REGISTER now for FREE 
|
FREE patent keyword monitoring and additional FREE benefits. REGISTER now for FREE
|
|
|
Active Solid-state Devices (e.g., Transistors, Solid-state Diodes) > Regenerative Type Switching Device (e.g., Scr, Comfet, Thyristor) > With Housing Or External Electrode With Housing Or External ElectrodeWith Housing Or External Electrode patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.11/15/07 - 20070262346 - Electronic component and a method for its production An electronic component includes a vertical semiconductor power transistor and a further semiconductor device arranged on the transistor to form a stack. The first vertical semiconductor power transistor has a semiconductor body having a first side and a second side and device structures, at least one first electrode positioned on ... 07/12/07 - 20070158682 - Semiconductor device A semiconductor device is provided which comprises a connecting lead 4 mounted between a MOS-FET 1 and a regulatory IC 2 on a support plate 3. Connecting lead 4 has a thermally radiative and electrically conductive substrate 6 and electrically insulative and thermal transfer-resistive covering 7. Substrate 6 has one ... 06/21/07 - 20070138503 - Semiconductor package structure for vertical mount and method In one embodiment, a semiconductor package structure includes a plurality of upright clips having ends with mounting surfaces for vertically mounting the package to a next level of assembly. A semiconductor chip is interposed between the upright clips together with one or more spacers. ... 03/15/07 - 20070057284 - Double-sided package for power module An electronic semiconductor package is described. The package has a wide band gap electronic semiconductor device requiring heat removal. On one side of the electronic semiconductor device is a first, thermally-conductive, electrically-insulative substrate having a predetermined electrically-conductive wire pattern affixed thereto. On the other side of the electronic semiconductor device ... 03/08/07 - 20070051974 - Semiconductor device and power conversion apparatus using the same The power conversion apparatus uses the semiconductor device. Said semiconductor device includes a first group of power semiconductor elements at least one of which is electrically connected between a first potential and a third potential, a second group of power semiconductor elements at least one of which is electrically connected ... 02/22/07 - 20070040187 - Semiconductor device and manufacturing method of the same There is a need for providing a technology capable of decreasing on-resistance of a power transistor in a semiconductor device that integrates the power transistor and a control integrated circuit into a single semiconductor chip. There is another need for providing a technology capable of reducing a chip size of ... 02/22/07 - 20070040186 - Power semiconductor packaging method and structure A semiconductor chip packaging structure comprising a dielectric film having one or more through holes aligned with the one or more contact pads of at least one power semiconductor chip. A patterned electrically conductive layer adjacent to the dielectric film has one or more electrically conductive posts which extend through ... 01/25/07 - 20070018197 - Semiconductor device A semiconductor device is disclosed that includes a first and a second semiconductor package. Each semiconductor package includes a semiconductor element, a plurality of electrode members, and an encapsulating member. The semiconductor elements are interposed between the respective electrode members, and the electrode members are in electrical communication with and ... 12/21/06 - 20060284211 - Power semiconductor module The power semiconductor module includes a module package housing power semiconductor devices therein and a magnetic core set around the module package, such that magnetic core surrounds the power semiconductor devices such as IGBTs. Alternatively, the magnetic core is built in the module package such that the outer circumference faces ... 11/16/06 - 20060255362 - Semiconductor component in a standard housing and method for the production thereof The standard housing (27) of a semiconductor component (21), preferably a power semiconductor component features a plurality of external leads (1-5). Between adjacent external leads (2-3 and 4-5) for identical supply potentials or signals, mechanically reinforcing flat conductor webs (28) electrically connecting the external leads (2-3 and 4-5) are located ... 09/28/06 - 20060214186 - Insulated power semiconductor module with reduced partial discharge and manufacturing method A method for assembling a power semiconductor module with reduced partial discharge behavior is described. The method includes steps of bonding an insulating substrate onto a bottom plate; disposing a first conductive layer on a portion of said insulating substrate, so that at least one peripheral top region of said ... 09/14/06 - 20060202228 - Semiconductor device A semiconductor device is provided which comprises a heat-radiative support plate 5; and first and second semiconductor elements 1 and 2 mounted and layered on support plate 5 for alternate switching of first and second semiconductor elements 1 and 2. The arrangement of piling and securing first and second semiconductor ... 08/10/06 - 20060175630 - Electronic power module comprising a rubber seal and corresponding production method An aim of an embodiment is to reduce the volume of power modules, especially for electronic motor control devices. An area is formed between cooling elements with the aid of an annular shaped rubber seal. A semi-conductor device is sealed with a sealing compound therein. Both sides of the semi-conductor ... 06/29/06 - 20060138452 - Power semiconductor module A power semiconductor module (1) with a housing (2) and at least one semiconductor chip (3, 3′) located in it is devised. At least one semiconductor chip (3, 3′) has a first main electrode side (31) and a second main electrode side (32) opposite the first main electrode side, the ... 06/08/06 - 20060118815 - Power semiconductor device A power semiconductor device is disclosed. In one embodiment, the power semiconductor device includes a plurality of device components that are contact-connected by bonding wires having different thicknesses. The surface of at least one bonding wire serves as a contact area for at least one further bonding wire, the bonding ... 06/01/06 - 20060113562 - Semiconductor power module having an electrically insulating heat sink and method of manufacturing the same A semiconductor power module includes a lead frame having a first portion at a first level, a second portion surrounding the first portion at a second level, and a plurality of terminals connected to the second portion. The semiconductor power module further includes a power circuit mounted on a first ... 05/25/06 - 20060108601 - Insulating substrate and semiconductor device An insulating substrate includes a metal base as a base member, an insulating layer which is a room temperature, aerosol deposited shock solidification film formed on the metal base, and a circuit pattern which is a cold sprayed thermal spray coating formed on the insulating layer. A semiconductor device incorporates ... 04/06/06 - 20060071238 - Power module A power module that includes a power circuit assembly in which power components are electrically and mechanically connected without wires. ... 03/02/06 - 20060043414 - Rectification chip terminal structure A rectification chip terminal structure for soldering a rectification chip encased in a glass passivated pallet (GPP) on a terminal filled with a packaging material to form a secured mounting for the rectification chip is to be inserted in a coupling bore of a circuit board. The structure includes a ... 02/16/06 - 20060033122 - Half-bridge package A semiconductor package which includes two power semiconductor die arranged in a half-bridge configuration. ... 10/06/05 - 20050218426 - Power semiconductor module A power semiconductor module has a circuit assembly body, which includes a metal base, a ceramic substrate, and a power semiconductor chip, and is combined with a package having terminals formed integrally. The ceramic substrate of the module has a structure such that an upper circuit plate and a lower ... 08/04/05 - 20050167696 - Silicon nitride insulating substrate for power semiconductor module An aspect of the present invention provides a power module for automotive switching applications including a plurality of semiconductor chips and a unitary silicon nitride substrate. The plurality of semiconductor chips are attached to the silicon nitride substrate and the substrate is configured to have a thermal coefficient of expansion ... 07/14/05 - 20050151161 - Electronic assembly An electronic system having a sandwich design and including two carriers, each carrier having a printed circuit layer, the upper printed circuit layer being positioned on different planes. ... ### FreshPatents.com Support |