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Active Solid-state Devices (e.g., Transistors, Solid-state Diodes) > Incoherent Light Emitter Structure > With Reflector, Opaque Mask, Or Optical Element (e.g., Lens, Optical Fiber, Index Of Refraction Matching Layer, Luminescent Material Layer, Filter) Integral With Device Or Device Enclosure Or Package

With Reflector, Opaque Mask, Or Optical Element (e.g., Lens, Optical Fiber, Index Of Refraction Matching Layer, Luminescent Material Layer, Filter) Integral With Device Or Device Enclosure Or Package

With Reflector, Opaque Mask, Or Optical Element (e.g., Lens, Optical Fiber, Index Of Refraction Matching Layer, Luminescent Material Layer, Filter) Integral With Device Or Device Enclosure Or Package patent applications listed include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.

08/28/14 - 20140239325 - Light emitter components and methods having improved performance
Light emitter components and methods having improved performance and related methods are disclosed. In one embodiment, a light emitter component can include a submount and at least one light emitting diode (LED) chip disposed over the submount. The submount can contact at least two different sides of the at least...

08/28/14 - 20140239326 - Light emitting diode backlight module
A light emitting diode (LED) backlight module includes a transparent conductive substrate that has an electrode-bearing surface and a plurality of transparent conductive electrodes disposed on the electrode-bearing surface, an LED chip that is welded on the transparent conductive electrodes by flip-chip packaging techniques, and a reflecting member that is...

08/28/14 - 20140239327 - Nanostructured led
The device according to the invention comprises a nanostructured LED with a first group of nanowires protruding from a first area of a substrate and a contacting means in a second area of the substrate. Each nanowire of the first group of nanowires comprises a p-i-n-junction and a top portion...

08/28/14 - 20140239328 - Light emitting device package
The present application relates to a light emitting device package. The light emitting device package includes a package substrate in which a via hole is formed. An electrode layer extends to both surfaces of the package substrate after passing through the via hole. A light emitting device is arranged on...

08/28/14 - 20140239329 - Color filter substrate, electrooptic device, electrooptic device manufacturing method, and electronic apparatus
A color filter substrate includes a second base material, a stopper film provided on the second base material, an insulating film including color filter grooves provided on the stopper film, and color filters provided so as to embed the color filter grooves....

08/28/14 - 20140239330 - Optical communication module and method for making the same
An optical communication module includes an optical semiconductor element. The element includes an optical functional region having a light receiving function or a light emitting function, a first transmission layer transmissive to light emitted from the optical functional region or light received by the optical functional region, and a wiring...

08/28/14 - 20140239331 - Light emitting device, light emitting element mounting method, and light emitting element mounter
Disclosed is a light emitting device including: a light emitting element including an LED chip and a phosphor layer provided at the light emitting side of the LED chip; and a substrate on which the light emitting element is bonded by an adhesive material. The adhesive material is an anisotropic...

08/28/14 - 20140239332 - Light emitting device and lighting device including same
A light emitting device includes a base that has an element mounting surface, a light emitting element that is mounted on the element mounting surface and that has maximum light intensity in a directly upward direction, and a coating member that contains a fluorescent body that is excited by light...

08/28/14 - 20140239333 - Led lighting systems with phosphor subassemblies, and/or methods of making the same
Certain example embodiments relate to improved lighting systems and/or methods of making the same. In certain example embodiments, a lighting system includes a glass substrate with one or more apertures. An LED or other light source is disposed at one end of the aperture such that light from the LED...

08/28/14 - 20140239334 - Package structure of light emitting diode
A package structure of semiconductor light emitting element is provided. The package structure of semiconductor light emitting element includes a substrate, a light emitting element and a transparent conductive board. A first electrode and a second electrode are disposed on the substrate. The light emitting element is disposed on the...

08/28/14 - 20140239335 - Light-emitting device and application liquid
Formation of an interlayer is realized for a light-emitting device, the interlayer having properties of anticorrosion and adhesion to a silicone layer, thus preventing incidence of cracking during a baking process. The light-emitting device comprises a light-emitting element covered with the silicone layer, and the interlayer is provided between the...

