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With Reflector, Opaque Mask, Or Optical Element (e.g., Lens, Optical Fiber, Index Of Refraction Matching Layer, Luminescent Material Layer, Filter) Integral With Device Or Device Enclosure Or Package

With Reflector, Opaque Mask, Or Optical Element (e.g., Lens, Optical Fiber, Index Of Refraction Matching Layer, Luminescent Material Layer, Filter) Integral With Device Or Device Enclosure Or Package patent applications listed include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.

Related Categories:

Active Solid-state Devices (e.g., Transistors, Solid-state Diodes)


Incoherent Light Emitter Structure > With Reflector, Opaque Mask, Or Optical Element (e.g., Lens, Optical Fiber, Index Of Refraction Matching Layer, Luminescent Material Layer, Filter) Integral With Device Or Device Enclosure Or Package



Light emitting diode package and method for manufacturing same
02/26/15 - 20150054009 - An LED packaging includes a substrate having a top surface and a bottom surface opposite to the top surface, a recess defined in the top surface, an LED mounted on the top surface of the substrate, a zener diode received in the recess, and a reflecting layer formed in the...

Phosphor and light-emitting device
02/26/15 - 20150054010 - A high-brightness phosphor having high-temperature characteristics and long-term reliability, and a white light-emitting device using this phosphor are provided. The phosphor contains a silicate phosphor (A) having a peak wavelength of at least 525 nm but not higher than 535 nm and fluorescence intensity of at least 250% but not...

Light emitting device
02/26/15 - 20150054011 - According to one embodiment, a light emitting device includes a base, a light emitting element, a resin layer, a fluorescent material layer, and a lens layer. The base has an under surface, a top surface, and a side surface. The light emitting element is provided on the top surface of...

Led die and method of manufacturing the same
02/26/15 - 20150054012 - An LED die includes a substrate, a first buffer layer, a second buffer layer, a plurality of nanospheres, a first semiconductor layer, an active layer and a second semiconductor layer. The first buffer layer, the second buffer layer, the first semiconductor layer, the active layer and the second semiconductor layer...

Light emitting device module
02/26/15 - 20150054013 - A light emitting device module including a first and second lead frames, a light emitting device electrically connected to the first and second lead frames, the light emitting device includes a light emitting structure having a first conduction type semiconductor layer, an active layer, and a second conduction type semiconductor...

Solid-state light-emitting element, light-emitting device, and lighting device
02/26/15 - 20150054014 - A solid-state light-emitting element includes a structure body having a property of transmitting visible light and an uneven structure on each of the top side and the bottom side thereof; a high refractive index material layer provided on one surface of the structure body; and a light-emitting body with a...

Light emitting device and light emitting device package having the same
02/26/15 - 20150054015 - Disclosed are a light emitting device. The light emitting device includes a light emitting structure including a first conductive semiconductor layer, a second conductive semiconductor layer, and an active layer, an electrode connected to the first conductive semiconductor layer. First to third conductive layers are disposed under the second conductive...

Light emitting structure and manufacturing method thereof
02/26/15 - 20150054016 - A light-emitting structure comprises a semiconductor light-emitting element which includes a first connection point and a second connection point. The light-emitting structure further includes a first electrode electrically connected to the first connection point, and a second electrode electrically connected the second connection point. The first electrode and the second...

Transparent electron blocking hole transporting layer
02/19/15 - 20150048397 - A light emitting diode includes an active region configured to emit light, a composite electrical contact layer, and a transparent electron blocking hole transport layer (TEBHTL). The composite electrical contact layer includes two materials. At least one of the two materials is a metal configured to reflect a portion of...

Light-emitting device and manufacturing method thereof
02/19/15 - 20150048398 - To provide a light-emitting device that is provided with an optical member firmly bonded to a semiconductor light-emitting element and has a high light extraction efficiency, the light-emitting device includes a light-emitting element having a semiconductor layer and an optical member bonded to the light-emitting surface of the light-emitting element...

