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With Reflector, Opaque Mask, Or Optical Element (e.g., Lens, Optical Fiber, Index Of Refraction Matching Layer, Luminescent Material Layer, Filter) Integral With Device Or Device Enclosure Or Package

With Reflector, Opaque Mask, Or Optical Element (e.g., Lens, Optical Fiber, Index Of Refraction Matching Layer, Luminescent Material Layer, Filter) Integral With Device Or Device Enclosure Or Package patent applications listed include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.

Related Categories:

Active Solid-state Devices (e.g., Transistors, Solid-state Diodes)


Incoherent Light Emitter Structure > With Reflector, Opaque Mask, Or Optical Element (e.g., Lens, Optical Fiber, Index Of Refraction Matching Layer, Luminescent Material Layer, Filter) Integral With Device Or Device Enclosure Or Package



Light source having liquid encapsulant
01/29/15 - 20150028370 - In one embodiment, a light source comprising a substrate, a die, a liquid encapsulant, an attachment member and a resilient cover configured to hold the liquid encapsulant is disclosed. At least a portion of the resilient cover is easily stretchable so as to absorb size increment of the liquid encapsulant...

Package structure of optical module
01/29/15 - 20150028371 - A package structure of an optical module is provided and includes: a light-emitting chip and a light-admitting chip which are disposed at a light-emitting region and a light-admitting region of a substrate, respectively; two encapsulants for enclosing the light-emitting chip and the light-admitting chip, respectively, and forming hemispherical first and...

Light emitting device package and package for mounting light emitting device
01/29/15 - 20150028372 - A package for mounting a light emitting device thereon. The package includes a substrate, a light emitting device mounting part including a wiring formed on one surface of the substrate, the wiring including two areas that are arranged facing each other and being separated a predetermined interval apart from each...

Light emitting device and method of manufacturing light emitting device
01/29/15 - 20150028373 - A light emitting device includes a light emitting element configured to emit visible light; a fluorescent substance excited by light from the light emitting element and configured to emit visible light; a translucent member containing a translucent base material, which provided on the fluorescent substance or configured to contain the...

Light-emitting element and the manufacturing method of the same
01/29/15 - 20150028374 - The present application discloses a light-emitting element comprising a semiconductor light-emitting stack emitting a first light which has a first color coordinate, a first wavelength conversion material on the semiconductor light-emitting stack converting the first light to emit a second light, and a second wavelength conversion material on the first...

Light-emitting device and method for manufacturing same
01/29/15 - 20150028375 - The present invention relates to a light-emitting device that is capable of preventing an increase in forward voltage while improving optical output characteristics, and to a method for manufacturing same. The light-emitting device comprises: a first conductive semiconductor layer; an active layer which is in contact with the first conductive...

Light emitting diode structure
01/22/15 - 20150021639 - A light emitting diode structure including a substrate, a semiconductor epitaxial layer and a reflective conductive structure layer is provided. The semiconductor epitaxial layer is disposed on the substrate and exposes a portion of the substrate. The reflective conductive structure layer covers a part of the semiconductor epitaxial layer and...

Light-emitting device
01/22/15 - 20150021640 - A light-emitting device includes a lead frame, a white resist, a light-emitting element, and a wire. The white resist is provided on the lead frame to be in contact with the lead frame. The white resist has an opening to expose the lead frame. The light-emitting element is disposed on...

Light emitting device
01/22/15 - 20150021641 - A light emitting device includes a substrate member, a light emitting element, a resin member, an insulating layer and a fluorescent material layer. The light emitting element is arranged on the substrate member. The resin member surrounds sides of the light emitting element, and has a top portion located higher...

Light emitting device and method of manufacturing the same
01/22/15 - 20150021642 - A light emitting device has a substrate including a pair of connection terminals at least on a first main surface of the substrate a light emitting element connected to the connection terminals by a molten material, and a light reflecting member covering the light emitting element, at least one of...

Surface-modified-metal-oxide-particle material, composition for sealing optical semiconductor element, and optical semiconductor device
01/22/15 - 20150021643 - There is provided a surface-modified-metal-oxide-particle material including surface-modified-metal-oxide-particles obtained by performing surface modification on metal oxide particles with a surface-modifying material, in which the surface-modifying material includes a predetermined silicone compound, an average primary particle diameter of the metal oxide particles is 3 nm to nm, viscosity at 25° C....

