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Active Solid-state Devices (e.g., Transistors, Solid-state Diodes) > Incoherent Light Emitter Structure > With Reflector, Opaque Mask, Or Optical Element (e.g., Lens, Optical Fiber, Index Of Refraction Matching Layer, Luminescent Material Layer, Filter) Integral With Device Or Device Enclosure Or Package

With Reflector, Opaque Mask, Or Optical Element (e.g., Lens, Optical Fiber, Index Of Refraction Matching Layer, Luminescent Material Layer, Filter) Integral With Device Or Device Enclosure Or Package

With Reflector, Opaque Mask, Or Optical Element (e.g., Lens, Optical Fiber, Index Of Refraction Matching Layer, Luminescent Material Layer, Filter) Integral With Device Or Device Enclosure Or Package patent applications listed include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.

07/24/14 - 20140203311 - Photon extraction from nitride ultraviolet light-emitting devices
In various embodiments, a rigid lens is attached to a light-emitting semiconductor die via a layer of encapsulant having a thickness insufficient to prevent propagation of thermal expansion mismatch-induced strain between the rigid lens and the semiconductor die....

07/24/14 - 20140203312 - Mixed light led structure
Disclosed is a mixed light LED structure which is a solid-state phosphor plate manufactured by mixing phosphor and resin, and the solid-state phosphor plate is installed in a carrier and covered onto the top of a light emitting chip, and a specific ratio relation between the area of the solid-state...

07/24/14 - 20140203313 - Semiconductor light emitting device
According to one embodiment, a semiconductor light emitting device includes: a mounting substrate; a semiconductor light emitting element; a first resin; and a second resin. The semiconductor light emitting element includes: a semiconductor layer including a light emitting layer; a p-side electrode; a p-side interconnection unit; an n-side electrode; and...

07/24/14 - 20140203314 - Semiconductor light emitting device
According to one embodiment, a semiconductor light emitting device includes: a semiconductor layer; a p-side electrode; an n-side electrode; and a fluorescent body layer. The p-side electrode is provided on a second surface side of the semiconductor layer. The n-side electrode is provided on the second surface side of the...

07/24/14 - 20140203315 - Led lens and led package using the same
A light emitting diode (LED) lens comprises a light incident surface on a bottom surface of the LED lens facing a light source. A light exit surface, having a size greater than the bottom surface, is defined by a top surface of the LED lens. A planar portion, emitting light...

07/24/14 - 20140203316 - Yellow phosphor layer containing colored beads for adjusting its perceived off-state color
LED dies, emitting blue light, are provided on a first support substrate to form a light emitting layer. A mixture of a transparent binder, yellow phosphor powder, magenta-colored glass beads, and cyan-colored glass beads is printed over the light emitting surface. The mixture forms a wavelength conversion layer when cured....

07/24/14 - 20140203317 - Semiconductor light emitting device and light emitting apparatus
There is provided a semiconductor light emitting device including a substrate having light transmission properties and including a first surface and a second surface opposed to the first surface, a light emitting structure including a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer...

07/24/14 - 20140203318 - Light emitting element and light emitting element package
A light emitting element includes: a sapphire substrate having a front surface and a rear surface opposite the front surface; a first conductive type semiconductor layer stacked on the front surface of the sapphire substrate; a light emitting layer stacked on the first conductive type semiconductor layer; a second conductive...

07/24/14 - 20140203319 - Article including a light emitting gadolinium-containing material and a process of forming the same
An article, such as a light emitting device, can include a first material and a second material, wherein the first material is capable of emitting first radiation having a first emission maximum at a first wavelength, and the second material is capable of emitting second radiation in response to capturing...

07/24/14 - 20140203320 - Composite high reflectivity layer
A high efficiency light emitting diode with a composite high reflectivity layer integral to said LED to improve emission efficiency. One embodiment of a light emitting diode (LED) chip comprises an LED and a composite high reflectivity layer integral to the LED to reflect light emitted from the active region....

