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Active Solid-state Devices (e.g., Transistors, Solid-state Diodes) > Responsive To Non-electrical Signal (e.g., Chemical, Stress, Light, Or Magnetic Field Sensors) Responsive To Non-electrical Signal (e.g., Chemical, Stress, Light, Or Magnetic Field Sensors)Responsive To Non-electrical Signal (e.g., Chemical, Stress, Light, Or Magnetic Field Sensors) patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.01/10/08 - 20080006888 - Nanomachined mechanical components using nanoplates, methods of fabricating the same and methods of manufacturing nanomachines Disclosed herein is a method of fabricating nano-components using nanoplates, including the steps of: printing a grid on a substrate using photolithography and Electron Beam Lithography; spraying an aqueous solution dispersed with nanoplates onto the grid portion to position the nanoplates on the substrate; depositing a protective film of a ... 12/13/07 - 20070284679 - Mos solid-state image pickup device and manufacturing method thereof An N-type epitaxial layer 115, which is formed above an N-type semiconductor substrate 114 in each of a pixel region and a peripheral circuit region; a first P-type well 1 formed above the N-type epitaxial layer 115 in the pixel region; and light receiving regions 117, which are formed within ... 11/29/07 - 20070272991 - Method and device for alternately contacting two wafers A method and device for alternately contacting two wafer-like component composite arrangements (12, 14) consisting of a plurality of cohesively designed similar components, in particular of a semiconductor wafer with a function component wafer for manufacturing electronic modules on a wafer level, in which the two component composite arrangements, each ... 11/01/07 - 20070252224 - Integrated chemical microreactor with large area channels and manufacturing process thereof The microreactor has a body of semiconductor material; a large area buried channel extending in the body and having walls; a coating layer of insulating material coating the walls of the channel; a diaphragm extending on top of the body and upwardly closing the channel. The diaphragm is formed by ... 10/25/07 - 20070246786 - Doping of sic structures and methods associated with same Doped silicon carbide structures, as well as methods associated with the same, are provided. The structures, for example, are components (e.g., layer, patterned structure) in MEMS structures. The doped silicon carbide structures may be highly conductive, thus, providing low resistance to electrical current. An in-situ doping process may be used ... 10/11/07 - 20070235824 - Novel schottky barrier metal-germanium contact in metal-germanium-metal photodetectors Metal-Semiconductor-Metal (“MSM”) photodetectors and methods to fabricate thereof are described. The MSM photodetector includes a thin heavily doped (“delta doped”) layer deposited at an interface between metal contacts and a semiconductor layer to reduce a dark current of the MSM photodetector. In one embodiment, the semiconductor layer is an intrinsic ... 09/27/07 - 20070222006 - Micromechanical component and corresponding manufacturing method A micromechanical component which includes a substrate; a first rigid electrode system situated on or in the substrate; a second electrode system suspended on the substrate; an intermediate space provided between the first electrode system and the second electrode system; the second electrode system being mounted on the suspension post ... 09/27/07 - 20070222004 - Mems device using nimn alloy and method of manufacture A material for forming a conductive structure for a MEMS device is described, which is an alloy containing about 0.01% manganese and the remainder nickel. Data shows that the alloy possesses advantageous mechanical and electrical properties. In particular, the sheet resistance of the alloy is actually lower than the sheet ... 09/20/07 - 20070215964 - Capacitive micromachined ultrasonic transducer (cmut) with varying thickness membrane Structure for capacitive micromachined ultrasonic transducer (CMUT) device or other vibrating membrane device having non-uniform membrane so that membrane mass and stiffness characteristics may be substantially independently adjusted. CMUT having trenched membrane and/or membrane with non-uniform thickness or density. Method for operating transducer or vibrating membrane device. Array of devices ... 09/20/07 - 20070215962 - Microelectromechanical system assembly and method for manufacturing thereof A microelectromechanical system (MEMS) assembly comprises a MEMS transducer, an integrated circuit (IC), and a substrate. The integrated circuit and the MEMS transducer are being electrically coupled to the substrate. The substrate may be a single layer or multiple layers. A coupling circuit resides in the substrate and may comprise ... 09/20/07 - 20070215961 - Comb structure fabrication methods and systems A method of manufacturing a vertical comb structure for a micro electromechanical (MEMS) device. Tooth structures are formed on a first wafer. A second wafer is then bonded to the tooth structures of the first wafer. The tooth structures are then released to form a comb structure. Forming the tooth ... 09/20/07 - 20070215960 - Methods for fabrication of positional and compositionally controlled nanostructures on substrate Fabrication methods disclosed herein provide for a nanoscale structure or a pattern comprising a plurality of nanostructures of specific predetermined position, shape and composition, including nanostructure arrays having large area at high throughput necessary for industrial production. The resultant nanostracture patterns are useful for nanostructure arrays, specifically sensor and catalytic ... 09/13/07 - 20070210392 - Semiconductor device A semiconductor device is designed such that a semiconductor sensor chip having a diaphragm for detecting pressure variations based on the displacement thereof is fixed onto the upper surface of a substrate having a rectangular shape, which is covered with a cover member so as to form a hollow space ... 09/06/07 - 20070205473 - Passive analog thermal isolation structure A thermal isolation structure for use in passively regulating the temperature of a microdevice is disclosed. The thermal isolation structure can include a substrate wafer and a cap wafer defining an interior cavity, and a number of double-ended or single-ended thermal bimorphs coupled to the substrate wafer and thermally actuatable ... 08/23/07 - 20070194395 - Capacity type sensor In a capacity type sensor including a guard electrode which is disposed between a first electrode and a second electrode, an alternating current potential difference between the first electrode and the guard electrode is made substantially close to zero by a potential equalizing means, and impedance change between the first ... 07/19/07 - 20070164377 - Semiconductor sensor using surface plasmons to increase energy absorption efficiency Surface plasmons are used to increase an energy absorbing efficiency of a semiconductor sensor. ... 