Coated narrow band red-emitting fluorosilicates for smeconductro leds
02/19/15 - 20150048399 - The invention provides a lighting unit comprising a light source, configured to generate light source light and a particulate luminescent material, configured to convert at least part of the light source light into luminescent material light, wherein the light source comprises a light emitting diode (LED), wherein the particulate luminescent...

Method of producing an optoelectronic semiconductor chip
02/19/15 - 20150048400 - A method of producing an optoelectronic semiconductor chip includes growing an optoelectronic semiconductor layer sequence on a growth substrate, forming an electrically insulating layer on a side of the optoelectronic semiconductor layer sequence facing away from the growth substrate by depositing particles of an electrically insulating material by an aerosol...

Ceramic composite for light conversion and light-emitting device using same
02/19/15 - 20150048401 - A ceramic composite for light conversion, which can make the fluorescence dominant wavelength longer up to 580 nm, further arbitrarily adjust the wavelength in the range of 570 to 580 nm, and undergoes no decrease in fluorescence intensity even when the fluorescence dominant wavelength is made longer, with luminescence unevenness...

Light-emitting device
02/19/15 - 20150048402 - A light-emitting device in accordance with the present invention includes a mounting substrate; an LED chip bonded to a surface of the mounting substrate with a bond; and an encapsulating portion covering the LED chip. The bond transmits light from the LED chip. The mounting substrate includes: a light-transmissive member...

Methods for making optical components, optical components, and products including same
02/19/15 - 20150048403 - Methods for making multiple hermetically sealed optical components are disclosed. Methods for making an individual hermetically sealed optical component are disclosed. An individual hermetically sealed optical component and products including same are also disclosed....

Semiconductor light emitting device
02/19/15 - 20150048404 - According to one embodiment, a semiconductor light emitting device includes a first semiconductor layer, a second semiconductor layer, a light emitting layer, a bonding pad, a narrow wire electrode and a first insulating layer. The light emitting layer is provided between the first semiconductor layer and the second semiconductor layer...

Light emitting device, light emitting device package, and lighting system
02/19/15 - 20150048405 - Provided are a light emitting device, a light emitting device package, and a lighting system. The light emitting device includes a substrate, a light emitting structure layer, a second electrode, a first electrode, a contact portion, and a first electrode layer. The first electrode is disposed in the substrate from...

Phosphor and light-emitting device
02/19/15 - 20150048406 - A phosphor has the general formula (M2x,M3y,M4z)mM1O3X(x/n), wherein M1 represents at least one element including at least Si and selected from the group consisting of Si, Ge, Ti, Zr, and Sn, M2 represents at least one element including at least Ca and selected from the group consisting of Ca, Mg,...

Optoelectronic chip-on-board module
02/19/15 - 20150048407 - A method is proposed for coating an optoelectronic chip-on-board module including a flat substrate populated with one or more optoelectronic components having at least one primary optical arrangement and optionally at least one secondary optical arrangement. The optoelectronic chip-on-board module is coated with a transparent, UV-resistant, and temperature-resistant coating made...

Lens element for distributing light with a uniform intensity distribution and lighting device comprised thereof
02/12/15 - 20150041837 - Embodiments of a lens element have a body that incorporates geometry that defines features for surfaces that receive and transmit light, e.g., from a light emitting diode (LED) device. These features include, for example, curves, bends, arcs, and like curvilinear objects and/or shapes. These embodiments employs these features to change...

Lens and led unit using the same
02/12/15 - 20150041838 - A lens includes a bottom face, a light incident face defined in the bottom face, two opposite first lateral faces, two opposite second lateral faces and a light emerging face. The two first lateral faces are located adjacent to the light incident face, and the two second lateral faces are...

Electron beam curable resin composition, resin frame for reflectors, reflector, semiconductor light emitting device, and method for producing molded body
02/12/15 - 20150041839 - Provided are an electron beam curable resin composition including polymethylpentene, and a crosslinking agent, in which the crosslinking agent has a saturated or unsaturated ring structure, at least one atom among atoms forming at least one ring is bonded to any allylic substituent of an allyl group, a methallyl group,...

