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Active Solid-state Devices (e.g., Transistors, Solid-state Diodes) > Incoherent Light Emitter Structure > Encapsulated EncapsulatedEncapsulated patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.11/22/07 - 20070267651 - Semiconductor device having a fuse and method of forming thereof A fuse (43) is formed overlying a passivation layer (35) and under a packaging material (55, 70). In one embodiment, a fuse (43) is blown before the packaging material (55, 70) is formed. In some embodiments, the fuse (43) may be formed of metal (47), a metal nitride (42) or ... 08/30/07 - 20070200133 - Led assembly and manufacturing method An LED assembly including a wiring substrate with an opening at its center; a heat sink housed inside the opening; an LED chip mounted on the heat sink; a connecting section for electrically coupling the LED chip and wiring substrate; and a transparent resin covering the LED chip and connecting ... 08/16/07 - 20070187710 - Led light source An LED unit (20) having increased light output. The LED unit (20) includes a submount substrate (22) having a cavity (24). An LED chip (30) is electrically mounted within the cavity (24) and a phosphor layer (34) is deposited in the cavity (24) that converts blue light from the LED ... 08/09/07 - 20070181902 - Transparent epoxy resin composition for molding optical semiconductor and optical semiconductor integrated circuit device using the same R2: an alkyl group (—CH3, —C2H5, —C3H7) ... 07/26/07 - 20070170456 - Light emitting diode package with coaxial leads The leads of a light emitting diode are made coaxial. The inner lead protrudes lower than the outer lead. The package is inserted into a spongy display panel for power supply. The display panel has three layers: a lower conducting layer for contacting said inner lead and a top conducting ... 07/26/07 - 20070170454 - Packages for semiconductor light emitting devices utilizing dispensed reflectors and methods of forming the same A packaged LED includes a substrate, an LED chip on the upper surface of the substrate, a first encapsulant material, including a reflective material, on the substrate and spaced apart from the LED chip, and a second encapsulant material on the LED chip. A method of forming a packaged LED ... 07/12/07 - 20070158676 - Solid-state imaging device, production method and drive method thereof, and camera A method of driving a solid-state imaging device using a 4 phase driving method, a 3 phase driving method or a 6 phase driving method. A single-layer transfer electrode configuration of forming first transfer electrodes and second transfer electrodes by one polysilicon layer is used. Two shunt wirings extending in ... 06/07/07 - 20070126020 - High-power led chip packaging structure and fabrication method thereof A packaging structure and a related fabrication method for high-power LED chip are provided herein, which mainly contains a base made of a metallic material and an electrically insulating material integrated into a single object. The metallic material forms a heat sinking seat in the middle of the base, which ... 05/24/07 - 20070114559 - Light emitting diode device having a shield and/or filter A light emitting diode device capable of shielding or filtering the light in a manner to provide high-gradient edges or regions within the beam pattern. The LED device is also capable of providing selective coloring, thereby cost effectively improving the adaptability and number of applications which can utilize the LED ... 05/24/07 - 20070114558 - Led module An LED module to realize light source performance as desire is comprised of multiple LEDs, a light-emitting chip of each LED being disposed in a carrier on a substrate; conduction circuits with different polarities being provided perimeter to the carrier on the substrate; golden plate wire connecting the chip and ... 05/17/07 - 20070108464 - Led package with improved heat dissipation and led assembly incorporating the same An LED package with improved heat dissipation and an LED assembly incorporating the same. The LED package includes a base made of a thermally conductive polymer; a pair of terminals formed on an upper side of the base; a LED chip electrically connected to the terminals; and a transparent encapsulant ... 05/17/07 - 20070108463 - Light-emitting diode with uv-blocking nano-particles A light-emitting device has an encapsulated light-emitter. Nano-particles substantially transparent to visible light block UV light. ... 05/03/07 - 20070096140 - Sealing structure for a white light led A sealing structure for a white light LED comprises a printed circuit layer located on a base, a cladding layer having a through hole is arranged on the printed circuit layer. A chip is received in the through hole and is electrically connected to the printed circuit layer by a ... 05/03/07 - 20070096139 - Light emitting diode encapsulation shape control A semiconductor optical device is encapsulated by disposing the semiconductor optical device in a cavity defined by a cavity wall. The cavity wall is coated with a coating material having a first surface energy. An encapsulant having a second surface energy is introduced into the cavity adjacent to the light ... 04/19/07 - 20070085105 - Light emitting diode and side emitting lens The invention is an illumination system that incorporates a light emitting diode and a side-emitting light-recycling lens. The side-emitting light-recycling lens recycles part of the light internally generated by a light emitting diode back to the light emitting diode as externally incident light. The light emitting diode reflects a portion ... 