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Active Solid-state Devices (e.g., Transistors, Solid-state Diodes) > Incoherent Light Emitter Structure > Plural Light Emitting Devices (e.g., Matrix, 7-segment Array)

Plural Light Emitting Devices (e.g., Matrix, 7-segment Array)

Plural Light Emitting Devices (e.g., Matrix, 7-segment Array) patent applications listed include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.

07/17/14 - 20140197426 - Light emitting diode chip structure and light emitting diode element
A light emitting diode chip structure includes a substrate, a mesa type light emitting diode structure, and an electroluminescent layer. The mesa type light emitting diode structure includes a first semiconductor layer, a light emitting layer, and a second semiconductor layer. The mesa type light emitting diode structure is formed...

07/17/14 - 20140197427 - A display apparatus substrate having a plurality of organic and inorganic layers stacked
A display apparatus and a method of manufacturing the same includes a substrate including a plurality of organic layers and a plurality of inorganic layers, a display unit formed on the substrate and an encapsulation unit formed on the display, wherein the plurality of organic layers and the plurality of...

07/17/14 - 20140197428 - Display panel and display device
A display panel includes an array substrate, an opposite substrate, and at least one closed sealing element. The array substrate has a first through hole, and the array substrate includes a plurality of pixel units, a plurality of scan lines, and a plurality of data lines. The scan lines are...

07/17/14 - 20140197429 - Method of arranging a multiplicity of leds in packaging units, and packaging unit comprising a multiplicity of leds
A method of arranging a multiplicity of LEDs in packaging units includes defining a desired range for at least one photometric measurement variable for each of the packaging units; selecting an LED from the multiplicity of LEDs not yet arranged in one of the packaging units; measuring the at least...

07/17/14 - 20140197430 - Substrate free led package
A method of fabricating a substrate free light emitting diode (LED), includes arranging LED dies on a tape to form an LED wafer assembly, molding an encapsulation structure over at least one of the LED dies on a first side of the LED wafer assembly, removing the tape, forming a...

07/17/14 - 20140197431 - Light emitting device
Provided is a light emitting device having a high light emitting efficiency and a good brightness distribution, further having a good color mixing and a good light distribution. A light emitting device includes a base member, a plurality of light emitting elements disposed on the base member, and a sealing...

07/10/14 - 20140191256 - Thin film trannsistor array panel and manufacturing method thereof
Instead of forming contact holes the same way in both the non-image forming peripheral area (PA) and the image forming display area of a thin film transistor array panel, contact holes in the DA are formed to be substantially smaller than those in the PA for thereby improving an aperture...

07/10/14 - 20140191257 - Electronic devices with yielding substrates
In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts....

07/10/14 - 20140191258 - Semiconductor light emitting device and method for manufacturing same
According to one embodiment, a semiconductor light emitting device includes not less than three chips. Each of the chips includes a semiconductor layer having a first face, a second face formed on a side opposite to the first face, and a light emitting layer, a p-side electrode, and an n-side...

07/10/14 - 20140191259 - Molded chip fabrication method and apparatus
A method and apparatus for coating a plurality of semiconductor devices that is particularly adapted to coating LEDs with a coating material containing conversion particles. One method according to the invention comprises providing a mold with a formation cavity. A plurality of semiconductor devices are mounted within the mold formation...

07/03/14 - 20140183565 - Light-emitting module board and manufacturing method of the light-emitting module board
A light-emitting module board includes a metal board provided with an insulating layer, a light-emitting part and a white insulating film. The light-emitting part includes plural LED chips mounted on the metal board, and a white reflecting film of a ceramic coating formed in a light-emitting area on the metal...

07/03/14 - 20140183566 - Multi-chip led diode apparatus
In one aspect, there is an apparatus that comprises a plurality of light emitting chips that each have active areas that have elongated aspect ratios. This chips are mounted in a generally rectangular package. The chips are each arranged around a periphery of the package so that each narrow side...