Optoelectronic semiconductor component, and method for the manufacture of an optoelectronic semiconductor component
02/12/15 - 20150041840 - In at least one embodiment, the semiconductor component includes a semiconductor layer sequence with an active layer for generating an electromagnetic radiation. The semiconductor component includes a radiation-permeable element and a connecting element. The connecting element is layered in form and connects the radiation-permeable element and the semiconductor layer sequence...

Phosphor in inorganic binder for led applications
02/12/15 - 20150041841 - A method for fabricating an LED/phosphor structure is described where an array of blue light emitting diode (LED) dies are mounted on a submount wafer. A phosphor powder is mixed with an organic polymer binder, such as an acrylate or nitrocellulose. The liquid or paste mixture is then deposited over...

Inorganic layer light-emitting device
02/12/15 - 20150041842 - There is provided an inorganic layer light-emitting device including: a light-emitting layer including an emission body made of an inorganic material; and a metal-based particle assembly layer being a layer consisting of a particle assembly including 30 or more metal-based particles separated from each other and disposed in two-dimensions, said...

Deep-red light-emitting magnesium fluoro-germanate fluoroescent body and method for producing same
02/12/15 - 20150041843 - The deep red light-emitting magnesium fluorogermanate phosphor prepared by calcining a mixture comprising a fine magnesium oxide powder having a BET specific surface area in the range of 5-200 m2/g, a fluorine compound, a germanium compound and a manganese compound gives a light emission having a maximum peak of increased...

Light emitting device
02/12/15 - 20150041844 - A light emitting device has a lens, extended to outside of the mounting substrate on which a semiconductor a light emitting element is mounted, and leakage of light is reduced. A light emitting element, a substrate having the light emitting element mounted on its upper surface, and a lens, having...

Light emitting device and method for producing same
02/05/15 - 20150034983 - There is provided a light emitting device highly resistant to the environment, and having good heat resistance, light resistance and gas barrier property, and a method for producing same. With the light emitting device, a substrate 2 and interconnect patterns 5A, 5B formed on the surface thereof are covered with...

Method and apparatus for molding encapsulant of light emitting device
02/05/15 - 20150034984 - Disclosed is an apparatus for forming an encapsulation material for a light emitting device. The apparatus for forming an encapsulation material comprises: an upper mold on which is mounted a substrate having a plurality of optical semiconductors; a lower mold arranged opposite the upper mold; a resin-capture space for capturing...

Semiconductor light emitting device and method for manufacturing same
02/05/15 - 20150034985 - According to one embodiment, the optical layer has a larger planar size than the semiconductor layer. The optical layer is transmissive to emission light of the light emitting layer. The first insulating film is provided on a side surface of the semiconductor layer continued from the first surface. The metal...

Led package
02/05/15 - 20150034986 - An LED package includes a chip carrier, an adhesive layer, one high-voltage LED die, and an encapsulating member. The chip carrier defines a receiving space. The adhesive layer is disposed in the receiving space and has a thermal conductivity of larger than or equal to 1 W/mK. The high-voltage LED...

Light emitting device and method for manufacturing light emitting device
02/05/15 - 20150034987 - A semiconductor device includes a substrate; a light emitting element flip-chip mounted on the substrate; a phosphor-containing member provided at least above the light emitting element and separated from the light emitting element; and a first reflecting member configured to cover the phosphor-containing member, at least one of a side...

Light emitting device and light emitting device package
02/05/15 - 20150034988 - Disclosed are a light emitting device and a light emitting device package. The light emitting device includes a first electrode, a light emitting structure including a first semiconductor layer, an active layer, and a second semiconductor layer on the first electrode, a nano-tube layer including a plurality of carbon nano...

Anisotropic conductive adhesive and method for manufacturing same, light-emitting device and method for manufacturing same
02/05/15 - 20150034989 - an anisotropic conductive adhesive which uses conductive particles where a silver-based metal is used as a conductive layer, having high light reflectance and excellent migration resistance is provided. The anisotropic conductive adhesive includes light reflective conductive particles in an insulating adhesive resin. The light reflective conductive particle includes a light...

