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Active Solid-state Devices (e.g., Transistors, Solid-state Diodes) > Field Effect Device > Charge Transfer Device > Non-electrical Input Responsive (e.g., Light Responsive Imager, Input Programmed By Size Of Storage Sites For Use As A Read-only Memory, Etc.) > Having Structure To Improve Output Signal (e.g., Exposure Control Structure) > Having Alternating Strips Of Sensor Structures And Register Structures (e.g., Interline Imager) Having Alternating Strips Of Sensor Structures And Register Structures (e.g., Interline Imager)Having Alternating Strips Of Sensor Structures And Register Structures (e.g., Interline Imager) patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.09/13/07 - 20070210344 - Semiconductor device It is an object of the present invention to obtain a photoelectric conversion device having a favorable spectral sensitivity characteristic and no variation in output current without such a contamination substance mixed into a photoelectric conversion layer or a transistor. Further, it is another object of the present invention to ... 08/02/07 - 20070176211 - Sensor elements with cantilevered bar structures made of semiconductors based on group iii-nitride The present invention relates to a sensor element which has a semiconductor structure based on a Group III-nitride. The semiconductor sensor element serves for determining the pressure, the temperature, a force, a deflection or an acceleration. It has a substrate base 1, disposed thereon, a homogeneous semiconductor layer based on ... 05/03/07 - 20070096160 - High frequency chip packages with connecting elements A radio frequency chip package is formed by assembling a connecting element such as a circuit board or flexible circuit tape having chips thereon with a bottom plane element such as a lead frame incorporating a large thermally-conductive plate and leads projecting upwardly from the plane of the plate. The ... 04/12/07 - 20070080375 - Solid-state image sensor and method for producing the same A main object of the present invention is to provide a solid-state image sensor capable of efficiently collecting a light beam when the central position of the light receiving element and the central position of the micro lens do not coincide with each other in the plan view owing to ... 03/22/07 - 20070063229 - Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice An inventive electronic device, such as a multi-chip module (MCM), a Single In-line Memory Module (SIMM), or a Dual In-line Memory Module (DIMM), includes a base, such as a printed circuit board, having a surface on which flip-chip pads and wire-bondable pads are provided. The flip-chip pads define an area ... 03/08/07 - 20070051987 - Digital micromirror device and manufacturing method thereof Provided is a digital micromirror device (DMD). The DMD includes a first metal line, a second metal line, a third metal line, and a mirror. The first metal line is formed to have a predetermined line width and a predetermined thickness, and the second metal line is formed to have ... 03/08/07 - 20070051986 - Image sensor and method of fabricating the same An image sensor is provided. The image sensor includes a substrate having a plurality of cell regions, photodiodes formed in the cell regions of the substrate an antireflection layer, a color filter layer, a planarization layer, and a plurality of microlenses. The antireflection layer is formed above the substrate including ... 11/09/06 - 20060249757 - Reticulated gate ccd pixel with diagonal strapping A sensor includes an array of pixels organized in rows and columns and a plurality of metal busses overlaying the array of pixels. A first column of pixels includes a proximal set of first pixels and a distal set of first pixels separated by a first jog region. A second ... 10/26/06 - 20060237751 - Image pickup device, image pickup unit and image pickup apparatus An image pickup device wherein the range in the amount of incident light (dynamic range) for obtaining an appropriate image can be expanded, and shutter and aperture functions are provided. A light shielding element for light shielding a photoelectric conversion section and an actuator for driving the light shielding element ... 09/21/06 - 20060208284 - Method for manufacturing a microlens substrate and method for manufacturing a liquid crystal panel Disclosed herein is a method for manufacturing a microlens substrate which is excellent in chemical resistance and light fastness to intense light irradiation, and is capable of forming a microlens substrate of a high accuracy of form. The method includes the steps of: forming a lens-shaped curve at a surface ... 07/27/06 - 20060163620 - Charge coupled device and solid-state imaging apparatus When capacity coupling between an output gate electrode (OG) and a last-stage transfer electrode is large at an output end of a CCD shift register, an electric potential of the OG is varied according to transfer clocks with the result that noise is liable to generate in an output signal. ... 07/27/06 - 20060163619 - Solid-state imaging device and method for producing solid-state imaging device A solid state image pickup device in which an image pickup region composed of a plurality of light-receiving pixel portions 1 and a transfer register 2 for transferring in one direction the signal charges accumulated in the light-receiving pixel portions 1 is formed on the face layer portion side of ... 07/13/06 - 20060151813 - Substrate for forming a solid-state image pickup element, solid-state image pickup element using the same, and method of producing the same A substrate for a solid-state image pickup element, comprising: an n-type silicon substrate; and an n-type epitaxial growth layer formed on a surface of the n-type silicon substrate, wherein the substrate is configured to form a solid-state image pickup element in the n-type epitaxial growth layer, the solid-state image pickup ... 06/22/06 - 20060131617 - Frequency conversion circuit for direct conversion receiving, semiconductor integrated circuit therefor, and direct conversion receiver A rectangular parallelepiped p-channel MOS transistor 21 having a height of HB and a width of WB is formed on a silicon substrate, and a gate oxide film is formed on a part of the top surface and the side surface of the p-channel MOS transistor 21. A source and ... 