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Metal Fusion Bonding > Process

Process

Process patent applications listed include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.

10/02/14 - 20140291384 - Solder wire dispenser, a portable hand-held device to apply solder accuratel and without touching the solder wire.
A hand-held device shaped as a pencil used for dispensing solder wire onto a soldering point. Such device contains a roll of solder wire that can be gradually extracted through a hole on the tip by pressing a button in forward motion to extract the solder without touching it. The...

09/18/14 - 20140263576 - Dual shift unit for welder
A welding apparatus includes a first welding element, a second welding element and a support on which the first welding element and the second welding element are mounted and which is movable relative to the welding apparatus. The support is configured to move the first welding element and the second...

08/28/14 - 20140239049 - Method of manufacturing mask assembly for thin film deposition
A method of manufacturing a mask assembly for thin film deposition includes: positioning a division mask on a mask frame, wherein the division mask has a length in a first direction that is greater than a width in a second direction perpendicular to the first direction; and spot welding opposing...

08/28/14 - 20140239050 - Self-expansible stent with radiopaque markers and method of making such a stent
Pushing a self-expanding stent from one of its ends, during release of the stent at a stenting site in a bodily lumen, by proximal withdrawal of a surrounding sheath, can impose unacceptably high stresses on parts of the strut network of the stent. For location of stents in a bodily...

10/31/13 - 20130284795 - Robotic high density welding body shop
A method and apparatus for managing the delivery of component parts and tooling to a robotic welding assembly positioned on a motor vehicle body assembly line. Automatic guided vehicles deliver component parts from a source of parts to a parts staging area on the robotic welding assembly including a substage...

10/03/13 - 20130256387 - Light emitting member mounting method and apparatus
A light emitting member mounting method includes: causing a friction material to contact a substrate including at least an optical waveguide member mounted on a base and to contact a light emitting member that is to be mounted to the substrate and that is equipped with a light emitting component,...

07/11/13 - 20130175324 - Thermal compression head for flip chip bonding
The present invention provides a method and a thermal compression head for flip chip bonding. The thermal compression head includes a main body and a contact portion. The main body has a main body opening. The contact portion has a contact surface and a plurality of openings. The openings communicate...

07/04/13 - 20130168437 - Noble metal paste for bonding of semiconductor element
A precious metal paste which does not cause contamination of a member, which can be uniformly coated to a member to be bonded, and which is in good condition after bonding is provided. The present invention relates to a precious metal paste for bonding a semiconductor element, of the paste...

06/20/13 - 20130153643 - Polyamide composition for surface-mounted components
A polyamide composition for surface-mounted components is described. Also described are compositions for surface-mounted components (SMCs) including a semiaromatic polyamide modified by a hydroxyaromatic compound, reinforcing fillers, and a flame retardant. Further, the compositions have many advantages linked to the uses thereof in lead-free reflow soldering processes, in particular a...

06/06/13 - 20130140345 - Method of manufacturing continuous sucker rod
A method for manufacturing a continuous sucker rod coil, wherein the method includes the step of selecting a plurality of input coils, each input coil having the same uniform hardness, and each input coil having two free ends. The method further includes the step of fusing adjacent free ends of...

03/21/13 - 20130068823 - Die bonder and bonding method
In the die bonder and bonding method in which a die is picked up from a wafer by a pick-up head which then places the die on an alignment stage, and the die is picked up from the alignment stage by a bonding head which then bond the die onto...

02/28/13 - 20130048700 - Filler metal chemistry for improved weldability of super alloys
A filler metal chemistry includes an amount of chromium weight of between about 9.0% and about 16% by weight, an amount of cobalt of between about 7.0% and about 14% by weight, an amount of molybdenum of between about 10% and about 20% by weight, an amount of iron of...

01/03/13 - 20130001273 - Mounting method, mounting device and mounting jig
A mounting method includes: holding a component at a position off a gravity center of the component; pressing the component to a solder provided on a mount face of a substrate; and adding pressing force to an opposite position of the component across the gravity center from the position held...

10/25/12 - 20120267420 - Fine grained ni-based alloys for resistance to stress corrosion cracking and methods for their design
A class of nickel based alloys having a fine grain structure resistant to stress corrosion cracking, and methods of alloy design to produce further alloys within the class are presented. The alloys act as suitable welding materials in similar applications to that of Alloy 622. The fine-grained structure of these...

07/12/12 - 20120175403 - Solder joint reflow process for reducing packaging failure rate
In a reflow process, a plurality of solder bumps between a first workpiece and a second workpiece is melted. During a solidification stage of the plurality of solder bumps, the plurality of solder bumps is cooled at a first cooling rate. After the solidification stage is finished, the plurality of...

03/29/12 - 20120074204 - Method for handling a stator bar using a pit
A method for handling a stator bar at a braze station including: lifting the stator bar from a platform, wherein the stator bar is in a substantially horizontal orientation on the platform; turning the stator bar from the horizontal orientation to an orientation at least 45 degrees from horizontal; aligning...

03/15/12 - 20120061452 - Apparatus and method for ensuring concentric weld deposition of material on a pipe interior
A welding jig for ensuring concentricity of an interior surface of a pipe with a circular outer periphery of a bolting flange thereon, comprising (i) a frame member; (ii) two spaced-apart rollers positioned at one end of said frame member, each adapted to remain in contacting engagement during welding with...