Light emitting device package and light unit having the same
01/22/15 - 20150021644 - Disclosed is a light emitting device package. The light emitting device package includes a package body having a first cavity and a second cavity; a plurality of reflective frames comprising a first reflective frame and a second reflective frame on the first cavity and the second cavity, respectively, and each...

Light emitting package having a guiding member guiding an optical member
01/22/15 - 20150021645 - A light emitting package, includes a base; a light emitting device on the base; an electrical circuit layer electrically connected to the light emitting device; an optical member formed of a light transmissive material; and a guiding member guiding the optical member, the guiding member including an opening, a first...

Light emitting device package including a substrate having at least two recessed surfaces
01/22/15 - 20150021646 - A light emitting device package is disclosed, which includes a first via hole and a second via hole disposed lower than a light emitting part, the first via hole and the second via hole are disposed at an outer area of the light emitting part, a bottom metal includes a...

Luminous element
01/22/15 - 20150021647 - A light emitting device according to the embodiment includes a first conductive semiconductor layer; an active layer over the first conductive semiconductor layer; a second conductive semiconductor layer over the active layer; a bonding layer over the second conductive semiconductor layer; a schottky diode layer over the bonding layer; an...

Non-chip led illumination device
01/15/15 - 20150014718 - A non-chip LED illumination device includes a retaining layer having one or more chambers for engaging with light emitting diode elements each of which include an outer surface and two terminals disposed on the outer surface of the light emitting diode element. A covering layer is engaged onto the retaining...

Light-emitting diode chip
01/15/15 - 20150014719 - A light-emitting diode chip includes an illuminating body and a first phosphor layer. The first phosphor layer is disposed on the illuminating body, and the first phosphor layer includes multiple first phosphor powder groups and multiple second phosphor powder groups. The illuminating body has a first emission wavelength, the first...

Light emitting diode package structure
01/15/15 - 20150014720 - A LED package structure including a carrier and a light emitting diode (LED) chip is provided. The LED chip includes a substrate, a patterned structure, a first semiconductor layer, an active layer and a second semiconductor layer. The substrate has a first surface and a second surface opposite to the...

Light-emitting element
01/15/15 - 20150014721 - A light-emitting element includes a light-emitting stack which has an active layer, and a non-oxide insulative layer below the light-emitting stack, wherein a refractive index of the non-oxide insulative layer is less than 1.4....

Led structure, metallic frame of led structure, and carrier module
01/15/15 - 20150014722 - A metallic frame of an LED structure includes two conductive frames spaced apart from each other with a gap and a plurality of extending arms respectively and integrally extended from the conductive frames. Each conductive frame includes a top surface, a bottom surface, and a lateral surface connecting the top...

Optical tuning of light emitting semiconductor junctions
01/15/15 - 20150014723 - Light emitting semiconductor junctions are disclosed. An exemplary light emitting junction has a first electrical contact coupled to a first side of the junction. The exemplary junction also has a second electrical contact coupled to a second side of the junction. The exemplary junction also has a region of set...

Light emitting device and light emitting device package
01/15/15 - 20150014724 - A light emitting device includes a light emitting structure including a plurality of compound semiconductor layers. A current spreading layer is provided under the light emitting structure, and a plurality of wavelength conversion structures is provided in the current spreading layer. An electrode layer is provided under the current spreading...

Phosphor and light emitting device having the same
01/15/15 - 20150014725 - Disclosed are a phosphor and a light emitting device having the same. The light emitting device includes a light emitting chip, a plurality of phosphors to absorb a portion of light emitted from the light emitting chip and to emit lights having mutually different peak wavelengths, and a molding member...

Phosphor, method for producing phosphor and light emitting device
01/15/15 - 20150014726 - The present invention provides a phosphor comprising a europium-activated sialon crystal having a basic composition represented by a formula: (Sr1-x, Eux)αSiβAlγOδNω (1) (wherein x is 0<x<1, α is 0<α<4 and β, γ, δ and ω are numbers such that converted numerical values when α is 3 satisfy 9<β≦15, 1≦γ≦5, 0.5≦δ≦3...

Silicone-grafted core-shell particles, polymer matrix, and led containing same
01/15/15 - 20150014727 - A silicone-grafted core-shell particle is described wherein the silicone-grafted core-shell particle comprises a core of an inorganic particle and a shell of a grafted poly(dimethylsiloxane) polymer formed from a bi-terminated poly(dimethylsiloxane) having reactive groups at each terminal end. The silicone-grafted core-shell particles may be dispersed in a polysiloxane polymer matrix...