04/12/07 - 20070080364 - White light emitting device capable of adjusting color temperature A white light emitting device includes a first light emitting device, a photoluminescent phosphor, a second light emitting device, and a current adjuster. The first light emitting device has a light emitting layer made of semiconductor, and emits blue light. The photoluminescent phosphor completely absorbs light emitted by the first ... 04/12/07 - 20070080363 - Phosphor, light emitting device by using the same and manufacturing method of the same Disclosed are a phosphor, which a light emitting device using the phosphor, and a method for producing the phosphor, which allows to control color coordinates, color temperatures and color rendering indexes by shifting a main emission peak without a decrease in light emission luminosity by changing the concentration of an ... 03/15/07 - 20070057274 - White-light luminescent silicon-nitride component with silicon quantum dots and fabricating method thereof The present invention provides a luminescent component with silicon quantum dots and its fabricating method, where the luminescent component includes a light-emitting device of high luminescent efficiency, large-area luminescence, cheap raw material and low producing cost. ... 03/01/07 - 20070045650 - Phosphor and blends thereof for use in leds Phosphor compositions having the formula EueMmAaGgQqNnXx, where M is at least one of Be, Mg, Ca, Sr, Ba, Cd, Sn, Pb or Zn; A is at least one of B, Al, Ga, In, Bi, Sc, Y, La or a rare earth element other than Eu; G is at least one ... 02/15/07 - 20070034890 - Multiple die led and lens optical system A light emitting device includes a number of light emitting diode dies (LEDs) mounted on a shared submount and covered with a single lens element that includes a corresponding number of lens elements. The LEDs are separated from each other by a distance that is sufficient for lens element to ... 01/18/07 - 20070012942 - Light emitting diode package with coaxial leads The leads of a light emitting diode are made coaxial. The inner lead protrudes lower than the outer lead. The package is inserted into a spongy display panel for power supply. The display panel has three layers: a lower conducting layer for contacting said inner lead and a top conducting ... 12/28/06 - 20060289890 - Light emitting device A light emitting device includes: a first LED that emits a first primary light in a first primary wavelength range when activated; a second LED that emits a second primary light in a second primary wavelength range when activated, the second primary wavelength range differing from the first primary wavelength ... 12/21/06 - 20060284209 - Light emitting device package A light emitting device package is provided. The light emitting device package comprises a base substrate on which a wiring pattern is formed; a light emitting device mounted on the base substrate to emit light when supplied with driving power through the wiring pattern; a molded lens stably seated on ... 12/21/06 - 20060284208 - Light emitting diode device using electrically conductive interconnection section A light emitting diode devic that includes (a) a light emitting diode section, (b) an electrically conductive pad section being disposed outside the light emitting diode section and being electrically connected to an external power source, and (c) at least one electrically conductive interconnection section for connecting the electrically conductive ... 12/14/06 - 20060278887 - White light-emitting diode and manufacturing method therefor The present invention relates to a white light-emitting diode which emits white light by combining a blue light emitted from a light-emitting diode chip for emitting the blue light, with a light that is emitted through being excited by the blue light emitted from the light-emitting diode chip; and a ... 12/07/06 - 20060273340 - Led package and method using the same An LED package including an LED chip (LA, A, B), a sealed transparent envelope (D) containing the LED chip inside, transparent liquid (E) filled in the envelope, electrodes (C) is disclosed. The LED chip comprises a plurality of conductive nodes. The transparent liquid is provided with a high resistance, the ... 11/30/06 - 20060267042 - Light emitting apparatus and method of manufacturing the same A light emitting apparatus comprising a light emitting device (101) disposed on a supporting body (105), and coating layers ((108, 109) that bind a fluorescent substance that absorbs light emitted by the light emitting device (101) and emits light of a different wavelength and secures the fluorescent substance onto the ... 11/30/06 - 20060267041 - High-brightness light-emitting diode A high-brightness light-emitting diode is disclosed. The high-brightness light-emitting diode, comprises: a chip; a base for holding the chip; and a transparent layer for covering the chip, wherein the chip is connected to an electrode by a metal wire. The improvement comprises an adhesive injection hole formed on the transparent ... 11/23/06 - 20060261366 - Integrated light-emitting device An integrated light-emitting device includes a substrate, a reflecting layer containing at least one reflector cup molded over the substrate to define a cup-shaped recess and having a reflective surface in the cup-shaped recess, a light-generating source mounted on the substrate within the cup-shaped recess, an encapsulating layer molded over ... 