07/12/07 - 20070158766 - Nanosensors Electrical devices comprised of nanowires are described, along with methods of their manufacture and use. The nanowires can be nanotubes and nanowires. The surface of the nanowires may be selectively functionalized. Nanodetector devices are described. ... 06/28/07 - 20070145500 - Cmos image sensor and manufacturing method thereof A CMOS image sensor capable of improving characteristics of the image sensor by preventing damage to a photodiode region and a method for manufacturing the same are provided. The CMOS image sensor includes: a semiconductor substrate on which a device isolation region and an active region are defined; a photodiode ... 06/28/07 - 20070145499 - Photovoltaic ultraviolet sensor A photovoltaic ultraviolet sensor comprises a zinc oxide single crystal substrate. On the +c face of the zinc oxide single crystal substrate, an ultraviolet receiver is formed. The exemplary ultraviolet receiver includes a Schottky electrode which, when receiving ultraviolet rays, produces a voltage in cooperation with the zinc oxide single ... 06/21/07 - 20070138581 - Micromechanical sensor A micromechanical sensor and a method for manufacturing same are described. A secure diaphragm restraint, independent of fluctuations in the cavern etching process due to the process technology, and a free design of the diaphragm are made possible by designing a suitable connection of the diaphragm in an oxide layer ... 06/14/07 - 20070132045 - Semiconductor dynamic sensor and method of manufacturing the same A semiconductor sensor includes an adhesive film for suppressing thermal stress transfer to a semiconductor sensor chip. More specifically, the adhesive film includes a first layer and a second layer. An elasticity modulus of the first layer is lower than that of the second layer, and the second layer has ... 06/14/07 - 20070132044 - Piezolectric micro electro-mechanical system switch, array of the switches, and method of fabricating the same A piezoelectric micro electro-mechanical system switch (MEMS), an array of piezoelectric MEMS switches, and a method of fabricating the switch, which are capable of improving low voltage and switching characteristics while securing high signal isolation, are provided. The piezoelectric MEMS switch includes a semiconductor substrate including a groove, a support ... 06/14/07 - 20070132043 - Nano-electronic sensors for chemical and biological analytes, including capacitance and bio-membrane devices Embodiments of nanoelectronic sensors are described, including sensors for detecting analytes inorganic gases, organic vapors, biomolecules, viruses and the like. A number of embodiments of capacitive sensors having alternative architectures are described. Particular examples include integrated cell membranes and membrane-like structures in nanoelectronic sensors. ... 06/07/07 - 20070126070 - Semiconductor devices with electric current detecting structure A semiconductor device is provided with a main electrode of main switching elements region, a sensor electrode of sensor switching elements region, and a protective device formed between the main electrode and the sensor electrode. The protective device electrically connects the main electrode and the sensor electrode when a predetermined ... 06/07/07 - 20070126069 - Micromechanical device and method for producing a micromechanical device A micromechanical device and a method for producing this device are provided, the device having a sensor pattern that includes a spring pattern and a seismic mass. The seismic mass may be connected to the substrate material via the spring pattern, and a clearance may be provided in a direction ... 06/07/07 - 20070126068 - Microcomponent comprising a hermetically-sealed cavity and a plug, and method of producing one such microcomponent The microcavity is delineated by a cover which is formed on a sacrificial layer and in which at least one hole is formed for removal of the sacrificial layer. A plug covers the hole and part of the cover along the periphery of the hole. The plug is made from ... 05/31/07 - 20070120206 - Semiconductor optical device having current-confined structure Provided is a semiconductor optical device having a current-confined structure. The device includes a first semiconductor layer of a first conductivity type which is formed on a semiconductor substrate and includes one or more material layers, a second semiconductor layer which is formed on the first semiconductor layer and includes ... 05/31/07 - 20070120205 - Physical quantity sensor having multiple through holes A semiconductor physical quantity sensor includes: a substrate; a semiconductor layer supported on the substrate; a trench disposed in the semiconductor layer; and a movable portion disposed in the semiconductor layer and separated from the substrate by the trench. The movable portion includes a plurality of through-holes, each of which ... 05/24/07 - 20070114622 - Damascene copper wiring optical image sensor A CMOS image sensor array and method of fabrication wherein the sensor includes Copper (Cu) metallization levels allowing for incorporation of a inner interlevel dielectric stack with improved thickness uniformity to result in a pixel array exhibiting increased light sensitivity. In the sensor array, each Cu metallization level includes a ... 05/24/07 - 20070114621 - Wirelessly powered flexible tag A wirelessly powered flexible tag configured to be in contact with a substrate is provided. The tag includes a coupling layer configured to couple the tag to the substrate. An electrical circuit disposed on the coupling layer and configured to interact wirelessly with an external stimulus. The tag further includes ... 05/24/07 - 20070114620 - Package and electronic apparatus using the same An upper sealing ring and a lower sealing ring are adhered by sealing solder. The width of tip end of sealing projection is narrower than the width of the lower sealing ring. Therefore, the sealing solder is placed on lower sealing ring and on the side surface of upper sealing ... 05/17/07 - 20070108540 - Micro-electromechanical switch, method of manufacturing an integrated circuit including at least one such switch, and an integrated circuit Integrated circuit obtained by a CMOS process and comprising circuit components and at least one micro-electromechanical switch comprising a layered structure, comprising an actuator electrode corresponding to a first conductive layer, at least one contact electrode corresponding to a second conductive layer, and a displaceable conductive element corresponding to a ... 05/17/07 - 20070108539 - Stable organic devices Stable organic devices, as well as related components, systems, and methods, are disclosed. ... 04/26/07 - 20070090474 - Mems device and method of fabrication A MEMS device and method of fabrication including a plurality of structural tie bars for added structural integrity. The MEMS device includes an active layer and a substrate having an insulating material formed therebetween, first and second pluralities of stationary electrodes and a plurality of moveable electrodes in the active ... 