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Active Solid-state Devices (e.g., Transistors, Solid-state Diodes) > Incoherent Light Emitter Structure > Plural Light Emitting Devices (e.g., Matrix, 7-segment Array)

Plural Light Emitting Devices (e.g., Matrix, 7-segment Array)

Plural Light Emitting Devices (e.g., Matrix, 7-segment Array) patent applications listed include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.

08/28/14 - 20140239316 - Light emitter packages and methods
Light emitter packages and related methods having improved performance are disclosed. In one aspect, a light emitter package can include at least one light emitter chip disposed over a substrate or submount. In some aspects, the package can include a reflective polymeric material or polymeric reflector (sometimes referred to as...

08/28/14 - 20140239317 - Display device
A display device includes a substrate and a flexible circuit having one of its ends bonded to the substrate. The substrate comprises a pixel array. A driver integrated circuit (IC) is mounted on the flexible circuit. The flexible circuit is bonded to the substrate without protruding beyond an edge of...

08/28/14 - 20140239318 - Light emitting device and manufacturing method thereof
The light emitting device including: a flexible substrate having a negative lead electrode and a positive lead electrode formed on an upper surface thereof; a light emitting element having a negative electrode and a positive electrode formed on an upper surface thereof; an insulating film formed on a side surface...

08/28/14 - 20140239319 - Light emitting device
A light emitting device including a light emitting structure comprising a plurality of light emitting regions comprising a first semiconductor layer, an active layer and a second semiconductor layer, a first electrode unit disposed on the first semiconductor layer in one of the light emitting regions, a second electrode unit...

08/28/14 - 20140239320 - Light emitting apparatus and production method thereof
A light emitting apparatus comprises an electrically insulating base member; a pair of electrically conductive pattern portions formed on an upper surface of the base member; at least one light emitting device that is electrically connected to the pair of electrically conductive pattern portions; and a resin portion that surrounds...

08/21/14 - 20140231832 - Three-terminal light emitting device (led) with built-in electrostatic discharge (esd) protection device
A three-terminal light emitting device (LED) chip, associated fabrication method, and LED array are provided. The method forms an n-doped semiconductor layer overlying a substrate, an active semiconductor layer overlying the n-doped semiconductor layer, and a p-doped semiconductor layer overlying the active semiconductor layer. A trench is formed through the...

08/21/14 - 20140231833 - Light emitting device
A first light emitting structure includes a first semiconductor layer, an active layer, and a second semiconductor layer. A second light emitting structure includes a third semiconductor layer, an active layer, and a fourth semiconductor layer. A first electrode and a second electrode connect to the first semiconductor layer, and...

08/21/14 - 20140231834 - Transparent led layer between phosphor layer and light exit surface of lamp
A flexible light sheet lamp includes a thin substrate and an array of printed microscopic vertical LEDs (VLEDs) sandwiched between a transparent first conductor layer and a transparent second conductor layer. The light sheet has a light exit surface. The VLEDs have one surface, facing the light exit surface of...

08/21/14 - 20140231835 - Stacked assembly of light emitting devices
A stacked assembly of light emitting devices includes a first light emitting device, a second light emitting device and a sealing member. The first light emitting device includes a first substrate member extending in a longitudinal direction and defining a plurality of through-holes, and a plurality of first light emitting...

08/21/14 - 20140231836 - Structure and method for led with phosphor coating
The present disclosure provides a light emitting diode (LED) apparatus. The LED apparatus includes an LED emitter having a top surface; and a phosphor feature disposed on the LED emitter. The phosphor feature includes a first phosphor film disposed on the top surface of the LED emitter and having a...

08/21/14 - 20140231837 - Led module
An LED module has an electrically insulating main body, a base surface and a mounting surface located opposite the base surface. A number of electrical connection contacts are arranged at the mounting surface. The connection contacts do not adjoin the base surface. A heat sink is arranged in the main...

