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Radiant Energy > Photocells; Circuits And Apparatus > Housings (in Addition To Cell Casing) Housings (in Addition To Cell Casing)Housings (in Addition To Cell Casing) patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.11/29/07 - 20070272846 - Image chip package structure and the method of making the same An image chip package structure includes a carrier member, an image sensing die, a protective shield and a plurality of wires. The image sensing die has a side connected to the carrier and an opposite side with an image sensing region and a plurality of die bonding pads around the ... 11/08/07 - 20070257187 - Light sensor protection and method for protecting a light sensor A light sensor protection system and method protects a light sensor system from a laser threat. The light sensor system has a sensor housing which contains optical elements disposed within the sensor housing and at a first end of the housing to converge light rays entering the housing at a ... 10/18/07 - 20070241272 - Image sensor package structure and method for manufacturing the same An image sensor package structure includes a substrate, a chip, a plurality of wires, and a frame layer. The substrate has an upper surface, which is formed with first electrodes, and a lower surface, which is formed with second electrodes corresponding to electrically connect to the first electrodes. The chip ... 09/13/07 - 20070210246 - Stacked image sensor optical module and fabrication method An optical module includes a substrate, a spacer coupled to the substrate, at least one electronic component, e.g., a passive component, coupled to the substrate, and an image sensor coupled to the spacer. The spacer spaces the image sensor above the at least one electronic component. ... 08/23/07 - 20070194220 - Angled ccd image capture device A handheld imaging device includes a CCD array or similar detector which is tilted with respect to the incoming light. The tilt permits a narrower handheld device to be manufactured, as the housing need not be as wide as the CCD or similar array. ... 08/09/07 - 20070181792 - Semiconductor device and manufacturing method of the same A semiconductor device, includes a semiconductor substrate having a main surface where a light receiving element area is formed; a projection part provided in the periphery of the light receiving element area on the main surface of the semiconductor substrate; an adhesive material layer provided in the external periphery of ... 08/02/07 - 20070176086 - Image sensing devices, image sensor modules, and associated methods The present invention relates to image sensing devices, image sensor modules, and associated methods. One aspect of the invention is directed toward an imaging device that includes a carrier having a first surface, a second surface generally opposite the first surface, and carrier contacts. The carrier contacts are carried on ... 07/12/07 - 20070158537 - Package for image sensor and identification module A package for an image sensor and an identification module is disclosed. The package for image sensor and identification module includes a substrate having an image sensing device, a central processor and a memory thereon and a holder having a window which is onto the image sensing device, wherein the ... 07/05/07 - 20070152148 - Package structure of image sensor device An image sensor package mainly includes a substrate cover having a chip cavity, an image sensor chip, a flexible circuit, and a transparent carrier. The flexible circuit is attached to the transparent carrier. The image sensor chip is flip-chip mounted on the flexible circuit, and then the substrate cover is ... 07/05/07 - 20070152147 - Camera module fabrication method An image sensor package includes an image sensor, a window, and a molding, where the molding includes a lens holder extension portion extending upwards from the window. The lens holder extension portion includes a female threaded aperture extending from the window such that the window is exposed through the aperture. ... 07/05/07 - 20070152146 - Assembling structure for a solid image pickup device An assembling structure for a solid image pickup device in accordance with the present invention is mounted on a substrate and comprises a mounting base, a lens tube and an adhesive material. The adhesive material is arranged on the bottom surface of an engaging recess of the mounting base. When ... 06/28/07 - 20070145255 - Lens-equipped light-emitting diode device and method of manufacturing the same A lens-equipped light-emitting diode device of the present invention includes a lead frame in which an electrode is formed, a light-emitting diode which is mounted on the electrode of the lead frame, an outer peripheral unit which is made of a first resin, which is provided on the lead frame, ... 06/28/07 - 20070145254 - Packaging method for an assembly of image-sensing chip and circuit board A packaging method for an assembly of image-sensing chip and circuit board, including steps of: preparing a module circuit board having several leads and module circuits on a surface, an image-sensing chip being mounted on the circuit board, wires being bonded from the image-sensing chip to the leads to electrically ... 