11/23/06 - 20060261365 - Multichip light emitting diode package A multichip light emitting diode package is provided. The multichip light emitting diode (LED) package includes a substrate having a non-plane surface including a plurality of sectioned-surfaces, a plurality of light emitting diode chips and a transparent molding material. Each of the light emitting diode chips is disposed on one ... 11/23/06 - 20060261364 - Solid element device and method for manufacturing thereof A method for manufacturing a solid element device, which comprises providing a glass-containing Al2O3 substrate (3) having a GaN based LED element (2) placed thereon, setting a P2O5—ZnO based low melting point glass in parallel with the substrate, and carrying out a press working at a temperature of 415° C. ... 11/16/06 - 20060255359 - Light emitting diode light source model An LED light source model has a substrate, at least one bare LED chip, a transparent layer and an optical light collecting element. The substrate has a top face, a bottom face and at least one chip cup defined on the top face. The at least one LED chip is ... 10/05/06 - 20060220056 - Light emitting display and method of manufacturing the same A method of manufacturing a light emitting display including an image display part formed on a substrate and a pad part including at least one terminal electrically connected to the image display part. The method includes forming thin film transistors and at least one electroluminescent device electrically connected to the ... 10/05/06 - 20060220055 - Light emitting diode systems Light emitting diode systems are disclosed. An optical display system that includes a light emitting diode (LED) and a cooling system is disclosed. The cooling system is configured so that, during use, the cooling system regulates a temperature of the light emitting diode. ... 10/05/06 - 20060220054 - Super light full space emitting diode buled Certain aspects of the invention may be found in an SLED with an improved luminance dispersion diagram. In one embodiment of the invention, an SLED may include a light-emitting element of solid geometry comprising a p-n junction. The light emitting element of solid geometry may enable distribution of light energy ... 09/28/06 - 20060214181 - Light emitting diode package with protective function against electrostatic discharge The present invention provides an LED package having an MEMS switch operated by electrostatic force, capable of continuously protecting an LED from excessive current due to electrostatic discharge. The invention includes a submount with first and second electrode patterns formed thereon; an LED mounted on the submount, having an n-electrode ... 09/28/06 - 20060214180 - Semiconductor apparatus and method of assembling the same In a semiconductor apparatus, a plurality of light-triggered type semiconductor devices, each having a groove for burying of an optical fiber for supplying an optical gate signal to a housing of the light-triggered type semiconductor device, are connected in series. Device cooling heat sinks, each having a flow path for ... 09/21/06 - 20060208272 - Method for filling recessed micro-structures with metallization in the production of a microelectronic device A method for filling recessed micro-structures at a surface of a semiconductor wafer with metallization is set forth. In accordance with the method, a metal layer is deposited into the micro-structures with a process, such as an electroplating process, that generates metal grains that are sufficiently small so as to ... 09/21/06 - 20060208271 - Light source apparatus and fabrication method thereof A light source apparatus and a fabrication method thereof can prevent light interference between light emitting devices adjacent to each other by forming a groove in a sub-mount and bonding a light emitting device to the groove, enhance heat radiating effect as well as luminous efficiency by collecting light emitted ... 09/21/06 - 20060208270 - Borate phosphor materials for use in lighting applications Boron containing phosphor compositions having the formulas (1) M3Ln2(BO3)4 doped with at least one activator selected from the group of Eu2+, Mn2+, Pb2+, Ce3+, Eu3+, Tb3+, and Bi3+ where M is at least one of Mg, Ca, Sr, Ba, or Zn, and Ln is at least one of Sc, Y, ... 08/31/06 - 20060192225 - Light emitting device having a layer of photonic crystals with embedded photoluminescent material and method for fabricating the device A light emitting device and method for fabricating the device utilizes a layer of photonic crystals with embedded photoluminescent material over a light source. The layer of photonic crystals with the embedded photoluminescent material can be used in different types of light emitting devices, such as lead frame-mounted light emitting ... 08/24/06 - 20060186431 - Light emitting device provided with lens for controlling light distribution characteristic The light emitting device comprises a substrate (2), a positive electrode (6) and a negative electrode (4) formed on the substrate (2), a light emitting diode (8) connected to the positive electrode (6) and the negative electrode (4), the transparent resin (12 and 14) that covers the light emitting diode ... 08/24/06 - 20060186430 - Light emitting diode package and fabrication method thereof The present invention provides an LED package and the fabrication method thereof. The present invention provides an LED package including a submount silicon substrate and insulating film and electrode patterns formed on the submount silicon substrate. The LED package also includes a spacer having a through hole, formed on the ... 