06/08/06 - 20060118832 - Fast switching power insulated gate semiconductor device An insulated gate semiconductor device (30) includes a gate (34), a source terminal (36), a drain terminal (38) and a variable input capacitance at the gate. A ratio between the input capacitance (Cfiss) when the device is on and the input capacitance Ciiss when the device is off is less ... 03/23/06 - 20060060891 - Redistributed solder pads using etched lead frame A semiconductor package has a thinned semiconductor die fixed in a shallow opening in a conductive body. The die electrodes at the bottom of the die are plated with a redistributed contact which overlaps the die bottom contact and an insulation body which fills the annular gap between the die ... 03/16/06 - 20060054938 - Gate driver with programmable dead-time insertion A dead-time generator for incorporation in an integrated circuit wherein the integrated circuit includes a high side and low side gate driver and wherein the high side and low side gate driver drive output switches such that a dead-time is provided between on times of the output switches, the dead-time ... 02/23/06 - 20060038204 - Solid-state imaging device and method for manufacturing the same A transfer film, on which an adhesive is applied, is glued to plural spacers formed on a glass substrate. The glass substrate is laid on a working table, and one end of the transfer film is fixed to a winding roller. A peeling guide is set at a position over ... 02/02/06 - 20060022225 - Metal bond pad for integrated circuits allowing improved probing ability of small pads The present invention is a metal bond pad that provides electrical and mechanical connection to an integrated circuit (IC). The metal bond pad is configured to accommodate for probe travel during probing measurements, without modifying the size of the passivation opening of the bond pad. This enables higher density of ... 01/12/06 - 20060006428 - Image sensor and method of fabricating the same Image sensors and methods of fabricating the same are provided. The image sensor includes a blocking pattern disposed on photodiodes. The blocking pattern is formed of insulation material having a metal diffusion coefficient which is lower than a silicon oxide diffusion coefficient. Therefore, dark defects of the image sensor are ... 12/29/05 - 20050285153 - Transistor, memory cell array and method of manufacturing a transistor A transistor, memory cell array and method of manufacturing a transistor are disclosed. In one embodiment, the invention refers to a transistor, which is formed at least partially in a semiconductor substrate, comprising a first and a second source/drain regions, a channel region connecting said first and second source/drain regions, ... 12/22/05 - 20050280048 - Memory device with high dielectric constant gate dielectrics and metal floating gates A memory cell transistor includes a high dielectric constant tunnel insulator, a metal floating gate, and a high dielectric constant inter-gate insulator comprising a metal oxide formed over a substrate. The tunnel insulator and inter-gate insulator have dielectric constants that are greater than silicon dioxide. Each memory cell has a ... 12/22/05 - 20050280047 - Fuse of a semiconductor memory device and repair process for the same Disclosed herein is a fuse of a semiconductor memory device and a repair process for the same. The fuse includes a lower conductive film of a multilayer interconnection formed on a lower structure of a semiconductor substrate, an upper conductive film of the multilayer interconnection spaced apart upward from the ... 12/15/05 - 20050274991 - Radiographic imaging substrate, radiographic imaging apparatus, and radiographic imaging system A radiographic imaging apparatus, comprising: a photoelectric conversion substrate including a pixel area where there are arranged a plurality of pixels each formed of a photoelectric conversion element and a switching element connected to the photoelectric conversion element in a matrix formed on an insulating substrate, a bias line for ... 12/15/05 - 20050274990 - Whole chip esd protection This invention provides two circuit embodiments for a whole chip electrostatic discharge, ECD, protection scheme. It also includes a method for whole chip ESD protection. This invention relates to distributing the circuit of this invention next to each input/output pad in order to provide parallel ESD current discharge paths. The ... 12/15/05 - 20050274989 - Integrated test circuit arrangement and test method An integrated test circuit arrangement is provided that contains integrated test structures, at least one integrated heating element, an integrated detection unit, an integrated supply unit, and a control unit. The integrated detection unit detects at least one physical property for each of the test structures. The integrated supply unit ... 09/08/05 - 20050194619 - Sicoh dielectric material with improved toughness and improved si-c bonding, semiconductor device containing the same, and method to make the same A low-k dielectric material with increased cohesive strength for use in electronic structures including interconnect and sensing structures is provided that includes atoms of Si, C, O, and H in which a fraction of the C atoms are bonded as Si—CH3 functional groups, and another fraction of the C atoms ... 06/02/05 - 20050116262 - Method for programming p-channel eeprom A method for programming a P-channel EEPROM having an N-well, a floating gate, a control gate, a P-type source region and a P-type drain region is provided. In the method, the N-well is grounded, a first positive voltage is applied to the control gate, a second positive voltage or a ... 06/02/05 - 20050116261 - In-pixel memory for display devices Magnetoresistive random access memory (MRAM) is used to provide in-pixel memory circuits for display devices. A memory circuit (25) comprises two MRAMs (60, 62), each coupled to a respective input of a flip-flop circuit (64). A display device (1) is provided comprising a plurality of pixels (20) each associated with ... ### FreshPatents.com Support |