FREE patent keyword monitoring and additional FREE benefits. http://images1.freshpatents.com/images/triangleright (1K) REGISTER now for FREE triangleleft (1K)
FreshPatents.com Logo    FreshPatents.com icons
Monitor Keywords Patent Organizer File a Provisional Patent Browse Inventors Browse Industry Browse Agents


Active Solid-state Devices (e.g., Transistors, Solid-state Diodes) > Incoherent Light Emitter Structure > With Reflector, Opaque Mask, Or Optical Element (e.g., Lens, Optical Fiber, Index Of Refraction Matching Layer, Luminescent Material Layer, Filter) Integral With Device Or Device Enclosure Or Package

With Reflector, Opaque Mask, Or Optical Element (e.g., Lens, Optical Fiber, Index Of Refraction Matching Layer, Luminescent Material Layer, Filter) Integral With Device Or Device Enclosure Or Package

With Reflector, Opaque Mask, Or Optical Element (e.g., Lens, Optical Fiber, Index Of Refraction Matching Layer, Luminescent Material Layer, Filter) Integral With Device Or Device Enclosure Or Package patent applications listed include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.

11/20/14 - 20140339582 - Resin sheet laminate, method for manufacturing the same and method for manufacturing led chip with phosphor-containing resin sheet
In order to improve the color and luminance uniformity of an LED chip with a phosphor-containing resin sheet obtained by adhering the phosphor-containing resin sheet to the LED chip, improve the ease of production, and improve the degree of freedom in design, etc., provided is a resin sheet laminate provided...

11/20/14 - 20140339583 - Phosphor
According to one embodiment, the phosphor exhibits a luminescence peak in a wavelength ranging from 500 to 600 nm when excited with light having an emission peak in a wavelength ranging from 250 to 500 nm. The phosphor has a composition represented by (M1-xCex)2yAlzSi10-zOuNw (M represents Sr and a part...

11/20/14 - 20140339584 - Phosphor and light emitting device package including the same
Embodiments provide a phosphor including a silicate-based first phosphor emitting light having a yellow wavelength, a nitride-based second phosphor emitting light having a green wavelength, and a nitride-based third phosphor emitting light having a red wavelength. A full width at half maximum of the spectrum of mixed light emitted from...

11/20/14 - 20140339585 - Encapsulating composition and light emitting device
An encapsulating composition for a light emitting device includes a transparent resin, a plurality of light scattering particles distributed throughout the transparent resin and having an average particle size ranging from 190 nm to 450 nm, and a plurality of phosphor particles distributed throughout the transparent resin. A light emitting...

11/20/14 - 20140339586 - Branched polycarbonate compositions having conversion material chemistry and articles thereof
Disclosed herein is a light emitting device, comprising: a lighting element located in a housing, wherein the housing is formed from a plastic composition comprising: a conversion material, and a polycarbonate composition comprising: a flame retardant comprising a sulfonate salt and three polycarbonates. The first polycarbonate has a branching level...

11/20/14 - 20140339587 - Semiconductor light emitting element and method of manufacturing the same
A semiconductor light emitting element having: a semiconductor laminated body; a full surface electrode containing an Ag provided on an upper surface of the p-type semiconductor layer; a cover electrode that covers a surface of the full surface electrode, is provided to contact on the upper surface of the p-type...

11/20/14 - 20140339588 - Light-emitting device and lighting system
Disclosed is a light-emitting device including a support member, a reflective layer on the support member, a light-transmitting electrode layer on the reflective layer, a light-emitting structure on the light-transmitting electrode layer, the light-emitting structure being provided with a first conductive semiconductor layer, an active layer and a second conductive...

11/20/14 - 20140339589 - Method for producing a polychromatizing layer and substrate and also light-emitting diode having a polychromatizing layer
The invention relates to a method for applying a polychromatizing layer which contains at least one luminescent means on a semiconductor substrate, which layer is suitable for producing a monochromatic light. The polychromatizing layer is applied with a printing process, especially with a micro-contact printing process. Preferably the polychromatizing layer...

11/20/14 - 20140339590 - Light emitting apparatus
A light emitting device including a contact layer, a blocking layer over the contact layer, a protection layer adjacent the blocking layer, a light emitter over the blocking layer, and an electrode layer coupled to the light emitter. The electrode layer overlaps the blocking layer and protection layer, and the...

11/20/14 - 20140339591 - Optoelectronic semiconductor chip and method of production thereof
An optoelectronic semiconductor chip includes a semiconductor layer stack including a nitride compound semiconductor material on a carrier substrate, wherein the semiconductor layer stack includes an active layer that emits an electromagnetic radiation, the semiconductor layer stack being arranged between a layer of a first conductivity and a layer of...