06/14/07 - 20070131856 - Holder for optical modules, optical module and optical connector An optical module holder in which an optical transmission line attaching section for attaching an end section of a light transmission line, a photoelectric element attaching section for attaching a photoelectric element including at least one of a light-emitting element or a light-receiving element, and a wall section connecting the ... 05/31/07 - 20070120050 - Imaging apparatus In an imaging apparatus constituted of a case body for mounting an imaging device and a flexible substrate bonding to an external connection terminal provided on the case body, the flexible substrate is bent along each face of case body 41 so as to surround case body 41. By bending ... 05/03/07 - 20070096020 - Method of fixing an optical element and method of manufacturing optical module In the optical element fixing method, when optical element 10 is adhesively fixing member 20 by using the optical-curing adhesive, the optical-curing adhesive is applied on at least one of the adhesion sections of the optical element and the adhesive section of the fixing member, and the optical-curing adhesive is ... 04/26/07 - 20070090284 - Image sensor package structure An image sensor package structure includes a substrate having an upper surface, which is formed with equal amount of the first electrodes arranged at the each side of the upper surface, each the first electrode of the adjacent side of the substrate is corresponding electrically connected each other, so that ... 04/12/07 - 20070080289 - Light tester for vehicles, preferably for motor vehicles The measurement head is equipped with the ray selection unit, which is entered by the rays emitted by the light unit under test. These rays enter the passages and are detected by the ray detection unit when they exit the ray selection unit. Said ray detection unit provides signals corresponding ... 04/05/07 - 20070075238 - Method for assembling an optical transducer element, and optical transducer element assembled by the method An optical transducer device including an optical transducer element having preliminary and fine-adjustment openings, a printed circuit board, a motor shaft, a hub mounted to the motor shaft, and a sensor/emitter element that forms a sensor gap. The optical transducer element is positioned by, pre-positioning the shaft in the preliminary ... 04/05/07 - 20070075237 - Optical fiber assembly wrapped across gimbal axes A control mechanism pins an optical fiber assembly on and off gimbal and between gimbals to route the assembly from an off-gimbal optical source across the gimbal axis/axes to an on-gimbal optical element so that the fiber assembly moves with the rotation of the gimbals. To accommodate a relatively large ... 04/05/07 - 20070075236 - Packaging method of a light-sensing semiconductor device and packaging structure thereof The present invention discloses a packaging method of a light-sensing semiconductor device and a packaging structure thereof, wherein a matrix of spacer walls is formed on a light-sensing wafer, which has multiple light-sensing chips, and the adhesive is directly applied to between two neighboring spacer walls on the non-light-sensing regions. ... 04/05/07 - 20070075235 - Packaging structure of a light-sensing element with reduced packaging area The present invention discloses a packaging structure of a light-sensing element with reduced packaging area, wherein the central line of the light-sensing element coincides with the central line of the substrate in order to save the area expended in the conventional technology owing to that the central line of the ... 03/22/07 - 20070063136 - Optical module An optical module (100) includes a lens barrel assembly (10), at least one lens (20), a filter (50), and a securing mechanism. The lens barrel assembly includes a first barrel (12) and a second barrel (14). The second barrel includes a clapboard (142) extending from an inner periphery thereof. The ... 03/22/07 - 20070063135 - Image sensing device package structure An image sensing device package structure is formed by using a base and a light transparent layer to package an image sensing device. The image sensing device is electrically connected to metallization traces on the base by means of wire bonding. Through change of the positions of the metallization traces, ... 03/15/07 - 20070057169 - Package structure for an optical sensor The present invention relates to a package structure for an optical sensor having a base set with the plurality of metallization traces on its upper and under surface and several conductors passing through the base electrically connects to the plurality of metallization traces on the surface; at least one optical ... 03/08/07 - 20070051885 - Automotive vehicle image sensor An image sensor has an imager die onto which is adhered an optical spacer. The imager die and optical spacer may be supported by a dam-and-fill construction which allows light to pass through the optical spacer and onto the imager die. The image sensor may generate control signals for use ... 02/08/07 - 20070029472 - Light emitting and receiving integrated device and optical disk apparatus A light emitting and receiving integrated device is disclosed wherein a light emitting element can be sealed with a sufficiently high degree of air-tightness. The light emitting and receiving integrated device includes a package body, a light emitting element mounted on a first face side of the package body, and ... 