08/28/14 - 20140239336 - Semiconductor light device including a lens having a light deflection structure
A semiconductor lighting device may include at least one semiconductor light source and a lens, wherein the lens has a light entrance surface at the underside, said light entrance surface facing the at least one semiconductor light source, and a light exit surface at the top side, the light entrance...

08/21/14 - 20140231841 - Semiconductor light-emitting device and method of manufacturing the same
A light-emitting device is disclosed including a light emitting structure comprising a lower layer of the first conductivity type, an active layer, an upper layer of the second conductivity type; a first electrode connected to the lower layer of the first conductivity type; a second electrode connected to the upper...

08/21/14 - 20140231842 - Semiconductor light emitting device and light emitting device
According to one embodiment, a semiconductor light emitting device includes a semiconductor layer, a first electrode, a second electrode, a first insulating film, a first interconnection layer, a second interconnection layer, a first metal pillar, a second metal pillar, a second insulating film and a fluorescent material layer. The first...

08/21/14 - 20140231843 - Semiconductor light emitting device and method for manufacturing the same
According to one embodiment, a semiconductor light emitting device includes a semiconductor layer, a p-side electrode, an n-side electrode and a fluorescent material layer. The semiconductor layer has a first surface and a second surface on an opposite side to the first surface and includes a light emitting layer. The...

08/21/14 - 20140231844 - Semiconductor light emitting device and method for manufacturing the same
According to one embodiment, a semiconductor light emitting device includes a semiconductor layer, a p-side electrode, an n-side electrode, a fluorescent material layer and a scattering layer. The semiconductor layer has a first surface and a second surface on an opposite side to the first surface and includes a light...

08/21/14 - 20140231845 - Semiconductor light emitting device and method for manufacturing the same
According to one embodiment, a semiconductor light emitting device includes a semiconductor layer, a p-side electrode, an n-side electrode, a fluorescent material layer and a reflection film. The semiconductor layer has a first surface and a second surface on an opposite side to the first surface and includes a light...

08/21/14 - 20140231846 - Light emitting module
A light emitting module includes a light-emitting unit, a wavelength converting element and an optical convergent element for partially or totally converting the wavelength of incident light. The light-emitting unit includes a light-emitting element which emits a first light, the wavelength converting element and an optical convergent element disposed in...

08/21/14 - 20140231847 - Light emitting module and lighting device
A light emitting module according to one embodiment includes a substrate; a light emitting body disposed on the substrate; a first phosphor which is excited by emitted light of the light emitting body; and a second phosphor which is arranged between the first phosphor and the light emitting body. The...

08/21/14 - 20140231848 - Engineered-phosphor led packages and related methods
In accordance with certain embodiments, regions of spatially varying wavelength-conversion particle concentration are formed over light-emitting dies....

08/21/14 - 20140231849 - Semiconductor light-emitting devices
Semiconductor light-emitting devices including a semiconductor region that includes a light-emitting structure; and an electrode layer including a first reflection metal layer that contacts a first portion of the semiconductor region and being configured to reflect light from the light-emitting structure and a second reflection metal layer that contacts a...

08/21/14 - 20140231850 - Engineered-phosphor led packages and related methods
In accordance with certain embodiments, regions of spatially varying wavelength-conversion particle concentration are formed over light-emitting dies....

08/21/14 - 20140231851 - Light emitting diode
A light emitting diode includes a semiconductor stacked structure, a substrate, a first electrode, a second electrode and a third electrode. The semiconductor stacked structure includes a first semiconductor layer, a second semiconductor layer and a light emitting layer. The first semiconductor layer has a first surface and a second...

08/21/14 - 20140231852 - Led chip resistant to electrostatic discharge and led package including the same
A light emitting diode chip and a light emitting diode package including the same. The light emitting diode chip includes a substrate, a light emitting diode section disposed on the substrate, an inverse parallel diode section disposed on the substrate and connected inversely parallel to the light emitting diode section....

