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With Reflector, Opaque Mask, Or Optical Element (e.g., Lens, Optical Fiber, Index Of Refraction Matching Layer, Luminescent Material Layer, Filter) Integral With Device Or Device Enclosure Or Package

With Reflector, Opaque Mask, Or Optical Element (e.g., Lens, Optical Fiber, Index Of Refraction Matching Layer, Luminescent Material Layer, Filter) Integral With Device Or Device Enclosure Or Package patent applications listed include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.

Related Categories:

Active Solid-state Devices (e.g., Transistors, Solid-state Diodes)


Incoherent Light Emitter Structure > With Reflector, Opaque Mask, Or Optical Element (e.g., Lens, Optical Fiber, Index Of Refraction Matching Layer, Luminescent Material Layer, Filter) Integral With Device Or Device Enclosure Or Package



Light-emitting structure
04/23/15 - 20150108519 - A light-emitting structure is provided, including a substrate, an LED stacked structure formed on the substrate, and a plurality of cavities formed on the substrate surrounding the LED stacked structure. The LED stacked structure comprises an N-type epitaxial layer, an illumination layer, and a P-type epitaxial layer. A portion of...

Semiconductor light emitting device
04/23/15 - 20150108520 - A semiconductor light emitting device includes a light emitting structure and first and second electrodes. The light emitting structure includes first and second conductivity type semiconductor layers and an active layer interposed therebetween. The first and second electrodes are electrically connected to the first and second conductivity type semiconductor layers....

Light emitting device
04/23/15 - 20150108521 - A light emitting device according to embodiments includes a light emitting element emitting light with a peak wavelength of 420˜445 nm, a first phosphor emitting light with a peak wavelength of 485˜530 nm, a second phosphor emitting light with a peak wavelength of 530˜580 nm, and a third phosphor emitting...

Led lamps
04/23/15 - 20150108522 - A high power LED lamp has a GaN chip placed over an AlGaInP chip. A reflector is placed between the two chips. Each of the chips has trenches diverting light for output. The chip pair can be arranged to produce white light having a spectral distribution in the red to...

Semiconductor light-emitting device
04/23/15 - 20150108523 - A reliable semiconductor light-emitting device can include a mounting board, at least one semiconductor light-emitting chip mounted on the mounting board, a wavelength converting layer having a side surface covering the light-emitting chip, and a seal member having an opening contacting the side surface of the wavelength converting layer and...

Semiconductor nanoparticle-based light-emitting devices and associated materials and methods
04/23/15 - 20150108524 - Embodiments of the present invention relate to a formulation for use in the fabrication of a light-emitting device, the formulation including a population of semiconductor nanoparticles incorporated into a plurality of discrete microbeads comprising an optically transparent medium, the nanoparticle-containing medium being embedded in a host light-emitting diode encapsulation medium....

Light emitting diode for surface mount technology, method of manufacturing the same, and method of manufacturing light emitting diode module
04/23/15 - 20150108525 - Provided are a light emitting diode (LED) in which a conductive barrier layer surrounding a reflective metal layer is defined by a protective insulating layer, and a method of manufacturing the same. A reflection pattern including a reflective metal layer and a conductive barrier layer is formed on an emission...

Light emitting diode
04/23/15 - 20150108526 - A light emitting diode includes a semiconductor stacked structure, a substrate, a first electrode, a second electrode and a third electrode. The semiconductor stacked structure includes a first semiconductor layer, a second semiconductor layer and a light emitting layer. An undoped semiconductor layer over the first semiconductor layer may be...

Light emitting diode
04/23/15 - 20150108527 - A light emitting diode includes a semiconductor stacked structure, a substrate, a first electrode, a second electrode and a third electrode. The semiconductor stacked structure includes a first semiconductor layer, a second semiconductor layer and a light emitting layer. A light extraction layer with a roughened structure is formed on...

Light emitting diode module for surface mount technology and method of manufacturing the same
04/23/15 - 20150108528 - Provided is a light emitting diode (LED) in which a side surface of a reflective metal layer has a predetermined angle, and occurrence of cracks in a conductive barrier layer formed on the reflective metal layer can be prevented. Also, an LED module using LEDs is disclosed. A reflection pattern...