10/06/11 - 20110240715 - Welding process and corrosion-resistant filler alloy and consumables therefor
A nickel-based alloy and welding processes and consumables that use the alloy as a weld filler metal to fabricate, weld overlay, and repair components, including components of nuclear power plant reactors that contact the hot coolant water of the reactor. The nickel-based alloy consists of, by weight, 26 to about...

09/08/11 - 20110215134 - Rotary die bonding apparatus and methodology thereof
The present invention relates generally to a rotary die bonding apparatus (102) comprising a vertical motion linear actuator and a rotary motion actuator with a plurality of pick up heads (116) for transferring semiconductor die (122) from diced wafer to the lead frame for die bonding process, wherein said plurality...

08/25/11 - 20110204121 - Lead-free solder alloy having reduced shrinkage cavities
A lead-free solder alloy having improved surface properties which suppresses minute irregularities and shrinkage cavities has a composition consisting essentially of Ag: 0.1-1.5%, Bi: 2.5-5.0%, Cu: 0.5-1.0%, optionally Ni: 0.015-0.035% and/or at least one of Ge and Ga: 0.0005-0.01%, and a remainder of Sn and unavoidable impurities....

05/26/11 - 20110121056 - Compositions and methods for determining alloys for thermal spray, weld overlay, thermal spray post processing applications, and castings
Disclosed herein are iron-based alloys having a microstructure comprising a fine-grained ferritic matrix and having a 60+ Rockwell C surface, wherein the ferritic matrix comprises <10 μm Nb and W carbide precipitates. Also disclosed are methods of welding comprising forming a crack free hardbanding weld overlay coating with such an...

04/28/11 - 20110095071 - Method for positioning two components using tack welds crossing the joint line
The invention relates to a method for positioning two components to be joined to each other along a common joint line. According to the invention, the two components are connected to each other by limited-length tack welds firmly connecting the two components, particularly by way of bonding, to each other....

04/07/11 - 20110079630 - System for reducing metallic whisker formation
Disclosed is a whisker-formation resistant composition that is suitable for use as a lead-free soldering composition. The composition includes a fusible material and a matrix material that is aggregated with the fusible material. Typically the fusible material has a lower melting temperature than the melting temperature of the matrix material...

08/19/10 - 20100206937 - Welding additive material
The steel can be used effectively as a welding additive material and has outstanding properties at very high temperatures, in particular a good creep rupture strength/resistance and a good oxidation resistance....

07/01/10 - 20100163600 - Solder bath and method of heating solder contained in the solder bath
A solder bath contains a solder bath main body that contains solder, and a heating member that heats the solder. The heating member is mounted on outer surfaces of a bottom and sides of the solder bath main body. The heating member contains a thermal diffusion member that is made...

04/29/10 - 20100102106 - Welding enclosure
A weld enclosure (15) and welding apparatus (10) including a weld enclosure (15). Also a method of welding. The apparatus (10) has first (12) and second (14) opposed tooling faces adapted to receive and hold respective first (16) and second (18) weld elements. The weld enclosure (15) comprises a housing...

03/18/10 - 20100065612 - Filler material, in particular for improving the quality of a joint seam formed during thermal joining of two metallic structural components
A filler material improves the quality of a joint seam formed during thermal joining of two metallic structural components and includes a core and a coating that surrounds the core at least in sections Because the filler material comprises a coating on the core, the alloying material for the coating...

01/14/10 - 20100006623 - Non-pull back pad package with an additional solder standoff
Disclosed herein is a method of manufacturing a semiconductor package with a solder standoff on lead pads that reach to the edge of the package (non-pullback leads). It includes encapsulating a plurality of die on a lead frame strip. The lead frame strip comprises a plurality of package sites, which...

08/27/09 - 20090212091 - Braided solder
Improved solder and soldering methods are disclosed. In accordance with one technique, a solder having a plurality of individual wire strands braided together is used. In accordance with another technique, the braided solder comprises both the same solder composition and wire gauge in the individual solder wire strands. In accordance...

06/25/09 - 20090159642 - Process of brazing/soldering by flame of metallic and non-metallic materials
The invention refers to the flame soldering/brazing procedure of metallic and nonmetallic materials, used in industrial operations without releasing of noxious gases emissions. The soldering/brazing procedure according to the invention is achieved totally eliminating the noxious gases emissions, reducing the energy consumption for the soldering/brazing operation, and improving the quality...

04/02/09 - 20090084830 - Tool assembly heat treatment method
A method of welding connection is directed towards the construction and subsequent heat treatment of industrial grade manual tools and, specifically, their tool heads to handles or handle attachment connections. The method employs the use of matching, non-heat treated, compatible material such as steel alloys, for the tool heads and...

02/19/09 - 20090045244 - Wire bonding apparatus comprising rotary positioning stage
A wire bonding apparatus, comprising a bonding tool mounted on a bondhead body which is in turn mounted on a positioning table, is provided for bonding electronic devices. The positioning table has first and second motors coupled to it that are operative to drive the bondhead body to positions along...