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With Reflector, Opaque Mask, Or Optical Element (e.g., Lens, Optical Fiber, Index Of Refraction Matching Layer, Luminescent Material Layer, Filter) Integral With Device Or Device Enclosure Or Package

With Reflector, Opaque Mask, Or Optical Element (e.g., Lens, Optical Fiber, Index Of Refraction Matching Layer, Luminescent Material Layer, Filter) Integral With Device Or Device Enclosure Or Package patent applications listed include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.

Related Categories:

Active Solid-state Devices (e.g., Transistors, Solid-state Diodes)


Incoherent Light Emitter Structure > With Reflector, Opaque Mask, Or Optical Element (e.g., Lens, Optical Fiber, Index Of Refraction Matching Layer, Luminescent Material Layer, Filter) Integral With Device Or Device Enclosure Or Package



Illuminating device
05/21/15 - 20150137157 - An illuminating device including a substrate, a light-emitting diode element disposed on the substrate, an electrode element, and a sealing ring. The substrate has a groove, and the electrode element has a retaining slot disposed in the groove. The sealing ring is embedded into the retaining slot and a part...

Led package frame and led package structure
05/21/15 - 20150137158 - A light-emitting diode (LED) package frame is provided, including a leadframe and an insulating member. The leadframe includes a first electrode and a second electrode separated from each other. The insulating member is disposed between the first electrode and the second electrode for insulation between the first and second electrodes,...

Light-emitting device, light-emitting device package, and light unit
05/21/15 - 20150137159 - A light-emitting device, according to one embodiment, comprises: a light-emitting structure comprising a first conductive semiconductor layer, an active layer which is underneath the first conductive semiconductor layer, and a second conductive semiconductor layer which is underneath the active layer; a reflective electrode, which is arranged under the light-emitting structure;...

Light-emitting device, light-emitting device package, and light unit
05/21/15 - 20150137160 - A light-emitting device, according to one embodiment, comprises: a transparent conductive oxide film; an active layer which comes into contact with a lower surface of the transparent conductive oxide layer; a first conductive semiconductor layer which comes into contact with a lower surface of the active layer; a reflective electrode...

Light-emitting device
05/21/15 - 20150137161 - Since, for example, a printed resistance 16, as a protective element, is formed on at least the top surface side, the back surface side, or the inside of an insulating film 2 and, for example, the printed resistance 16, as a protective element, is formed on the rear surface side...

Optoelectronic semiconductor component with sapphire flip-chip
05/21/15 - 20150137162 - An optoelectronic semiconductor component has a volume-emitting sapphire flip-chip with an upper side and a lower side. This optoelectronic semiconductor component is embedded in an optically transparent mold body with an upper side and a lower side....

Led cap containing quantum dot phosphors
05/21/15 - 20150137163 - An LED device has a cap containing one or more quantum dot (QD) phosphors. The cap may be sized and configured to be integrated with standard LED packages. The QD phosphor may be held within the well of the LED package, so as to absorb the maximum amount of light...

Semiconductor light emitting device and method for manufacturing the same
05/21/15 - 20150137164 - Provided is a semiconductor light emitting device 1 includes a semiconductor stacked layer 2 having a light extraction surface 3a perpendicular to a stacked surface of the semiconductor stacked layer 2, a light transmissive light guide member 3 disposed on the semiconductor stacked Layer 2, a light reflective member 4...

Light-emitting device
05/21/15 - 20150137165 - A light-emitting device includes a mounting board, a light-emitting element mounted on a main face of the mounting board, and a sealing member covering the light-emitting element. The sealing member includes a first sealing layer covering a part of the main face of the mounting board and the light-emitting element,...

Epoxy resin composition for optical semiconductor device and optical semiconductor device using the same
05/21/15 - 20150137166 - The present invention relates to an epoxy resin composition for an optical semiconductor device having an optical semiconductor element mounting region and having a reflector that surrounds at least a part of the region, the epoxy resin composition being an epoxy resin composition for forming the reflector, the epoxy resin...