08/14/14 - 20140225132 - Lightweight solid state light source with common light emitting and heat dissipating surface
Lightweight solid state light sources with common light emitting and heat dissipating surfaces consisting of light emitting diodes (LED) in thermal contact to light transmitting thermally conductive elements and combined with a reflector element to form a light recycling cavity, provide both convective and radiative cooling from their light emitting...

08/14/14 - 20140225133 - Light-emitting device having transparent package and manufacturing method
The present disclosure provides a method for forming a light-emitting device and a light-emitting device formed thereby. The method comprises the steps of providing a transparent substrate, forming multiple pairs of electrode pins on the transparent substrate wherein each pair of electrode pins comprises two electrode pins, providing multiple LED...

08/14/14 - 20140225134 - Light emitting device package
A light emitting device package is provided. The light emitting device package may include a main body having a cavity including side surfaces and a bottom, and a first reflective cup and a second reflective cup provided in the bottom of the cavity of the main body and separated from...

08/14/14 - 20140225135 - Optical device array substrate having a heat dissipating structure integrated with a substrate, and method for manufacturing same
The present invention relates to an optical device array substrate having a built-in heat dissipating structure, and to a method for manufacturing same, wherein the optical device array substrate itself is used as a heat sink and a coupling hole is formed at the bottom of the substrate to have...

08/07/14 - 20140217426 - Semiconductor integrated circuit device, electronic apparatus, and display apparatus
A semiconductor integrated circuit device includes a COF substrate; a semiconductor integrated circuit mounted on the COF substrate and having a first voltage circuit portion operating at a first voltage range and a second voltage circuit portion operating at a second voltage range higher than the first voltage range, the...

08/07/14 - 20140217427 - Solid-state light emitting devices and signage with photoluminescence wavelength conversion
A solid-state light emitting device comprises a solid-state light emitter (LED) operable to generate excitation light and a wavelength conversion component including a mixture of particles of a photoluminescence material and particles of a light reflective material. In operation the phosphor absorbs at least a portion of the excitation light...

07/31/14 - 20140209930 - Multi-vertical led packaging structure
The present disclosure involves a light-emitting diode (LED) packaging structure. The LED packaging structure includes a submount having a substrate and a plurality of bond pads on the substrate. The LED packaging structure includes a plurality of p-type LEDs bonded to the substrate through a first subset of the bond...

07/31/14 - 20140209931 - Led board structure and method of manufacturing same
An LED board structure includes a light-pervious substrate having a plurality of light-pervious areas formed thereon, a plurality of patterned conductive traces arranged on the light-pervious substrate at locations other than the light-pervious areas, and a plurality of LEDs correspondingly arranged on the light-pervious areas and respectively having two electrode...

07/31/14 - 20140209932 - Pixel unit and pixel array
A pixel array and a pixel unit thereof adapted in a display panel are provided. The pixel array includes a plurality of pixel units, and each pixel unit includes a first gate line, a second gate line, a data line, a first sub-pixel, a second sub-pixel and a third sub-pixel....

07/31/14 - 20140209933 - Display panel and method of manufacturing the display panel
A method of manufacturing a display panel includes forming a pixel-defining layer on a substrate, disposing a mask on the pixel-defining layer on a first region of the substrate, and forming a first emission layer, and disposing the mask on the pixel-defining layer on a second region of the substrate,...

07/31/14 - 20140209934 - White light emitting diodes package containing plural blue light-emitting diodes
A white light-emitting diode (LED) package containing plural blue LED chips is disclosed. The white LED package includes a transparent plate, plural blue LED chips bonded on a front surface of the transparent plate, a front fluorescent glue layer covering the plural blue LED chips, and a rear transparent glue...

07/31/14 - 20140209935 - Array substrate and display device
An array substrate and a display device are disclosed. The array substrate comprises: a TFT, a pixel electrode layer driven by the TFT, a data line, a first passivation layer and a common electrode layer disposed on a substrate, the data line is for driving the TFT, the first passivation...