01/25/07 - 20070018088 - Sensor semiconductor device and fabricating method thereof A sensor semiconductor device and a fabrication method thereof are provided. The fabrication method includes mounting a sensor chip on a surface of a substrate; forming a transparent cover on the sensor chip; forming a dielectric layer and a circuit layer on the substrate, wherein the sensor chip is electrically ... 01/04/07 - 20070001113 - Housing for sensor A housing 200 for securing a photo sensor 405 where the housing includes a lower body 211 configured to selectively engage a base 203 at one of a multiplicity of angular rotations relative to the base and an upper body 209 configured to hold the photo sensor. In various embodiments, ... 12/28/06 - 20060289733 - Stack-type image sensor module An image sensor module includes an image-sensing unit having a first surface, a second surface and a plurality of first conductive contacts arranged at the second surface, a signal processing unit mounted on the first surface of the image-sensing unit and provided with a plurality of second conductive contacts respectively ... 12/21/06 - 20060284064 - Door assembly for a semi-automatic micro-hole plate single-photon counter The present invention relates to a door assembly provided on the housing of a semi-automatic micro-hole plate single-photon counter, said door assembly being mounted on a door opening being cooperated with the door opening to open it or close it so as, said door assembly comprising a door shaft, a ... 12/14/06 - 20060278821 - Optoelectronic component Provided are optoelectronic components which include an optoelectronic device mounted on a silicon substrate and a flexible circuit electrically connected to the optoelectronic device. ... 12/14/06 - 20060278820 - Semiconductor module An image sensor module is composed of a base, a CCD image sensor, a glass plate, and a gasket. The base has a chip chamber with an opening, in which the CCD image sensor is contained. The glass plate is bonded by an adhesive layer to a top surface of ... 12/07/06 - 20060273249 - Image sensor chip package and method of manufacturing the same An image sensor chip package (200) includes a base (20), an image sensor chip (23), a plurality of wires (24), an adhesive means (26) and a cover (28). The base has a top surface (201) and a plurality of top pads (204) arranged on the top surface. The image sensor ... 11/30/06 - 20060266939 - Optical sensor An optical sensor includes a light receiving device disposed in a housing, an exterior filter rotatably mounted to an attachment surface of the housing, and a light intercepting member which rotates along with a rotation of the exterior filter to adjust an amount of light incident on a light receiving ... 11/30/06 - 20060266938 - Optical die-down quad flat non-leaded package An optical sensor package that includes an optical sensor die is mounted by flip chip interconnect onto a lead frame in a “die-down” orientation, that is, with the active side of the optical sensor die facing the lead frame. An opening is provided in the lead frame die paddle (pad), ... 11/16/06 - 20060255253 - Method for packaging an image sensor die and a package thereof A method and package for packaging an image sensor die utilizes a substrate having a concave space and an opening to connect the image sensor die with the substrate by SMT method. This method can reduce the manufacturing process of packaging the image sensor. The packaging method comprises providing a ... 11/02/06 - 20060243896 - Packaging structure of a light-sensing element and fabrication method thereof The present invention discloses a packaging structure of a light-sensing element and a fabrication method thereof, wherein the light-sensing chip is installed on the substrate, and then a cleaning step is undertaken; next, a light transparent cover with a cavity is installed to the substrate with a glue material in ... 10/19/06 - 20060231750 - Image sensor module package An image sensor module package is disclosed. A plurality of connecting pads are formed on a first surface of a glass substrate having and located outside a light entering area. A via-redistribution layer is formed on an opposing second surface of the glass substrate. A plurality of vias penetrate the ... 10/19/06 - 20060231749 - Optical-based sensing devices The present invention provides an electro-optical sensing device for detecting the presence or concentration of an analyte. More particularly, the invention relates to (but is not in all cases necessarily limited to) optical-based sensing devices which are characterized by being totally self-contained, with a smooth and rounded oblong, oval, or ... 10/05/06 - 20060219885 - Optical device module A screw portion is provided on an image sensing unit, a screw hole portion to be engaged with the screw portion is provided on an optical path delimiter, and the screw portion and the screw hole portion are engaged together to thereby fix the image sensing unit and the optical ... 10/05/06 - 20060219884 - Optical device module, and method of fabricating the optical device module An optical path delimiter having a lens is disposed so as to be in contact with a transparent lid bonded to a surface of a solid-state image sensor, and is fixed without bonded. Further, the solid-state image sensor to which the transparent lid is bonded, the optical path delimiter disposed ... 