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Active Solid-state Devices (e.g., Transistors, Solid-state Diodes) > Incoherent Light Emitter Structure > In Combination With Or Also Constituting Light Responsive Device > With Specific Housing Or Contact Structure With Specific Housing Or Contact StructureWith Specific Housing Or Contact Structure patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.01/24/08 - 20080017870 - Semiconductor light-emitting means and light-emitting panel comprising the same A semiconductor light-emitting means (56) comprises a transparent substrate (12), on which light-emitting diodes (26, 28) are arranged. These and electrodes (14, 36) used for contacting them are transparent. ... 10/25/07 - 20070246717 - Light source having both thermal and space efficiency A light source that is both thermally and spatially efficient can be achieved by attaching a light source, such as an LED chip, to a flexible circuit and positioning a light conductive material around the light source. For one embodiment, a cavity is created around the light source such that ... 10/25/07 - 20070246716 - Semiconductor light emitting device with integrated electronic components One or more circuit elements such as silicon diodes, resistors, capacitors, and inductors are disposed between the semiconductor structure of a semiconductor light emitting device and the connection layers used to connect the device to an external structure. In some embodiments, the n-contacts to the semiconductor structure are distributed across ... 08/23/07 - 20070194330 - High efficiency leds with tunnel junctions An LED made from a wide band gap semiconductor material and having a low resistance p-type confinement layer with a tunnel junction in a wide band gap semiconductor device is disclosed. A dissimilar material is placed at the tunnel junction where the material generates a natural dipole. This natural dipole ... 06/28/07 - 20070145387 - Led housing and fabrication method thereof The invention relates to an LED housing and its fabrication method. In the LED housing, a heat conducting part has a chip mounting area, a heat connecting area opposed to the chip mounting area and a groove formed adjacent to the heat connecting area. An electrical connecting part has a ... 06/21/07 - 20070138485 - Flat panel display subassembly having shielding structure An exemplary flat panel display subassembly (1) includes a chassis (14), and a shielding structure (16) detachably secured to the chassis. The chassis includes a location bridge (144) at an outer surface thereof, and an opening (147) defined adjacent the location bridge. The shielding structure covers the opening, and includes ... 06/14/07 - 20070131945 - Light-emitting semiconductor device with open-bypass function This invention discloses a light-emitting semiconductor device with open-bypass function, which comprises two terminals providing a current, at least one LED unit and a bypass switch. Electrodes of the LED unit and the bypass switch are properly connected to the terminals, so that the bypass switch will provide an alternative ... 06/14/07 - 20070131944 - Dual organic electroluminescent display and method of making same A dual display unit comprising two OLED displays separately fabricated on two substrates. Each of the substrates has a peripheral area surrounding the respective display. A getter element is provided on one or both peripheral areas, substantially surrounding both the displays, for absorbing harmful gaseous elements in the display unit. ... 05/31/07 - 20070120134 - Stem for optical element and optical semiconductor device using the same A stem for an optical element includes a base-like portion located on a portion of a package side surface of an eyelet, higher than the package side surface. A block is located on a surface of the base-like portion of the eyelet. An optical element mounting surface of the block ... 05/03/07 - 20070096119 - Electrode structure and optical semiconductor element An electrode structure includes a first conductive layer, an insulation layer that covers at least a portion of a marginal area of an upper surface of the first conductive layer and has a first sloped section that slopes down toward the upper surface of the first conductive layer, a first ... 05/03/07 - 20070096118 - Synthetic jet cooling system for led module An LED assembly is provided herein. The assembly comprises a thermally conductive housing (201), wherein a portion of said housing is equipped with a plurality of fins (203); an LED (205) disposed in said housing; and a synthetic jet actuator (207) adapted to direct a synthetic jet onto said portion ... 04/26/07 - 20070090374 - Flat lamp panel A flat lamp panel includes a top substrate and a bottom substrate. The bottom substrate includes at least an electrode pair, a dielectric layer, and a first phosphor layer covering the up surface of the bottom substrate. The top substrate is disposed above the bottom substrate in a parallel manner. ... 04/19/07 - 20070085089 - High power light emitting diode A high power LED comprises a substrate. An N-type semiconductor layer, an active layer and a P-type semiconductor layer are sequentially deposited on the substrate. A semi-insulator layer or a non-N-type semiconductor layer can be interposed between the N-type semiconductor layer and substrate. At least one N-type electrode is connected ... 