07/31/14 - 20140209936 - Vertically printing leds in series
A first layer of first vertical light emitting diodes (VLEDs) is printed on a conductor surface. A first transparent conductor layer is deposited over the first VLEDs to electrically contact top electrodes of the first VLEDs. A second layer of second VLEDs is printed on the first transparent conductor layer....

07/31/14 - 20140209937 - Package-free and circuit board-free led device and method for fabricating the same
The present invention discloses a package-free and circuit board-free LED device and a method for fabricating the same. The LED device is exempted from the semiconductor package substrate and the printed circuit board and comprises at least one LED chip having two electrodes able to directly connect with external wires...

07/31/14 - 20140209938 - Semiconductor light emitting element
A semiconductor light emitting element includes: an insulating substrate having a plurality of convex portions on a surface thereof; a plurality of light emitting element components having semiconductor laminated bodies that are laminated on the insulating substrate and are separated from one another by a groove that exposes the convex...

07/31/14 - 20140209939 - Ceramic led package
A package for multiple LED's and for attachment to a substrate includes a body, which includes a top body layer, a cavity disposed through the top body layer and having a floor for bonding to the multiple LED's, and a thermal conduction layer bonded to the top body layer and...

07/31/14 - 20140209940 - Light emitting device having a plurality of light emitting cells
Exemplary embodiments of the present invention relate to a light-emitting device including a single substrate, at least two light-emitting units disposed on the single substrate, each of the at least two light-emitting units including a first conductivity-type semiconductor layer, a second conductivity-type semiconductor layer, and an active layer disposed between...

07/31/14 - 20140209941 - Light emitting device and method of fabricating the same
A light emitting device and a method of fabricating the same. The light emitting device includes a substrate. A plurality of light emitting cells are disposed on top of the substrate to be spaced apart from one another. Each of the light emitting cells includes a first upper semiconductor layer,...

07/31/14 - 20140209942 - Method and device of a led matrix
There is provided a method for manufacturing a light emitting diode, LED, matrix (100) comprising the steps of providing with a maintained integrity a conductor sheet (150) with a plurality of component areas (111) interconnected with meandering connection tracks (116), mounting a plurality of LEDs (120) to a respective component...

07/24/14 - 20140203301 - Display device
A display device includes a substrate and pixels arranged on the substrate in a matrix form. The substrate includes a display area in which the pixels are arranged and a non-display area disposed adjacent to a side of the display area. Each pixel includes a cover layer that extends in...

07/24/14 - 20140203302 - Pixel structure of display panel
A pixel structure of a display panel includes a gate line, a first data line, a second data line, a first active switching device, a second active switching device, a first pixel electrode and a second pixel electrode. The first pixel electrode is electrically connected to the first active switching...

07/24/14 - 20140203303 - Light-emitting diode display substrate, method for manufacturing same, and display device
A light-emitting diode (LED) display substrate, a method for manufacturing the same, and a display device are provided and involve the display field. The method for manufacturing the LED display substrate comprises: forming a transparent conductive anode (201) on a substrate (200); forming a pixel region defined by a first...

07/24/14 - 20140203304 - Light-emitting device package strip and method for manufacturing the same
Provided is a light-emitting device package strip that includes a lead frame strip, a plurality of resin molding products that are injection-molded in the lead frame strip, and runner and gate members that are formed between adjacent resin molding products and on end sides of a line of adjacent resin...

07/24/14 - 20140203305 - Light emitting device and its method of manufacture
The light emitting device is provided with a substrate, semiconductor light emitting elements mounted on the substrate, a mold frame that surrounds the periphery of the light emitting elements on the substrate, and resin layers that fill the inside of the mold frame. The mold frame includes a first mold...