08/24/06 - 20060186429 - Semiconductor light emitting device and method of manufacture A light-emitting diode (“LED”) device has an LED chip attached to a substrate. The terminals of the LED chip are electrically coupled to leads of the LED device. Elastomeric encapsulant within a receptacle of the LED device surrounds the LED chip. A second encapsulant is disposed within an aperture of ... 08/24/06 - 20060186428 - Light emitting device with enhanced encapsulant adhesion using siloxane material and method for fabricating the device A light emitting device and method for fabricating the device utilizes an adhesive layer of siloxane material to enhance the adhesion of an encapsulant to a light source, one or more leadframes and/or a reflector cup surface. The siloxane layer can be used in different types of light emitting devices, ... 08/17/06 - 20060180828 - Light source apparatus and fabrication method thereof A light source apparatus and a fabrication method thereof can prevent light interference between light emitting devices adjacent to each other and increase the luminous efficiency by collecting light emitted from the side of the light emitting device toward the front of a metal stem by forming grooves at a ... 08/17/06 - 20060180827 - Led light set An LED light set comprising at least one LED dice and two conductive wires covered by insulated layer, a holder is installed on the wires at every certain distance, one LED dice is installed on every holder; each of the LED dice connects to two conductive wires with very thin ... 07/27/06 - 20060163602 - Optical semiconductor device An optical semiconductor device (A1) comprises a light reflector (5) and an optical semiconductor chip (3). The reflector (5) includes two first reflecting surfaces (50a) spaced from each other in direction x, and two second reflecting surfaces (50b) spaced from each other in direction y. The chip (3) includes a ... 07/27/06 - 20060163601 - Lighting module and method the production thereof An illumination module with at least one thin-film light emitting diode chip which is applied on a chip carrier having electrical connecting conductors and has a first and a second electrical connection side and also an epitaxially fabricated semiconductor layer sequence. The semiconductor layer sequence has an n-conducting semiconductor layer, ... 07/20/06 - 20060157727 - Semiconductor photodetector A semiconductor photodetector which can achieve spectral sensitivity characteristics close to relative luminous characteristics at low cost while using a light receiving element of a semiconductor made from such as silicon, has a semiconductor light receiving element having high spectral sensitivity in a wavelength range between approximately 400 nm to ... 07/20/06 - 20060157726 - Semiconductor light emitting device mounting substrates including a conductive lead extending therein and methods of packaging same A mounting substrate for a semiconductor light emitting device includes a thermally conductive mounting block. The mounting block has, in a first face thereof, a cavity that is configured to mount a semiconductor light emitting device therein and to reflect light that is emitted by the semiconductor light emitting device ... 06/29/06 - 20060138444 - Flip-chip bonding structure of light-emitting element using metal column A flip-chip bonding structure of a light-emitting element is provided. The structure improves a heat emission efficiency by using a metal column having a high thermal conductivity instead of a solder bump. The structure includes a light-emitting element, a sub-mount, and a metal column. The metal column connects the light-emitting ... 06/29/06 - 20060138443 - Encapsulation and packaging of ultraviolet and deep-ultraviolet light emitting diodes Disclosed are the materials and methods used to package and encapsulate UV and DUV LEDs. These LEDs have emission wavelengths in the range from around 360 nm to around 200 nm. The UV/DUV LED die or its flip-chip bonded subassembly are disposed in a low thermal resistance packaging house. Either ... 06/22/06 - 20060131602 - Illumination assembly and method of making same An illumination assembly including a thermally conductive substrate, a patterned conductive layer proximate a major surface of the thermally conductive substrate, a dielectric layer positioned between the patterned conductive layer and the major surface of the substrate, and at least one LED including a post that is attached to the ... 06/08/06 - 20060118808 - Semiconductor device A semiconductor device for adequately removing heat generated by a semiconductor element is provided. A semiconductor device 100 is equipped with a substrate 2, having a bottom surface 2b and an element mounting surface 2a which is positioned on the opposite side of bottom surface 2b, and a semiconductor element ... 06/01/06 - 20060113556 - Method and apparatus for calibrating a metrology tool A method and apparatus for calibrating a metrology tool are disclosed. The apparatus includes a substrate having at least one calibration site formed thereon. The calibration site includes a pattern of cells that have at least one feature disposed in a surface of the substrate. The feature provided for measurement ... 05/25/06 - 20060108597 - Light-emitting device and vehicle lamp A light-emitting device in which a light-emitting element, such as an LED, and an electrostatic protection element for protecting the light-emitting element from electrostatic breakdown are connected in parallel. The light-emitting device is configured such that a connection wire member of the light-emitting element and a connection wire member of ... 