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Active Solid-state Devices (e.g., Transistors, Solid-state Diodes) > Incoherent Light Emitter Structure > With Housing Or Contact Structure With Housing Or Contact StructureWith Housing Or Contact Structure patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.01/24/08 - 20080017879 - Methods and apparatus for packaging integrated circuit devices An integrally packaged integrated circuit device including an integrated circuit die including a crystalline substrate having first and second generally planar surfaces and edge surfaces and semiconductor circuitry formed over the first generally planar surface, at least one chip scale packaging layer formed over the semiconductor circuitry and the first ... 01/17/08 - 20080012037 - Method for manufacturing semiconductor device The inventive method for manufacturing a semiconductor device is a method for manufacturing a semiconductor device using irradiation with laser light to partition a substrate having semiconductor layers formed thereon, with gallium contained in at least one of the substrate and the semiconductor layers, wherein the method comprises: forming grooves ... 01/17/08 - 20080012036 - Leadframe-based packages for solid state light emitting devices and methods of forming leadframe-based packages for solid state light emitting devices A modular package for a light emitting device includes a leadframe including a first region having a top surface, a bottom surface and a first thickness and a second region having a top surface, a bottom surface and a second thickness that is less than the first thickness. The leadframe ... 01/10/08 - 20080006843 - Light emitting diode package structure and fabricating method thereof A light emitting diode (LED) package structure including a first substrate, one or more LED chips, a second substrate, and a thermoelectric cooling device is provided. The first substrate has a first surface and a corresponding second surface. The LED chip suitable for emitting a light is arranged on the ... 01/03/08 - 20080001164 - Flip chip type led lighting device manufacturing method A flip chip type LED lighting device manufacturing method includes the step of providing a strip, the step of providing a submount, the step of forming a metal bonding layer on the strip or submount, the step of bonding the submount to the strip, and the step of cutting the ... 01/03/08 - 20080001163 - Led lamp An LED lamp has a package and a plurality of light emitting elements that are electrically connected to a plurality of electrode plates provided in the package and that are sealed with transparent material. A red light emitting element of the plurality of light emitting elements is wire bonded along ... 01/03/08 - 20080001162 - Process for structuring at least one layer as well as electrical component with structures from the layer The invention states a process to generate at least one structured layer (10A), wherein a mask structure (20) with a first (20A) and second structure (20B) is generated on a layer (10) which is present on a substrate (5). Through this mask structure (20), the first layer (20A) is transferred ... 12/13/07 - 20070284606 - High-efficiency, overvoltage-protected, light-emitting semiconductor device An LED comprises a multilayered light-generating semiconductor region grown on one of a pair of opposite major surfaces of a semiconducting silicon substrate, a bonding pad overlying the light-generating semiconductor region and received in part in a cavity formed centrally therein, and a substrate electrode on the other major surface ... 12/06/07 - 20070278511 - Light-emitting device manufacturing method and light-emitting device A method for producing a light-emitting device comprising: a step of electrically connecting a first electrode provided on one main surface of a semiconductor substrate (element substrate) through a light-emitting layer, and a first lead of a lead frame, so as to oppose each other; a step of electrically connecting ... 11/29/07 - 20070272940 - Semiconductor device with a light emitting semiconductor die A semiconductor device includes a light emitting semiconductor die mounted on at least one of first and second electrically conductive bonding pads, which are located on a first major surface of a substrate of the device. The light emitting semiconductor die has an anode and a cathode, which are electrically ... 11/29/07 - 20070272938 - Package for storing light emitting element and method for producing package for storing light emitting element A light-emitting element storing package which ensures the efficient reflection of light emitted by a light-emitting element by a reflector frame and thereby improves the brightness of the emitted light, and a method of manufacturing the same are provided. The light-emitting element storing package includes: an insulating substrate consisting of ... 11/22/07 - 20070267647 - Optoelectronic device chip having a composite spacer structure and method making same An optoelectronic device chip, and a method for making the chip, are disclosed. The chip comprises a device substrate, an optically transparent upper substrate, and a composite spacer layer which includes an adhesive material and a plurality of particles dispersed in said adhesive material. The distance between the device substrate ... 11/15/07 - 20070262339 - Side-view surface mount white led A light emitting diode is disclosed. The diode includes a package support and a semiconductor chip on the package support, with the chip including an active region that emits light in the visible portion of the spectrum. Metal contacts are in electrical communication with the chip on the package. A ... 11/15/07 - 20070262338 - Semiconductor light-emitting element, manufacturing method and mounting method of the same and light-emitting device An LED chip of the present invention has a structure in which an n-type semiconductor layer and a p-type semiconductor layer are successively formed on the lower face of an element substrate, with the p-type semiconductor layer being formed on an area except for an area for an n-electrode. A ... 11/15/07 - 20070262337 - Multiple thermal path packaging for solid state light emitting apparatus and associated assembling methods A mounting substrate includes a peripheral portion and a central portion. Solid state light emitting elements are provided on the mounting substrate. A housing is configured to thermally couple to the peripheral portion of the mounting substrate, so as to provide a first thermal conduction path for at least some ... 11/08/07 - 20070257274 - Lighting device and method A lighting device having a light emitting diode (LED). The device includes a metal substrate having a surface. A dielectric coating layer is superimposed on the surface of the metal substrate. A light emitting diode (LED) is supported on the dielectric coating layer. The metal substrate serves as a heat ... 10/25/07 - 20070246731 - Semiconductor device using semiconductor chip A semiconductor device includes an insulating substrate 2 having an obverse surface formed with a die pad 3, a rectangular semiconductor chip 7 such as an LED chip bonded to the die pad with a die bonding material 10, and a molded portion 9 made of a synthetic resin for ... 10/25/07 - 20070246730 - Light emitting diode and light emitting diode device including the light emitting diode element and method for manufacturing the light emitting diode A light emitting element has a base made of heat conductive material, a wire plate made of an insulation material and secured to an upper surface of the base. Conductive patterns are secured to the wire plate, and a light emitting chip is secured to the base at an exposed ... 10/18/07 - 20070241361 - Light emitting diode and light emitting diode device including the light emitting diode element and method for manufacturing the light emitting diode A light emitting diode has a base made of heat conductive material, a wire plate made of an insulation material and secured to an upper surface of the base. Conductive patterns are secured to the wire plate, and a light emitting diode element is secured to the base at an ... 10/18/07 - 20070241360 - Light emitting devices suitable for flip-chip bonding Light emitting device die having a mesa configuration on a substrate and an electrode on the mesa are attached to a submount in a flip-chip configuration by forming predefined pattern of conductive die attach material on at least one of the electrode and the submount and mounting the light emitting ... 10/11/07 - 20070235748 - Lighting device having a lighting unit with an optical semiconductor bare chip mounted on printed wiring board A wiring board used for mounting an LED bare chip capable of firmly bonding the LED bare chip and improving yield. In a printed wiring board 2, a distance D between wiring patterns 81 and 85 disposed so as to oppose each other is the smallest at a position nearest ... 10/11/07 - 20070235747 - Light source with compliant interface A compliant interface is added above the top housing of a light source, such as an LED during LED manufacture. The compliant interface allows for a low light loss transfer between the surface of the light guide material. The compliant structure is, in one embodiment, a light transparent compliant silicone ... 10/04/07 - 20070228406 - Chip package structure and method for manufacturing bumps A method for manufacturing bumps is provided. First, a first metal layer is formed on a substrate. Then, a patterned second metal layer is formed on the first metal layer. Then, flat bumps are formed on the second metal layer. Finally, the first metal layer is patterned to form bond ... 09/27/07 - 20070221944 - Light emitting diodes and fabrication methods thereof A light emitting diode (LED)) may be disclosed. The LED may include a light-emitting side. The LED may also include a first electrode disposed on the light-emitting side. The LED may also include a second electrode. The LED may also include a semiconductor element disposed between the first electrode and ... 