Light emitting diode package and method of manufacture
04/23/15 - 20150108529 - A light emitting diode (LED) device and packaging for same is disclosed. In some aspects, the LED is manufactured using a vertical configuration including a plurality of layers. Certain layers act to promote mechanical, electrical, thermal, or optical characteristics of the device. The device avoids design problems, including manufacturing complexities,...

Semiconductor device for emitting frequency-adjusted infrared light
04/16/15 - 20150102372 - A semiconductor device for emitting frequency-adjusted infrared light includes a lateral emitter structure and a lateral filter structure. The lateral emitter structure is configured to emit infrared light with an emitter frequency distribution. Further, the lateral filter structure is configured to filter the infrared light emitted by the lateral emitter...

Light emitting diode package and method of manufacturing the same
04/16/15 - 20150102373 - There is provided a light emitting diode (LED) package. The LED package includes a package body. The LED package also includes an LED chip mounted on the package body. The LED package further includes a side inclined portion disposed to enclose side surfaces of the LED chip, including a light...

Optoelectronic component and method for producing it
04/16/15 - 20150102374 - An optoelectronic component is specified. According to at least one embodiment of the invention, the optoelectronic component comprises a housing (20) and a radiation-emitting or radiation-receiving semiconductor chip (10) arranged in the housing (20). Furthermore, the component comprises an optical element (50), which contains a polymer material comprising a silicone....

Light emitting device package
04/16/15 - 20150102375 - A light emitting device package is disclosed. The light emitting device package includes a package body including at least one ceramic layer, a submount disposed at the package body, a light emitting device disposed on the submount for emitting ultraviolet (UV)-wavelength light, and an anti-reflection (AR) coating layer disposed around...

Light-emitting device and electronic apparatus
04/16/15 - 20150102376 - A light-emitting device includes a light-emitting element disposed in a display region and including a first electrode, a second electrode, and a light-emitting functional layer. The light-emitting device includes a wiring formed in a periphery of the display region and that is electrically connected to the second electrode, and a...

Flip chip light emitting diode package structure
04/16/15 - 20150102377 - A flip chip light emitting diode package structure includes a package carrier, a light guiding unit and at least one light emitting unit. The light guiding unit and the light emitting unit are disposed on the package carrier, and the light emitting unit is located between the light guiding unit...

Light emitting diode package structure
04/16/15 - 20150102378 - A light-emitting diode package structure includes a package carrier, a light guiding component and a light emitting unit. The light guiding component is disposed on the package carrier. The light emitting unit is disposed on an upper surface of light guiding component relatively distant from the package carrier. A horizontal...

Light emitting diode structure
04/16/15 - 20150102379 - A light emitting diode structure includes a substrate and a light emitting unit. The substrate has a protrusion portion and a light guiding portion. The protrusion portion and the light guiding portion have a seamless connection therebetween, and a horizontal projection area of the protrusion portion is smaller than that...

Light-emitting element mounting package, manufacturing method of the same, and light-emitting element package
04/16/15 - 20150102380 - A light-emitting element mounting package including a first wiring forming a first light-emitting element mounting portion, which is provided on one surface of a substrate to mount a light-emitting element, and a first through wiring having one end and another end, the one end being electrically connected to the first...

Semiconductor light emitting device, wafer, and method for manufacturing nitride semiconductor crystal layer
04/16/15 - 20150102381 - According to one embodiment, a semiconductor light emitting device includes a first semiconductor layer, a light emitting layer, a second semiconductor layer, and a low refractive index layer. The first semiconductor layer has a first major surface and a second major surface being opposite to the first major surface. The...

Die emitting white light
04/09/15 - 20150097203 - Various methods and apparatuses are disclosed. A method may include disposing at least one die on a location on a carrier substrate, forming at least one stud bump on each of at least one die, forming a phosphor layer on the at least one stud bump and the at least...