07/03/14 - 20140183567 - Display device and method of manufacturing the same
A display device includes a data IC including a plurality of dummy output pads, and a plurality of signal output pads that are positioned at both sides of the plurality of dummy output pads; a plurality of dummy data pads and a plurality of signal input data pads in a...

07/03/14 - 20140183568 - Led package with flexible polyimide circuit and method of manufacturing led package
A light emitting diode (LED) package may include a base, at least one light emitting die on the base, and a flextape on the base. The flextape includes at least one metal trace connected to the light emitting die. In a method of manufacturing the LED package, the base may...

07/03/14 - 20140183569 - Led chip unit and manufacturing method thereof, and led module
An LED chip unit and manufacturing method thereof, a LED module, an illuminating device and a display device. The LED chip unit includes a plurality of LED cores which are electrically isolated from each other. The LED chip unit is used for a cutting unit of an epitaxial wafer, so...

07/03/14 - 20140183570 - Illumination apparatuses
The present invention provides an illumination apparatus. The illumination apparatus comprises a body having a lower portion coupled to a standard metallic lamp adaptor and an upper portion; a light source module comprising an LED array of LED chips connected in series, a phosphor powder layer encapsulating the LED chips,...

07/03/14 - 20140183571 - Display device
A display device includes a micro-lens film which has a high fill-factor and a high luminance ratio and prevents generation of moiré. The display device includes a display panel configured to display an image, a plurality of Light Emitting Diodes (LEDs) configured to generate light to supply light to the...

07/03/14 - 20140183572 - Light emitting device
A light emitting device includes a substrate, a plurality of light emitting cells disposed on the substrate to be spaced apart from each other, and a connection wire electrically connecting adjacent ones of the light emitting cells. One of the adjacent light emitting cells includes a plurality of first segments,...

07/03/14 - 20140183573 - Light emitting device
A light emitting device includes a substrate, a plurality of light emitting cells disposed on the substrate to be spaced apart from each other, and a connection wire electrically connecting adjacent ones of the light emitting cells. A first separation distance between first adjacent light emitting cells that are not...

07/03/14 - 20140183574 - Light emitting device package, light emitting device using that package, and illumination device using the light emitting devices
The light emitting device package of the present invention has a longitudinal direction (as viewed from above) and a transverse direction perpendicular to the longitudinal direction, and is provided with a first and second lead-frame lined-up in the longitudinal direction and molded resin holds the first and second lead-frames integrally....

07/03/14 - 20140183575 - Light emitting device and manufacturing method thereof
The light-emitting device has a plurality of light-emitting elements that is mounted on one or more wiring patterns on a substrate. A new light-emitting element that replaces a defective element is mounted on the same wiring pattern on which the defective element is mounted. The defective element or a trace...

07/03/14 - 20140183576 - Display device and method of fabricating the display device
In an EL element having an anode, an insulating film (bump) formed on the anode, and an EL film and a cathode formed on the insulating film, each of a bottom end portion and a top end portion of the insulating film is formed so as to have a curved...

06/26/14 - 20140175463 - Flexible display device and method of manufacturing the same
A flexible display device is discussed. The flexible display device according to an embodiment includes an insulating and flexible substrate on which an adhesive layer is formed, a support layer adhered to the substrate via the adhesive layer, a cell array formed above the support layer, defining a plurality of...

06/26/14 - 20140175464 - Light emitting diode device
A light emitting diode (LED) device includes a light guiding member having a light incident surface, and an LED light bar mounted on the light incident surface. The LED light bar includes a printed circuit board, LEDs mounted on the printed circuit board, and encapsulating layers formed on the printed...

06/26/14 - 20140175465 - Light emitting diode and method of fabricating the same
Exemplary embodiments of the present invention provide a light emitting diode including a first light emitting cell and a second light emitting cell disposed on a substrate and spaced apart from each other, a first transparent electrode layer disposed on the first light emitting cell and electrically connected to the...

