ion concentration or the biological substance concentration of a detected solution. Lighting elements fabricated directly on the back...