Controlling led emission pattern using optically active materials
02/05/15 - 20150034990 - A light emission device comprising a light emitting element, a wavelength conversion (e.g. phosphor) element, and a filter that reduces Color over Angle (CoA) effects by at least partially reflecting light from the light emitting element that strike the filter at near-normal angles of incidence. In some embodiments, a combined...

Light emitting device, light emitting device package
02/05/15 - 20150034991 - Provided are a light emitting device, a light emitting device package, and a lighting system. The light emitting device includes a light emitting structure including a first conductive type semiconductor layer, a second conductive type semiconductor layer, and an active layer between the first conductive type semiconductor layer and the...

Light emitting device
02/05/15 - 20150034992 - A light emitting device includes a substrate, metallization, a light emitting element, conducting wire, light reflective resin, and insulating material. The metallization is provided on a surface of the substrate that is made of insulating substance. The light emitting element is mounted on the substrate. The conducting wire electrically connects...

Semiconductor light-emitting device
02/05/15 - 20150034993 - A semiconductor light-emitting device includes a substrate, an LED chip mounted on the substrate, and a resin package covering the LED chip. The substrate includes a base and a wiring pattern formed on the base. The resin package includes a lens. The base includes an upper surface, a lower surface...

Light-emiting device, light-emiting device package, method of manufacturing light-emiting device, and method of packaging light-emiting device
02/05/15 - 20150034994 - A light-emitting device including a phosphor layer, a light-emitting device package employing the light-emitting device, a method of manufacturing the light-emitting device, and a method of packaging the light-emitting device. The light-emitting device includes: a light-transmissive substrate having a top surface, a bottom surface, and side surfaces; a light-emitting unit...

Light source having liquid encapsulant
01/29/15 - 20150028370 - In one embodiment, a light source comprising a substrate, a die, a liquid encapsulant, an attachment member and a resilient cover configured to hold the liquid encapsulant is disclosed. At least a portion of the resilient cover is easily stretchable so as to absorb size increment of the liquid encapsulant...

Package structure of optical module
01/29/15 - 20150028371 - A package structure of an optical module is provided and includes: a light-emitting chip and a light-admitting chip which are disposed at a light-emitting region and a light-admitting region of a substrate, respectively; two encapsulants for enclosing the light-emitting chip and the light-admitting chip, respectively, and forming hemispherical first and...

Light emitting device package and package for mounting light emitting device
01/29/15 - 20150028372 - A package for mounting a light emitting device thereon. The package includes a substrate, a light emitting device mounting part including a wiring formed on one surface of the substrate, the wiring including two areas that are arranged facing each other and being separated a predetermined interval apart from each...

Light emitting device and method of manufacturing light emitting device
01/29/15 - 20150028373 - A light emitting device includes a light emitting element configured to emit visible light; a fluorescent substance excited by light from the light emitting element and configured to emit visible light; a translucent member containing a translucent base material, which provided on the fluorescent substance or configured to contain the...

Light-emitting element and the manufacturing method of the same
01/29/15 - 20150028374 - The present application discloses a light-emitting element comprising a semiconductor light-emitting stack emitting a first light which has a first color coordinate, a first wavelength conversion material on the semiconductor light-emitting stack converting the first light to emit a second light, and a second wavelength conversion material on the first...

Light-emitting device and method for manufacturing same
01/29/15 - 20150028375 - The present invention relates to a light-emitting device that is capable of preventing an increase in forward voltage while improving optical output characteristics, and to a method for manufacturing same. The light-emitting device comprises: a first conductive semiconductor layer; an active layer which is in contact with the first conductive...

Light emitting diode structure
01/22/15 - 20150021639 - A light emitting diode structure including a substrate, a semiconductor epitaxial layer and a reflective conductive structure layer is provided. The semiconductor epitaxial layer is disposed on the substrate and exposes a portion of the substrate. The reflective conductive structure layer covers a part of the semiconductor epitaxial layer and...