Light-emitting device
05/21/15 - 20150137167 - A light-emitting device, comprises a light-emitting stacked layer comprising a first conductivity type semiconductor layer; a light-emitting layer formed on the first conductivity type semiconductor layer; and a second conductivity type semiconductor layer formed on the light-emitting layer and comprising a first plurality of cavities; a first planarization layer formed...

Wavelength-converting light emitting diode (led) chip and led device equipped with chip
05/21/15 - 20150137168 - A wavelength-converted light emitting diode (LED) chip is provided. The wavelength-converted LED chip includes an LED chip and a wavelength-converted layer. The LED chip emits light in a predetermined wavelength region. The wavelength-converted layer is formed of a resin containing phosphor bodies of at least one kind which convert a...

Light-emitting device package
05/14/15 - 20150129912 - A light-emitting device package including a substrate, a packaging lens, a light-emitting unit and a plurality of optical microstructures is provided. The packaging lens and the light-emitting unit are disposed on the substrate and the packaging lens wraps the light-emitting unit. The packaging lens has a bottom surface and includes...

Electrode structure
05/14/15 - 20150129913 - An electrode structure includes a first diffusion barrier layer, an aluminum reflective layer formed over the first diffusion barrier layer. The aluminum reflective layer has a thickness from about 500 angstroms (Å) to less than 2,000 Å, a second diffusion barrier layer formed over the aluminum reflective layer, and an...

Light-emitting diode package
05/14/15 - 20150129914 - The invention provides a light-emitting diode package. The light-emitting diode package includes a lead frame having a first lead and a second lead separated from each other by a space. A transparent plastic housing surrounds and encapsulates the lead frame to form a cup-shaped body having a recessed accommodating space....

Light-emitting diode provided with substrate having pattern on rear side thereof, and method for manufacturing same
05/14/15 - 20150129915 - A method for manufacturing a light-emitting diode is provided. First, a substrate having a front or top surface and a rear or bottom surface is provided. An uneven pattern is formed on the rear or bottom surface. A light-emitting semiconductor layer is formed by stacking a first semiconductor layer, an...

Light emitting device with remote nanostructured phosphor
05/14/15 - 20150129916 - Embodiments of the invention include a light emitting device (LED 10), a first wavelength converting material (13, in a matrix 14 to form a layer 12), and a second wavelength converting material (forming layer 16). The first wavelength converting material includes a nanostructured wavelength converting material. The nanostructured wavelength converting...

Light-emitting device, light-emitting device package, and light unit
05/14/15 - 20150129917 - The light-emitting device, according to one embodiment, comprises: a light-emitting structure including a first conductive semiconductor layer, an active layer formed beneath the first conductive semiconductor layer, and a second conductive semiconductor layer formed beneath the active layer; a reflective electrode arranged beneath the light-emitting structure and having a first...

Light emitting device and method of manufacturing light emitting device
05/14/15 - 20150129918 - Provided is a light emitting device having a phosphor layer on a surface of a semiconductor light emitting element and achieving an even light distribution color, and a method of manufacturing the same. A method of manufacturing a light emitting device includes arranging a plurality of semiconductor light emitting elements...

Light-emitting device and the method of manufacturing the same
05/14/15 - 20150129919 - The present application discloses a light-emitting device comprises a semiconductor light-emitting element, a transparent element covering the semiconductor light-emitting element, an insulating layer which connects to the transparent element, an intermediate layer which connects to the insulating layer; and a conductive adhesive material connecting to the intermediate layer....

Semiconductor light emitting device
05/14/15 - 20150129920 - Disclosed is a semiconductor light emitting device. The semiconductor light emitting device comprises a light emitting structure comprising a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer; a reflective layer under the light emitting structure; a first electrode layer on the first conductive semiconductor layer;...

Uniform emission led package
05/14/15 - 20150129921 - An emitter package comprising a light emitting diode (LED) mounted to the surface of a submount with the surface having a first meniscus forming feature around the LED. A matrix encapsulant is included on the surface and covering the LED. The outer edge of the matrix encapsulant adjacent the surface...

Semiconductor light emitting device providing graded brightness
05/14/15 - 20150129922 - A semiconductor light emitting device includes a semiconductor lamination including a p-type semiconductor layer, an active semiconductor layer, and an n-type semiconductor layer; opposing electrode structure including a first electrode structure formed above the p-type semiconductor layer, and a second electrode structure formed above the n-type semiconductor layer; and brightness...