06/26/14 - 20140175466 - Led mixing chamber with reflective walls formed in slots
A relatively large substrate has a reflective surface, such as a diffusive white surface. LED dies, either as bare LED dies or packaged LED dies, are mounted to the substrate to form separate arrays of LEDs. Each array is intended for a separate mixing chamber. A layer of an encapsulant,...

06/19/14 - 20140167075 - Phosphor cap for led die top and lateral surfaces
A method for depositing a layer of phosphor-containing material on a plurality of LED dies includes disposing a template with a plurality of openings on an adhesive tape and disposing each of a plurality of LED dies in one of the plurality of openings of the template. The method also...

06/19/14 - 20140167076 - Led module with separate heat-dissipation and electrical conduction paths, and related heat dissipation board
A LED module with separate heat-dissipation and electrical conduction paths is disclosed, having a metal substrate; a plastic layer, comprising one or more hollow regions, and attached to the metal substrate; one or more conducting elements attached to the plastic layer; one or more LED chips positioned in the one...

06/19/14 - 20140167077 - Light source module
A light source module includes a substrate, at least two light emitting diode (LED) chips and at least one dummy chip. The LED chips are disposed on the substrate. The dummy chip is disposed on the substrate and located between the LED chips. The LED chips, the dummy chip and...

06/19/14 - 20140167078 - Lead frame and light emitting diode package having the same
An exemplary lead frame includes a substrate and a bonding electrode, a first connecting electrode, and a second connecting electrode embedded in the substrate. A top surface of the bonding electrode includes a first bonding surface and a second bonding surface spaced from the first bonding surface. A top surface...

06/19/14 - 20140167079 - Array substrate, method for fabricating the same and display device
An array substrate, a method for fabricating the same and a display device are disclosed. The array substrate comprises a display region, at least two common electrode blocks are disposed at a periphery of the display region and conducted via a pixel electrode bridge line pattern....

06/12/14 - 20140159063 - Vertical solid-state transducers and high voltage solid-state transducers having buried contacts and associated systems and methods
Solid-state transducers (“SSTs”) and vertical high voltage SSTs having buried contacts are disclosed herein. An SST die in accordance with a particular embodiment can include a transducer structure having a first semiconductor material at a first side of the transducer structure, and a second semiconductor material at a second side...

06/12/14 - 20140159064 - Light emitting device reflective bank structure
Reflective bank structures for light emitting devices are described. The reflective bank structure may include a substrate, an insulating layer on the substrate, and an array of bank openings in the insulating layer with each bank opening including a bottom surface and sidewalls. A reflective layer spans sidewalls of each...

06/12/14 - 20140159065 - Stabilization structure including sacrificial release layer and staging cavity
A method and structure for stabilizing an array of micro devices is disclosed. The array of micro devices is held within an array of staging cavities on a carrier substrate. Each micro device is laterally surrounded by sidewalls of a corresponding staging cavity....

06/12/14 - 20140159066 - Stabilization structure including sacrificial release layer and staging bollards
A method and structure for stabilizing an array of micro devices is disclosed. The array of micro devices is within an array of staging cavities on a carrier substrate. Each micro device is laterally retained between a plurality of staging bollards of a corresponding staging cavity....

06/12/14 - 20140159067 - Active matrix emissive micro led display
A display panel and a method of forming a display panel are described. The display panel may include a thin film transistor substrate including a pixel area and a non-pixel area. The pixel area includes an array of bank openings and an array of bottom electrodes within the array of...

06/12/14 - 20140159068 - Display device
A display device includes: a substrate; a signal line on the substrate; a signal input line on the substrate and connected to a driver; a first insulating layer between the signal line and the signal input line; a second insulating layer on the signal line, the signal input line and...

06/12/14 - 20140159069 - Light emitting device and method for manufacturing the same
A light emitting device includes a light source module and a secondary optical element. The optical element includes a light incident surface and a light radiating surface opposite to the light incident surface. The light source module includes at least one light emitting unit, and the light emitting unit includes...

06/12/14 - 20140159070 - Array substrate and display device
An array substrate includes a first electrode located above a switching element through a first insulating film, a second electrode located above the first electrode through a second insulating film, and a connection portion that is located to pass through the first insulating film, first electrode, and second insulating film...