04/12/07 - 20070080355 - Alternating current light-emitting device An alternating current light-emitting device and the fabrication method thereof is disclosed. The alternating current light-emitting device includes at least one alternating current micro-die light-emitting module formed on a substrate and composed of at least two micro-dies connected to one another. The micro-dies, each includes at least two active layers, ... 03/22/07 - 20070063203 - Method for producing electronic components A diode is formed by an N+ diffusion layer and a P-type semiconductor substrate. In an N-well, a diode is formed by a P+ diffusion layer and an N+ diffusion layer. The N+ diffusion layer is connected to power supply wiring. A fuse is connected to the N+ diffusion layer ... 02/22/07 - 20070040180 - Integrated circuit device An integrally packaged optronic integrated circuit device including an integrated circuit die containing at least one of a radiation emitter and radiation receiver and having a transparent packaging layer overlying a surface of the die, the transparent packaging layer having an opaque coating adjacent to edges of the layer. ... 02/01/07 - 20070023767 - Semiconductor apparatus having conductive layers and semiconductor thin films A semiconductor apparatus includes a substrate; m electrically conductive layers formed on the substrate, m being an integer of 2 or more, potentials of the m electrically conductive layers being capable of being independently controlled; and semiconductor thin films having at least one semiconductor device respectively. The semiconductor thin films ... 02/01/07 - 20070023766 - Feed through structure for optical semiconductor package Includes a stem with a hole, a dielectric sealed into the hole of the stem and including a pair of pin insertion holes, and a pair of high frequency signal pins that penetrate and fit into the pair of pin insertion holes of the dielectric, and constituting differential lines connected ... 02/01/07 - 20070023765 - Acicular ito for led array In an array of LEDs coupled between a transparent substrate and an electrode, a light emitting surface of each LED is in electrical contact with a region of acicular ITO. By contacting the light emitting surface of the die, the acicular ITO also provides light scattering. The contact regions are ... 01/25/07 - 20070018175 - Light emitting diodes with improved light collimation A light emitting diode with improved light collimation comprises a substrate-supported LED die disposed within a transparent dome. A portion of the dome laterally circumscribe the die comprises light reflecting material to reflect emitted light back to the die. A portion of the dome centrally overlying the die is substantially ... 11/02/06 - 20060243990 - Surface mount type photo interrupter and method for manufacturing the same A light emitting element and a light receiving element are mounted on the upper surface of an insulating substrate to be laterally aligned. A cap including a first hollow portion accommodating the light emitting element, a second hollow portion accommodating the light receiving element, and a connecting portion connecting the ... 10/26/06 - 20060237730 - Peltier cooler with integrated electronic device(s) A Peltier effect cooling device is formed in combination with an electronic device to form a unique thermal and electrical relationship. An electronic device to be cooled is placed in a serial electrical relationship between at least two thermoelectric couples while simultaneously being in thermal contact with a cold side ... 10/12/06 - 20060226433 - Strobe light control circuit and igbt device As external connection terminals for an emitter electrode (12) of an IGBT chip, a first emitter terminal (151) for electrically connecting a light emitter in a strobe light control circuit to the emitter electrode (12) and a second emitter terminal (152) for connecting a drive circuit for driving an IGBT ... 10/12/06 - 20060226432 - Semiconductor integrated device To improve reliability in controlling an output of a semiconductor laser. There are provided a prism adhered to the semiconductor substrate, and having a light reflection surface formed with a light reflection film for reflecting a laser beam emitted from the semiconductor laser and a light transmission surface for transmitting ... 10/05/06 - 20060220036 - Led package using si substrate and fabricating method thereof There are provided an LED package using a Si substrate and a fabricating method of the LED package. In the LED package, a supporting structure includes a Si substrate and an insulating layer formed on top and bottom surfaces of the Si substrate, and the supporting structure defines at least ... 09/14/06 - 20060202213 - Device mounting substrate and image display device A method of repairing a defective one of devices mounted on substrate is provided. Devices are arrayed on a substrate and electrically connected to wiring lines connected to a drive circuit, to be thus mounted on the substrate. The devices mounted on the substrate are then subjected to an emission ... 08/03/06 - 20060169991 - Light emitting diode An LED including a substrate having a pair of terminal electrodes, at least one LED element mounted on the substrate, a frame disposed on the substrate, holes provided in the substrate, concave portions provided in positions of the frame facing the holes, and a pair of conductive elastic members provided ... 07/20/06 - 20060157717 - Light emitting device A light emitting device having a simple structure that can be easily manufactured, attaining high light emitting efficiency stably for a long time is obtained, which light emitting device includes: a GaN substrate as a nitride semiconductor substrate and, on a first main surface of the nitride semiconductor substrate, an ... 