09/27/07 - 20070221943 - Backlight device and display device It is an object to manufacture a highly reliable backlight device with less color unevenness and less luminance unevenness, and a high-performance and highly reliable display device including the backlight device, which can display a high quality image. A light emitting diode (LED) is used as a light source of ... 09/20/07 - 20070215896 - Light emitting diode package structure and method of manufacturing the same A light emitting diode package structure having a heat-resistant cover and a method of manufacturing the same include a base, a light emitting diode chip, a plastic shell, and a packaging material. The plastic shell is in the shape of a bowl and has an injection hole thereon. After the ... 09/20/07 - 20070215895 - Semiconductor light emitting element mounting member, and semiconductor light emitting device employing it A semiconductor light-emitting element mounting member with an improved effective light reflectivity in a metal film serving as an electrode layer and/or a reflective layer, in which the metal layer has improved adhesion to a substrate, mechanical strength, and reliability and superior light-emitting characteristics. The semiconductor light-emitting element mounting member ... 09/06/07 - 20070205427 - Side structure of a bare led and backlight module thereof The present invention discloses a side structure of a bare LED and a backlight module thereof, wherein the backlight module is preferably a light source of a display device such as an LCD device. The backlight module includes a flat plate covered with a thermally conductive dielectric material, a plurality ... 09/06/07 - 20070205426 - Semiconductor light-emitting device A semiconductor light-emitting device includes a semiconductor light-emitting element and a lead-out electrode. The semiconductor light-emitting element has a light-emitting surface of polygonal shape and an electrode formed on the light-emitting surface. The lead-out electrode is connected to the electrode. In the semiconductor light-emitting device, the electrode is formed along ... 08/30/07 - 20070200132 - Electrical connection for optoelectronic devices A structure having an optical element thereon has a portion of the structure extending beyond a region having the optical element in at least one direction. The structure may include an active optical element, with the different dimensions of the substrates forming the structure allowing access for the electrical interconnections ... 08/30/07 - 20070200131 - Light emitting device package and method of manufacturing the same A light emitting device package and a method of manufacturing the same are disclosed. The light emitting device package includes a package structure, two diffusion layers formed on the package structure such that the two diffusion layers are electrically separated from each other, and first and second electrodes insulated from ... 08/30/07 - 20070200130 - Electronic device An electronic device according to the invention includes a housing, a recess containing an optoelectronic component, and a film including a polyimide, which is over the recess covering the optoelectronic component. ... 08/30/07 - 20070200129 - Transparent positive electrode An object of the present invention is to provide a positive electrode having high transparency, low contact resistance and excellent current diffusibility and not requiring electron beam irradiation, high-temperature annealing or heat treatment, for alloying, in an oxygen atmosphere. The inventive transparent positive electrode for gallium nitride-based compound semiconductor light-emitting ... 08/30/07 - 20070200128 - Light emitting device A light emitting apparatus 10 includes an aluminum nitride co-fired substrate 11 and a light emitting device 12 arranged on a front surface of the co-fired substrate, in which the front surface of the aluminum nitride substrate 11 bearing the light emitting device 12 is mirror-polished so as to have ... 08/23/07 - 20070194339 - Optical data communication module Disclosed is an infrared data communication module (1) comprising an infrared light-emitting device (3), an infrared light-receiving device (4) and an IC chip (5). The light-emitting device (3), light-receiving device (4) and IC chip (5) are mounted on a substrate (2) and covered with a sealing resin package (6). The ... 08/16/07 - 20070187709 - Semiconductor device and method for manufacturing the same The semiconductor device 1 comprises a housing 12 which has the recess 24 in the front surface 14, the pair of lead electrodes 20 which have the distal ends 34 exposed in the recess 24, protrude from the external surface of the housing 12 and are bent along the bottom ... 08/16/07 - 20070187708 - Led illumination apparatus and card-type led illumination source An LED illumination includes an insertable and removable LED illumination source having a feeder terminal on one surface of a substrate on which an LED has been mounted; a thermal conductor member, which contacts with a back surface of the substrate on which the LED is not present; at least ... 08/09/07 - 20070181901 - Power surface mount light emitting die package A light emitting die (LED) package is provided which includes a substrate having traces, a LED mounted on the substrate and connected to the traces, and an encapsulant covering the LED. The package includes a lens sitting on the encapsulant and substantially covering the LED. The lens is free to ... 08/09/07 - 20070181900 - Semiconductor light emitting device and its manufacture method A semiconductor light emitting device is provided having a highly reliable reflection and electrode layer. The semiconductor light emitting device is manufactured by the steps of: forming an insulating film on a surface of a silicon substrate; forming an adhesion layer made of at least one of Ti and Cr ... 08/09/07 - 20070181898 - Pixel structure for a solid state light emitting device A light emitting device includes an active layer structure, which has one or more active layers with luminescent centers, e.g. a wide bandgap material with semiconductor nano-particles, deposited on a substrate. For the practical extraction of light from the active layer structure, a transparent electrode is disposed over the active ... 08/09/07 - 20070181897 - High heat dissipating package baseplate for a high brightness led A high heat dissipating package baseplate for a high brightness LED, wherein a package baseplate manufacturing process includes a baseplate manufacturing process, a wiring manufacturing process and a package manufacturing process. An arc concavity is formed in a surface of a heat dissipating piece, and a light reflecting layer having ... 08/09/07 - 20070181896 - Structure for a single light source multicolor led A single light source multicolor LED, including a package baseplate having a high heat dissipation effect, and the package baseplate is provided with a heat dissipating layer and a printed circuit. The printed circuit includes an insulating layer, a conductive layer and a covering layer. A surface of the package ... 08/02/07 - 20070176198 - Chip on board package and manufacturing method thereof A Chip on Board (COB) package which can reduce the manufacturing costs by using a general PCB as a substrate, increase a heat radiation effect from a light source, thereby realizing a high quality light source at low costs, and a manufacturing method thereof. The COB package includes a board-like ... 07/26/07 - 20070170453 - Package for mounting an optical element and a method of manufacturing the same The optical mounting package of the present invention is featured by mounting a silicon frame on an insulating substrate for mounting the optical element. The package of the present invention is also featured by that the frame mounted on the insulating substrate for mounting the optical element is made of ... 07/26/07 - 20070170451 - Integrated circuit capable of operating at different supply voltages A chip configuration for dual board voltage compatibility comprising ballast I/O pads, regulator control block and VDDCO pad. If 1.8V is available on board, all 1.8V pads are connected to the package pins and the VDDCO pad is double bonded with one 1.8V package pin. This ensures that the regulator ... 07/26/07 - 20070170450 - Package for a light emitting element with integrated electrostatic discharge protection A package includes a substrate with a recess in which a light emitting element is mounted. A surface of the substrate forms an exterior surface of the package. A lid may be attached to the substrate to define a sealed region in which the light emitting element is mounted. The ... 07/19/07 - 20070164303 - [led lamp] A LED lamp includes a substrate, which has through holes cut through the top wall and bottom wall thereof and electric contacts fixedly provided at the top wall corresponding to the through holes for connection to power source, metal locating blocks respectively fixedly mounted in the through holes inside the ... 07/12/07 - 20070158675 - Semiconductor light-emitting device and method for manufacturing the device A semiconductor light-emitting device has a pair of leads placed in parallel, a light-emitting element on the upper end of one lead, a bonding wire for electrically connecting the semiconductor light-emitting element of the upper end of another lead, and an envelope formed from a light-transmitting resin for sealing the ... 07/12/07 - 20070158673 - Wafer-level chip packaging process and chip package structure A wafer-level chip packaging process includes the following steps. First, a wafer having a plurality of chip units, an active surface, and a corresponding back surface is provided. Each chip unit has a plurality of pads on the active surface. Next, a plurality of through holes is formed under the ... 07/12/07 - 20070158672 - Flat light source and manufacturing method thereof A flat light source including a first substrate, ribs, a phosphor layer, a second substrate, electrode patterns and an insulating layer is provided. The ribs are disposed on the first substrate. The phosphor layer is disposed on the surface of the ribs. The second substrate is located above the first ... 07/12/07 - 20070158671 - Led and attachment structure of led In a can type LED 3 where an anode A, a cathode K and an LED pedestal 31p are provided within a housing 31, and pins a1 and k1 of anode A and cathode K lead out at least to the outside of housing 31 so that a voltage can ... 