Light-emitting device
01/22/15 - 20150021640 - A light-emitting device includes a lead frame, a white resist, a light-emitting element, and a wire. The white resist is provided on the lead frame to be in contact with the lead frame. The white resist has an opening to expose the lead frame. The light-emitting element is disposed on...

Light emitting device
01/22/15 - 20150021641 - A light emitting device includes a substrate member, a light emitting element, a resin member, an insulating layer and a fluorescent material layer. The light emitting element is arranged on the substrate member. The resin member surrounds sides of the light emitting element, and has a top portion located higher...

Light emitting device and method of manufacturing the same
01/22/15 - 20150021642 - A light emitting device has a substrate including a pair of connection terminals at least on a first main surface of the substrate a light emitting element connected to the connection terminals by a molten material, and a light reflecting member covering the light emitting element, at least one of...

Surface-modified-metal-oxide-particle material, composition for sealing optical semiconductor element, and optical semiconductor device
01/22/15 - 20150021643 - There is provided a surface-modified-metal-oxide-particle material including surface-modified-metal-oxide-particles obtained by performing surface modification on metal oxide particles with a surface-modifying material, in which the surface-modifying material includes a predetermined silicone compound, an average primary particle diameter of the metal oxide particles is 3 nm to nm, viscosity at 25° C....

Light emitting device package and light unit having the same
01/22/15 - 20150021644 - Disclosed is a light emitting device package. The light emitting device package includes a package body having a first cavity and a second cavity; a plurality of reflective frames comprising a first reflective frame and a second reflective frame on the first cavity and the second cavity, respectively, and each...

Light emitting package having a guiding member guiding an optical member
01/22/15 - 20150021645 - A light emitting package, includes a base; a light emitting device on the base; an electrical circuit layer electrically connected to the light emitting device; an optical member formed of a light transmissive material; and a guiding member guiding the optical member, the guiding member including an opening, a first...

Light emitting device package including a substrate having at least two recessed surfaces
01/22/15 - 20150021646 - A light emitting device package is disclosed, which includes a first via hole and a second via hole disposed lower than a light emitting part, the first via hole and the second via hole are disposed at an outer area of the light emitting part, a bottom metal includes a...

Luminous element
01/22/15 - 20150021647 - A light emitting device according to the embodiment includes a first conductive semiconductor layer; an active layer over the first conductive semiconductor layer; a second conductive semiconductor layer over the active layer; a bonding layer over the second conductive semiconductor layer; a schottky diode layer over the bonding layer; an...

Non-chip led illumination device
01/15/15 - 20150014718 - A non-chip LED illumination device includes a retaining layer having one or more chambers for engaging with light emitting diode elements each of which include an outer surface and two terminals disposed on the outer surface of the light emitting diode element. A covering layer is engaged onto the retaining...

Light-emitting diode chip
01/15/15 - 20150014719 - A light-emitting diode chip includes an illuminating body and a first phosphor layer. The first phosphor layer is disposed on the illuminating body, and the first phosphor layer includes multiple first phosphor powder groups and multiple second phosphor powder groups. The illuminating body has a first emission wavelength, the first...

Light emitting diode package structure
01/15/15 - 20150014720 - A LED package structure including a carrier and a light emitting diode (LED) chip is provided. The LED chip includes a substrate, a patterned structure, a first semiconductor layer, an active layer and a second semiconductor layer. The substrate has a first surface and a second surface opposite to the...

Light-emitting element
01/15/15 - 20150014721 - A light-emitting element includes a light-emitting stack which has an active layer, and a non-oxide insulative layer below the light-emitting stack, wherein a refractive index of the non-oxide insulative layer is less than 1.4....

Led structure, metallic frame of led structure, and carrier module
01/15/15 - 20150014722 - A metallic frame of an LED structure includes two conductive frames spaced apart from each other with a gap and a plurality of extending arms respectively and integrally extended from the conductive frames. Each conductive frame includes a top surface, a bottom surface, and a lateral surface connecting the top...

