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Compositions > Electrically Conductive Or Emissive Compositions > Free Metal Containing > Noble Metal (gold, Silver, Ruthenium, Rhodium, Palladium, Osmium, Iridium, Platinum) Noble Metal (gold, Silver, Ruthenium, Rhodium, Palladium, Osmium, Iridium, Platinum)Noble Metal (gold, Silver, Ruthenium, Rhodium, Palladium, Osmium, Iridium, Platinum) patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.09/20/07 - 20070215842 - Manufacturable cowp metal cap process for copper interconnects An aqueous seeding solution of palladium acetate, acetic acid and chloride. ... 07/26/07 - 20070170403 - High conductivity inks with improved adhesion Conductive ink compositions which can be cured to highly conductive metal traces by means of “chemical welding” include adhesion promoting additives for providing improved adhesion of the compositions to various substrates. ... 06/21/07 - 20070138447 - Method of producing ceramic raw material and ceramic molded body A method of producing a ceramic raw material has steps of adding water into ceramic particles in order to produce a ceramic particle dispersed liquid, adding water into resin component in order to produce a resin component dispersed liquid, mixing the ceramic particle dispersed liquid and the resin component dispersed ... 04/05/07 - 20070075301 - Resistor composition and thick film resistor A resistor composition comprising: a lead-free ruthenium-based electrically conductive component, a lead-free glass having a glass basicity (Po value) of 0.4 to 0.9, and an organic vehicle; wherein, MSi2Al2O8 crystals (M: Ba and/or Sr) are present in a thick film resistor obtained by firing this composition. The ruthenium-based resistor composition ... 03/15/07 - 20070057238 - Particle dispersion copper alloy and method for producing the same Hard phase particles including Co alloy particles, carbide alloy particles, and silicide particles are dispersed substantially uniformly throughout a matrix composed of Cu self-fluxing alloy of a cladded portion. The cladded portion contains 6 to 15% by weight of Co, 3 to 8% by weight of one of Cr and ... 02/01/07 - 20070023738 - Low temperature fired, lead-free thick film heating element A lead free, thick film heating element. Known thick film heating elements contain environmentally hazardous material such as lead. This is particularly problematic when manufacturing thick film heating elements, as lead is often used in thick film formulations to allow the glass-based thick film to be processed at low firing ... 12/28/06 - 20060289842 - Conductive composition and method of using the same A conductive composition includes a conductive metal, a first resin component, and a second resin component, which is an isocyanate component, that is reactive with the first resin component. A metal oxide and a lubricant are present as impurities on a surface of the metal. The second resin component is ... 04/06/06 - 20060071202 - Photosensitive paste composition A photosensitive paste composition comprising conductive powders, an inorganic binder and an organic vehicle wherein the conductive powders comprise metal-coated powders is provided. According to the present embodiments, a photosensitive paste composition that has excellent properties such as excellent workability, anti-deterioration, high conductibility and anti-oxidation and an electrode pattern and ... 03/02/06 - 20060043346 - Precursor compositions for the deposition of electrically conductive features A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a viscosity of at least about 1000 centipoise and can be deposited by screen printing. The precursor composition also has a low conversion temperature, enabling the deposition and ... 12/22/05 - 20050279970 - Spherical silver power and method for producing same A spherical silver powder which has a good dispersibility and which is capable of obtaining a good degree of sintering even if it is used for forming a paste to be fired at a low temperature of 600° C. or less to form a conductor. An aqueous solution containing a ... 10/06/05 - 20050218382 - Uphill screen printing in the manufacturing of microelectronic components Method for screen printing a continuous structure on a substrate wherein the screen printed structure extends from at least a first level to at least a second level. The disclosed method is particularly suitable for the fabrication of microelectronic devices and components thereof including the fabrication of field emission display ... 09/22/05 - 20050205851 - Organic-inorganic compositie magnetic material and method for manufacturing same The present invention provided a method for manufacturing an organic-inorganic composite magnetic material which has organic radical molecules chemisorbed on the surface of a metal substance and exhibits super-paramagnetism or ferromagnetism. An ionic salt of a metal allowing thiol to be absorbed thereon is reduced with a reducing agent in ... 09/08/05 - 20050194577 - Conductive silver paste and conductive film formed using the same A conductive silver paste according to the present invention comprises epoxy resin, flake-shaped silver powders having an average particle diameter of 0.5 to 50 μm, and spherical silver powders, each having its surface coated with organic matter, having an average particle diameter of not more than 1 μm, and a ... 06/09/05 - 20050121657 - Thick film conductor compositions for use in membrane switch applications The present invention relates to a thick film conductor composition comprising: (a) electrically conductive silver powder; (b) PVDF/HFP polymer resin, copolymers of a PVDF/HFP polymer resin, and mixtures thereof; dissolved in (c) organic solvent, with the provisos that the PVDF/HFP resin has a melt viscosity of 0.2-0.7 kPoise and a ... ### FreshPatents.com Support |