04/26/07 - 20070090473 - Microelectromechanical component and method for the production thereof A microelectromechanical component and to a method for the production thereof is disclosed. In one embodiment, the microelectromechanical component has a pressure-sensitive semiconductor chip, which is covered in its pressure-sensitive region by a rubber-elastic layer and is arranged in a cavity housing and covered by a rubber-elastic covering. This rubber-elastic ... 04/19/07 - 20070085155 - Optically-configurable nanotube or nanowire semiconductor device The invention relates to a semiconductor device comprising at least two electrodes and at least one nanotube or nanowire, in particular a carbon nanotube or nanowire, the device including at least one semiconductive nanotube or nanowire having at least one region that is covered at least in part by at ... 04/05/07 - 20070075386 - Apparatus and method for forming film hole The present invention provides a film hole forming apparatus (400), which includes a chemical etching system (410) and a driving system (420). The driving system comprising a transmission belt, which pass through the chemical etching system. A material of the transmission belt being teflon, teflon-containing material, poly (vinylidene finoride), metal, ... 03/29/07 - 20070069313 - Hydrogen gas sensitive semiconductor sensor A hydrogen gas sensitive semiconductor sensor including a catalytic metal layer, a semiconductor layer and an insulator layer arranged between the catalytic metal layer and the semiconductor layer. The catalytic metal layer includes an outer surface and an inner surface including at least one hydrogen atom adsorption surface portion. Each ... 03/08/07 - 20070052045 - Thin membrane alignment method using patterned nanomagnets A passive nanomagnet alignment method is described to self-align a membrane to another surface. The membrane and the surface each have a plurality of nanomagnets patterned on it, wherein the nanomagnets are magnetized based on an applied external magnetic field. The membrane is brought into close proximity and coarse alignment ... 03/08/07 - 20070052044 - Scrolling input arrangements using capacitive sensors on a flexible membrane Scrolling input arrangements are presented including: a flexible membrane; a number of capacitive sensors mechanically integrated with the flexible membrane, the capacitive sensors radially disposed with respect to a first axis that is perpendicular with respect to the flexible membrane; an integrated circuit mechanically coupled with the flexible membrane and ... 03/01/07 - 20070045756 - Nanoelectronic sensor with integral suspended micro-heater A nanoelectronic sensing device includes a substrate, a nanostructure element disposed adjacent the substrate, and at least a conductive element electrically connected to the nanostructure element. The device is configured to heat at least a portion of the sensor structure including the nanostructure element. In certain embodiments, the nanostructure element ... 03/01/07 - 20070045755 - Gyro device implemented by back-end semiconductor manufacturing process The invention relates to a single-chip gyro device, which includes a substrate, a plurality of metal layers and a plurality of dielectric layers, and a plurality of metal side walls. Each of the dielectric layers is located between two adjacent layers selected from a layer group consisting of the metal ... 02/22/07 - 20070040230 - Micromechanical component A micromechanical component has a structure such that a material flow is guided from at least one preferred direction for the purpose of uniformly enveloping the micromechanical component. ... 02/22/07 - 20070040229 - Self-assembly microstructure with polymide thin-film elastic joint The invention relates to a self-assembly microstructure with a polyimide thin-film elastic joint, which contains at least one stationary part of the microstructure and at least one movable part of the microstructure. An elastic joint located between the stationary part and the movable part is a photosensitive polyimide thin film ... 02/08/07 - 20070029629 - Integrated sensor and circuitry and process therefor A micromachined sensor and a process for fabrication and vertical integration of a sensor and circuitry at wafer-level. The process entails processing a first wafer to incompletely define a sensing structure in a first surface thereof, processing a second wafer to define circuitry on a surface thereof, bonding the first ... 02/01/07 - 20070023851 - Mems pixel sensor A MEMS pixel sensor is provided with a thin-film mechanical device having a mechanical body, with a mechanical state responsive to a proximate environment. A thin-film electronic device converts the mechanical state into electrical signals. A pixel interface supplies power to the electronic device and transceives electrical signals. The sensor ... 02/01/07 - 20070023850 - Bonding surfaces together via plasma treatment on both surfaces with wet treatment on only one surface A first surface is bonded to a second surface. The first surface and the second surface are plasma treated. Only the first surface is wet treated. The first surface and the second surface are joined together to bond the first surface to the second surface. ... 01/25/07 - 20070018261 - Low compressive tinx materials and methods of making the same Disclosed herein is a microelectromechanical device having a structural layer composed of a low stress TiNx layer and a method of making the same. ... 01/25/07 - 20070018260 - Devices having vertically-disposed nanofabric articles and methods of making the same Electro-mechanical switches and memory cells using vertically-disposed nanofabric articles and methods of making the same are described. An electro-mechanical device, includes a structure having a major horizontal surface and a channel formed therein. A conductive trace is in the channel; and a nanotube article vertically suspended in the channel, in ... 01/18/07 - 20070013013 - Semiconductor chemical sensor A chemical sensor is provided that includes a semiconductor layer, an organic chemical layer disposed on a surface of the semiconductor layer, and a heating element configured to heat the semiconductor layer. ... 01/11/07 - 20070007607 - Semiconductor sensor and manufacturing mehtod therefor A semiconductor sensor is disclosed that includes a semiconductor substrate, a sensing portion provided on the semiconductor substrate, and a pad in electrical communication with the sensing portion and provided on the semiconductor substrate. The semiconductor sensor also includes a bonding wire in electrical communication with the pad. Furthermore, the ... 