07/24/14 - 20140203321 - Light emitting diode package having heat dissipating slugs
A light emitting diode package having heat dissipating slugs is provided. The light emitting diode package comprises first and second heat dissipating slugs formed of a conductive material and spaced apart from each other; a package main body coupled to the first and second heat dissipating slugs to support the...

07/17/14 - 20140197434 - Light emitting diode device and method for manufacturing heat dissipation substrate
The light emitting diode (LED) device includes a substrate formed with at least one electrode; an LED chip disposed on the substrate, and formed with at least one solder pad; at least one wire electrically connected between the solder pad and the electrode; and a fluorescent material layer covering the...

07/17/14 - 20140197435 - Optoelectronic semiconductor chip
An optoelectronic semiconductor chip includes a semiconductor body of semiconductor material, a p-contact layer and an n-contact layer. The semiconductor body includes an active layer intended for generating radiation. The semiconductor body includes a p-side and an n-side, between which the active layer is arranged. The p-contact layer is intended...

07/17/14 - 20140197436 - Light emitting device and light emitting device package
According to example embodiments, a light emitting device package includes a package body including nanofibers and light-reflective particles dispersed in a resin, first and second electrodes in the package body, and a light emitting device on the package body. The emitting device is electrically connected to the first and second...

07/17/14 - 20140197437 - Fluorescent material and illumination device
wherein M1 is selected from Sc3+, Y3+, La3+, Sm3+, Gd3+, Tb3+, Pm3+, Er3+, Lu3+, and combinations thereof; M2 is selected from Al3+, In3+, Ga3+, and combinations thereof; M3 is selected from Tm3+, Bi3+, Tb+, Ce3+, Eu3+, Mn3+, Er3+, Yb3+, Ho3+, Gd3+, Pr3+, Dy3+, Nd3+, and combinations thereof; and 0.45≦x/n≦0.75, 0.54≦y/n≦0.6,...

07/17/14 - 20140197438 - Light emitting device and lighting apparatus having the same
A light emitting device include a first lead frame including a first bonding region and a second lead frame including a second bonding region. A gap is provided between the first and second lead frames. A first body is coupled to the first and second lead frames and includes an...

07/17/14 - 20140197439 - Led module
There is provided a manufacturing method of an LED module including: forming an insulating film on a substrate; forming a first ground pad and a second ground pad separated from each other on the insulating film; forming a first division film that fills a space between the first and second...

07/17/14 - 20140197440 - Illumination device
A semiconductor light emitting element includes a transparent substrate and a plurality of light emitting diode (LED) structures. The transparent substrate has a support surface and a second main surface disposed opposite to each other. At least some of the LED structures are disposed on the support surface and form...

07/17/14 - 20140197441 - Semiconductor light emitting element and illumination device comprising the same
A semiconductor light emitting element includes a transparent substrate and a plurality of light emitting diode (LED) chips. The transparent substrate has a support surface and a second main surface disposed opposite to each other. At least some of the LED structures are disposed on the support surface and form...

07/17/14 - 20140197442 - Optical device package and method of manufacturing the same
Provided are an optical device package and a method of manufacturing the same. The method of manufacturing the optical device package according to an exemplary embodiment of the present invention comprises: forming an adhesive layer showing predetermined reflectance or more on an insulating layer; forming a metal layer on the...

07/17/14 - 20140197443 - Led device having improved luminous efficacy
There are provided a light emitting diode (LED) device including an LED chip emitting light within a specific wavelength region, a transparent resin layer covering a light emission surface of the LED chip, and a color conversion layer formed to be spaced apart from the LED chip by the transparent...

07/10/14 - 20140191262 - Material with tunable index of refraction
Devices are described including a component comprising an alloy of AlN and AlSb. The component has an index of refraction substantially the same as that of a semiconductor in the optoelectronic device, and has high transparency at wavelengths of light used in the optoelectronic device. The component is in contact...