Led package with red-emitting phosphors
05/07/15 - 20150123153 - The first population of particles has a lower manganese concentration than the second population of particles, and the manganese concentration in the polymer composite layer ranges from a minimum value in a region of the polymer composite layer proximate to the LED chip to a maximum value in a region...

Light emitting diode structure
05/07/15 - 20150123154 - A light emitting diode structure includes a first type semiconductor layer, an illumination layer, a second type semiconductor layer, a plurality of first light extraction improvement structures and a transparent conductive layer. The illumination layer is disposed on the first type semiconductor layer. The second type semiconductor layer is disposed...

Phosphors, such as new narrow-band red emitting phosphors for solid state lighting
05/07/15 - 20150123155 - The invention provides, amongst others for application in a lighting unit, a phosphor having the formula M1−x−y−zZzAaBbCcDdEeN4−nOn:ESxREy (I), with M=selected from the group consisting of Ca, Sr, and Ba; Z=selected from the group consisting of monovalent Na, K, and Rb; A=selected from the group consisting of divalent Mg, Mn, Zn,...

Optoelectronic semiconductor component
05/07/15 - 20150123156 - An optoelectronic semiconductor component having a light source, which emits primary radiation, a housing, and electrical terminals, wherein a conversion element, which is based on a matrix and at least two phosphors, is connected upstream of the optoelectronic semiconductor component. The matrix contains metal phosphate and preferably consists of metal...

Vertical integration of cmos electronics with photonic devices
05/07/15 - 20150123157 - A method of fabricating a composite semiconductor structure includes providing an SOI substrate including a plurality of silicon-based devices, providing a compound semiconductor substrate including a plurality of photonic devices, and dicing the compound semiconductor substrate to provide a plurality of photonic dies. Each die includes one or more of...

Light emitting device
05/07/15 - 20150123158 - A light emitting device includes a substrate, a light extraction layer provided over the substrate and a light emitting structure provided over the light extraction layer. The light extraction layer has a refraction index higher than a refraction index of the substrate and lower than a refraction index of the...

Semiconductor light emitting device
05/07/15 - 20150123159 - According to an embodiment, a semiconductor light emitting device includes a semiconductor layer, a first electrode, an second electrode, a first insulating film, a first interconnection and a second interconnection. The semiconductor layer includes a luminous portion and a non-luminous portion. The first electrode is provided on the luminous portion,...

Semiconductor light emitting device
04/30/15 - 20150115300 - According to one embodiment, the n-side electrode has a corner and a plurality of straight portions. The plurality of straight portions extends in different directions. The corner connects the plurality of straight portions. A first insulating film is provided between the semiconductor layer and the corner of the n-side electrode....

Electrode structure and light emitting diode structure having the same
04/30/15 - 20150115301 - An electrode structure includes at least one reflection layer, a barrier layer, and a conductive pad. The barrier layer includes a first barrier layer and a second barrier layer. The first and second barrier layers are stacked on the reflection layer in sequence. The first and second barrier layers are...

Optoelectronic devices containing a converter carrier layer, and methods of producing an optoelectronic device containing a converter carrier layer
04/30/15 - 20150115302 - An optoelectronic device includes a layer sequence having an active layer that emits electromagnetic primary radiation, and at least one converter carrier layer arranged in the beam path of the electromagnetic primary radiation. The at least one converter carrier layer includes converter particles and an inorganic-organic hybrid material and/or a...

Led module with circuit board
04/30/15 - 20150115303 - The present invention relates to an LED module 10, a circuit board 1, and a method for coating the circuit board 1 that is used in an LED module 10. The circuit board 1 is used particularly for reflecting light emitted by at least one LED chip of the LED...

Optoelectronic component and method for producing an optoelectronic component
04/30/15 - 20150115304 - An optoelectronic component may include a carrier element having a heat sink, at least one semiconductor chip for emitting electromagnetic radiation which is mounted and electrically contact-connected on the carrier element, a radiation-transmissive cover disposed downstream of the at least one semiconductor chip, a converter layer applied on the radiation-transmissive...