Method of producing crystalline substrate having concave-convex structure
04/09/15 - 20150097204 - A method of producing the crystalline substrate having a concave-convex structure includes: (A) forming a transfer film by forming a concave-convex film on a support film on the surface having a concave-convex pattern thereon so that thickness of the residual film of the concave-convex film is 0.01 to 1 μm,...

Light emitting diode having magnetic structure and method of fabricating the same
04/09/15 - 20150097205 - A light emitting diode including a magnetic structure and a method of fabricating the same are disclosed. The magnetic structure composed of passivation layers and a magnetic layer is disposed inside a luminous structure composed of an active layer and a semiconductor layer. In the light emitting diode, the magnetic...

Method of manufacturing package component for light emitting diode and package structure thereof
04/09/15 - 20150097206 - A method of manufacturing package component for light emitting diode (LED) is disclosed. At least one LED is disposed on a substrate inside a photocuring resin, wherein the LED is covered completely by the substrate and the photocuring resin. Power is provided to the LED to make the LED emit...

Locating optical structures to leds
04/02/15 - 20150091031 - An optical device and a method of making an optical device are disclosed. A printed wiring board is formed that includes coupling elements at selected locations. The coupling elements are formed using a printed wiring board manufacturing technique. A light source may be coupled to the printed wiring board at...

Nickel-titanium and related alloys as silver diffusion barriers
04/02/15 - 20150091032 - Diffusion of silver from LED reflector layers is blocked by 10-50 nm barrier layers of nickel-titanium (NiTi) alloys. Optionally, the alloys also include one or more of tungsten (W), niobium (Nb), aluminum (Al), vanadium (V), tantalum (Ta), or chromium (Cr). These barriers may omit the noble-metal (e.g., platinum or gold)...

Light enhancing structure for a light emitting diode
04/02/15 - 20150091033 - A light enhancing structure includes a light emitting diode in it and at least one coating layer. The light emitting diode unit includes a plurality of surfaces and a light-emitting surface. The light-emitting surface is for allowing a plurality of lights generated inside the light emitting diode unit to emit...

Light emitting diode package
04/02/15 - 20150091034 - A light-emitting diode (LED) package structure includes a lead frame, a LED chip, a package body, N opaque spacer and N+1 encapsulating glues. The LED chip is disposed on the lead frame; the package body covers the lead frame and exposes the LED chip. The package body has an accommodation...

Semiconductor device structure
04/02/15 - 20150091035 - The present disclosure relates to a method for manufacturing a semiconductor device structure, comprising the steps of: securing the position of a semiconductor device on a plate; securing the positions of electrodes such that the electrodes face the plate; covering the semiconductor device with an encapsulating material; and separating, from...

Light emitting diode
04/02/15 - 20150091036 - Disclosed herein is a light emitting diode. The light emitting diode includes a substrate, an n-type semiconductor layer placed on the substrate, an active layer placed on the n-type semiconductor layer, a p-type semiconductor layer placed on the active layer, a reflective layer placed on the p-type semiconductor layer, an...

Light emitting device
04/02/15 - 20150091037 - A light emitting device includes a semiconductor structure layer including a first conductive semiconductor layer, an active layer on the first conductive semiconductor layer, and a second conductive semiconductor layer on the active layer. A plurality of lower refractive layers is provided on an outer surface of the semiconductor structure...

Light emitting diode
04/02/15 - 20150091038 - A light emitting diode including a lower semiconductor layer formed on a substrate; an upper semiconductor layer disposed above the lower semiconductor layer, exposing an edge region of the lower semiconductor layer; a first electrode formed on the upper semiconductor layer; an insulation layer interposed between the first electrode and...

Semiconductor light emitting element
04/02/15 - 20150091039 - A semiconductor light emitting element includes a semiconductor stack part that includes a light emitting layer, a diffractive face to which light emitted from the light emitting layer is incident, and convex portions or concave portions formed in a period which is longer than an optical wavelength of the light...

Semiconductor light-emitting device
04/02/15 - 20150091040 - A semiconductor light-emitting device includes a lead frame, a semiconductor light-emitting element mounted on the top surface of the bonding region, and a case covering part of the lead frame. The bottom surface of the bonding region is exposed to the outside of the case. The lead frame includes a...