01/04/07 - 20070001249 - Structure of sweep-type fingerprint sensing chip capable of resisting electrostatic discharge (esd) and method of fabricating the same A structure of sweep-type fingerprint sensing chip capable of resisting electrostatic discharge (ESD) includes a semiconductor substrate, and a sweep-type fingerprint sensing chip formed on the semiconductor substrate, a polymer layer and a conducting metal layer. The sweep-type fingerprint sensing chip includes a sensing array region and a peripheral circuit ... 01/04/07 - 20070001248 - Mems device having compact actuator A MEMS device including a plurality of actuator layers formed over a substrate and a bimorph actuator having a substantially serpentine pattern. The serpentine pattern is a staggered pattern having a plurality of static segments interlaced with a plurality of deformable segments. Each of the plurality of static segments has ... 01/04/07 - 20070001247 - Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates A method for forming a MEMS device is disclosed, where a final release step is performed just prior to a wafer bonding step to protect the MEMS device from contamination, physical contact, or other deleterious external events. Without additional changes to the MEMS structure between release and wafer bonding and ... 12/07/06 - 20060273416 - Capacitive resonators A micro-electro-mechanical system (MEMS) capacitive resonator and methods for manufacturing the same are invented and disclosed. In one embodiment, an apparatus comprises a micro-electro-mechanical system (MEMS) capacitive resonator, the resonator comprising support means, a semiconductor resonating member coupled to the support means, and electrodes comprised of a different material than ... 11/30/06 - 20060267120 - Liquid crystal display apparatus and manufacturing method thereof A liquid crystal apparatus includes a TFT array substrate which includes gate wirings having a gate electrode, source wirings having a source electrode, a thin film transistor having the gate electrode, a semiconductor layer, the source electrode, and a drain electrode, an interlayer insulating film provided above the thin film ... 11/23/06 - 20060261423 - Method of fabricating printheads having multiple nozzle assemblies A method of fabricating printheads each having a plurality of nozzle assemblies positioned on a substrate from a plurality of sets of the nozzle assemblies positioned on the substrate includes the step of applying a guard defining a plurality of recesses to the substrate so that each set is located ... 11/02/06 - 20060244086 - Transparent amorphous carbon structure in semiconductor devices A transparent amorphous carbon layer is formed. The transparent amorphous carbon layer has a low absorption coefficient such that the amorphous carbon is transparent in visible light. The transparent amorphous carbon layer may be used in semiconductor devices for different purposes. The transparent amorphous carbon layer may be included in ... 11/02/06 - 20060244085 - Method for forming a chamber in an electronic device and device formed thereby A method is disclosed for forming a chamber in an electronic device, including the steps of preparing an outer surface on a solidified core material, the solidified core material in a depression formed in a substrate. The method further includes establishing a layer on the prepared outer surface of the ... 10/26/06 - 20060237805 - Sensor platform using a horizontally oriented nanotube element Sensor platforms and methods of making them are described, and include platforms having horizontally oriented sensor elements comprising nanotubes or other nanostructures, such as nanowires. Under certain embodiments, a sensor element has an affinity for an analyte. Under certain embodiments, such a sensor element comprises one or more pristine nanotubes, ... 10/05/06 - 20060220159 - Sensor A sensor having a terminal connection structure in which an elongated sensor element (21) is inserted, from its rear end through relative movement, into a metallic-terminal-member retainer. Metallic terminal members (51) are elastically deformed and pressed against corresponding electrode terminals (25) formed on side surfaces (26) of the sensor element. ... 09/21/06 - 20060208327 - Acceleration sensor and method of manufacturing acceleration sensor An acceleration sensor includes a semiconductor substrate, a sensing element formed on the semiconductor substrate, a bonding frame made of polysilicon which is formed on the semiconductor substrate and surrounds the sensing element, and a glass cap which is bonded to a top surface of the bonding frame made of ... 09/21/06 - 20060208326 - Method of fabrication of ai/ge bonding in a wafer packaging environment and a product produced therefrom A method of bonding of germanium to aluminum between two substrates to create a robust electrical and mechanical contact is disclosed. An aluminum-germanium bond has the following unique combination of attributes: (1) it can form a hermetic seal; (2) it can be used to create an electrically conductive path between ... 08/31/06 - 20060192259 - Bonded assembly having improved adhesive bond strength A bonded assembly is provided. The bonded assembly comprises: (a) a first substrate having a plurality of etched trenches defined in a first bonding surface; and (b) a second substrate having a second bonding surface. The second bonding surface is bonded to the first bonding surface with an adhesive and ... 08/24/06 - 20060186493 - Laminated structure, method of manufacturing the same and ultrasonic transducer array A laminated structure with less breakage of an insulative layer due to stress and easy interconnection. The laminated structure includes at least a first electrode layer, a dielectric layer and a second electrode layer stacked in this order. The first electrode layer includes a first electrode material disposed such that ... 08/24/06 - 20060186492 - Microelectronic imagers with shaped image sensors and methods for manufacturing microelectronic imagers Microelectronic imagers with shaped image sensors and methods for manufacturing curved image sensors. In one embodiment, a microelectronic imager device comprises an imaging die having a substrate, a curved microelectronic image sensor having a face with a convex and/or concave portion at one side of the substrate, and integrated circuitry ... 08/17/06 - 20060180882 - Mems device and manufacturing method of mems device A MEMS device includes a wiring laminated through an interlayer insulating film on a semiconductor substrate, the interlayer insulating film partially opened up to an upper portion of the substrate, and a structure disposed in the opening, wherein on a sidewall of the interlayer insulating film exposed in the opening ... 08/17/06 - 20060180881 - Probe head and method of fabricating the same A probe head includes a sensor unit having: as sensor which records or reads data on or from a predetermined medium; first and second shields disposed on both sides of the sensor at a predetermined distance from each other; and first and second intermediate layers respectively interposed between the sensor ... 