Optoelectronic component
04/30/15 - 20150115305 - the first connection layer has a first layer thickness and the second partial layer has a second layer thickness, wherein the first layer thickness and the second layer thickness differ from one another at most by 20%....

Light emitting device and light emitting module including a fluorescent material layer
04/30/15 - 20150115306 - A semiconductor light-emitting device includes a semiconductor light-emitting layer, a pair of electrodes, a fluorescent material layer and a chromaticity adjusting layer. The semiconductor light-emitting layer emits first light. The pair of electrodes is connected to the semiconductor light-emitting layer. The fluorescent material layer covers at least a center portion...

Sapphire substrate and method for manufacturing the same and nitride semiconductor light emitting element
04/30/15 - 20150115307 - A sapphire substrate provided with a plurality of projections on a principal surface on which a nitride semiconductor is grown to form a nitride semiconductor light emitting element, wherein the projection is substantially pyramidal-shaped having a pointed top and constituted by a plurality of side surfaces, wherein the side surface...

Light-emitting structure
04/23/15 - 20150108519 - A light-emitting structure is provided, including a substrate, an LED stacked structure formed on the substrate, and a plurality of cavities formed on the substrate surrounding the LED stacked structure. The LED stacked structure comprises an N-type epitaxial layer, an illumination layer, and a P-type epitaxial layer. A portion of...

Semiconductor light emitting device
04/23/15 - 20150108520 - A semiconductor light emitting device includes a light emitting structure and first and second electrodes. The light emitting structure includes first and second conductivity type semiconductor layers and an active layer interposed therebetween. The first and second electrodes are electrically connected to the first and second conductivity type semiconductor layers....

Light emitting device
04/23/15 - 20150108521 - A light emitting device according to embodiments includes a light emitting element emitting light with a peak wavelength of 420˜445 nm, a first phosphor emitting light with a peak wavelength of 485˜530 nm, a second phosphor emitting light with a peak wavelength of 530˜580 nm, and a third phosphor emitting...

Led lamps
04/23/15 - 20150108522 - A high power LED lamp has a GaN chip placed over an AlGaInP chip. A reflector is placed between the two chips. Each of the chips has trenches diverting light for output. The chip pair can be arranged to produce white light having a spectral distribution in the red to...

Semiconductor light-emitting device
04/23/15 - 20150108523 - A reliable semiconductor light-emitting device can include a mounting board, at least one semiconductor light-emitting chip mounted on the mounting board, a wavelength converting layer having a side surface covering the light-emitting chip, and a seal member having an opening contacting the side surface of the wavelength converting layer and...

Semiconductor nanoparticle-based light-emitting devices and associated materials and methods
04/23/15 - 20150108524 - Embodiments of the present invention relate to a formulation for use in the fabrication of a light-emitting device, the formulation including a population of semiconductor nanoparticles incorporated into a plurality of discrete microbeads comprising an optically transparent medium, the nanoparticle-containing medium being embedded in a host light-emitting diode encapsulation medium....

Light emitting diode for surface mount technology, method of manufacturing the same, and method of manufacturing light emitting diode module
04/23/15 - 20150108525 - Provided are a light emitting diode (LED) in which a conductive barrier layer surrounding a reflective metal layer is defined by a protective insulating layer, and a method of manufacturing the same. A reflection pattern including a reflective metal layer and a conductive barrier layer is formed on an emission...

Light emitting diode
04/23/15 - 20150108526 - A light emitting diode includes a semiconductor stacked structure, a substrate, a first electrode, a second electrode and a third electrode. The semiconductor stacked structure includes a first semiconductor layer, a second semiconductor layer and a light emitting layer. An undoped semiconductor layer over the first semiconductor layer may be...

Light emitting diode
04/23/15 - 20150108527 - A light emitting diode includes a semiconductor stacked structure, a substrate, a first electrode, a second electrode and a third electrode. The semiconductor stacked structure includes a first semiconductor layer, a second semiconductor layer and a light emitting layer. A light extraction layer with a roughened structure is formed on...