Light-emitting module and luminaire
03/26/15 - 20150084075 - According to one embodiment, there is provided a light-emitting module including a substrate, a light-emitting body provided on the substrate, and a phosphor containing layer provided on the substrate and the light-emitting body, the phosphor containing layer including a first phosphor excited by emitted light of the light-emitting body, having...

Light emitting module and lighting device
03/26/15 - 20150084076 - According to one embodiment, a light emitting module includes: a semiconductor light emitting element and an incident suppression section. The semiconductor light emitting element includes a base material and a light emitting layer. The base material is formed of a material absorbing light and is provided on a substrate. The...

Light emitting module and lighting device
03/26/15 - 20150084077 - According to one embodiment, a light emitting module includes a semiconductor light emitting element and a heat radiating section. The semiconductor light emitting element includes a base material and a light emitting layer. The base material is formed of a material absorbing light and is provided on a substrate. The...

Light-emitting diode having diamond-like carbon layer and manufacturing method and application thereof
03/26/15 - 20150084078 - A light emitting diode having a diamond-like carbon layer is disclosed, which includes: a substrate; a semiconductor epitaxial multilayer structure deposited over the substrate and including a first semiconductor epitaxial layer and a second semiconductor epitaxial layer, wherein the first and second semiconductor epitaxial layers are stacked with each other;...

Phosphor and light-emitting device
03/26/15 - 20150084079 - A high-brightness phosphor having high-temperature characteristics and long-term reliability, and a white light-emitting device using this phosphor are provided. The phosphor contains a silicate phosphor (A) having a peak wavelength of at least 525 nm but not higher than 535 nm and fluorescence intensity of at least 250% but not...

Light emitting apparatus and method for manufacturing same
03/26/15 - 20150084080 - There is provided a light-emitting device comprising a light-emitting element and a substrate for light-emitting element. The light-emitting element is in a mounted state on a mounting surface of the substrate, the mounting surface being one of two opposed main surfaces of the substrate. The substrate is provided with a...

Method for manufacturing light-emitting device and light-emitting device manufactured using same
03/26/15 - 20150084081 - The present invention relates to a method for manufacturing a light-emitting device and the light-emitting device manufactured using same, which can reduce manufacturing costs, form nanopatterns in a large area, and increase light extraction efficiency. One embodiment of the present invention discloses the method for manufacturing a light-emitting device, comprising:...

Semiconductor light-emitting element
03/26/15 - 20150084082 - A semiconductor light-emitting element includes: an ohmic electrode layer formed on a surface of a semiconductor structure layer including a light-emitting layer; a reflective metal layer containing Ag formed so as to cover at least ends of the ohmic electrode layer; and a covering electrode layer formed so as to...

Phosphor, production method of the phosphor, and light emitting device using the phosphor
03/26/15 - 20150084083 - 1.6≦x+y≦2.0....

Light emitting diode and led module having the same
03/26/15 - 20150084084 - Disclosed are an LED and an LED module. The LED includes: a first conductivity type semiconductor layer; a mesa disposed over the first conductivity type semiconductor layer and including an active layer and a second conductivity type semiconductor layer; a first ohmic-contact structure in contact with the first conductivity type...

Light emitting device having wide beam angle and method of fabricating the same
03/26/15 - 20150084085 - A light emitting device having a wide beam angle and a method of fabricating the same. The light emitting device includes a light emitting structure, a substrate disposed on the light emitting structure, and an anti-reflection layer covering side surfaces of the light emitting structure and the substrate, and at...

Light-emitting diode device
03/26/15 - 20150084086 - An encapsulated light-emitting diode device is disclosed. The encapsulated light-emitting diode device includes a circuit carrier including a surface; a light-emitting device including a transparent substrate, the transparent substrate including a first surface and a second surface, and the first surface and the surface of the circuit carrier includes an...

Single-phase and full-color phosphor
03/19/15 - 20150076539 - A composition of matter including a phosphor having an emission peak in each of a blue, green, and red color region of the Electromagnetic spectrum, wherein the phosphor is excitable by light having a wavelength between 350 nanometers (nm) and 420 nm....