07/24/14 - 20140203306 - Semiconductor light-emitting device
A semiconductor light-emitting device can include a wavelength converting layer including a surrounding portion, which covers at least one semiconductor light-emitting chip in order to emit various colored lights including white light. The semiconductor light-emitting device can include a substrate, a frame located on the substrate, the chip mounted on...

07/24/14 - 20140203307 - Display panel and system for displaying images utilizing the same
An embodiment of the invention provides a display panel, which includes a substrate having a pixel region and a peripheral region, a control element overlying the pixel region of the substrate, a conducting layer overlying the substrate in the peripheral region, a first insulating layer overlying the conducting layer in...

07/24/14 - 20140203308 - Light-emitting dies incorporating wavelength-conversion materials and related methods
In accordance with certain embodiments, semiconductor dies are embedded within polymeric binder to form, e.g., light-emitting dies and/or composite wafers containing multiple light-emitting dies embedded in a single volume of binder....

07/24/14 - 20140203309 - Electroluminescence display device
Disclosed is an electroluminescence device having a substrate, a thin film transistor over the substrate, an insulating film over the thin film transistor, an electroluminescence element over the insulating film, a passivation film over the electroluminescence element, and a counter substrate over the passivation film. The electroluminescence element is configured...

07/17/14 - 20140197426 - Light emitting diode chip structure and light emitting diode element
A light emitting diode chip structure includes a substrate, a mesa type light emitting diode structure, and an electroluminescent layer. The mesa type light emitting diode structure includes a first semiconductor layer, a light emitting layer, and a second semiconductor layer. The mesa type light emitting diode structure is formed...

07/17/14 - 20140197427 - A display apparatus substrate having a plurality of organic and inorganic layers stacked
A display apparatus and a method of manufacturing the same includes a substrate including a plurality of organic layers and a plurality of inorganic layers, a display unit formed on the substrate and an encapsulation unit formed on the display, wherein the plurality of organic layers and the plurality of...

07/17/14 - 20140197428 - Display panel and display device
A display panel includes an array substrate, an opposite substrate, and at least one closed sealing element. The array substrate has a first through hole, and the array substrate includes a plurality of pixel units, a plurality of scan lines, and a plurality of data lines. The scan lines are...

07/17/14 - 20140197429 - Method of arranging a multiplicity of leds in packaging units, and packaging unit comprising a multiplicity of leds
A method of arranging a multiplicity of LEDs in packaging units includes defining a desired range for at least one photometric measurement variable for each of the packaging units; selecting an LED from the multiplicity of LEDs not yet arranged in one of the packaging units; measuring the at least...

07/17/14 - 20140197430 - Substrate free led package
A method of fabricating a substrate free light emitting diode (LED), includes arranging LED dies on a tape to form an LED wafer assembly, molding an encapsulation structure over at least one of the LED dies on a first side of the LED wafer assembly, removing the tape, forming a...

07/17/14 - 20140197431 - Light emitting device
Provided is a light emitting device having a high light emitting efficiency and a good brightness distribution, further having a good color mixing and a good light distribution. A light emitting device includes a base member, a plurality of light emitting elements disposed on the base member, and a sealing...

07/10/14 - 20140191256 - Thin film trannsistor array panel and manufacturing method thereof
Instead of forming contact holes the same way in both the non-image forming peripheral area (PA) and the image forming display area of a thin film transistor array panel, contact holes in the DA are formed to be substantially smaller than those in the PA for thereby improving an aperture...

07/10/14 - 20140191257 - Electronic devices with yielding substrates
In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts....

07/10/14 - 20140191258 - Semiconductor light emitting device and method for manufacturing same
According to one embodiment, a semiconductor light emitting device includes not less than three chips. Each of the chips includes a semiconductor layer having a first face, a second face formed on a side opposite to the first face, and a light emitting layer, a p-side electrode, and an n-side...