Light emitting diode module for surface mount technology and method of manufacturing the same
04/23/15 - 20150108528 - Provided is a light emitting diode (LED) in which a side surface of a reflective metal layer has a predetermined angle, and occurrence of cracks in a conductive barrier layer formed on the reflective metal layer can be prevented. Also, an LED module using LEDs is disclosed. A reflection pattern...

Light emitting diode package and method of manufacture
04/23/15 - 20150108529 - A light emitting diode (LED) device and packaging for same is disclosed. In some aspects, the LED is manufactured using a vertical configuration including a plurality of layers. Certain layers act to promote mechanical, electrical, thermal, or optical characteristics of the device. The device avoids design problems, including manufacturing complexities,...

Semiconductor device for emitting frequency-adjusted infrared light
04/16/15 - 20150102372 - A semiconductor device for emitting frequency-adjusted infrared light includes a lateral emitter structure and a lateral filter structure. The lateral emitter structure is configured to emit infrared light with an emitter frequency distribution. Further, the lateral filter structure is configured to filter the infrared light emitted by the lateral emitter...

Light emitting diode package and method of manufacturing the same
04/16/15 - 20150102373 - There is provided a light emitting diode (LED) package. The LED package includes a package body. The LED package also includes an LED chip mounted on the package body. The LED package further includes a side inclined portion disposed to enclose side surfaces of the LED chip, including a light...

Optoelectronic component and method for producing it
04/16/15 - 20150102374 - An optoelectronic component is specified. According to at least one embodiment of the invention, the optoelectronic component comprises a housing (20) and a radiation-emitting or radiation-receiving semiconductor chip (10) arranged in the housing (20). Furthermore, the component comprises an optical element (50), which contains a polymer material comprising a silicone....

Light emitting device package
04/16/15 - 20150102375 - A light emitting device package is disclosed. The light emitting device package includes a package body including at least one ceramic layer, a submount disposed at the package body, a light emitting device disposed on the submount for emitting ultraviolet (UV)-wavelength light, and an anti-reflection (AR) coating layer disposed around...

Light-emitting device and electronic apparatus
04/16/15 - 20150102376 - A light-emitting device includes a light-emitting element disposed in a display region and including a first electrode, a second electrode, and a light-emitting functional layer. The light-emitting device includes a wiring formed in a periphery of the display region and that is electrically connected to the second electrode, and a...

Flip chip light emitting diode package structure
04/16/15 - 20150102377 - A flip chip light emitting diode package structure includes a package carrier, a light guiding unit and at least one light emitting unit. The light guiding unit and the light emitting unit are disposed on the package carrier, and the light emitting unit is located between the light guiding unit...

Light emitting diode package structure
04/16/15 - 20150102378 - A light-emitting diode package structure includes a package carrier, a light guiding component and a light emitting unit. The light guiding component is disposed on the package carrier. The light emitting unit is disposed on an upper surface of light guiding component relatively distant from the package carrier. A horizontal...

Light emitting diode structure
04/16/15 - 20150102379 - A light emitting diode structure includes a substrate and a light emitting unit. The substrate has a protrusion portion and a light guiding portion. The protrusion portion and the light guiding portion have a seamless connection therebetween, and a horizontal projection area of the protrusion portion is smaller than that...

Light-emitting element mounting package, manufacturing method of the same, and light-emitting element package
04/16/15 - 20150102380 - A light-emitting element mounting package including a first wiring forming a first light-emitting element mounting portion, which is provided on one surface of a substrate to mount a light-emitting element, and a first through wiring having one end and another end, the one end being electrically connected to the first...

Semiconductor light emitting device, wafer, and method for manufacturing nitride semiconductor crystal layer
04/16/15 - 20150102381 - According to one embodiment, a semiconductor light emitting device includes a first semiconductor layer, a light emitting layer, a second semiconductor layer, and a low refractive index layer. The first semiconductor layer has a first major surface and a second major surface being opposite to the first major surface. The...

Die emitting white light
04/09/15 - 20150097203 - Various methods and apparatuses are disclosed. A method may include disposing at least one die on a location on a carrier substrate, forming at least one stud bump on each of at least one die, forming a phosphor layer on the at least one stud bump and the at least...