Phosphor-matrix composite powder for minimizing light scattering and led structure including the same
01/15/15 - 20150014728 - This invention relates to a phosphor-matrix composite powder for minimizing light scattering and to an LED structure including the same, wherein the phosphor-matrix composite powder satisfying certain relation is prepared and the LED structure including the same is manufactured, thus minimizing light scattering and reflection and maximizing package efficiency....

Resin composition for reflecting light, substrate for mounting optical semiconductor element, and optical semiconductor device
01/15/15 - 20150014729 - (In the formula (1), R represents a monovalent organic group having 2 to 10 carbon atoms, and n represents an integer of 3 to 50.)...

Light-emitting diode
01/15/15 - 20150014730 - The invention relates to a light-emitting diode comprising a body (1) which consists at least partly of a semiconductor material. The body (1) has an active layer (2), in which light can be generated, and at least one exit face (3) from which the light that is generated in the...

Light emitting device package
01/15/15 - 20150014731 - A light emitting device package includes: a package body having a first cavity; an electrode layer comprising a first electrode and a second electrode which are electrically isolated from each other; a light emitting device electrically connected to the electrode layer on the package body; a protective device disposed in...

Textured phosphor conversion layer light emitting diode
01/15/15 - 20150014732 - This invention is related to LED Light Extraction for optoelectronic applications. More particularly the invention relates to (Al, Ga, In)N combined with optimized optics and phosphor layer for highly efficient (Al, Ga, In)N based light emitting diodes applications, and its fabrication method. A further extension is the general combination of...

Led lighting apparatus and method for fabricating wavelength conversion member for use in the same
01/15/15 - 20150014733 - A light-emitting diode (LED) lighting apparatus is provided. The LED lighting apparatus includes at least one LED, and a wavelength conversion member spaced apart from the LED and configured to convert a wavelength of light emitted from the LED. The wavelength conversion member includes a light-transmitting member, and a transfer...

Light emitting device and light emitting device package
01/15/15 - 20150014734 - A light emitting device according to the embodiment includes a first electrode; a light emitting structure including a first semiconductor layer, an active layer and a second semiconductor layer on the first electrode; a second electrode on the light emitting structure; and a control switch installed on the light emitting...

Flip-chip light emitting diode package module and manufacturing method thereof
01/08/15 - 20150008462 - The instant disclosure relates to a flip-chip LED package module and a method of manufacturing thereof. The method of manufacturing flip-chip LED package module comprises the following steps. A plurality of LEDs is disposed on a carrier. A packaging process is forming a plurality of transparent lens corresponding to LEDs...

Fluoride phosphor and light emitting device using the same and method of manufacturing the fluoride phosphor
01/08/15 - 20150008463 - A fluoride phosphor activated with tetravalent Mn can absorb blue light and emit red light, and is represented by the general formula: K2[M1-aMn4+aF6] (M is at least one selected from group-IV elements of Ti, Zr, and Hf and group IVB elements of Si, Ge, Sn, and a is 0<a<0.2). The...

Light emitting device
01/08/15 - 20150008464 - A light emitting device comprising: a package having a recess; a light emitting element mounted in the recess of the package; a transmissive member provided above the light emitting element; a sealing resin that seals the recess of the package; a first fluorescent material contained in the transmissive member; and...

Reflective electrode structure, light emitting device and package
01/08/15 - 20150008465 - The present invention describes a buried reflective electrode with vias and mesh current spreader isolated by a reflective stack of dielectric layers (BREVMIRS). The BREVMIRS includes a reflective stack of dielectric layers, a conducting mesh, a transparent conducting layer and a first electrode layer with vias going through the stack...

Wavelength converted light emittting device
01/08/15 - 20150008466 - Embodiments of the invention include a semiconductor structure comprising a light emitting layer. The semiconductor structure is attached to a support such that the semiconductor structure and the support are mechanically self-supporting. A wavelength converting material extends over the sides of the semiconductor structure and the support, wherein the wavelength...

Light-emitting device and method for manufacturing the same
01/08/15 - 20150008467 - There is provided a light-emitting device comprising a light-emitting element. The light-emitting device of the present invention comprises an electrode part for the light-emitting element; a reflective layer provided on the electrode part; and the light-emitting element provided on the reflective layer such that the light-emitting element is in contact...