05/18/06 - 20060102923 - Optical element housing package In a package for housing an optical element, if the size of an optical element chip and of a metal cap increase, the flatness of a flange of the metal cap can be maintained when the metal cap is bonded by seam welding to the package body, and the optical ... 05/18/06 - 20060102922 - Led heat dissipation support A light emitting diode chip carrier to improve heat dissipation by providing a thicker heat dissipation area between two supports that carry the light-emitting chip; and heat absorption and dissipation results by the metallic material help absorb the heat generated by the acting light emitting chip for the LED to ... 05/04/06 - 20060091418 - Side emitting led device and method of fabrication In one embodiment, a light emitting diode (LED) device comprises an LED die for generating output light and an encapsulant sealing the LED die, the encapsulant comprising a conical structure extending away from the LED die and positioned above the LED die, wherein a profile of the conical structure causes ... 04/27/06 - 20060086947 - Securing a transistor outline can within an optical component The present invention relates to affixing components of optical packages. The optical packages can include an optical component, such as a TO-Can. The TO-Can can house an optical transmitter and/or an optical receiver. Another optical component of the optical package can be a barrel for aligning the TO-Can with an ... 04/27/06 - 20060086946 - Method and apparatus for mixing light emitted by a plurality of solid-state light emitters In one embodiment, light emitted by a plurality of solid-state light emitters is mixed by mounting the plurality of solid-state light emitters on a transparent to translucent substrate so that they primarily emit light away from the substrate. The light emitters are then covered with a transparent to translucent encapsulant; ... 04/20/06 - 20060081871 - Multiple light-emitting diode arrangement A radiation-emitting semiconductor component comprising a plurality of semiconductor bodies (10, 20, 30) which each have an active zone (11, 21, 31) and during operation emit light having in each case a different central wavelength (λ10, λ20, λ30) and an assigned spectral bandwidth (Δλ10, Δλ20, Δλ30), so that the mixing ... 03/30/06 - 20060065907 - White light emitting device and manufacturing method thereof A white light emitting device (LED) and a manufacturing method thereof wherein an LED coated with polymeric resin in which organic phosphors are solved and inorganic phosphors are dispersed creates a white LED, thereby producing an effect of excellent luminance and color coordinate without creating a compatibility problem with the ... 03/23/06 - 20060060882 - Optical semiconductor device, optical communication device, and electronic equipment An optical semiconductor device has an optical semiconductor element (2) such as an LED or PD, and a light-permeable resin (4) encapsulating the optical semiconductor element. The light-permeable resin contains a base resin and filler. The light-permeable resin (4) has a characteristic that its transmittance increases with a temperature rise ... 03/16/06 - 20060054915 - Led package A LED package includes a heat conductive base plate and a light emitting diode disposed thereon. A transparent encapsulating layer without luminescent powder seals the light emitting diode and a ventilation layer thereon is adapted to communicate with outside air. A luminescent plate is over the ventilation layer. ... 03/16/06 - 20060054914 - Composite heat conductive structure for a led package A composite heat conductive structure for a LED package includes an upper heat conductive base plate substantially made of ceramic material with a hole and a lower heat conductive member with a hollow portion of cylindrical shape on a top surface thereof. The lower heat conductive member is detachably secured ... 03/09/06 - 20060049423 - Light-emitting device A light-emitting device has a light-emitting portion having a light-emitting element; a heat dissipation base on which is mounted the light-emitting portion and which is exposed outwardly for dissipating heat produced by the light-emitting portion; a power feeding portion for feeding power to the light-emitting portion; and a sealing portion ... 03/09/06 - 20060049422 - Surface mount led An LED can include a silicon substrate that has a conductive pattern including an LED chip equipped portion, a connection portion, and external electrodes. A glass frame can be anodic-bonded onto the silicon substrate, and can include a through-hole forming a lamp house. An LED chip can be mounted onto ... 03/02/06 - 20060043407 - Semiconductor light emitting apparatus A semiconductor light emitting apparatus comprises: a first lead having a recess; a second lead; embedding resin that embeds therein a portion of the first lead and a portion of the second lead; a semiconductor light emitting device; a wire connecting the semiconductor light emitting device to the second lead; ... 02/23/06 - 20060038198 - Device and method for producing output light having a wavelength spectrum in the visible range and the infrared range using a fluorescent material A device and method for producing output light having a wavelength spectrum in the visible wavelength range and the infrared wavelength range uses a fluorescent material to convert at least some of the original light emitted from a light source of the device to longer wavelength light to produce the ... 