07/05/07 - 20070152231 - Led with compound encapsulant lens An LED light source includes an LED emitter and an encapsulant that at least partially surrounds the emitter. The encapsulant includes an inner lens and an outer lens, the inner lens having a refractive index less than, and in some cases about 70 to 80% of, the refractive index of ... 06/28/07 - 20070145404 - Semicondcutor device and manufacturing method of semiconductor device A semiconductor device made by mounting a light emitting element on a substrate, where an optically-transparent cover with a flat plate shape is installed on the light emitting element and a groove part for suppressing reflection of light emission of the light emitting element is formed in the cover. ... 06/28/07 - 20070145403 - Luminescent device and method for manufacturing the same A luminescent device including a die pad lead composed of an inner lead and an outer lead, a case for uniting the inner lead, a light emitting diode chip mounted on a first predetermined position of one main surface of the inner lead, and a transparent sealing material portion for ... 06/21/07 - 20070138498 - Methods and apparatus for packaging integrated circuit devices An integrally packaged integrated circuit device including an integrated circuit die including a crystalline substrate having first and second generally planar surfaces and edge surfaces and semiconductor circuitry formed over the first generally planar surface, at least one chip scale packaging layer formed over the semiconductor circuitry and the first ... 06/14/07 - 20070131958 - Single chip with multi-led A single chip with multi-LED comprises a substrate on which an N-type semiconductor layer, an active layer and a P-type semiconductor layer are successively stacked. At least one N-type electrode is connected to the N-type semiconductor layer, and is exposed to an opening through the active layer and the P-type ... 06/14/07 - 20070131957 - Radiation-emitting and/or radiation-receiving semiconductor component and method for the production thereof A radiation-emitting and/or radiation-receiving semiconductor component comprising a radiation-emitting and/or radiation-receiving semiconductor chip, a molded plastic part which is transparent to an electromagnetic radiation to be emitted and/or received by the semiconductor component and by which the semiconductor chip is at least partially overmolded, and external electrical leads that are ... 06/07/07 - 20070126019 - Light emitting device A light emitting element (100) comprising an element chip (100C) provided, at least in a partial section in the thickness direction thereof, with a part of reduced cross-section where the cross sectional area decreases continuously or stepwise in the direction perpendicular to the thickness direction from the first major surface ... 05/31/07 - 20070120140 - Semiconductor apparatus with thin semiconductor film A semiconductor apparatus includes a substrate having at least one terminal, a thin semiconductor film including at least one semiconductor device, the thin semiconductor film being disposed and bonded on the substrate; and an individual interconnecting line formed as a thin conductive film extending from the semiconductor device in the ... 05/31/07 - 20070120139 - Semiconductor light emitting device A semiconductor light emitting device includes a mold resin having a cup shape portion on an upper surface of the mold resin. One or more holes penetrate through the cup shape portion to outside of the mold resin and/or one or more trenches extend from the cup-shaped portion to outside ... 05/31/07 - 20070120138 - Multi-layer light emitting device with integrated thermoelectric chip A LED package having an LED chip and a thermoelectric device. The thermoelectric device a has a first side in thermal communication with the LED chip and a second side in thermal communication with a heat sink to create a thermal gradient between the LED chip and the heat sink. ... 05/24/07 - 20070114557 - Flip-chip light emitting diode device without sub-mount A light emitting diode (10) has a backside and a front-side with at least one n-type electrode (14) and at least one p-type electrode (12) disposed thereon defining a minimum electrodes separation (delectrodes). A bonding pad layer (50) includes at least one n-type bonding pad (64) and at least one ... 05/24/07 - 20070114556 - Semiconductor apparatus with thin semiconductor film A semiconductor apparatus includes a substrate having at least one terminal, a thin semiconductor film including at least one semiconductor device, the thin semiconductor film being disposed and bonded on the substrate; and an individual interconnecting line formed as a thin conductive film extending from the semiconductor device in the ... 05/24/07 - 20070114555 - Light emitting element, production method thereof, backlight unit having the light emitting element, and production method thereof A light emitting element includes: A light emitting element, includes: at least one LED chip provided on an installation surface of a substrate; a metallic reflecting plate, provided upright in a light projecting direction of the LED chip on the installation surface so as to surround an entire periphery of ... 05/24/07 - 20070114554 - Power line control circuit of semiconductor device A power line control circuit of a semiconductor device in which a width of a power line can be selectively controlled. The power line control circuit of the semiconductor device according to the present invention can selectively control the width of the power line employing the dummy power line. It ... 05/10/07 - 20070102722 - Light emitting diode unit A light emitting diode unit including a base (100) made of anodized aluminum and a printed board (101) attached to the base (100) and the printed board (101) including a predetermined conductive pattern (102) and an opening (101a) having an area for die-bonding at least one LED chip (113) to ... 05/03/07 - 20070096138 - Semiconductor laser device and fabrication method thereof A semiconductor laser device aimed to be reduced in size and that can maintain high position accuracy, and a fabrication method of such a semiconductor laser device are achieved. A semiconductor laser device includes a stem as a base member, and a cap member. The stem includes a main unit ... 05/03/07 - 20070096137 - Semiconductor device and method of manufacturing semiconductor device A semiconductor device includes: a semiconductor element; a wiring board including a connection terminal to be electrically connected to the semiconductor element; and a metal plate disposed between the semiconductor element and the wiring board; wherein the metal plate is provided with an opening for exposing the connection terminal to ... 05/03/07 - 20070096136 - Cladding layer structure of a led package structure A cladding layer structure of a LED (light emitting diode) package structure comprises a printed circuit layer arranged on a substrate, a cladding layer having a through hole is located on the printed circuit layer, a chip is received in the through hole and is in electrical contact with the ... 05/03/07 - 20070096135 - Display panel A drive current line which supplies power to an EL element includes a branch line which is provided in a display region and a trunk line having a larger cross sectional area than the branch line and which is provided along two or more sides of a peripheral portion of ... 05/03/07 - 20070096134 - Light emitting diode fixture and heat sink A housing for a plurality of light emitting diodes includes a housing providing a heat sink, where the heat sink includes a plurality of protrusions. A control board can be removably coupled to the heat sink and the control board can provide an aperture to receive a lens housing and ... 05/03/07 - 20070096133 - System and method for led manufacturing An LED is formed using terminal leads that are rolled instead of die-set formed. Using this process, the terminal leads can end in several terminals thereby allowing higher heat dissipation. The LED can be produced using an LED chip that has light coming only from the top or with light ... 05/03/07 - 20070096132 - Coaxial led lighting board A lighting board is fabricated with. the use of coaxial light device inserted in a socket plate, the convenience of assembly and disassembly of the coaxial light device with its coaxial lead makes the product easily to be maintained for changing different color of the coaxial light device, changing different ... 05/03/07 - 20070096131 - Laminating encapsulant film containing phosphor over leds A process is described for wavelength conversion of LED light using phosphors. LED dies are tested for correlated color temperature (CCT), and binned according to their color emission. The LEDs in a single bin are mounted on a single submount to form an array of LEDs. Various thin sheets of ... 04/26/07 - 20070090387 - Solid state light sheet and encapsulated bare die semiconductor circuits An electronically active sheet includes a bottom substrate having a bottom electrically conductive surface. A top substrate having a top electrically conductive surface is disposed facing the bottom electrically conductive surface. An electrical insulator separates the bottom electrically conductive surface from the top electrically conductive surface. At least one bare ... 04/26/07 - 20070090386 - Air cooled high-efficiency light emitting diode spotlight or floodlight The present invention replaces a standard size halogen tungsten lamp spotlight or floodlight with a much cooler LED lamp that also fits into existing housings. However, the LED's still need to be cooled. The Present Invention mounts up to three LED's into a special reflector with a plurality of specially ... 04/26/07 - 20070090385 - Semiconductor device The present invention provides a semiconductor device in which a power line is not affected by noise due to a voltage drop caused by instantaneous high-current consumption in the buffer portion and that has no possibility that a logic portion malfunctions. In a case where the same potential is supplied ... 