Nitride semiconductor light emitting device
03/19/15 - 20150076540 - A nitride semiconductor light emitting device includes a laminate body, a first electrode, a second electrode, and a phosphor layer having a light emitting surface. The laminate body includes a first layer of a first-conductivity-type, a first part of a second layer of a second-conductivity-type, and a light emitting layer...

Light-emitting device
03/19/15 - 20150076541 - A light-emitting device includes a first and second lead frame spaced from each other. A light-emitting element is mounted on the first lead frame and electrically connected to the first and second lead frames. A first frame body is disposed on the first lead frame and the second lead frame...

Light emitting module
03/19/15 - 20150076542 - The present disclosure provides a light emitting module, which includes a base board, a light emitting diode chip, a transparent thermoplastic layer, and fluorescent glue. The base board includes a die-bonding zone. The light emitting diode chip is bonded on the die-bonding zone. The light emitting diode chip includes an...

Light emitting device
03/19/15 - 20150076543 - According to one embodiment, a light emitting device includes a base, a light emitting element, and a fluorescent body-containing layer. The light emitting element is installed on the base, has an upper surface and a lower surface, and includes a light emitting unit on the upper surface. The fluorescent body-containing...

Radiation-emitting component, transparent material and filler particles, and method of producing same
03/19/15 - 20150076544 - A radiation-emitting component includes a radiation source; a transparent material disposed in the beam path of the component and including a polymer material and filler particles, wherein the filler particles include an inorganic filler material and a phosphonic acid derivative or phosphoric acid derivative attached to a surface thereof and...

Electronic component package and method of manufacturing same
03/19/15 - 20150076545 - There is provided a method for manufacturing an electronic component package. The method includes the steps: (i) disposing a metal pattern layer on an adhesive carrier; (ii) placing at least one kind of electronic component on the adhesive carrier, the placed electronic component being not overlapped with respect to the...

Semiconductor light emitting device
03/19/15 - 20150076546 - According to one embodiment, a semiconductor light emitting device includes a stacked body, first and second electrodes. The stacked body includes a light emitting layer. The first and second electrodes are provided on the stacked body. The device further includes an insulating layer covering the stacked body, a first conversion...

Group iii nitride semiconductor light-emitting device
03/19/15 - 20150076547 - The present invention provides a Group III nitride semiconductor light-emitting device exhibiting improved emission performance. A p-electrode comprises a wire bonding portion being connected to a wire, a wiring portion extending in a wiring pattern from the wire bonding portion, and a contact portion being connected to the wiring portion...

Method of manufacturing light emitting device including light emitting element and wavelength converting member
03/19/15 - 20150076548 - A light emitting device includes a light emitting element and a wavelength converting member bonded with each other. The light emitting element has, from the wavelength converting member side, a first region and a second region. The wavelength converting member has, from the light emitting element side, a third region...

Distributed bragg reflector for reflecting light of multiple wavelengths from an led
03/12/15 - 20150069434 - A blue LED device has a transparent substrate and a reflector structure disposed on the backside of the substrate. The reflector structure includes a Distributed Bragg Reflector (DBR) structure having layers configured to reflect yellow light as well as blue light. In one example, the DBR structure includes a first...

Led package and manufacturing process of same
03/12/15 - 20150069435 - A LED package is formed of a substrate, an LED chip, an insulated layer, and a fluorescent adhesive layer. The substrate includes a positive contact and a negative contact. The LED chip is fixed to the substrate and includes a positive terminal and a negative terminal, the former of which...

Semiconductor light emitting device and method for manufacturing same
03/12/15 - 20150069436 - A semiconductor light emitting device according to an embodiment includes a semiconductor layer, a first resin layer provided on the semiconductor layer, first fluorescer particles disposed in the first resin layer, and a second resin layer provided on the first resin layer to contact the first resin layer. Recesses are...

Semiconductor light emitting device and method for manufacturing same
03/12/15 - 20150069437 - According to one embodiment, a semiconductor light emitting device includes a semiconductor layer, a sealing member configured to cover a lower surface of the semiconductor layer and a side surface of the semiconductor layer to protrude to be higher than an upper surface of the semiconductor layer at a side...