02/23/06 - 20060038197 - Reflection-type optoelectronic semiconductor device A reflection-type optoelectronic semiconductor device has an LED chip disposed on a first conducting wire portion, a second conducting wire portion connected to the LED chip via a connection wire, a packaging body for sealing the LED chip and part of the first conducting wire portion and the second conducting ... 02/23/06 - 20060038196 - Sideway-emission light emitting diode A sideway-emission light emitting diode includes a light emitting diode package comprised of a light emitting diode dice that gives off light and a lens that is positioned in front of a front end face of the package for receiving the light and redirecting the received light toward a circumference ... 02/16/06 - 20060033118 - System, apparatus and method of selective laser repair for metal bumps of semiconductor device stack Exemplary embodiments of the selective laser repair apparatus and method may allow the repair of metal bumps in a semiconductor device stack by applying a laser beam to a damaged and/or defective bump. Metal bumps may be repaired and individual chips and/or packages forming a device stack need not be ... 01/19/06 - 20060011936 - Fluorescent substance containing nitrogen, method for manufacturing the same, and light-emitting device Disclosed is a method for manufacturing a nitrogen-containing fluorescent substance comprising accommodating an oxide fluorescent substance containing two or more elements in a receptacle made of a material containing carbon, and sintering the oxide fluorescent substance in a mixed gas atmosphere containing nitrogen gas. ... 01/12/06 - 20060006406 - Light emitting diode package and light source comprising the same An LED package comprises a substrate, one or three terminals formed on a first side of the substrate, three terminals formed on a second side opposite to the first side, and two or three LEDs disposed on the substrate, one of the LEDS being electrically connected to one of the ... 01/05/06 - 20060001040 - High integrity protective coatings A composite article with at least one high integrity protective coating, the high integrity protective coating having at least one planarizing layer and at least one organic-inorganic composition barrier coating layer. A method for depositing a high integrity protective coating. ... 01/05/06 - 20060001039 - Method of forming buried channels and microfluidic devices having the same A method of manufacturing an integrated device that includes filling at least one channel region of a substrate with a sacrificial material to form a filled channel, forming an encapsulating layer over the filled channel, forming an aperture in the encapsulating layer, and selectively removing the sacrificial material in the ... 12/22/05 - 20050280019 - Package for semiconductor light emitting element and semiconductor light emitting device A package for semiconductor light emitting element is described. The package includes a first metal substrate having a cup shaped recess portion, an insulating member having a first cup shaped opening, provided on the first metal substrate, and a second metal substrate having a second cup shaped opening, provided on ... 12/22/05 - 20050280018 - Light-emitting diode An LED comprising a circuit board, a first electrode unit provided on a first surface of the circuit board, a second electrode unit provided on a second surface of the circuit board and electrically connected to the first electrode unit, an LED element mounted on the first electrode unit, and ... 12/15/05 - 20050274973 - Led lamp An LED lamp according to the present invention includes: a substrate 10 having a principal surface 10a; at least one LED 12, which is supported on the principal surface 10a of the substrate 10; a reflector 16, which has an opening that defines a reflective surface 14 surrounding the side ... 12/15/05 - 20050274972 - Light emitting device A light emitting device can include a substrate, electrodes provided on the substrate, a light emitting diode configured to emit light, the light emitting diode being provided on one of the electrodes, phosphors configured to change a wavelength of the light, and an electrically conductive device configured to connect the ... 12/15/05 - 20050274971 - Light emitting diode and method of making the same A light emitting diode (LED) and a method of making the same are disclosed. The present invention is featured in that the LED comprises a transparent heat-conductive glue, a reflective layer, and a carrier, etc, wherein the transparent heat-conductive glue is used to adhere the epitaxial structure and the carrier ... 12/08/05 - 20050269592 - Tb, b-based yellow phosphor, its preparation method, and white semiconductor light emitting device incorporating the same The present invention relates to a terbium borate-based yellow phosphor, a preparation method thereof, and a white semiconductor light emitting device incorporating the same. The terbium borate-based yellow phosphor of the present invention is represented by the general formula (Tb1-x-y-zREXAy)3DaBbO12:Cez (where, RE is at least one rare earth element selected ... 12/01/05 - 20050263786 - Light emitting diode A light emitting diode of this invention comprises: a base substrate having a pair of electrode portions; a light emitting element mounted on the base substrate and electrically connected to the electrode portions; a reflection cup placed on the base substrate to surround the light emitting element; and a resin ... 