04/26/07 - 20070090384 - Nitride based semiconductor device having multiple layer buffer structure and fabrication method thereof A multiple layered buffer structure for nitride based semiconductor device is provided herein. The buffer structure contains a first layer of AlxInyGa1-x-yN grown under a high temperature, and a second layer of an un-doped or appropriately doped GaN based material grown under a low temperature The GaN based material of ... 04/19/07 - 20070085104 - Robust group iii light emitting diode for high reliability in standard packaging applications A physically robust light emitting diode is disclosed that offers high-reliability in standard packaging and that will withstand high temperature and high humidity conditions. The diode comprises a Group III nitride heterojunction diode with a p-type Group III nitride contact layer, an ohmic contact to the p-type contact layer, and ... 04/19/07 - 20070085103 - Light emitting device using light emitting diode chip A light emitting device comprises: an LED chip mounted in a recess formed in a mounting substrate; a wavelength converting member that is disposed so as to cover the recess and the edge area around the recess and that is excited by light emitted from the LED chip to emit ... 04/12/07 - 20070080362 - Led with light transmissive heat sink An more efficient or higher luminance LED assembly may be formed from a high power LED chip having a first surface, and a second surface, the first surface being mounted to a substrate; the second surface being in intimate thermal contact with a light transmissive heat sink having a thermal ... 04/12/07 - 20070080361 - Optoelectronic semiconductor chip, method for producing it, and optoelectronic device An optoelectronic semiconductor chip comprises a radiation passage area (2d), to which is applied a current spreading layer (4) containing particles (4b) of a wavelength conversion material. Furthermore, a method for producing such a semiconductor chip and also a device comprising such a semiconductor chip are specified. ... 04/12/07 - 20070080360 - Microelectronic interconnect substrate and packaging techniques A LED (Light Emitting Diode) substrate and packaging for a single diode or a diode array is described. The substrate includes an integral reflector(s) for the diode(s) in the form of a shaped cavity (or cavities) to house the diode die(s). The reflector cavity walls can optionally be plated with ... 04/12/07 - 20070080359 - Plasma display apparatus A plasma display apparatus comprises a plasma display panel comprising an electrode, a drive board and a connection unit adhered to a terminal of the drive board and electrically connected to the electrode. ... 04/05/07 - 20070075325 - High power light emitting diode package The invention relates to a high power LED package having excellent light efficiency and heat dissipating characteristics. The LED package includes a base member, a reflector unit arranged on the base member and having a plurality of first reflectors, a plurality of LED chips mounted on the base member and ... 03/29/07 - 20070069232 - Semiconductor device with a resin-sealed optical semiconductor element To provide a semiconductor device 10, which is thin, compact, and excellent in mechanical strength and humidity resistance. Semiconductor device 10A has a configuration such that in semiconductor device 10A, wherein an optical semiconductor element 14, having a light receiving part or a light emitting part, is sealed in a ... 03/29/07 - 20070069231 - Semiconductor light-emitting device and method A semiconductor light-emitting device can include a submount on which a semiconductor light-emitting element is mounted. The device can have a high light utilization efficiency with high reliability and can achieve a reduction in manufacturing cost as well as a decrease in size. The submount can have a reverse trapezoidal ... 03/22/07 - 20070063214 - Light emitting diode package and method for manufacturing the same The invention relates to a light emitting diode package that can prevent deterioration of phosphor and a method of manufacturing the same. The light emitting diode package includes a package body having a recessed part, a light emitting diode chip mounted on a floor surface of the recessed part and ... 03/22/07 - 20070063213 - Led package A package allowing agile deployment of the location of each LED chip includes a heat slug to secure multiple LED chips, two lead frames, a conducting area extending along the edge of the heat slug, and a non-conductive material that connects the heat slug and the lead frame for those ... 03/22/07 - 20070063212 - Semiconductor laser device and manufacturing method thereof In a semiconductor laser device 10 including a semiconductor laser element 14, a frame 12 having a front face on which the semiconductor laser element 14 is placed, and a resin molded portion 15 that covers the front and back faces of the frame 12, on a front face side ... 03/15/07 - 20070057273 - Diode having vertical structure and method of manufacturing the same A light emitting diode includes a conductive layer, an n-GaN layer on the conductive layer, an active layer on the n-GaN layer, a p-GaN layer on the active layer, and a p-electrode on the p-GaN layer. The conductive layer is an n-electrode. ... 03/15/07 - 20070057272 - Gallium nitride-based semiconductor light emitting device and process for its production It is an object of the present invention to inhibit exposure of Ag in Ag-employing reflective electrodes caused by microdefects generated during the manufacturing process, and to prevent reduction in light emission output and deterioration in current-voltage characteristics resulting from shorting of the light emitting device. The semiconductor light emitting ... 03/15/07 - 20070057271 - Interconnects for semiconductor light emitting devices A semiconductor light emitting device including a light emitting layer disposed between an n-type region and a p-type region and contacts electrically connected to the n-type region and the p-type region is connected to a mount. A metal layer arbitrarily patterned to cover at least 20% of the area of ... 03/15/07 - 20070057270 - Gan laser with refractory metal elog masks for intracavity contact Refractory metal ELOG mask are used for GaN based VCSELs and edge emitter structures to serve as intracavity contacts. In these structures the refractory metal ELOG masks serve both as ohmic contact metals as well as masks for ELOG. ... 03/08/07 - 20070051968 - Nitride-based semiconductor light-emitting device and method of manufacturing the same A nitride-based semiconductor light-emitting device having excellent reliability and long lifetime, and a method of manufacturing the same are provided. A nitride-based semiconductor light-emitting element chip, in which a nitride-based semiconductor layer and a first electrode are formed on a surface of an electrically conductive substrate and a second electrode ... 03/01/07 - 20070045649 - Light source device A light source device including a substrate, a first LED chip, a second LED chip, a third LED chip and a light guide element is provided. The first LED chip is disposed on one side of the substrate. The second LED chip is disposed on the other side of the ... 03/01/07 - 20070045648 - Package structure of light emitting diode A package structure of a light emitting diode for outputting a target peak wavelength includes a carrier, a first die and a second die. The first die is disposed on the carrier. The first die has a first peak wavelength greater than the target peak wavelength. The second die is ... 03/01/07 - 20070045647 - Display panel package A display panel package includes a first electronic member, a second electronic member and an electrically conductive structure for electrically connecting the first electronic member and the second electronic member. The electrically conductive structure has a plurality of bumps electrically and spacedly connected to the first electronic member, and a ... 02/15/07 - 20070034889 - Diode housing A housing accommodating a semiconductor chip is set out. The housing and chip may be used for sending and/or receiving radiation. Popular applications of the housing may be in light emitting diodes. The housing includes a conductor strip that is punched into two electrically isolated portions. The housing further includes ... 02/08/07 - 20070029572 - Led having improved soldering structure, method for soldering the led to pcb, and led assembly manufactured by the method The invention relates to an LED with an improved soldering structure, a method of assembling the LED to a PCB, and an LED assembly manufactured by the method. The LED includes an LED chip and a pair of leads with an end electrically connected the LED chip and the other ... 02/08/07 - 20070029571 - Nitride semiconductor light-emitting device In a nitride semiconductor light-emitting device, a cap is pressure-bonded on the top surface of a stem under electric discharge to form a package. The package encloses a heatsink, a nitride semiconductor laser element, electrode pins, and wires, and has sealed inside it a gas containing oxygen as a sealed ... 02/08/07 - 20070029570 - Led package and method for fabricating the same An LED package comprises: a package body having therein a LED receiving part including a reflecting surface; an LED mounted within the LED receiving part; a lead mounted within the package body such that first and second ends of the lead are exposed to the outside of the package body. ... 02/08/07 - 20070029569 - Packages for semiconductor light emitting devices utilizing dispensed encapsulants and methods of packaging the same A submount for mounting an LED chip includes a substrate, a die attach pad configured to receive an LED chip on an upper surface of the substrate, a first meniscus control feature on the substrate surrounding the die attach pad and defining a first encapsulant region of the upper surface ... 02/08/07 - 20070029568 - Light emitting device and fabrication method thereof The present invention discloses a light device and the fabrication method thereof. An object of the present invention is to provide the light device and the fabrication method thereof an electric/thermal/structural stability is obtained, and a P-type electrode and an N-type electrode can be simultaneously formed. In order to achieve ... 