Light emitting devices, systems, and methods of manufacturing
01/08/15 - 20150008468 - A light emitting device includes: a substrate; an n layer; an active light emitting region having a light emitting side; a p layer; a reflector opposite the light emitting side; and a plurality of microchannels configured to optically couple the active light emitting region with the reflector....

Semiconductor light emitting device and method for manufacturing the same
01/08/15 - 20150008469 - A semiconductor light emitting device includes a light emitting unit, a first and second conductive pillar, a sealing unit, and a first and second terminal. The light emitting unit includes a first and second semiconductor layer and a light emitting layer. The light emitting layer is provided on the first...

Semiconductor light emitting device
01/08/15 - 20150008470 - According to one embodiment, a semiconductor light emitting device includes a light emitting element, a phosphor layer, and a fluorescent reflection film. The phosphor layer has a transparent medium, a phosphor dispersed in the transparent medium, and a particle dispersed in the transparent medium. The phosphor is excited by the...

Contacting an optoelectronic semiconductor component through a conversion element and corresponding optoelectronic semiconductor component
01/08/15 - 20150008471 - A method for manufacturing an optoelectronic semiconductor component, comprising: providing a semiconductor chip in a composite wafer, comprising an active side for emitting a primary radiation and a contact terminal which is arranged on the active side; depositing a coupling element on the active side; attaching a luminescence conversion element,...

Light emitting diode package
01/01/15 - 20150001562 - An LED package includes a package body having a well formed in its upper surface, where the well is configured to receive a light emitting chip. An optical lens is disposed above the package body and includes a hollow dome structure located above and encompassing the lateral extent of the...

Light emitting device and method of manufacturing the same
01/01/15 - 20150001563 - There is provided a light emitting device including a light emitting element, a covering member for covering a side surface of the light emitting element, and a light-transmissive member disposed on upper surfaces in a light emitting direction of the light emitting element and the covering member and having an...

Light emitting device
01/01/15 - 20150001564 - Provided is a light emitting device in which deterioration of the substrate member can be reduced. The light emitting device includes a base member mainly made of a resin, a plurality of wiring portions and arranged on the base member via an adhesive agent, a groove portion defined between adjacent...

Light emitting device
01/01/15 - 20150001565 - A light emitting device comprises a package having a recess; a light emitting element mounted in the recess of the package; a light transmissive member provided above the light emitting element; a sealing resin that seals the recess of the package; and a fluorescent material contained in the sealing resin....

Semiconductor light-emitting device with reflective surface region
01/01/15 - 20150001566 - A semiconductor lighting device may include a substrate populated with at least one semiconductor light source, wherein at least one reflective surface region of the substrate is covered with a light-reflecting layer, and wherein the light-reflecting layer has an aluminum carrier coated in a reflection-intensifying manner....

Solid state light and method of forming
01/01/15 - 20150001567 - Optical assemblies comprising an optical device and a composition comprising a resin-linear organosiloxane block copolymer are disclosed. In some embodiments, the organosiloxane block copolymers has a weight average molecular weight of at least 20,000 g/mole and includes 40 to 90 mole percent disiloxy units of the formula [R12SiO2/2] arranged in...

Structured substrate for leds with high light extraction
01/01/15 - 20150001568 - A device for back-scattering an incident light ray, including: a host substrate; a structured layer; a first face in contact with a front face of the host substrate; a second flat face parallel to the first face; a first material and a second material which form, in a mixed plane,...

Curable silicone composition, cured product thereof, and optical semiconductor device
01/01/15 - 20150001569 - A curable silicone composition comprises: (A) an organopolysiloxane represented by an average unit formula; (B) an organopolysiloxane having 10 or less silicon atoms, wherein 30 to 60 mole % of all silicon atom-bonded organic groups are alkenyl groups having from 2 to 6 carbons; (C) an organopolysiloxane represented by a...

Led package and method of the same
01/01/15 - 20150001570 - LED package includes a substrate with pre-formed P-type through-hole and N-type through-hole through said substrate, wherein a conductive material formed on the sidewall of said P-type through-hole and N-type through-hole; a reflective layer formed on an upper surface of said substrate; a LED die having P-type pad and N-type pad...

Semiconductor device and method for manufacturing the same
01/01/15 - 20150001571 - Provided is an optical semiconductor device includes: a light-emitting layer having a first main surface, a second main surface opposed to the first main surface, a first electrode and a second electrode which are formed on the second main surface; a fluorescent layer provided on the first main surface; a...