11/20/14 - 20140339592 - Light emitting diode
A light emitting diode includes a patterned carbon nanotube layer, a first semiconductor layer, a second semiconductor layer, an active layer stacked on an epitaxial growth surface of a substrate in that sequence. A first portion of the patterned carbon nanotube layer is covered by the first semiconductor layer and...

11/20/14 - 20140339593 - Light emitting diode (led) component comprising a phosphor with improved excitation properties
A light emitting diode (LED) component comprises an LED having a dominant wavelength in a range of from about 425 nm to less than 460 nm and a phosphor in optical communication with the LED. The phosphor includes a host lattice comprising yttrium aluminum garnet (YAG), and may include an...

11/13/14 - 20140332834 - Substrate for an opto-electric device
An opto-electric device has a substrate comprised of metal or plastic. The substrate in an uncoated condition has an average surface roughness Rz of 150 nm to 1500 nm. A dielectric coating coats the substrate and a non-thermally curable coating is directly on the dielectric coating. An electrode is on...

11/13/14 - 20140332835 - Light emitting element, light emitting device and electronic apparatus
[In formula (1), A indicates a hydrogen atom, an alkyl group, an aryl group which may have a substituent, an arylamino group, or a triaryl amine, and B indicates a hydrogen atom, an alkyl group, an aryl group which may have a substituent, an arylamino group, or a triaryl amine,...

11/13/14 - 20140332836 - Semiconductor light emitting device
Disclosed is a semiconductor light emitting device. The semiconductor light emitting device includes a plurality of compound semiconductor layers including a first conductive semiconductor layer, an active layer and a second conductive semiconductor layer; a pad on the plurality of compound semiconductor layers; an electrode layer under the plurality of...

11/13/14 - 20140332837 - Light emitting apparatus
Provided is a light emitting apparatus. The light emitting apparatus includes a substrate; a light emitting device on the substrate; a fluorescent layer formed on the substrate and the light emitting device to surround the light emitting device; an encapsulant resin layer formed on the substrate and the fluorescent layer...

11/13/14 - 20140332838 - Light emitting devices having light coupling layers with recessed electrodes
A light emitting device comprises a first layer of an n-type semiconductor material, a second layer of a p-type semiconductor material, and an active layer between the first layer and the second layer. A light coupling structure is disposed adjacent to one of the first layer and the second layer....

11/06/14 - 20140327023 - Phosphor assembly for light emitting devices
A method for fabricating a light emitting device is disclosed. The light emitting device includes a light emitting diode (LED). The method includes disposing a layered phosphor composite or a thick phosphor composite radiationally coupled to the LED to form a light emitting device. The layered phosphor composite includes a...

11/06/14 - 20140327024 - Semiconductor device and fabrication method for same
A semiconductor device includes an electrical insulating layer with superior heat resistance, heat dissipation, and durability, and which is manufactured through a process with good cost performance and process performance. In a semiconductor device including a first substrate to which a semiconductor chip is mounted directly or indirectly, and a...

11/06/14 - 20140327025 - Light emitting diode package structure
A light-emitting diode package structure including a chip carrier portion, a light-emitting diode chip, and a package material is provided. The light-emitting diode chip is disposed on the chip carrier portion of the package. The package material is filled in the chip carrier portion and covers the light-emitting diode chip....

11/06/14 - 20140327026 - Color stable red-emitting phosphors
y is 5, 6 or 7....

11/06/14 - 20140327027 - Semiconductor light emitting element and semiconductor light emitting device
A semiconductor light emitting element, includes: a laminated structure body including an n-type semiconductor layer, a p-type semiconductor layer, and a light emitting layer; a p-side electrode provided in contact with the p-type semiconductor layer; an n-side electrode provided in contact with the n-type semiconductor layer; a highly reflective insulating...

11/06/14 - 20140327028 - Light-emitting diode, method for manufacturing light-emitting diode, light-emitting diode lamp and illumination device
A light-emitting diode, a method of manufacturing the same, a lamp and an illumination device. A light-emitting diode (100) is provided with a compound semiconductor layer (10) including a light-emitting layer (24) provided on a substrate (1); an ohmic contact electrode (7) provided between the substrate and compound semiconductor layer;...

11/06/14 - 20140327029 - Semiconductor light emitting device with thick metal layers
A device according to embodiments of the invention includes a semiconductor structure including a light emitting layer sandwiched between an n-type region and a p-type region and first and second metal contacts, wherein the first metal contact is in direct contact with the n-type region and the second metal contact...

11/06/14 - 20140327030 - Controlled led light output by selective area roughening
The surface of a light emitting device is roughened to enhance the light extraction efficiency of the surface, but the amount of roughened area is selected to achieve a desired level of light extraction efficiency. Photo-lithographic techniques may be used to create a mask that limits the roughening to select...