02/01/07 - 20070023776 - Light emitting diode package A light emitting diode package is provided. The light emitting diode package comprises a submount substrate which includes a mounting region having side walls inclined upwardly, first and second cavities formed around the mounting region, and first and second grooves extending between the mounting region and the first and second ... 02/01/07 - 20070023775 - Nitride-based compound semiconductor light emitting device and method of fabricating the same A nitride-based semiconductor light emitting device with improved characteristics of ohmic contact to an n-electrode and a method of fabricating the same are provided. The nitride-based semiconductor light emitting device includes an n-electrode, a p-electrode, an n-type compound semiconductor layer, and an active layer and a p-type compound semiconductor layer ... 01/25/07 - 20070018191 - Side view led with improved arrangement of protection device A side view LED includes an insulating substrate, and first and second metal layers each having first and second areas spaced apart from each other at a predetermined gap and disposed on top and underside surfaces of the insulating substrate, respectively. First and second electrical connectors are formed in a ... 01/25/07 - 20070018190 - Led package and fabricating method thereof The invention provides an LED package capable of effectively releasing heat emitted from an LED chip out of the package and a fabrication method thereof. For this purpose, at least one groove is formed on an underside surface of the substrate to package the LED chip and the groove is ... 01/25/07 - 20070018189 - Light emitting diode A light emitting diode is disclosed. A light emitting diode comprises: a bracing frame; and at least two chips stacked on the bracing frame in a chip-on-chip stacking manner. The light emitting diode for uniform color mixing is completed after each of said at least two chips is electrically connected. ... 01/18/07 - 20070012941 - Light emitting diode comprising semiconductor nanocrystal complexes A light emitting diode (LED) formed by depositing an LED chip and coupling a stability layer to the LED chip. Semiconductor nanocrystals are placed in a first matrix material to form a nanocrystal complex layer. The nanocrystal complex layer is deposited on top of the stability layer. A thickness of ... 01/18/07 - 20070012940 - Wavelength-convertible light emitting diode package The invention relates to a wavelength-convertible LED package including a package substrate having a lead frame, and an LED mounted on the package substrate and electrically connected to the lead frame. The wavelength-convertible LED package also includes a low refractive index region surrounding the LED, having a first refractive index, ... 01/18/07 - 20070012939 - Flip chip light emitting diode and method of manufacturing the same The present invention relates to a flip chip light emitting diode, in which the flow of current concentrated on a portion adjacent to an n-type electrode can be induced into the center of a light emitting section and a current-spreading effect is accordingly enhanced, thereby increasing light emission efficiency of ... 01/18/07 - 20070012938 - Light-emitting-diode packaging structure having thermal-electric element A light-emitting-diode packaging structure having thermoelectric device, which is applied to the LED unit packaged using the flip chip technology. This is realized by directly building the thermoelectric elements into the solder bump layer of the light-emitting-diode packaging structure to replace a part of the solder bumps, as such raising ... 01/18/07 - 20070012937 - High-brightness light emitting diode having reflective layer An LED structure is disclosed herein, which comprises, sequentially arranged in the following order, a light generating structure, a non-alloy ohmic contact layer, a metallic layer, and a substrate. As a reflecting mirror, the metallic layer is made of a pure metal or a metal nitride for achieving superior reflectivity. ... 01/04/07 - 20070001190 - Vertical structure led and fabricating method thereof A vertical structure light emitting diode (LED) and a fabricating method thereof is disclosed, wherein a metal support layer is formed on an upper surface of a light emitting structure by way of electrolytic plating method in which no high temperature process is required to obviate occurrence of defects on ... 01/04/07 - 20070001189 - Method of fabricating substrate for package of semiconductor light-emitting device In the invention, a substrate and fabrication thereof for a package of at least one semiconductor device, such as semiconductor light-emitting devices, are disclosed. In particular, a base together with a frame supporting the base of the substrate according to the invention is formed of a thick-walled metal material, a ... 01/04/07 - 20070001188 - Semiconductor device for emitting light and method for fabricating the same A semiconductor light emitting device includes a package (5) having two or more terminals, two or more semiconductor devices (1,2) mounted in the package to emit lights each having a predetermined wavelength, and a molding unit (3) mixed with a phosphor. The phosphor is excited by the lights emitted from ... 12/28/06 - 20060289889 - Display device and manufacturing method thereof It is an object of the present invention to prevent an influence of voltage drop due to wiring resistance, trouble in writing of a signal into a pixel, and trouble in gray scales, and provide a display device with higher definition, represented by an EL display device and a liquid ... 12/28/06 - 20060289888 - Packaging of smd light emitting diodes An SMD LED package with superior thermal dissipation capability is provided. The SMD LED package comprises a supporting block with circuit patterns and at least one LED attached to the supporting block. Wherein, circuit patterns of holes/vias, insulating layers, and conducting traces/pads are formed on and in the supporting block. ... 12/28/06 - 20060289887 - Surface mount light emitting diode (led) assembly with improved power dissipation A high performance LED (402) and associated semiconductor package (400) advantageously utilizes an integrated heat sink (408) for purposes of power dissipation. At a next level of assembly, (500, 600) the semiconductor package (400) is electromechanically coupled to a printed circuit board (300). The printed circuit board (300) has a ... 12/21/06 - 20060284207 - Light emitting diode package with metal reflective layer and method of manufacturing the same The invention relates to an LED package having a metal reflective layer for focusing and emitting light through a side of the package, and a manufacturing method of the same. The LED package includes a substrate with an electrode formed thereon, a light emitting diode chip disposed on the substrate, ... 12/14/06 - 20060278886 - Light emitting diode, method of manufacturing light emitting diode, light emitting diode backlight, light emitting diode illuminating device, light emitting diode display, and electronic apparatus A light emitting diode is provided. The light emitting diode includes a semiconductor layer that forms a light emitting diode structure and has a major face and an end face inclined at an angle θ1 to the major face, and a reflector that is provided outside the end face with ... 12/14/06 - 20060278885 - Led wafer-level chip scale packaging A structure of light emitting diode (LED) wafer-level chip scale packaging (WL-CSP) is disclosed. The process of making the same is also provided in this invention. The LED CSP utilizes the through hole metal filling to enhance heat conduction between the LED die and its carrier substrate. The CSP structure ... 12/14/06 - 20060278884 - Substrate-free flip chip light emitting diode and manufacturing method thereof A substrate-free LED device is provided. The LED device comprises a substrate, an epitaxial layer disposed on the substrate, a first electrode disposed on a portion of the epitaxial layer, a second electrode disposed on another portion of the epitaxial layer, and a protection layer, disposed over the epitaxial layer. ... 12/07/06 - 20060273339 - contacting scheme for large and small area semiconductor light emitting flip chip devices A light emitting device includes a layer of first conductivity type, a layer of second conductivity type, and a light emitting layer disposed between the layer of first conductivity type and the layer of second conductivity type. A via is formed in the layer of second conductivity type, down to ... 12/07/06 - 20060273338 - High power led package and fabrication method thereof An LED diode package includes a heat connecting part for mounting a light emitting part on an upper surface thereof, frames electrically connected to the light emitting part while holding the heat connecting part and a molded part fixing the heat connecting part and the frames together. The light emitting ... 11/30/06 - 20060267040 - High-brightness led with protective function of electrostatic discharge damage The present invention relates to a high-brightness LED with a protective function of electrostatic discharge damage. The high-brightness LED with a protective function of electrostatic discharge damage includes a lead frame that is formed with a pair of anode and cathode leads; a package that is formed of synthetic resin ... 11/30/06 - 20060267039 - Semiconductor light emitting element and semiconductor light emitting device A semiconductor light emitting element includes a semiconductor layer which has an electrode on at least one principal surface and a supporting substrate which is bonded with the electrode by a conductive adhesive. One of the semiconductor layer and the supporting substrate includes a protruded surface protruding in one portion ... 11/23/06 - 20060261363 - Flip-chip light emitting diode with a thermally stable multiple layer reflective p-type contact A p-type contact (30) is disclosed for flip chip bonding and electrically contacting a p-type group III-nitride layer (28) of a group III-nitride flip chip light emitting diode die (10) with a bonding pad (60). A first palladium layer (42) is disposed on the p-type group III-nitride layer (28). The ... 