Optical tuning of light emitting semiconductor junctions
01/15/15 - 20150014723 - Light emitting semiconductor junctions are disclosed. An exemplary light emitting junction has a first electrical contact coupled to a first side of the junction. The exemplary junction also has a second electrical contact coupled to a second side of the junction. The exemplary junction also has a region of set...

Light emitting device and light emitting device package
01/15/15 - 20150014724 - A light emitting device includes a light emitting structure including a plurality of compound semiconductor layers. A current spreading layer is provided under the light emitting structure, and a plurality of wavelength conversion structures is provided in the current spreading layer. An electrode layer is provided under the current spreading...

Phosphor and light emitting device having the same
01/15/15 - 20150014725 - Disclosed are a phosphor and a light emitting device having the same. The light emitting device includes a light emitting chip, a plurality of phosphors to absorb a portion of light emitted from the light emitting chip and to emit lights having mutually different peak wavelengths, and a molding member...

Phosphor, method for producing phosphor and light emitting device
01/15/15 - 20150014726 - The present invention provides a phosphor comprising a europium-activated sialon crystal having a basic composition represented by a formula: (Sr1-x, Eux)αSiβAlγOδNω (1) (wherein x is 0<x<1, α is 0<α<4 and β, γ, δ and ω are numbers such that converted numerical values when α is 3 satisfy 9<β≦15, 1≦γ≦5, 0.5≦δ≦3...

Silicone-grafted core-shell particles, polymer matrix, and led containing same
01/15/15 - 20150014727 - A silicone-grafted core-shell particle is described wherein the silicone-grafted core-shell particle comprises a core of an inorganic particle and a shell of a grafted poly(dimethylsiloxane) polymer formed from a bi-terminated poly(dimethylsiloxane) having reactive groups at each terminal end. The silicone-grafted core-shell particles may be dispersed in a polysiloxane polymer matrix...

Phosphor-matrix composite powder for minimizing light scattering and led structure including the same
01/15/15 - 20150014728 - This invention relates to a phosphor-matrix composite powder for minimizing light scattering and to an LED structure including the same, wherein the phosphor-matrix composite powder satisfying certain relation is prepared and the LED structure including the same is manufactured, thus minimizing light scattering and reflection and maximizing package efficiency....

Resin composition for reflecting light, substrate for mounting optical semiconductor element, and optical semiconductor device
01/15/15 - 20150014729 - (In the formula (1), R represents a monovalent organic group having 2 to 10 carbon atoms, and n represents an integer of 3 to 50.)...

Light-emitting diode
01/15/15 - 20150014730 - The invention relates to a light-emitting diode comprising a body (1) which consists at least partly of a semiconductor material. The body (1) has an active layer (2), in which light can be generated, and at least one exit face (3) from which the light that is generated in the...

Light emitting device package
01/15/15 - 20150014731 - A light emitting device package includes: a package body having a first cavity; an electrode layer comprising a first electrode and a second electrode which are electrically isolated from each other; a light emitting device electrically connected to the electrode layer on the package body; a protective device disposed in...

Textured phosphor conversion layer light emitting diode
01/15/15 - 20150014732 - This invention is related to LED Light Extraction for optoelectronic applications. More particularly the invention relates to (Al, Ga, In)N combined with optimized optics and phosphor layer for highly efficient (Al, Ga, In)N based light emitting diodes applications, and its fabrication method. A further extension is the general combination of...

Led lighting apparatus and method for fabricating wavelength conversion member for use in the same
01/15/15 - 20150014733 - A light-emitting diode (LED) lighting apparatus is provided. The LED lighting apparatus includes at least one LED, and a wavelength conversion member spaced apart from the LED and configured to convert a wavelength of light emitted from the LED. The wavelength conversion member includes a light-transmitting member, and a transfer...

Light emitting device and light emitting device package
01/15/15 - 20150014734 - A light emitting device according to the embodiment includes a first electrode; a light emitting structure including a first semiconductor layer, an active layer and a second semiconductor layer on the first electrode; a second electrode on the light emitting structure; and a control switch installed on the light emitting...