10/30/14 - 20140319560 - Light-emitting dies incorporating wavelength-conversion materials and related methods
In accordance with certain embodiments, semiconductor dies are embedded within polymeric binder to form, e.g., freestanding white light-emitting dies and/or composite wafers containing multiple light-emitting dies embedded in a single volume of binder....

10/30/14 - 20140319561 - Semiconductor light emitting device with light transmissive roughened structure and method of manufacturing the same
A semiconductor light emitting device includes a semiconductor light emitting chip and a transparent conductive layer formed on the semiconductor light emitting chip. The semiconductor light emitting chip includes a substrate, and a first semiconductor layer, an active layer and a second semiconductor layer successively formed on the substrate. The...

10/30/14 - 20140319562 - Light-emitting diode package structure
An LED package structure of the invention includes a light-emitting device and a transparent molding compound. The light-emitting device has an upper surface. The transparent molding compound is disposed on the light-emitting device and covers the upper surface, in which the transparent molding compound has a top surface and a...

10/30/14 - 20140319563 - Laterally aligned colloidal nanorods assemblies
Nanorods assemblies that have lengths in excess of 50 microns to meters are formed from contacting rice-shaped colloidal superparticles that are aligned along the long axis of the colloidal superparticles. The rice-shaped colloidal superparticles are formed from a multiplicity of nanorods with a high degree of association that is end...

10/30/14 - 20140319564 - Light emitting diode package and method for manucfacturing same
A light emitting diode package for mounting to a printed circuit board by surface mounting technology includes a substrate, first and second electrodes and a light emitting diode. The first electrode and the second electrode each have a first end and a second end. The second end of the first...

10/30/14 - 20140319565 - Light emitting diode package
A light emitting diode (LED) package includes a substrate, a pin structure and a reflector formed on the substrate, an LED chip arranged on the pin structure and a first encapsulation layer mixed with phosphor filled in the reflector. The LED chip includes a top surface, a side surface extending...

10/30/14 - 20140319566 - Light emitting diode chip
A light emitting diode chip includes a semiconductor layer sequence having an active layer that generates electromagnetic radiation, wherein the light emitting diode chip has a radiation exit area at a front side, the light emitting diode chip has a mirror layer at least in regions at a rear side...

10/30/14 - 20140319567 - Light emitting device
A provided light includes a semiconductor chip including a p-type semiconductor layer and an n-type semiconductor layer, the semiconductor chip being adapted to emit light between the p-type semiconductor layer and the n-type semiconductor layer; a p-side pad electrode disposed on an upper surface side of the semiconductor chip and...

10/30/14 - 20140319568 - Phosphor, light-emitting apparatus including the same, and phosphor production method
A phosphor is provided which is represented by the general formula MxCeyPrzSi6N8+w. M is at least one element selected from the group consisting of La, Y, Tb and Lu. And x, y, z and w satisfy 2.0<x<3.5, 0<y<1.0, 0<z<0.05, and 2.0<w<4.0, respectively....

10/30/14 - 20140319569 - Optical semiconductor element mounting package, and optical semiconductor device using the same
An optical semiconductor element mounting package that has good adhesion between the resin molding and the lead electrodes and has excellent reliability is provided, as well as an optical semiconductor device using the package is also provided. The optical semiconductor element mounting package having a recessed part that serves as...

10/30/14 - 20140319570 - Light-emitting device
A light-emitting device includes a substrate that includes at least a pair of electrodes, an LED element electrically mounted on the substrate, a phosphor plate adhered to an upper surface of the LED element and including an upper surface and a lower surface each having an area larger than that...

10/30/14 - 20140319571 - Semiconductor light-emitting element
In a surface emission-type semiconductor light-emitting element including a DBR layer, a variation in light intensity due to a temperature change in the formation of a large number of elements manufactured from one wafer is suppressed while maintaining a light intensity enhancement effect. In the semiconductor light-emitting element that outputs...

10/30/14 - 20140319572 - Ceramic conversion element, optoelectronic component comprising a ceramic conversion element, and methods for producing a ceramic conversion element
A ceramic conversion element includes a multiplicity of first regions and a multiplicity of second regions, wherein the first regions vitreous, ceramic or monocrystalline fashion, at least either the first regions or the second regions are columnar and have a preferred direction forming an angle of at most 45° with...

10/23/14 - 20140312371 - Hybrid reflector cup
A package for a light source and methods of manufacturing the same are disclosed. In particular, a light source package is disclosed with an outer component and an interchangeable inner component. The inner component can be modular and replaceable with other inner components having different properties, thereby enabling a flexible...