11/16/06 - 20060255358 - Electrode structures for leds with increased active area An electrode structure is disclosed for enhancing the brightness and/or efficiency of an LED. The electrode structure can have a metal electrode and an optically transmissive thick dielectric material formed intermediate the electrode and a light emitting semiconductor material. The electrode and the thick dielectric cooperate to reflect light from ... 11/16/06 - 20060255357 - Light emitting element mounting frame and light emitting device In the light emitting device of the present invention, a silver alloy layer is formed on at least a portion of the surface of a frame on which a light emitting element is mounted. Because of this structure, a light emitting element mounting frame and a light emitting device that ... 11/16/06 - 20060255356 - Light-emitting diode and manufacturing method thereof A light-emitting diode and the manufacturing method thereof are provided, wherein the light-emitting diode comprises an epitaxial structure, a bonding layer and a composite substrate. The bonding layer located over one side of the epitaxial structure is used for adhering the composite substrate to the epitaxial structure. The composite substrate ... 11/09/06 - 20060249746 - Light emitting device A light emitting device includes a plurality of chips efficiently disposed in a limited space of an opening that has an approximately elliptical or elongate-circular opening shape. The device includes a lead having a slit formed between a portion for bonding a wire to and a portion for mounting chips ... 11/09/06 - 20060249745 - Heat dissipating structure and light emitting device having the same A heat dissipating structure is flip-chip bonded to a light-emitting element and facilitates heat dissipation. The heat dissipating structure includes: a submount facing the light-emitting element and having at least one groove; a conductive material layer filled into at least a portion of the at least one groove; and a ... 11/09/06 - 20060249744 - Submount for light emitting device A submount for a light emitting device package is provided. The submount includes a substrate; a first bonding layer and a second bonding layer which are separately formed on the substrate; a first barrier layer and a second barrier layer which are formed on the first bonding layer and on ... 11/02/06 - 20060244000 - Surface-mountable light-emitting diode light source and method of producing a light-emitting diode light source A surface-mountable light-emitting diode light source is described, in which the leadframe-bends toward the rear side of the package that are required for surface mounting lie within a transparent plastic molded body. Also described is a method of producing a mixed-light, preferably white-light source on the basis of a UV- ... 11/02/06 - 20060243999 - Led package structure and method of packaging the same An LED package structure includes a first LED chip, a second LED chip arranged on the minor light-emitting surface of the first LED chip, a conductive unit connected between the electrode areas for parallel or serially connecting the two LED chips together, and two external electric conduction units for electrically ... 11/02/06 - 20060243998 - High power light-emitting diode package and methods for making same In a light-emitting diode package made in accordance with the present invention, a light-emitting diode assembly is positioned above a spacer assembly. In the light-emitting diode assembly, a die containing a light-emitting diode is positioned above a substrate. During operation, both the combination of at least one conductive plate adjacent ... 10/19/06 - 20060231856 - Led device and optical detector therewith for bill validator An LED device is provided which comprises a plastic encapsulant 7 formed with an integrated cylindrical lens 8 disposed opposite to an LED chip 5 to provide light from LED chip 5 with the wider directivity angular range in the vertical Y irradiative direction than that in the horizontal X ... 10/19/06 - 20060231855 - Semiconductor device A semiconductor device includes a semiconductor element, a light-blocking region enclosing the semiconductor element, a plurality of contacts disposed in a staggered arrangement in a first region of the light-blocking region, and a linear contact formed to extend along at least a first direction in a second region of the ... 10/19/06 - 20060231854 - Flip chip type nitride semiconductor light emitting device The present invention relates to a flip chip type nitride semiconductor light emitting device having p-type and n-type nitride semiconductor layers, and an active layer in between. The invention also has an ohmic contact layer formed on the p-type nitride semiconductor layer, a light-transmitting conductive oxide layer formed on the ... 10/19/06 - 20060231853 - Semiconductor light-emitting device and its manufacturing method In a light-emitting device and its manufacturing method, mounting by batch process with surface-mount technology, high light extraction efficiency, and low manufacturing cost are realized. The light-emitting device 1 comprises semiconductor layers (2, 3) of p-type and n-type nitride semiconductor, semiconductor-surface-electrodes (21, 31) to apply currents into each of the ... 10/19/06 - 20060231852 - Semiconductor light-emitting device, method for manufacturing same and light-emitting apparatus using same A nitride semiconductor light-emitting device includes a layered portion emitting light on a substrate. The layered portion includes an n-type semiconductor layer, an active layer, and a p-type semiconductor layer. The periphery of the layered portion is inclined, and the surface of the n-type semiconductor layer is exposed at the ... 10/05/06 - 20060220053 - Semiconductor light emitting device A semiconductor light emitting device may include a first lead; a second lead; a first semiconductor light emitting element mounted on the first lead, being configured to emit a light having an optical emission spectrum no more than 400 nm from a light extraction surface of the first semiconductor light ... 10/05/06 - 20060220052 - Led lamp apparatus and manufacturing method thereof In an LED lamp apparatus comprising an LED, a circuit portion and a case portion, a pair of the leads of the LED are surrounded at their parts by a sealing member and are extended to comprise the circuit portion, then at least one of the leads constituting the circuit ... 10/05/06 - 20060220051 - System and method for surface mountable display A system and method is disclosed for allowing a solid substrate, such as a printed circuit board (PCB), to act as the support structure for an electronic circuit. In one embodiment, the LEDs which form a part of a scrambler assembly are constructed on a first substrate and the electrical ... 10/05/06 - 20060220050 - Semiconductor light-emitting device mounting member, light-emitting diode constituting member using same, and light-emitting diode using same A semiconductor-light-emitting-device-mounting member BL comprises (a) a highly heat-dissipative member 1 having a main surface 10 on which connecting-use electrode layers 41 and 42 are provided to form a device-mounting area 10a and (b) a frame-shaped member 2 placed on the main surface 10 so as to surround the device-mounting ... 09/28/06 - 20060214179 - Semiconductor light source for illuminating a physical space including a 3-dimensional lead frame A semiconductor light source for illuminating physical spaces can include a lead frame with multiple facets. Each facet can have one or more semiconductor light emitting devices located on it. ... 09/28/06 - 20060214178 - Light emitting diode package and fabrication method thereof The present invention provides a light emitting diode (LED) package and the fabrication method thereof. The LED package includes a lower metal layer, and a first silicon layer, a first insulation layer, a second silicon layer, a second insulation layer, and a package electrode pattern formed in their order on ... 09/28/06 - 20060214177 - Cooling method and apparatus A method and apparatus for cooling an electronic component, such as an optoelectronic device, is described. The method involves arranging a porous material to be able to receive heat from the electronic component and removing heat from the porous material as a result of vaporization of a coolant delivered to ... 09/14/06 - 20060202225 - Submount for use in flipchip-structured light emitting device including transistor Disclosed herein is a submount to mount a light emitting diode in a flipchip-structured light emitting device. The submount including a transistor to mount a nitride semiconductor light emitting diode in a flipchip-structured light emitting device includes: a substrate made of a first conductive semiconductor material; a first region formed ... 09/14/06 - 20060202224 - Substrate structure for light-emitting diode module A substrate structure for light-emitting diode module includes a highly heat-radiating metal substrate, a plurality of isolating islands formed on a top surface of the metal substrate only at positions and/or paths for forming required conducting circuits, and a plurality of conduction islands separately formed on the isolating islands to ... 09/14/06 - 20060202223 - Increased light extraction from a nitride led In a method for fabricating a flip-chip light emitting diode device, a submount wafer is populated with a plurality of the light emitting diode dies. Each device die is flip-chip bonded to the submount. Subsequent to the flip-chip bonding, a growth substrate is removed. The entire submount is immersed in ... 09/07/06 - 20060197103 - Surface-mountable light-emitting diode structural element A surface-mountable light emitting diode structural element in which an optoelectronic chip is attached to a chip carrier part of a lead frame, is described. The lead frame has a connection part disposed at a distance from the chip carrier part, and which is electrically conductively connected with an electrical ... 