10/05/06 - 20060219883 - Spread illuminating apparatus of side light type There is provided a spread illuminating apparatus including a light guide plate, and an LED structure which is disposed at a side surface of the light guide plate, includes: a substrate having electrode patterns formed thereon; an LED chip disposed on the electrode patterns; and a light-transmittable resin adapted to ... 10/05/06 - 20060219882 - Lens assembly A lens assembly for obtaining an image of an object is provided. The lens assembly includes a lens device receiving a reflected light from the object, a circuit board carrying thereon the lens device, a spacer mounted on the circuit board, and a sensor mounted on the spacer, receiving the ... 09/21/06 - 20060208183 - Tester for optical device A tester according to the present invention can conduct a test on optical devices each having a different positional relation between a position of a contact face of an external contact terminal and a direction of light emitted from a semiconductor laser element. ... 09/21/06 - 20060208182 - Solid-state image sensing device A solid-state image sensing device has a printed board; a solid-state image sensing element fixed to the printed board; and a light-transmitting lid section fixed to the solid-state image sensing element so as to cover an image sensing area (effective pixel area). The printed board has a bore which penetrates ... 09/21/06 - 20060208181 - Semiconductor package A semiconductor package includes a base plate; a sidewall provided at a periphery of the base plate; a sensor chip retained in a chip accommodation space defined by the sidewall; and a chip installation hole provided in the base plate for installing the sensor chip. The sensor chip is disposed ... 09/14/06 - 20060202117 - Case for accommodating solid-state imaging device and solid-state imaging apparatus This solid-state imaging device comprises a rib integrally formed with a bottom plate. A case for accommodating a solid-state imaging device, which can suppress warping from occurring at the time of molding the case and is less deformable by heat at the time of mounting is provided. The solid-state imaging ... 09/07/06 - 20060197014 - Cartridge type solid-state image pickup apparatus Cartridge type solid-state image pickup apparatus, which is used to photograph a digital image while it is attached to a film camera instead of a film, comprises: a housing having a shape of a cartridge from which the film is drawn by a predetermined length; and a solid-state imaging element ... 07/27/06 - 20060163462 - Localized hermetic sealing of a power monitor on a planar light circuit A photodetector for power monitoring purposes may be positioned directly on a planar light circuit. The photodetector may be protected by hermetically sealing a localized region over the planar light circuit corresponding to the position of the photodetector. The remainder of the planar light circuit may remain unsealed. ... 07/27/06 - 20060163461 - Image sensor module An image sensor module includes: a substrate having an opening; an image sensor, attached to a lower surface of the substrate, for performing an image detection and includes a light receiving part exposed through the opening; and a transparent member including a base part and a projecting part formed to ... 05/25/06 - 20060108519 - Enhanced flat-panel display photosensing apparatus and method thereof A display photosensing apparatus and/or system for precision sensing of emitted light including a reflector unit configured to have at least one first hole, and a first photosensitive element disposed behind the reflector unit for receiving a light passing through the at least one first hole, can increase the sensitivity ... 05/25/06 - 20060108518 - Structure for calibrating packaging of electric micro-optic modules The present invention relates to a structure for calibrating the alignment between a lens set and an image sensor in the process of packaging such as an electric micro-optic module (EMOM) or compact camera module (CCM) by using a matching structure like sawteeth or V-grooves at contact surfaces or edges. ... 04/27/06 - 20060086900 - Connector Terminal fittings (21A, 21B) are inserted into cavities (45) of a housing (40) and are locked by locks (28). A cover (70) is mounted on the rear of the housing (40), and is locked by cover locks (60). The cover (70) functions as a retainer by engaging rear surfaces of ... 04/27/06 - 20060086899 - Structure of image sensor package An image sensor package comprises a carrier, an image sensor chip, and a transparent substrate where the carrier has a chip cavity and a plurality of first pads formed around the chip cavity. A plurality of bonding pads are formed on the active surface of the image sensor chip. The ... 03/23/06 - 20060060765 - Photosensitive bonding package structure A photosensitive bonding package structure mainly comprising a substrate, a photosensitive device and a plurality of bumps is provided. The substrate has a light incident area located near the central area of the substrate. The photosensitive device has a photosensitive area in a position corresponding to the light incident area ... 