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Metal Fusion Bonding > Process ProcessProcess patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.01/31/08 - 20080023528 - Fabrication method and structure of pcb assembly, and tool for assembly thereof A fabrication method and structure for a PBCA, and tool for assembly of the structure. The structure includes a circuit board, at least one first solder joint, a plurality of second solder joints, and an electronic device. The circuit board has a solder mask, having a plurality of openings exposing ... 01/10/08 - 20080006677 - Rotary tool for friction stir spot welding and method of friction stir spot welding using the same A rotary tool for friction stir spot welding including: a rod-like probe to be inserted into one side of stacked planar portions of plural metal members to be joined while being rotated; and a cylindrical shoulder member which is disposed coaxially outwardly of the probe and which has a shoulder ... 12/13/07 - 20070284418 - Package structure of inverter apparatus and method of manufacturing the same A package structure of an inverter apparatus includes at least four metal column supports arranged vertically to be spaced apart from each other, and sheet-metal bent beams connecting the column supports in transverse direction and longitudinal direction to form rectangular package structure. The metal column support is an aluminum die-cast ... 12/13/07 - 20070284417 - Reflow furnace In a second horizontal plate (18a) bottoming an atmosphere recovery box (18), there are formed circular holes (21) between blowout pipes (20) adjacent to each other. Each of partition walls (2) positioned above a conveyor (5) includes an upper portion formed from a heat-insulating wall (2a) including a heat-insulative material ... 12/13/07 - 20070284415 - Semiconductor having a bonding wire and process A semiconductor device having a bonding wire is disclosed. In one embodiment, it is a bonding wire for use in a wedge-wedge bonding process for bonding a semiconductor element. One embodiment includes a metallic wire core of greater hardness and a high electric and thermal conductivity and a metallic coating ... 12/13/07 - 20070284411 - Investment casting core assembly In a method for manufacturing a combination investment casting core, a plurality of cores are each formed by cutting a metallic sheet to define a first portion and a number of separate second portions linked by the first portion. The second portions are bent out of local alignment with the ... 11/15/07 - 20070262119 - Wire bonding process for insulated wires A process for bonding insulated wires is provided wherein a conforming free air ball is formed from an insulated wire to create a ball bond. A tip of the insulated wire is first positioned close to an electronic flame-off device and a first electric discharge is produced from the electronic ... 11/15/07 - 20070262117 - Earth/ground attachment for welding and cutting equipment A contact assembly for mounting to a clamp to provide an earth/ground connection for arc equipment, the assembly comprising an outer metal housing providing a mounting body of generally cylindrical form, a solid metal contact block mounted within the body and extending through an open end of the body to ... 10/25/07 - 20070246511 - Conductive bonding material fill techniques A system, method, and apparatus of providing conductive bonding material into a plurality of cavities in a circuit supporting substrate is disclosed. The method comprises placing a fill head in substantial contact with a circuit supporting substrate. The circuit supporting substrate includes at least one cavity. A linear motion or ... 10/25/07 - 20070246510 - Rotating type soldering device A rotating type soldering device is used for soldering a heat pipe and includes a transmission mechanism having a transmission platform on which heat pipes are disposed and transmitted. A rotation mechanism and a material-sending mechanism are arranged on topside and bottom side of the transmission platform The rotation mechanism ... 10/18/07 - 20070241165 - Thermoconductimetric analyzer for soldering process improvement Performance of a flux in a soldering process is assessed by monitoring the activity of the flux via its electrical conductance measured using a probe having interdigitated metallic traces and a temperature sensor. The measured conductance-temperature time profile provides information useful for selecting a suitable flux formulation and soldering conditions ... 10/18/07 - 20070241164 - Perforated composites for joining of metallic and composite materials Embodiments in the present invention provide a system and method of joining structural members. This method involves aligning the first structural member to a metallic substrate when the first structural member has at least one tapered hole or cavity. A metallic or other like material suitable to cold spraying technology ... 10/11/07 - 20070235502 - Condenser microphone An electronic device suitable for a condenser microphone includes: first and second electrodes; and a housing defining an accommodating space for receiving the first and second electrodes therein and having a base that confines one side of the accommodating space and that has an outer surface which is provided with ... 10/11/07 - 20070235501 - Self-packaging mems device Microelectronic packages are disclosed. In one aspect, a microelectronic package may include a substrate, a cap layer over the substrate, and a sealed chamber defined between the substrate and the cap layer. The package may include one or more openings to the sealed chamber that are closed by a reflowed ... 10/11/07 - 20070235500 - Room temperature joining process with piezoelectric ceramic-activated reactive multilayer foil Apparatus comprising a multilayered reactive foil preform including alternating layers of first and second materials deposited on foils. The layers also include piezoelectric ceramic particles to provide an electrical stimulus when pressure is applied to activate an exothermic reaction between the first and second materials. ... 10/04/07 - 20070228106 - Process and device for form locked joining of two components A process is described for form locking joining of two components through plastic deformation of one of the two components. In order for the tool for forming the form locking connection not to get in direct contact with the plasticized area of the joining partners, a third component between the ... 10/04/07 - 20070228105 - Solder layer and electronic device bonding substrate and submount using the same A solder layer and an electronic device bonding substrate using the layer are provided which avoid deteriorating qualities of the electronic device to be bonded. In a solder layer 14 free from lead and formed on a substrate 11 or an electronic device bonding substrate 10 having such a solder ... 10/04/07 - 20070228104 - Friction stir welding spindle assembly A friction stir welding system is provided that can afford a versatile and efficient welding operation. The friction stir welding spindle assembly can have a shoulder spindle and a pin spindle independently rotatable in relation to each other. The shoulder spindle and the pin spindle can be rotatably supported by ... 09/27/07 - 20070221709 - Ultrasonic welding method, ultrasonic welding device and pipe joined by the same An ultrasonic welding method and an ultrasonic welding device are provided to join a first member having a substantial pipe shape and a second member at a joining surface by pressure-applying and vibration-exciting. In an arranging process, each of a first horn member and a second horn member is slantways ... 09/27/07 - 20070221708 - Method of brazing pipe member to counterpart member This invention is intended to provide a method of brazing the pipe member to the counterpart member, in which the pipe end portion of the pipe member and the counterpart member can be certainly secured by brazing at the desired position while this brazing operation is performed at a low ... 09/27/07 - 20070221705 - Buttered welding of superalloys Disclosed herein is a method of welding superalloy articles. A buttered layer is attached to a first article formed from a superalloy. A buttered layer is attached to a second article formed from a superalloy. Residual stresses are relieved between the buttered layer and the superalloy. Matching faying surfaces are ... 09/27/07 - 20070221704 - Method of manufacturing circuit device A method of manufacturing a circuit device of the present invention comprises the steps of: forming a conductive pattern including a first pad and a second pad on the surface of a substrate; applying a solder paste to the surface of the first pad and then thermally melting the solder ... 09/20/07 - 20070215674 - Method of brazing an aluminum alloy material and method of producing an aluminum alloy heat exchanger in which Tf represents an incipient fluidization temperature of a filler material, and Ts represents an incipient fluidization temperature of flux. ... 09/20/07 - 20070215672 - System for removal of an integrated circuit from a mount material A system for removal of an integrated circuit from a mount material including holding and stretching the mount material using linear and rotary motion, and removing the integrated circuit from the mount material when the mount material is stretched by linear and rotary motion. ... 09/13/07 - 20070210138 - Circuit board pallet with magnetized pins The circuit board pallet comprises one or more flat metallic spring arms positioned over magnetized pins. The magnetized pins comprise a magnetic material, such as steel. The magnetized pains contact a permanent magnet embedded inside or attached under the pallet. The metallic spring arms comprise a flexible magnetic material, such ... 09/13/07 - 20070210137 - Base dispensing tool for tube supports and method of utilizing same A tool (62) retains a plurality of bases (36) for tube supports (30). Each base (36) includes a body (44) having a finger (52) extending into an interior (46) of the body (44) and a foot (54) extending outwardly from the body (44). The tool (62) includes a rod (64) ... 09/06/07 - 20070205251 - Soldering structure of through hole A through hole is formed in a printed board. Conductor patterns are formed on an upper face and a lower face of the printed board in such a manner that the conductor patterns are electrically connected to each other, by means of a through hole solder. A lead terminal of ... 09/06/07 - 20070205250 - Printed circuit board apparatus and method for assembly A surface mounting assembly (SMA) process for manufacturing a printed circuit board (PCB), with the SMA process including the steps of: providing a circuit board with a plurality of metallic pads; depositing solder paste on at least a portion of the plurality of metallic pads; and mounting at least one ... 08/30/07 - 20070199977 - Turbocharger turbine and shaft assembly The present disclosure includes a turbocharger. The turbocharger may include a titanium-aluminide turbine and a shaft. A single joint connects the turbine to the shaft. The joint may include an alloy comprising at least 80 atomic percent nickel and palladium. ... 08/23/07 - 20070194085 - High velocity metallic powder spray fastening The present invention provides a low temperature joining method that is compatible with multiple materials and results in a bond between joined structures without reducing the mechanical properties of the joined structures base materials. The method of the present invention includes the steps of contacting a first structure to a ... 08/23/07 - 20070194084 - Method and system for utilizing an interlocking dissimilar metal component in the formation of a hard disk drive A method and system for utilizing an interlocking dissimilar metal component in the formation of a hard disk drive is disclosed. The method provides a hard disk drive component having at least one interlocking dissimilar metal component, the at least one interlocking dissimilar metal component having at least two dissimilar ... 08/23/07 - 20070194083 - Process and device for soldering in the vapor phase The invention provides a process for soldering in the vapor phase in which after the solder has melted onto the item to be soldered a vacuum is generated around the item to be soldered in the vapor phase. Also provided is a device for soldering in the vapor phase comprising ... 08/16/07 - 20070187465 - Thermally enhanced tool for friction stirring A friction stirring tool and a method for removing the catalytic phase from the friction stirring tool having a superabrasive coating by chemically etching, electrolytic etching or similar means to thereby at least partially remove a portion of the secondary catalytic phase metal from the superabrasive coating to thereby enhance ... 08/16/07 - 20070187464 - Joining of advanced materials by plastic deformation A method for utilizing plastic deformation resulting from grain boundary sliding with or without a novel joint compound that leads to the joining of advanced ceramic materials, intermetallics, and cermets. A joint formed by this approach is as strong as or stronger than the materials joined. The method does not ... 08/16/07 - 20070187462 - Method of manufacturing a brazed assembly The present invention relates to a method of manufacturing a shaped product by means of brazing. The method includes the steps of: producing an intermediate object of metal by rolling or extrusion and having at least one flat surface, coating the at least one surface with a brazing composition comprising ... 08/16/07 - 20070187461 - Welding shielding dam for automated welding of impellers and blisks A dam is provided for localizing gas around an outer periphery of an impeller. In one embodiment, by way of example only, the dam includes a skirt, a flange, and a fastener. The skirt includes an inner section, an outer section, and an outer peripheral edge. The inner section is ... 08/16/07 - 20070187459 - Novel method and a novel combined device for performing a pre- and postbrazing temperature controlled martensit-free brazing process using a controlled brazing temperature The present invention (FIG. 1) relates to a new formula-controlled method of joining by brazing a connecting piece with a workpiece where the temperature is controlled during all phases of the process before, during and after the brazing temperature phase so that adverse structural changes of the work material (martensite ... 08/09/07 - 20070181652 - Bond capillary design for ribbon wire bonding A device (100) and method (200) for bonding a ribbon wire (104) to a workpiece (106) comprising feeding the ribbon wire through a passageway (116) of an ultrasonic bond capillary (102) and clamping the ribbon wire against an engagement surface (120) of the bond capillary via a clamping jaw (118) ... 08/09/07 - 20070181648 - Electronic device and process for forming same An electronic device includes a substrate, a first organic electronic component overlying the substrate, wherein, from a plan view, the first organic electronic component defines a perimeter of a first pixel area, and at least one post structure, wherein the at least one post structure lies within the perimeter of ... 08/09/07 - 20070181647 - Application of high integrity welding and repair of metal components in oil and gas exploration, production and refining A method for welding and repairing cracks in metal parts is provided by subjecting the metal parts to be welded to friction stir welding and the cracks to be repaired to friction stir processing under conditions sufficient to provide a weld joint or crack repair having a preselected property or ... 08/09/07 - 20070181645 - Wire bonding method and apparatus A wire bonding method and apparatus are provided for electronic components to enable PR processing and wire bonding to be carried out substantially concurrently. The apparatus comprises a bond head carrying a bonding tool for performing wire bonding and a rotary motor coupled to the bond head that is configured ... 