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Active Solid-state Devices (e.g., Transistors, Solid-state Diodes) > Field Effect Device > Charge Transfer Device > Non-electrical Input Responsive (e.g., Light Responsive Imager, Input Programmed By Size Of Storage Sites For Use As A Read-only Memory, Etc.) > Having Structure To Improve Output Signal (e.g., Exposure Control Structure) Having Structure To Improve Output Signal (e.g., Exposure Control Structure)Having Structure To Improve Output Signal (e.g., Exposure Control Structure) patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.11/08/07 - 20070257282 - Image sensor applying power voltage to backside of semiconductor substrate and method of manufacturing image sensor An image sensor applying a power voltage to a backside of a semiconductor substrate includes a first type semiconductor substrate, a first type semiconductor layer formed on the first type semiconductor substrate, a second type semiconductor layer formed on the first type semiconductor layer, and a power voltage receiver formed ... 09/13/07 - 20070210343 - Image sensor and an apparatus for an image sensor using same In a CCD type solid-state image sensor (CCD) of this invention, a potential gradient is provided in which potentials about electric signals gradually change from a photodiode toward a gate electrode. Specifically, impurities forming the photodiode are diffused in the shape of character “X”, and the width of the impurities ... 09/07/06 - 20060197114 - Solid-state image sensor A solid-state image sensor capable of suppressing blooming and increase of a dark current also when an n-type impurity concentration in a transfer channel region is increased is obtained. In this solid-state image sensor, gate electrodes of a prescribed pixel and another pixel adjacent to the prescribed pixel are provided ... 06/08/06 - 20060118831 - Semiconductor package and manufacturing method thereof A semiconductor package may include a substrate having a first major surface supporting a substrate pad and a bump pad electrically connected to the substrate pad. The substrate may have a second major surface with a concave part. A substrate window may extend through the substrate and open at the ... ### FreshPatents.com Support |