03/16/06 - 20060054802 - Self-adjusting lens mount for automated assembly of vehicle sensors A two piece lens mount system for mounting a lens in correct focus and alignment relative to a CMOS imaging device such that the optical axis of the lens is coincident with and perpendicular to the center of the active area of the imager array. The lens is secured by ... 03/02/06 - 20060043278 - Vcsel pin sensor A vertical cavity surface emitting laser (VCSEL) operable as a signal emitter and a silicon photodetector adapted for receiving light signals co-mounted in a common canister. Also containable is a four lead header and an isolating ceramic spacer. The canister can be electrically connected to a first lead from the ... 03/02/06 - 20060043277 - Integrated ball grid array optical mouse sensor packaging A compact optical sensor package for use in an optical mouse. The optical sensor package includes a chip enclosure which is physically and electrically bonded to a main circuit Board using Ball Grid Array (BGA) technology. The chip enclosure includes a windowed cover having a window, and a base board ... 02/09/06 - 20060027740 - Snap lid camera module An image sensor package includes a molding having a locking feature. The package further includes a snap lid having a tab, where the tab is attached to the locking feature of the molding. To form the image sensor package, a window is placed in a pocket of the molding. The ... 01/26/06 - 20060016973 - Multi-chip image sensor package module A multi-chip image sensor package module includes a substrate having an opening, an IC chip, an image sensor chip and a glass cover. The IC chip includes a plurality of bumps on its mounting surface to mount on the lower surface of the substrate. The glass cover is disposed above ... 01/12/06 - 20060006321 - Optoelectronic component Provided are optoelectronic components which include an optoelectronic device and a structure for self-aligning the optoelectronic device. Also provided are optoelectronic modules and methods of forming optoelectronic components. ... 01/12/06 - 20060006320 - Optoelectronic component Provided are optoelectronic components which include an optoelectronic device and a structure for self-aligning the optoelectronic device. Also provided are optoelectronic modules and methods of forming optoelectronic components. ... 01/12/06 - 20060006319 - Light sensor configurations for automatic vehicle equipment control The inventive sensor device includes a support structure, a sensing element mounted on the support substrate for sensing optical radiation and generating an electrical output signal in response thereto, and an encapsulant encapsulating the sensing element on the support structure. The encapsulant being configured to define a lens portion for ... 01/05/06 - 20060000971 - Intelligent sensory platform for wireless two-way sensory surveillance A intelligent surveillance platform is provided with wireless two-way sensory surveillance in environments wherein the entire surveillance unit and its supporting structure fit within a standard light switch junction box and otherwise also functions as a light switch. The platform serves as a sensory ‘edge-of-network’ subsystem for use with a ... 01/05/06 - 20060000970 - Photon energized cavity and system In a first exemplary embodiment of the invention, an externally and photonically energized unit comprises a shaped resonant cavity, with selected material for converting the incident photons into other electromagnetic radiation for resonance within the cavity; and a pick-up element for receiving and applying the resonant electromagnetic radiation to one ... 12/22/05 - 20050279923 - Lens mount integrated with a thermoelectrically cooled photodetector module An integrated housing for a lens and a photodetector, which is being cooled to low temperatures to enable the detector to detect faint emission of photons. An enclosure is provided to which a lens is affixed from one side using a retaining ring, and a photodetector is affixed from the ... 12/15/05 - 20050274883 - Imaging and electronic apparatus An imaging apparatus is provided having a transparent module with a lens unit, a holding module, and an image sensor. ... 12/15/05 - 20050274882 - Optical device and method for fabricating the same An optical device comprises a copper plate having an opening; a flexible board placed below the copper plate; a light receiving element substrate placed below the copper plate and mounted on a wiring pattern of the flexible board via bumps; a light emitting element and a light receiving element both ... 11/24/05 - 20050258351 - Light filtering image sensor A method and apparatus for directing light to a light sensor and filtering out an infrared component from the directed light. In one embodiment, the apparatus includes an array of light sensors disposed on a substrate, wherein the light sensors are operable to convert light intensity into a voltage signal. ... 11/24/05 - 20050258350 - Optoelectronic semiconductor device and method of manufacturing such a device The invention relates to a semiconductor device (10) comprising a semiconductor element (1), particularly a solid-state image sensor (1), comprising a semiconductor body (11) of which one surface comprises an optically active part (1A) and an optically inactive part (1B) within which electrical connection regions (2) of the optoelectronic semiconductor ... 