07/13/06 - 20060151795 - Solid state relay, electronic device, and method for manufacturing solid state relays A light-receiving element for receiving a signal light from a light-emitting element and a load-controlling power element are mounted on an output-side lead frame of a solid state relay. A first electrode of the light-receiving element is connected to a first control terminal and a second electrode of the light-receiving ... 05/04/06 - 20060091406 - Illuminating apparatus, method for fabricating the same and display apparatus using the same An illuminating apparatus has a reduced number of mounting spots by soldering or the like to permit an increased yield rate and a reduced cost. The illuminating apparatus has light emitting diodes, lead frames, and a transparent sealer. N light emitting diodes, N sets of lead frames mounted with the ... 03/23/06 - 20060060867 - Light emitting device A light emitting device having: a light-emitting portion having a light emitting element flip-chip mounted, a first power supply portion that supplies power to the light emitting element, and an inorganic sealing material that seals the light emitting element; a second power supply portion that supplies power to the light-emitting ... 03/02/06 - 20060043389 - Digital signal transfer device A digital signal transfer device generates from a modulating section (100) a modulated signal responsive to a digital input signal and transfers this to a demodulating section (200) through a pulse transformer (6). The demodulating section (200) generates from the modulated signal an output signal in which the digital input ... 02/23/06 - 20060038187 - Led and method of manufacturing the same An LED can include a pair of electrode members, and an LED chip joined to a chip mount portion disposed at the extremity of one of the pair of electrode members. The LED chip can be electrically connected to the pair of electrode members. A transparent resin portion can include ... 01/19/06 - 20060011928 - Surface-mountable light-emitting diode and/or photodiode and method for the production thereof A surface-mountable miniature luminescent diode with a chip package which has a leadframe (16) and a semiconductor chip (22) which is arranged on the leadframe (16) and is in electrical contact with it and which contains an active, radiation-emitting region. The leadframe (16) is formed by a flexible multi-layered sheet ... 12/08/05 - 20050269579 - Light-emitting diode array A light-emitting diode array comprising a conductive layer formed on a substrate, pluralities of separate light-emitting portions formed on the conductive layer, a first groove formed in the conductive layer to divide the light-emitting portions to blocks, first electrodes each formed on at least part of an upper surface of ... 12/08/05 - 20050269578 - Optoelectronic devices This invention relates to optoelectronic devices of improved efficiency. In particular it relates to light emitting diodes, photodiodes and photovoltaics. By careful design of periodic microstructures, e.g. gratings, associated with such devices more efficient light generation or detection is achieved. ... 11/24/05 - 20050258436 - Lighting device An object of the invention is to provide a lighting device which can suppress luminance nonuniformity in a light emitting region when the lighting device has large area. A layer including a light emitting material is formed between a first electrode and a second electrode, and a third electrode is ... 10/27/05 - 20050236631 - Light emitting device using nitride semiconductor and fabrication method of the same A nitride based 3-5 group compound semiconductor light emitting device comprising: a substrate; a buffer layer formed above the substrate; a first In-doped GaN layer formed above the buffer layer; an InxGa1-xN/InyGa1-yN super lattice structure layer formed above the first In-doped GaN layer; a first electrode contact layer formed above ... 09/08/05 - 20050194601 - Light emitting device A light emitting device comprises a light emitting element, a metal package having a recess part for housing the light emitting element and a base part which has one or more through holes, and one or more lead electrode pins which penetrate the through holes and are separated from the ... 09/08/05 - 20050194600 - Light-emitting diode A light-emitting diode having a first lead with a cup part in which a light-emitting element is held, a second lead in juxtaposition with the first lead, and a resin molding enclosing the tips of first and second leads. Flag-shaped protrusions are formed in the middle of first and second ... 09/01/05 - 20050189548 - Optical transmission module An optical transmission module that can be produced more easily and uses a shorter wiring pattern connecting the driving device and the light-emitting device than the conventional light-emitting apparatus, with the driving device and the light-emitting device arranged close to each other. The light-emitting device and the light-receiving device for ... 08/11/05 - 20050173713 - Multi-pin light-emitting diode device A light-emitting diode (LED) device with at least three pins, mainly comprises an accommodating base provided therein with an electrostatic discharge protection device and at least one light-emitting die adhered onto this electrostatic discharge protection device in the manner of flip-chip, in such a way that a first electrode and ... 