12/01/05 - 20050263785 - Light emitting diode device Disclosed herein is a light emitting diode (LED) device. The light emitting diode device comprises a package formed with a terminal for applying an electrical signal, one or more LED chips mounted on the package such that the LED chips are electrically connected to the terminal, a lens formed to ... 11/24/05 - 20050258447 - Electronic parts and method of manufacturing electronic parts packaging structure A method of manufacturing an electronic parts packaging structure of the present invention, includes a step of mounting an electronic parts, which has a connection terminal and a passivating film to cover the connection terminal, on a mounted body to direct the connection terminal upward, a step of forming an ... 11/17/05 - 20050253161 - Semiconductor light emitting device on insulating substrate and its manufacture method A semiconductor LED device includes: a transparent substrate stacked on which are an n-type nitride semiconductor layer, a nitride semiconductor light emission layer and a p-type nitride semiconductor layer; recess regions cutting the p-type layer and light emission layer and exposing the n-type layer, defining a plurality of mesa active ... 11/10/05 - 20050247951 - White light-emitting device A white light-emitting device has a semiconductor light-emitting chip, configured to emit light and at least one (Ba1-xMx)Al2O4 phosphor to absorb the light emitted from the semiconductor light-emitting chip to emit a white light, where M is consisted of at least one of Eu, Bi, Mn, Ce, Tb, Gd, La, ... 10/27/05 - 20050236640 - Laminates for encapsulating devices An encapsulation for an electrical device is disclosed. The encapsulation comprises plastic substrates which are laminated onto the surface of the electrical device. The use of laminated plastics is particularly useful for flexible electrical devices such as organic LEDs. ... 10/27/05 - 20050236639 - Semiconductor light emitting device and fabrication method thereof A semiconductor light emitting device includes an LED element, a lead frame on which the LED is mounted, a lead frame electrically connected to the LED element via a wire, transparent resin formed on the LED element and on the lead frames, and light shielding resin having a reflectance higher ... 10/13/05 - 20050224830 - Illumination devices comprising white light emitting diodes and diode arrays and method and apparatus for making them In accordance with the invention, an illumination device comprises a substrate having a surface and a cavity in the surface. At least one light emitting diode (“LED”) is mounted within the cavity, and a monolayer comprising phosphor particles overlies the LED. The phosphor monolayer is adhered to the LED by ... 10/06/05 - 20050218421 - Methods for packaging a light emitting device and packaged light emitting devices Methods of packaging a semiconductor light emitting device positioned in a reflective cavity are provided. A first quantity of encapsulant material is dispensed into the reflective cavity including the light emitting device therein and the first quantity of encapsulant in the reflective cavity is cured. A second quantity of encapsulant ... 09/29/05 - 20050212008 - Led devices and silicone resin composition therefor LED devices encapsulated with silicone resin compositions comprising (A) a silicone resin having at least two alkenyl groups bonded to silicon atoms in a molecule, (B) an organohydrogensilane and/or organohydrogenpolysiloxane having at least two hydrogen atoms bonded to silicon atoms in a molecule, and (C) an addition reaction catalyst which ... 09/29/05 - 20050212007 - Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices A method of making a light active sheet. A bottom substrate having an electrically conductive surface is provided. A hotmelt adhesive sheet is provided. Light active semiconductor elements, such as LED die, are embedded in the hotmelt adhesive sheet. The LED die each have a top electrode and a bottom ... 09/22/05 - 20050205889 - Light emitting diode package with high power A light emitting diode package includes a substrate, a conductive material, a LED chip, and a lens. The substrate has an upper surface formed with a P-electrode and a N-electrode, a lower surface formed with a cavity, and a through hole penetrating the substrate from the upper surface to the ... 09/08/05 - 20050194609 - Semiconductor light emitting device and method for manufacturing same A semiconductor light emitting device ensuring a uniform color tone comprises a semiconductor light emitting element that emits light of a first wavelength upon injection of a current, a fluorescent material portion that contains a fluorescent material excited by light of the first wavelength to emit light of a second ... 09/08/05 - 20050194608 - Single-chip white light emitting device A single-chip white light emitting device, including: a substrate, a buffer layer, a first conductive cladding layer, a second conductive cladding layer, at least one broad-spectrum blue-complimentary light quantum dot emitting layer and at least one blue light emitting layer. The buffer layer is disposed over the substrate. The first ... 09/01/05 - 20050189558 - Flip-chip light-emitting device with micro-reflector A Flip-chip light-emitting device with integral micro-reflector. The flip-chip light-emitting device emits reflected light provided by a light-emitting layer. The micro-reflector reflects light that might otherwise be lost to internal refraction and absorption, so as to increase light-emitting efficiency. ... 