08/21/14 - 20140231853 - Group-iii nitride semiconductor light-emitting element and manufacturing method therefor
A group-III nitride semiconductor light emitting element includes a semiconductor layer that includes a light emitting layer, a p-type semiconductor layer and an n-type semiconductor layer, a p-contact electrode that is in contact with the p-type semiconductor layer, an n-contact electrode that is in contact with the n-type semiconductor layer,...

08/21/14 - 20140231854 - Engineered-phosphor led packages and related methods
In accordance with certain embodiments, regions of spatially varying wavelength-conversion particle concentration are formed over light-emitting dies....

08/21/14 - 20140231855 - Method for producing a light-emitting diode and light-emitting diode
A method of producing a light-emitting diode includes providing at least one light-emitting diode chip, providing a suspension comprising a solvent and particles of at least one luminescent material, arranging the at least one light-emitting diode chip in the suspension, electrophoretically depositing the particles on an outer face of the...

08/21/14 - 20140231856 - Method for producing at least one radiation-emitting and/or -receiving semiconductor component, and semiconductor component
A method for producing a radiation-emitting or radiation-receiving semiconductor component is specified. In a method step, a carrier body having a mounting surface is provided. In a further method step, a barrier frame is formed on the mounting surface, in such a way that the barrier frame laterally encloses a...

08/21/14 - 20140231857 - Phosphor materials and related devices
A phosphor material is presented that includes a blend of a first phosphor, a second phosphor and a third phosphor. The first phosphor includes a composition having a general formula of RE2−yM1+yA2−yScySin-wGewO12+δ:Ce3+ wherein RE is selected from a lanthanide ion or Y3+, where M is selected from Mg, Ca, Sr...

08/14/14 - 20140225139 - Light emitting device package and method of manufacturing the same
A light emitting device package includes a frame unit including at least two lead frames spaced apart from one another and a light emitting region defined by a distance between the two lead frames; a light emitting device mounted on a surface of the frame unit such that the light...

08/14/14 - 20140225140 - Light-emitting device
Occurrence of a crosstalk phenomenon in a light-emitting device is inhibited. A light-emitting device including an insulating layer 416; a first lower electrode 421a formed over the insulating layer; a second lower electrode 421b formed over the insulating layer; a partition 418 formed over the insulating layer and positioned between...

08/14/14 - 20140225141 - Semiconductor light emitting device
According to one embodiment, a semiconductor light emitting device includes a first metal layer, a second metal layer, a third metal layer, a semiconductor light emitting unit and an insulating unit. The semiconductor light emitting unit is separated from the first metal layer in a first direction. The second metal...

08/14/14 - 20140225142 - Semiconductor light emitting device
According to one embodiment, a semiconductor light emitting device includes a metal layer, a stacked structural body, a first electrode, a pad electrode, a first conductive layer, a second conductive layer and an insulating layer. The metal layer includes a major surface having a first region, a second region, a...

08/14/14 - 20140225143 - Light emitting device
A semiconductor device has a light emitting element, and a resin layer; the light emitting element includes a semiconductor laminated body in which a first semiconductor layer and a second semiconductor layer are laminated in sequence, a second electrode connected to the second semiconductor layer on an upper surface of...

08/14/14 - 20140225144 - Light-reflective conductive particle, anisotropic conductive adhesive, and light-emitting device
A light-reflective conductive particle for an anisotropic conductive adhesive used for connecting a light-emitting element to a wiring board by anisotropic conductive connection includes a core particle covered with a metal material and a light reflecting layer formed of a light-reflective inorganic particle having a refractive index of 1.52 or...

08/14/14 - 20140225145 - Light emitting device and fabricating method thereof
A light-emitting device includes a light-emitting element for emitting primary light, and a wavelength conversion unit for absorbing part of the primary light and emitting secondary light having a wavelength longer than that of the primary light, wherein the wavelength conversion unit includes plural kinds of phosphors having light absorption...