08/17/06 - 20060180880 - Magnetic shielding for magnetically sensitive semiconductor devices A magnetic shielding device is provided for protecting at least one magnetically sensitive component on a substrate according to embodiments of the present invention. The device comprises a first shield having a top portion, and one or more side portions, wherein the top and side portions along with the substrate ... 07/27/06 - 20060163679 - High performance mems packaging architecture An apparatus and method for sensor architecture based on bulk machining of Silicon-On-Oxide wafers and fusion bonding that provides a symmetric, nearly all-silicon, hermetically sealed MEMS device having a sensor mechanism formed in an active semiconductor layer, and opposing silicon cover plates each having active layers bonded to opposite faces ... 07/20/06 - 20060157806 - Multilayered semiconductor susbtrate and image sensor formed thereon for improved infrared response An image sensor is formed on a multilayered substrate to improve infrared response. The multilayered substrate uses a silicon-germanium alloy to improve infrared response. In one embodiment, the silicon-germanium alloy has a germanium concentration gradient such that an upper portion of the silicon-germanium alloy has a lower germanium concentration than ... 06/22/06 - 20060131678 - Method of manufacturing surface acoustic wave device and surface acoustic wave device A method of manufacturing a surface acoustic wave device formed in one chip and including over a semiconductor substrate at least an IC region and a surface acoustic wave element region that are horizontally disposed, the method including: forming in the IC region over the semiconductor substrate a semiconductor element ... 06/22/06 - 20060131677 - Systems and methods for electrically coupling wires and conductors A first device includes a micrometer-scale or smaller geometry first conductor. A second device includes a micrometer-scale or smaller second conductor. An actuator the first and second devices relative to each other between first and second positions. Signals are substantially coupled between the first and second conductors in the first ... 06/15/06 - 20060125032 - Micro electro mechanical system apparatus A MEMS (micro electro mechanical system) apparatus is equipped with a light-emitting circuit, having a light-emitting device, to emit light; a light-receiving circuit having a series circuit of series-connected light-receiving devices that receive the emitted light to generate a voltage; and a MEMS assembly driven by the generated voltage. ... 06/15/06 - 20060125031 - Microelectromechanical device having a common ground plane layer and a set of contact teeth and method for making aspects thereof The present invention relates to MEM switches. More specifically, the present invention relates to a system and method for making MEM switches having a common ground plane. One method for making MEM switches includes: patterning a common ground plane layer on a substrate; forming a dielectric layer on the common ... 06/08/06 - 20060118894 - High speed photodiode with a barrier layer for blocking or eliminating slow photonic carriers and method for forming same A structure (and method for forming the structure) includes a photodetector, a substrate formed under the photodetector, and a barrier layer formed over the substrate. The buried barrier layer preferably includes a single or dual p-n junction, or a bubble layer for blocking or eliminating the slow photon-generated carriers in ... 06/08/06 - 20060118893 - Monitoring photodetector for integrated photonic devices A laser and detector integrated on corresponding epitaxial layers of a single chip cooperate with on-chip and/or external optics to couple light of a first wavelength emitted by the laser to a single external device such as an optical fiber and to simultaneously couple light of a different wavelength received ... 06/01/06 - 20060113617 - Organic el display A top emission structure color organic EL (electroluminescent) display in which there are bonded together a substrate, having thin film transistors formed thereon, and a transparent substrate, having color-converting filters formed thereon, with an overcoat layer for adjusting the gap between the two substrates and also for relieving stress formed ... 05/25/06 - 20060108652 - Microelectromechanical systems, and methods for encapsulating and fabricating same There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device, having mechanical structures encapsulated in a chamber prior to final packaging. The material that encapsulates the mechanical structures, when deposited, includes ... 05/11/06 - 20060097332 - Semiconductor device, carrier, card reader, methods of initializing and checking authenticity The semiconductor device has a security coating with embedded magnetic particles and magnetoresistive sensors. This renders possible a measurement of the impedance of security elements defined by magnetoresistive sensors and security coating. If initial values of the impedance are stored, actual values can be compared therewith to see if the ... 05/11/06 - 20060097331 - Sensor device A sensor device includes a sensor chip having a movable portion on one surface, a circuit chip laminated with the sensor chip to be opposite to the movable portion of the sensor chip, and a bump located between the sensor chip and the circuit chip. In the sensor device, the ... 04/20/06 - 20060081951 - Micro-electro-mechanical system (mems) package having side double-sealing member and method of manufacturing the same A micro-electro-mechanical system (MEMS) package having a side double-sealing member and method of manufacturing the MEMS package is disclosed. The MEMS package is formed by forming a metal layer on a base substrate by patterning so that the metal layer surrounds an MEMS element provided on the base substrate, joining ... 04/20/06 - 20060081950 - Molehole embedded 3-d crossbar architecture used in electrochemical molecular memory device This invention provides a new design and fabrication for a three-dimensional crossbar architecture embedding a sub-micron or nanometer sized hole (called a molehole) in each cross-region. Each molehole is an electrochemical cell consisting of two or more sectional surfaces separated by a non-conductor (e.g., a dialectric layer and solid electrolyte). ... 04/13/06 - 20060076633 - Methods and apparatus for particle reduction in mems devices A method for assembling a micro-electromechanical system (MEMS) device that includes a micro-machine is described. The method comprises forming the micro-machine on a die, the die having a top surface and a bottom surface, providing a plurality of die bonding pedestals on a surface of a housing, and mounting at ... 04/13/06 - 20060076632 - System and method for display device with activated desiccant A MEMS device package comprises a substrate with a MEMS device formed thereon, a backplane, a seal, and an inactive desiccant within the package. The desiccant is activated after assembly of the package by exposure to an environmental change or an activating substance. A method of packaging a MEMS device ... 