09/01/05 - 20050189557 - Light emitting diode package assembly that emulates the light pattern produced by an incandescent filament bulb In accordance with the invention, a light emitting diode package assembly is provided to emulate the pattern of light produced by an incandescent filament bulb. The package assembly is composed of a substrate for LEDs comprising a heat-sinking base having a pair of opposing major surfaces. Each major surface has ... 08/25/05 - 20050184307 - Light emitting diode with porous sic substrate and method for fabricating A method and apparatus for forming a porous layer on the surface of a semiconductor material wherein an electrolyte is provided and is placed in contact with one or more surfaces of a layer of semiconductor material. The electrolyte is heated and a bias is introduced across said electrolyte and ... 08/18/05 - 20050179049 - Light emitting diode A light emitting diode (LED) is a sealed and packaged structure for elevating heat dissipation efficiency of the LED; and is characterized that, a light emitting chip is placed at an area defined by fingers of the LED, and the light emitting diode has a lower portion thereof utilizing an ... 08/11/05 - 20050173723 - Light-emitting diode structure and a method for manufacturing the light-emitting diode A light-emitting diode structure and a method for manufacturing the light-emitting diode structure. The method includes steps of: preparing a metal plane blank in a production line and punching the blank with an upper mold section to form a concave central section protruding from the blank; punching the concave central ... 08/11/05 - 20050173722 - Semiconductor device and method for manufacturing the same A MOS transistor has a gate electrode formed on a semiconductor substrate via a gate insulation film and a source and a drain formed on both sides of the gate electrode, wherein, with sidewall films each consisting of two layers (a thin first film and a second film for covering ... 08/04/05 - 20050167689 - Non-volatile zero field splitting resonance memory A low-volatility or non-volatility memory device utilizing zero field splitting properties to store data. In response to an electrical pulse or a light pulse, in the absence of any externally applied magnetic field, the host material can switch between stable energy-absorbing states based on the zero field splitting properties of ... 07/28/05 - 20050161694 - Light-radiating semiconductor component with a luminescence conversion element The light-radiating semiconductor component has a radiation-emitting semiconductor body and a luminescence conversion element. The semiconductor body emits radiation in the ultraviolet, blue and/or green spectral region and the luminescence conversion element converts a portion of the radiation into radiation of a longer wavelength. This makes it possible to produce ... 07/21/05 - 20050156187 - Semiconductor device using semiconductor chip A semiconductor device includes an insulating substrate 2 having an obverse surface formed with a die pad 3, a rectangular semiconductor chip 7 such as an LED chip bonded to the die pad with a die bonding material 10, and a molded portion 9 made of a synthetic resin for ... 07/14/05 - 20050151151 - Hermetically sealed package and method of fabrication of a hermetically sealed package A method and apparatus for forming a hermetic seal between two substrates includes providing an electromagnetic absorbent sealing material perimetrically about a surface of one of the substrates. Furthermore, the illustrative method includes heating the sealing material. In addition, a package having a hermetic seal and apparati for disposing a ... 06/30/05 - 20050139855 - Package structure for semiconductor A package structure for a semiconductor is described. The advantages thereof are that it has a great structural strength and when being penetrated by light, it will not be influenced by external light and can condense the light. Therefore, it is not easily be deformed so that the yield and ... 06/30/05 - 20050139854 - Light source unit and projector Exemplary embodiments provide a light source unit capable of reducing emission of any unnecessary electromagnetic waves to a sufficient level, and a projector using such a light source unit. Exemplary embodiments include a chip that emits light responding to an incoming current, a base section structured by stacking the chip, ... 06/23/05 - 20050133811 - Nitride semiconductor light emitting device and method for manufacturing the same Disclosed herein is a nitride semiconductor light emitting device. The nitride semiconductor light emitting device comprises a substrate, an n-type nitride semiconductor layer formed on the substrate and provided with an electrode region of a predetermined area adjacent to a center of one lateral side of the top surface of ... 06/16/05 - 20050127390 - Led package An improved LED package comprises a first stand, a second stand, an LED chip, an epoxy packaging object, wherein the first stand further comprises a concave bowl section, and a first pin is extended from the bottom of the first stand, and a second stand is disposed adjacent to the ... 06/02/05 - 20050116246 - Light emitting diode lamp A light emitting diode lamp includes a lead terminal 2 formed with a cup 8 having a conical inner circumferential surface serving as a light reflective surface 8a, an LED chip 4 bonded to a bottom surface 8b of the cup with a die bonding material H, a molded portion ... ### FreshPatents.com Support |