08/14/14 - 20140225146 - Semiconductor light-emitting element
A semiconductor light-emitting element includes a support substrate, a semiconductor film including a light-emitting layer provided on the support substrate, a surface electrode provided on a light-extraction-surface-side surface of the semiconductor film, and a light-reflecting layer provided between the support substrate and the semiconductor film, forming a light-reflecting surface. The...

08/14/14 - 20140225147 - Method for producing a plurality of opto-electronic components and opto-electronic component
A method is provided for producing a plurality of optoelectronic components. A number of semiconductor chips are arranged on a connection carrier assembly. A frame assembly with a number of openings is arranged in such a way, relative to the connection carrier assembly, that the semiconductor chips are each arranged...

08/14/14 - 20140225148 - Optoelectronic component including an adhesive layer, method for producing an adhesive layer in an optoelectronic component, and use of an adhesive to form adhesive layers in optoelectronic components
An optoelectronic component includes at least one active semiconductor layer sequence, at least one first and one second element, and at least one adhesive layer arranged between at least one first element and at least one second element. The adhesive layer is produced from an adhesive that comprises at least...

08/14/14 - 20140225149 - Optoelectronic semiconductor component and method for fabricating an optoelectronic semiconductor component
An optoelectronic semiconductor component includes an optoelectronic semiconductor chip and an optical element. A connecting layer includes a transparent oxide arranged between the semiconductor chip and the optical element. The connecting layer directly adjoins the semiconductor chip and the optical element and fixes the optical element on the semiconductor chip....

08/07/14 - 20140217436 - Submount-free light emitting diode (led) components and methods of fabricating same
Light emitting devices include a Light Emitting Diode (LED) chip having an anode contact and a cathode contact on a face thereof. A solder mask extends from the gap between the contacts onto one or both of the contacts. The LED chip may be mounted on a printed circuit board...

08/07/14 - 20140217437 - Light emitting apparatus and manufacturing method thereof
The present application provides for a method for manufacturing a light emitting apparatus. The method includes mounting light emitting elements on a substrate and applying a resin containing phosphors to form wavelength conversion units covering the light emitting elements on the substrate. Portions of the wavelength conversion unit are removed...

08/07/14 - 20140217438 - Semiconductor light emitting device and method for manufacturing same
According to one embodiment, a semiconductor light emitting device includes: a semiconductor layer; a first electrode; a first interconnection layer; a second electrode; a second interconnection layer; a support substrate; a bonding layer; a first terminal; and a second terminal. The support substrate has a third face facing the semiconductor...

08/07/14 - 20140217439 - Semiconductor light emitting device
The present disclosure relates to a semiconductor light-emitting device, comprising: a plurality of semiconductor layers grown sequentially using a growth substrate; a first electrode for providing either electrons or holes to a first semiconductor layer; a non-conductive reflective film formed over a second semiconductor layer to reflect light from an...

08/07/14 - 20140217440 - Light-emitting module and manufacturing method thereof
A light-emitting module includes a first conductive lead frame, a second conductive lead frame physically separated from the first conductive lead frame, a protective plastic layer, a reflective plastic layer, and a light-emitting die. The protective plastic layer surrounds the first and second conductive lead frames, and an accommodating space...

08/07/14 - 20140217441 - Antireflection coating using self-assembly nano structure and manufacture method thereof
In an aspect of the present disclosure, there is disclosed a manufacture method of an antireflection coating using a self-assembly nano structure, which includes forming a first metal droplet on a substrate by means of droplet epitaxy, depositing a first non-metal on the formed first metal droplet, and forming a...

08/07/14 - 20140217442 - Semiconductor light-emitting element, light-source head, and image forming apparatus
A semiconductor light-emitting element includes a semiconductor layer including a light-emitting layer, and an upper reflective surface and a lower reflective surface between which the semiconductor layer is interposed. A distance L between the upper reflective surface and the lower reflective surface satisfies 0.20λ+0.5aλ≦L≦0.30λ+0.5aλ, where λ denotes a peak wavelength...