04/13/06 - 20060076631 - Method and system for providing mems device package with secondary seal A MEMS device package comprises a substrate with a MEMS device formed thereon, a backplane, and a primary seal, wherein the primary seal is positioned between the backplane and the substrate to encapsulate and seal the MEMS device package from ambient conditions. The MEMS device package further comprises a secondary ... 04/06/06 - 20060071286 - Polymeric piezoresistive sensors A MEMS system, such as a biosensor, includes a micromechanical resonator and a piezoresistive sensing element which includes an organic semiconductor, such as an organic thin film transistor. ... 03/30/06 - 20060065941 - Encapsulation component for integrated micro electromechanical systems and fabrication process of the component The microsystems are integrated in a first cavity bounded by at least a substrate and by a top wall formed by at least a part of a first cover. The component has a second cavity bounded by at least the whole of the top wall of the first cavity and ... 03/30/06 - 20060065940 - Analog interferometric modulator device Disclosed is new architecture of microelectromechanical system (MEMS) device. The device has a partially reflective optical layer, a deformable mechanical layer and a mirror layer, each of which forms an independent electrode. A support post separates the optical layer from the mechanical layer. The mirror layer is located and movable ... 03/23/06 - 20060060931 - Standard micro-component for calibrating or standardizing fluorescence measuring instruments and biochip comprising same The invention concerns a standard micro-component (4) for calibrating or standardizing fluorescence measuring instruments, comprising a substrate (1) whereon is arranged at least one thin film (2). The thin film (2) includes fluorescent components. At least one first zone (3) of null thickness is formed in the thin film (2), ... 03/16/06 - 20060054982 - Nanowire optoelectric switching device and method A nanowire switching device and method. The device has a nanowire structure comprising an elongated member having a cross-sectional area ranging from about 1 nanometers but less than about 500 nanometers, but can also be at other dimensions, which vary or are substantially constant or any combination of these. The ... 03/02/06 - 20060043506 - Boron phosphide-based compound semiconductor device, production method thereof and light-emitting diode A boron phosphide-based compound semiconductor device with excellent device properties, comprising a boron phosphide-based compound semiconductor layer having a wide bandgap is provided. The boron phosphide-based compound semiconductor layer consists of an amorphous layer and a polycrystal layer provided to join with the amorphous layer, and the room-temperature bandgap of ... 02/16/06 - 20060033174 - Cmos power sensor A CMOS power sensor is disclosed in the present invention. The CMOS power sensor includes a current coil, a high voltage device circuit, and a Hall device. The current coil is fabricated during the process steps of forming gold bumps of a CMOS device. One end of the current coil ... 02/09/06 - 20060027886 - Apparatus for cutting devices from conductive substrates secured during cutting by vacuum pressure A method and system for cutting a wafer comprising a conductive substrate attached to an array of integrated devices includes placing the wafer on a stage such as a movable X-Y stage including a vacuum chuck having a porous mounting surface, and securing the wafer during and after cutting by ... 02/09/06 - 20060027885 - Mems device with non-standard profile A method of producing a MEMS device forms structure on a non-standard device wafer. To that end, the method provides the noted non-standard device wafer, which has a wafer outer diameter and a non-standard thickness. As known by those in the art, a standard device wafer has a standard thickness ... 02/09/06 - 20060027884 - Silicon carbide mems structures and methods of forming the same MEMS structures that include silicon carbide micromechanical components, as well as methods of forming and using the same, are provided. The silicon carbide micromechanical components may be integrated on the same structure with electronic components that control or detect movement of the micromechanical components. MEMS structures of the invention may ... 01/26/06 - 20060017124 - Bistable magnetic device using soft magnetic intermediary material Roughly described, a magnetic structure includes an electrically conductive path for carrying current flow, a soft magnetic material with high permeability value in magnetic communication with the current flow so that it can be magnetized in either of two directions, and a magnetic device such as a magnetic random access ... 01/26/06 - 20060017123 - Field imager A detection apparatus for detecting the presence of a sample, the detection apparatus comprising a chamber, ports for introducing a sample within the chamber, an actuation unit for establishing a controllable electromagnetic field in the chamber; and a sensing unit for sensing changes in the electromagnetic field due to the ... 01/19/06 - 20060011998 - Electromechanical electron transfer devices An electron transfer device is implemented in a structure which is readily capable of achieving charge transfer cycle frequencies in the range of several hundred MHz or more and which can be formed by conventional semiconductor integrated circuit manufacturing processes. The device includes a substrate having a horizontal extent and ... 01/19/06 - 20060011997 - Electrostatic discharge protection of a capacitive type fingerprint sensing A planar fingerprint pattern detecting array includes a large number of individual skin-distance sensing cells that are arranged in a row/column configuration. Each sensing cell includes an amplifier having an ungrounded input mode and an ungrounded output node. Output-to-input negative feedback that is sensitive to the fingerprint pattern is provided ... 01/12/06 - 20060006482 - Tfa image sensor with stability-optimized photodiode The invention relates to a TFA image sensor with stability-optimized photodiode for converting electromagnetic radiation into an intensity-dependent photocurrent with an intermetal dielectric, on which, in the region of the pixel matrix, a lower barrier layer is situated and a conductive layer is situated on the barrier layer, and vias ... 01/05/06 - 20060001113 - Magnetic sensor of very high sensitivity A magnetic sensor includes a thin deformable membrane made of a conductive material forming a first plate of a capacitor which conducts an electric current therethrough. A second capacitor plate of the capacitor includes a doped region of a semiconductor substrate. A layer of a gaseous dielectric separates the two ... 