10/23/14 - 20140312372 - Semiconductor optical emitting device with grooved substrate providing multiple angled light emission paths
A semiconductor optical emitting device comprises an at least partially transparent substrate and an active semiconductor structure arranged on a first side of the substrate. A first portion of light generated by the active semiconductor structure is emitted through the substrate from the first side of the substrate to a...

10/23/14 - 20140312373 - Light emitting diodes having group iii nitride surface features defined by a mask and crystal planes
An LED includes a mesa having a Group III Nitride mesa face and a mesa sidewall, on an underlying LED structure. The mesa face includes Group III Nitride surface features having tops that are defined by mask features, having bottoms, and having sides that extend along crystal planes of the...

10/23/14 - 20140312374 - Method for forming projections and depressions, sealing structure, and light-emitting device
A novel method for forming projections and depressions is provided. A novel sealing structure is provided. A novel light-emitting device is provided. A first step of forming a film containing at least two kinds of metals having different etching rates over a surface; a second step of heating the film...

10/23/14 - 20140312375 - Method for producing an optoelectronic assembly and optoelectronic assembly
A method for producing an optoelectronic assembly (12) is provided, in which an optoelectronic component (16) is arranged on a carrier (14). Electrical terminals of the optoelectronic component (16) are electrically coupled to electrical contacts of the carrier (14) corresponding thereto. A dummy body (20) is arranged on a first...

10/23/14 - 20140312376 - Semiconductor light emitting devices including red phosphors that exhibit good color rendering properties and related red phosphors
A light emitting device includes a light emitting diode (“LED”) that emits light having a dominant wavelength in the blue color range, and a recipient luminophoric medium that is configured to down-convert at least some of the light emitted by the LED. The recipient luminophoric medium includes a green phosphor...

10/23/14 - 20140312377 - Optoelectronic apparatuses with post-molded reflector cups
An optoelectronic apparatus includes one or more packaged optoelectronic semiconductor devices (POSDs), each including one or more optoelectronic elements encapsulated by a light transmissive molding compound. Each POSD includes a top surface formed by a top surface of the light transmissive molding compound that encapsulates the one or more optoelectronic...

10/16/14 - 20140306251 - Patterned light emitting element substrate
Disclosed is a patterned light-emission element substrate including a surface consisted of a plurality of cones, and the surface of each cone is roughened by a wet etch roughening treatment to produce a rough surface....

10/16/14 - 20140306252 - Optical device and method for manufacturing the same
The present invention provides an optical device, and the optical device comprises a luminous element and a gradient-index nanoparticle layer and scattering particles composed by particles stack with different refractive indexes and particle sizes. The luminous element has a light emitting surface. The refractive indexes of the nanoparticle layers decrease...

10/16/14 - 20140306253 - Light emitting device
This disclosure relates to a light-emitting apparatus comprising a submount, a chip carrier formed on the submount, a light-emitting chip formed on the chip carrier, a reflecting cup formed on the submount and enclosing the light-emitting chip and the chip carrier, and a transparent encapsulating material for encapsulating the light-emitting...

10/16/14 - 20140306254 - Light emitting device and manufacturing method for same
Disclosed are a light emitting device and a method of manufacturing the same. The light emitting device includes a support substrate, a reflective ohmic contact layer on the support substrate, a functional complex layer including a process assisting region and ohmic contact regions divided by the process assisting region on...

10/16/14 - 20140306255 - Light emitting diode
A light emitting diode includes a substrate, graphene layer, a first semiconductor layer, an active layer, a second semiconductor layer, a first electrode and a second electrode. The first semiconductor layer is on the epitaxial growth surface of the substrate. The active layer is between the first semiconductor layer and...

10/16/14 - 20140306256 - Light emitting diode
A light emitting diode includes a graphene layer, a first semiconductor layer, an active layer, a second semiconductor layer, a first electrode and a second electrode. The first semiconductor layer, the active layer, and the second semiconductor layer are stacked with each other in sequence. The first electrode is located...

10/16/14 - 20140306257 - Led package and method for fabricating the same
A light emitting diode (LED) package according to an exemplary embodiment of the present invention includes a base including a first lead terminal and a second lead terminal, an LED chip disposed on the base, a housing disposed on the base, the housing having a cavity in which the LED...

10/16/14 - 20140306258 - Ceramic conversion element, optoelectronic semiconductor component comprising a ceramic conversion element, and method for producing a ceramic conversion element
A ceramic conversion element having a multiplicity of columnar regions arranged within a ceramic or vitreous matrix, wherein the columnar regions have a preferential direction which makes an angle of at most 45° with a normal to the main surface of the conversion element, at least either the columnar regions...