08/09/07 - 20070181644 - Component mounting method and component mounting apparatus A method and an apparatus for mounting electronic components that enables precise mounting of electronic components, such as deformation-prone thin IC chips or fine-pitch and high-pin-count IC chips, on a substrate. Thin IC chips, which conventionally tend to lose flatness because of warping that occurs during production or deformation that ... 08/09/07 - 20070181643 - Method and system for weld bead sequencing to reduce distortion and stress In one embodiment, the present invention relates to a method and system of determining the weld bead sequence on a mechanical component is disclosed. In one specific embodiment, the sequence is determined by numerical analysis of a plurality of weld bead sequences to determine the weld bead sequence. Then, after ... 08/09/07 - 20070181641 - Automotive p.s.i.r. milling burr control tape An injection molded plastic instrument panel P.S.I.R. hidden door milling method including applying a stiff tape, having a hardness greater than a hardness of the plastic instrument panel, to a plastic instrument panel surface to be milled to prevent flexing of the surface during milling. The method may further include ... 08/09/07 - 20070181640 - Lead-free solder reworking system and method thereof A lead-free solder reworking method. A solder tank including a nozzle and containing molten lead-free solder is provided. A printed circuit board assembly is placed on the solder tank. The printed circuit board assembly has a printed circuit board and a first electronic member. The printed circuit board has at ... 08/09/07 - 20070181639 - Pressure welding machine and pressure welding method The invention relates to a pressure welding method and a pressure welding machine (1) which is provided with a frame (10), two welding heads (13, 14), mobile along a feed axis (41), and two adjusting units (17, 18) comprising feed drives (23) for the welding heads (13, 14). The two ... 08/09/07 - 20070181638 - Apparatus for cooling and cleaning emission gas generated from reflow furnace This invention provides an apparatus for cooling and cleaning emission gas which does not affect working environment even indoor in processing of emission gas including hot gas (hot wind) and volatile gas generated by heating of flux and can operate stably in a long period without replenishment of cooling water ... 08/09/07 - 20070181637 - Method of friction stir-spot welding and welding apparatus In order to solve the problem, after a tool (1) is inserted into a member (4) to be welded, a rotation shaft of the welding tool is tilted around a predetermined point (13) as a fulcrum, and the tip portion of the welding tool (1) is swung to enlarge a ... 08/09/07 - 20070181636 - Guide element, use of a guide element and method for the production of a guide element Disclosed is a guide element comprising a base body having at least two guide surfaces disposed on various non-parallel planes. In order to provide the guide surfaces disposed on various non-parallel planes with a sliding lining, the guide surfaces are provided with at least one pre-fabricated strip of material consisting ... 08/09/07 - 20070181635 - Forging method forged product and forging apparatus A forging apparatus 1A includes a swaging apparatus 2 equipped with a fixing die 10, a guide 20 having an insertion passage 22 for inserting and holding a bar-shaped raw material 5 in a buckling preventing state, and a punch 30. The raw material 5 is fixed to the fixing ... 07/26/07 - 20070170227 - Soldering method An object of the invention is to provide a high-quality soldering method, by reducing, to a vacuum, the pressure in a vacuum room (2) in which a workpiece (10) having solid solder placed thereon consisting solely of tin or including tin and one or more components selected from silver, lead, ... 07/26/07 - 20070170226 - Ferritic stainless steel welded pipe superior in expandability A ferritic stainless steel welded pipe is ferritic stainless steel welded pipe contains, by wt %, C: 0.001 to 0.015%, N: 0.001 to 0.020%, Cr: 11 to 25%, Mo: 0.01 to 2.0%, one or both of Ti and Nb in 0.05 to 0.5%, and B: 0.0003 to 0.0030%, having an ... 07/19/07 - 20070164085 - Method for applying an isolation layer to a brazed end of a generator armature winding bar A method of forming a brazed joint between an armature bar and a hydraulic header clip including: assembling free ends of hollow strands and of solid strands of the armature winding bar and positioning the assembly within the hydraulic header clip; interleaving a silver based braze alloy between the strands, ... 07/19/07 - 20070164081 - Portable friction forge welder A portable friction forge welder that applies a direct rotational load to workpieces via a rotational actuator and a direct axial load to workpieces via an axial actuator, where the rotational actuator and the axial actuator have separate and independent power sources. The portable friction forge welder relies on a ... 07/19/07 - 20070164080 - Mounting system and method for mounting objects A mounting system and method for mounting objects are provided. The mounting system includes a mounting component having an angled engagement portion configured to an engage an object and a leveling component having an angled portion configured to abuttingly engage the angled engagement portion of the mounting component. The leveling ... 07/19/07 - 20070164079 - Electronic component mounting method, and circuit substrate and circuit substrate unit used in the method An electronic component mounting method comprising: supplying an unhardened reinforcing resin on a circuit substrate; supplying a solder paste on bond areas of the circuit substrate on which electrodes of the electronic components are to be bonded; placing the electronic components on the circuit substrate; and heating and then cooling ... 07/19/07 - 20070164078 - Spin welding device A rotary friction welding system is provided comprising a first rotary spindle (14) and a second dead spindle (15), wherein the first spindle (14) carries a first mutually connectable component (11) and the second spindle (15) carries a second mutually connectable component (12). The rotary friction welding system also comprises ... 07/12/07 - 20070158393 - System for use in tapping a pipe A mechanical weldable fitting for use in tapping a pipe includes a first and second metal collar, each formed of attachable upper and lower semi-toroidal portions that when assembled on the pipe providing spaced-apart external cylindrical surfaces. Each collar having at least one internal circumferential sealing groove therein that receives ... 07/12/07 - 20070158390 - Forge welding tubulars Tubular ends are heated to a predetermined temperature above 1200 degrees Celsius and surrounded by a shield gas when the tubular ends are pressed together to form forge welded tubular ends. The forge welded tubular ends are then cooled down rapidly from said temperature above 1200 to at most 600 ... 07/12/07 - 20070158389 - Turbine element repair fixture A blade processing fixture has first and second jaws. The second jaw is movable relative to the first jaw from a disengaged position for accepting a root of the blade. The blade is accepted in a receiving area between the first and second jaws. The second jaw is movable to ... 07/12/07 - 20070158388 - Apparatus and method for welding superalloys A heating apparatus is provided for use during a welding operation on a component. In one embodiment, the apparatus includes a die having a cavity having at least a portion shaped to complement a first portion of the component and an opening providing a space through which a second portion ... 07/12/07 - 20070158387 - Heater, reflow apparatus, and solder bump forming method and apparatus An apparatus characterized by a feature that in a stage on which a substrate or a jig holding a substrate is mounted, an opening closed when the substrate or the jig is mounted is provided and the substrate or the jig is heated by blowing hot air against the lower ... 07/12/07 - 20070158386 - Aluminium alloy strip for brazing The invention relates to a method for assembling sheets of aluminium alloy, comprising a welding without flux, in a controlled atmosphere, at a temperature of 580 to 620° C. a rapid cooling and, optionally, reheating to a temperature of 80 to 250° C. in which at least one of the ... 07/05/07 - 20070152021 - Ultrasonic transducer comprising a sensor disposed in the mounting The invention relates to an ultrasonic transducer comprising at least one sensor, particularly for use in ultrasonic bonders. At least one sensor (4, 6) is arranged in/on a mounting (2, 3) of the ultrasonic transducer and, in particular, by means of which a transverse extension perpendicular to a propagating exciting ... 07/05/07 - 20070152020 - Optical structures including liquid bumps A liquid prime mover can be used to position a component on a substrate. For example, a liquid material can be provided on the substrate adjacent the component such that the component has a first position relative to the substrate. A property of the liquid material can then be changed ... 07/05/07 - 20070152019 - Solder compositions; method of soldering, and a laminated transparency having bus bars A low temperature solder including indium in the range of 62-65 weight percent and tin in the range of 31-33 weight percent uses the heat generated during thermal treatment of one or more glass sheets to melt the solder. In one non-limiting embodiment, a lead providing external access to an ... 07/05/07 - 20070152018 - Solder-bearing wafer for use in soldering operations According to one embodiment, an electrical connector for electrical connection to a second electronic device having at least one second contact includes a substrate having a first surface and an opposing second surface, with a recess being formed in the first surface. The connect also has a first contact securely ... 06/28/07 - 20070145103 - Electrostatic methods and apparatus for mounting and demounting particles from a surface having an array of tacky and non-tacky areas Methods and associated apparatus are disclosed for use in mounting particles on and de-mounting particles from a substrate having an array of tacky and non-tacky areas. The particles can be either electrically conducting or electrically non-conducting. Selection of electrically conducting particles is preferred. The substrate having an array of tacky ... 06/28/07 - 20070145102 - Method for mounting a flip chip on a substrate The invention concerns a method for mounting a semiconductor chip with bumps on one surface onto a substrate location of a substrate, whereby the bumps are brought into contact with corresponding pads on the substrate location. Reference marks are attached to the bondhead that enable measurement of the actual position ... 06/28/07 - 20070145100 - Low alternating-current loss oxide superconductor and fabricating method thereof The present invention is configured such that, in a low AC loss oxide superconductor constituted by providing an oxide superconducting layer 6 on a substrate 1, said oxide superconducting layer 6 is separated into a plurality of filament conductors 2 in parallel to the lengthwise direction of said substrate 1 ... 06/28/07 - 20070145099 - Particle resonance sensing apparatus for identifying particles suspended in air using ping and ring functions A particle identification detector of airborne particles of interest is contained in a battery operated 4″×4″×1.5″ box. Air is drawn through an internal chamber for analysis by pinging a sampling pad along the chamber with scanning microsecond bursts varying from 2 to 4 gHz. Resultant emf rings received from the ... 06/28/07 - 20070145098 - Can and lithium secondary battery using the same A can for a lithium secondary battery and a lithium secondary battery using the same, where guide slots are formed in a bottom wall and a sidewall of the can of the lithium secondary battery so that the can is symmetrically bent about a longitudinal axis thereof when the lithium ... 06/28/07 - 20070145097 - Carbon nanotubes solder composite for high performance interconnect An embodiment of the present invention is an interconnect technique. Carbon nanotubes (CNTs) are prepared. A CNT-solder composite paste is formed containing the CNTs and solder with a pre-defined volume fraction. ... 06/21/07 - 20070138234 - Technique for stress redistribution A technique for maintaining-designs tolerances and reducing stress during welding of closures on nuclear waste containers. ... 06/14/07 - 20070131734 - Method for the planar joining of components of semiconductor devices and a diffusion joining structure A method for the planar joining of components of semiconductor devices involves coating the components with diffusion materials on their upper sides and rear sides, respectively. Subsequently, the components to be joined one on the other are introduced into a reducing atmosphere. The components are aligned and a compressive pressure ... 06/07/07 - 20070125834 - Solders A substantially lead-free solder, comprising: from around 96.8% to around 99.3% tin; from around 0.2 % to around 3.0% copper; and from around 0.02% to around 0.12% silicon. ... 06/07/07 - 20070125833 - Method for improved high current component interconnections A printed circuit board having at least one conductive region covered in solder paste has preformed solder elements placed on the solder paste in the conductive region. A component package is placed onto the printed circuit board over the conductive region and the solder is reflowed, forming a wide solder ... 06/07/07 - 20070125832 - Machining station and method for producing vehicle bodies A machining station and a method produce vehicle bodies of different types. A clamping station has interchangeable clamping frames, at least one clamping frame magazine, into which the interchangeable clamping frames are deposited when not in use and from which the interchangeable clamping frames are removed when in use, and ... 06/07/07 - 20070125831 - Capillary for a bonding tool A capillary is provided for a wire bonding tool that comprises a holding portion for clamping the capillary, a conical portion at a tip of the capillary for performing bonding and a substantially frustoconical portion located between the holding portion and the conical portion. The sidewalls of the frustoconical portion ... 06/07/07 - 20070125830 - Holding tool for fixing an electronic component and circular table manufacturing unit A holding tool for fixing an electronic component (2) during a manufacturing process, said electronic component (2), comprising a winding assembly (20) and an electronic circuit (24), the holding tool (1) comprising a holding tool body (10), first an second jaws (12, 14) disposed at the holding tool body (10) ... 05/31/07 - 20070119905 - Component mounting tool, and method and apparatus for mounting component using this tool Component 3 is pressed onto a circuit board 4 so that their respective metal interconnects 5, 6 are in close contact with each other, and ultrasonic vibration is applied to the suction nozzle 14 holding the component 3. Friction is thereby generated between metal interconnects 5, 6 whereby the component ... 05/31/07 - 20070119904 - Electrical circuit apparatus An electrical circuit apparatus that includes; a substrate having a top side, a ground layer, at least one thermal aperture, and at least one solder aperture; a heat sink; and an adhesive layer for mechanically coupling the heat sink to the ground layer of the substrate, the adhesive layer having ... 05/24/07 - 20070114266 - Method and device to elongate a solder joint A method and device to elongate a solder joint are provided. The method begins by forming an elongator on a first substrate. The elongator comprises an expander and an encapsulant to encapsulate the expander. A solder joint is formed to connect the first substrate to a second substrate. Thereafter, the ... 05/24/07 - 20070114265 - Supporting device of a transport device of a soldering apparatus The invention relates to a supporting device of the transport device of a soldering apparatus for the conveying of printed-circuit boards with at least two revolving, endless transport chains, said transport chains running in guide rails in the transport zone and each passing through two guide elements at the ends ... 