Method of producing crystalline substrate having concave-convex structure
04/09/15 - 20150097204 - A method of producing the crystalline substrate having a concave-convex structure includes: (A) forming a transfer film by forming a concave-convex film on a support film on the surface having a concave-convex pattern thereon so that thickness of the residual film of the concave-convex film is 0.01 to 1 μm,...

Light emitting diode having magnetic structure and method of fabricating the same
04/09/15 - 20150097205 - A light emitting diode including a magnetic structure and a method of fabricating the same are disclosed. The magnetic structure composed of passivation layers and a magnetic layer is disposed inside a luminous structure composed of an active layer and a semiconductor layer. In the light emitting diode, the magnetic...

Method of manufacturing package component for light emitting diode and package structure thereof
04/09/15 - 20150097206 - A method of manufacturing package component for light emitting diode (LED) is disclosed. At least one LED is disposed on a substrate inside a photocuring resin, wherein the LED is covered completely by the substrate and the photocuring resin. Power is provided to the LED to make the LED emit...

Locating optical structures to leds
04/02/15 - 20150091031 - An optical device and a method of making an optical device are disclosed. A printed wiring board is formed that includes coupling elements at selected locations. The coupling elements are formed using a printed wiring board manufacturing technique. A light source may be coupled to the printed wiring board at...

Nickel-titanium and related alloys as silver diffusion barriers
04/02/15 - 20150091032 - Diffusion of silver from LED reflector layers is blocked by 10-50 nm barrier layers of nickel-titanium (NiTi) alloys. Optionally, the alloys also include one or more of tungsten (W), niobium (Nb), aluminum (Al), vanadium (V), tantalum (Ta), or chromium (Cr). These barriers may omit the noble-metal (e.g., platinum or gold)...

Light enhancing structure for a light emitting diode
04/02/15 - 20150091033 - A light enhancing structure includes a light emitting diode in it and at least one coating layer. The light emitting diode unit includes a plurality of surfaces and a light-emitting surface. The light-emitting surface is for allowing a plurality of lights generated inside the light emitting diode unit to emit...

Light emitting diode package
04/02/15 - 20150091034 - A light-emitting diode (LED) package structure includes a lead frame, a LED chip, a package body, N opaque spacer and N+1 encapsulating glues. The LED chip is disposed on the lead frame; the package body covers the lead frame and exposes the LED chip. The package body has an accommodation...

Semiconductor device structure
04/02/15 - 20150091035 - The present disclosure relates to a method for manufacturing a semiconductor device structure, comprising the steps of: securing the position of a semiconductor device on a plate; securing the positions of electrodes such that the electrodes face the plate; covering the semiconductor device with an encapsulating material; and separating, from...

Light emitting diode
04/02/15 - 20150091036 - Disclosed herein is a light emitting diode. The light emitting diode includes a substrate, an n-type semiconductor layer placed on the substrate, an active layer placed on the n-type semiconductor layer, a p-type semiconductor layer placed on the active layer, a reflective layer placed on the p-type semiconductor layer, an...

Light emitting device
04/02/15 - 20150091037 - A light emitting device includes a semiconductor structure layer including a first conductive semiconductor layer, an active layer on the first conductive semiconductor layer, and a second conductive semiconductor layer on the active layer. A plurality of lower refractive layers is provided on an outer surface of the semiconductor structure...

Light emitting diode
04/02/15 - 20150091038 - A light emitting diode including a lower semiconductor layer formed on a substrate; an upper semiconductor layer disposed above the lower semiconductor layer, exposing an edge region of the lower semiconductor layer; a first electrode formed on the upper semiconductor layer; an insulation layer interposed between the first electrode and...

Semiconductor light emitting element
04/02/15 - 20150091039 - A semiconductor light emitting element includes a semiconductor stack part that includes a light emitting layer, a diffractive face to which light emitted from the light emitting layer is incident, and convex portions or concave portions formed in a period which is longer than an optical wavelength of the light...

Semiconductor light-emitting device
04/02/15 - 20150091040 - A semiconductor light-emitting device includes a lead frame, a semiconductor light-emitting element mounted on the top surface of the bonding region, and a case covering part of the lead frame. The bottom surface of the bonding region is exposed to the outside of the case. The lead frame includes a...