12/29/05 - 20050285214 - Integrated circuit chip that supports through-chip electromagnetic communication One embodiment of the present invention provides an integrated circuit chip, including an active face upon which active circuitry and signal pads reside, and a back face opposite the active face. The integrated circuit chip additionally comprises an electromagnetic via that facilitates communication between signal pads on the integrated circuit ... 12/22/05 - 20050280106 - Mems structure and method for fabricating the same A MEMS structure includes a floating space formed on the upper silicon layer by a first dry etching, and then dry etched to a predeterminded depth on the lower silicon layer by etching gas supplied through the etched holes from which the oxide film has been removed at the bottom ... 11/24/05 - 20050258501 - Light receiving element, method for producing the same, and light receiving element with built-in circuit A light receiving element includes a substrate; and an epitaxial layer provided on the substrate and containing an impurity diffusion layer extending from a surface of the epitaxial layer to a prescribed depth. The prescribed depth is about 0.3 μm or less. The impurity diffusion layer contains an impurity at ... 11/17/05 - 20050253206 - Microstructure comprising a surface which is functionalised through the localised deposit of a thin layer and production method thereof An electromechanical microstructure including a first mechanical part formed in a first electrically conductive material, and which includes a zone deformable in an elastic manner having a thickness value and an exposed surface, and a first organic film having a thickness, present on all of the exposed surface of the ... 11/10/05 - 20050247989 - Method for integrating micro and nanoparticles into mems and apparatus including the same MEMs devices are integrally fabricated with included micro or nanoparticles by providing a mixture of a sacrificial material and a multiplicity of particles, disposing the mixture onto a substrate, fabricating a MEMs structure on the substrate including at least part of the mixture, so that at least some of the ... 10/27/05 - 20050236681 - Metrology structure and methods A method of indicating the progress of a sacrificial material removal process, the method, comprising; freeing a portion of a member, the member being disposed in a cage and laterally surrounded by the sacrificial material; and preventing the freed portion of the member from floating away by retaining the freed ... 10/20/05 - 20050230767 - Fabrication and integration of polymeric biomems A micro-electro-mechanical system (MEMS) device is provided, along with means for its fabrication and operation for microfluidic and/or biomicrofluidic applications. The MEMS device includes a substrate, optional electrodes on the substrate, a patterned structure on the substrate, the patterned structure having a fluidic microchannel aligned with one or more of ... 10/13/05 - 20050224899 - Wireless substrate-like sensor In accordance with an aspect of the present invention, a wireless substrate-like sensor is configured to ensure it does not contaminate a semiconductor processing chamber. The sensor is sealed except for one or more apertures. In one embodiment, a vent is disposed proximate the apertures. In another embodiment, the aperture ... 10/06/05 - 20050218465 - Integrated electronic sensor A single chip wireless sensor (1) comprises a microcontroller (2) connected by a transmit/receive interface (3) to a wireless antenna (4). The microcontroller (2) is also connected to an 8 kB RAM (5), a USB interface (6), an RS232 interface (8), 64kB flash memory (9), and a 32 kHz crystal ... 10/06/05 - 20050218464 - Biochemical ultrasensitive charge sensing Chemical sensors for detecting chemicals are provided using surface and bulk selective chemical reactions. Large charge complexes are bound to the bound target and provide ultrasensitive sensing detection of the original target. In particular embodiments, the sensing device is affected by a change in the resistance of some key part ... 09/15/05 - 20050199971 - Integrated sensor and electronics package An integrated sensor and electronics package wherein a micro-electromechanical sensor die is bonded to one side of the package substrate, one or more electronic chips are bonded to an opposite side of the package substrate, internal electrical connections run from the sensor die, through the package substrate, and to the ... 09/15/05 - 20050199970 - Electromechanical resonator and method for fabricating such a resonator An electromechanical resonator includes a monocrystalline-silicon substrate (S) provided with an active zone (ZA) delimited by an insulating region, a vibrating beam (10) anchored by at least one of its free ends on the insulating region and including a monocrystalline-silicon vibrating central part (12), and a control electrode (E) arranged ... 09/15/05 - 20050199969 - Pressure sensor A pressure sensor comprising a plurality of sensor parts arranged in matrix. A first electrode being connected with first wiring and a second electrode being connected with second wiring are disposed oppositely through a cavity part in the sensor part. The second electrode bends to the first electrode side in ... 09/08/05 - 20050194650 - Micromechanical actuator with multiple-plane comb electrodes and methods of making A micro-electro-mechanical component comprising a movable element with comb electrodes, and two stationary elements with comb electrodes aligned and stacked on each other but electrically insulated by a layer of insulation material. The movable element is supported by multiple torsional hinges and suspended over a cavity such that the element ... 08/18/05 - 20050179099 - Integrated getter area for wafer level encapsulated microelectromechanical systems There are many inventions described and illustrated herein. In one aspect, present invention is directed to a thin film encapsulated MEMS, and technique of fabricating or manufacturing a thin film encapsulated MEMS including an integrated getter area and/or an increased chamber volume, which causes little to no increase in overall ... 08/11/05 - 20050173770 - Method and apparatus for making a mems scanner Devices are formed on a semiconductor wafer in an interdigitated relationship and are released by deep reactive ion etching. MEMS scanners are formed without a surrounding frame. Mounting pads extend outward from torsion arms. Neighboring MEMS scanners are formed with their mounting pads interdigitated such that a regular polygon cannot ... 08/11/05 - 20050173769 - Package for a micro-electro mechanical device A package for a micro-electromechanical device (MEMS package) includes an inner enclosure having an inner cavity defined therein, and a fill port channel communicating with the inner cavity and of sufficient length to allow a quantity of adhesive to enter the fill port channel while preventing the adhesive from entering ... 