05/17/07 - 20070108255 - Process for the pressureless sintering of metal alloys; and application to the manufacture of hollow spheres Hollow metal spheres are heated in a high vacuum in the presence of an organic substance, at a temperature at least equal to the melting point of a eutectic between carbon and the metallic constituents of the said spheres. ... 05/17/07 - 20070108254 - Circuit board A circuit board (A1) comprises an insulating base board (1), a conductive pad (4a) provided on the base board, and a metal member (3) bonded to the pad via a solder layer (6). The metal member (3) includes a welding portion (3a) to be welded to a terminal (5) for ... 05/10/07 - 20070102491 - Flip chip dip coating encapsulant A method for encapsulating a flip chip in one step is disclosed. The flip chip is immersed in a polymer bath to apply a coating of the polymer to the surface of the flip chip except for the distal end of the conductive projections on the flip chip electrically conductive ... 05/10/07 - 20070102490 - Circuit board,method of mounting surface mounting component on circuit board, and electronic equipment using the same circuit board A through hole 2 in a circuit board 1 and to be joined to a lead 5 in a surface mounting component 6 is prepared from a material such as nickel, and palladium having a thermal conductivity equal to or less than 100 W/m.K, the circuit board 1 involving a ... 05/10/07 - 20070102489 - Ultrasonic welding head An ultrasonic welding head for ultrasonic welding connection of a chip to a substrate is described, in which the welding parameters have a negligibly slight variation or are constant. This is attained by providing that a static friction element that increases the static friction relative to the chip to be ... 05/10/07 - 20070102488 - Method and apparatus for weld profiling A method for removing a weld crown from a weld joint between first and second work pieces includes steps of positioning a rotary milling tool proximate to the joint and at an offset angle to set a cutting arc relative to the joint. The milling tool is positioned so the ... 05/10/07 - 20070102487 - Bonding structure of substrate and component and method of manufacturing the same A bonding structure and method of manufacturing the same are provided. The bonding structure of a substrate and a component include an electrode formed of metal powder and a resin component on the substrate. A low melting point solder that bonds the component to the electrode. The metal powder contains ... 05/10/07 - 20070102486 - Wire embedded bridge A wire embedded bridge made by the apparatus and method disclosed by example herein may be commonly used for the formation of an RFID circuit or chip strap. The process uses flexible polyester and/or other films as a base component of the bridge. A wire is heated and embedded into ... 05/10/07 - 20070102485 - Soldering method and apparatus It is a soldering method for bonding, by solder, each bonding pad formed on respective bonding targets to be bonded to each other. The method comprises the steps of: a pad heating step for irradiating heating beams while the solder is placed on irradiation paths of the heating beams in ... 05/10/07 - 20070102484 - Angled caulking tip attachment A tip attachment for use in dispensing products from tubes or squeeze bottles, such as caulking, sealants, adhesives, lubricants or the like. An elongate tip attaches to a threaded base member, the threaded base member adapted for engagement with a standard straight tip of the product tube. The tip is ... 05/10/07 - 20070102483 - Low temperature diffusion braze repair of single crystal components The present invention is directed to a process for repairing cracks in a turbine engine component. The process comprises the steps of providing a component, preferably formed from a single crystal nickel based material, with at least one crack, applying a repair alloy composition containing a single crystal nickel based ... 05/10/07 - 20070102482 - Assembly of a component mounted on a transfer surface An optical component to be mounted on a transfer surface. At least one face of the optical component includes at least one metallized bonding land arranged in a notch for assembly by transfer of the component and soldering of metallized bonding lands on the transfer surface. ... 05/10/07 - 20070102481 - Solder paste In reflow soldering using a solder paste formed by mixing a flux and a solder powder, the present invention suppresses the formation of voids and prevents the formation of large-diameter voids which have an adverse effect on the reliability of soldering. The flux contains a solder for which the temperature ... 05/10/07 - 20070102480 - Welded connections A method for welding an end of a polygonal hollow section (PHS) to a member comprises the step of forming a weld across a surface of the PHS. The weld extends continuously from a connection weld connecting the PHS and the member to a location remote from the connection weld. ... 04/26/07 - 20070090169 - Cast parts with enhanced wear resistance The invention concerns a cast wear part with its structure reinforced by at least a type metal carbide, and/or metal nitride, and/or boride, and/or metal oxides, and/or intermetallic compounds, referred to below as constituents. The invention is characterized in that the raw materials used as reagents for said constituents have ... 04/26/07 - 20070090168 - Protective coating and coated welding tip and nozzle assembly A coated welding tip and nozzle assembly is disclosed. The tip and the nozzle are coated with a coating composition comprising titanium dioxide. The coating provides resistance to adhesion and accumulation of weld spatter on the nozzle and tip and facilitates weld spatter removal. The coating also protects against thermal ... 04/26/07 - 20070090167 - Weld filler, use of the weld filler and welding process The invention relates to a weld filler and to a use of a weld filler which significantly improves the weldability of some nickel-based superalloys and includes the following constituents (in wt %): 17.5%-20.0% chromium (Cr) 10.0%-12.0% cobalt (Co) 9.0%-10.5% molybdenum (Mo) 0.1%-3.3% titanium, in particular 3.0%-3.3% titanium (Ti), 1.4%-1.8% aluminum ... 04/26/07 - 20070090166 - Microfluidic cell culture device Microfluidic devices for cell culturing and methods for using the same are disclosed. One device includes a substrate and membrane. The substrate includes a reservoir in fluid communication with a passage. A bio-compatible fluid may be added to the reservoir and passage. The reservoir is configured to receive and retain ... 04/26/07 - 20070090165 - Spot weld fracture analysis method, program therefor, and analysis apparatus thereof A spot weld fracture analysis method for a spot weld portion of three or more mutually superimposed plates that are spot-welded at a common welding point comprises an analysis step of executing an analysis by using a finite element model in which each plate is modeled by shell elements, and ... 04/26/07 - 20070090164 - System and methods for data-driven control of manufacturing processes Systems and methods for implementing hybrid, closed-loop control that generates control values for processes defined by a limited number of function evaluations and large amounts of process and measurement noise. The described control system is applied to a stencil printing process for applying solder paste to an electronic medium such ... 04/26/07 - 20070090163 - Welding accessory arrangement A welding accessory system for a welder that includes a welder having a welder housing and at least one welding accessory support connected to the welder housing to support at least one welding accessory of a welder. The one or more welding accessory supports include a cable holder, an electrode ... 04/26/07 - 20070090162 - Reinforced sandwich structure The present invention relates to a reinforced sandwich structure (10) comprising stacked in height direction thereof, at least one top layer (2) and at least one bottom layer (3) comprising a fibrous reinforcing material, which top and bottom layer sandwich between them at least one core (1) of a foamed ... 04/26/07 - 20070090161 - Casting steel strip A method of casting steel strip by introducing molten plain carbon steel on casting surfaces at least one casting roll with the molten steel having a free nitrogen content below 120 ppm and a free hydrogen content below about 6.9 ppm. The free nitrogen content maybe below about 100 ppm ... 04/26/07 - 20070090160 - Electronic part manufacturing method The objective of this invention is to prevent the generation of defects pertaining to placement of solder balls on the terminal placement parts of the electronic part main body. The solder ball 1 has spherical core 2 and coating layer 3 that covers core 2. The coating layer 3 contains ... 04/26/07 - 20070090159 - Clamp apparatus, joining method, and method of manufacturing hollow member A clamp apparatus clamps a circular cover in joining together a base having a circular recess and the cover fitted into the recess of the base, at and around an entire annular joint interface between a circumferential wall of the cover and a circumferential wall of the recess of the ... 04/26/07 - 20070090158 - Method of fabricating foil brazing member A method of fabricating a foil brazing member is disclosed and comprises the steps of ejecting molten metal of a brazing metal alloy onto a rotating metal cooling roll from at least an opening of a nozzle, cooling and solidifying the molten metal by the cooling roll and forcibly separating ... 04/26/07 - 20070090157 - Method for reducing variations in the bending of rolled base plates and semiconductor module having such a base plate sensor A method for reducing variations in the bending of rolled metal base plates for semiconductor modules is disclosed. In this method, the base plates are rolled in their longitudinal direction in a specific manner. ... 04/26/07 - 20070090156 - Method for forming solder contacts on mounted substrates A method is provided for forming a microelectronic assembly. A semiconductor substrate having a first thickness is mounted to a support substrate with a low temperature adhesive. The semiconductor substrate is thinned from the first thickness to a second thickness. At least one contact formation is formed on the semiconductor ... 04/26/07 - 20070090155 - Method of making tailored blanks using linear friction welding A method of making tailored blanks in accordance with one embodiment comprises the steps of friction welding a first joining surface of a first structural member having a substantially non-rectangular parallelogram profile to a first portion of a joining surface of a substrate; and thereafter concurrently linear friction welding first ... 04/26/07 - 20070090154 - Method of forming a product of metal-based composite material A forming method wherein a billet (31, 66, 77, 87, 107, 128, 136, 144, 153, 77B, 77C) comprising a metal-based composite material (27) prepared by mixing an aluminum alloy (22) and a ceramic (15) is subjected to pressure forming to manufacture a formed article, which comprises carrying out the pressure ... 04/26/07 - 20070090153 - Singlet oxygen quencher and composition using the same A novel singlet oxygen quencher is disclosed. The quencher comprises a colloidal liquid of a platinum metal group. A composition comprising, as an active ingredient, the singlet oxygen quencher is also disclosed. ... 04/26/07 - 20070090152 - Method for cladding the blade tips of rotor blades of a gas turbine power plant and device for carrying out the method A method is for the cladding of blade tips of compressor blades of a gas turbine power plant, using a blank, which is made up of a solder foil provided with a metal layer having embedded hard particles and which is adapted to the geometry of the blade tip that ... 04/19/07 - 20070084904 - Conductive ball, formation method for electrode of electronic component, electronic component and electronic equipment A conductive ball is formed by coating a generally spherical-shaped core made of a non-metallic material with a coating layer composed of a Cu layer and an Sn-5.5Ag alloy layer of non-eutectic composition. The conductive ball is disposed on a land of an electronic component via flux and reflown at ... 04/12/07 - 20070080194 - Heat shield with a sandwich construction A heat shield is disclosed having first and a second three-dimensionally deformed metal layers which are connected to one another such that an outer edge section of the first metal layer is flanged on the second metal layer around substantially the entire circumference of the outer edge of the second ... 04/12/07 - 20070080193 - Ultrasonic horn An ultrasonic horn used in, for instance, a wire bonding apparatus and formed with mounting flanges, including a slit and a cross-sectional shape varying portion; the slit being on the central axis in the horn's longitudinal direction and extending fore and aft relative to the center of the mounting flanges, ... 04/12/07 - 20070080191 - Method and apparatus of producing a welded connection between the surfaces of two planar workpieces A method for producing a welded connection between a first workpiece and a second workpiece and also an apparatus for carrying out the method are illustrated and described. The object of providing a method for producing a welded connection between two workpieces along a parallel joint in which thermal energy ... 04/12/07 - 20070080190 - Method of mounting a semiconductor chip When a semiconductor chip is mounted using ultrasonic vibration, a method of mounting makes it possible to bond the semiconductor chip and bonding patterns with sufficient bonding strength without making the construction of a circuit board complex. The method of mounting a semiconductor chip causes ultrasonic vibration to act on ... 04/12/07 - 20070080189 - Catalytic reactor The invention relates to a reactor (1), suitable for the catalytic conversion of a feed mixture which is capable of explosion and/or ignition, comprising a feed supply chamber (2), an effluent discharge chamber (3), a catalyst bed (4) having an upstream surface (5) and a downstream surface (6) which is ... 04/05/07 - 20070075121 - Apparatus and system for welding preforms and associated method An assembly for positioning a structural assembly for friction stir welding, and a system and method for friction stir welding the structural assembly are provided. The assembly includes a frame defining an aperture therein, and at least one structural member positioned within the aperture. The assembly also includes at least ... 04/05/07 - 20070075120 - Methods for inhibiting corrosion in brazed metal surfaces and coolants and additives for use therein wherein R1, R2, R3, and R4 are each independently selected from the group consisting of H, OH, COOH, C1-C10alkyl groups, glycol esters, anhydride groups, —COOM, and combinations thereof, wherein M is at least one of H, alkali metal ions, alkali earth metal ions, NH4+, amines, imidazoline, polyalcohol esters, C1 to ... 04/05/07 - 20070075119 - Solder feeder A solder feeder includes a housing member, a solder gripper assembly with a solder guide tube, a solder holder, a trigger means, and a solder path tube receiving a straight or a curved nozzle. Solder from a solder spool is extended forward when the trigger means is engaged or activated. ... 03/29/07 - 20070068996 - Continuous mode solder jet apparatus A solder jet apparatus is disclosed. The solder jet apparatus is a continuous mode solder jet that includes a blanking system and raster scan system. The use of the raster scan and blanking systems allows for a continuous stream of solder to be placed anywhere on the surface in any ... 03/29/07 - 20070068995 - Manufacturing of micro-objects such as miniature diamond tool tips Techniques for affixing a micro-object to a mounting structure at a desired relative orientation. A shaped portion of a work piece is caused to become embedded in two or more reference structures at stages during fabrication. The micro-object may have dimensions less than 200 microns, and possibly on the order ... 