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Active Solid-state Devices (e.g., Transistors, Solid-state Diodes) > Incoherent Light Emitter Structure > With Reflector, Opaque Mask, Or Optical Element (e.g., Lens, Optical Fiber, Index Of Refraction Matching Layer, Luminescent Material Layer, Filter) Integral With Device Or Device Enclosure Or Package

With Reflector, Opaque Mask, Or Optical Element (e.g., Lens, Optical Fiber, Index Of Refraction Matching Layer, Luminescent Material Layer, Filter) Integral With Device Or Device Enclosure Or Package

With Reflector, Opaque Mask, Or Optical Element (e.g., Lens, Optical Fiber, Index Of Refraction Matching Layer, Luminescent Material Layer, Filter) Integral With Device Or Device Enclosure Or Package patent applications listed include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.

10/30/14 - 20140319560 - Light-emitting dies incorporating wavelength-conversion materials and related methods
In accordance with certain embodiments, semiconductor dies are embedded within polymeric binder to form, e.g., freestanding white light-emitting dies and/or composite wafers containing multiple light-emitting dies embedded in a single volume of binder....

10/30/14 - 20140319561 - Semiconductor light emitting device with light transmissive roughened structure and method of manufacturing the same
A semiconductor light emitting device includes a semiconductor light emitting chip and a transparent conductive layer formed on the semiconductor light emitting chip. The semiconductor light emitting chip includes a substrate, and a first semiconductor layer, an active layer and a second semiconductor layer successively formed on the substrate. The...

10/30/14 - 20140319562 - Light-emitting diode package structure
An LED package structure of the invention includes a light-emitting device and a transparent molding compound. The light-emitting device has an upper surface. The transparent molding compound is disposed on the light-emitting device and covers the upper surface, in which the transparent molding compound has a top surface and a...

10/30/14 - 20140319563 - Laterally aligned colloidal nanorods assemblies
Nanorods assemblies that have lengths in excess of 50 microns to meters are formed from contacting rice-shaped colloidal superparticles that are aligned along the long axis of the colloidal superparticles. The rice-shaped colloidal superparticles are formed from a multiplicity of nanorods with a high degree of association that is end...

10/30/14 - 20140319564 - Light emitting diode package and method for manucfacturing same
A light emitting diode package for mounting to a printed circuit board by surface mounting technology includes a substrate, first and second electrodes and a light emitting diode. The first electrode and the second electrode each have a first end and a second end. The second end of the first...

10/30/14 - 20140319565 - Light emitting diode package
A light emitting diode (LED) package includes a substrate, a pin structure and a reflector formed on the substrate, an LED chip arranged on the pin structure and a first encapsulation layer mixed with phosphor filled in the reflector. The LED chip includes a top surface, a side surface extending...

10/30/14 - 20140319566 - Light emitting diode chip
A light emitting diode chip includes a semiconductor layer sequence having an active layer that generates electromagnetic radiation, wherein the light emitting diode chip has a radiation exit area at a front side, the light emitting diode chip has a mirror layer at least in regions at a rear side...

10/30/14 - 20140319567 - Light emitting device
A provided light includes a semiconductor chip including a p-type semiconductor layer and an n-type semiconductor layer, the semiconductor chip being adapted to emit light between the p-type semiconductor layer and the n-type semiconductor layer; a p-side pad electrode disposed on an upper surface side of the semiconductor chip and...

10/30/14 - 20140319568 - Phosphor, light-emitting apparatus including the same, and phosphor production method
A phosphor is provided which is represented by the general formula MxCeyPrzSi6N8+w. M is at least one element selected from the group consisting of La, Y, Tb and Lu. And x, y, z and w satisfy 2.0<x<3.5, 0<y<1.0, 0<z<0.05, and 2.0<w<4.0, respectively....

10/30/14 - 20140319569 - Optical semiconductor element mounting package, and optical semiconductor device using the same
An optical semiconductor element mounting package that has good adhesion between the resin molding and the lead electrodes and has excellent reliability is provided, as well as an optical semiconductor device using the package is also provided. The optical semiconductor element mounting package having a recessed part that serves as...

10/30/14 - 20140319570 - Light-emitting device
A light-emitting device includes a substrate that includes at least a pair of electrodes, an LED element electrically mounted on the substrate, a phosphor plate adhered to an upper surface of the LED element and including an upper surface and a lower surface each having an area larger than that...

10/30/14 - 20140319571 - Semiconductor light-emitting element
In a surface emission-type semiconductor light-emitting element including a DBR layer, a variation in light intensity due to a temperature change in the formation of a large number of elements manufactured from one wafer is suppressed while maintaining a light intensity enhancement effect. In the semiconductor light-emitting element that outputs...