06/12/14 - 20140159071 - Light emitting device
A light emitting device includes a substrate, light emitting cells, each of the light emitting cells including a light emitting structure including lower and upper semiconductor layers, an upper electrode, and a lower electrode, a conductive interconnection layer electrically connecting a lower electrode of a first one of the light...

06/12/14 - 20140159072 - Light-emitting device, light-emitting device assembly, and electrode-bearing substrate
A light-emitting device assembly includes a plurality of light-emitting devices, the plurality of light-emitting devices being provided continuously, the plurality of light-emitting devices each including a substrate, an optical semiconductor element mounted on the surface of the substrate, an encapsulating layer formed on the substrate surface to encapsulate the optical...

06/12/14 - 20140159073 - Array substrate and method for manufacturing the same, and display device
The present invention provides an array substrate and a method for manufacturing the same, and a display device. Wherein, after forming a pattern corresponding to a source/drain electrode layer, a transparent conducting layer is formed, and then a passivation layer is formed on the transparent conducting layer. Because the transparent...

06/12/14 - 20140159074 - El display device and method for manufacturing same
An EL display device of the present invention includes a plurality of pixel electrodes, wiring, a common electrode, a plurality of light-emitting layer portions, and a protective layer. The pixel electrodes are formed in one-to-one correspondence with a plurality of pixels. The wiring is formed in at least one of...

06/12/14 - 20140159075 - Light-emitting device package and method of manufacturing the same
A light-emitting device package uses a metal layer as a reflective region and includes a light-emitting device chip and an electrode pad that are disposed on an insulating layer. In addition, the electrode pad and an electrode pattern of a printed circuit board are connected to each other by an...

06/12/14 - 20140159076 - Light-emitting device
Improves light extraction efficiency. A light emitting device 1 using a white resin molding package 5 integrally molded with lead frames 3, 4 constituting an electrode corresponding to one or a plurality of light emitting element 2 and white resin, wherein an area in a plane view of a white...

06/05/14 - 20140151721 - Phase transition cooling in led lighting devices
A lighting device is provided comprising a chip-on-board (COB) light emitting diode (LED) light source, a phase transfer fluid disposed in a hermetically sealed phase transfer fluid chamber, a phase transfer fluid wicking structure, a distributed color conversion medium, and a glass containment plate. The color conversion medium is distributed...

06/05/14 - 20140151722 - Light emitting diode (led) light source device having uniform illumination
An LED light source device includes a printed circuit board (PCB) and a plurality of LED light sources located on the PCB and electrically connected with the PCB. The plurality of LED light sources are arranged symmetrically relative to a center point of the PCB, and a distance between every...

06/05/14 - 20140151723 - Pixel array
A pixel array includes multiple scan lines, multiple gate lines, multiple data lines and multiple pixel structures. The scan lines are disposed on a substrate. The gate lines intersect with the scan lines to demarcate multiple first unit regions and multiple second unit regions. Each gate line electrically connects to...

06/05/14 - 20140151724 - Method for producing an optoelectronic semiconductor component and such a semiconductor component
A method for producing a semiconductor component is disclosed. A carrier substrate includes a mounting region and an opening, which is formed in the mounting region of the carrier substrate. After mounting a semiconductor chip, an electrically insulating layer is applied to the carrier substrate in such a way that...

06/05/14 - 20140151725 - Method and apparatus for fabricating phosphor-coated led dies
The present disclosure involves a method of packaging a light-emitting diode (LED). According to the method, a group of metal pads and a group of LEDs are provided. The group of LEDs is attached to the group of metal pads, for example through a bonding process. After the LEDs are...

06/05/14 - 20140151726 - Light emitting module
There are provided a light emitting module including a luminescent material layer (15) which is disposed so as to cover a light emitting surface (13a) of a semiconductor light emitting element (13) and which changes a wavelength of at least part of light emitted from the semiconductor light emitting element,...