03/29/07 - 20070068994 - Soldering apparatus An R-ALIP type electromagnetic pump having an inner core, a linear pipe, and a combination of an outer core and coils provided around the linear pipe is disposed outside a solder vessel containing a molten solder. The solder vessel has a bottom wall made of an iron having at least ... 03/29/07 - 20070068993 - Frictional spot joining method and frictional spot joining apparatus In a frictional spot joining where plural metal members lapping over are jointed with a joining device comprising a rotating tool, a receiving tool disposed on a rotational axis of the rotating tool and a drive device to rotate and move the rotating tool in a pushing direction, a holding ... 03/15/07 - 20070057025 - Self-centering braze assembly methods Braze and electrode wire assemblies, e.g., used with an implantable microstimulator, include a wire welded in the through-hole of an electrode, which electrode is brazed to a ceramic case that is brazed to a metal ring that is welded to a metal can. The braze joints are step or similar ... 03/15/07 - 20070057024 - Method and apparatus for removing known good die A method and structure is disclosed for detaching a chip from a substrate that delays the delivery of shear force to the chip until the connectors attaching the chip to the substrate are soft enough that the delivery of shear force will not damage the chip's connectors. More particularly, the ... 03/15/07 - 20070057023 - Method for welding processed article and welded processed product Provided is a welded processed product which is reduced in the hear deformation thereof and can exhibit improved the welding strength between component processed articles. A welded processed products, wherein a first convex column (13) and second convex columns (14A and 14B) to be subjected to the vibration-welding with a ... 03/15/07 - 20070057022 - Component mounting method and component-mounted body A component mounting method configured to mount on a wiring board a surface-mount electronic component that has an electrode terminal on a bonding surface, the method including the steps of preparing the electronic component having a solder layer that covers the electrode terminal, and a resin layer that is provided ... 03/15/07 - 20070057021 - Semiconductor device and automotive ac generator A semiconductor device includes a semiconductor element, a support member bonded to a first surface of the semiconductor element with a first bonding material, and a lead electrode bonded to a second surface of the semiconductor element supported on the support member with a second bonding material. Respective connecting parts ... 03/15/07 - 20070057020 - Flux collection system A flux collection system is proposed in which in a buffering area between an inlet and a heating chamber of a reflow furnace, blowing in-furnace ambient gas to a printed circuit board from a position under a carrier device and sucking ambient gas at a lower section of the carrier ... 03/15/07 - 20070057019 - Heatable roll and process for making a heatable roll A heatable roll having a smooth, hard surface for the production and/or treatment of a fibrous web, in particular a paper, board or tissue web, comprises a base tube made of weldable steel, to which at least one welded layer which has a higher hardness than the base tube is ... 03/15/07 - 20070057018 - Soldering apparatus There is provided a soldering apparatus that can supply nitrogen gas to each soldering iron, is low in cost, and can increase the workability. A soldering apparatus 100 includes a soldering iron unit 300 having an iron tip heated by a heater unit and a blowout nozzle for blowing out ... 03/15/07 - 20070057017 - Lamination apparatus and lamination method using the same The present invention is directed to a lamination apparatus and a lamination method using the same. The lamination apparatus includes a process chamber and a pump connected with one side of the process chamber for making the interior of the process chamber a vacuum. Inside the process chamber, a first ... 03/15/07 - 20070057016 - Machine for continuously manufacturing a welded metal trellis Machine for manufacturing a continuous strip of metal lattice by means of a single flexible metal wire continuously supplying said machine, said lattice being produced by repeating a same motif of metal wire in a plane, each motif being superposed on the preceding motif with an offset of constant pitch ... 03/08/07 - 20070051779 - Powder coating for generator stator bar end fitting and method for applying the powder coating A method of sealing a generator stator bar and a stator bar end fitting receiving the end including the steps of: brazing the fitting to the end of the stator bar with a braze material; applying a powder coating material to the end of the stator bar in the fitting; ... 03/08/07 - 20070051778 - Lead-type electronic-part-mounted printed circuit board, method of soldering lead-type electronic part and air-conditioner A printed circuit board 1 including a group of consecutive soldering lands 3 for soldering a lead-type electronic part 2 with a plurality of leads 2a, includes a solder drawing land 4 having a cross-shaped slit 4a and being provided adjacently to a rearmost portion of the group of the ... 03/08/07 - 20070051777 - Soldering method This invention provides a soldering method capable of solving soldering defects due to excess molten solder in the case of soldering while applying an inner pressure into a through-hole of a lead component mounting substrate: (a) In a primary soldering step, a lead component mounting substrate is lowered, and the ... 03/08/07 - 20070051776 - Dual friction welder A friction welding system includes a first spindle and a second spindle. The first spindle and the second spindle securely locate a first part and a second part, respectively. The first spindle defines a first axis. The second spindle defines a second axis. A tailstock fixture is disposed along the ... 03/08/07 - 20070051775 - Water sports board with wave engager A personal water sports board with a wave engager operably secured thereto for operation in a flow of water, such as a boogie board and the like, is disclosed. The wave engager has a wall shaped to allow water to flow freely thereby in one direction, but to operably engage ... 03/08/07 - 20070051774 - Method of controlling solder deposition on heat spreader used for semiconductor package Method for controlling the deposition of solder on a heat spreader or heat sink is disclosed. The method comprises applying an attaching flux and finishing flux to a heat spreader, placing a preform thereon and subjecting the same to reflow conditions. The finishing flux is applied to solubilize the normally ... 03/08/07 - 20070051773 - Thermal interface materials, methods of preparation thereof and their applications Thermal interface materials are described herein that include at least one phase change material, and at least one solvent, solvent mixture or combination thereof, wherein the at least one solvent, solvent mixture or combination thereof at least partially solvates the at least one phase change material. Methods of producing thermal ... 03/01/07 - 20070045384 - Method for manufacturing gas and liquid storage tanks A method for making gas and liquid storage tanks such as automotive fuel tanks includes providing two or more blanks of air hardenable martensitic stainless steel in the annealed condition. The steel blanks have a thickness in the range of 0.5-5.0 mm., and are formed utilizing stamping, forging, pressing, or ... 03/01/07 - 20070045383 - Servo controller for spot welding gun There is provided a servo controller for a spot welding gun for controlling a pressurizing force, applied by a pair of mutually-opposing gun chips, on an object to be welded, including at least one movable gun chip, which is held between the pair of gun chips, by causing a drive ... 02/22/07 - 20070040004 - Process for producing a high temperature-resistant structure with application of bonding agent A process for producing a high temperature-resistant structure having at least one at least partially structured metallic layer includes applying a bonding agent to at least one joining portion of the at least one layer. The bonding agent is applied in drop form to form a bonding layer with a ... 02/22/07 - 20070040003 - Low temperature methods of bonding components and related structures Methods of bonding two components may include positioning the components relative to one another to obtain a desired orientation. Once the desired orientation is obtained, the components can be bonded in the desired orientation with metal wherein a temperature of both components is maintained below a melting temperature of the ... 02/22/07 - 20070040002 - Method for forming a weldbonded structure A method for weldbonding at least two work-pieces together includes applying an adhesive to a first surface of a first work-piece, and bringing the first surface of the first work-piece into contact with a surface of a second work-piece. The first work-piece and second work-piece are then friction stir or ... 02/22/07 - 20070040001 - Welded structure having excellent resistance to brittle crack propagation and welding method therefor A welding method for manufacturing welded structures having excellent properties to prevent the propagation of brittle fracture occurring in welded joints, characterized by the step of forming a repair weld having a greater toughness than that of a butt weld and an outer edge whose angle φ with respect to ... 02/22/07 - 20070040000 - Zoned stretching of a web There is provided an apparatus and methods for stretching one or more zones of a web and webs including one or more stretched zones. Each of the stretched zones in the web is stretched in the cross-web direction, i.e., the direction transverse to the downweb direction. The stretching can be ... 02/15/07 - 20070034674 - Semiconductor device A wire bonding method that connects a first bonding point and a second bonding point by a wire, the method including a step that press-bonds a ball formed on a tip end of a wire to a first bonding point, thus forming a press-bonded ball; a step that slightly raises ... 02/15/07 - 20070034673 - Seam-welded air hardenable steel constructions The present invention provides seam-welded, air hardenable steel tubes, methods of manufacturing seam-welded air hardenable steel tubes, tube mills for practicing such methods and applications for using seam-welded, air hardenable steel tubing of the present invention. ... 02/15/07 - 20070034672 - Method of and installation for rolling in-process stock The invention also relates to an installation for effecting the method and in which the unwinding reel (1, 6) is used as a strip store for the reverse pass. ... 02/08/07 - 20070029367 - Semiconductor device A wire bonding method that performs a primary bonding of wire on a first bonding point and performs a secondary bonding of the wire on a second bonding point, thus connecting the first and second bonding points with the wire, the secondary bonding including: a first bonding step that forms ... 02/08/07 - 20070029366 - Apparatus and method for vibration welding The present invention relates to a method for vibration welding. The vibration welding is performed with a plurality of mechanically decoupled oscillating heads, each of which is connected with a frequency converter. An electrical circuit connects the frequency converters such that one of the frequency converters can be operated as ... 02/08/07 - 20070029365 - High volume microlamination production of devices Embodiments of a differential thermal expansion bonding device are described for the high volume bonding of laminae together to form a MECS device. One embodiment of the device comprises a frame, engager made of a solid, liquid or gas, preload with springs and platens. Other embodiments of a method for ... 02/01/07 - 20070023482 - Oil distillation vacuum column with thickened plate in the vapor horn section A vacuum column for oil distillation incorporates a thickened plate that has a layer of erosion-resistant material that is thicker than the corrosion-resistant thickness of an adjacent column section. Use of thickened, explosive- or roll-bonded clad plates may provide better service than either conventional plug-welded liners or conventional shell plates ... 02/01/07 - 20070023481 - Soldering work piece, soldering method and heat exchanger The invention relates to a soldering work piece made of aluminium and/or aluminium compounds, to a soldering method, in addition to a heat exchanger soldered in said manner. One surface of the soldering work piece is provided with an artificially applied oxide layer. ... 02/01/07 - 20070023480 - Bead trimmer with a tool extraction system The bead trimmer is preferably applied in a production line for elements having longitudinal weld beads (21), where an element slides along a parallel direction to a longitudinal axis thereof (x), and comprises a tool-bearing turret (2) for removable fixing of a trimming tool (30), associated to a first slide ... 02/01/07 - 20070023479 - Apparatus and method for joining pipe ends together A method and apparatus for joining pipe sections (102, 104) together to form an underwater pipeline. The pipe sections (102, 104) are in an abutting position and have a generally vertical orientation. An upper end (108) of the most recently joined pipe sections (104) is to be welded to a ... 01/25/07 - 20070017958 - Method for coating a substrate and articles coated therewith Methods for coating a substrate, such as a turbine engine component, are presented. In one method a preform comprising braze alloy and wear-resistant particles is attached to the substrate. The preform is then bonded to the substrate to form the wear-resistant coating. Other embodiments include articles, such as components for ... 01/25/07 - 20070017957 - Method and apparatus for detecting parameters of a liquid metal in a container A method and an apparatus for measuring simultaneously and in a reliable manner both the level of molten metal in a casting mold and the depth of molding powder floating over the molten metal, wherein an electromagnetic open cavity is formed on the upper inlet aperture of a casting mold ... 01/25/07 - 20070017956 - Modified flux system A titanium based welding flux that includes titanium dioxide and a moisture resistant agent. The titanium oxide includes purified titanium dioxide that includes little or no impurities that can act as nucleation sites for carbide formation in a weld metal. The moisture resistant compound includes a colloidal metal oxide. ... 01/18/07 - 20070012748 - Method for manufacturing multi-component structural members A method for fabricating multi-component structural members includes brazing a first component of air-hardenable martensitic stainless steel to a second component made of ferrous, stainless or nickel alloy steels. The martensitic stainless steel first component is preferably type 410, 420 or 440 and formed while in the annealed condition. The ... 01/18/07 - 20070012747 - Honeycomb structure and method for applying adhesive and brazing material to the structure A method for gluing and brazing a honeycomb structure includes at least one partially structured foil with a pitch and a wave height. The method includes the steps of choosing a mean brazing material diameter of a powder brazing material, said diameter being 15% smaller than the height of the ... 01/04/07 - 20070000971 - Integrated circuit device and electronic instrument An integrated circuit device includes first and second transistors NTr1 and PTr1 push-pull connected between first and second power supply lines and outputting a voltage of one of the first and second power supply lines to a connection node ND by a charge-pump operation, and a pad PD electrically connected ... 01/04/07 - 20070000970 - Method of producing wire-connection structure, and wire-connection structure For electrically connecting a wiring formed on one surface of an insulating substrate such as an FPC to an individual electrode arranged facing the other surface of the substrate, firstly, a through hole and a notch are formed by irradiating a laser beam from above onto the FPC. Next, the ... 