07/10/14 - 20140191263 - Compositions for an led reflector and articles thereof
Disclosed herein is a resin composition for molding a reflector for a light-emitting semiconductor diode comprising about 25 to about 80 wt. % of an heat-resistant aromatic polyester, about 5 to 50 wt. % of titanium dioxide filler; and about 5 to 50 wt. % of a glass fibers having...

07/10/14 - 20140191264 - Semiconductor light-emitting device
There is provided a semiconductor light-emitting device including a substrate having a first refractive index, a nitride semiconductor layer formed on the substrate and having a second refractive index that is different from the first refractive index, a light-emitting structure formed on the nitride semiconductor layer and including a first...

07/10/14 - 20140191265 - Light emitting devices with improved light extraction efficiency
Light emitting devices with improved light extraction efficiency are provided. The light emitting devices have a stack of layers including semiconductor layers comprising an active region. The stack is bonded to a transparent optical element....

07/10/14 - 20140191266 - Light emitting device and method of manufacturing the light emitting device
In one example embodiment, a light emitting device includes a transparent substrate and a transparent electrode on the transparent substrate, the transparent electrode comprising at least two transparent electrode layers, the at least two transparent electrode layers being successively stacked and having different refractive indices, the refractive index of one...

07/10/14 - 20140191267 - Light emitting device
A light emitting device according to the embodiment includes a light emitting structure including a first conductive semiconductor layer, an active layer disposed under the first conductive semiconductor layer, and a second conductive semiconductor layer disposed under the active layer. A first electrode is disposed under the light emitting structure...

07/10/14 - 20140191268 - Light emitting element and light emitting element package
A light emitting element includes: a substrate; a first conductive type semiconductor layer stacked on the substrate; a light emitting layer stacked on the first conductive type semiconductor layer; a second conductive type semiconductor layer stacked on the light emitting layer; an ITO layer stacked on the second conductive type...

07/10/14 - 20140191269 - Semiconductor light emitting device
According to one embodiment, a semiconductor light emitting device includes a stacked structure body, a first electrode, a second electrode, and a dielectric body part. The stacked structure body includes a first semiconductor layer, having a first portion and a second portion juxtaposed with the first portion, a light emitting...

07/10/14 - 20140191270 - Light emitting device and light emitting device package
A light emitting device includes a light emitting layer, a substrate that is transparent to an emission wavelength of the light emitting layer and positioned to receive an emission wavelength from the light emitting layer, a convex pattern including a collection of a plurality of convex portions discretely arranged on...

07/10/14 - 20140191271 - Light emitting module
In a light emitting module, a red phosphor is contained in a second phosphor layer so that the wavelength of a second phosphor layer after the wavelength conversion is longer than that of a first phosphor layer. And a blue phosphor and a yellow-green phosphor are contained in the first...

07/10/14 - 20140191272 - Optoelectronic component and method for producing an optoelectronic component
An optoelectronic component includes a substrate, on which a semiconductor chip and a wettable attractor element are arranged. A medium including pigments at least regionally covers the exposed region of the substrate that is not covered by the semiconductor chip and the attractor element. The medium at least partly wets...

07/10/14 - 20140191273 - Light-emitting arrangement
A light emitting arrangement is provided, comprising:—a light source capable of emitting light of a first wavelength range;—a primary wavelength converting domain arranged to receive light emitted by said light source and capable of converting at least part of the light of said first wavelength range into light of a...

07/03/14 - 20140183581 - Light-emitting device and manufacturing method thereof
A light-emitting device comprises a substrate; a first semiconductor layer formed on the substrate; a light-emitting layer on the first semiconductor layer; and a second semiconductor layer having a rough surface formed on the light-emitting layer, wherein the rough surface comprises a plurality of cavities randomly distributed on the rough...

07/03/14 - 20140183582 - Light emitting diode package and display apparatus including the same
A light emitting diode package includes a light emitting diode, an insulating layer, a plurality of light emitting particles, and a plurality of metal particles. The light emitting diode is configured to emit first light of a first wavelength in a visible light range. The insulating layer is disposed on...