07/10/14 - 20140191259 - Molded chip fabrication method and apparatus
A method and apparatus for coating a plurality of semiconductor devices that is particularly adapted to coating LEDs with a coating material containing conversion particles. One method according to the invention comprises providing a mold with a formation cavity. A plurality of semiconductor devices are mounted within the mold formation...

07/03/14 - 20140183565 - Light-emitting module board and manufacturing method of the light-emitting module board
A light-emitting module board includes a metal board provided with an insulating layer, a light-emitting part and a white insulating film. The light-emitting part includes plural LED chips mounted on the metal board, and a white reflecting film of a ceramic coating formed in a light-emitting area on the metal...

07/03/14 - 20140183566 - Multi-chip led diode apparatus
In one aspect, there is an apparatus that comprises a plurality of light emitting chips that each have active areas that have elongated aspect ratios. This chips are mounted in a generally rectangular package. The chips are each arranged around a periphery of the package so that each narrow side...

07/03/14 - 20140183567 - Display device and method of manufacturing the same
A display device includes a data IC including a plurality of dummy output pads, and a plurality of signal output pads that are positioned at both sides of the plurality of dummy output pads; a plurality of dummy data pads and a plurality of signal input data pads in a...

07/03/14 - 20140183568 - Led package with flexible polyimide circuit and method of manufacturing led package
A light emitting diode (LED) package may include a base, at least one light emitting die on the base, and a flextape on the base. The flextape includes at least one metal trace connected to the light emitting die. In a method of manufacturing the LED package, the base may...

07/03/14 - 20140183569 - Led chip unit and manufacturing method thereof, and led module
An LED chip unit and manufacturing method thereof, a LED module, an illuminating device and a display device. The LED chip unit includes a plurality of LED cores which are electrically isolated from each other. The LED chip unit is used for a cutting unit of an epitaxial wafer, so...

07/03/14 - 20140183570 - Illumination apparatuses
The present invention provides an illumination apparatus. The illumination apparatus comprises a body having a lower portion coupled to a standard metallic lamp adaptor and an upper portion; a light source module comprising an LED array of LED chips connected in series, a phosphor powder layer encapsulating the LED chips,...

07/03/14 - 20140183571 - Display device
A display device includes a micro-lens film which has a high fill-factor and a high luminance ratio and prevents generation of moiré. The display device includes a display panel configured to display an image, a plurality of Light Emitting Diodes (LEDs) configured to generate light to supply light to the...

07/03/14 - 20140183572 - Light emitting device
A light emitting device includes a substrate, a plurality of light emitting cells disposed on the substrate to be spaced apart from each other, and a connection wire electrically connecting adjacent ones of the light emitting cells. One of the adjacent light emitting cells includes a plurality of first segments,...

07/03/14 - 20140183573 - Light emitting device
A light emitting device includes a substrate, a plurality of light emitting cells disposed on the substrate to be spaced apart from each other, and a connection wire electrically connecting adjacent ones of the light emitting cells. A first separation distance between first adjacent light emitting cells that are not...

07/03/14 - 20140183574 - Light emitting device package, light emitting device using that package, and illumination device using the light emitting devices
The light emitting device package of the present invention has a longitudinal direction (as viewed from above) and a transverse direction perpendicular to the longitudinal direction, and is provided with a first and second lead-frame lined-up in the longitudinal direction and molded resin holds the first and second lead-frames integrally....

07/03/14 - 20140183575 - Light emitting device and manufacturing method thereof
The light-emitting device has a plurality of light-emitting elements that is mounted on one or more wiring patterns on a substrate. A new light-emitting element that replaces a defective element is mounted on the same wiring pattern on which the defective element is mounted. The defective element or a trace...

07/03/14 - 20140183576 - Display device and method of fabricating the display device
In an EL element having an anode, an insulating film (bump) formed on the anode, and an EL film and a cathode formed on the insulating film, each of a bottom end portion and a top end portion of the insulating film is formed so as to have a curved...