10/30/14 - 20140319572 - Ceramic conversion element, optoelectronic component comprising a ceramic conversion element, and methods for producing a ceramic conversion element
A ceramic conversion element includes a multiplicity of first regions and a multiplicity of second regions, wherein the first regions vitreous, ceramic or monocrystalline fashion, at least either the first regions or the second regions are columnar and have a preferred direction forming an angle of at most 45° with...

10/23/14 - 20140312371 - Hybrid reflector cup
A package for a light source and methods of manufacturing the same are disclosed. In particular, a light source package is disclosed with an outer component and an interchangeable inner component. The inner component can be modular and replaceable with other inner components having different properties, thereby enabling a flexible...

10/23/14 - 20140312372 - Semiconductor optical emitting device with grooved substrate providing multiple angled light emission paths
A semiconductor optical emitting device comprises an at least partially transparent substrate and an active semiconductor structure arranged on a first side of the substrate. A first portion of light generated by the active semiconductor structure is emitted through the substrate from the first side of the substrate to a...

10/23/14 - 20140312373 - Light emitting diodes having group iii nitride surface features defined by a mask and crystal planes
An LED includes a mesa having a Group III Nitride mesa face and a mesa sidewall, on an underlying LED structure. The mesa face includes Group III Nitride surface features having tops that are defined by mask features, having bottoms, and having sides that extend along crystal planes of the...

10/23/14 - 20140312374 - Method for forming projections and depressions, sealing structure, and light-emitting device
A novel method for forming projections and depressions is provided. A novel sealing structure is provided. A novel light-emitting device is provided. A first step of forming a film containing at least two kinds of metals having different etching rates over a surface; a second step of heating the film...

10/23/14 - 20140312375 - Method for producing an optoelectronic assembly and optoelectronic assembly
A method for producing an optoelectronic assembly (12) is provided, in which an optoelectronic component (16) is arranged on a carrier (14). Electrical terminals of the optoelectronic component (16) are electrically coupled to electrical contacts of the carrier (14) corresponding thereto. A dummy body (20) is arranged on a first...

10/23/14 - 20140312376 - Semiconductor light emitting devices including red phosphors that exhibit good color rendering properties and related red phosphors
A light emitting device includes a light emitting diode (“LED”) that emits light having a dominant wavelength in the blue color range, and a recipient luminophoric medium that is configured to down-convert at least some of the light emitted by the LED. The recipient luminophoric medium includes a green phosphor...

10/23/14 - 20140312377 - Optoelectronic apparatuses with post-molded reflector cups
An optoelectronic apparatus includes one or more packaged optoelectronic semiconductor devices (POSDs), each including one or more optoelectronic elements encapsulated by a light transmissive molding compound. Each POSD includes a top surface formed by a top surface of the light transmissive molding compound that encapsulates the one or more optoelectronic...

10/16/14 - 20140306251 - Patterned light emitting element substrate
Disclosed is a patterned light-emission element substrate including a surface consisted of a plurality of cones, and the surface of each cone is roughened by a wet etch roughening treatment to produce a rough surface....

10/16/14 - 20140306252 - Optical device and method for manufacturing the same
The present invention provides an optical device, and the optical device comprises a luminous element and a gradient-index nanoparticle layer and scattering particles composed by particles stack with different refractive indexes and particle sizes. The luminous element has a light emitting surface. The refractive indexes of the nanoparticle layers decrease...

10/16/14 - 20140306253 - Light emitting device
This disclosure relates to a light-emitting apparatus comprising a submount, a chip carrier formed on the submount, a light-emitting chip formed on the chip carrier, a reflecting cup formed on the submount and enclosing the light-emitting chip and the chip carrier, and a transparent encapsulating material for encapsulating the light-emitting...

10/16/14 - 20140306254 - Light emitting device and manufacturing method for same
Disclosed are a light emitting device and a method of manufacturing the same. The light emitting device includes a support substrate, a reflective ohmic contact layer on the support substrate, a functional complex layer including a process assisting region and ohmic contact regions divided by the process assisting region on...

10/16/14 - 20140306255 - Light emitting diode
A light emitting diode includes a substrate, graphene layer, a first semiconductor layer, an active layer, a second semiconductor layer, a first electrode and a second electrode. The first semiconductor layer is on the epitaxial growth surface of the substrate. The active layer is between the first semiconductor layer and...

10/16/14 - 20140306256 - Light emitting diode
A light emitting diode includes a graphene layer, a first semiconductor layer, an active layer, a second semiconductor layer, a first electrode and a second electrode. The first semiconductor layer, the active layer, and the second semiconductor layer are stacked with each other in sequence. The first electrode is located...

10/16/14 - 20140306257 - Led package and method for fabricating the same
A light emitting diode (LED) package according to an exemplary embodiment of the present invention includes a base including a first lead terminal and a second lead terminal, an LED chip disposed on the base, a housing disposed on the base, the housing having a cavity in which the LED...