07/03/14 - 20140183583 - Wavelength converting material and application thereof
This disclosure discloses a wavelength converting material. The wavelength converting material comprises a plurality of wavelength converting particles, the wavelength converting particles having an average particle size greater than 5 μm, and wherein each of the wavelength converting particles has a particle size. 90% of the wavelength converting particles have...

07/03/14 - 20140183584 - Led lamp incorporating remote phosphor and diffuser with heat dissipation features
LED lamps or bulbs are disclosed that comprise a light source, a heat sink structure and a remote phosphor carrier having at least one conversion material. The phosphor carrier can be remote to the light sources and mounted to the heat sink. The phosphor carrier can have a three-dimensional shape...

07/03/14 - 20140183585 - Fabrication of optical elements and modules incorporating the same
Fabricating a wafer-scale spacer/optics structure includes replicating optical replication elements and spacer replication sections directly onto an optics wafer (or other wafer) using a single replication tool. The replicated optical elements and spacer elements can be composed of the same or different materials....

07/03/14 - 20140183586 - Light emitting element
A light emitting element includes a semiconductor laminate structure including a first semiconductor layer of a first conductivity type, a light emitting layer, and a second semiconductor layer of a second conductivity type different from the first conductivity type, a part of the second semiconductor layer and the light emitting...

07/03/14 - 20140183587 - Light emitting diode package
An LED package includes a substrate, an LED chip arranged on the substrate, and a light transmission layer arranged on a light output path of the LED chip. The substrate includes a first electrode and a second electrode separated and electrically insulated from the first electrode. The LED chip is...

07/03/14 - 20140183588 - Light-emitting diode and method of manufacturing same
Provided are a light-emitting diode which prevents degradation of reflectance and which enables high-luminosity light emission, and its manufacturing method. Such a light-emitting diode includes a substrate (1) upon which are provided, in this order, a reflecting layer (6), a transparent film (8) wherein multiple ohmic contract electrodes (7) are...

07/03/14 - 20140183589 - Method for manufacturing a semiconductor light-emitting element and semiconductor light-emitting element manufactured thereby
There are provided a method of manufacturing a semiconductor light emitting device and a semiconductor light emitting device manufactured thereby. According to an exemplary embodiment, a method of manufacturing a semiconductor light emitting device includes: forming a light emitting structure by sequentially growing a first conductivity type semiconductor layer, an...

06/26/14 - 20140175477 - Edge coupling alignment using embedded features
Methods and systems may provide an alignment scheme for components that may reduce positional deviation between the components. The method may include placing a first component on top of a substrate, wherein the first component includes a receiving alignment feature, and coupling a second component to the first component, wherein...

06/26/14 - 20140175478 - Optoelectronic semiconductor component and scattering body
An optoelectronic semiconductor component includes one or a plurality of optoelectonic semiconductor chips, and at least one scattering body including a radiation-transmissive matrix material and embedded therein scattering particles composed of a particle material and which is disposed downstream of at least one of the semiconductor chips, wherein, in the...

06/26/14 - 20140175479 - Led unit with light mixing element
An LED unit includes an LED, a light mixing element mounted on the LED and a lens covering the light mixing element. The light mixing element is transparent and includes a top face, a bottom face and a circumferential face. Light emitted from the LED with a large output angle...

06/26/14 - 20140175480 - Led die and method for manufacturing led incorporating the same
An LED die includes a substrate, a first semiconductor layer, a light emitting layer, a second semiconductor layer, a first electrode and a second electrode. A phosphor layer is formed on the second semiconductor layer. The phosphor layer has a constant thickness at a main light emitting face of the...

06/26/14 - 20140175481 - Wafer-level flip chip device packages and related methods
In accordance with certain embodiments, semiconductor dies are at least partially coated with a polymer and a conductive adhesive prior being bonded to a substrate having electrical traces thereon....

06/26/14 - 20140175482 - Light emitting diode package with light reflecting cup internally slanted
An exemplary LED package includes a base, electrodes formed on the base, an LED chip electrically connecting the electrodes, and a reflecting cup mounted on the base and surrounding the LED chip therein. The reflecting cup includes a bottom surface and an inner surface recessed up from the bottom surface...