01/04/07 - 20070000969 - Brazed aluminum structure and method for forming same A brazed aluminum alloy structure is formed that includes a first component formed of an aluminum alloy sheet, a second metal sheet component formed of an aluminum alloy and a braze fillet metallurgically bonding a faying surface of the first component to a faying surface of the second component. The ... 01/04/07 - 20070000968 - Weld structure having excellent resistance brittle crack propagation resistance and method of welding the weld structure A welding method for manufacturing welded structures having excellent properties to prevent the propagation of brittle fracture occurring in welded joints, characterized by the step of forming a repair weld having a greater toughness than that of a butt weld and an outer edge whose angle φ with respect to ... 12/28/06 - 20060289608 - Friction stirring of high softening temperature materials using new surface features on a tool A method of selecting a geometry for a friction stirring tool, said tool having a melting point that is higher than the workpiece material, wherein the tool is placed in motion against the workpiece to generate heat in the workpiece such that workpiece material is transported in surface features of ... 12/21/06 - 20060283916 - Bond and repair method using a bonding fixture A tooling for affecting the repair of turbine blade tips which generates bond line loads as a result of differential thermal expansion between the work piece and the fixture. The fixture accommodates multiple work pieces of different sizes to facilitate a batch repair process and compressive load limits are established ... 12/21/06 - 20060283915 - Positioning flowable solder for bonding integrated circuit elements A solder mask defined bond pad or a non-solder mask defined bond pad may be configured to center the solder over the bond pad using either surface attractive forces or capillary action. In some embodiments, a stub trace may be provided, for example, in opposition to the real trace to ... 12/21/06 - 20060283914 - Under-cover mounting structure for an industrial vehicle An under-cover mounting structure for an industrial vehicle includes right and left side-frames, and an under cover. The right and left side-frames face each other with an interval. The under cover is detachably mounted on the side frames by fixing means for covering a lower part of an area between ... 12/21/06 - 20060283913 - Apparatus for manufacturing prefabricated sandwiched building panels Machine for producing prefabricated sandwiched building panels having upper and lower grids and insulating material between the grids. The machine has a pair of transversely movable insertion devices suitable for inserting sections of metal wire into the panel, a pair of transversely movable cutting devices vertically coaxial with the insertion ... 12/21/06 - 20060283912 - Method for welding conductors The invention relates to a method for ultrasonically welding electrical conductors. According to said method, the conductors (32) are introduced into a compression space (30) that is delimited by at least two confining elements and are welded together after closing the compression space, ultrasound being applied via a sonotrode (16) ... 12/07/06 - 20060273139 - Cleaning device for a vehicular lamp A cleaning device for a vehicular lamp including a piston 3, which has a spray nozzle 5 and a nozzle cover 7 covering the spray nozzle, and a cylinder 2, which drives the piston into and out of an opening 91 formed in a vehicle body 9. The nozzle cover ... 12/07/06 - 20060273138 - Soldering apparatus for printed circuit board, soldering method for printed circuit board and soldering cream printing unit for soldering printed circuit board Provided is a soldering apparatus for a printed circuit board (PCB) for soldering the PCB and one or more electronic components populated on the PCB, the PCB having an upper side and a bottom side that is opposite the upper side, including a PCB INVERTING UNIT for rotatably supporting the ... 12/07/06 - 20060273137 - Heat dissipation device with heat pipes A heat dissipation device comprises a seat for absorbing heat from a heat generating device. At least a heat pipe has a first section thereof thermally combined to the seat, and two second sections thereof extending from the first section and remotely from the seat. Pluralities of heat sinks are ... 12/07/06 - 20060273136 - Agitator for mixing hair coloring dye A generally cylindrical non-spherical dense body having rib members, used for agitating hair coloring dye within a mixing and application hair coloring dye container. When the container is shaken, the agitator travels randomly inside the container agitating the hair coloring dye liquids together and more thoroughly mixing the entire contents ... 11/30/06 - 20060266805 - Projection welding method and workpieces fabrication for projection welding A method for fabricating a workpiece for projection welding is provided. One or more dimples are formed projecting outwardly from one surface of the workpiece, and a recess is formed surrounding the dimple, which is depressed inwardly into the surface. In a projection welding process, a second workpiece is placed ... 11/30/06 - 20060266804 - Chip package and wire bonding process thereof A chip package and the wire bonding process thereof are provided. The chip package includes a circuit substrate, a chip, a bonding wire, and a leaning block, wherein the circuit substrate has a bonding surface and at least one contact disposed on the bonding surface. In addition, the chip is ... 11/30/06 - 20060266803 - Heater apparatus Electrical oscillations are supplied to electrodes of a diathermal heating chamber. A liquid is passed through the diathermal heating chamber so as to be heated. The liquid has a minimum level of dissolved solids, which is replenished over time or when the dissolved solids in the liquid fall below a ... 11/30/06 - 20060266802 - Solid wire for gas shielded arc welding Disclosed is a solid wire for gas shielded arc welding treated with a surface treatment soil which includes metal salts containing Sodium (Na), potassium (K), calcium (Ca) and zinc (Zn), and a non-metal phosphorus (P), and a hydrocarbon compound containing at least two functional groups selected from the group that ... 11/30/06 - 20060266801 - Assembly and method for manufacture of component by hot isostatic pressing An assembly for manufacture of a component by hot isostatic pressing comprises a first workpiece and a second workpiece. The first workpiece and second workpiece are assembled to define a cavity. Removable tooling pieces are provided to the assembly which further define the cavity and which are shaped to apply ... 11/30/06 - 20060266800 - Copper welding solid wire with good arc stability Disclosed is a copper plating solid wire for MAG welding with excellent arc stability during welding, in which the solid wire for MAG welding is manufactured by high-speed copper plating by being immersed in a copper plating solution to make a plating layer of 0.2-1.0 μm in thickness, and the ... 11/30/06 - 20060266799 - Slag detachability An electrode composition is disclosed, particularly useful for arc welding and utilized in a flux-cored arc electrode, which produces a slag that is readily removable. The electrode composition employs aluminum and magnesium in a atomic ratio of 1.5:1 or more, respectively. Also disclosed are methods for facilitating the removal of ... 11/30/06 - 20060266798 - Weld fastener for use in projection welding process A weld fastener for use in a projection welding process includes a fastener body having a planar surface with at least one weld projection extending therefrom. The weld projection includes a free end spaced from the planar surface that defines a weld plane. The fastener body includes an interior wall ... 11/30/06 - 20060266797 - Method for increasing the stability and/or load carrying ability of work pieces by means of friction welding The invention relates to a method for at least locally increasing the stability and/or load carrying ability of work pieces (10), whereby first of all a first work piece (11) is produced by means of a conventional manufacturing method. The inventive method is characterized by the following steps: a) the ... 11/30/06 - 20060266796 - Method and a device for detecting slag A method and device are disclosed for detecting the presence of slag in a shroud through which molten metal passed from a ladle to a tundish. An induced voltage generated at a receiving coil is compared with a defined voltage range. If the induced voltage has a value outside the ... 11/30/06 - 20060266795 - Method for printing a surface A method for printing a plastic surface by means of hot-stamping with a metallic hot-stamping tool that can be heated and is coated with plastic is described. The plastic-coated outer surface of the hot-stamping tool forms the stamping surface. The stamping surface transfers a pigment layer applied onto the carrier ... 11/23/06 - 20060261134 - Nanopowder synthesis method A nanopowders synthesis method includes: providing a water phase reactant and an oil phase reactant; and stirring the water phase reactant and the oil phase reactant to form a microemulsion with dispersed phases of the water phase reactant and the oil phase reactant whereby nanopowders are formed via reaction of ... 11/23/06 - 20060261133 - Method and device for producing a bondable area region on a carrier A method and a device is provided for levelling an area region on the surface of a metal or metallization layer of a carrier. The area region is made planar by the action of a stamp or of a roller. ... 11/23/06 - 20060261132 - Low range bonding tool Bonding tool tips and wedge tools for bonding electrical connections are disclosed herein. The tool tips have 102 to 105 ohms of resistance and the wedge bonding tools have a range of 1012 to 1019 ohms of resistance. A resistive material coating the tool tip and wedge tool has a ... 11/23/06 - 20060261131 - Solder paste and printed board In a solder paste formed by blending an alloy powder and a flux, the alloy powder is a powder mixture formed by mixing at least one powder of a Sn—Zn based alloy and at least one powder of a Sn—Ag based alloy. The alloys powders are blended so that the ... 11/16/06 - 20060255097 - Camera-assisted adjustment of bonding head elements The invention relates to a method which is used to carry out adjusting operations on a bond head, wherein a bond head element is positioned in relation to a reference element, especially an ultrasonic tool. According to the invention, at least the surrounding area of the reference element, especially the ... 11/16/06 - 20060255096 - Three-dimension shaped pad The pad is constituted basically by a plurality of consecutive pages joined together; the pages are flexible and are divided into a plurality of consecutive sections; the pages of each section have the same shape; the shape of a section is contained within the shape of the next section; the ... 11/16/06 - 20060255095 - Diecasting machine A diecasting machine is provided with a mold and an injection plunger to inject and fill molten metal in the mold by an advancement of the injection plunger. The diecasting machine includes an electric servomotor and a hydraulic drive source. The electric servomotor is usable as a first drive source ... 11/16/06 - 20060255094 - Method for construction of pressure vessels with a liner using friction stirring processes A system and method for using friction stir welding, friction stir processing, and friction stir mixing to create pressure vessels, pipes or other containers comprised of a single material or multiple layers of different materials, and having superior strength and endurance characteristics. ... 11/16/06 - 20060255093 - Protective cap for a contact pipe in a welding torch in addition to a welding torch equipped with said cap The invention relates to a protective cap for at least one contact pipe of a welding torch, the pipe or pipes having a respective bore for guiding and contacting a respective welding rod that is fed through the pipe or pipes. The cap comprises a housing consisting of or coated ... 11/09/06 - 20060249559 - Tube mill with in-line braze coating spray process A process and apparatus for continuously forming and coating a tube with a braze alloy. The apparatus includes a device for continuously delivering tubing material to a device that forms a continuous tube from the tubing material, a device for preheating the tube, a device for depositing the braze alloy ... 11/09/06 - 20060249558 - Automated micro-volume assay system An automated assay system is described with stations for placement of materials to be used in an assay of materials inside capillaries and an automated gripper for manipulating capillaries. The system includes a separation and immobilization station where reactions inside the capillaries take place and a detector station where photoemissions ... 11/02/06 - 20060243778 - Coating apparatus for an aluminum alloy heat exchanger member, method of producing a heat exchanger member, and aluminum alloy heat exchanger member An coating apparatus, wherein the apparatus applies a coating, onto a surface of an aluminum alloy member for a heat exchanger to be assembled by brazing, with a top-feed-type roll transfer system having at least three rolls, the coating being obtained by mixing into an organic binder a metal powder, ... 11/02/06 - 20060243777 - Cleaning a hot soldering iron tip using dry melamine sponge In one aspect the invention provides a method of cleaning molten solder from the hot tip of a soldering iron that does not require a water-laden sponge. The hot tip of the iron is wiped against a block of dry open-celled melamine foam. The block is formed with an inclined ... 11/02/06 - 20060243776 - Part for active silver brazing and active silver brazing product using the part Brazed product obtained by brazing a metal and ceramic according to a brazing method of high production rate that realizes uniform brazing material composition at brazed sites, thereby enhancing junction reliability and that is free from problems such as deterioration of working environment by malodor. There are also disclosed a ... 10/19/06 - 20060231592 - Ultrasonic tool and ultrasonic bonder An ultrasonic tool, for bonding two materials to each other by joining a face of one of the materials to a face of the other material using the action of ultrasonic waves applied to one of the materials through another face of the one of the materials, wherein the ultrasonic ... 10/19/06 - 20060231591 - Feed devices and methods for injection molded solder systems A solder feeding device having a reservoir, a drive unit, a first lead, and a second lead is provided. The reservoir melts solid solder wire into molten solder, while the drive unit selectively feeds the solid solder wire into the reservoir. The first and second leads are in electrical communication ... 10/19/06 - 20060231590 - Glow discharge drilling apparatus and glow discharge drilling method A glow discharge drilling apparatus enables switching of a continuous mode for continuously supplying electric power and an intermittent mode for intermittently supplying electric power. Electric power is supplied in the intermittent mode with respect to a sample easily melted by a heat due to a glow discharge and a ... 10/19/06 - 20060231589 - Hydroxynaphthalenedicarboxylic acid hydrazide and derivatives thereof as well as process for preparing them provided that at least one of X1 and Y1 is a group represented by formula (3). ... 10/19/06 - 20060231588 - Hydrogen supplying apparatus and method of manufacturing hydrogen supplying apparatus A hydrogen supplying apparatus equipped with a hydrogen separation membrane and a catalyst plate, which is made by forming a catalyst layer on a metal plate, wherein the metal material of the membrane is different in hardness from that of the catalyst plate. A method of producing the hydrogen supplying ... 