11/17/05 - 20050253058 - Optical navigation sensor with integrated lens An optical navigation sensor apparatus for an optical mouse includes an optical navigation sensor having an electronic chip, an aperture plate and an imaging lens integrated into a single package. The imaging lens includes a lens housing surrounding the aperture and providing a barrier to the entry of foreign matter ... 11/17/05 - 20050253057 - Microprocessor based automatically dimmable eye protection device with interruption prevention An auto darkening eye protection device comprising a shutter assembly adjustable between a clear state and a dark state and a control circuit. The control circuit is provided with a microcontroller, a delivery circuit, a sensing circuit and a weld detect circuit. The microcontroller is switchable between a sleep mode ... 11/10/05 - 20050247865 - Status indicator for a controller A controller housing for use with a controller that may include a location for a status light emitting source. The controller housing may be adapted to hide from view the location for the status light emitting source when the status light emitting source is not present and/or when the status ... 11/03/05 - 20050242274 - Camera module An image sensor package includes an image sensor, a window, and a molding, where the molding includes a lens holder extension portion extending upwards from the window. The lens holder extension portion includes a female threaded aperture extending from the window such that the window is exposed through the aperture. ... 10/27/05 - 20050236562 - Assembly with self-alignment features to position a cover on a substrate that supports a micro component The substrate includes an alignment slot in at least one of its side edges, and includes metallization coupled electrically to the micro component and extending from the front surface of the substrate to its back surface via at least one of the alignment slots. The assembly also includes a cover ... 10/13/05 - 20050224707 - Imager Assembly of sensors formed as an imager with a detection brick including a photosensitive material, a brick for addressing and optionally processing signals from the sensor(s), an interconnection brick located between the detection brick and the addressing brick, this brick including connection pads, characterized in that the photosensitive material of ... 10/06/05 - 20050218317 - Optoelectronic component Provided are optoelectronic components which include an optoelectronic device and a structure for self-aligning the optoelectronic device. Also provided are optoelectronic modules and methods of forming optoelectronic components. ... 09/29/05 - 20050211888 - Solid state imaging device A solid state imaging device is constituted of an image sensor chip, a circuit board, and an electromagnetic-wave absorber formed of copper. The image sensor chip is constituted of a bare chip, a spacer, and a cover glass. First contact terminals are formed on the bare chip, and second contact ... 09/22/05 - 20050205771 - Optoelectronic component Provided are optoelectronic components which contain an optoelectronic device and an encapsulant. ... 09/15/05 - 20050199792 - Optical sensor An optical sensor for detecting objects within an area to be monitored comprises at least one casing to accommodate optical and electronic components. The at least one casing comprises casing parts. The casing parts are composed of a low-pressure injection molding compound and are formed by a low-pressure injection molding ... 09/01/05 - 20050189481 - Lens module and camera A lens module has a plurality of lens units which have focal lengths different from each other; an imaging device which focuses a subject light passing through one lens unit selected from the plurality of lens units on a common imaging plane to conduct photoelectric conversion; and a lens base ... 08/11/05 - 20050173626 - Fastening base for mounting an electric device The invention relates to a fastening base for mounting an electrical device, particularly an electric sensor or proximity switch, having a reception opening for receiving a connecting piece of the electrical device and with a locking pivoted lever for fixing the connecting piece in the reception opening, the locking pivoted ... 08/04/05 - 20050167579 - Positioning structure of plane image input apparatus A positioning structure of plane image input apparatus comprises a hollow body, carrying scanned documents and setting a correct picture on outer and inner opposite sides, and an optical module inside the body moving back and forth. The optical module has a correct light source to emit light, a correct ... 06/30/05 - 20050139757 - Pixelated cadmium zinc telluride based photon counting mode detector A radiation detector for detecting radiation such as x-rays. The radiation detector includes a detector having a plurality of pixels, wherein each of the pixels is used for detecting the radiation. The radiation detector also includes a ball grid array (BGA) package having a plurality of solder balls formed on ... 06/16/05 - 20050127281 - Method and apparatus for manufacturing a transistor-outline (to) can having a ceramic header A transponder comprises a first TO having a first insulating base, a photodetector mounted on a first side of the first insulating base, and a metal cap hermetically sealed to the first side of the first insulating base to enclose the photodetector. The transponder also comprises a second TO can ... ### FreshPatents.com Support |