06/26/14 - 20140175483 - Light emitting diode package
An LED package includes a first electrode, a second electrode electrically insulated from the first electrode, a reflecting cup connecting the first electrode and the second electrode, and an LED chip. The first electrode includes an elongated first main portion and a first connecting portion bending downwardly from an end...

06/26/14 - 20140175484 - Light emitting diode package
An LED package includes a first electrode, a second electrode, a reflecting cup connecting the first electrode and the second electrode, and an LED chip. The first electrode includes a first main portion and a first connecting portion extending outwardly from the first main portion. The first connecting portion has...

06/26/14 - 20140175485 - Light emitting diode with enhanced light extraction
A light-emitting diode includes a substrate, a stacked semiconductor structure on one side of the substrate, and a reflection layer on the other side of the substrate opposite to the stacked semiconductor structure. At least one contact electrode is disposed on the stacked semiconductor structure. The contact electrode includes a...

06/26/14 - 20140175486 - Narrow viewing angle plastic leaded chip carrier
The PLCC package enables a narrow viewing angle without requiring a second lens by providing the PLCC package with a reflector cup having multiple stages where the geometry or some other characteristic of one stage is different from the geometry or some other characteristic of another stage....

06/26/14 - 20140175487 - Light emitting device package
A light emitting device package is provided. The light emitting device includes: a substrate; a light emitting device disposed at one side of the substrate; and a formation layer formed on the substrate and having a slope at an edge portion of the formation layer....

06/26/14 - 20140175488 - Heat-curable silicone resin sheet having phosphor-containing layer and white pigment-containing layer, method of producing light emitting device using same and encapsulated light emitting semiconductor device produced thereby
Provided are a heat-curable silicone resin sheet capable of easily and uniformly dispersing phosphors on an LED element surface and reducing a brightness through a light-diffusing effect, a method of producing a light emitting device using the same and an encapsulated light emitting semiconductor device produced by the corresponding method....

06/26/14 - 20140175489 - Semiconductor light emitting element
A semiconductor light emitting element includes: a laminated semiconductor layer in which an n-type semiconductor layer, a light emitting layer and a p-type semiconductor layer are laminated; plural n-side electrodes that are laminated on the n-type semiconductor layer, electrically connected to the n-type semiconductor layer and arranged to surround at...

06/26/14 - 20140175490 - Silicon-germanium light-emitting element
Provided is an element structure whereby it is possible to produce a silicon-germanium light-emitting element enclosing an injected carrier within a light-emitting region. Also provided is a method of manufacturing the structure. Between the light-emitting region and an electrode there is produced a narrow passage for the carrier, specifically, a...

06/26/14 - 20140175491 - Light emitting device
The light emitting device comprising a light emitting element; and a wavelength converting member having a first face and a second face, in which light emitted from the light emitting element enters in through the first face, and a part of the second face serves as a light emitting face,...

06/26/14 - 20140175492 - Dense-luminescent-materials-coated violet leds
Techniques for fabricating and using arrays of violet-emitting LEDs coated with densely-packed-luminescent-material layers together with apparatus and method embodiments thereto are disclosed....

06/26/14 - 20140175493 - Light-emitting device
A light-emitting device includes a semiconductor light-emitting stack; a current injected portion formed on the semiconductor light-emitting stack; an extension portion having a first branch radiating from the current injected portion and a second branch extending from the first branch; an electrical contact structure between the second branch and the...

06/26/14 - 20140175494 - Silicone resin composition, encapsulating layer, reflector, and optical semiconductor device
A silicone resin composition includes a cage octasilsesquioxane; a polysiloxane containing alkenyl groups at both ends containing an alkenyl group having the number of moles smaller than the number of moles of the hydrosilyl group of the cage octasilsesquioxane; a hydrosilylation catalyst; a hydroxyl group-containing polysiloxane, organohydrogenpolysiloxane, or a polysiloxane...