10/19/06 - 20060231587 - Apparatus for performing a plurality of magnetic pulse forming or welding operations An apparatus for performing a plurality of magnetic pulse forming or welding operations includes a power supply, a plurality of inductors, and a power distribution system for selectively connecting the power supply to each of the plurality of inductors so as to perform a plurality of magnetic pulse forming or ... 10/19/06 - 20060231586 - Method of assembling two parts, at least one of which is made of a composite, and insert for carrying out the assembly The present invention relates to a method for bonding a first part (31) made of a composite to a second part (34), to a defined dimension (A), wherein an insert (32) is fitted onto said first part (31), said insert (32) protruding beyond said dimension (A), the insert (32) is ... 10/19/06 - 20060231585 - Welding device and method for welding workpieces The invention concerns an ultrasonic welding device, which is more fully integrated by adjacent components of coupling surface. In order to permit a adequately fixed connection between the components, while, at the same time simplifying the mounting, it is suggested that at least some of the integrated components (30, 34) ... 10/19/06 - 20060231584 - Manufacturing method of trademark label A manufacturing method of trademark label of the present invention comprises a process of making rubber sheet which produced by compounding the ingredients of natural rubber composite, a process of cutting the rubber sheet according to the design of trademark label, a process of spreading primer on adhesion side of ... 10/12/06 - 20060226201 - Circuit board carrier/solder pallet Provided is a plaque and its method of manufacture, the plaque including a cured thermoset phenolic resin and a reinforcing material that is molded into a controlled thickness. Also provided is a solder pallet utilizing the plaque in its manufacture. The plaque can be manufactured by forming a preform of ... 10/12/06 - 20060226200 - Method for manufacturing bonded substrates and substrates for use in the bonded substrates A method for manufacturing bonded substrates includes: forming the first terminals on the first substrate, the first terminals each having a metal core projecting from a surface of the first substrate, each metal core coated with a solder layer lower in a melting point than the metal core; forming the ... 10/12/06 - 20060226199 - Selective soldering of flat flexible cable with lead-free solder to a substrate A system and method for soldering flat flexible cable to an electronic substrate using lead-free solder is disclosed. The method comprises bending conductive end portions of the flat flexible cable and inserting the bent conductive end portions of the flat flexible cable through slots that extend through the thickness of ... 10/05/06 - 20060219757 - Method for producing cure system, adhesive system, and electronic device A cure system including a compatiblized and passivated refectory solid dispersed within a low temperature liquid curing agent is provided. An adhesive system including the cure system is provided, and an associated method. A device including the cured adhesive system is provided. ... 10/05/06 - 20060219756 - Active binder for brazing, part for brazing employing the binder, brazed product obtained with the binder, and silver brazing material An active binder for brazing which is for use in brazing metals to ceramics; a ceramic part for brazing to which the binder has been applied; a brazed product; and a foil-form brazing material for use in producing a brazed metal/ceramic product. The active binder contains particles of either an ... 09/21/06 - 20060208032 - Manufacture of specialized alloys with specific properties A method of manufacturing specialized alloys having specific properties and an alloy made using this method. The methods involve the use of micro and/or nano-sized particles that are mixed into an alloy using a friction stir welding method. The micro and/or nano-sized particles are used to alter one or more ... 09/14/06 - 20060201997 - Fine pad pitch organic circuit board with plating solder and method for fabricating the same A fine pad pitch organic circuit board with plating solder and a method for fabricating the circuit board with plating solder are provided. The circuit board is formed with a plurality of densely arranged contact pads on at least a surface thereof in the absence of solder mask being applied ... 09/14/06 - 20060201996 - Medical graft materials with adherent extracellular matrix fibrous mass Described are medical grafting materials that include a base substrate material and an adherent fibrous mass of extracellular matrix components received upon the substrate material. Also described are methods of preparing and using such materials. ... 08/31/06 - 20060191977 - Desoldering sheath The present invention provides a desoldering sheath and a method for making the same. The desoldering sheath is comprised of multiple metal ropes that are each made from two or more fine-gauge wire threads. The metal ropes are woven together to form a metal fabric that approximates the shape of ... 08/24/06 - 20060186177 - Wire bonding method A wire bonding method for bonding a ball 11 which is formed at a tip end of a bonding wire to a pad 2 that is a first bond point to form a first bonding part 12 and bonding the wire 10 to an interconnect wiring 4 that is a ... 08/10/06 - 20060175380 - Self-assembly method, opal, photonic band gap, and light source A suspension of particles is rapidly self-assembled with a minimal number of defects into a three-dimensional array of particles onto a substrate under simultaneous sedimentating and annealing forces. This array of particles may be ordered as an opal structure. Optionally, the synthesized structure may incorporate an electrolyte into the suspension ... 08/03/06 - 20060169746 - Resonator, ultrasonic die bonding head, and ultrasonic die bonding apparatus A resonator 1 of the present invention includes: a vibrating member 13 holding an electronic component 12 and applying a vibration to the electronic component 12; and a depressing member 15 applying a depressing force for a side of a substrate 11 to the electronic component 12 through the vibrating ... 08/03/06 - 20060169745 - Multi-function digital pressure measuring device A multi-function digital pressure measuring device and welding torch having an outlet nozzle with first and second gas inlets with valves. The pressure measuring device having a body with a first gas chamber and a first inlet and a first outlet where the first inlet is connectable to a first ... 07/27/06 - 20060163326 - Method and device for friction agitation welding A weld across a joint is formed between superposed plate workpieces comprising a first plate workpiece made up of one or more plates and a second plate workpiece made up of a single plate having a joint bore formed therein by grasping the superposed plate workpieces between a rotating friction ... 07/27/06 - 20060163325 - Wire bonding apparatus and process A wire bonding machine includes (1) a support structure for supporting a work piece and (2) a pre-heat structure for supporting the work piece during a pre-heat operation. The pre-heat structure is moveable with respect to the support structure. ... 07/27/06 - 20060163324 - Method and system for spraying metallic powder on a component surface A method for applying a braze material to a component surface comprises the steps of first directing a liquid spray including a binder toward the component surface, and then injecting a powder including a metallic braze material into the spray, and thereby coating the component surface with a substantially homogenous ... 07/27/06 - 20060163323 - Repair and reclassification of superalloy components Novel materials and methods for repairing/reclassifying superalloy components are described herein. These materials are non-traditional blends of materials having a much higher base material content than traditional repair/reclassification materials. In embodiments used to repair/reclassify nickel-based components, these materials may comprise about 5-18.9 weight percent of a low melting point alloy ... 07/27/06 - 20060163322 - Brazing filter metal sheet and method for production thereof In order to provide a brazing sheet having excellent workability, a powder of a brazing filler metal composition is obtained from a single type of powder or by mixing two or more powders to form the brazing filler metal composition. By powder roll compaction of the powder, the powder is ... 07/27/06 - 20060163321 - Liquid phase diffusion welding method for metallic machine part and metallic machine part A liquid phase diffusion bonding method for a metal machine part superior in the quality of the joint and the productivity enabling the bonding time to be shortened, achieving homogenization of the bonding structure and improving the tensile strength, fatigue strength, and joint quality and reliability. This liquid phase diffusion ... 07/27/06 - 20060163320 - Method for fixing a miniaturized component to a carrier plate The invention relates to a method, a device and a system for fixing a miniaturized component—especially carrying or containing at least one optical element—to a carrier plate in a highly-precise manner, by means of a soldered joint, a welded joint or an adhesive joint. Said component is positioned above the ... 07/27/06 - 20060163319 - Method for manufacture of truss core sandwich structures and related structures thereof An embodiment provides a method of constructing a cellular structure having nodes therein comprising: providing at least one truss layer comprised of at least one truss unit, at least one of the truss units being comprised of truss members; providing at least one panel in mechanical communication with the at ... 07/20/06 - 20060157536 - Work piece holder The invention relates to a fixture that reduces the heat transfer between a thermally conductive work piece, such as a copper tube, and the fixture. In one embodiment, the fixture includes a pair of collet members, with each collet member having at least one work piece engaging protrusion, and a ... 07/20/06 - 20060157535 - Orbital tube welding purge adaptor A purge gas introduction system for an orbital tube welding setup is provided, configured to inject high purity inert purge gas to the interior volume of a tube or tubular component. An o-ring is interposed between an annular base and an annular ring, their junction forming an annular o-ring groove, ... 07/13/06 - 20060151575 - Method of producing shaped bodies, particularly cores, molds and feeders for use in foundry practice The present invention relates to a process for producing shaped bodies, in particular cores, molds and feeders in foundry technology, which comprises the following steps: a. Preparation of a composition comprising i. at least one phenolic resin in solid form, ii. at least one polyisocyanate, and iii. at least one ... 07/13/06 - 20060151574 - Formulations useful against hepatitis c virus infections The present invention relates generally to chemical compounds and substances which are effective against Hepatitis C virus (HCV) infections. Moreover, the present invention relates to compositions comprising said compounds and/or substances, to methods for preventing HCV infections as well use of the compounds and/or substances for the preparation of compositions ... 07/13/06 - 20060151573 - Method for producing a cooled ring carrier The invention relates to a method for producing a cooled ring carrier (1) for an aluminium piston pertaining to an internal combustion engine and produced according to a casting method, comprising a cooling channel (6) which is embodied on the rear (3) fo the ring carrier as a downwardly open ... 07/06/06 - 20060144904 - Method of adjusting the position of an ultrasonic welding horn An ultrasonic rotary welding apparatus and methods of using the same are disclosed. The ultrasonic welding device includes an ultrasonic horn and an anvil. The ultrasonic horn is constrained by a mounting system. The mounting system permits the horn to exhibit two degrees of freedom. The first degree of freedom ... 07/06/06 - 20060144903 - Method of manufacturing a combined driveshaft tube and yoke assembly An method for manufacturing an assembly of first and second components, such as an end fitting and a driveshaft tube for use in a vehicular drive train system. Initially, a yoke is provided including a body having a recess provided therein and a pair of yoke arms. The recess defines ... 07/06/06 - 20060144902 - Amplitude adjustment of an ultrasonic horn A system and method for maintaining a substantially constant gap between a horn and an anvil includes the act of positioning a horn proximal an anvil, so that a gap is established between the horn and the anvil. An alternating current (AC) signal is applied to a converter coupled to ... 07/06/06 - 20060144901 - Ribbon-wound bobbin A ribbon bobbin is disclosed. The ribbon bobbin has a first planar flange, a second planar flange, and a cylindrical post disposed therebetween. The cylindrical post has a first end connected to a center of the first planar flange and a second end connected to a center of the second ... 06/29/06 - 20060138196 - Method for producing connecting ends on metal hoses and hose piece comprising such connecting ends Connecting ends on a hose piece comprising several metal layers, in particular a strip wound metal hose piece, are produced by fixing the overlapping metal layers of a hose of larger length or of an endless hose in the region of the point of separation through welding and subsequently cutting ... 06/29/06 - 20060138195 - Method for providing turbulation on the inner surface of holes in an article, and related articles A method of providing turbulation on the inner surface of a passage hole (e.g., a turbine cooling hole) is described. The turbulation is first applied to a substrate which can eventually be inserted into the passage hole. The substrate is often a bar or tube, formed of a sacrificial material. ... 06/22/06 - 20060131363 - High pressure chemical vapor trapping method A high pressure trapping system is provided to collect chemical vapor by-products in successive stages through chemical reasons conducted at progressively colder temperatures. A hot trap receives chemical vapor exhaust and collects a first waste, typically a solid, as a result of the high temperature completing a chemical reason in ... 06/22/06 - 20060131362 - Chemical composition and process The invention concerns an aqueous slurry comprising a thickener and thermally expandable microspheres comprising a thermoplastic polymer shell and a propellant entrapped therein, said slurry having a pH of at least about 2.5 and comprising a buffer having a pKa within about ±1 pH-unit of the actual pH. The invention ... 06/22/06 - 20060131361 - Quantum dot-encoded bead set for calibration and quantification of multiplexed assays, and methods for their use Control beads are disclosed that allow for improved quantitation of analytes in multiplexed bead assays. The control beads have a range of concentrations of calibration moieties that provide for the preparation of a titration curve. The titration curve can be used to quantify the concentration of the analytes. The titration ... 06/22/06 - 20060131360 - Thermal attach and detach methods and system for surface-mounted components A thermal attach and detach method and system for surface-mounted components (SMCs) employs a planar-heater which generates heat in response to an electrical current. The heater's resistance varies with its temperature, and the resistance is read to determine heater and SMC temperature. A means of gripping an SMC is provided ... 06/15/06 - 20060124700 - Multi-layer polymer-solder hybrid thermal interface material for integrated heat spreader and method of making same A process of making a multi-layer thermal interface material is depicted. The multi-layer thermal interface material is attached between an integrated heat spreader and a die. Processing of the multi-layer thermal interface material includes stamping or other pressure processing. ... 