08/07/14 - 20140217443 - Chip with integrated phosphor
This disclosure relates to light emitting devices and methods of manufacture thereof, including side and/or multi-surface light emitting devices. Embodiments according to the present disclosure include the use of a functional layer, which can comprise a stand-off distance with one or more portions of the light emitter to improve the...

08/07/14 - 20140217444 - Optoelectronic semiconductor component and method for the production thereof
An optoelectronic semiconductor device including a carrier substrate and at least one semiconductor chip arranged thereon, wherein the semiconductor chip includes an active layer that generates radiation, conductor tracks electrically contacting the semiconductor chip arranged on the carrier substrate, the semiconductor chip is enclosed in a potting material, and the...

08/07/14 - 20140217445 - High efficiency plastic light conversion components by incorporation of phosphor in a polymer by adding to monomers before polymerisation
The invention relates to a method for producing a polymer product having integrated luminescent material particles, the polymer product being produced from at least one monomer in liquid phase and at least one kind of powder of luminescent material particles. The method is characterized by adding the luminescent material to...

08/07/14 - 20140217446 - Led package and metallic frame thereof
A light emitting diode package includes a metallic frame, and an LED chip disposed on the metallic frame. The metallic frame includes first and second metal plates arranged side by side with a space therebetween, and two support arms extending integrally and respectively from two opposite ends of the second...

08/07/14 - 20140217447 - Phosphor compositions for highly reliable white light-emitting diode devices
y=0.0805x3−154.06x2+97017x−2E+07....

08/07/14 - 20140217448 - Semiconductor light emitting device
There is provided a semiconductor light-emitting device having a small size and high light efficiency. The semiconductor light-emitting device includes a substrate; a light-emitting structure that includes a first conductive-type semiconductor layer, an active layer, and a second conductive-type semiconductor layer are formed on the substrate, wherein the light-emitting structure...

08/07/14 - 20140217449 - Substrate for optics and semiconductor light emitting device
To provide a substrate for optics provided with a fine-structure product which improves luminous efficiency of an LED while improving internal quantum efficiency IQE by decreasing the number of dislocation defects in a semiconductor layer, a substrate for optics (1) is provided with a fine-structure layer (12) including dots comprised...

08/07/14 - 20140217450 - Anisotropic conductive adhesive and method for manufacturing same, and light-emitting device and method for manufacturing same
An anisotropic conductive adhesive which uses conductive particles where a silver-based metal is used as a conductive layer, having high light reflectance and excellent migration resistance is provided. The anisotropic conductive adhesive includes light reflective conductive particles in an insulating adhesive resin. The light reflective conductive particle includes a light...

08/07/14 - 20140217451 - Mixed light led structure
Disclosed is a mixed light LED structure which is a solid-state phosphor plate manufactured by mixing phosphor and resin, and the solid-state phosphor plate is installed in a carrier and covered onto the top of a light emitting chip, and a specific ratio relation between the area of the solid-state...

08/07/14 - 20140217452 - Light emitting device having vertical structure and package thereof
A light emitting device having a vertical structure and a package thereof, which are capable of damping impact generated in a substrate separation process, and achieving an improvement in mass productivity. The device and package include a sub-mount, a first-type electrode, a second-type electrode, a light emitting device, a zener...

08/07/14 - 20140217453 - Light emitting diode
A light emitting diode includes a first semiconductor layer, an active layer, a second semiconductor layer, an upper electrode, and a lower electrode. The active layer is sandwiched between the first semiconductor layer and the second semiconductor layer. The lower electrode is electrically connected with the first semiconductor layer, and...

08/07/14 - 20140217454 - Light source comprising a luminescent substance and associated illumination unit
A light source includes a primary radiation source, which emits radiation in the shortwave range of the optical spectral range, wherein this radiation is converted at least by means of a first luminescent substance entirely or partially into secondary longer-wave radiation in the visible spectral range, wherein the first luminescent...