09/07/06 - 20060197102 - Semiconductor composite apparatus, led, led printhead, and image forming apparatus A semiconductor composite apparatus includes a substrate and a planarizing layer, and a semiconductor thin film. The planarizing layer is formed on the substrate either directly or indirectly. The planarizing layer includes a first surface that faces the substrate, and a second surface that is on the side of the ... 09/07/06 - 20060197101 - Light source module of light emitting diode A light source module for a light emitting diode (LED) is provided. In the present invention, a common printed circuit board (PCB) is utilized to provide electric current and isolated from the heat dissipation mechanism, and the thermal conductive element, protruding from the LED package structure, is connected to another ... 08/31/06 - 20060192224 - Semiconductor light emitting device A semiconductor light emitting device includes a mold resin having a cup shape portion on an upper surface of the mold resin. One or more holes penetrate through the cup shape portion to outside of the mold resin and/or one or more trenches extend from the cup-shaped portion to outside ... 08/31/06 - 20060192223 - Nitride semiconductor light emitting device The invention relates to a flip-chip nitride semiconductor LED. In the LED, a light emitting structure has first and second conductivity type nitride semiconductor layers and an active layer interposed therebetween. Each of plurality of first and second electrodes has a bonding pad placed adjacent to a top corner of ... 08/31/06 - 20060192222 - Light emitting device A light emitting device is provided. The light emitting device includes a substrate, at least one light emitting chip and a first heat dissipation element. The substrate has a top surface and a bottom surface, and contacts are disposed on the top surface. The light emitting chip disposed on the ... 08/24/06 - 20060186427 - Side-view type light emitting device A side-view type light emitting device capable of effectively releasing heat generated on the surface of the substrate is provided. The side-view type light emitting device 1 comprising a substrate 1-1, a positive surface electrode 1-2, a negative surface electrode 1-3, a light emitting element 1-4, a sealing member 1-5 ... 08/17/06 - 20060180826 - El display device and a method of manufacturing the same To provide a high throughput film deposition means for film depositing an organic EL material made of polymer accurately and without any positional shift. A pixel portion is divided into a plurality of pixel rows by a bank, and a head portion of a thin film deposition apparatus is scanned ... 08/17/06 - 20060180825 - Ic chip coating material and vacuum fluorescent display device using same An IC chip coating material includes first metal oxide particles; a metal alkoxide; an organic solvent; and second metal oxide particles and/or flat particles of a composite oxide, the second metal oxide particles having a composition identical to or different from that of the first metal oxide particles and also ... 08/17/06 - 20060180824 - High power led housing and fabrication method thereof An LED housing, in which a heat conducting part has a chip mounting area, a heat connecting area opposed to the chip mounting area and a neck between them. Fixing parts have first ends engaged with the neck. An electrical connecting part has a wire connecting area placed adjacent to ... 08/17/06 - 20060180823 - Optical semiconductor device package and optical semiconductor device An optical semiconductor device package includes a disc-shaped stem, metallic leads in rod form penetrating the stem in the direction of the thickness to protrude from a main surface of the stem, and a mount extending vertically from the main surface of the stem, with a plane part of the ... 08/10/06 - 20060175627 - Power supply, multi chip module, system in package and non-isolated dc-dc converter A power supply includes a non-isolated DC-DC converter for use in a power source system having a high side switch and a low side switch, in which HEMT or HFET or gallium nitride device with low capacity and low on-resistance is used for the high side switch and a vertical ... 08/03/06 - 20060169999 - Led package frame and led package having the same The invention relates to an LED package frame and an LED package incorporating the same. The LED package frame comprises an LED chip; and a heat conductive member made of a lump of high heat conductivity material. The heat conductive member has a receiving part at a lateral portion, and ... 07/27/06 - 20060163600 - Chip component and method for producing a chip component A chip component (1) includes a semiconductor body (2), in which at least one switchable element (6, 62) is arranged in a partial region (24) of the semiconductor body (2). The partial region (24) can be reached by light of at least one wavelength. Furthermore, a circuit (9) integrated into ... 07/27/06 - 20060163599 - Light emitting diode and fabricating method thereof A light emitting diode and the method of the same are provided. A light emitting diode epitaxy structure is formed on a substrate, and then the light emitting diode epitaxy structure is etched to form a recess. The recess is then filled with a transparent dielectric material. An ohmic contact ... 07/27/06 - 20060163598 - Light emitting diode lamp module An LED lamps module is provided. The LED lamp module includes a plurality of LED lamps, a plurality of electric wires and a plurality of moisture-resisting members. In one embodiment of the present invention, each LED lamp includes a substrate with a circuitry, at least one LED chip disposed on ... 07/20/06 - 20060157725 - Led assembly having overmolded lens on treated leadframe and method therefor An LED assembly is manufactured by providing a base on a leadframe, installing an LED within the base, and treating the leadframe with the base thereon to prepare for overmolding. A cover is overmolded onto the leadframe with the base thereon to encapsulate the LED. ... 07/20/06 - 20060157724 - Light-emitting diode, backlight device and method of manufacturing the light-emitting diode A light-emitting diode includes a transparent substrate having a main surface and serving as a substrate, a light-emitting diode element mounted on the main surface, and a substantially semicylindrical resin sealing portion made of transparent resin and arranged on the main surface to sealingly cover the light-emitting diode element. The ... 07/13/06 - 20060151802 - Gallium nitride compound semiconductor device A GaN compound semiconductor device can be capable of free process design and can have optimum device characteristics. The device can include a group III nitride compound semiconductor laminate structure including an n-type GaN compound semiconductor layer and a p-type GaN compound semiconductor layer. An n electrode can be formed ... 07/13/06 - 20060151801 - Light emitting diode with thermo-electric cooler Systems and methods for fabricating a light emitting diode include depositing one or more metal layers on a substrate; forming an n-gallium nitride (n-GaN) layer above the metal layer; and depositing a thermoelectric cooler in the metal layer to dissipate heat. ... 07/13/06 - 20060151800 - Surface mountable light emitting device This invention relates to a surface mountable light emitting device in which the lead frame is exposed over a substantial portion of the underside of the device so as to allow greater thermal conductivity to any device on which it may be mounted. The LED provides the lens and a ... 07/06/06 - 20060145180 - Led lighting assembly The present invention provides a lighting head assembly that incorporates a high intensity LED package into an integral assembly including a heat sink and circuit board for further incorporation into other useful lighting devices. The present invention primarily includes a heat sink member that also serves as a mounting die ... 07/06/06 - 20060145179 - High-brightness gallium-nitride based light emitting diode structure A GaN-based LED structure is provided so that the brightness and luminous efficiency of the GaN-based LED are enhanced effectively. The greatest difference between the GaN-based LEDs according to the invention and the prior arts lies in the addition of a masking buffer layer and a roughened contact layer on ... 07/06/06 - 20060145178 - System and method for mounting electrical devices In one embodiment an electronic device, such as an optical sensor, is attached to a substrate upon which wire logouts and, if desired, other components are constructed. A frame, or cover, is attached to the substrate surrounding the attached device. An aperture in the cover allows wireless signals to pass ... 07/06/06 - 20060145177 - Light emitting device and process for fabricating the same A light emitting device 100 of the invention is the one using a first main surface of a compound semiconductor layer portion, having a light emitting layer section 24 therein, as a light extraction surface, and having, on the second main surface side of the compound semiconductor layer, a device-substrate ... 06/29/06 - 20060138442 - Diode housing A housing accommodating a semiconductor chip is set out. The housing and chip may be used for sending and/or receiving radiation. Popular applications of the housing may be in light emitting diodes. The housing includes a conductor strip that is punched into two electrically isolated portions. The housing further includes ... 06/29/06 - 20060138441 - Light source module and method for production thereof A light source module having a plurality of LEDs connected to a metal carrier (4) by means of an insulating layer (3). In order to afford protection against mechanical effects and in order to form a reflector, the LEDs are surrounded by a frame (10), which is segmented into a ... 06/22/06 - 20060131601 - Illumination assembly and method of making same An illumination assembly including a thermally conductive substrate, a patterned conductive layer proximate a major surface of the thermally conductive substrate, a dielectric layer positioned between the patterned conductive layer and the major surface of the substrate, and at least one LED including a post that is attached to the ... 