06/15/06 - 20060124699 - Micro-c-4 semiconductor die and method for depositing connection sites thereon A semiconductor die having multiple solder bumps, each having a diameter less than about 100 microns, and the method for making such a die are described. The solder bumps are preferably about 10 microns in diameter, and the pitch between the solder bumps is less than 100 microns, and preferably ... 06/15/06 - 20060124698 - Device, and associated method, for coupling trusses together A first truss may be coupled to a second truss by securing a male coupling portion of a coupling device to the first truss, and securing a female portion of the coupling device to the second truss. An extension of the male coupling portion is positioned within an opening of ... 06/15/06 - 20060124697 - Phase change resistance spot welding tip An improved spot welding tip is adapted for welding a set of adjacent members within a heated zone during a welding program, wherein a quantity of energy is produced, and for reducing the final base temperature of the heated zone. The tip presents a distal engaging surface for contacting one ... 06/15/06 - 20060124696 - Method for managing a continuous in-line metal strip processing installation, and installation for implementing this method According to the invention, the global duration for performing the general connection process of a new coil (11′) is divided into at least two time periods (T1, T3) realised in at least two successive portions (3, 4) of the inlet section (1) of the plant and the junction cycle is ... 06/15/06 - 20060124695 - Stable liquid preparation This invention relates to a liquid preparation containing a solution, which has a water content of from 10 to 80%, and an active ingredient coated with a coating material comprising a water-soluble cellulose derivative. The liquid preparation can stably retain the water-unstable active ingredient in it and at the same ... 06/15/06 - 20060124694 - Composite body and method for producing a mechanical joint A compound body has a first body part (15) made of glass and a mechanical connection (20, 60) which is melted on the first body part (15) and contains aluminum. ... 06/08/06 - 20060118600 - Low cost brazes for titanium A braze material and method of brazing titanium metals. The material may consist of Ti, Ni, Cu Zr, PM and M where PM is a precious metal and M may be Fe, V, Cr, Co, Mo, Nb, Mn, Si, Sn, Al, B, Gd, Ge or combinations thereof, with the (Cu+PM)/Ni ... 06/01/06 - 20060113357 - Method of bonding titanium to stainless steel A method of bonding a stainless steel part to a titanium part by heating a component assembly comprised of the titanium part, the stainless steel part, and a laminated titanium-nickel filler material placed between the two parts and heated at a temperature that is less than the melting point of ... 06/01/06 - 20060113356 - Method and device for mounting electric component A mounting method and a mounting device are provided, which can mount an electric component with high reliability by using an adhesive. The mounting method includes thermocompression bonding an IC chip onto a wiring board by using an anisotropic conductive adhesive film. During the thermocompression bonding, a top region of ... 06/01/06 - 20060113355 - Method of forming a flux layer on an aluminum plate member, a flux composition and an aluminum plate member with a flux layer thereon The invention relates to a flux layer 2 composed of solid constituents of 5-25 g/m2 formed on a surface of an aluminum plate member 1, by spray-coating a flux composition from a nozzle 20 to the plate member 1 with a thickness of 0.2-1.6 mm, which was press-molded and heated ... 06/01/06 - 20060113354 - Method and installation for dip coating of a metal strip, in particular of a steel strip A process for the continuous dip-coating of a metal strip (1) in a tank (11) containing a liquid metal bath (12), in which process the metal strip (1) is made to run continuously through a duct (13), the lower part of which is immersed in the liquid metal bath (12), ... 06/01/06 - 20060113353 - Method of manufacturing metallic composite material Disclosed is a method of manufacturing a metallic composite material for use as building material, the metallic composite material including an aluminium core sheet and a titanium clad layer on at least one side of the core sheet. The aluminium core sheet and titanium clad layer are bonded to one ... 05/25/06 - 20060108397 - Microchannel apparatus, methods of making microchannel apparatus, and processes of conducting unit operations Novel methods of making laminated, microchannel devices are described. Examples include: assembly from thin strips rather than sheets; and hot isostatic pressing (HIPing) to form devices with a hermetically sealed wall. Laminated microchannel articles having novel features are also described. The invention includes processes conducted using any of the articles ... 05/25/06 - 20060108396 - Bonded components and component bonding A method for bonding first and second components to one another comprises: forming a plurality of bonding area projections on a bonding area of a first component; depositing bonding metal on the bonding area of the first component or a corresponding bonding area of a second component; positioning the first ... 05/25/06 - 20060108395 - Integral channels in metal components and fabrication thereof An internal channel in a metal body for use in applications where internal fluid flow within a metal body is desired, as in a heat exchanger. The internal channel is formed in the metal body by frictionally stirring with a pin plunged into the metal body, and traversing the metal ... 05/25/06 - 20060108394 - Method for joining aluminum power alloy Sintered pieces of rapid-solidified aluminum alloy powder are friction stir welded together. The sintered piece may be composite material dispersing ceramic particle therein. A welding aid, which disperses the same ceramic particle as those in the sintered pieces, may be sandwiched between or mounted on the sintered pieces. A weld ... 05/18/06 - 20060102698 - Voltage regulated gmaw welding using a constant current power source and wire feeder having variable gain A system and method of duplicating CV mode of operation with a CC power includes a wire feeder designed to automatically adjust the speed of which consumable wire is delivered to a weld so as to maintain a target voltage set by a user. The wire feeder is designed to ... 05/18/06 - 20060102697 - Actuator control system An actuator control system comprises an electric actuator, a driver, and a controller. The electric actuator is provided with a buffering mechanism which absorbs impact applied to a piston rod. The buffering mechanism includes piston dampers which absorb impact applied to a piston, a first end damper which is provided ... 05/18/06 - 20060102696 - Layered products for fluxless brazing of substrates A brazing product for fluxless brazing comprises a substrate and a filler metal-forming composition applied to the substrate. The substrate preferably comprises aluminum, an aluminum alloy or another metal and may include at least one layer of a ceramic, carbide or nitride. The filler metal-forming composition comprises a liquid-forming layer ... 05/18/06 - 20060102695 - Polarity switching short circuiting arc welding method A method of performing polarity switching short circuiting arc welding is provided. In the arc welding, a welding wire is fed at a constant feeding rate, a short circuiting state and a arcing state appear repeatedly between the welding wire and a base metal, and the output polarity of a ... 05/18/06 - 20060102694 - Semiconductor system with fine pitch lead fingers A semiconductor package system includes providing a die having a plurality of contact pads. A leadframe is formed having a plurality of lead fingers with the plurality of lead fingers having a fine pitch and each having a substantially trapezoidal cross-section. A plurality of bumps is formed on the plurality ... 05/18/06 - 20060102693 - Engine welder with full access A cabinet for an engine welder comprising an output power module driven by a DC input signal from a rectifier having an AC input signal created by an alternator rotated by an internal combustion engine. The cabinet has a front panel with a pivotally mounted door with an open and ... 05/18/06 - 20060102692 - Process for producing ptc element/metal lead element connecting structure and ptc element for use in the process The present invention provides a novel method for electrical connection between a polymer PTC device and a metal lead element to thereby prevent the problems of the connection by caulking or soldering. For this purpose, the present invention provides a process for producing a connection structure by laser welding, said ... 05/18/06 - 20060102691 - Water-base aluminum-brazing composition and process of brazing An aqueous aluminum brazing composition containing an organic binder and zinc-based flux which prevents precipitation of the zinc-based flux having a large specific gravity while securing excellent brazeability. The thixotropic index of the brazing composition is adjusted to 1.01-1.20 by adding (meth)acrylic acid/(meth)acrylate copolymer emulsion to the brazing composition as ... 05/04/06 - 20060091183 - Double wall cooking vessel A dual wall cooking vessel is formed by the impact or friction bonding of the an inner to an outer vessel wherein a laminate of aluminum and copper layers is disposed between the outer surface of the bottom of the inner vessel and the inner surface of the bottom of ... 05/04/06 - 20060091182 - Repair of braze joint and article repaired A method of repairing a braze joint and the resulting joint includes removing an unsuitable portion of a first joining material in a joint between a first member and a second member of an aerospace assembly and cleaning the joint. A stripping solution is used to remove the unsuitable portion ... 04/27/06 - 20060086772 - System and method for improving hard drive actuator lead attachment A system and method are disclosed for improving hard drive actuator lead attachment. In one embodiment, an actuator board is coupled to an actuator flexible cable by a bonding agent, such as an anisotropic conductive film (ACF). In one embodiment, an actuator flexible cable is coupled to one or more ... 04/20/06 - 20060081682 - Brazing method of an aluminum material A method of brazing an aluminum material, which contains: using an aluminum alloy brazing sheet, wherein an aluminum alloy containing 0.2 to 1 mass % of Mg is used for a core alloy; the brazing sheet, in which an Mg amount in a filler alloy is 0.05 mass % or ... 04/20/06 - 20060081681 - Coated diamond particles A method of producing coated diamond particles includes the steps of providing a combination of a transition metal selected from zirconium, hafnium, niobium and tantalum, an activation metal and uncoated diamond particles, and heat treating the combination in a non-oxidizing atmosphere to cause the activation metal to bond to the ... 04/13/06 - 20060076387 - Joining method and apparatus This joining method has a joining step of bonding together a plurality of members W1, W2, which are to be joined, metallurgically in a solid phase state, and comprises a contact step of bringing a liquid organic acid L into contact with surfaces to be joined of the members W1, ... 03/23/06 - 20060060634 - Method and device for connecting pipes; motor vehicle with a device of this type The invention relates to a method for shaping pipes with the steps connecting a pipe end with a coupling of a connection device for pipes, in particular a quick connector, through friction welding and controlling the region of formation of the molten mass formed during friction welding. The contamination of ... 03/23/06 - 20060060633 - High strength insulating metal-to-ceramic joints for solid oxide fuel cells and other high temperature applications and method of making A seal formed between a metal part and a second part that will remain gas tight in high temperature operating environments which experience frequent thermal cycling, which is particularly useful as an insulating joint in solid oxide fuel cells. A first metal part is attached to an reinforcing material. A ... 03/23/06 - 20060060632 - Fuel cell stack with edge seal A stack of sheet metal elements, formed and/or informed, is aligned and compressed so that the edges of the sheet elements form sides of the stack. The edges and intervening interfacial gaps are sealed with molten solder. The practice is particularly applicable to a stack of electrode, current collector and ... 03/16/06 - 20060054661 - Handheld extruder welding device A handheld extruder welding device is provided for welding thermoplastic synthetic materials by means of an extrusion screw with a feed zone and a conveying/plasticizing zone. In the area of the feed zone, a feed channel with a ridge running in longitudinal direction is located in a sleeve. This ridge ... 03/16/06 - 20060054660 - Articulated gas bearing support pads A gas pad assembly is provided. The gas pad assembly includes a plurality of articulated gas pads. Each gas pad includes a mounting stem having a first and a second end and a gas passage that runs the length of the mounting stem and able to receive gas through the ... 03/16/06 - 20060054659 - Method and apparatus for blending a colorant The disclosure is directed to a method and apparatus for homogenously mixing of colorant easily and reliably into a polyol, aqueous solution, or polymer. In the practice of the invention, almost any colorant or dye can be employed. One use of the invention employs polymeric colorant. The colorant is deployed ... 02/23/06 - 20060037990 - System to navigate within images spatially referenced to a computed space A system for navigating images spatially referenced to a plurality of location coordinates from at least one coordinate location within a computed space provides travel with a non-linear itinerary. Specifically, serial navigation of a plurality of geographic images spatially referenced to location coordinates of a geo-planar space from a selected ... 02/16/06 - 20060032890 - Apparatus and method for printing micro metal structures A method and device for printing liquid material such as liquid solder is provided. C4 structures as small as 10 microns in diameter can be produced using devices and methods described above. Further, devices and methods provided are able to operate at temperatures much higher than other print head designs ... 02/09/06 - 20060027629 - Surface treatment method for flux-brazed aluminum-made heat exchanger There is disclosed a rust prevention and hydrophilization treatment method for a flux-brazed aluminum-made heat exchanger which comprises subjecting the same to a rust prevention treatment by the use of a zirconium base compound and/or a titanium base compound, and thereafter subjecting the same to a hydrophilization treatment by means ... 02/09/06 - 20060027628 - Corrosion resistant fluid conducting parts, methods of making corrosion resistant fluid conducting parts and equipment and parts replacement methods utilizing corrosion resistant fluid conducting parts According to one aspect of the present disclosure, a part for an article of equipment includes a fluid conducting first region including a corrosion resistant first material, and a fluid conducting second region including a second material. The first region and the second region are either directly or indirectly joined ... 02/09/06 - 20060027627 - Mechanical weldable fitting for use in tapping a pipeline A mechanical weldable fitting for use in tapping a pipe includes a first and second metal collar, each formed of attachable upper and lower semi-toroidal portions that when assembled on the pipe providing spaced-apart external cylindrical surfaces. Each collar having at least one internal circumferential sealing groove therein that receives ... 02/09/06 - 20060027626 - Method of processing formed product, and metal cope and metal drag used for the method A method is provided for processing a product formed by a punch press. The method includes leaving a micro joint connecting a workpiece to a raw material forming the product when forming a slit in the workpiece along an outer shape of the raw material. The method also includes forming ... 