Light emitting device and lighting apparatus including the same
12/25/14 - 20140374785 - Disclosed herein is a light emitting device exhibiting improved current spreading. The disclosed light emitting device includes a light emitting structure including a first conductivity type semiconductor layer, a second conductivity type semiconductor layer, and an active layer disposed between the first conductivity type and second conductivity type semiconductor layers,...

Moulded lens forming a chip scale led package and method of manufacturing the same
12/25/14 - 20140374786 - A wafer-scale process is described that simultaneously encapsulates LED dies, forms lenses over the LED dies, and forms a chip scale package for said dies. An array of LED dies (16A,B) are affixed to an adhesive surface of a temporary support structure (14). The support structure is then brought against...

Encapsulating sheet, producing method of optical semiconductor device, optical semiconductor device, and lighting device
12/25/14 - 20140374787 - An encapsulating sheet, encapsulating an optical semiconductor element, includes a first layer which contains a phosphor and a second layer which contains a phosphor, is laminated on the first layer, and encapsulates the optical semiconductor element. The ratio of the volume of the phosphor in the first layer to that...

Chip on board light emitting diode device having dissipation unit array
12/18/14 - 20140367716 - A chip on board light emitting diode (LED) device comprises a LED device, a printed circuit board (PCB) and a dissipation unit array. The LED device comprises a LED substrate, a first contact pad and a second contact pad above the LED substrate and a thermal layer formed on top...

Semiconductor optical emitting device with metallized sidewalls
12/18/14 - 20140367717 - A semiconductor optical emitting device comprises an at least partially transparent substrate, an active semiconductor structure, a dielectric layer and a metal layer. The substrate comprises a first surface, a second surface and at least one sidewall. The active semiconductor structure comprises a first surface, a second surface and at...

Light-emitting device and method of manufacturing the same
12/18/14 - 20140367718 - Disclosed are a light-emitting device and a manufacturing method thereof. A light-emitting device according to a preferred embodiment of the disclosure comprises: a frame portion having a bottom and a sidewall; a light-emitting portion which is disposed on the frame portion and emits light; and a window portion disposed over...

Phosphors for use with leds and other optoelectronic devices
12/18/14 - 20140367719 - Phosphors fabricated from one or more layers of a naturally lamellar or fabricated lamellar semiconductor that is combined with a substrate. One or more of the layers of the lamellar semiconductor are separated from bulk material. The one or more layers are transformed into a phosphor for use with one...

Semiconductor light emitting device and method of manufacturing the same
12/18/14 - 20140367720 - A semiconductor light emitting device and method of manufacturing the semiconductor light emitting device are provided. The semiconductor light emitting device includes a light emitting structure including a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer. The device may also includes a first...

Light-emitting device containing flattened anisotropic colloidal semiconductor nanocrystals and processes for manufacturing such devices
12/18/14 - 20140367721 - A device that emits light in response to an electrical or optical excitation, such as LEDs, displays, e-readers, device includes at least one anisotropic flat colloidal semiconductor nanocrystal whose smallest dimension, namely the thickness, is smaller than the other two by a factor of at least 1.5, the emitted light...

Light emitting diode and method for manufacturing same
12/18/14 - 20140367722 - Disclosed are a light-emitting diode and a method for manufacturing the same. A light-emitting diode according to one aspect of the present invention includes: a first conductive clad layer; a light-scattering pattern configured, in the first conductive clad layer, having a refractive index different from that of the first conductive...

Curable silicone composition, cured product thereof, and optical semiconductor device
12/18/14 - 20140367723 - A curable silicone composition comprises: (A) an organopolysiloxane represented by an average unit formula; (B) an organopolysiloxane having 10 or less silicon atoms, wherein 30 to 60 mole % of all silicon atom-bonded organic groups are alkenyl groups having from 2 to 6 carbons; (C) an organopolysiloxane represented by a...

Light emitting device package and lighting system including the same
12/18/14 - 20140367724 - Provided are a light emitting device package and a lighting system including the light emitting device package. The light emitting device package includes a package body, at least one electrode on the package body, a light emitting device on the package body, a reflective structure around the light emitting device...

Composite film and semiconductor light emitting device using the same
12/18/14 - 20140367725 - The present invention relates to a composite film including a wavelength conversion layer and a diffusive reflection resin layer in a laminated state and being used in a semiconductor light emitting device, in which the wavelength conversion layer contains a phosphor material which absorbs a part or all of excitation...