10/16/14 - 20140306258 - Ceramic conversion element, optoelectronic semiconductor component comprising a ceramic conversion element, and method for producing a ceramic conversion element
A ceramic conversion element having a multiplicity of columnar regions arranged within a ceramic or vitreous matrix, wherein the columnar regions have a preferential direction which makes an angle of at most 45° with a normal to the main surface of the conversion element, at least either the columnar regions...

10/09/14 - 20140299902 - Articles and methods for rapid manufacturing of solid state light sources
Rapid manufacturing processes and designs based on solid luminescent elements form solid state light sources. Direct attach, as well as other LED types, are embedded or affixed to the solid luminescent elements to form low cost solid state light sources....

10/09/14 - 20140299903 - Double-chip light emitting diode
Disclosed is a double-chip LED including a leadframe, a green chip, a blue chip, a transparent colloid and a red fluorescent layer. The green chip is installed at the bottom of the leadframe; the blue chip is installed at the bottom of the leadframe and adjacent to the green chip;...

10/09/14 - 20140299904 - Light emitting device
A light emitting device according to embodiments includes a light emitting element emitting light having a peak wavelength of 425 nm or more and 465 nm or less, a first phosphor emitting light having a peak wavelength of 485 nm or more and 530 nm or less, a second phosphor...

10/09/14 - 20140299905 - Light emitting diode with improved luminous efficiency
A light-emitting diode includes a substrate, and a light-emitting structure disposed on the substrate. The light-emitting structure includes a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer. A transparent electrode layer including concave portions and convex portions is disposed on the second conductivity-type semiconductor layer....

10/09/14 - 20140299906 - Light emitting diode, manufacturing method thereof, light emitting diode module, and manufacturing method thereof
A manufacturing method of a light emitting diode (LED) and a manufacturing method of an LED module are provided. The manufacturing method of the LED may include manufacturing a plurality of LED chips, manufacturing a phosphor pre-form including a plurality of mounting areas for mounting the plurality of LED chips,...

10/09/14 - 20140299907 - Reflector for light-emitting devices
Polymer compositions are described that are well suited for producing reflectors for light-emitting devices, such as light-emitting diodes. In one embodiment, the polymer composition contains a polymer resin and a stabilizer comprising a phosphonate compound and/or a phosphate compound and optionally a white pigment. The polymer resin may comprise, for...

10/02/14 - 20140291711 - Semiconductor light emitting device and package structure thereof
A semiconductor light emitting device and a package structure thereof are provided. The semiconductor light emitting device includes a substrate, an epitaxial structure layer, a first electrode, a second electrode and a patterned film structure. The substrate has a first surface and a second surface opposite to the first surface....

10/02/14 - 20140291712 - Phosphor and light emitting device
A phosphor and a light emitting device are provided. The phosphor comprises a composition having a formula of (BaaSr1-a)2-zSi5ObNn:EuZ, 0.03<a<0.75, 0<b<1, 7<n<9, and 0.03<z<0.3....

10/02/14 - 20140291713 - Flip-chip light emitting diode package with moisture barrier layer
An exemplary light emitting diode (LED) package includes a substrate, a first electrode penetrating downward through the substrate, a second electrode penetrating downward through the substrate and spaced from the first electrode, an LED die arranged on the substrate and mounted to the first and second electrodes by flip-chip technology,...

10/02/14 - 20140291714 - Semiconductor light emitting device
The present disclosure relates to a semiconductor light emitting device, comprising: a plurality of semiconductor layers that grows sequentially on a growth substrate, with the plurality of semiconductor layers including a first semiconductor layer having a first conductivity, a second semiconductor layer having a second conductivity different from the first...

10/02/14 - 20140291715 - Compact led package with reflectivity layer
LED packages are disclosed that are compact and efficiently emit light, and can comprise encapsulants with curved and planar surfaces. The packages can comprise a submount with a one or a plurality of LEDs, and in those with a plurality of LEDs each of the LEDs can emit the same...

10/02/14 - 20140291716 - Light emitting device and method of manufacturing the same
Provided is a light emitting device with improved light extracting efficiency and further higher heat releasing performance. A light emitting device includes a planar lead frame having a first lead and a second lead, and includes a light emitting element mounted on the first lead, a resin frame surrounding a...

10/02/14 - 20140291717 - Method for manufacturing mach-zehnder modulator, method for manufacturing optical waveguide, and optical waveguide
A method for manufacturing a Mach-Zehnder modulator includes the steps of forming a stacked semiconductor layer, the stacked semiconductor layer including a first conductivity type semiconductor layer, a core layer and a second conductivity type semiconductor layer, forming a waveguide mesa, the waveguide mesa having a first portion, a second...