01/26/06 - 20060016858 - Method of improving quality and reliability of welded rail joint properties by ultrasonic impact treatment A method for improving the performance of sections of rails joined together by welding by reworking welded joints utilizing an ultrasonic impact treatment (UIT) process either before welding, during welding, after welding or during repairs of used rails, including treatment of a joint, around a joint and/or length of a ... 01/26/06 - 20060016857 - High production welding fixture A welding fixture for supporting first and second workpieces in a coaxial relationship along a workpiece axis relative to each other includes a base, a left clamp on the base for holding a first workpiece, and a right clamp on the base for holding a second workpiece on an opposite ... 01/26/06 - 20060016856 - Apparatus and method for sealing a container An apparatus and method for sealing a container is described and which includes multiple work stations which are positioned on a moveable carousel, and wherein the individual work stations are operable to form a seal on a container which encloses hazardous waste and wherein the seal can be readily inspected ... 01/19/06 - 20060011704 - Process for producing a deformed, locally reinforced sheet metal component and corresponding component The process is used to produce a deformed, locally reinforced sheet-metal component (10), in which a metal reinforcing sheet (14) is secured to a metal base sheet (12) by means of a brazed join (16) before or during the deformation process, characterized in that a nickel-based brazing material is used ... 01/12/06 - 20060006210 - Method, apparatus and program of thermal analysis, heat controller and heating furnace using the same Heating characteristic value at any measuring point of an object at any measuring location of an heating furnace is determined as a single invariable by using temperature (Tint and Ts) measured at the measuring point of the object and heating temperature (Ta) and heating time (t) at the measuring location ... 12/22/05 - 20050279809 - Optical structures including liquid bumps and related methods A liquid prime mover can be used to position a component on a substrate. For example, a liquid material can be provided on the substrate adjacent the component such that the component has a first position relative to the substrate. A property of the liquid material can then be changed ... 12/22/05 - 20050279808 - Aom modulation techniques employing plurality of tilt-angled transducers to improve laser system performance Digital control of frequency and/or amplitude modulation techniques of an intracavity and/or extracavity AOM (60) facilitate substantially full extinction of a laser beam (90) to prevent unwanted laser energy from impinging a workpiece (80); facilitate laser pulse amplitude stability through closed-loop control of pulse-to-pulse laser energy; facilitate beam-positioning control including, ... 12/22/05 - 20050279807 - Aom modulation techniques employing an upstream bragg adjustment device Digital control of frequency and/or amplitude modulation techniques of an intracavity and/or extracavity AOM (60) facilitate substantially full extinction of a laser beam (90) to prevent unwanted laser energy from impinging a workpiece (80); facilitate laser pulse amplitude stability through closed-loop control of pulse-to-pulse laser energy; facilitate beam-positioning control including, ... 12/22/05 - 20050279806 - Modular steel concrete reinforcement system A method of welding reinforcement steel bars (rebar) and assembly of fusion-welded rebar into panel assemblies that are self-stabilizing to withstand the rigors of transport to and positioning within construction sites. The rebar welding method generates fusion welds in such a manner that the weld imparts stability and strength to ... 12/15/05 - 20050274774 - Insulation paper with high thermal conductivity materials The present invention provides for a high thermal conductivity (HTC) paper that comprises a host matrix, such as mica, and HTC materials intercalated into the host matrix. The HTC materials are comprised of at least one of nanofillers, diamond like coatings directly on the host matrix, and diamond like coatings ... 12/15/05 - 20050274773 - Cored wire Cored wire including at least one thermal barrier layer, distinguished by the fact that said layer is made of a material that pyrolizes upon contact with a metal bath such as liquid metal. ... 12/15/05 - 20050274772 - Treating an area to increase affinity for a fluid Methods to treat an area on a surface to increase affinity for a fluid having a solution of particles including a conductive material. ... 12/08/05 - 20050269383 - Apparatus and methods for underwater welding A lower housing having a lower chamber and a welding opening is fixed about an underwater weld site. The lower housing includes an upper opening, the lower housing being filled with water upon installation. A transport housing containing a welding unit in a dry state is lowered such that a ... 11/24/05 - 20050258214 - Method for forming bump, semiconductor element having bumps and method of manufacturing the same, semiconductor device and method of manufacturing the same, circuit board, and electronic equipment A tip of a wire formed in the shape of a ball is bonded to an electrode by using a tool. A part of the wire is drawn from the tip bonded to the electrode. A bump is formed on the electrode by deforming a portion of the wire continuous ... 11/24/05 - 20050258213 - Method and device for the evacuation of casting wastes A continuous metallic strip casting plant comprising an ingot mould, a device for the evacuation of casting wastes formed by a trolley which can host two chests. The trolley is located below the ingot mould and on the trolley is deposited the full chest in the free space next to ... 11/17/05 - 20050252946 - Protection module for protecting objects against threats, especially against hollow loads A protection module for protecting objects against threats, especially hollow loads. The protection module is made of a material or contains a material which is configured as a three-dimensional metal grid structure or open-pored metal foam which is 4-40 ppi thick. A solid or liquid material can be introduced into ... 11/10/05 - 20050247757 - Silver braze alloy The present invention relates to a silver braze alloy having improved wetting properties. The silver braze alloy consists essentially of from about 52.25 wt % to about 57.0 wt % silver, from about 38.95 to about 43.0 wt % copper, from about 0.5 wt % to about 5.5 wt %, ... 11/10/05 - 20050247756 - Connection mechanism and method A precision self-locking connection mechanism and method for connecting two parts or elements to one another and a precision self-locking connection mechanism and method in combination with a further connection mechanism for connecting two parts or elements together. ... 11/10/05 - 20050247755 - Probe attach tool A tool for attaching fine preformed probes to a substrate for use with a vacuum source is disclosed. The apparatus comprises a body portion; a tip portion disposed at one end of the body portion; a first orifice extending from a first end of the body portion to the working ... 11/03/05 - 20050242157 - Reactor structure as a heat exchanger layer stacking construction and method of making same A reactor structure has a heat transfer layer stacking construction with a stack of heat-conductive plate elements which, alternating in the stacking direction, bound one catalyst-filled reactor layer and one tempering layer respectively, adjacent plate elements being connected in a fluid-tight manner on at least two closed side areas. The ... 11/03/05 - 20050242156 - Dlc (diamond-like carbon) hard coating on copper based material for bearings A bearing material of copper or a copper-containing alloy for use in friction bearings with a cover layer deposited at least on portions of the sliding face, is made up of at least a support layer and a sliding layer, the sliding layer being a hard coating and comprising diamond-like ... 10/27/05 - 20050236461 - Vehicle framing system for plurality of vehicle body styles An apparatus and method for randomly interchanging up to four pairs of side framing gates at a framing station of a vehicle assembly line while maintaining a predetermined build cycle time interval of the assembly line. The system employs first and second carousels positioned on opposite sides of the assembly ... 10/27/05 - 20050236460 - Middle layer of die structure that comprises a cavity that holds an alkali metal An apparatus in one example comprises a die structure that comprises a middle layer, a first outside layer, and a second outside layer. The middle layer comprises a cavity that holds an alkali metal, and one of the first outside layer and the second outside layer comprises a channel that ... 10/20/05 - 20050230454 - Copper-based brazing alloy and brazing process The invention proposes a brazing alloy, which can be produced in particular as a homogenous, ductile, amorphous brazing foil and consists of 2 to 20 atom % of nickel, 2 to 12 atom % of tin, 0.5 to 5.0 atom % of zinc, 6 to 16 atom % of phosphorus, ... 10/13/05 - 20050224558 - Brazing titanium to stainless steel using laminated ti-ni filler material A method of bonding a stainless steel part to a titanium part by heating a component assembly comprised of the titanium part, the stainless steel part, and a laminated titanium-nickel filler material placed between the two parts and heated at a temperature that is less than the melting point of ... 10/06/05 - 20050218191 - Laser-guiding coordination device for a drilling machine A laser-guiding coordination device for a drilling machine has a C-base, two laser-line projectors oppositely and adjustably embedded inside the C-base. Each laser-line projector has a first adjuster, a second adjuster perpendicularly and rotatably mounted inside the first adjuster, and a laser generator accommodated inside the second adjuster to generate ... 09/29/05 - 20050211748 - Laser processing method and laser processing apparatus using ultra-short pulse laser A laser processing apparatus includes a laser generation apparatus for outputting an ultra-short pulse laser beam, a laser control apparatus for controlling the laser generation apparatus, an optical system, an optical system control apparatus for measuring the optical system, and a measurement apparatus for measuring the ultra-short pulse laser beam. ... 09/29/05 - 20050211747 - Metal transfer in arc welding A double pulse welding current method is disclosed for the generation and transfer of droplets of welding metal from an electrode wire to a workpiece in an arc welding process. A suitable background direct current level is specified to deliver a desired number of droplets to the weld site. During ... 09/22/05 - 20050205646 - Titanium lined composite cookware A Cooking vessel has an interior lining of titanium or an allow thereof. The bottom is optionally formed of anodized aluminum as the titanium walls withstand the corrosive environment of the anodizing bath. The titanium lining is more resistant to corrosion, staining and attack by acid foods than anodized aluminum. ... 09/22/05 - 20050205645 - Refined aluminium strip or sheet for electrolytic capacitors This invention relates to a thin refined aluminium sheet or strip with purity greater than 99.9%, designed for making anodes of electrolytic capacitors, with an atomic content of between 5 and 25% of aluminium carbide in the 10 nm thick surface layer, and preferably between 10 and 20%. ... 09/15/05 - 20050199681 - Printed circuit board with embedded capacitors therein, and process for manufacturing the same Disclosed herein are a printed circuit board with embedded capacitors therein and a process for manufacturing the printed circuit board. The embedded capacitors are formed by applying a photosensitive insulating resin to a printed circuit board inner layer, and applying a high dielectric polymer capacitor paste thereto. ... 09/15/05 - 20050199680 - Rotating disk storage device and integrated wire head suspension assembly Embodiments of the invention provide techniques to prevent, when a bonding pad and a lead wiring pad are to be connected using a solder ball, the solder ball from deviating from a centerline and a soldering problem from occurring. In one embodiment, a head suspension assembly includes a solder ball ... 08/25/05 - 20050184130 - Isolator system At the time of sterilization of the isolator, the pressure inside the isolator is increased relative to the pressure inside the robot, and the gas supply unit is operated to cause a flow of a gas inside the robot from the casing 14a to the casing 13, thereby preventing any ... 08/11/05 - 20050173493 - Method for repairing defects in a conductive substrate using welding A method for repairing defects in a substrate comprising the steps of placing a consumable filler slug in contact with the substrate in the vicinity of the defect; placing at least one electrically conductive cover sheet in contact with a portion of the consumable filler slug; bringing a first electrode ... 08/11/05 - 20050173492 - Method for repairing defects in a metallic substrate using welding A method for repairing defects in a metallic substrate comprising the steps of placing a consumable filler slug in contact with the substrate in the vicinity of the defect; bringing a first electrode and a second electrode in contact with the consumable slug and applying a pressure to the consumable ... 07/07/05 - 20050145677 - Metal tubular body and manufacturing method thereof Side hole-bearing tubular bodies made of metal and having an inside diameter of up to 2 mm are manufactured by a method which includes punching from a metal sheet a sheet blank in the developed shape of a tubular body and punching in the sheet blank a hole which corresponds ... 07/07/05 - 20050145676 - Metal tubular body and manufacturing method thereof Side hole-bearing tubular bodies made of metal and having an inside diameter of up to 2 mm are manufactured by a method which includes punching from a metal sheet a sheet blank in the developed shape of a tubular body and punching in the sheet blank a hole which corresponds ... 06/23/05 - 20050133565 - Laser annealing apparatus for processing semiconductor devices in inline manner A laser annealing apparatus is provided, which can simultaneously process a plurality of moving semiconductor devices in an inline manner using one annealing laser. The apparatus may include a laser beam emitting unit, which emits laser beams to target regions of a to-be-processed object. Also included may be a plurality ... 06/16/05 - 20050127135 - Support structure A support structure of the present invention includes a fixation member directly or indirectly heated, a supported object supported by the fixation member, and a sliding member provided on an outer periphery of the fixation member, the sliding member being slidable in a longitudinal direction of the fixation member. In ... 06/16/05 - 20050127134 - Nano-metal composite made by deposition from colloidal suspensions Methods of attaching high-temperature electrical components to substrates are provided. The methods involve of attachment of high-temperature components to substrates via a nano-metal film. ... 06/16/05 - 20050127133 - High-throughput ex-situ method for rare-earth-barium-copper-oxide (rebco) film growth The present invention provides a high-throughput system for the ex-situ formation of a superconducting thin film, such as rare-earth-barium-copper-oxide (REBCO), atop a continuous length of buffered metal substrate tape by heating a buffered metal substrate tape coated with precursors of REBCO These precursors, when heated and introduced to water vapor ... 06/02/05 - 20050116010 - Fibrous web and process for the production thereof The invention relates to a fibrous web containing a filler and to a method for manufacturing the same. The fibrous web containing the filler comprises a substance, which is in a granular form and has a rotationally symmetrical shape and an inner part and a crust part, whereby the density ... ### FreshPatents.com Support |