Distributed bragg reflector on an aluminum package for an led
03/12/15 - 20150069438 - A light-emitting diode (LED) assembly includes an aluminum substrate, a silver layer, a distributed Bragg reflector (DBR) and an LED device. The aluminum substrate has a top surface whose length and width are each more than once centimeter. The silver layer is disposed over the entire top surface of the...

Phosphor in inorganic binder for led applications
03/12/15 - 20150069439 - A method for fabricating an LED/phosphor structure is described where an array of blue light emitting diode (LED) dies are mounted on a submount wafer. A phosphor powder is mixed with an organic polymer binder, such as an acrylate or nitrocellulose. The liquid or paste mixture is then deposited over...

Light emitting diode and method of manufacturing the same
03/12/15 - 20150069440 - Provided is a light emitting diode having a nanostructure capping pattern and a method of manufacturing the same. A light-emitting structure including a first semiconductor layer, a second semiconductor layer, and an active layer between the first and second semiconductor layers is provided. A nanostructure is provided on the light-emitting...

Light emitting diode package
03/12/15 - 20150069441 - A light emitting diode (LED) package includes a substrate, a first electrode and a second electrode mounted on opposite sides of the substrate, an LED chip mounted on a top surface of one of the electrodes and electrically connecting the first electrode and the second electrode by wire bonding, and...

Flexible led assemblies and led light bulbs
03/12/15 - 20150069442 - Disclosure has LED assemblies and related LED light bulbs. An LED assembly comprises a flexible, transparent substrate, an LED chip on the first surface and electrically connected to two adjacent conductive sections, and a first wavelength conversion layer, formed on the first surface to substantially cover the LED chip. The...

Light-emitting diode with local photonic crystals
03/12/15 - 20150069443 - The light-emitting diode includes first and second layers of semiconductor material, having opposite conductivity types, an active light-emitting area located between the first and second layers of semiconductor material, an electrode arranged on the first layer of semiconductor material and a photonic crystal formed in the first layer of semiconductor...

Light emitting diode
03/12/15 - 20150069444 - A light emitting diode and a method of fabricating the same, the light emitting diode including a substrate, a semiconductor layer formed on one surface of the substrate, and an anti-reflection element formed on the other surface of the substrate and including a nano-pattern. The anti-reflection element is interposed between...

Light emitting device package
03/12/15 - 20150069445 - A light emitting device package is disclosed. The light emitting device package includes a package body, a heat radiating member disposed in the package body, a light emitting device disposed on the heat radiating member, a bonding member disposed between the light emitting device and the heat radiating member, and...

Light emitting diode
03/12/15 - 20150069446 - A light emitting diode includes a substrate, a first semiconductor layer, an active layer, a second semiconductor layer, a first electrode, and a second electrode. The first semiconductor layer, the active layer, and the second semiconductor layer are orderly stacked on the substrate. The first electrode is electrically connected to...

Led component by integrating epitaxial structure and package substrate together and method of manufacturing the same
03/12/15 - 20150069447 - The present invention discloses an integral LED component which integrates LED epitaxial structure electrodes and interconnects with a package substrate together and an integral manufacturing process thereof. The integral LED component can be made with multiple epitaxial structures or with just a single epitaxial structure. The integral LED component can...

Light-reflective anisotropic conductive adhesive agent, and light emitting device
03/12/15 - 20150069448 - A light-reflective anisotropic conductive adhesive is used for anisotropic conductive connection of a light-emitting element to a wiring board. The adhesive includes a thermosetting resin, conductive particles, and light-reflective acicular insulating particles. The conductive particles comprise a core particle coated with a metal particle or a metal material, and a...

Light-emitting device and manufacturing method thereof
03/12/15 - 20150069449 - A light-emitting device which is thin and lightweight and has high flexibility, impact resistance, and reliability is provided. Further, a light-emitting device which is thin and lightweight and has high flexibility, impact resistance, and hermeticity is provided. In the light-emitting device in which a light-emitting region including a transistor and...