08/04/05 - 20050167769 - Electrode design and positioning for controlled movement of a moveable electrode and associated support structure A MEMS system including a fixed electrode and a suspended moveable electrode that is controllable over a wide range of motion. In traditional systems where an fixed electrode is positioned under the moveable electrode, the range of motion is limited because the support structure supporting the moveable electrode becomes unstable ... 07/28/05 - 20050161751 - Mems device having compact actuator A MEMS device including a plurality of actuator layers formed over a substrate and a bimorph actuator having a substantially serpentine pattern. The serpentine pattern is a staggered pattern having a plurality of static segments interlaced with a plurality of deformable segments. Each of the plurality of static segments has ... 07/28/05 - 20050161750 - Molybdenum-based electrode with carbon nanotube growth A carbon nanotube is formed on at least one Molybdenum-based electrode. In one embodiment, a carbon-nanotube device includes a pair of Molybdenum-based electrodes over respective terraces. Using a catalyst on the Molybdenum-based material of at least one electrode, a carbon nanotube is grown over a gap that separates the terraces ... 07/28/05 - 20050161749 - Apparatus and method for vacuum-based nanomechanical energy force and mass sensors A doubly clamped beam has an asymmetric piezoelectric layer within the beam with a gate proximate to the beam within a submicron distance with a gate and beam dipole. A suspended beam is formed using a Cl2/He plasma etch supplied at a flow rate ratio of 1:9 respectively into a ... 07/21/05 - 20050156260 - Microelectromechanical systems having trench isolated contacts, and methods for fabricating same There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device, having mechanical structures encapsulated in a chamber prior to final packaging and a contact area disposed at least partially outside the ... 07/21/05 - 20050156259 - Mems array, manufacturing method thereof, and mems device manufacturing method based on the same A plurality of elements such as a resistor (10), capacitor (20), and coil (30) and switches 41 to 44 for connecting these elements are formed integrally on a substrate 1 and the elements are made freely connectable to form a MEMS array. The switches 41 to 44 used may be ... 07/14/05 - 20050151214 - Porous gas sensors and method of preparation thereof A sensor is disclosed. A representative sensor includes a silicon substrate having a porous silicon region. A portion of the porous silicon region has a front contact is disposed thereon. The contact resistance between the porous silicon region and the front contact is between about 10 ohms and 100 ohms. ... 07/14/05 - 20050151213 - Method and structure for integrating thermistor A structure and method are provided for forming a thermistor. Isolation structures are formed in a substrate including at least an upper layer of a single crystal semiconductor. A layer of salicide precursor is deposited over the isolation region and the upper layer. The salicide precursor is then reacted with ... 07/07/05 - 20050145962 - Fabrication of mems devices with spin-on glass A method of making an etched structure in the fabrication of a MEMS device involves depositing a bulk layer, typically of polysilicon, prone to surface roughness. At least one layer of photo-insensitive spin-on planarizing material, such as silicate-based spin-on glass, is formed on the bulk layer to reduce surface roughness. ... 07/07/05 - 20050145961 - Mems passivation with transition metals Organic surfactants are employed to passivate the surfaces of MEMS devices, such as digital micromirrors. The binding of these surfactants to the surface is improved by first associating with the surface transition metal atoms or ions from Groups IVB, VB, and IVB of the periodic table. ... 07/07/05 - 20050145960 - Emf sensor with protective sheath A rugged sensor and method for manufacturing such, for use in hostile environments, the sensor exhibiting high mechanical strength to protect the sensor from physical damage. The sensor system also including a modular component that may variously be connected to the sensor to extension thereof, the modular component also exhibiting ... 06/30/05 - 20050139940 - Methods for depositing, releasing and packaging microelectromechanical devices on wafer substrates A method for forming a MEMS device is disclosed, where a final release step is performed just prior to a wafer bonding step to protect the MEMS device from contamination, physical contact, or other deleterious external events. Without additional changes to the MEMS structure between release and wafer bonding and ... 06/30/05 - 20050139939 - Wafer protection device A wafer protection device. The wafer has a first surface etched with an etching fluid and a second surface, and the wafer protection device is applied to the wafer to prevent a specific area on the second surface of the wafer from etching. The wafer protection device has a body ... 06/23/05 - 20050133877 - Chemical sensor The invention concerns a chemical sensor comprising at least one cantilever sensor unit with a capture surface for a chemical substance to be detected. The cantilever comprises a piezoresistor of doped single crystalline silicon with a pair of wires for applying an electrical field over the piezoresistor, and a current ... 06/16/05 - 20050127461 - Molecular modifications of metal/dielectric interfaces A method of increasing the work function of micro-electrodes includes providing a metal or silica surface functionalized with reactive groups and contacting the functionalized surface with a solution of at least one biochemical, having a permanent dipole moment and being capable of self assembly, for a sufficient time for the ... 06/09/05 - 20050121735 - Hermetically sealed silicon micro-machined electromechanical system (mems) device having diffused conductors The present invention is an apparatus and method for a micro-machined electromechanical system (MEMS) device having a hermetically sealed sensor or actuator device mechanism that is electrically interconnected by diffused conductive paths to a plurality of wire bond pads that are located external to the hermetic seal. ... 06/09/05 - 20050121734 - Combination catheter devices, methods, and systems A combination catheter method, system, and device are provided having a capacitive-micromachined ultrasound transducer (“cMUT”) and a sensor fabricated on the same substrate. A substrate is provided, and various layers of materials are deposited onto the substrate and patterned to form a cMUT and one or more sensors. Other embodiments ... 06/02/05 - 20050116307 - Method and arrangement for protecting a chip and checking its authenticity The semiconductor device has a security coating with embedded magnetic particles and magnetoresistive sensors. This renders possible a measurement of the impedance of security elements defined by magnetoresistive sensors and security coating. If initial values of the impedance arc stored, actual values can be compared therewith to see if the ... ### FreshPatents.com Support - Terms & Conditions |