06/22/06 - 20060131600 - Light transmitting window member, semiconductor package provided with light transmitting window member and method for manufacturing light transmitting window member A light transmission window member capable of simplifying the structure and capable of simplifying manufacturing steps is obtained. This light transmission window member (10, 10a), which is a light transmission window member employed for a semiconductor package (30, 30a), comprises a flat metal frame (2) having an opening (2a) for ... 06/15/06 - 20060124955 - Method of manufacturing surface-emitting backlight, by molding contact member integrally with molded case A method of manufacturing a surface-emitting backlight is provided with the steps of forming a lead frame and resin-made molded case by insert molding, attaching light sources, which are red, blue and green LED dies, to contacts of the lead frame provided in a hollow space of the molded case, ... 06/15/06 - 20060124954 - Semiconductor light emitting device and method for manufacturing the same A semiconductor light emitting device having a semiconductor stacking structure bonded onto the support member and having excellent characteristics is provided by a preferable electrode structure. The semiconductor light emitting device comprising; a semiconductor stacking structure having a first semiconductor layer and a second semiconductor layer of conductivity types different ... 06/15/06 - 20060124953 - Semiconductor light emitting device mounting substrates and packages including cavities and cover plates, and methods of packaging same A mounting substrate for a semiconductor light emitting device includes a solid metal block having first and second opposing metal faces. The first metal face includes a cavity that is configured to mount at least one semiconductor light emitting device therein, and to reflect light that is emitted by at ... 06/15/06 - 20060124952 - Light emitter One embodiment of a light emitting microchip apparatus includes a substrate having an exposed depression therein and a filament positioned within the exposed depression. ... 06/15/06 - 20060124951 - Ceramic composite material for optical conversion and use thereof A ceramic composite material for light conversion, which is a solidified body comprising two or more matrix phases with respective components being two or more oxides selected from the group consisting of metal oxides and complex oxides each produced from two or more metal oxides, wherein at least one of ... 06/08/06 - 20060118807 - Electronic microcircuit having internal light enhancement By adding light reflective and/or transparent and/or translucent material within a micro-electronic circuit housing, improved light transfer is achieved between a light generation source and a light utilization device. In one embodiment, the reflective material is placed on the inside surface of a non-metallic housing lid and the light from ... 06/08/06 - 20060118806 - Light emitting diode package A light emitting diode (LED) package including a chip carrier, an adhesive layer, a light emitting diode (LED) chip and an anti-aging layer is provided. The adhesive is disposed on the chip carrier. The LED chip having a light emitting layer is adhered on the chip carrier by the adhesive ... 06/01/06 - 20060113555 - Light emitting diode chip with large heat dispensing and illuminating area A light emitting diode chip has a large area of electricity conducting material applied to each of the P pole and the N pole and the etching process does not reduce the illuminating area so that the areas of illumination and reflection are increased and the efficiency for dispensing heat ... 05/25/06 - 20060108596 - Nitride semiconductor device and method of manufacturing the same A P-type electrode material is provided on a top surface of a P-type contact layer. The P-type electrode material is formed with an AuGa film, an Au film, a Pt film, and an Au film. The AuGa film is provided on the P-type contact layer. The Au film is provided ... 05/25/06 - 20060108595 - Led fabrication via ion implant isolation A semiconductor light emitting diode includes a semiconductor substrate, an epitaxial layer of n-type Group III nitride on the substrate, a p-type epitaxial layer of Group III nitride on the n-type epitaxial layer and forming a p-n junction with the n-type layer, and a resistive gallium nitride region on the ... 05/18/06 - 20060102921 - High-brightness gallium-nitride based light emitting diode structure A GaN-based LED structure is provided so that the brightness and lighting efficiency of the GaN-based LED are enhanced effectively. The greatest difference between the GaN-based LEDs according to the invention and the prior arts lies in the addition of a thin layer on top of the traditional structure. The ... 05/18/06 - 20060102920 - Thin film electrode for forming ohmic contact in light emitting diodes and laser diodes using nickel-based solid solution for manufacturing high performance gallium nitride-based optical devices, and method for fabricating the same Disclosed herein is a technique for forming a high quality ohmic contact utilizable in the fabrication of short-wavelength light emitting diodes (LEDs) emitting blue and green visible light and ultraviolet light, and laser diodes (LDs) using a gallium nitride (GaN) semiconductor. The ohmic contact is formed by depositing a nickel ... 05/18/06 - 20060102919 - Display device and electronic appliance using the same The present invention provides a display device including a nonvolatile memory circuit to which data can be added without increasing the number of manufacturing steps, and an electronic appliance using the display device. A display device of the present invention has a memory circuit that includes a memory element with ... 05/18/06 - 20060102918 - Package structure of a surface mount device light emitting diode A surface mount device (SMD) light emitting diode (LED) package structure is disclosed. The structure includes a cup-structure substrate, a lead frame, an LED chip, a set of conducting wires, and a transparent or semi-transparent seal. The inner or outer surface of the cup-structure substrate includes a plurality of indentations ... 05/18/06 - 20060102917 - Semiconductor light emitting device, method for producing the same and reflector for semiconductor light emitting device A semiconductor light emitting device comprises a metallic support plate 1; a light-reflective reflector 3 mounted on the support plate 1 and formed with a hole 3a; a semiconductor light emitting element 2 mounted on the support plate 1 within the hole 3a of the reflector 3, and a plastic ... 05/11/06 - 20060097277 - Method of fabricating vertical devices using a metal support film A method of fabricating semiconductor devices, such as GaN LEDs, on insulating substrates, such as sapphire. Semiconductor layers are produced on the insulating substrate using normal techniques. Trenches that define the boundaries of the individual devices are formed through the semiconductor layers and into the insulating substrate, beneficially by inductive ... 05/11/06 - 20060097276 - Flip chip type led lighting device manufacturing method A flip chip type LED lighting device manufacturing method includes the step of providing a strip, the step of providing a submount, the step of forming a metal bonding layer on the strip or submount, the step of bonding the submount to the strip, and the step of cutting the ... 05/04/06 - 20060091417 - Nitride semiconductor device A nitride semiconductor device includes a semiconductor layer, a first electrode for establishing an ohmic contact disposed on the semiconductor layer, and a second electrode on the first electrode, having a different shape from that of the first electrode. A joint region is formed with the upper layer of the ... 05/04/06 - 20060091416 - High power led package with universal bonding pads and interconnect arrangement LED packages are provided that can accommodate more than one type of LED. These packages include at least three bonding pads arranged such that two are appropriate for one type of LED, while another two are appropriate for another type of LED. Packages can include a thermally conductive layer on ... 05/04/06 - 20060091415 - Led package with structure and materials for high heat dissipation LED packages are provided that include a material that is both thermally conductive and has a coefficient of thermal expansion that is matched to that of an LED. The material can be a ceramic such as aluminum nitride. The package has a body that includes a bottom surface and a ... 05/04/06 - 20060091414 - Led package with front surface heat extractor Light sources are disclosed utilizing LED dies having at least one emitting surface. An optical element is disclosed for efficiently extracting light out of an LED die by controlling the angular distribution of the emitted light. The optical element has an input surface that is optically coupled to the emitting ... 04/27/06 - 20060086945 - Package structure for optical-electrical semiconductor A package structure for an optical-electrical semiconductor is described. The package structure has a thermal conductive structure for heat transfer and is integrally formed in one piece to improve the structural strength thereof, while the thermal conductive structure prevent over-heating of the LED device for greater longevity. The package structure ... 04/27/06 - 20060086944 - Light emitting module The light emitting module includes a substrate, a light emitting element and a driving circuit chip. The light emitting element is attached to the substrate and has a plurality of first contacts on a top surface thereof. The driving circuit chip is attached onto the substrate and has a plurality ... 04/20/06 - 20060081870 - Method of forming a lamination film pattern and improved lamination film pattern In a method of forming an electrically conductive lamination pattern, an insulating film is formed on a surface of a chromium-containing bottom layer, before an aluminum-containing top layer is formed over the insulating film, so that the insulating film separates the aluminum-containing top layer from the chromium-containing bottom layer. A ... 04/20/06 - 20060081869 - Flip-chip electrode light-emitting element formed by multilayer coa |