10/02/14 - 20140291718 - Light emitting diodes
A LED includes a red light emitting unit, a green light emitting unit, a blue light emitting unit, and an optical grating located on a same plane. The red light emitting unit, the green light emitting unit and the blue light emitting unit are located around the optical grating. Each...

10/02/14 - 20140291719 - Light emitting diode package having frame with bottom surface having two surfaces different in height
Provided is a light emitting device package. It is a substrate comprising a top and a bottom surfaces being substantially parallel to each other; a light emitting diode chip on the substrate; a frame disposed around the light emitting diode chip and configured to reflect light emitted from the light...

09/25/14 - 20140284638 - Nitride semiconductor light emitting device
A nitride semiconductor light emitting device includes a laminate, first and second electrodes, a conductive layer, and a phosphor layer. The laminate includes a first layer including a first electroconductive-type layer, a second layer including a second electroconductive-type layer, a light emitting layer between the first and second layers, and...

09/25/14 - 20140284639 - Light emitting diode package
A light emitting diode (LED) package includes a substrate, a first electrode and a second electrode embedded in the substrate and spaced from each other, an LED die mounted on a top surface of the substrate and electrically connected to the first and the second electrodes. Both the first and...

09/25/14 - 20140284640 - Light emitting diode package
A light emitting diode (LED) package includes a substrate, a first electrode, a second electrode, an LED die mounted on the substrate and electrically connected to the first and the second electrodes, and an encapsulation layer encapsulating the LED die. Both the first and the second electrodes are embedded in...

09/25/14 - 20140284641 - Led packages and manufacturing method thereof
A method of manufacturing LED packages includes the steps of: forming a conductive circuit layer on a substrate; screen printing a wall layer on the conductive circuit layer to form a trellis with a plurality of wall units, so that regions of the conductive circuit layer surrounded by the wall...

09/25/14 - 20140284642 - Light-emitting module and light-emitting device
A light-emitting module which efficiently extracts light emitted from a light-emitting element is provided. Alternatively, a light-emitting module having lower power consumption or improved reliability is provided. A light-emitting module includes a window material having a light-transmitting property, a light-emitting element that emits light transmitted from a light-transmitting layer to...

09/25/14 - 20140284643 - Power surface mount light emitting die package
A light emitting die package is provided which includes a metal substrate having a first surface and a first conductive lead on the first surface. The first conductive lead is insulated from the substrate by an insulating film. The first conductive lead forms a mounting pad for mounting a light...

09/25/14 - 20140284644 - Light-emitting device and method for manufacturing the same
The present invention is directed to reduction of angle dependence of chromaticity in a phosphor layer, without using a light scattering agent, the phosphor layer being made up of phosphor particles adhered tightly to one another via a binder according to the spray coating method. The phosphor layer contains phosphor...

09/25/14 - 20140284645 - Optoelectronic semiconductor component
An optoelectronic semiconductor component includes an optoelectronic semiconductor chip having side areas covered by a shaped body, at least one plated-through hole including an electrically conductive material, and an electrically conductive connection electrically conductively connected to the semiconductor chip and the plated-through hole, wherein, the plated-through hole is arranged in...

09/25/14 - 20140284646 - Light generating device and method of manufacturing the same
A light generating device and a method of manufacturing the light generating device are disclosed. The light generating device includes a p-type semiconductor layer, an n-type semiconductor layer, an active layer, a p-type electrode and an n-type electrode. The active layer is disposed between the p-type semiconductor layer and the...

09/25/14 - 20140284647 - Semiconductor light emitting device and method of fabricating semiconductor light emitting device
A semiconductor light emitting device has a light emitting element, a first electrode layer, a second electrode layer, a seed electrode layer and a plated layer. The light emitting element has a nitride-based III-V compound semiconductor on a substrate. The light emitting element having a light extraction surface. The first...

09/25/14 - 20140284648 - Light emitting device with molded wavelength converting layer
A flexible film comprising a wavelength converting material is positioned over a light source. The flexible film is conformed to a predetermined shape. In some embodiments, the light source is a light emitting diode mounted on a support substrate. The diode is aligned with an indentation in a mold such...

09/25/14 - 20140284649 - Optoelectronic component and phosphors
An optoelectronic component includes a layer sequence having an active region that emits primary electromagnetic radiation, wherein the primary electromagnetic radiation has a wavelength of 430 nm to 470 nm, a conversion material arranged in a beam path of the primary electromagnetic radiation and at least partly converts the primary...

09/25/14 - 20140284650 - Light-emitting diode package and method for manufacturing same
Disclosed are a light-emitting diode package and a method for manufacturing same. The method for manufacturing a light-emitting diode package comprises: preparing a package main body having a cavity and an air vent passageway which extends from the cavity; installing a light-emitting diode inside the cavity of the package main...