08/11/05 - 20050173712 - Semiconductor photodetector and its production method In a semiconductor photodetector 1 according to the present invention, flat surfaces of three steps with different heights are formed in a top surface portion of a semi-insulating GaAs substrate 2. An n-type GaAs layer 3, an i-type GaAs layer 4, and a p-type GaAs layer 5 are successively deposited ... 08/04/05 - 20050167683 - Sapphire/gallium nitride laminate having reduced bending deformation wherein Y is the curvature radius (m) of a sapphire/gallium nitride laminate, X is the thickness (μm) of a gallium nitride film, Y0 is 5.47±0.34, A is 24.13±0.50, and T is 0.56±0.04. The inventive laminate can be advantageously used in the manufacture of a high quality electronic device. ... 07/28/05 - 20050161684 - Led lighting assembly The present invention provides a lighting head assembly that incorporates a high intensity LED package into an integral housing for further incorporation into other useful lighting devices. The present invention primarily includes two housing components, namely an inner mounting die and an outer enclosure. The inner and outer components cooperate ... 07/14/05 - 20050151143 - Light emitting device A light emitting element array is made with large light emitting elements and small light emitting elements are arranged on a substrate in a matrix-like form. The large light emitting element has the luminescent area of about 1 mm square. There is a clearance N1 of about 0.5 mm between ... 07/14/05 - 20050151142 - Led substrate An insulating substrate made of insulating material is used. A pair of electrode patterns are formed on the surface of the insulating substrate, and a pair of through-holes are formed in the insulating substrate. A resin is mounted on the insulating substrate to close an opening of each of the ... 07/14/05 - 20050151141 - Luminescence diode chip A luminescence diode chip with a semiconductor body having an epitaxially grown semiconductor layer sequence with an active zone and a radiation coupling-out area, the active zone emitting an electromagnetic radiation during operation of the luminescence diode chip, which electromagnetic radiation, at least in part, is coupled out via the ... 07/07/05 - 20050145859 - Semiconductor light-emitting device and process for producing the same Semiconductor light-emitting devices are provided. The semiconductor light-emitting devices include a substrate and a crystal layer selectively grown thereon at least a portion of the crystal layer is oriented along a plane that slants to or diagonally intersect a principal plane of orientation associated with the substrate thereby for example, ... 07/07/05 - 20050145858 - Led package die having a small footprint A light emitting die package and a method of making the light emitting die package are disclosed. The die package includes a stem substrate having grooves, a wire lead attached to the grooves, and a light emitting diode (LED) mounted on the stem substrate. Also coupled to the substrate are ... 06/30/05 - 20050139843 - Chip carrier used for semiconductor optical device, optical module, and optical transmitter and receiver A chip carrier includes a metal-coated portion formed on a front surface of a substrate and to be mounted a device, and a rear surface of the substrate being coated with a metal, in which a metal-coated portion is formed on a side surface of the substrate and the metal-coated ... 06/23/05 - 20050133801 - Red fluorescent material, white light emitting diode using red fluorescent material, and lighting device using white light emitting diode The present invention achieves improvement of the color reproducibility, color rendering properties and light emitting efficiency of a white light emitting diode. The present invention is a red fluorescent material composed of a europium doped calcium lanthanum tungstate represented by a general formula of Ca3(La1−x,Eux)2W2012 (0<x≦1). The red fluorescent material ... 06/16/05 - 20050127378 - Optical semiconductor device The invention provides an optical semiconductor device which comprises: an optical semiconductor element; a first resin layer encapsulating the optical semiconductor element and comprising a first resin and light-scattering particles; and one or more resin layers sequentially encapsulating the first resin layer and each comprising a resin having a lower ... 06/16/05 - 20050127377 - Optoelectronic component Optoelectronic component, having a basic body or housing (2), at least one optoelectronic semiconductor chip (3) arranged in a recess of the basic body, and a potting composition (5) made of a transparent material, which potting composition embeds the at least one semiconductor chip in the recess, the transparent potting ... 06/02/05 - 20050116239 - Circuit interconnect for optoelectronic device This disclosure concerns systems and devices configured to implement impedance matching schemes in a high speed data transmission environment. In one example, an optoelectronic assembly is provided that includes a TO package having a base through which one or more leads pass. The leads are electrically coupled to an optoelectronic ... 06/02/05 - 20050116238 - Optoelectronic semiconductor component A radiation-emitting and/or radiation-receiving semiconductor component in which a radiation-emitting and/or radiation-receiving semiconductor chip is secured on a chip carrier part of a lead frame. The chip carrier part forms a trough in the region in which the semiconductor chip is secured wherein the inner surface of the trough is ... ### FreshPatents.com Support |