Semiconductor light-emitting device and fabricating method thereof
12/18/14 - 20140367726 - A semiconductor light-emitting device including an epitaxial structure, a first electrode structure, a second electrode structure, a light reflective metal layer, a resistivity-enhancing structure and a protection ring is provided. The light-emitting epitaxial structure has a first surface and a second surface. The light-emitting epitaxial structure has a first zone...

Light-emitting device having dielectric reflector and method of manufacturing the same
12/18/14 - 20140367727 - A light-emitting device includes a first conductive semiconductor layer formed on a substrate, a mask layer formed on the first conductive semiconductor layer and having a plurality of holes, a plurality of vertical light-emitting structures vertically grown on the first conductive semiconductor layer through the plurality of holes, a current...

Light emitting device and manufacturing method thereof
12/18/14 - 20140367728 - A light emitting device including a substrate including an entire top surface that is flat, a light emitting diode on the substrate, a lead frame disposed on the flat top surface of the substrate, the lead frame electrically connected to the light emitting diode, a dam member disposed on the...

Encapsulating layer-covered semiconductor element, producing method thereof, and semiconductor device
12/18/14 - 20140367729 - A method for producing an encapsulating layer-covered semiconductor element includes the steps of preparing a support sheet including a hard support board formed with a through hole passing through in a thickness direction and a pressure-sensitive adhesive layer laminated on a surface at one side in the thickness direction of...

Light emitting diode package structure
12/11/14 - 20140361323 - A LED package structure includes a base portion, a light-emitting chip, a cup portion and an encapsulating glue. The base portion has an upper surface and a lower surface. The upper surface has a die-bonding area. The light-emitting chip emits a light with a first wavelength and is located on...

Semiconductor light emitting device
12/11/14 - 20140361324 - A light emitting device includes a light emitting element disposed on a portion of a first lead frame element, a first resin including a fluorescent material, and a second resin. The first resin is above the light emitting element. The second resin is between the first resin and the first...

Package structure and method for manufacturing the same
12/11/14 - 20140361325 - A package structure and methods for forming the package structure are provided. The package structure includes a lead frame having a chip bonding area and a shell surrounding a portion of the lead frame. The shell has an inner surface and an outer surface opposite to the inner surface. A...

Light emitting device and light emitting device package
12/11/14 - 20140361326 - A light emitting device includes a light emitting structure provided over a first substrate and including at least a first conductive semiconductor layer; an active layer and a second conductive semiconductor layer. A first electrode is provided over the first conductive semiconductor layer; and a second electrode is provided over...

Light emitting diode and method of manufacturing the same
12/11/14 - 20140361327 - The present invention relates to a light emitting diode and a method of manufacturing same. The light emitting diode includes: a first conductive semiconductor layer; a plurality of mesas that are disposed spaced apart from one another on the first conductive semiconductor layer, each mesa including an active layer and...

Uv photoexcited red light-emitting material and light emitting apparatus
12/11/14 - 20140361328 - A UV photoexcited red light-emitting material comprising a fluoride single crystal represented by the chemical formula: M1−xRExF2+x−w, wherein M is at least one metal element belonging to Group 2 of the Periodic Table selected from the group consisting of Be, Mg, Ca, Sr, and Ba, RE is a rare earth...

Producing light emitting devices at variable flux levels
12/11/14 - 20140361329 - Conventional techniques are used to control the flux of an LED element, by modifying a surface of a light emitting element. One type of modification is roughening the surface, to enhance the light extraction efficiency. The degree of modification of the surface is controlled by controlling one or more of...

Semiconductor light emitting element
12/11/14 - 20140361330 - A semiconductor light emitting element that outputs emitted light having a predetermined emitted light peak wavelength λ includes: at least a substrate; a lower distributed Bragg reflector layer provided on the substrate; and a light emitting layer provided on the lower distributed Bragg reflector layer. At least one phase changing...

Light-emitting apparatus, surface light source, and method for manufacturing package for light-emitting apparatus
12/11/14 - 20140361331 - A light-emitting apparatus of the present invention has (i) a semiconductor device which emits light toward a higher position than a substrate and (ii) a plurality of external connection terminals, and includes: a light-reflecting layer, provided on the substrate, which reflects the light emitted by the semiconductor device; and a...

Light-emitting device
12/11/14 - 20140361332 - Disclosed is a light-emitting device (1) including a light-emitting element (2) emitting primary light, and a light converter (3) absorbing a part of the primary light emitted from the light-emitting element (2) and emitting secondary light having a longer wavelength than the primary light. The light converter (3) contains a...